CHEMTRONICS TDS # SWNoClean Technical Data Sheet Soder-Wick No Clean Desoldering Braid PRODUCT DESCRIPTION Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. Requires little or no post solder cleaning No corrosive residues Halide free ESD Safe bobbins meet specs: MIL-STD-1686C MIL-HDBK-263B Static decay provision of MIL-B-81705C Minimal risk of heat and static component damage TYPICAL APPLICATIONS Soder-Wick No Clean safely removes solder from: Lugs and Posts Micro Circuits Surface Mount Device Pads Ball Grid Array Pads TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES Surface Insulation Resistance Bellcore TR-NWT-000078 : PASS After 96 Hours (megohms) 2 x 104 Limit Group A 4.8 x 106 Group B 3.8 x 106 Group C 4.1 x 106 : PASS ANSI/IPC J SF-818 8 After 168 Hours (ohms) 1.8 x 10 Limit 1-2 2-3 3-4 4-5 2.3 x 1010 2.6 x 1010 2.8 x 1010 2.8 x 1010 Electromigration : PASS Average Insulation Resistance (megohms)-One Decade Limit Initial Final Group E 3.93 x 103 1.24 x 104 Group F 3.87 x 103 2.84 x 104 At 10x magnification no evidence of electromigration or heavy corrosion. Silver Chromate Test Paper PASS Copper Mirror Test PASS Shelflife 2 years SODER-WICK NO CLEAN MEETS OR EXCEEDS: MIL-F-14256F, Type R DOD-STD-883E, Method 2022 Bellcore TR-NWT-000078 ANSI/IPC J SF-818 AVAILABILITY Part # 1 2 3 4 5 6 BGA Size Inches .030" .060" .080" .110" .145" .210" - Color White Yellow Green Blue Brown Red Purple Size Metric .76mm 1.52mm 2.03mm 2.79mm 3.68mm 5.33mm - Part # Size Length Part # 60-1-5 60-2-5 60-3-5 60-4-5 60-5-5 60-6-5 1 2 3 4 5 6 5 5 5 5 5 5 60-1-10 60-2-10 60-3-10 60-4-10 60-5-10 VacuPak Packaging USAGE INSTRUCTIONS For industrial use only. Read MSDS carefully prior to use. 1) Choose a Soder-Wick No Clean width equal to or slightly larger than the pad or connection. 2) Choose a solder iron tip equal to or slightly larger than the pad or connection. 3) Set temperature of iron between 600-750F. 4) Place wick on solder joint and place tip of hot iron on top of wick. 5) As solder becomes molten, the color of the wick will change from copper to silver. 6) Remove wick and iron from joint simultaneously once color change has stopped. 7) The component lead / pad is now clean and free from solder. 8) Clip and discard used portion of the wick. TECHNICAL & APPLICATION ASSISTANCE Chemtronics provides a technical hotline to answer your technical and application related questions. The toll free number is: 1-800-TECH-401. Chemtronics, Soder-Wick and CircuitWorks are registered trademarks of Chemtronics. All rights reserved. VacuPak is a trademark of Chemtronics. All rights reserved. Size Length 1 2 3 4 5 10 10 10 10 10 Part # Size SW16015 SW16025 SW16035 SW16045 SW16055 SW160BGA 1 2 3 4 5 BGA The VacuPak Can contains ten five-foot bobbins in a vacuum sealed can. This package provides the highest level of cleanliness and freshness. Great for tool kit storage. NOTE: This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use the data properly. Chemtronics does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it. CHEMTRONICS 8125 COBB CENTER DRIVE KENNESAW, GA 30152 1-770-424-4888 DISTRIBUTED BY: REV. F (08/13)