TMP435
DXP
DXN
V+
1
10
9
4
5
3
2
SCL
SDA
THERM
+5V
SMBus
Controller
8
GND
ALERTTHERM2/
7
6
OneChannelLocal
OneChannelRemote
TMP435
A1
A0
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
±1°C TEMPERATURE SENSOR with Series-R,
n-Factor, Automatic Beta Compensation and Programmable Addressing
Check for Samples: TMP435
1FEATURES DESCRIPTION
234 ±1°C REMOTE DIODE SENSOR The TMP435 is a remote temperature sensor monitor
with a built-in local temperature sensor. The remote
±1°C LOCAL TEMPERATURE SENSOR temperature sensor diode-connected transistors are
AUTOMATIC BETA COMPENSATION typically low-cost, NPN- or PNP-type transistors or
n-FACTOR CORRECTION diodes that are an integral part of microcontrollers,
PROGRAMMABLE THRESHOLD LIMITS microprocessors, or FPGAs.
TWO-WIRE/ SMBus™ SERIAL INTERFACE Remote accuracy is ±1°C for multiple IC
manufacturers, with no calibration needed. The
MINIMUM AND MAXIMUM TEMPERATURE two-wire serial interface accepts SMBus write byte,
MONITORS read byte, send byte, and receive byte commands to
MULTIPLE INTERFACE ADDRESSES program the alarm thresholds and to read
ALERT/THERM2 PIN CONFIGURATION temperature data.
DIODE FAULT DETECTION The TMP435 includes beta compensation
PIN-PROGRAMMABLE TWO-WIRE (correction), series resistance cancellation,
ADDRESSING programmable non-ideality factor, programmable
resolution, programmable threshold limits, minimum
and maximum temperature monitors, wide remote
APPLICATIONS temperature measurement range (up to +150°C),
LCD/ DLP®/LCOS PROJECTORS diode fault detection, a temperature alert function,
SERVERS and pin-programmable two-wire addressing using
INDUSTRIAL CONTROLLERS 3-state logic.
CENTRAL OFFICE TELECOM EQUIPMENT The TMP435 is available in an MSOP-10 package.
DESKTOP AND NOTEBOOK COMPUTERS
STORAGE AREA NETWORKS (SAN)
INDUSTRIAL AND MEDICAL EQUIPMENT
PROCESSOR/FPGA TEMPERATURE
MONITORING
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2DLP is a registered trademark of Texas Instruments.
3SMBus is a trademark of Intel Corporation.
4All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION(1)
TWO-WIRE PACKAGE
PRODUCT DESCRIPTION ADDRESS PACKAGE-LEAD PACKAGE DESIGNATOR MARKING
Remote Junction
TMP435 Pin-programmable MSOP-10 DGS DTPI
Temperature Sensor
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted. TMP435 UNIT
Power Supply, VS+7.0 V
Pins 2, 3, 4, 5 and 8 only –0.5 to VS+ 0.5 V
Input Voltage Pins 7, 9, and 10 only –0.5 to 7 V
Input Current 10 mA
Operating Temperature Range –55 to +127 °C
Storage Temperature Range –60 to +130 °C
Junction Temperature (TJmax) +150 °C
Human Body Model (HBM) 4000 V
ESD Rating Charged Device Model (CDM) 1000 V
Machine Model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
2Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
ELECTRICAL CHARACTERISTICS
At TA= –40°C to +125°C and VS= 2.7V to 5.5V, unless otherwise noted. TMP435
PARAMETER CONDITIONS MIN TYP MAX UNIT
TEMPERATURE ERROR
Local Temperature Sensor TELOCAL TA= –40°C to +125°C ±1.25 ±2.5 °C
TA= +0°C to +100°C, VS= 3.3V ±0.25 ±1 °C
Remote Temperature Sensor(1) TEREMOTE TA= 0°C to +100°C, TDIODE = –40°C to +150°C, VS= 3.3V ±0.25 ±1 °C
TA= –40°C to +100°C, TDIODE = –40°C to +150°C, VS= 3.3V ±0.5 ±1.5 °C
TA= –40°C to +125°C, TDIODE = –40°C to +150°C ±3 ±5 °C
vs Supply (Local/Remote) VS= 2.7V to 5.5V ±0.2 ±0.5 °C/V
TEMPERATURE MEASUREMENT
Conversion Time (per channel)
Local Channel 12 15 17 ms
Remote Channel
RC = 1 97 126 137 ms
MBeta Correction Enabled (2)
RC = 0 36 47 52 ms
RC = 1 72 93 100 ms
MBeta Correction Disabled (3)
RC = 0 33 44 47 ms
Resolution
Local Channel 12 Bits
Remote Channel 12 Bits
Remote Sensor Source Currents
High 120 mA
Series Resistance (beta correction) (4)
Medium High 60 mA
Medium Low 12 mA
Low 6 mA
Remote Transistor Ideality Factor n TMP435 optimized ideality factor 1.000(2)
1.008(3)
Beta Correction Range b0.1 27
SMBus INTERFACE
Logic Input High Voltage (SCL, SDA) VIH 2.1 V
Logic Input Low Voltage (SCL, SDA) VIL 0.8 V
Hysteresis 500 mV
SMBus Output Low Sink Current 6 mA
SDA Output Low Voltage VOL IOUT = 6mA 0.15 0.4 V
Logic Input Current 0 VIN 6V –1 +1 mA
SMBus Input Capacitance (SCL, SDA) 3 pF
SMBus Clock Frequency 3.4 MHz
SMBus Timeout 25 32 35 ms
SCL Falling Edge to SDA Valid Time 1 ms
DIGITAL OUTPUTS
Output Low Voltage VOL IOUT = 6mA 0.15 0.4 V
High-Level Output Leakage Current IOH VOUT = VS0.1 1 mA
ALERT/THERM2 Output Low Sink Current ALERT/THERM2 Forced to 0.4V 6 mA
THERM Output Low Sink Current THERM2 Forced to 0.4V 6 mA
(1) Tested with less than 5effective series resistance and 100pF differential input capacitance. TAis the ambient temperature of the
TMP435. TDIODE is the temperature at the remote diode sensor.
(2) Beta correction configuration set to '1000' and sensor is GND collector-connected (PNP collector to ground).
(3) Beta correction configuration set to '0111' or sensor is diode-connected (base shorted to collector).
(4) If beta correction is disabled ('0111'), then up to 1kof series line resistance is cancelled; if beta correction is enabled ('1xxx'), up to
300is cancelled.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At TA= –40°C to +125°C and VS= 2.7V to 5.5V, unless otherwise noted. TMP435
PARAMETER CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
Specified Voltage Range VS2.7 5.5 V
Quiescent Current IQ0.0625 Conversions per Second, VS= 3.3V 35 45 mA
Eight Conversions per Second, VS= 3.3V(5) 0.7 1 mA
Serial Bus Inactive, Shutdown Mode 3 10 mA
Serial Bus Active, fS= 400kHz, Shutdown Mode 90 mA
Serial Bus Active, fS= 3.4MHz, Shutdown Mode 350 mA
Undervoltage Lockout UVLO 2.3 2.4 2.6 V
Power-On Reset Threshold POR 1.6 2.3 V
TEMPERATURE RANGE
Specified Range –40 +125 °C
Storage Range –60 +130 °C
Thermal Resistance, MSOP-10 qJA 165 °C/W
(5) Beta correction disabled.
4Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
1
2
3
4
5
10
9
8
7
6
SCL
SDA
ALERTTHERM2/
A0
GND
V+
DXP
DXN
A1
THERM
RT/THERM2
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
DEVICE INFORMATION
DGS PACKAGE
MSOP-10
(TOP VIEW)
PIN ASSIGNMENTS
TMP435
NO. NAME DESCRIPTION
1 V+ Positive supply (2.7V to 5.5V)
2 DXP Positive connection to remote temperature sensor
3 DXN Negative connection to remote temperature sensor
4 A0 Address pin 0
5 A1 Address pin 1
6 GND Ground
7 THERM Thermal flag, active low, open-drain; requires pull-up resistor to V+
8 ALERT/THERM2 Alert (reconfigurable as second thermal flag), active low, open-drain; requires pull-up resistor to V+
9 SDA Serial data line for SMBus, open-drain; requires pull-up resistor to V+
10 SCL Serial clock line for SMBus, open-drain; requires pull-up resistor to V+
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TMP435
3
2
1
0
1
2
3
-
-
-
RemoteTemperatureError( C)
°
-50 -25 0 25 50 75 100 125
AmbientTemperature,T (
AC)
°
BetaCompensationDisabled.
GNDCollector-ConnectedTransistorwithn-factor=1.008.
3
2
1
0
1
2
3
-
-
-
LocalTemperatureError( C)
°
-50 -25 0 25 50 75 100 125
AmbientTemperature,T (
AC)
°
700
600
500
400
300
200
100
0
I ( A)m
Q
0.0625 0.125 0.25 0.5 1 2 48
ConversionRate(conversions/s)
V =3.3V
S
150
100
50
0
50
100
-
-
-150
RemoteTemperatureError( C)
°
0 5 10 15 20 3025
LeakageResistance(M )W
RGND (LowBeta)
RVs
RVs (LowBeta)
RGND
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
I ( A)m
Q
2.5 3.0 3.5 4.0 4.5 5.0 5.5
V (V)
S
500
450
400
350
300
250
200
150
100
50
0
I ( A)m
Q
1k 10k 100k 1M 10M
SCLClockFrequency(Hz)
V =3.3V
S
V =5.5V
S
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
TYPICAL CHARACTERISTICS
At TA= +25°C and VS= 3.3V, unless otherwise noted.
REMOTE TEMPERATURE ERROR LOCAL TEMPERATURE ERROR
vs TEMPERATURE vs TEMPERATURE
Figure 1. Figure 2.
REMOTE TEMPERATURE ERROR QUIESCENT CURRENT
vs LEAKAGE RESISTANCE vs CONVERSION RATE
Figure 3. Figure 4.
SHUTDOWN QUIESCENT CURRENT SHUTDOWN QUIESCENT CURRENT
vs SCL CLOCK FREQUENCY vs SUPPLY VOLTAGE
Figure 5. Figure 6.
6Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
2.5
2.0
1.5
1.0
0.5
0
0.5
1.0
1.5
2.0
2.5
-
-
-
-
-
RemoteTemperatureError( C)
°
0 100 200 300 400 500
R ( )W
S
3
2
1
0
1
2
3
-
-
-
RemoteTemperatureError( C)
°
0 100 200 300 400 500 600 700 800 900 1k
R ( )W
S
Diode-ConnectedTransistor,2N3906(PNP)(2)
GNDCollector-ConnectedTransistor,2N3906(PNP)(1)(2)
NOTES(1):Temperatureoffsetistheresultof
n-factorbeingautomaticallysetto1.000.
Approximaten-factorof2N3906is1.008.
(2)SeeFigure11forschematicconfiguration.
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
TYPICAL CHARACTERISTICS (continued)
At TA= +25°C and VS= 3.3V, unless otherwise noted. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE
REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (Low-Beta Transistor)
Figure 7. Figure 8.
REMOTE TEMPERATURE ERROR REMOTE TEMPERATURE ERROR
vs DIFFERENTIAL CAPACITANCE vs DIFFERENTIAL CAPACITANCE with 45nm CPU
AT +25°C, VCC = 3.3V, RS= 0AT +25°C, VCC = 3.3V, RS= 0, Beta = 011 (AUTO)
Figure 9. Figure 10.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TMP435
(a) GNDCollector-ConnectedTransistor
DXP
DXN
RS
(1)
RS
(1)
(b) Diode-ConnectedTransistor
DXP
DXN
RS
(1)
RS
(1)
(b) Diode-ConnectedTransistor
(a) GNDCollector-ConnectedTransistor
DXP
DXN
CDIFF
(1)
DXP
DXN
CDIFF
(1)
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
PARAMETRIC MEASUREMENT INFORMATION
TEST CIRCUITS
SERIES RESISTANCE CONFIGURATION
(1) RSshould be less than 1k; see Filtering section.
Figure 11.
DIFFERENTIAL CAPACITANCE CONFIGURATION
(1) CDIFF should be less than 2200pF; see Filtering section.
Figure 12.
8Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
APPLICATION INFORMATION
correct for any changes in the beta factor as a result
The TMP435 (two-channel) is a digital temperature of temperature variation. The device can operate a
sensor that combines a local die temperature PNP transistor with a beta factor as low as 0.1. See
measurement channel and a remote junction the Beta Compensation Configuration Register
temperature measurement channel in a single section for further information.
package. This device is two-wire- and SMBus
interface-compatible, and is specified over a Series Resistance Cancellation
temperature range of –40°C to +125°C. The TMP435
contains multiple registers for holding configuration Series resistance in an application circuit that typically
information, temperature measurement results, results from printed circuit board (PCB) trace
temperature comparator maximum/minimum limits, resistance and remote line length is automatically
and status information. User-programmed high and cancelled by the TMP435, preventing what would
low temperature limits stored in the TMP435 can be otherwise result in a temperature offset. A total of up
used to trigger an over/under temperature alarm to 1kof series line resistance is cancelled by the
(ALERT) on local and remote temperatures. TMP435 if beta correction is disabled and up to 300
Additional thermal limits can be programmed into the of series line resistance is canceled if beta correction
TMP435 and used to trigger another flag (THERM) is enabled, eliminating the need for additional
that can be used to initiate a system response to characterization and temperature offset correction.
rising temperatures. See the two Remote Temperature Error vs Series
Resistance typical characteristic curves (Figure 7 and
For proper remote temperature sensing operation, the Figure 8) for details on the effect of series resistance
TMP435 requires only a transistor connected on sensed remote temperature error.
between DXP and DXN.
The SCL and SDA interface pins require pull-up Differential Input Capacitance
resistors as part of the communication bus, while The TMP435 can tolerate differential input
ALERT and THERM are open-drain outputs that also capacitance of up to 2200pF with minimal change in
need pull-up resistors. ALERT and THERM may be temperature error. The effect of capacitance on
shared with other devices if desired for a wired-OR sensed remote temperature error is illustrated in
implementation. A 0.1mF power-supply bypass Figure 9 and Figure 10,Remote Temperature Error
capacitor is recommended for good local bypassing. vs Differential Capacitance. See the Filtering section
See Figure 13 for a typical configuration. for suggested component values where filtering
unwanted coupled signals is needed.
Beta Compensation
Previous generations of remote junction temperature Temperature Measurement Data
sensors were operated by controlling the emitter Temperature measurement data are taken over a
current of the sensing transistor. However, default range of 0°C to +127°C for both local and
examination of the physics of a transistor shows that remote locations. However, measurements from
VBE is actually a function of the collector current. If 55°C to +150°C can be made both locally and
beta is independent of the collector current, then VBE remotely by reconfiguring the TMP435 for the
may be calculated from the emitter current. In earlier extended temperature range, as described in this
generations of processors that contained PNP section. Temperature data resulting from conversions
transistors connected to these temperature sensors, within the default measurement range are
controlling the emitter current provided acceptable represented in binary form, as shown in Table 1,
temperature measurement results. At 90nm process Standard Binary column. Note that any temperature
geometry and below, the beta factor continues to below 0°C results in a data value of zero (00h).
decrease and the premise that it is independent of Likewise, temperatures above +127°C result in a
collector current becomes less certain. value of 127 (7Fh). The device can be set to measure
To manage this increasing temperature measurement over an extended temperature range by changing bit
error, the TMP435 controls the collector current 2 (RANGE) of Configuration Register 1 from low to
instead of the emitter current. The TMP435 high. The change in measurement range and data
automatically detects and chooses the correct range format from standard binary to extended binary
depending on the beta factor of the external occurs at the next temperature conversion.
transistor. This auto-ranging is performed at the
beginning of each temperature conversion in order to
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TMP435
C(3)
DIFF
C(3)
DIFF
R(2)
S
R(2)
S
R(2)
S
R(2)
S
Diode-connectedconfiguration :
(1)
SeriesResistance
Transistor-connectedconfiguration :
(1)
DXP
DXN
V+
1
10
9
4
5
3
2
SCL
SDA
THERM
+5V
SMBus
Controller
8
GND
ALERTTHERM2/
7
6
TMP435
A1
A0
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
For data captured in the extended temperature range Both local and remote temperature data use two
configuration, an offset of 64 (40h) is added to the bytes for data storage. The high byte stores the
standard binary value, as shown in Table 1,Extended temperature with 1°C resolution. The second or low
Binary column. This configuration allows byte stores the decimal fraction value of the
measurement of temperatures as low as –64°C, and temperature and allows a higher measurement
as high as +191°C; however, most resolution, as shown in Table 2.
temperature-sensing diodes only measure with the The measurement resolution for both the local and
range of –55°C to +150°C. remote channels is 0.0625°C, and cannot be
Additionally, the TMP435 is rated only for ambient adjusted.
local temperatures ranging from –40°C to +125°C.
Parameters in the Absolute Maximum Ratings table
must be observed.
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series
resistance cancellation.
(2) RS(optional) should be < 1kΩin most applications. Selection of RSdepends on specific application; see Filtering
section.
(3) CDIFF (optional) should be < 2200pF in most applications. Selection of CDIFF depends on specific application; see
Filtering section and Figure 9,Remote Temperature Error vs Differential Capacitance.
Figure 13. TMP435 Basic Connections
10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
THERMHysteresisRegister
BetaCorrectionRegister
ConfigurationRegister
StatusRegister
IdentificationRegisters
ConsecutiveAlertRegister
ConversionRateRegister
LocalandRemoteLimitRegisters
LocalandRemoteTemperatureRegisters
SDA
SCL
PointerRegister
I/O
Control
Interface
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Table 1. Temperature Data Format (Local and Remote Temperature High Bytes)
LOCAL/REMOTE TEMPERATURE REGISTER
HIGH BYTE VALUE (+1°C RESOLUTION)
STANDARD BINARY(1) EXTENDED BINARY(2)
TEMP (°C) BINARY HEX BINARY HEX
64 0000 0000 00 0000 0000 00
50 0000 0000 00 0000 1110 0E
25 0000 0000 00 0010 0111 27
0 0000 0000 00 0100 0000 40
1 0000 0001 01 0100 0001 41
5 0000 0101 05 0100 0101 45
10 0000 1010 0A 0100 1010 4A
25 0001 1001 19 0101 1001 59
50 0011 0010 32 0111 0010 72
75 0100 1011 4B 1000 1011 8B
100 0110 0100 64 1010 0100 A4
125 0111 1101 7D 1011 1101 BD
127 0111 1111 7F 1011 1111 BF
150 0111 1111 7F 1101 0110 D6
175 0111 1111 7F 1110 1111 EF
191 0111 1111 7F 1111 1111 FF
(1) Resolution is 1°C/count. Negative numbers are represented in twos complement format.
(2) Resolution is 1°C/count. All values are unsigned with a –64°C offset. REGISTER INFORMATION
Table 2. Decimal Fraction Temperature Data The TMP435 contain multiple registers for holding
Format (Local and Remote Temperature Low configuration information, temperature measurement
Bytes) results, temperature comparator maximum/minimum,
TEMPERATURE REGISTER LOW BYTE VALUE limits, and status information. These registers are
(0.0625°C RESOLUTION)(1) described in Figure 14 and in Table 3.
TEMP (°C) STANDARD AND EXTENDED BINARY HEX
0 0000 0000 00
0.0625 0001 0000 10
0.1250 0010 0000 20
0.1875 0011 0000 30
0.2500 0100 0000 40
0.3125 0101 0000 50
0.3750 0110 0000 60
0.4375 0111 0000 70
0.5000 1000 0000 80
0.5625 1001 0000 90
0.6250 1010 0000 A0
0.6875 1011 0000 B0
0.7500 1100 0000 C0
0.8125 1101 0000 D0
0.8750 1110 0000 E0 Figure 14. Internal Register Structure
0.9375 1111 0000 F0
(1) Resolution is 0.0625°C/count. All possible values are shown.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
Table 3. TMP435 Register Map
POINTER ADDRESS
(HEX) BIT DESCRIPTIONS
POWER-ON REGISTER
READ WRITE RESET (HEX) D7 D6 D5 D4 D3 D2 D1 D0 DESCRIPTIONS
Local Temperature
00 NA(1) 00 LT11 LT10 LT9 LT8 LT7 LT6 LT5 LT4 (High Byte)
Remote
01 NA 00 RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 Temperature (High
Byte)
02 NA 80 BUSY LHIGH LLOW RHIGH RLOW OPEN RTHRM LTHRM Status Register
Configuration
03 09 00 MASK SD AL/TH 0 0 RANGE 0 0 Register 1
Conversion Rate
04 0A 07 0 0 0 0 R3 R2 R1 R0 Register
Local Temperature
05 0B 55 LTH11 LTH10 LTH9 LTH8 LTH7 LTH6 LTH5 LTH4 High Limit (High
Byte)
Local Temperature
06 0C 00 LTL11 LTL10 LTL9 LTL8 LTL7 LTL6 LTL5 LTL4 Low Limit (High
Byte)
Remote
07 0D 55 RTH11 RTH10 RTH9 RTH8 RTH7 RTH6 RTH5 RTH4 Temperature High
Limit (High Byte)
Remote
08 0E 00 RTL11 RTL10 RTL9 RTL8 RTL7 RTL6 RTL5 RTL4 Temperature Low
Limit (High Byte)
NA 0F XX X(2) X X X X X X X One-Shot Start
Remote
10 NA 00 RT3 RT2 RT1 RT0 0 0 0 0 Temperature (Low
Byte)
Remote
13 13 00 RTH3 RTH2 RTH1 RTH0 0 0 0 0 Temperature High
Limit (Low Byte)
Remote
14 14 00 RTL3 RTL2 RTL1 RTL0 0 0 0 0 Temperature Low
Limit (Low Byte)
Local Temperature
15 NA 00 LT3 LT2 LT1 LT0 0 0 0 0 (Low Byte)
Local Temperature
16 16 00 LTH3 LTH2 LTH1 LTH0 0 0 0 0 High Limit (Low
Byte)
Local Temperature
17 17 00 LTL3 LTL2 LTL1 LTL0 0 0 0 0 Low Limit (Low
Byte)
18 18 00 NC7 NC6 NC5 NC4 NC3 NC2 NC1 NC0 n-Factor Correction
Remote THERM
19 19 55 RTHL7 RTHL6 RTHL5 RTHL4 RTHL3 RTHL2 RTHL1 RTHL0 Limit
Configuration
1A 1A 1C 0 0 0 REN LEN RC 0 0 Register 2
1F 1F 00 0 0 0 0 0 0 RIMASK LMASK Channel Mask
20 20 55 LTHL7 LTHL6 LTHL5 LTHL4 LTHL3 LTHL2 LTHL1 LTHL0 Local THERM Limit
21 21 0A TH7 TH6 TH5 TH4 TH3 TH2 TH1 TH0 THERM Hysteresis
Consecutive Alert
22 22 70 0 CTH2 CTH1 CTH0 CALT2 CALT1 CALT0 0 Register
Beta Range
25 25 08 0 0 0 0 BC3 BC2 BC1 BC0 Register
NA FC 00 X(3) X X X X X X X Software Reset
FD NA 31 0 0 1 1 0 0 0 1 TMP435 Device ID
FE NA 55 0 1 0 1 0 1 0 1 Manufacturer ID
(1) NA = Not applicable; register is write- or read-only.
(2) X = Indeterminate state.
(3) X = Undefined. Writing any value to this register initiates a software reset; see the Software Reset section.
12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Pointer Register Limit Registers
Figure 14 shows the internal register structure of the The TMP435 has registers for setting comparator
TMP435. The 8-bit Pointer Register is used to limits for both the local and remote measurement
address a given data register. The Pointer Register channels. These registers have read and write
identifies which of the data registers should respond capability. The High and Low Limit Registers for both
to a read or write command on the two-wire bus. This channels span two registers, as do the temperature
register is set with every write command. A write registers. The local temperature high limit is set by
command must be issued to set the proper value in writing the high byte to pointer address 0Bh and
the Pointer Register before executing a read writing the low byte to pointer address 16h, or by
command. Table 3 describes the pointer address of using a single two-byte write command (high byte
the registers available in the TMP435. The power-on first) to pointer address 0Bh.
reset (POR) value of the Pointer Register is 00h The local temperature high limit is obtained by
(0000 0000b). reading the high byte from pointer address 05h and
the low byte from pointer address 16h, or by using a
Temperature Registers two-byte read command from pointer address 05h.
The power-on reset value of the local temperature
The TMP435 has four 8-bit registers that hold high limit is 55h/00h (+85°C in standard temperature
temperature measurement results. Both the local mode; +21°C in extended temperature mode).
channel and the remote channel have a high byte
register that contains the most significant bits (MSBs) Similarly, the local temperature low limit is set by
of the temperature analog-to-digital converter (ADC) writing the high byte to pointer address 0Ch and
result and a low byte register that contains the least writing the low byte to pointer address 17h, or by
significant bits (LSBs) of the temperature ADC result. using a single two-byte write command to pointer
The local channel high byte address for the TMP435 address 0Ch. The local temperature low limit is read
is 00h; the local channel low byte address is 15h. The by reading the high byte from pointer address 06h
remote channel high byte is at address 01h; the and the low byte from pointer address 17h, or by
remote channel low byte address is 10h. These using a two-byte read from pointer address 06h. The
registers are read-only and are updated by the ADC power-on reset value of the local temperature low
each time a temperature measurement is completed. limit register is 00h/00h (0°C in standard temperature
mode; –64°C in extended mode).
The TMP435 contains circuitry to assure that a low
byte register read command returns data from the The remote temperature high limit for the TMP435 is
same analog-to-digital (A/D) conversion as the set by writing the high byte to pointer address 0Dh
immediately preceding high byte read command. This and writing the low byte to pointer address 13h, or by
assurance remains valid only until another register is using a two-byte write command to pointer address
read. For proper operation, the high byte of a 0Dh. The remote temperature high limit is obtained
temperature register should be read first. The low by reading the high byte from pointer address 07h
byte register should be read in the next read and the low byte from pointer address 13h, or by
command. The low byte register may be left unread if using a two-byte read command from pointer address
the LSBs are not needed. Alternatively, the 07h. The power-on reset value of the Remote
temperature registers may be read as a 16-bit Temperature High Limit Register is 55h/00h (+85°C in
register by using a single two-byte read command standard temperature mode; +21°C in extended
from address 00h for the local channel result, or from temperature mode).
address 01h for the remote channel result (23h for
the second remote channel result). The high byte is The remote temperature low limit for the TMP435 is
output first, followed by the low byte. Both bytes of set by writing the high byte to pointer address 0Eh
this read operation are from the same A/D and writing the low byte to pointer address 14h, or by
conversion. The power-on reset value of both using a two-byte write to pointer address 0Eh. The
temperature registers is 00h. remote temperature low limit is read by reading the
high byte from pointer address 08h and the low byte
from pointer address 14h, or by using a two-byte read
from pointer address 08h. The power-on reset value
of the Remote Temperature Low Limit Register is
00h/00h (0°C in standard temperature mode; –64°C
in extended mode).
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
The TMP435 also has a THERM limit register for both Status Register
the local and the remote channels. These are 8-bit The TMP435 has a Status Register to report the state
registers and allow for THERM limits set to 1°C of the temperature comparators. Table 4 shows the
resolution. The local channel THERM limit is set by Status Register bits. The Status Register is read-only
writing to pointer address 20h. The remote channel and is read by reading from pointer address 02h.
THERM limit is set by writing to pointer address 19h. The BUSY bit reads as ‘1’ if the ADC is making a
The local channel THERM limit is obtained by reading conversion. It reads as ‘0’ if the ADC is not
from pointer address 20h; the remote channel converting.
THERM limit is read by reading from pointer address
19h. The power-on reset value of the THERM limit The OPEN bit reads as ‘1’ if the remote transistor
registers is 55h (+85°C in standard temperature was detected as open since the last read of the
mode; +21°C in extended temperature mode). The Status Register. The OPEN status is only detected
THERM limit comparators also have hysteresis. The when the ADC attempts to convert a remote
hysteresis of both comparators is set by writing to temperature.
pointer address 21h. The hysteresis value is obtained The RTHRM bit reads as ‘1’ if the remote
by reading from pointer address 21h. The value in the temperature has exceeded the remote THERM limit
Hysteresis Register is an unsigned number (always and remains greater than the remote THERM limit
positive). The power-on reset value of this register is less the value in the shared Hysteresis Register; see
0Ah (+10°C). Figure 20.
Whenever changing between standard and extended The LTHRM bit reads as ‘1’ if the local temperature
temperature ranges, be aware that the temperatures has exceeded the local THERM limit and remains
stored in the temperature limit registers are NOT greater than the local THERM limit less the value in
automatically reformatted to correspond to the new the shared Hysteresis Register; see Figure 20.
temperature range format. These values must be
reprogrammed in the appropriate binary or extended
binary format.
Table 4. TMP435 Status Register Format
TMP435 STATUS REGISTER (Read = 02h, Write = NA)
BIT # D7 D6 D5 D4 D3 D2 D1 D0
BIT NAME BUSY LHIGH LLOW RHIGH RLOW OPEN RTHRM LTHRM
POR VALUE 0(1) 0000000
(1) The BUSY bit changes to ‘1’ almost immediately (<< 100ms) following power-up, as the TMP435 begins the first temperature conversion.
It is high whenever the TMP435 is converting a temperature reading.
14 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
The LHIGH and RHIGH bit values depend on the Configuration Register 1
state of the AL/TH bit in the Configuration Register. If Configuration Register 1 sets the temperature range,
the AL/TH bit is ‘0’, the LHIGH bit reads as ‘1’ if the controls shutdown mode, and determines how the
local high limit was exceeded since the last clearing ALERT/THERM2 pin functions. This Configuration
of the Status Register. The RHIGH bit reads as ‘1’ if Register is set by writing to pointer address 09h and
the remote high limit was exceeded since the last read by reading from pointer address 03h.
clearing of the Status Register. If the AL/TH bit is ‘1’,
the remote high limit and the local high limit are used The MASK bit (bit 7) enables or disables the ALERT
to implement a THERM2 function. LHIGH reads as ‘1’ pin output if ALERT/THERM2 = 0. If ALERT/THERM2
if the local temperature has exceeded the local high = 1 then the MASK bit has no effect. If MASK is set to
limit and remains greater than the local high limit less ‘0’, the ALERT pin goes low when one of the
the value in the Hysteresis Register. temperature measurement channels exceeds its high
or low limits for the chosen number of consecutive
The RHIGH bit reads as ‘1’ if the remote temperature conversions. If the MASK bit is set to ‘1’, the TMP435
has exceeded the remote high limit and remains retains the ALERT pin status, but the ALERT pin
greater than the remote high limit less the value in does not go low.
the Hysteresis Register. The shutdown (SD) bit (bit 6) enables or disables the
The LLOW and RLOW bits are not affected by the temperature measurement circuitry. lf SD = 0, the
AL/TH bit. The LLOW bit reads as ‘1’ if the local low TMP435 converts continuously at the rate set in the
limit was exceeded since the last clearing of the conversion rate register. When SD is set to '1', the
Status Register. The RLOW bit reads as ‘1’ if the TMP435 immediately stops converting and enters a
remote low limit was exceeded since the last clearing shutdown mode. When SD is set to '0' again, the
of the Status Register. TMP435 resumes continuous conversions. A single
The values of the LLOW, RLOW, and OPEN (as well conversion can be started when SD = 1 by writing to
as LHIGH and RHIGH when AL/TH is ‘0’) are latched the One-Shot Register.
and read as ‘1’ until the Status Register is read or a The AL/TH bit (bit 5) controls whether the ALERT pin
device reset occurs. These bits are cleared by functions in ALERT mode or THERM2 mode. If ALTH
reading the Status Register, provided that the = 0, the ALERT pin operates as an interrupt pin. In
condition causing the flag to be set no longer exists. this mode, the ALERT pin goes low after the set
The values of BUSY, LTHRM, and RTHRM (as well number of consecutive out-of-limit temperature
as LHIGH and RHIGH when ALERT/THERM2 is ‘1’) measurements occur.
are not latched and are not cleared by reading the
Status Register. They always indicate the current If AL/TH = 1, the ALERT/THERM2 pin implements a
state, and are updated appropriately at the end of the THERM function (THERM2). In this mode, THERM2
corresponding A/D conversion. Clearing the Status functions similar to the THERM pin except that the
Register bits does not clear the state of the ALERT local high limit and remote high limit registers are
pin; an SMBus alert response address command used for the thresholds. THERM2 goes low when
must be used to clear the ALERT pin. either RHIGH or LHIGH is set.
The TMP435 NORs, LHIGH, LLOW, RHIGH, RLOW, The temperature range is set by configuring bit 2 of
and OPEN, so a status change for any of these flags Configuration Register 1. Setting this bit low
from ‘0’ to ‘1’ automatically causes the ALERT pin to configures the TMP435 for the standard
go low (only applies when the ALERT/THERM2 pin is measurement range (0°C to +127°C); temperature
configured for ALERT mode). conversions are stored in the standard binary format.
Setting bit 2 high configures the TMP435 for the
space extended measurement range (–55°C to +150°C);
space temperature conversions are stored in the extended
binary format (see Table 1).
space The remaining bits of Configuration Register 1 are
space reserved and must always be set to ‘0’. The power-on
reset value for this register is 00h. Table 5
space summarizes the bits of Configuration Register 1.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
Table 5. Configuration Register 1 Bit Descriptions
CONFIGURATION REGISTER 1
(Read = 03h, Write = 09h, POR = 00h)
BIT NAME FUNCTION POWER-ON RESET VALUE
0 = ALERT Enabled
7 MASK 0
1 = ALERT Masked
0 = Run
6 SD 0
1 = Shut Down
0 = ALERT Mode
5 AL/TH 0
1 = THERM Mode
4, 3 Reserved 0
0 = 0°C to +127°C
2 Temperature Range 0
1 = 55°C to +150°C
1, 0 Reserved 0
The LEN bit enables the local temperature
Configuration Register 2 measurement channel. If LEN = '1', the local channel
is enabled; if LEN = '0', the local channel is disabled.
Configuration Register 2 (pointer address 1Ah)
controls which temperature measurement channels The REN bit enables external temperature
are enabled and whether the external channels have measurement channel 1 (connected to pins 1 and 2.)
the resistance correction feature enabled or not. If REN = '1', the external channel is enabled; if REN =
'0', the external channel is disabled.
The RC bit enables the resistance correction feature
for the external temperature channels. If RC = '1', The temperature measurement sequence is local
series resistance correction is enabled; if RC = '0', channel, external channel 1, shutdown, and delay (to
resistance correction is disabled. Resistance set conversion rate, if necessary). The sequence
correction should be enabled for most applications. starts over with the local channel. If any of the
However, disabling the resistance correction may channels are disabled, they are skipped in the
yield slightly improved temperature measurement sequence. Table 6 summarizes the bits of
noise performance, and reduce conversion time by Configuration Register 2.
about 50%, which could lower power consumption
when conversion rates of two per second or less are
selected.
space
Table 6. Configuration Register 2 Bit Descriptions
CONFIGURATION REGISTER 2
(Read/Write = 1A, POR = 1Ch)
BIT NAME FUNCTION POWER-ON RESET VALUE
7, 6, 5 Reserved 0
0 = External channel 1 disabled
4 REN 1
1 = External channel 1 enabled
0 = Local channel disabled
3 LEN 1
1 = Local channel enabled
0 = Resistance correction
disabled
2 RC 1
1 = Resistance correction
enabled
1, 0 Reserved 0
16 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Conversion Rate Register If the Beta Compensation Configuration Register is
set to '0111' (beta correction disabled) for a given
The Conversion Rate Register (pointer address 0Ah) channel, the automatic detection is bypassed and the
controls the rate at which temperature conversions temperature is measured assuming a
are performed. This register adjusts the idle time diode-connected sensor. A PNP transistor may
between conversions but not the conversion timing continue to be GND collector-connected in this mode,
itself, thereby allowing the TMP435 power dissipation but no beta compensation factor is applied. When the
to be balanced with the temperature register update beta correction is set to '0111' or the sensor is
rate. Table 7 shows the conversion rate options and diode-connected (base shorted to collector), the
corresponding current consumption. n-factor used by the TMP435 is 1.008. When the beta
correction configuration is set to '1xxx' (beta
Beta Compensation Configuration Register correction enabled) and the sensor is GND
collector-connected (PNP collector to ground), the
If the Beta Compensation Configuration Register is n-factor used by the TMP435 is 1.000. Table 8 shows
set to '1xxx' (beta correction enabled) for a given the read value for the selected beta ranges and the
channel at the beginning of each temperature appropriate n-factor used for each conversion.
conversion, the TMP435 automatically detects if the
sensor is diode-connected or GND
collector-connected, selects the proper beta range,
and measures the sensor temperature appropriately.
Table 7. Conversion Rate Register
CONVERSION RATE REGISTER (Read = 04h, Write = 0Ah, POR = 07h)
AVERAGE IQ(TYP)
(mA)
R7 R6 R5 R4 R3 R2 R1 R0 CONVERSION/SEC VS= 2.7V VS= 5.5V
0 0 0 0 0 0 0 0 0.0625 11 32
0 0 0 0 0 0 0 1 0.125 17 38
0 0 0 0 0 0 1 0 0.25 28 49
0 0 0 0 0 0 1 1 0.5 47 69
0 0 0 0 0 1 0 0 1 80 103
0 0 0 0 0 1 0 1 2 128 155
0 0 0 0 0 1 1 0 4 190 220
07h to 0Fh 8 373 413
Table 8. Beta Compensation Configuration Register
BCx3-BCx0 BETA RANGE DESCRIPTION n-FACTOR TIME
1000 Automatically selected range 0 (0.10 < beta < 0.18) 1.000 126ms
1001 Automatically selected range 1 (0.16 < beta < 0.26) 1.000 126ms
1010 Automatically selected range 2 (0.24 < beta < 0.43) 1.000 126ms
1011 Automatically selected range 3 (0.35 < beta < 0.78) 1.000 126ms
1100 Automatically selected range 4 (0.64 < beta < 1.8) 1.000 126ms
1101 Automatically selected range 5 (1.4 < beta < 9.0) 1.000 126ms
1110 Automatically selected range 6 (6.7 < beta < 40.0) 1.000 126ms
1111 Automatically selected range 7 (beta > 27.0) 1.000 126ms
1111 Automatically detected diode connected sensor 1.008 93ms
0000 Manually selected range 0 (0.10 < beta < 0.5) 1.000 93ms
0001 Manually selected range 1 (0.13 < beta < 1.0) 1.000 93ms
0010 Manually selected range 2 (0.18 < beta < 2.0) 1.000 93ms
0011 Manually selected range 3 (0.3 < beta < 25) 1.000 93ms
0100 Manually selected range 4 (0.5 < beta < 50) 1.000 93ms
0101 Manually selected range 5 (1.1 < beta < 100) 1.000 93ms
0110 Manually selected range 6 (2.4 < beta < 150) 1.000 93ms
0111 Manually disabled beta correction 1.008 93ms
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Link(s): TMP435
V V =-
BE2 BE1 ln
nkT
q
()
I
I
2
1
1.008 300
300 N
´
-ADJUST
neff =
300 1.008´
neff
NADJUST =300 -
1.000 300
300 N
´
-ADJUST
neff =
300 1.000´
neff
NADJUST =300 -
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
n-Factor Correction Register range from –128 to +127. Table 9 shows the n-factor
range for both 1.008 and 1.000. For the TMP435, the
The TMP435 allows for a different n-factor value to n-correction value may be written to and read from
be used for converting remote channel pointer address 18h. The register power-on reset
measurements to temperature. The remote channel value is 00h, thus having no effect unless written to.
uses sequential current excitation to extract a
differential VBE voltage measurement to determine Table 9. n-Factor Range
the temperature of the remote transistor. Equation 1 NADJUST
relates this voltage and temperature. BINARY HEX DECIMAL n-FACTOR
01111111 7F 127 1.747977
(1) 00001010 0A 10 1.042759
The value nin Equation 1 is a characteristic of the 00001000 08 8 1.035616
particular transistor used for the remote channel. 00000110 06 6 1.028571
When the beta compensation configuration is set to 00000100 04 4 1.021622
'0111' (beta compensation disabled) or the sensor is
diode-connected (base shorted to collector), the 00000010 02 2 1.014765
n-factor used by the TMP435 is 1.008. When the beta 00000001 01 1 1.011371
compensation configuration is set to '1000' (beta 00000000 00 0 1.008
compensation enabled) and the sensor is GND 11111111 FF –1 1.004651
collector-connected (PNP collector to ground), the 11111110 FE –2 1.001325
n-factor used by the TMP435 is 1.000. If the n-factor
used for the temperature conversion does not match 11111100 FC –4 0.994737
the characteristic of the sensor, then temperature 11111010 FA –6 0.988235
offset is observed. The value in the n-Factor 11111000 F8 –8 0.981818
Correction Register may be used to adjust the 11110110 F6 –10 0.975484
effective n-factor according to Equation 2 and 10000000 80 –128 0.706542
Equation 3 for disabled beta compensation or a
diode-connected sensor. Equation 4 and Equation 5 space
may be used for enabled beta compensation and a
GND collector-connected sensor. Software Reset
The TMP435 may be reset by writing any value to
(2) Pointer Register FCh. This action restores the
power-on reset state to all of the TMP435 registers as
(3) well as abort any conversion in process and clear the
ALERT and THERM pins.
The TMP435 also supports reset via the two-wire
(4) general call address (00000000). The TMP435
acknowledges the general call address and responds
(5) to the second byte. If the second byte is 00000110,
the TMP435 executes a software reset. The TMP435
The n-correction value must be stored in does not respond to other values in the second byte.
twos-complement format, yielding an effective data
18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Consecutive Alert Register does not trip on the measured temperature falling
edges. Allowable hysteresis values are shown in
The value in the Consecutive Alert Register (address Table 11. The default hysteresis value is 10°C,
22h) determines how many consecutive out-of-limit whether the device is operating in the standard or
measurements must occur on a measurement extended mode setting.
channel before the ALERT/THERM2 or the THERM
signal is activated. The value in this register does not Identification Registers
affect bits in the Status Register. Values of one, two,
three, or four consecutive conversions can be The TMP435 allows for the two-wire bus controller to
selected; one conversion is the default. This function query the device for manufacturer and device IDs to
allows additional filtering for the ALERT/THERM2 or enable the device for software identification of the
the THERM pin. Table 13 shows the consecutive device at the particular two-wire bus address. The
alert bits. For bit descriptions, refer to Table 10.manufacturer ID is obtained by reading from pointer
address FEh. The TMP435 returns 55h for the
Table 10. Consecutive Alert Register Bit manufacturer code. The device ID is obtained by
Descriptions reading from pointer address FDh. The TMP435
returns 31h for the device ID (see Table 3). These
BIT NAME NUMBER OF registers are read-only.
CONSECUTIVE
OUT-OF-LIMIT
MEASUREMENTS Table 11. Allowable THERM Hysteresis Values
CALT2/CTH2 CALT1/CTH1 CALT0/CTH0 (ALERT/THERM) THERM HYSTERESIS VALUE
0 0 0 1 TH[7:0]
0 0 1 2 TEMPERATURE (STANDARD
0 1 1 3 (°C) BINARY) (HEX)
1 1 1 4 0 0000 0000 00
1 0000 0001 01
space. 5 0000 0101 05
10 0000 1010 0A
Therm Hysteresis Register 25 0001 1001 19
The THERM Hysteresis Register, shown in Table 12,50 0011 0010 32
stores the hysteresis value used for the THERM pin 75 0100 1011 4B
alarm function and for the ALERT/THERM2 pin when
the AL/TH is 1. This register must be programmed 100 0110 0100 64
with a value that is less than the Local Temperature 125 0111 1101 7D
High Limit Register value, Remote Temperature High 127 0111 1111 7F
Limit Register value, Local THERM Limit Register 150 1001 0110 96
value, or Remote THERM Limit Register value; 175 1010 1111 AF
otherwise, the respective temperature comparator 200 1100 1000 C8
225 1110 0001 E1
255 1111 1111 FF
Table 12. THERM Hysteresis Register Format
THERM HYSTERESIS REGISTER
(Read = 21h, Write = 21h, POR = 0Ah)
BIT # D7 D6 D5 D4 D3 D2 D1 D0
BIT NAME TH7 TH6 TH5 TH4 TH3 TH2 TH1 TH0
POR VALUE 00001010
Table 13. Consecutive Alert Register Format
CONSECUTIVE ALERT REGISTER
(READ = 22h, WRITE = 22h, POR = 70h)
BIT # D7 D6 D5 D4 D3 D2 D1 D0
BIT NAME 0 CTH2 CTH1 CTH0 CALT2 CALT1 CALT0 0
POR VALUE 01110000
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
Bus Overview Two-Wire Interface Slave Device Addresses
The TMP435 is SMBus interface-compatible. In The TMP435 supports nine slave device addresses
SMBus protocol, the device that initiates the transfer and is available in two different fixed serial interface
is called a master, and the devices controlled by the addresses.
master are slaves. The bus must be controlled by a The A1 and A0 pins, as summarized in Table 14), set
master device that generates the serial clock (SCL), the slave device address for the TMP435.
controls the bus access, and generates the START
and STOP conditions. Table 14. Two-Wire Addresses
To address a specific device, a START condition is A0 A1 ADDRESS
initiated. START is indicated by pulling the data line 0 0 1001 100
(SDA) from a high to low logic level while SCL is 0 1 1001 101
high. All slaves on the bus shift in the slave address
byte, with the last bit indicating whether a read or 1 0 1001 110
write operation is intended. During the ninth clock 1 1 1001 111
pulse, the slave being addressed responds to the 0 Z 1001 000
master by generating an Acknowledge and pulling Z 0 1001 001
SDA low. 1 Z 1001 010
Data transfer is then initiated and sent over eight Z 1 1001 011
clock pulses followed by an Acknowledge bit. During Z Z 0110 111
data transfer SDA must remain stable while SCL is
high, because any change in SDA while SCL is high
is interpreted as a control signal. Read/Write Operations
Once all data have been transferred, the master Accessing a particular register on the TMP435 is
generates a STOP condition. STOP is indicated by accomplished by writing the appropriate value to the
pulling SDA from low to high, while SCL is high. Pointer Register. The value for the Pointer Register is
the first byte transferred after the slave address byte
Serial Interface with the R/W bit low. Every write operation to the
TMP435 requires a value for the Pointer Register
The TMP435 operates only as a slave device on (see Figure 16).
either the two-wire bus or the SMBus. Connections to
either bus are made via the open-drain I/O lines, SDA When reading from the TMP435, the last value stored
and SCL. The SDA and SCL pins feature integrated in the Pointer Register by a write operation is used to
spike suppression filters and Schmitt triggers to determine which register is read by a read operation.
minimize the effects of input spikes and bus noise. To change the register pointer for a read operation, a
The TMP435 supports the transmission protocol for new value must be written to the Pointer Register.
fast (1kHz to 400kHz) and high-speed (1kHz to This transaction is accomplished by issuing a slave
3.4MHz) modes. All data bytes are transmitted MSB address byte with the R/W bit low, followed by the
first. Pointer Register byte. No additional data are
required. The master can then generate a START
condition and send the slave address byte with the
Serial Bus Address R/W bit high to initiate the read command. See
To communicate with the TMP435, the master must Figure 17 for details of this sequence. If repeated
first address slave devices via a slave address byte. reads from the same register are desired, it is not
The slave address byte consists of seven address necessary to continually send the Pointer Register
bits, and a direction bit indicating the intent of bytes, because the TMP435 retains the Pointer
executing a read or write operation. Register value until it is changed by the next write
operation. Note that register bytes are sent MSB first,
The address of the TMP435 is 4Ch (1001100b). followed by the LSB.
20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
SCL
SDA
t(LOW) tRtFt(HDSTA)
t(HDSTA)
t(HDDAT)
t(BUF)
t(SUDAT)
t(HIGH) t(SUSTA) t(SUSTO)
P S S P
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
TIMING DIAGRAMS Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not
The TMP435 is two-wire and SMBus-compatible. limited and is determined by the master device. The
Figure 15 to Figure 19 describe the various receiver acknowledges the transfer of data.
operations on the TMP435. Bus definitions are given
below. Parameters for Figure 15 are defined in Acknowledge: Each receiving device, when
Table 15. addressed, is obliged to generate an Acknowledge
bit. A device that acknowledges must pull down the
Bus Idle: Both SDA and SCL lines remain high. SDA line during the Acknowledge clock pulse in such
a way that the SDA line is stable low during the high
Start Data Transfer: A change in the state of the period of the Acknowledge clock pulse. Setup and
SDA line, from high to low, while the SCL line is high, hold times must be taken into account. On a master
defines a START condition. Each data transfer is receive, data transfer termination can be signaled by
initiated with a START condition. the master generating a Not-Acknowledge on the last
Stop Data Transfer: A change in the state of the byte that has been transmitted by the slave.
SDA line from low to high while the SCL line is high
defines a STOP condition. Each data transfer
terminates with a STOP or a repeated START
condition.
Figure 15. Two-Wire Timing Diagram
Table 15. Timing Diagram Definitions for Figure 15
FAST MODE HIGH-SPEED MODE
PARAMETER MIN MAX MIN MAX UNITS
SCL Operating Frequency f(SCL) 0.001 0.4 0.001 3.4 MHZ
Bus Free Time Between STOP ns
t(BUF) 600 160
and START Condition
Hold time after repeated START
condition. After this period, the t(HDSTA) 100 100 ns
first clock is generated.
Repeated START Condition Setup t(SUSTA) 100 100 ns
Time
STOP Condition Setup Time t(SUSTO) 100 100 ns
Data Hold Time t(HDDAT) 0(1) 0(2) ns
Data Setup Time t(SUDAT) 100 10 ns
SCL Clock LOW Period t(LOW) 1300 160 ns
SCL Clock HIGH Period t(HIGH) 600 60 ns
Clock/Data Fall Time tF300 160 ns
Clock/Data Rise Time 300 160 ns
tR
for SCLK 100kHz 1000 ns
(1) For cases with fall time of SCL less than 20ns and/or the rise time or fall time of SDA less than 20ns, the hold time should be greater
than 20ns.
(2) For cases with fall time of SCL less than 10ns and/or the rise or fall time of SDA less than 10ns, the hold time should be greater than
10ns.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Link(s): TMP435
Frame1Two-WireSlaveAddressByte Frame2PointerRegisterByte
Frame4DataByte2
1
StartBy
Master
ACKBy
TMP435
ACKBy
TMP435
ACKBy
TMP435
StopBy
Master
1 9 1
1
D7 D6 D5 D4 D3 D2 D1 D0
9
Frame3DataByte1
ACKBy
TMP435
1
D7
SDA
(Continued)
SCL
(Continued)
D6 D5 D4 D3 D2 D1 D0
9
9
SDA
SCL
0 0 1 1 0 0(1) R/W P7 P6 P5 P4 P3 P2 P1 P0
¼
¼
NOTE(1): Slaveaddress1001100(TMP435)shown.See OrderingInformation tableformoredetails.
Frame1T WireSlaveAddressBytewo- Frame2PointerRegisterByte
1
StartBy
Master
ACKBy
TMP435
ACKBy
TMP435
Frame3T WireSlaveAddressBytewo- Frame4DataByte1ReadRegister
StartBy
Master
ACKBy
TMP435
NACKBy
Master(2)
From
TMP435
1 9 1 9
1 9 1 9
SDA
SCL
0 0 1 R/WP7 P6 P5 P4 P3 P2 P1 P0
SDA
(Continued)
SCL
(Continued)
1 0 0 1
1 0 0(1)
1 0 0(1) R/WD7 D6 D5 D4 D3 D2 D1 D0
(1)Slaveaddress1001100(TMP435)shown. See OrderingInformation tableformoredetails.
(2)MastershouldleaveSDAhightoterminateasingle-bytereadoperation.
NOTES:
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
Figure 16. Two-Wire Timing Diagram for Write Word Format
Figure 17. Two-Wire Timing Diagram for Single-Byte Read Format
22 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
Frame1Two-WireSlaveAddressByte Frame2PointerRegisterByte
1
StartBy
Master
ACKBy
TMP435
ACKBy
TMP435
Frame3Two-WireSlaveAddressByte Frame4DataByte1ReadRegister
StartBy
Master
ACKBy
TMP435
ACKBy
Master
From
TMP435
1 9 1 9
1 9 1 9
SDA
SCL
0 0 1 R/WP7 P6 P5 P4 P3 P2 P1 P0
SDA
(Continued)
SCL
(Continued)
SDA
(Continued)
SCL
(Continued)
1 0 0 1
1 0 0(1)
1 0 0(1) R/WD7 D6 D5 D4 D3 D2 D1 D0
Frame5DataByte2ReadRegister
StopBy
Master
NACKBy
Master(2)
From
TMP435
1 9
D7 D6 D5 D4 D3 D2 D1 D0
(1)Slaveaddress1001100(TMP435)shown. See tableformoredetails.OrderingInformation
(2)MastershouldleaveSDAhightoterminateatwo-bytereadoperation.
NOTES:
Frame1SMBusALERTResponseAddressByte Frame2SlaveAddressByte
StartBy
Master
ACKBy
TMP435
From
TMP435
NACKBy
Master
StopBy
Master
1 9 1 9
SDA
SCL
ALERT
0 0 0 1 1 0 0 R/W 1 0 0 1 1 0 0(1) Status
NOTE(1): Slaveaddress1001100(TMP435)shown. See OrderingInformation tableformoredetails.
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Figure 18. Two-Wire Timing Diagram for Two-Byte Read Format
Figure 19. Timing Diagram for SMBus ALERT
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
High-Speed Mode minus the hysteresis value stored in the THERM
Hysteresis Register. The allowable values of
In order for the two-wire bus to operate at frequencies hysteresis are shown in Table 11. The default
above 400kHz, the master device must issue a hysteresis is 10°C. When the ALERT/THERM2 pin is
High-speed mode (Hs-mode) master code configured as a second thermal alarm (Configuration
(00001XXX) as the first byte after a START condition Register: bit 7 = x, bit 5 = 1), it functions the same as
to switch the bus to high-speed operation. The THERM, but uses the temperatures stored in the
TMP435 does not acknowledge this byte, but Local/Remote Temperature High Limit Registers to
switches the input filters on SDA and SCL and the set its comparison range.
output filter on SDA to operate in Hs-mode, allowing
transfers at up to 3.4MHz. After the Hs-mode master When ALERT/THERM2 is configured as ALERT
code has been issued, the master transmits a (Configuration Register: bit 7 = 0, bit 5 = 0), the pin
two-wire slave address to initiate a data transfer asserts low when either the measured local or remote
operation. The bus continues to operate in Hs-mode temperature violates the range limit set by the
until a STOP condition occurs on the bus. Upon corresponding Local/Remote Temperature High/Low
receiving the STOP condition, the TMP435 switches Limit Registers. This alert function can be configured
the input and output filter back to fast-mode to assert only if the range is violated a specified
operation. number of consecutive times (1, 2, 3, or 4). The
consecutive violation limit is set in the Consecutive
Alert Register. False alerts that occur as a result of
Timeout Function environmental noise can be prevented by requiring
The serial interface of the TMP435 resets if either consecutive faults. ALERT also asserts low if the
SCL or SDA are held low for 32ms (typical) between remote temperature sensor is open-circuit. When the
a START and STOP condition. If the TMP435 is MASK function is enabled (Configuration Register 1:
holding the bus low, it releases the bus and waits for bit 7 = 1), ALERT is disabled (that is, masked).
a START condition. ALERT resets when the master reads the device
address, as long as the condition that caused the
THERM and ALERT/THERM2 alert no longer persists, and the Status Register has
been reset.
The TMP435 has two pins dedicated to alarm
functions, the THERM and ALERT/THERM2 pins. SMBus Alert Function
Both pins are open-drain outputs that each require a
pull-up resistor to V+. These pins can be wire-ORed The TMP435 supports the SMBus Alert function.
together with other alarm pins for system monitoring When pin 6 is configured as an alert output, the
of multiple sensors. The THERM pin provides a ALERT pin of the TMP435 may be connected as an
thermal interrupt that cannot be software disabled. SMBus Alert signal. When a master detects an alert
The ALERT pin is intended for use as an earlier condition on the ALERT line, the master sends an
warning interrupt, and can be software disabled, or SMBus Alert command (00011001) on the bus. If the
masked. The ALERT/THERM2 pin can also be ALERT pin of the TMP435 is active, the devices
configured for use as THERM2, a second THERM pin acknowledge the SMBus Alert command and respond
(Configuration Register: AL/TH bit = 1). The default by returning its slave address on the SDA line. The
setting configures pin 6 for the TMP435 to function as eighth bit (LSB) of the slave address byte indicates
ALERT (AL/TH = 0). whether the temperature exceeding one of the
temperature high limit settings or falling below one of
The THERM pin asserts low when either the the temperature low limit settings caused the alert
measured local or remote temperature is outside of condition. This bit is high if the temperature is greater
the temperature range programmed in the than or equal to one of the temperature high limit
corresponding Local/Remote THERM Limit Register. settings; this bit is low if the temperature is less than
The THERM temperature limit range can be one of the temperature low limit settings. See
programmed with a wider range than that of the limit Figure 20 for details of this sequence.
registers, which allows ALERT to provide an earlier
warning than THERM. The THERM alarm resets
automatically when the measured temperature
returns to within the THERM temperature limit range
24 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
Measured
Temperature
THERMLimitandALERTHighLimit
ALERTLowLimitandTHERMLimitHysteresis
THERM
ALERT
SMBusALERT
Read Read
Time
Read
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Figure 20. SMBus Alert Timing Diagram
space Under-Voltage Lockout
If multiple devices on the bus respond to the SMBus
Alert command, arbitration during the slave address The TMP435 senses when the power-supply voltage
portion of the SMBus Alert command determines has reached a minimum voltage level for the ADC to
which device must clear its alert status. If the function. The detection circuitry consists of a voltage
TMP435 wins the arbitration, its ALERT pin becomes comparator that enables the ADC after the power
inactive at the completion of the SMBus Alert supply (V+) exceeds 2.45V (typical). The comparator
command. If the TMP435 loses the arbitration, the output is continuously checked during a conversion.
ALERT pin remains active. The TMP435 does not perform a temperature
conversion if the power supply is not valid. The last
Shutdown Mode (SD) valid measured temperature is used for the
temperature measurement result.
The TMP435 shutdown mode allows the user to save
maximum power by shutting down all device circuitry General Call Reset
other than the serial interface, reducing current
consumption to typically less than 3µA; see the The TMP435 supports reset via the Two-Wire
typical characteristic graph, Shutdown Quiescent General Call address 00h (0000 0000b). The
Current vs Supply Voltage (Figure 6). Shutdown TMP435 acknowledges the General Call address and
mode is enabled when the SD bit of the Configuration responds to the second byte. If the second byte is
Register 1 is high; the device shuts down 06h (0000 0110b), the TMP435 executes a software
immediately, aborting the current conversion. When reset. This software reset restores the power-on reset
SD is low, the device maintains a continuous state to all TMP435 registers, aborts any conversion
conversion state. in progress, and clears the ALERT and THERM pins.
The TMP435 takes no action in response to other
Sensor Fault values in the second byte.
The TMP435 can sense a fault at the DXP input that Filtering
results from incorrect diode connection or an open
circuit. The detection circuitry consists of a voltage Remote junction temperature sensors are usually
comparator that trips when the voltage at DXP implemented in a noisy environment. Noise is
exceeds (V+) 0.6V (typical). The comparator output frequently generated by fast digital signals and if not
is continuously checked during a conversion. If a fault filtered properly will induce errors that can corrupt
is detected, the last valid measured temperature is temperature measurements. The TMP435 has a
used for the temperature measurement result, the built-in 65kHz filter on the inputs of DXP and DXN to
OPEN bit (Status Register, bit 2) is set high, and, if minimize the effects of noise. However, a differential
the alert function is enabled, ALERT asserts low. low-pass filter can help attenuate unwanted coupled
signals. Exact component values are
When not using the remote sensor with the TMP435, application-specific. It is also recommended that the
the DXP and DXN inputs must be connected together capacitor value remains between 0pF to 2200pF with
to prevent meaningless fault warnings. a series resistance less than 1k.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 25
Product Folder Link(s): TMP435
T =
ERR ´ °[273.15+T( C)]
n1.008
1.008
-
()
T =
ERR ´ °(273.15+100 C)
1.004 1.008
1.008
-
()
T =1.48 C
ERR °
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
Remote Sensing 3. Base resistance < 100.
4. Tight control of VBE characteristics indicated by
The TMP435 is designed to be used with either small variations in hFE (that is, 50 to 150).
discrete transistors or substrate transistors built into
processor chips and ASICs. Either NPN- or PNP-type Based on these criteria, two recommended
transistors can be used, as long as the base-emitter small-signal transistors are the 2N3904 (NPN) or
junction is used as the remote temperature sense. 2N3906 (PNP).
NPN transistors must be diode-connected. PNP
transistors can either be transistor- or Measurement Accuracy and Thermal
diode-connected (see Figure 13). Considerations
Errors in remote temperature sensor readings are The temperature measurement accuracy of the
typically the consequence of the ideality factor and TMP435 depends on the remote and/or local
current excitation used by the TMP435 versus the temperature sensor being at the same temperature
manufacturer-specified operating current for a given as the system point being monitored. Clearly, if the
transistor. Some manufacturers specify a high-level temperature sensor is not in good thermal contact
and low-level current for the temperature-sensing with the part of the system being monitored, then
substrate transistors. The TMP435 uses 6mA for ILOW there is a delay in the response of the sensor to a
and 120mA for IHIGH. The device allows for different temperature change in the system. For remote
n-factor values; see the N-Factor Correction Register temperature sensing applications using a substrate
section. transistor (or a small, SOT23 transistor) placed close
to the device being monitored, this delay is usually
The ideality factor (n) is a measured characteristic of not a concern.
a remote temperature sensor diode as compared to
an ideal diode. The ideality factor for the TMP435 is The local temperature sensor inside the TMP435
trimmed to be 1.008. For transistors whose ideality monitors the ambient air around the device. The
factor does not match the TMP435, Equation 6 can thermal time constant for the TMP435 is
be used to calculate the temperature error. Note that approximately two seconds. This constant implies
for the equation to be used correctly, actual that if the ambient air changes quickly by 100°C, it
temperature (°C) must be converted to Kelvin (K). would take the TMP435 about 10 seconds (that is,
five thermal time constants) to settle to within 1°C of
the final value. In most applications, the TMP435
package is in thermal contact with the PCB, as well
Where: as subjected to forced airflow. The accuracy of the
n= Ideality factor of remote temperature sensor measured temperature directly depends on how
accurately the PCB and forced airflow temperatures
T(°C) = actual temperature represent the temperature that the TMP435 is
TERR = Error in TMP435 reading because n measuring. Additionally, the internal power dissipation
1.008 of the TMP435 can cause the temperature to rise
Degree delta is the same for °C and K (6) above the ambient or PCB temperature. The internal
For n= 1.004 and T(°C) = 100°C: power dissipated as a result of exciting the remote
temperature sensor is negligible because of the small
currents used. For a 5.5V supply and maximum
conversion rate of eight conversions per second, the
TMP435 dissipates 1.82mW (PDIQ = 5.5V × 330mA).
(7) If both the ALERT/THERM2 and THERM pins are
each sinking 1mA, an additional power of 0.8mW is
If a discrete transistor is used as the remote dissipated (PDOUT = 1mA × 0.4V + 1mA × 0.4V =
temperature sensor with the TMP435, the best 0.8mW). Total power dissipation is then 2.62mW
accuracy can be achieved by selecting the transistor (PDIQ + PDOUT) and, with a qJA of 165°C/W, causes
according to the following criteria: the junction temperature to rise approximately
1. Base-emitter voltage > 0.25V at 6mA, at the 0.432°C above the ambient.
highest sensed temperature.
2. Base-emitter voltage < 0.95V at 120mA, at the
lowest sensed temperature.
26 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
V+
DXP
DXN
GND
GroundorV+layer
onbottomand/or
top,ifpossible.
110
2
3
4
8
7
6
5
9
TMP435
0.1 FCapacitorm
PCBVia PCBVia
V+ GND
DXP
A0
DXN
A1
TMP435
www.ti.com
SBOS495A MARCH 2010REVISED APRIL 2010
Layout Considerations temperature offset readings as a result of leakage
paths between DXP or DXN and GND, or
Remote temperature sensing on the TMP435 between DXP or DXN and V+.
measures very small voltages using very low
currents; therefore, noise at the IC inputs must be
minimized. Most applications using the TMP435 have
high digital content, with several clocks and logic
level transitions creating a noisy environment. Layout
should adhere to the following guidelines:
1. Place the TMP435 as close to the remote
junction sensor as possible.
2. Route the DXP and DXN traces next to each
other and shield them from adjacent signals
through the use of ground guard traces, as
shown in Figure 21. If a multilayer PCB is used,
bury these traces between ground or VDD planes
to shield them from extrinsic noise sources. 5 mil
(0,127 mm) PCB traces are recommended.
3. Minimize additional thermocouple junctions
caused by copper-to-solder connections. If these
junctions are used, make the same number and Note: Use 5mil (.005in, or 0,127mm) traces with
approximate locations of copper-to-solder 5mil spacing.
connections in both the DXP and DXN
connections to cancel any thermocouple effects. Figure 21. Example Signal Traces
4. Use a 0.1mF local bypass capacitor directly
between the V+ and GND of the TMP435.
Figure 22 shows the suggested bypass capacitor
placement for the TMP435. Minimize filter
capacitance between DXP and DXN to 2200pF or
less for optimum measurement performance. This
capacitance includes any cable capacitance
between the remote temperature sensor and
TMP435.
5. If the connection between the remote
temperature sensor and the TMP435 is less than
8 inches (20,32 cm), use a twisted-wire pair
connection. Beyond 8 inches, use a twisted,
shielded pair with the shield grounded as close to
the TMP435 as possible. Leave the remote
sensor connection end of the shield wire open to Figure 22. Suggested Bypass Capacitor
avoid ground loops and 60Hz pickup. Placement
6. Thoroughly clean and remove all flux residue in
and around the pins of the TMP435 to avoid
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 27
Product Folder Link(s): TMP435
TMP435
SBOS495A MARCH 2010REVISED APRIL 2010
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March, 2010) to Revision A Page
Changed typo in second paragraph of Beta Compensation Configuration Register section to clarify state of beta
correction ............................................................................................................................................................................ 17
Corrected POR value in Table 7 ......................................................................................................................................... 17
Corrected Equation 7 .......................................................................................................................................................... 26
28 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TMP435
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TMP435ADGSR ACTIVE MSOP DGS 10 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP435ADGST ACTIVE MSOP DGS 10 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Apr-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP435ADGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TMP435ADGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TMP435ADGST MSOP DGS 10 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TMP435ADGST MSOP DGS 10 250 177.8 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP435ADGSR MSOP DGS 10 2500 366.0 364.0 50.0
TMP435ADGSR MSOP DGS 10 2500 358.0 335.0 35.0
TMP435ADGST MSOP DGS 10 250 366.0 364.0 50.0
TMP435ADGST MSOP DGS 10 250 202.0 201.0 28.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated