JUNE 2013 I115
AVX offers a broad line of solid Tantalum capacitors in a wide
range of sizes, styles, and ratings to meet any design needs.
This catalog combines into one source AVX’s leaded tanta-
lum capacitor information from its worldwide tantalum oper-
ations.
The TAP/TEP is rated for use from -55°C to +85°C at rated
voltage and up to +125°C with voltage derating. There
are three preferred wire forms to choose from which are
available on tape and reel, and in bulk for hand insertion.
AVX has a complete tantalum applications service available
for use by all our customers. With the capability to prototype
and mass produce solid tantalum capacitors in special
configurations, almost any design need can be fulfilled.
And if the customer requirements are outside our standard
testing, AVX will work with you to define and implement a test
or screening plan.
AVX is determined to become the world leader in tantalum
capacitor technology and has made, and is continuing to
make, significant investments in equipment and research to
reach that end. We believe that the investment has paid off
with the devices shown on the following pages.
Section 3: Introduction
Foreword
Dipped Radial Capacitors
Terminal Wire
Tantalum wire
Resin encapsulation
Tantalum Graphite
Silver
Solder
Manganese
dioxide
Tantalum
pentoxide
SOLID TANTALUM RESIN DIPPED
SERIES TAP/TEP
The TAP/TEP resin dipped series of miniature tantalum
capacitors is available for individual needs in both commercial
and professional applications. From computers to automotive
to industrial, AVX has a dipped radial for almost any applica-
tion.
116 IJUNE 2013
Figure 1 Figure 2 Figure 3
Wire Form C Wire Form B Wire Form S
D
H
L
S
d2.0 (0.079)
min
+
D
L
S
d
H1 + 4 (0.16)
max
D
H1
L
S
d2 (0.079)
min
+
2.0(0.08)
max
Figure 4 Figure 5 Figure 6
Wire Form F Wire Form D Wire Form G
D
H + 3.8 (0.15)
max
L
S
1.10 +0.25
-0.10
(0.4 +0.010
-0.004 )S
d
0.079 (2)
min
D
H1 max
+0.118
(3.0)
L
+
D
H
L
S
d
Non-Preferred Wire Forms
(Not recommended for new designs)
DIMENSIONS
millimeters (inches)
Preferred Wire Forms
Packaging
Wire Form Figure Case Size L (see note 1) S d Suffixes Available*
CCS Bulk
16.0±4.00 5.00±1.00 0.50±0.05 CRW Tape/Reel
C Figure 1 A - R* (0.630±0.160) (0.200±0.040) (0.020±0.002) CRS Tape/Ammo
B Figure 2 A - J* 16.0±4.00 5.00±1.00 0.50±0.05 BRW Tape/Reel
(0.630±0.160) (0.200±0.040) (0.020±0.002) BRS Tape/Ammo
SCS Bulk
16.0±4.00 2.50±0.50 0.50±0.05 SRW Tape/Reel
S Figure 3 A - J* (0.630±0.160) (0.100±0.020) (0.020±0.002) SRS Tape/Ammo
Non-Preferred Wire Forms
(Not recommended for new designs)
3.90±0.75 5.00±0.50 0.50±0.05
F Figure 4 A - R (0.155±0.030) (0.200±0.020) (0.020±0.002) FCS Bulk
DCS Bulk
D Figure 5 A - H* 16.0±4.00 2.50±0.75 0.50±0.05 DTW Tape/Reel
(0.630±0.160) (0.100±0.020) (0.020±0.002) DTS Tape/Ammo
16.0±4.00 3.18±0.50 0.50±0.05
G Figure 6 A - J (0.630±0.160) (0.125±0.020) (0.020±0.002) GSB Bulk
Similar to 16.0±4.00 6.35±1.00 0.50±0.05
HFigure 1 A - R (0.630±0.160) (0.250±0.040) (0.020±0.002) HSB Bulk
Notes: (1) Lead lengths can be supplied to tolerances other than those above and should be specified in the ordering information.
(2) For D, H, and H1 dimensions, refer to individual product on following pages.
*For case size availability in tape and reel, please refer to pages 123-124.
Dipped Radial Capacitors
Wire Form Outline
SOLID TANTALUM RESIN DIPPED TAP/TEP
Preferred Wire Forms
JUNE 2013 I117
+
H
D
Dipped Radial Capacitors
TAP Series
TAP is a professional grade device manufactured
with a flame retardant coating and featuring low
leakage current and impedance, very small
physical sizes and exceptional temperature
stability. It is designed and conditioned to
operate to +125°C (see page 153 for voltage
derating above 85°C) and is available loose or
taped and reeled for auto insertion. The 15 case
sizes with wide capacitance and working voltage
ranges means the TAP can accommodate
almost any application.
MAXIMUM CASE DIMENSIONS: millimeters (inches)
TAP
Type
475
Capacitance Code
pF code: 1st two digits
represent significant figures,
3rd digit represents multiplier
(number of zeros to follow)
M
Capacitance Tolerance
K = ±10%
M = ±20%
(For J = ±5% tolerance,
please consult factory)
035
Rated DC Voltage
SCS
Suffix indicating wire form
and packaging
(see page 116)
HOW TO ORDER
Wire C, F, G, H B, S, D
Case H *H1D
A 8.50 (0.330) 7.00 (0.280) 4.50 (0.180)
B 9.00 (0.350) 7.50 (0.300) 4.50 (0.180)
C 10.0 (0.390) 8.50 (0.330) 5.00 (0.200)
D 10.5 (0.410) 9.00 (0.350) 5.00 (0.200)
E 10.5 (0.410) 9.00 (0.350) 5.50 (0.220)
F 11.5 (0.450) 10.0 (0.390) 6.00 (0.240)
G 11.5 (0.450) 10.0 (0.390) 6.50 (0.260)
H 12.0 (0.470) 10.5 (0.410) 7.00 (0.280)
J 13.0 (0.510) 11.5 (0.450) 8.00 (0.310)
K 14.0 (0.550) 12.5 (0.490) 8.50 (0.330)
L 14.0 (0.550) 12.5 (0.490) 9.00 (0.350)
M 14.5 (0.570) 13.0 (0.510) 9.00 (0.350)
N 16.0 (0.630) 9.00 (0.350)
P 17.0 (0.670) 10.0 (0.390)
R 18.5 (0.730) 10.0 (0.390)
SOLID TANTALUM RESIN DIPPED CAPACITORS
LEAD-FREE COMPATIBLE
COMPONENT
118 IJUNE 2013
Technical Data: All technical data relate to an ambient temperature of +25°C
Capacitance Range: 0.10 μF to 330 μF
Capacitance Tolerance: ±20%; ±10% (±5% consult your AVX representative for details)
Rated Voltage DC (VR)
+85°C: 6.3 10 16 20 25 35 50
Category Voltage (VC)
+125°C: 4 6.3 10 13 16 23 33
Surge Voltage (VS)
+85°C: 8 13 20 26 33 46 65
Surge Voltage (VS)
+125°C: 5 9 12 16 21 28 40
Temperature Range: -55°C to +125°C
Environmental Classification: 55/125/56 (IEC 68-2)
Dissipation Factor: 0.04 for CR 0.1-1.5μF
0.06 for CR 2.2-6.8μF
0.08 for CR 10-68μF
0.10 for CR 100-330μF
Reliability: 1% per 1000 hrs. at 85°C with 0.1Ω/V series impedance, 60% confidence level.
Qualification: CECC 30201 - 032
Capacitance Range (letter denotes case size)
Capacitance Rated voltage DC (VR)
μF Code 6.3V 10V 16V 20V 25V 35V 50V
0.10 104 AA
0.15 154 AA
0.22 224 AA
0.33 334 AA
0.47 474 AA
0.68 684 AB
1.0 105 A A A C
1.5 155 A A A A D
2.2 225 A A A A B E
3.3 335 A A A B B C F
4.7 475 A A B C C E G
6.8 685 A B C D D F H
10 106 B C D E E F J
15 156 C D E F F H K
22 226 D E F H H K L
33 336 E F F J J M
47 476 F G J K M N
68 686 G H L N N
100 107 H K N N
150 157 K N N
220 227 M P R
330 337 P R
Values outside this standard range may be available on request.
AVX reserves the right to supply capacitors to a higher voltage rating, in the same case size, than that ordered.
MARKING
Polarity, capacitance, rated DC voltage, and an "A" (AVX
logo) are laser marked on the capacitor body which is made
of flame retardant gold epoxy resin with a limiting oxygen
index in excess of 30 (ASTM-D-2863).
• Polarity
• Capacitance
• Voltage
• AVX logo
• Tolerance code:
±20% = Standard (no marking)
±10% = “K” on reverse side of unit
±5% = “J” on reverse side of unit 16
10μ
A
+
Dipped Radial Capacitors
TAP Series
TECHNICAL SPECIFICATIONS
JUNE 2013 I119
Dipped Radial Capacitors
TAP Series
DCL DF ESR
AVX Case Capacitance (μA) % Max. (Ω)
Part No. Size μF Max. Max. @ 100 kHz
25 volt @ 85°C (16 volt @ 125°C)
TAP 105(*)025 A 1.0 0.5 4 10.0
TAP 155(*)025 A 1.5 0.5 4 8.0
TAP 225(*)025 A 2.2 0.5 6 6.0
TAP 335(*)025 B 3.3 0.6 6 5.0
TAP 475(*)025 C 4.7 0.9 6 4.0
TAP 685(*)025 D 6.8 1.3 6 3.1
TAP 106(*)025 E 10 2.0 8 2.5
TAP 156(*)025 F 15 3.0 8 2.0
TAP 226(*)025 H 22 4.4 8 1.5
TAP 336(*)025 J 33 6.6 8 1.2
TAP 476(*)025 M 47 9.4 8 1.0
TAP 686(*)025 N 68 13.6 8 0.8
35 volt @ 85°C (23 volt @ 125°C)
TAP 104(*)035 A 0.1 0.5 4 26.0
TAP 154(*)035 A 0.15 0.5 4 21.0
TAP 224(*)035 A 0.22 0.5 4 17.0
TAP 334(*)035 A 0.33 0.5 4 15.0
TAP 474(*)035 A 0.47 0.5 4 13.0
TAP 684(*)035 A 0.68 0.5 4 10.0
TAP 105(*)035 A 1.0 0.5 4 8.0
TAP 155(*)035 A 1.5 0.5 4 6.0
TAP 225(*)035 B 2.2 0.6 6 5.0
TAP 335(*)035 C 3.3 0.9 6 4.0
TAP 475(*)035 E 4.7 1.3 6 3.0
TAP 685(*)035 F 6.8 1.9 6 2.5
TAP 106(*)035 F 10 2.8 8 2.0
TAP 156(*)035 H 15 4.2 8 1.6
TAP 226(*)035 K 22 6.1 8 1.3
TAP 336(*)035 M 33 9.2 8 1.0
TAP 476(*)035 N 47 10.0 8 0.8
50 volt @ 85°C (33 volt @ 125°C)
TAP 104(*)050 A 0.1 0.5 4 26.0
TAP 154(*)050 A 0.15 0.5 4 21.0
TAP 224(*)050 A 0.22 0.5 4 17.0
TAP 334(*)050 A 0.33 0.5 4 15.0
TAP 474(*)050 A 0.47 0.5 4 13.0
TAP 684(*)050 B 0.68 0.5 4 10.0
TAP 105(*)050 C 1.0 0.5 4 8.0
TAP 155(*)050 D 1.5 0.6 4 6.0
TAP 225(*)050 E 2.2 0.8 6 3.5
TAP 335(*)050 F 3.3 1.3 6 3.0
TAP 475(*)050 G 4.7 1.8 6 2.5
TAP 685(*)050 H 6.8 2.7 6 2.0
TAP 106(*)050 J 10 4.0 8 1.6
TAP 156(*)050 K 15 6.0 8 1.2
TAP 226(*)050 L 22 8.8 8 1.0
DCL DF ESR
AVX Case Capacitance (μA) % Max. (Ω)
Part No. Size μF Max. Max. @ 100 kHz
6.3 volt @ 85°C (4 volt @ 125°C)
TAP 335(*)006 A 3.3 0.5 6 13.0
TAP 475(*)006 A 4.7 0.5 6 10.0
TAP 685(*)006 A 6.8 0.5 6 8.0
TAP 106(*)006 B 10 0.5 8 6.0
TAP 156(*)006 C 15 0.8 8 5.0
TAP 226(*)006 D 22 1.1 8 3.7
TAP 336(*)006 E 33 1.7 8 3.0
TAP 476(*)006 F 47 2.4 8 2.0
TAP 686(*)006 G 68 3.4 8 1.8
TAP 107(*)006 H 100 5.0 10 1.6
TAP 157(*)006 K 150 7.6 10 0.9
TAP 227(*)006 M 220 11.0 10 0.9
TAP 337(*)006 P 330 16.6 10 0.7
10 volt @ 85°C (6.3 volt @ 125°C)
TAP 225(*)010 A 2.2 0.5 6 13.0
TAP 335(*)010 A 3.3 0.5 6 10.0
TAP 475(*)010 A 4.7 0.5 6 8.0
TAP 685(*)010 B 6.8 0.5 6 6.0
TAP 106(*)010 C 10 0.8 8 5.0
TAP 156(*)010 D 15 1.2 8 3.7
TAP 226(*)010 E 22 1.7 8 2.7
TAP 336(*)010 F 33 2.6 8 2.1
TAP 476(*)010 G 47 3.7 8 1.7
TAP 686(*)010 H 68 5.4 8 1.3
TAP 107(*)010 K 100 8.0 10 1.0
TAP 157(*)010 N 150 12.0 10 0.8
TAP 227(*)010 P 220 17.6 10 0.6
TAP 337(*)010 R 330 20.0 10 0.5
16 volt @ 85°C (10 volt @ 125°C)
TAP 155(*)016 A 1.5 0.5 4 10.0
TAP 225(*)016 A 2.2 0.5 6 8.0
TAP 335(*)016 A 3.3 0.5 6 6.0
TAP 475(*)016 B 4.7 0.6 6 5.0
TAP 685(*)016 C 6.8 0.8 6 4.0
TAP 106(*)016 D 10 1.2 8 3.2
TAP 156(*)016 E 15 1.9 8 2.5
TAP 226(*)016 F 22 2.8 8 2.0
TAP 336(*)016 F 33 4.2 8 1.6
TAP 476(*)016 J 47 6.0 8 1.3
TAP 686(*)016 L 68 8.7 8 1.0
TAP 107(*)016 N 100 12.8 10 0.8
TAP 157(*)016 N 150 19.2 10 0.6
TAP 227(*)016 R 220 20.0 10 0.5
20 volt @ 85°C (13 volt @ 125°C)
TAP 105(*)020 A 1.0 0.5 4 10.0
TAP 155(*)020 A 1.5 0.5 4 9.0
TAP 225(*)020 A 2.2 0.5 6 7.0
TAP 335(*)020 B 3.3 0.5 6 5.5
TAP 475(*)020 C 4.7 0.7 6 4.5
TAP 685(*)020 D 6.8 1.0 6 3.6
TAP 106(*)020 E 10 1.6 8 2.9
TAP 156(*)020 F 15 2.4 8 2.3
TAP 226(*)020 H 22 3.5 8 1.8
TAP 336(*)020 J 33 5.2 8 1.4
TAP 476(*)020 K 47 7.5 8 1.2
TAP 686(*)020 N 68 10.8 8 0.9
TAP 107(*)020 N 100 16.0 10 0.6
(*) Insert capacitance tolerance code; M for ±20%, K for ±10% and J for ±5%
NOTE: Voltage ratings are minimum values. AVX reserves the right to supply high-
er voltage ratings in the same case size.
RATINGS AND PART NUMBER REFERENCE
JUNE 2013 I123
SOLID TANTALUM RESIN DIPPED TAP/TEP
TAPE AND REEL PACKAGING FOR AUTOMATIC COMPONENT INSERTION
TAP/TEP types are all offered on radial tape, in reel or
‘ammo’ pack format for use on high speed radial automatic
insertion equipment, or preforming machines.
The tape format is compatible with EIA 468A standard for
component taping set out by major manufacturers of radial
automatic insertion equipment.
Dipped Radial Capacitors
Tape and Reel Packaging
TAP/TEP – available in three formats. See page 124 for dimensions.
‘B’ wires for normal automatic insertion on
5mm pitch.
BRW suffix for reel
BRS suffix for ‘ammo’ pack
Available in case sizes A - J
‘C’ wires for preforming.
CRW suffix for reel
CRS suffix for ‘ammo’ pack
Available in case sizes A - R
‘S’ and ‘D’ wire for special applications,
automatic insertion on 2.5mm pitch.
SRW, DTW suffix for reel
SRS, DTS suffix for ‘ammo’ pack
Available in case sizes A - J
P2
P1
H3
H1
⌬P
⌬h
W2
W1
HL
d
T
W
SD
P
P2
P1
H3
H1
⌬P
⌬h
W2
W1
HL
d
T
W
SD
P
P2
P1
H3
H2
H1
⌬P
⌬h
W2
W1
L
d
T
W
SD
PS wire
124 IJUNE 2013
SOLID TANTALUM RESIN DIPPED TAP/TEP
Dipped Radial Capacitors
Tape and Reel Packaging
Description Code Dimension
Feed hole pitch P 12.7 ± 0.30 (0.500 ± 0.010)
Hole center to lead P13.85 ± 0.70 (0.150 ± 0.030)
to be measured at bottom
of clench
5.05 ± 1.00 (0.200 ± 0.040)
for S wire
Hole center to component center P26.35 ± 0.40 (0.250 ± 0.020)
Change in pitch Δp ± 1.00 (± 0.040)
Lead diameter d 0.50 ± 0.05 (0.020 ± 0.003)
Lead spacing S See wire form table
Component alignment Δh 0 ± 2.00 (0 ± 0.080)
Feed hole diameter D 4.00 ± 0.20 (0.150 ± 0.008)
Tape width W 18.0 + 1.00 (0.700 + 0.040)
- 0.50 - 0.020)
Hold down tape width W16.00 (0.240) min.
Hold down tape position W21.00 (0.040) max.
Lead wire clench height H 16.0 ± 0.50 (0.630 ± 0.020)
19.0 ± 1.00 (0.750 ± 0.040)
on request
Hole position H19.00 ± 0.50 (0.350 ± 0.020)
Base of component height H218.0 (0.700) min. (S wire only)
Component height H332.25 (1.300) max.
Length of snipped lead L 11.0 (0.430) max.
Total tape thickness T 0.70 ± 0.20 (0.030 ± 0.001)
Carrying card
0.50 ± 0.10 (0.020 ± 0.005)
REEL CONFIGURATION AND
DIMENSIONS:
millimeters (inches)
Diameter 30
(1.18) max.
53 (2.09) max.
80
(3.15)
360 (14.17) max.
45 (1.77) max.
40 (1.57) min.
cardboard with plastic hub.
Holding tape outside
Manufactured from cardboard with plastic hub.
Holding tape outside. Positive terminal leading.
PACKAGING QUANTITIES
For Reels For ‘Ammo’ pack For bulk products
Style Case size No. of pieces
A 1500
B, C, D 1250
E, F 1000
G, H, J 750
K, L, M, N, P, R 500
Style Case size No. of pieces
A, B, C, D 3000
E, F, G 2500
H, J 2000
K, L, M, N, P, R 1000
Style Case size No. of pieces
A to H 1000
J to L 500
M to R 100
AMMO PACK DIMENSIONS
millimeters (inches) max.
Height 360 (14.17), width 360 (14.17), thickness 60 (2.36)
GENERAL NOTES
Resin dipped tantalum capacitors are only available taped in
the range of case sizes and in the modular quantities by case
size as indicated.
Packaging quantities on tape may vary by ±1%.
TAP
TEP
TAP
TEP
TAP
TEP
CASE DIMENSIONS: millimeters (inches)
152 IJUNE 2013
SECTION 1:
ELECTRICAL CHARACTERISTICS AND EXPLANATION OF TERMS
1.1 CAPACITANCE
1.1.1 Rated capacitance (CR)
This is the nominal rated capacitance. For tantalum capaci-
tors it is measured as the capacitance of the equivalent
series circuit at 20°C in a measuring bridge supplied by a
120 Hz source free of harmonics with 2.2V DC bias max.
1.1.2 Temperature dependence on the capacitance
The capacitance of a tantalum capacitor varies with temper-
ature. This variation itself is dependent to a small extent on
the rated voltage and capacitor size. See graph below for
typical capacitance changes with temperature.
1.1.3 Capacitance tolerance
This is the permissible variation of the actual value of the
capacitance from the rated value.
1.1.4 Frequency dependence of the capacitance
The effective capacitance decreases as frequency increases.
Beyond 100 kHz the capacitance continues to drop until res-
onance is reached (typically between 0.5-5 MHz depending
on the rating). Beyond this the device becomes inductive.
Typical Capacitance vs. Temperature
% Capacitance
15
10
5
0
-5
-10
-15
Temperature (°C)
-55 -25 0 25 50 75 100 125
1.0␮F 35V
CAP (␮F)
1.4
1.2
1.0
0.8
0.6
0.4
100Hz 1kHz 10kHz 100kHz
Frequency
1.2 VOLTAGE
1.2.1 Rated DC voltage (VR)
This is the rated DC voltage for continuous operation up to
+85°C.
1.2.2 Category voltage (VC)
This is the maximum voltage that may be applied continu-
ously to a capacitor. It is equal to the rated voltage up to
+85°C, beyond which it is subject to a linear derating, to 2/3
VRat 125°C.
1.2.3 Surge voltage (VS)
This is the highest voltage that may be applied to a capaci-
tor for short periods of time. The surge voltage may be
applied up to 10 times in an hour for periods of up to
30 seconds at a time. The surge voltage must not be used
as a parameter in the design of circuits in which, in the
normal course of operation, the capacitor is periodically
charged and discharged.
100
90
80
70
60
50
Percent of 85°C RVDC1 (VR)
75 85 95 105 115 125
Temperature °C
TAP/TEP Technical Summary and
Application Guidelines
Typical Curve Capacitance vs. Frequency
Category Voltage vs. Temperature
JUNE 2013 I153
1.2.4 Effect of surges
The solid Tantalum capacitor has a limited ability to withstand
surges (15% to 30% of rated voltage). This is in common
with all other electrolytic capacitors and is due to the fact that
they operate under very high electrical stress within the oxide
layer. In the case of ‘solid’ electrolytic capacitors this is further
complicated by the limited self healing ability of the manganese
dioxide semiconductor.
It is important to ensure that the voltage across the terminals of
the capacitor does not exceed the surge voltage rating at any
time. This is particularly so in low impedance circuits where the
capacitor is likely to be subjected to the full impact of surges,
especially in low inductance applications. Even an extremely
short duration spike is likely to cause damage. In such situa-
tions it will be necessary to use a higher voltage rating.
1.2.5 Reverse voltage and non-polar operation
The reverse voltage ratings are designed to cover exceptional
conditions of small level excursions into incorrect polarity.
The values quoted are not intended to cover continuous
reverse operation.
The peak reverse voltage applied to the capacitor must not
exceed:
10% of rated DC working voltage to a maximum of
1V at 25°C
3% of rated DC working voltage to a maximum of
0.5V at 85°C
1% of category DC working voltage to a maximum of
0.1V at 125°C
1.2.6 Non-polar operation
If the higher reverse voltages are essential, then two capacitors,
each of twice the required capacitance and of equal
tolerance and rated voltage, should be connected in a
back-to-back configuration, i.e., both anodes or both
cathodes joined together. This is necessary in order to avoid
a reduction in life expectancy.
1.2.7 Superimposed AC voltage (Vrms) - Ripple Voltage
This is the maximum RMS alternating voltage, superimposed
on a DC voltage, that may be applied to a capacitor. The
sum of the DC voltage and the surge value of the
superimposed AC voltage must not exceed the category
voltage, Vc. Full details are given in Section 2.
1.2.8 Voltage derating
Refer to section 3.2 (pages 157-159) for the effect of voltage
derating on reliability.
85°C 125°C
Rated Surge Category Surge
Voltage Voltage Voltage Voltage
(V DC) (V DC) (V DC) (V DC)
2 2.6 1.3 1.7
3422.6
4 5.2 2.6 3.4
6.3845
10 13 6.3 9
16 20 10 12
20 26 13 16
25 33 16 21
35 46 23 28
50 65 33 40
1.3 DISSIPATION FACTOR AND TANGENT OF LOSS ANGLE (TAN D)
1.3.1 Dissipation factor (DF)
Dissipation factor is the measurement of the tangent of the
loss angle (Tan ␦) expressed as a percentage.
The measurement of DF is carried out at +25°C and 120 Hz
with 2.2V DC bias max. with an AC voltage free of harmonics.
The value of DF is temperature and frequency dependent.
1.3.2 Tangent of loss angle (Tan ␦)
This is a measure of the energy loss in the capacitor. It is
expressed as Tan ␦and is the power loss of the capacitor
divided by its reactive power at a sinusoidal voltage of specified
frequency. (Terms also used are power factor, loss factor and
dielectric loss, Cos (90 - ␦) is the true power factor.) The meas-
urement of Tan ␦is carried out at +20°C and 120 Hz with 2.2V
DC bias max. with an AC voltage free of harmonics.
1.3.3 Frequency dependence of dissipation factor
Dissipation Factor increases with frequency as shown in the
typical curves below.
10␮F 10V
3.3␮F 25V
1.0␮F 35V
100
50
20
10
5
2
1
100Hz 1kHz 10kHz 100kHz
Frequency
DF%
Typical Curve-Dissipation Factor vs. Frequency
TAP/TEP Technical Summary and
Application Guidelines
154 IJUNE 2013
1.3.4 Temperature dependence of dissipation factor
Dissipation factor varies with temperature as the typical
curves show to the right. For maximum limits please refer to
ratings tables.
Typical Curves-Dissipation Factor vs. Temperature
100␮F/6V
1␮F/35V
DF %
10
5
0
-55 -40 -20 0 20 40 60 80 100 125
Temperature C
1.4 IMPEDANCE, (Z) AND EQUIVALENT SERIES RESISTANCE (ESR)
1.4.1 Impedance, Z
This is the ratio of voltage to current at a specified frequency.
Three factors contribute to the impedance of a tantalum
capacitor; the resistance of the semiconducting layer,
the capacitance, and the inductance of the electrodes and
leads.
At high frequencies the inductance of the leads becomes a
limiting factor. The temperature and frequency behavior of
these three factors of impedance determine the behavior of
the impedance Z. The impedance is measured at 25°C and
100 kHz.
1.4.2 Equivalent series resistance, ESR
Resistance losses occur in all practical forms of capacitors.
These are made up from several different mechanisms,
including resistance in components and contacts, viscous
forces within the dielectric, and defects producing bypass
current paths. To express the effect of these losses they are
considered as the ESR of the capacitor. The ESR is frequency
dependent. The ESR can be found by using the relationship:
ESR = Tan ␦
2πfC
where f is the frequency in Hz, and C is the capacitance in
farads. The ESR is measured at 25°C and 100 kHz.
ESR is one of the contributing factors to impedance, and at
high frequencies (100 kHz and above) is the dominant factor,
so that ESR and impedance become almost identical,
impedance being marginally higher.
1.4.3 Frequency dependence of impedance and ESR
ESR and impedance both increase with decreasing frequency.
At lower frequencies the values diverge as the extra contri-
butions to impedance (resistance of the semiconducting
layer, etc.) become more significant. Beyond 1 MHz (and
beyond the resonant point of the capacitor) impedance again
increases due to induction.
ESR (␦)
1k
100
10
1
0.1
0.01
0.1 μF
0.33 μF
1 μF
10 μF
33 μF
100 μF
330 μF
100 1k 10k 100k 1M
Frequency f (Hz)
Impedance (Z)
ESR
Frequency Dependence of Impedance and ESR
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TAP/TEP Technical Summary and
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1.4.4 Temperature dependence of the impedance and ESR
At 100 kHz, impedance and ESR behave identically and
decrease with increasing temperature as the typical curves
show. For maximum limits at high and low temperatures,
please refer to graph opposite.
1.5 DC LEAKAGE CURRENT (DCL)
1.5.1 Leakage current (DCL)
The leakage current is dependent on the voltage applied, the
time, and the capacitor temperature. It is measured
at +25°C with the rated voltage applied. A protective resist-
ance of 1000⍀is connected in series with the capacitor
in the measuring circuit.
Three minutes after application of the rated voltage the leak-
age current must not exceed the maximum values indicated
in the ratings table. Reforming is unnecessary even after pro-
longed periods without the application of voltage.
1.5.2 Temperature dependence of the leakage current
The leakage current increases with higher temperatures, typical
values are shown in the graph.
For operation between 85°C and 125°C, the maximum
working voltage must be derated and can be found from the
following formula.
V max = 1- (T-85)x VR volts
120
where T is the required operating temperature. Maximum
limits are given in rating tables.
1.5.3 Voltage dependence of the leakage current
The leakage current drops rapidly below the value corre-
sponding to the rated voltage VRwhen reduced voltages are
applied. The effect of voltage derating on the leakage
current is shown in the graph.
This will also give a significant increase in reliability for any
application. See Section 3 (pages 157-159) for details.
1.5.4 Ripple current
The maximum ripple current allowance can be calculated from
the power dissipation limits for a given temperature rise above
ambient. Please refer to Section 2 (page 156) for details.
10
1
0.1
Leakage Current DCLT/DCL 25°C
-55 -40 -20 0 20 40 60 80 100 125
Temperature °C
Temperature Dependence of the
Leakage Current for a Typical Component
Effect of Voltage Derating on Leakage Current
1
0.1
0.01
Leakage Current Ratio DCL/DCL @ VR
020
40 60 80 100
% of Rated Voltage (VR)
TYPICAL RANGE
1/35
10/35
47/35
100
10
1
0.1
ESR/Impedance Z (⍀)
-55 -40 -20 0 +20 +40 +60 +80 +100 +125
Temperature T (C)
Temperature Dependence of the
Impedance and ESR
156 IJUNE 2013
In an AC application heat is generated within the capacitor
by both the AC component of the signal (which will depend
upon signal form, amplitude and frequency), and by the
DC leakage. For practical purposes the second factor is
insignificant. The actual power dissipated in the capacitor is
calculated using the formula:
P = I2 R = E2R
Z2
I = rms ripple current, amperes
R = equivalent series resistance, ohms
E = rms ripple voltage, volts
P = power dissipated, watts
Z = impedance, ohms, at frequency under
consideration
Using this formula it is possible to calculate the maximum
AC ripple current and voltage permissible for a particular
application.
2.2 MAXIMUM AC RIPPLE VOLTAGE
(EMAX)
From the previous equation:
E(max) = ZP max
R
where Pmax is the maximum permissible ripple voltage as listed
for the product under consideration (see table).
However, care must be taken to ensure that:
1. The DC working voltage of the capacitor must not be
exceeded by the sum of the positive peak of the applied
AC voltage and the DC bias voltage.
2. The sum of the applied DC bias voltage and the negative
peak of the AC voltage must not allow a voltage reversal
in excess of that defined in the sector, ‘Reverse Voltage’.
2.3 MAXIMUM PERMISSIBLE POWER
DISSIPATION (WATTS) @ 25°C
The maximum power dissipation at 25°C has been calculated
for the various series and are shown in Section 2.4, together
with temperature derating factors up to 125°C.
For leaded components the values are calculated for parts
supported in air by their leads (free space dissipation).
The ripple ratings are set by defining the maximum tempera-
ture rise to be allowed under worst case conditions, i.e.,
with resistive losses at their maximum limit. This differential
is normally 10°C at room temperature dropping to 2°C at
125°C. In application circuit layout, thermal management,
available ventilation, and signal waveform may significantly
affect the values quoted below. It is recommended that
temperature measurements are made on devices during
operating conditions to ensure that the temperature differ ential
between the device and the ambient temperature is less than
10°C up to 85°C and less than 2°C between 85°C and 125°C.
Derating factors for temperatures above 25°C are also shown
below. The maximum permissible proven dissipation should be
multiplied by the appropriate derating factor.
For certain applications, e.g., power supply filtering, it may
be desirable to obtain a screened level of ESR to enable
higher ripple currents to be handled. Please contact our
applications desk for information.
2.4 POWER DISSIPATION RATINGS
(IN FREE AIR)
TAR – Molded Axial
SECTION 2:
AC OPERATION — RIPPLE VOLTAGE AND RIPPLE CURRENT
2.1 RIPPLE RATINGS (AC)
Case Max. power
size dissipation (W)
Q 0.065
R 0.075
S0.09
W 0.105
Temperature
derating factors
Temp. °C Factor
+25 1.0
+85 0.6
+125 0.4
Case Max. power
size dissipation (W)
A0.09
B0.10
C 0.125
D0.18
Temperature
derating factors
Temp. °C Factor
+20 1.0
+85 0.9
+125 0.4
TAA – Hermetically Sealed Axial
Case Max. power
size dissipation (W)
A 0.045
B0.05
C 0.055
D0.06
E 0.065
F 0.075
G0.08
H 0.085
J0.09
K0.1
L0.11
M/N 0.12
P0.13
R0.14
Temperature
derating factors
Temp. °C Factor
+25 1.0
+85 0.4
+125 0.09
TAP/TEP – Resin Dipped Radial
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SECTION 3:
RELIABILITY AND CALCULATION OF FAILURE RATE
3.1 STEADY-STATE
Tantalum Dielectric has essentially no wear out mechanism
and in certain circumstances is capable of limited self
healing, random failures can occur in operation. The failure
rate of Tantalum capacitors will decrease with time and not
increase as with other electrolytic capacitors and other
electronic components.
Figure 1. Tantalum reliability curve.
The useful life reliability of the Tantalum capacitor is affected
by three factors. The equation from which the failure rate can
be calculated is:
F = FUx FTx FRx FB
where FUis a correction factor due to operating voltage/
voltage derating
FTis a correction factor due to operating
temperature
FRis a correction factor due to circuit series
resistance
FBis the basic failure rate level. For standard
leaded Tantalum product this is 1%/1000hours
Operating voltage/voltage derating
If a capacitor with a higher voltage rating than the maximum
line voltage is used, then the operating reliability will be
improved. This is known as voltage derating. The graph,
Figure 2, shows the relationship between voltage derating
(the ratio between applied and rated voltage) and the failure
rate. The graph gives the correction factor FUfor any
operating voltage.
Voltage Correction Factor
Figure 2. Correction factor to failure rate F for voltage
derating of a typical component (60% con. level).
Operating temperature
If the operating temperature is below the rated temperature
for the capacitor then the operating reliability will be improved
as shown in Figure 3. This graph gives a correction factor FT
for any temperature of operation.
Temperature Correction Factor
Figure 3. Correction factor to failure rate F for ambient
temperature T for typical component (60% con. level).
20
100.0
10.0
1.0
0.1
0.0 30 40 50 60 70 80 90 100 110 120 130
Temperature (C)
Correction Factor
Tantalum
1.0000
0.1000
0.0100
0.0010
0.0001
Correction Factor
00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Applied Voltage / Rated Voltage
Infinite Useful Life
Useful life reliability can be altered by voltage
derating, temperature or series resistance
Infant
Mortalities
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Circuit Impedance
All solid tantalum capacitors require current limiting
resistance to protect the dielectric from surges. A series
resistor is recommended for this purpose. A lower circuit
impedance may cause an increase in failure rate, especially
at temperatures higher than 20°C. An inductive low imped-
ance circuit may apply voltage surges to the capacitor and
similarly a non-inductive circuit may apply current surges
to the capacitor, causing localized over-heating and failure.
The recommended impedance is 1Ω per volt. Where this is
not feasible, equivalent voltage derating should be used
(See MIL HANDBOOK 217E). Table I shows the correction
factor, FR, for increasing series resistance.
Table I: Circuit Impedance
Correction factor to failure rate F for series resistance R
on basic failure rate FBfor a typical component (60%
con. level).
Example calculation
Consider a 12 volt power line. The designer needs about
10μF of capacitance to act as a decoupling capacitor near a
video bandwidth amplifier. Thus the circuit impedance will be
limited only by the output impedance of the boards power
unit and the track resistance. Let us assume it to be about
2 Ohms minimum, i.e., 0.167 Ohms/Volt. The operating
temperature range is -25°C to +85°C. If a 10μF 16 Volt
capacitor was designed-in, the operating failure rate would
be as follows:
a) FT= 0.8 @ 85°C
b) FR= 0.7 @ 0.167 Ohms/Volt
c) FU= 0.17 @ applied voltage/rated voltage = 75%
Thus FB= 0.8 x 0.7 x 0.17 x 1 = 0.0952%/1000 Hours
If the capacitor was changed for a 20 volt capacitor, the
operating failure rate will change as shown.
FU= 0.05 @ applied voltage/rated voltage = 60%
FB= 0.8 x 0.7 x 0.05 x 1 = 0.028%/1000 Hours
3.2 DYNAMIC
As stated in Section 1.2.4 (page 153), the solid Tantalum
capacitor has a limited ability to withstand voltage and current
surges. Such current surges can cause a capacitor to fail.
The expected failure rate cannot be calculated by a simple
formula as in the case of steady-state reliability. The two
parameters under the control of the circuit design engineer
known to reduce the incidence of failures are derating and
series resistance.The table below summarizes the results of
trials carried out at AVX with a piece of equipment which has
very low series resistance and applied no derating. So that
the capacitor was tested at its rated voltage.
Results of production scale derating experiment
As can clearly be seen from the results of this experiment,
the more derating applied by the user, the less likely the
probability of a surge failure occurring.
It must be remembered that these results were derived from
a highly accelerated surge test machine, and failure rates in
the low ppm are more likely with the end customer.
Circuit Resistance ohms/volt FR
3.0 0.07
2.0 0.1
1.0 0.2
0.8 0.3
0.6 0.4
0.4 0.6
0.2 0.8
0.1 1.0
Capacitance and Number of units 50% derating No derating
Voltage tested applied applied
47μF 16V 1,547,587 0.03% 1.1%
100μF 10V 632,876 0.01% 0.5%
22μF 25V 2,256,258 0.05% 0.3%
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JUNE 2013 I159
A commonly held misconception is that the leakage current
of a Tantalum capacitor can predict the number of failures
which will be seen on a surge screen. This can be disproved
by the results of an experiment carried out at AVX on 47μF
10V surface mount capacitors with different leakage
currents. The results are summarized in the table below.
Leakage Current vs Number of Surge Failures
Again, it must be remembered that these results were
derived from a highly accelerated surge test machine,
and failure rates in the low ppm are more likely with the end
customer.
AVX recommended derating table
For further details on surge in Tantalum capacitors refer
to J.A. Gill’s paper “Surge in Solid Tantalum Capacitors”,
available from AVX offices worldwide.
An added bonus of increasing the derating applied in a
circuit, to improve the ability of the capacitor to withstand
surge conditions, is that the steady-state reliability is
improved by up to an order. Consider the example of a
6.3 volt capacitor being used on a 5 volt rail. The steady-
state reliability of a Tantalum capacitor is affected by three
parameters; temperature, series resistance and voltage
derating. Assuming 40°C operation and 0.1Ω/volt of series
resistance, the scaling factors for temperature and series
resistance will both be 0.05 [see Section 3.1 (page 156)]. The
derating factor will be 0.15. The capacitors reliability will
therefore be
Failure rate = FUx FTx FRx 1%/1000 hours
= 0.15 x 0.05 x 1 x 1%/1000 hours
= 7.5% x 10-3/hours
If a 10 volt capacitor was used instead, the new scaling factor
would be 0.017, thus the steady-state reliability would be
Failure rate = FUx FTx FRx 1%/1000 hours
= 0.017 x 0.05 x 1 x 1%/1000 hours
= 8.5% x 10-4/ 1000 hours
So there is an order improvement in the capacitors steady-
state reliability.
3.3 RELIABILITY TESTING
AVX performs extensive life testing on tantalum capacitors.
I2,000 hour tests as part of our regular Quality Assurance
Program.
Test conditions:
I85°C/rated voltage/circuit impedance of 3Ω max.
I125°C/0.67 x rated voltage/circuit impedance of 3Ω max.
3.4 Mode of Failure
This is normally an increase in leakage current which ultimately
becomes a short circuit.
Number tested Number failed surge
Standard leakage range 10,000 25
0.1 μA to 1μA
Over Catalog limit 10,000 26
5μA to 50μA
Classified Short Circuit 10,000 25
50μA to 500μA
Voltage Rail Working Cap Voltage
3.3 6.3
510
10 20
12 25
15 35
≥24 Series Combinations (11)
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160 IJUNE 2013
SECTION 5:
MECHANICAL AND THERMAL PROPERTIES, LEADED CAPACITORS
5.1 ACCELERATION
10 g (981 m/s)
5.2 VIBRATION SEVERITY
10 to 2000 Hz, 0.75 mm or 98 m/s2
5.3 SHOCK
Trapezoidal Pulse 10 g (981 m/s) for 6 ms
5.4 TENSILE STRENGTH OF
CONNECTION
10 N for type TAR, 5 N for type TAP/TEP.
5.5 BENDING STRENGTH OF
CONNECTIONS
2 bends at 90°C with 50% of the tensile strength test loading.
5.6 SOLDERING CONDITIONS
Dip soldering permissible provided solder bath temperature
⬉270°C; solder time <3 sec.; circuit board thickness
⭌1.0 mm.
5.7 INSTALLATION INSTRUCTIONS
The upper temperature limit (maximum capacitor surface
temperature) must not be exceeded even under the most
unfavorable conditions when the capacitor is installed. This
must be considered particularly when it is positioned near
components which radiate heat strongly (e.g., valves and
power transistors). Furthermore, care must be taken, when
bending the wires, that the bending forces do not strain the
capacitor housing.
5.8 INSTALLATION POSITION
No restriction.
5.9 SOLDERING INSTRUCTIONS
Fluxes containing acids must not be used.
SECTION 4:
APPLICATION GUIDELINES FOR TANTALUM CAPACITORS
Dangerous Range
Allowable Range
with Preheat
Allowable Range
with Care
270
260
250
240
230
220
210
200
0 2 4 6 8 10 12
Soldering Time (secs.)
Allowable range of peak temp./time combination for wave soldering
Temperature
(o
C)
*See appropriate product specification
TAP/TEP Technical Summary and
Application Guidelines
4.1 SOLDERING CONDITIONS AND
BOARD ATTACHMENT
The soldering temperature and time should be the minimum
for a good connection.
A suitable combination for wavesoldering is 230°C - 250°C
for 3 - 5 seconds.
Small parametric shifts may be noted immediately after wave
solder, components should be allowed to stabilize at room
temperature prior to electrical testing.
AVX leaded tantalum capacitors are designed for wave
soldering operations.
4.2 RECOMMENDED SOLDERING
PROFILES
Recommended wave soldering profile for mounting of
tantalum capacitors is shown below.
After soldering the assembly should preferably be allowed to
cool naturally. In the event that assisted cooling is used, the
rate of change in temperature should not exceed that used
in reflow.