IXD_604 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description * 4A Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Outputs May be Connected in Parallel for Higher Drive Current * Matched Rise and Fall Times * Low Propagation Delay Time * Low, 10A Supply Current * Low Output Impedance The IXDD604/IXDF604/IXDI604/IXDN604 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 4A of current while producing voltage rise and fall times of less than 10ns. The input of each driver is virtually immune to latch up, and proprietary circuitry eliminates cross conduction and current "shoot-through." Low propagation delay and fast, matched rise and fall times make the IXD_604 family ideal for high-frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD604 is a dual non-inverting driver with an enable. The IXDN604 is a dual non-inverting driver, the IXDI604 is a dual inverting driver, and the IXDF604 has one inverting driver and one non-inverting driver. The IXD_604 family is available in a standard 8-pin DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package. Ordering Information Part Number IXDD604D2TR IXDD604PI IXDD604SI IXDD604SITR IXDD604SIA IXDD604SIATR IXDF604PI IXDF604SI IXDF604SITR IXDF604SIA IXDF604SIATR IXDI604PI IXDI604SI IXDI604SITR IXDI604SIA IXDI604SIATR IXDN604PI IXDN604SI IXDN604SITR IXDN604SIA IXDN604SIATR DS-IXD_604-R09 Logic Configuration ENA A OUTA B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA ENB INB Package Type Packing Method Quantity 8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IXD_604 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: -40C < TA < +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 5 2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 10 11 R09 IXD_604 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD604PI/SI/SIA ENA 1 INA 2 GND 3 INB 4 A B IXDD604D2 8 ENB ENA 1 7 OUTA INA 2 6 VCC INB 3 5 OUTB ENB 4 IXDI604PI/SI/SIA NC 1 INA 2 GND 3 INB 4 A B Pin Name Description 8 OUTA A 7 GND INA Channel A Logic Input B 6 VCC INB Channel B Logic Input 5 OUTB ENA Channel A Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state ENB Channel B Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state OUTA OUTA Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDF604PI/SI/SIA 8 NC NC 1 7 OUTA INA 2 6 VCC GND 3 5 OUTB INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB IXDN604PI/SI/SIA NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units VCC -0.3 40 V VINx , VENx -5 VCC+0.3 V IOUT - 4 A Iout_pulsed - 5 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Supply Voltage Input Voltage Output Current Output Pulsed Current (0.5s) Absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Symbol Range Units VCC 4.5 to 35 V Operating Temperature Range TA -40 to +125 C R09 www.ixysic.com Supply Voltage 3 IXD_604 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted). Conditions Symbol Minimum Input Voltage, High Parameter 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN 10 A IXDD604 only VENH 2/3VCC - High EN Input Voltage - Low EN Input Voltage IXDD604 only VENL - V Output Voltage, High - VOH VCC-0.025 1/3VCC - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 1.3 2.5 Output Resistance, Low State ROL - 1.1 2 IDC - - 1 Rise Time VCC=18V, IOUT=10mA Limited by package power dissipation VCC=18V, CLOAD=1000pF tr - 9 16 Fall Time VCC=18V, CLOAD=1000pF tf - 8 14 On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly - 29 50 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly - 35 50 Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH - 35 55 Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD - 40 55 VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC REN - 200 1 <1 <1 3 10 10 Input Current Output Current, Continuous Enable Pull-Up Resistor Power Supply Current ICC Typical Maximum Units V V A ns k mA A 1.6 Electrical Characteristics: -40C < TA < +125C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted). Parameter Conditions Symbol Minimum Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 0V < VIN < VCC IIN - VOH -10 VCC-0.025 10 Output Voltage, High Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 3 Output Resistance, Low State ROL - 2.5 IDC - 1 Rise Time VCC=18V, IOUT=10mA Limited by package power dissipation VCC=18V, CLOAD=1000pF tr - 16 Fall Time VCC=18V, CLOAD=1000pF tf - 14 On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly - 65 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly - 65 Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH - 65 Disable to High Impedance State Delay Time IXDD604 only, VCC=18V VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC tDOLD - 65 3.5 150 150 Input Current Output Current, Continuous Power Supply Current 4 www.ixysic.com ICC - Units V A V A ns mA A R09 IXD_604 INTEGRATED CIRCUITS DIVISION 1.7 Thermal Characteristics Package Parameter Symbol Rating D2 (8-Pin DFN) Units 35 PI (8-Pin DIP) 125 JA Thermal Resistance, Junction-to-Ambient SI (8-Pin Power SOIC) C/W 85 SIA (8-Pin SOIC) 120 SI (8-Pin Power SOIC) JC Thermal Resistance, Junction-to-Case 10 C/W 2 IXD_604 Performance 2.1 Timing Diagrams VIH INx VIH INx VIL VIL tondly toffdly tondly toffdly 90% OUTx 90% OUTx 10% 10% tf tr tf tr 2.2 Characteristics Test Diagram + 0.1F 10F INA VCC - VCC INB OUTA OUTB CLOAD VCC VIN ENA ENB GND R09 Tektronix Current Probe 6302 www.ixysic.com CLOAD Tektronix Current Probe 6302 5 IXD_604 INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IXDD604 3.3 IXDF604 IXDD604 IXDF604 VCC VCC 200k OUTA INA VCC ENA INA GND OUTA VCC VCC 200k OUTB INB VCC ENB INB OUTB GND INA OUTA 0 1 1 0 INX ENX OUTX INB 0 1 or open OUTB 0 0 1 1 or open 0 1 1 0 0 1 Z 1 0 Z 3.4 IXDN604 3.2 IXDI604 IXDI604 IXDN604 VCC OUTA INA VCC OUTA INA GND GND VCC OUTB INB 6 VCC OUTB INB INX OUTX INX OUTX 0 1 0 0 1 0 1 1 www.ixysic.com R09 IXD_604 INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics 100 9 CL=10nF CL=1nF CL=470pF 40 80 40 20 0 0 10 15 20 25 30 Supply Voltage (V) 120 40 5 10 15 20 25 30 Supply Voltage (V) VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V 80 60 120 40 4000 6000 8000 Load Capacitance (pF) 140 120 100 toffdly tondly 5 2.9 10 15 20 25 Supply Voltage (V) 30 80 60 10000 0 2000 4000 6000 8000 Load Capacitance (pF) 50 40 toffdly 30 tondly 2 Input Threshold Voltage vs. Temperature (VCC=18V, CL=1nF) 100 120 140 4 6 8 Input Voltage (V) 10 Propagation Delay vs. Temperature Min VIH 2.3 2.1 Max VIL 1.9 2.6 2.4 2.2 VIH 2.0 1.8 VIL 1.6 1.4 20 40 60 80 Temperature (C) 100 120 140 0 5 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 toffdly 40 35 tondly 30 25 0 20 40 60 80 Temperature (C) 100 120 140 Enable Threshold vs. Supply Voltage Input Threshold vs. Supply Voltage 3.2 Input Threshold (V) 2.5 45 20 -40 -20 12 2.8 10000 50 3.0 0 20 40 60 80 Temperature (C) 40 60 35 2.7 1.7 -40 -20 0 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V Enable Threshold (V) 0 Input Threshold Voltage (V) -40 -20 40 20 20 R09 35 Propagation Delay vs. Input Voltage (VCC=15V, CL=1nF) 70 Propagation Delay (ns) Propagation Delay (ns) 2000 Propagation Delay vs. Supply Voltage (VIN=0-5V, CL=1nF, f=1kHz) 40 5 0 0 60 6 20 0 80 tf 7 A&B Fall Time vs. Load Capacitance at Various VCC Levels 100 20 160 tr 8 4 0 A&B Rise Time vs. Load Capacitance at Various VCC Levels 100 Rise Time (ns) 35 Fall Time (ns) 5 CL=10nF CL=1nF CL=470pF 60 20 0 Rise & Fall Times (ns) 80 60 10 Fall Time (ns) Rise Time (ns) 100 120 Propagation Delay (ns) 120 A&B Rise and Fall Times vs. Temperature (Input=0-5V, VCC=18V, CL=1nF) A&B Fall Times vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C) A&B Rise Times vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C) 22 20 18 16 14 12 10 8 6 4 2 0 VENH VENL 0 5 10 15 20 25 Supply Voltage (V) 30 35 7 IXD_604 INTEGRATED CIRCUITS DIVISION 100 400 10 Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V) 250 f=1MHz f=500kHz f=100kHz f=50kHz 200 f=2MHz 350 300 400 150 100 250 200 150 100 50 250 200 150 100 50 1000 Load Capacitance (pF) 10 Supply Current vs. Frequency Both Outputs Active (VCC=12V) 100 10 1 0.1 10 100 1000 Frequency (kHz) CL=10nF CL=1nF CL=470pF 100 10 1 1 10000 Supply Current vs. Frequency Both Outputs Active (VCC=8V) 1000 CL=10nF CL=1nF CL=470pF 10000 0.1 1 10000 Supply Current (mA) Supply Current (mA) CL=10nF CL=1nF CL=470pF 100 1000 Load Capacitance (pF) Supply Current vs. Frequency Both Outputs Active (VCC=18V) 1000 1 0 100 1000 Supply Current vs. Frequency Both Outputs Active (VCC=35V) 1000 0 100 10000 Supply Current (mA) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz 1000 Load Capacitance (pF) 100 10 1 0.1 10 100 1000 Frequency (kHz) 10000 Quiescent Supply Current vs. Temperature (VCC=18V) 3.0 CL=10nF CL=1nF CL=470pF Supply Current (mA) Supply Current (mA) 10000 Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V) 300 0 100 Supply Current (mA) 350 1000 Load Capacitance (pF) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz 300 50 1 100 Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V) 350 Supply Current (mA) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz Supply Current (mA) Supply Current (mA) 1000 Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V) VIN=3.5V VIN=5V VIN=10V 2.5 2.0 1.5 1.0 0.5 VIN=0V & 18V 0.01 1 Dynamic Supply Current vs. Temperature (VCC=18V, VIN=5V, f=1khz, CL=1nF) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 8 0.0 1 1000 10 100 1000 Frequency (kHz) 10000 -8 -6 -4 -2 20 40 60 80 Temperature (C) 100 120 140 0 20 40 60 80 Temperature (C) 100 120 140 Output Sink Current vs. Supply Voltage (CL=10nF) 10 8 6 4 2 0 0 0 -40 -20 Output Source Current vs. Supply Voltage (CL=10nF) -10 Output Source Current (A) Supply Current (mA) 1.4 10 100 Frequency (kHz) Output Sink Current (A) 0.01 0 5 10 15 20 25 Supply Voltage (V) www.ixysic.com 30 35 0 5 10 15 20 25 Supply Voltage (V) 30 35 R09 IXD_604 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (VCC=18V, CL=10nF) 6 Output Sink Current (A) Output Source Current (A) 6 5 4 3 2 0 20 40 60 80 Temperature (C) 100 120 140 4 3 -40 -20 High State Output Resistance vs. Supply Voltage (IOUT= -10mA) 4.0 3.5 3.0 3.0 2.5 2.0 1.5 1.0 0.5 0 20 40 60 80 Temperature (C) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA) 4.0 3.5 Resistance () Resistance () 5 2 -40 -20 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0 R09 Output Sink Current vs. Temperature (VCC=18V, CL=10nF) 5 10 15 20 25 Supply Voltage (V) 30 35 0 www.ixysic.com 5 10 15 20 25 Supply Voltage (V) 30 35 9 IXD_604 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification IXD_604 All Versions MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles IXD_604SI / IXD_604SIA / IXD_604D2 IXD_604PI 260C 250C 30 seconds 30 seconds 3 - 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based 10 www.ixysic.com R09 IXD_604 INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 5.5.1 SIA (8-Pin SOIC) 0.31 / 0.51 (0.012 / 0.020) 8x TOP VIEW PCB Land Pattern 1.55 (0.061) 5 5.80 / 6.20 (0.228 / 0.244) 3.75 (0.148) 3.80 / 4.00 (0.150 / 0.157) 0.10 / 0.25 (0.004 / 0.010) A PIN #1 1.25 MIN (0.049 MIN) 0.25 (0.010) 1.27 0.05 6x A 4 1.75 MAX (0.069 MAX) 0.60 (0.024) GAUGE PLANE SEATING PLANE 0.40 / 1.27 (0.016 / 0.050) 8- 0 4.80 / 5.00 (0.189 / 0.197) Dimensions MIN / MAX 0.10 (0.004) 0.10 / 0.25 (0.004 / 0.010) Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. Lead thickness includes plating. 5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back) PCB Land Pattern 0.31 / 0.51 (0.012 / 0.020) 8x TOP VIEW BOTTOM VIEW 5 5.80 / 6.20 (0.228 / 0.244) PIN #1 1.27 0.05 6x 2.81 / 3.30 (0.111 / 0.130) R09 2.23 (0.088) 3.055 (0.120) 4 4.80 / 5.00 (0.189 / 0.197) 0.10 / 0.25 (0.004 / 0.010) A 0.25 (0.010) A 0 / 0.15 (0 / 0.006) 1.55 (0.061) 3.85 (0.152) 2.05 / 2.41 (0.081 / 0.095) 3.80 / 4.00 (0.150 / 0.157) 1.25 MIN (0.049 MIN) 1.70 MAX (0.067 MAX) 0.60 (0.024) 0.10 (0.004) GAUGE PLANE SEATING PLANE 0.40 / 1.27 (0.016 / 0.050) Dimensions MIN / MAX 8- 0 Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current. 7. Lead thickness includes plating. www.ixysic.com 11 IXD_604 INTEGRATED CIRCUITS DIVISION 5.5.3 Tape & Reel Information for SI and SIA Packages 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) A0=6.50 (0.256) K0= 2.10 (0.083) P1=8.00 (0.315) Dimensions mm (inches) User Direction of Feed Embossed Carrier NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Embossment 5.5.4 PI (8-Pin DIP) 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 0.457 0.076 (0.018 0.003) 4.064 TYP (0.160) 3.302 0.051 (0.130 0.002) 7.239 TYP. (0.285) 0.254 0.0127 (0.010 0.0005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) 12 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) www.ixysic.com R09 IXD_604 INTEGRATED CIRCUITS DIVISION 5.5.5 D2 (8-Pin DFN) 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.157 BSC) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177) 3.10 (0.122) 0.45 (0.018) 0.10 (0.004) 2.60 (0.102) 1.20 (0.047) 0.74 / 0.83 (0.029 / 0.033) Recommended PCB Land Pattern 3.03 / 3.10 (0.119 / 0.122) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 Pin 8 2.53 / 2.60 (0.100 / 0.102) 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) NOTE: The exposed metal pad on the back of the D2 package should be connected to GND. Pad is not suitable for carrying current. 5.5.6 Tape & Reel Information for D2 Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.55 0.05 4.00 0.10 See Note #2 2.00 0.05 R0.75 TYP 1.75 0.10 (0.05) 5 MAX 5.50 0.05 (0.05) B0=5.40 0.10 12.00 0.30 Embossed Carrier K0=1.90 0.10 P1=8.00 0.10 5 MAX A0=4.25 0.10 Embossment 0.30 0.05 1.50 (MIN) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_604-R09 (c)Copyright 2017, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/25/2017 R09 www.ixysic.com 13 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: IXDI604PI IXDD604D2TR IXDD604PI IXDD604SI IXDD604SIA IXDD604SIATR IXDD604SITR IXDF604PI IXDF604SI IXDF604SIA IXDF604SIATR IXDF604SITR IXDI604SI IXDI604SIA IXDI604SIATR IXDI604SITR IXDN604PI IXDN604SI IXDN604SIA IXDN604SIATR IXDN604SITR