05/2006
AWT6272R
HELPTM Cellular/WCDMA 3.4 V/29 dBm
Linear Power Amplifier Module
PRELIMINARY DA T A SHEET - Rev 1.5
M20 Package
10 Pin 4 mm x 4 mm x 1.1 mm
Surface Mount Module
Figure 1: Block Diagram
MMIC technology offering state-of-the-art reliability,
temperature stability, and ruggedness. Select able bias
modes that optimize efficiency for different output power
levels, and a shutdown mode with low leakage current,
increase handset talk and standby time. The self-
contained 4 mm x 4 mm x 1.1 mm surface mount
package incorporates matching networks optimized
for output power, efficiency, and linearity in a 50 Ω
system.
FEATURES
•InGaP HBT Technology
•High Efficiency:
44 % @ POUT = +29 dBm
20 % @ POUT = +16 dBm
15 % @ POUT = +7 dBm
•Low Quiescent Current: 16 mA
•Low Leakage Current in Shutdown Mode: <1 µA
•VREF = +2.85 V (+2.75 V min over temp)
•Optimized for a 50 Ω System
•Low Profile Miniature Surface Mount Package
Option: 1.1 mm Max
•RoHS Compliant Package, 250 oC MSL-3
•HSDPA Compliant (no backoff)
APPLICATIONS
•Dual Band WCDMA Wireless Handsets
•Dual Mode 3GPP Wireless Handsets
PRODUCT DESCRIPTION
The AWT6272R meets the increasing demands for
higher output power in UMTS handsets. The PA module
is optimized for VREF = +2.85 V, a requirement for
compatibility with the Qualcomm® 6250 chipset. The
device is manufactured on an advanced InGaP HBT
Bias Control
V
CC
V
REF
RF
IN
RF
OUT
GND
V
MODE
1
7
5
8
10
6
GND at slug (pad)
3
9
4
2
GND
V
CC
GND
GND
AWT6272R