Specifications subject to change without notice. All dimensions in inches. © Copyright 1998 The Connor-Winfield Corporation
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851-4722
Fax: 630- 851- 5040
www.conwin.com
Bulletin Sm044
Page 2 of 2
Revision 08
Date 12 May 2004
Pin Connections
1: Tri-State E/D
2: Ground
3: Output
4: VDD
Dimensional Tolerance: ±.02” (.
±.005” (.
Dimensional Tolerance: ±.02” (.508mm)
±.005” (.127mm)
Soldering
General Conditions 260°C max x 10 sec max x 2 times max or
230°C max x 180 sec max x 1 time
Typical Operation Data (Vapor phase reflow)
20 to 100 sec up to 215°C, 50 sec
at 215°C, then down to room temperature per 1 to 5°C / sec
Environmental Characteristics
Temperature Cycle The specimen shall meet electrical characteristics after
tested 5 cycles of -55°C / 30 minutes and +125°C / 30 minutes
Hermetical No bubbles appear in Flourinert (FC-43) at 125°C ±5°C for 5 minutes
Solvent Resistance Marking will withstand immersion in
Isopropyl Alcohol or Trichloroethylene
Suggested Pad Layout
Ordering Information
Mechanical Characteristics
Free Drop The specimen shall meet electrical characteristics after tested 3 times,
Free Drop testing on the hard wooden board from a height of 75 cm.
Vibration The specimen shall meet electrical characteristics after tested
by the following conditions: 10-55Hz 1.5mm Amplitude,
55-2000 Hz 20 G's, 2 hours for each plane
Thermal Shock After applied Thermal Shock of 260°C
max x 10 sec max x 2 times, or 230°C max x 180 sec max,
the specimen shall meet electrical characteristics
Solderability (EIAJ-RCX-0102.101 Condition 1a)
1) Flux: MIL-F-14256 (WW Rosin=25%, Isopropyl Alcohol = 75%)
2) Solder: QQ-S-571 (Sn = 63%, Pb = 37%)
3) Solder bath temperature: 235°C ±5°C
4) Depth of immersion: Up to electrical terminal
5) Immersing time: Within 2 sec ±0.5 sec into solder bath
After performing the above procedures, a newly soldered coverage shall be greater than 90%After performing the above procedures, a newly soldered coverage shall be greater than 90%
After performing the above procedures, a newly soldered coverage shall be greater than 90%After performing the above procedures, a newly soldered coverage shall be greater than 90%
After performing the above procedures, a newly soldered coverage shall be greater than 90%
T est Circuit
Output Waveform
T ape and Reel Dimensions
Package Characteristics
Package Hermetically sealed ceramic package and metal cover
HSM633 - 125.00 MHz
CLOCK
SERIES
CENTER
FREQUENCY