BGA Heat Sink
Model :
No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : http://www.malico.com.tw
Specification
Performance
CMBA023535
Series
CMBA023535 Series
For 35x35 Chip set
1.Material : Al 6063
2.Dimension :
Foot print : 35x35mm
Height : 12,15,18,21,23,28,33 mm
Base (thickness) : 2.6mm
3.Finish: Black Anodize
4.Chip set package thickness and clip color
3.3+/-0.25mm -Yellow clip
1.7+/-0.25mm -Blue clip
0.8+/-0.25mm -Orange clip
5.Accessory :
Clip : Plastic (UL94-V0)
Thermal pad : T710 or others
15x15Heat Source (LxW)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0100 200 300 400 500 600 700 800
Air Velocity (LFM)
Thermal resistance
Rca (oC/ W)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
Pressure drop (in-H2O)
H=25
H=20
H=12
H=25
