MAX6501, MAX6502
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3
PIN DESCRIPTION
MAX6501 MAX6502 Name Description
1,2 1,2 GND Ground. Ground both pins together close to the chip. Pin 2 provides the lowest thermal
resistance to the die.
3 3 HYST Hysteresis Input. Connect HYST to GND for +2°C hysteresis, or connect to VCC for +10°C
hysteresis.
4 4 VCC Supply Input (+2.7 V to +5.5 V). Recommend 100 pF or greater Coupling capacitor from VCC
to GND.
5 - TOVER Open-Drain, Active-Low Output. TOVER goes low when the die temperature exceeds the
factory-programmed temperature threshold. Connect to a 100 KΩ pull-up resistor. May be
pulled up to a voltage higher than VCC.
- 5 TOVER Push/Pull Active-High Output. TOVER goes high when the die temperature exceeds the
factory-programmed temperature threshold.
Typical Operating Circuit
GND
MAX6502
GND
VCC VCC
GND HYST
TOVER INT
µP
100 pF
+2.7 V to +5.5 V
DETAILED DESCRIPTION
The MAX6501 and MAX6502 integrate a temperature
sensor with a factory-programmed t hreshold s witch. A l ogic
signal i s a sserted w hen t he d ie t emperature c rosses t he f actory
programmed threshold. An external hysteresis input pin
allows the u ser t o s elect e ither 2°C or 10°C h ysteresis t o g ive
further flexibility to the design of the application. The
MAX6501 and MAX6502 are intended for a temperature
range from 45°C to 115°C in a 10°C increment. The
MAX6501 has an open drain output and the MAX6502 has
a push/pull output stage.
The MAX6501 is intended for applications with a
microprocessor reset input. The MAX6502 is intended for
applications of turning on a fan or heater element.
Hysteresis Input
To prevent the output from “chattering’’ at or near the trip
point temperature, a selectable HYST input pin is provided.
Hysteresis can be externally selected at 2°C (HYST = GND)
or 10 °C (HYST = VDD) by means of the CMOS compatible
HYST input pin. Do not let the HYST pin float as this could
cause increase supply current. The hysteresis does not
depend on the part’s programmed trip threshold.
Table 1. Factory-Programmed Threshold Range
Part Number Threshold (TTH) Range
MAX6501 +45°C TTH +115°C
MAX6502 +45°C TTH +115°C
Thermal Considerations
With a very low 17 µA supply current, the MAX6501 and
MAX6502 dissipates very little power. Thus, the die
temperature is basically the same as the package
temperature. To minimize the error in temperature readings,
the load current should be limited to a few milliamps. As an
example, the typical thermal resistance of a 5-Pin SOT-23A
package is 140°C/W. If the MAX6501 had to sink 1.0 mA,
and the output voltage is guaranteed to be less than 0.3 V,
then an additional 0.3 mW of power is dissipated within the
IC. This corresponds to a 0.042°C rise in die temperature in
the 5-Pin SOT-23A.