TLP118
1 2019-05-27
© 2019
Toshiba Electronic Devices & Storage Corporation
T OS HIBA PHOT OCOU PL ER IRED & PHOT O -IC
TLP118
PDP (Plasma Display Panel)
F A (Factory Automation)
Interfaces of measuring and control instruments
Operat e at hig h ambient tem perat ures up to 125°C
The Toshiba TLP118 consists of an infrared emitting diodes and
integrated high-gain, high-speed photodetectors.
The TLP118 is housed in the SO6 package. The output stage is
an open collector type.
The photodetector has an internal Faraday shield that provides
a guaranteed common-mode transient immunity of ±15 kV/μs.
Inverter logic type (Open collector output)
Package: SO6 pin
Guaranteed performance over: -40 to 125°C
Power supply voltage: 4.5 to 5.5 V
Input threshold current: IFH = 5.0 mA (max)
Propagation delay time tpHL/tpLH: 60 ns (max)
Common-mode transient immunity: ±15 kV/μs (min)
Isolation voltage: 3750 Vrms (min)
UL-recognized: UL 1577, File No.E67349
cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1 : When VDE approved ty pe is needed,
please designate the Option(V4).
Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
JEDEC
―
JEITA
―
TOSHIBA
11−4L1
Weight: 0.08 g (typ.)
Creepage distanc e 5.0 mm (min)
Clearance distance 5.0 mm (min)
Insulation thickness 0.4 mm (min)
1:ANODE
3:
CATHODE
4:GND
5
:VO (Output)
6:
VCC
V
CC
GND
SHIELD
1
3
4
5
6
Pin Conf iguration (Top Vie w)
Schematic
Constr uct io n Mec hanic a l Ratings
Start of commercial production
2009-10
6
3
－
1
＋
5
4
SHIELD
VCC
V
O
GND
I
CC
I
F
I
O
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Toshiba Electronic Devices & Storage Corporation
Absolute Maximum Ratings (Ta=25°C)
CHARACTERISTIC SYMBOL RATING UNIT
LED
Forward Current
IF
25
mA
Forward Current Derating (Ta ≥ 110°C)
ΔIF /°C
-0.67
mA/°C
Pulse Forward Current
(Note 1) I
FP
50 mA
Pulse Forward Current Derating (Ta ≥ 110°C)
ΔIFP /°C
-1.34
mA/°C
Input Power Dissipation
PD
40
mW
Input power Dissipation Derating (Ta > 85°C)
ΔPD/°C
-1.0
mW/°C
Reverse Voltage V
R
5 V
DETECTOR
Output Current 1 (Ta ≤ 125°C)
IO
25
mA
Output Voltage
VO
6
V
Supply Voltage
VCC
6
V
Output Power Dissipation P
O
80 mW
Output Power Dissipati on Derat i ng (Ta ≥ 110°C)
ΔPO /°C
-2.0
mW/°C
Operating Temperature Range
Topr
-40 to 125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Lead Soldering Temperature (10 s) T
sol
260 °C
Isolation Volt age (AC,60 s, R.H.≤ 60 %) (Note 2)
BVS
3750
Vrms
Note: Usi ng continuously u nder heavy load s (e.g. the appl ication of high t emperature/c urrent/v oltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the
operating co ndi tion s (i.e. oper at ing te mper at ure /current/volta ge, e tc.) are wit hin the ab sol ute maximum ra tings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling P recautions”/“D erating Con cept and M ethods”) and indiv idual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 1: Pulse width ≤ 1 ms, duty = 50 %.
Note 2: This d evice is regarded as a two terminal device: pins 1 and 3 are shorted together,
as are pins 4, 5 and 6.
Recommended Operating Conditions
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
Input Current , Hi gh Level
IFH
7.5
―
15
mA
Input Voltage , Low Level
VFL
0
―
0.8
V
Supply Voltage* V
CC
4.5
―
5.5 V
Operating Temperature T
opr
-40 ― 125 °C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Add itionally, each item is an independent guideline respect ively. In developing design s using this product,
please confirm specified characteristics shown in this document.
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Toshiba Electronic Devices & Storage Corporation
Electrical Characteristics
(Unless ot herwise specif ied , Ta=-40 to 125°C, VCC=4.5 to 5.5 V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT CONDITION MIN TYP. MAX UNIT
Input Forward Voltage
VF
―
IF = 10 mA , Ta = 25 °C
1.45
1.61
1.85
V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTa ― IF = 10 mA ― -1.6 ― mV/°C
Input Reverse Current I
R
―
V
R
= 5 V , Ta = 25 °C
―
―
10 μA
Capacitance between Input
terminals
CT ― V = 0 V, f = 1 MHz, Ta = 25 °C ― 60 ― pF
Logic High Output Current IOH 1
VF = 0. 8 V ,VO = 5.5 V
―
―
250
μA
Ta = 25 °C
―
0.5
10
Logic Low Output Volt age VOL 2 IF = 10 mA, IO = 13 mA (Sinking) ― 0.2 0.6 V
Logic Low Supply Current ICCL 3 IF = 10 mA ― 1.5 5 mA
Logic High Supply Current ICCH 4 IF = 0 mA ― 1.5 5 mA
“H Level Output to L Level
Output” Input Current
IFHL ― IO = 13 mA (Sinking), VO < 0.6 V ― 1.0 5.0 mA
*All typical val ues are at Ta=25°C, VCC=5 V unless otherwise specified
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Conditi on MIN TYP. MAX UNIT
Capacitanc e input to output C
S
V
S
= 0 V,f = 1 MHz (Note 1)
― 0.8 ― pF
Isolation resist ance R
S
R.H. ≤ 60 %, VS = 500 V (Note 1)
1×10
12
10
14
― Ω
Isolation voltage BVS AC,60 s 3750 ― ― Vrms
Note 1: This d evice is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6.
TLP118
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Switching Characteristics
(Unless otherwise specified, Ta=-40 to 125 °C､VCC=4.5 t o 5.5V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT
CONDITION MIN TYP. MAX UNIT
Propagation delay tim e (H→L) tpHL
5
IF =0→7.5
mA RL= 350 Ω
CL= 15 pF
(Note 1)
― 30 60 ns
Propagation delay tim e (L→H)
tpLH
IF = 7.5→0 mA
―
30
60
ns
Switching Time Dispersion
between ON and OFF |tpHL-
tpLH|
IF = 0↔7.5 mA
RL = 350 Ω,
CL = 15 pF
(Note 1)
― ― 30 ns
Propagation Delay Skew (Note 2)
tpsk
-40
―
40
ns
Fall Time (90 – 10 %) tf IF = 0→7.5 mA
RL = 350 Ω
CL = 15 pF
(Note 1)
― 30 ― ns
Rise Time (10 – 90 %) tr IF =7.5→0 mA ― 30 ― ns
Common Mode transient
Immunity at High Level Output
CMH
6
VCM = 1000 Vp-p , IF = 0 mA,
VCC = 5 V , Ta = 25° C 15 ― ― kV/μs
Common Mode transient
Immunity at Low Level Output CML VCM = 1000 Vp-p , IF = 10 mA,
VCC = 5 V , Ta = 25 °C -15 ― ― kV/μs
*All typi cal values are at Ta = 25 °C
Note : A ceramic capacitor (0.1 μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation
of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns,
CL is approximately 15pF which includes probe and Jig/stray wiring capacitance.
Note 2: Propagation delay skew is defined as the difference between the largest and smallest propagation delay
times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical
test conditions (supply voltage, input current, temperature, etc).
TEST CI RCUIT 1: I OH Test Circuit TEST CIRCUIT 2: VOL Test Circuit
TEST CI RCUIT 3: I CCL Test Circuit TEST CIRCUIT 4: ICCH Test Circuit
IF
A
VCC
0.1 μF
I
CCL
0.1μF
VOL VCC
V
IO
↑
SHIELD
IF
SHIELD
A
VCC
0.1 μF
I
CCH
SHIELD
0.1μF
SHIELD
VF
VCC
IOH
A
VO
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Toshiba Electronic Devices & Storage Corporation
TEST CIRCUIT 5: Switching Time Test Circuit
TEST CIR CUI T 6: Common-Mode Transient Immunity Test Circuit
V
O
V
OL
t
pLH
t
pHL
1.5 V
50%
tf tr
90%
10%
IF
0.1μF
RIN=100Ω
*CL=15pF *CL=15pF
RL=350Ω
IF=7.5mA(P.G)
(f=5MHz , duty=50%, tr=tf= Less than 5ns)
IF monitor
VO
P.G.
SHIELD
VCM
10%
90% 1000 V
・SW B : I
F
=0 mA
・SW A : IF=10 mA 0.8 V
2V
VO
tr
tf
CML
CMH
＋
－
SW
B
VCC
VCM
VO
0.1
μ
F
IF
A
RL=350Ω
→
*C
L:
includes probe and stray capacitance.
P.G.: Pulse generator
VCC
)( )(800 s
tr
V
H
CM
µ
=
)( )(800 s
tf
V
L
CM
µ
=
SHIELD
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Toshiba Electronic Devices & Storage Corporation
I
F
- V
F
∆V
F/
∆ Ta- I
F
Forward Current
IF (mA)
Temperature Coefficient
of Forward V oltage
∆VF/ ∆Ta (mV/˚C)
Forward Voltage VF (V)
Forward Current IF (mA)
VO- I F
IFHL-Ta
Output Voltage VO (V)
“
H Level Output to L Level Output” Input Current
IFHL (mA)
Forward Current I
F
(mA)
Ambient Temperature Ta (°C)
I
CCL
-Ta
I
CCH
-Ta
Logic Low Supply Current
ICCL (mA)
Logic High Supply Current
ICCH (mA)
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
1
10
100
11.2 1.4 1.6 1.8 22.2
-3
-2.5
-2
-1.5
-10.1 110 100
VCC=5V
IO=13mA
125˚C
25˚C
-40˚C
RL=350Ω
4k
Ω
VCC=5V
IF=10mA
VCC=5V
IF=0mA
NOTE: The above charact eristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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Toshiba Electronic Devices & Storage Corporation
V
OL
- Ta
t
pHL
/ t
pLH
- Ta
Low Level Output Voltag
e VOL (V)
Propagation Delay Time
tpHL / tpLH (ns)
Ambient Temperature Ta (˚C)
Ambient Temperature Ta (˚C)
VCC=5V
IF=10mA
IO=13mA(Sinking)
VCC=5V
RL=350Ω
IF=7.5mA
tpHL
tpLH
NOTE: The above charact eristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
TLP118
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Toshiba Electronic Devices & Storage Corporation
Solder ing and Storage
(1) Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below,
irrespective of whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used
The soldering temperature profile is based on the package surface temperature
(See the figure shown above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120
seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3
seconds not exceeding 350 °C
Heating by solder ing iron mu st be done only once per lead
TLP118
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Toshiba Electronic Devices & Storage Corporation
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 °C to 35 °C,
and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded .
6) When repacking devices, use anti-static contain er s.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
TLP118
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Toshiba Electronic Devices & Storage Corporation
Specification for Embossed–Tape Packing (TPL)(T PR) for SO 6 Coupler
1. Applicable Package
Package Product T y pe
SO6 Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP118 (TPL, E
[[G]]/RoHS COMPATIBLE (Note 1)
Tape-type
Device-name
Note 1: Please contact your Toshiba sales representative for details on environmental information such as
the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament
and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
3. Tape Dimensi ons
3.1 Specification Classification Are as Shown in Table 1
Table 1 Tape Type Classification
Tape type Classification Quantity
(pcs / reel)
TPL L direction 3000
TPR R direction 3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
Direction of Tape
L direction R direc t i on
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Toshiba Electronic Devices & Storage Corporation
3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2 Empty Device Recesses
Standard Remarks
Occurrenc es of 2 or more
successi ve empty device
recesses 0 device Within any given 40-mm section of
tape, not including l eader and trailer
Single empty devic e
recesses 6 devic es (max) per reel Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise s pecified: ±0.1
Symbol Dimension Remark
A 4.0 ―
B 7.6 ―
D 5.5 Center line of indented square hole and sprocket hole
E 1.75 Dist ance bet ween tape edge and hole center
F 8.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumul ative error (max) per 10 feed holes
K0 2.6 Internal space
+0.1
-0.3
+0.1
-0.3
0.3 ± 0.05
2.95 ± 0.2
K0
G
F
φ1.6 ± 0.1
A
E
D
B
12.0 ± 0.3
φ
1.5
+0.1
−0
Unit: mm
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Toshiba Electronic Devices & Storage Corporation
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
Figure 3 Reel Form
Table 4 Reel Dimensions
Unit: mm
Symbol Dimension
A Φ330 ±2
B Φ80 ±1
C Φ13 ±0.5
E 2.0 ±0.5
U 4.0 ±0.5
W1 13.5 ±0.5
W2 17.5 ±1.0
4. Packing
Packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard,
the quantity, the lot number and the Toshiba company name.
E
W1
W2
A
B
C
U
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Toshiba Electronic Devices & Storage Corporation
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
Note 1: Please contact your Toshiba sales representative for details on environmental information such as
the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament
and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
TLP118 (TPL,E 3000 pcs
Device name
Tape type
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE (Note 1)
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RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collecti vely ref erred t o as “TOSHIBA”.
Hardware, soft ware and systems described in this document are collec t i vel y referred to as “Product ”.
• TOSHIBA reserves the right to make changes to the informati on in this document and related Product without notic e.
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TOSHIBA's written permission, reproduct i on is permiss i bl e only if reproduction is without alteration/omission.
• Though TOSHIB A works conti nually to improve Product 's qual ity and reliabil i t y, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for thei r hardware, s oftware and
systems which minimi ze risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before c ust om ers use the Product, create designs including t he
Product, or incorporat e the Product into thei r own applicati ons, c ust om ers must also refer to and comply with (a) the latest versi ons of
all relevant TOSHIBA i nformation, including without limit ation, this document, the specifications, the data sheets and applic ation notes
for Product and the precautions and conditions set forth in the "TOSHIB A Semic onduct or Reliabi l ity Handbook" and (b) the
instruct i ons for the applicati on with which the Product will be used with or for. Customers are solely responsibl e for all aspects of their
own product design or applications, includi ng but not limit ed to (a) determini ng the appropriateness of the use of this Product in suc h
design or applications; (b) evaluat ing and determ i ni ng the applic abi lity of any information contained in this document, or in charts,
diagrams, programs, al gorithms , sample application circuits, or any other referenc ed docum ents; and (c) validati ng al l operating
parameters for such designs and applications. TOSHIB A ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESI G N OR
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• PRODUCT IS NEI THE R INTENDE D NO R WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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MAY CAUSE LOSS OF HUM AN LIFE, BODILY I NJURY, SE RIOUS PROPERTY DAMAGE AND/OR S ERIOUS PUBLIC IMPACT
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limitati on, equipm ent used in nuclear fac ili t i es, equipm ent used in the aerospace industry, lifesaving and/or lif e supporti ng medical
equipment, equipm ent us ed for automobil es, trai ns, shi ps and other transportati on, t raffic signali ng equipment, equipment us ed to
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except in complianc e with all applicable export laws and regulati ons.
• Please contact your TOSHIBA s ales representative for details as to environmental matters such as the RoHS compatibility of
Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of control led
substances, includi ng without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIA NCE WITH APPLICABLE LAWS AND REG ULATIONS.
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