1
®
FN8126.2
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X5043, X5045
4K, 512 x 8 Bit
CPU Supervisor with 4K SPI EEPROM
These devices combine four popular functions, Power-on
Reset Control, Watchdog Timer, Supply Voltage Supervision,
and Block Lock Protect Serial EEPROM Memory in one
package. This combination lowers system cost, reduces
board space requirements, and increases reliability.
Applying power to the device activates the power-on reset
circuit which holds RESET/RESET active for a period of
time. This allows the power supply and oscillator to stabilize
before the processor executes code.
The Watchdog Timer provides an independent protection
mechanism for microcontrollers. When the microcontroller
fails to restart a timer within a selectable time out interval,
the device activates the RESET/RESET signal. The user
selects the interval from three preset values. Once selected,
the interval does not change, even after cycling the power.
The device’s low VCC detection circuitry protects the user’s
system from low voltage conditions, resetting the system
when VCC falls below the minimum VCC trip point.
RESET/RESET is asserted until VCC returns to proper
operating level and stabilizes. Four industry standard VTRIP
thresholds are available, however, Intersil’s unique circuits
allow the threshold to be reprogrammed to meet custom
requirements or to fine-tune the threshold for applications
requiring higher precision.
The memory portion of the device is a CMOS Serial
EEPROM array with Intersil’s block lock protection. The
array is internally organized as 512 x 8. The device features
a Serial Peripheral Interface (SPI) and software protocol
allowing operation on a simple four-wire bus.
The device utilizes Intersil’s proprietary Direct Write™ cell,
providing a minimum endurance of 100,000 cycles and a
minimum data retention of 100 years.
Features
•Low V
CC Detection and Reset Assertion
- Four standard reset threshold voltages
4.63V, 4.38V, 2.93V, 2.63V
- Re-program low VCC reset threshold voltage using
special programming sequence.
- Reset signal valid to VCC = 1V
• Selectable Time Out Watchdog Timer
• Long Battery Life with Low Power Consumption
- <50µA max standby current, watchdog on
- <10µA max standby current, watchdog off
• 4Kbits of EEPROM–1M Write Cycle Endurance
• Save Critical Data with Block Lock™ Memory
- Protect 1/4, 1/2, all or none of EEPROM array
• Built-in Inadvertent Write Protection
- Write enable latch
- Write protect pin
• SPI Interface - 3.3MHz Clock Rate
• Minimize Programming Time
- 16-byte page write mode
- 5ms write cycle time (typical)
• Available Packages
- 8 Ld MSOP, 8 Ld SOIC, 8 Ld PDIP
- 14 Ld TSSOP
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Communications Equipment
- Routers, Hubs, Switches
- Set Top Boxes
• Industrial Systems
- Process Control
- Intelligent Instrumentation
• Computer Systems
- Desktop Computers
- Network Servers
• Battery Powered Equipment
Data Sheet March 16, 2006
2FN8126.2
March 16, 2006
Typical Application
Block Diagram
uC
RESET
CS
SCK
SI
SO
WP
VCC
VSS
RESET
SPI
VCC
VSS
X5043
2.7-5.0V
10K
Watchdog
Timer
Command
Decode &
Control
Logic
SI
SO
SCK
CS/WDI
VCC POR and Low
Generation
VTRIP
+
-
RESET (X5043)
Voltage Reset
Protect Logic 4Kbits
EEPROM
Watchdog
Detector
WP
Array
Status
Register
Transition Reset
Reset & Watchdog
Timebase
RESET (X5045)
X5043, X5045
STANDARD VTRIP LEVEL SUFFIX
4.63V (+/-2.5%) -4.5A
4.38V (+/-2.5%) -4.5
2.93V (+/-2.5%) -2.7A
2.63V (+/-2.5%) -2.7
See “Ordering Information” on page 3. for
more details
For Custom Settings, call Intersil.
X5043, X5045
3FN8126.2
March 16, 2006
Ordering Information
PART NUMBER
RESET
(ACTIVE LOW)
PART
MARKING
PART NUMBER
RESET
(ACTIVE HIGH)
PART
MARKING
VCC
RANGE
VTRIP
RANGE
TEMP
RANGE
(°C) PACKAGE
X5043P-4.5A X5043P AL X5045P-4.5A X5045P AL 4.5-5.5V 4.5-4.75 0 to 70 8 Ld PDIP
X5043PZ-4.5A (Note) X5043P Z AL X5045PZ-4.5A (Note) X5045P Z AL 0 to 70 8 Ld PDIP (Pb-free)
X5043PI-4.5A X5043P AM X5045PI-4.5A X5045P AM -40 to 85 8 Ld PDIP
X5043PIZ-4.5A (Note) X5043P Z AM X5045PIZ-4.5A (Note) X5045P Z AM -40 to 85 8 Ld PDIP (Pb-free)
X5043S8-4.5A X5043 AL X5045S8-4.5A X5045 AL 0 to 70 8 Ld SOIC
X5043S8Z-4.5A (Note) X5043 Z AL X5045S8Z-4.5A
(Note)
X5045 Z AL 0 to 70 8 Ld SOIC (Pb-free)
X5043S8I-4.5A* X5043 AM X5045S8I-4.5A* X5045 AM -40 to 85 8 Ld SOIC
X5043S8IZ-4.5A*
(Note)
X5043 Z AM X5045S8IZ-4.5A*
(Note)
X5045 Z AM -40 to 85 8 Ld SOIC (Pb-free)
X5043M8-4.5A AEM X5045M8-4.5A AEV 0 to 70 8 Ld MSOP
X5043M8Z-4.5A
(Note)
DBS X5045M8Z-4.5A
(Note)
DCB 0 to 70 8 Ld MSOP (Pb-free)
X5043M8I-4.5A AEN X5045M8I-4.5A AEW -40 to 85 8 Ld MSOP
X5043M8IZ-4.5A
(Note)
DBM X5045M8IZ-4.5A
(Note)
DBX -40 to 85 8 Ld MSOP (Pb-free)
X5043V14I-4.5A X5043V AM X5045V14I-4.5A X5045V AM -40 to 85 14 Ld TSSOP
X5043V14IZ-4.5A
(Note)
X5043V Z AM X5045V14IZ-4.5A
(Note)
X5045V Z AM -40 to 85 14 Ld TSSOP
(Pb-free)
X5043P X5043P X5045P X5045P 4.25-4.5 0 to 70 8 Ld PDIP
X5043PZ (Note) X5043P Z X5045PZ (Note) X5045P Z 0 to 70 8 Ld PDIP (Pb-free)
X5043PI X5043P I X5045PI X5045P I -40 to 85 8 Ld PDIP
X5043PIZ (Note) X5043P Z I X5045PIZ (Note) X5045P Z I -40 to 85 8 Ld PDIP (Pb-free)
X5043S8* X5043 X5045S8* X5045 0 to 70 8 Ld SOIC
X5043S8Z* (Note) X5043 Z X5045S8Z* (Note) X5045 Z 0 to 70 8 Ld SOIC (Pb-free)
X5043S8I* X5043 I X5045S8I* X5045 I -40 to 85 8 Ld SOIC
X5043S8IZ* (Note) X5043 Z I X5045S8IZ* (Note) X5045 Z I -40 to 85 8 Ld SOIC (Pb-free)
X5043M8 AEO X5045M8 AEX 0 to 70 8 Ld MSOP
X5043M8Z (Note) DBN X5045M8Z (Note) DBY 0 to 70 8 Ld MSOP (Pb-free)
X5043M8I AEP X5045M8I AEY -40 to 85 8 Ld MSOP
X5043M8IZ (Note) DBJ X5045M8IZ (Note) DBT -40 to 85 8 Ld MSOP (Pb-free)
X5043V14I X5043V I X5045V14I X5045V I -40 to 85 14 Ld TSSOP
X5043V14IZ (Note) X5043V Z I X5045V14IZ (Note) X5045V Z I -40 to 85 14 Ld TSSOP
(Pb-free)
X5043, X5045
4FN8126.2
March 16, 2006
X5043P-2.7A X5043P AN X5045P-2.7A X5045P AN 2.7-5.5V 2.85-3.0 0 to 70 8 Ld PDIP
X5043PZ-2.7A (Note) X5043P Z AN X5045PZ-2.7A (Note) X5045P Z AN 0 to 70 8 Ld PDIP (Pb-free)
X5043PI-2.7A X5043P AP X5045PI-2.7A X5045P AP -40 to 85 8 Ld PDIP
X5043PIZ-2.7A (Note) X5043P Z AP X5045PIZ-2.7A (Note) X5045P Z AP -40 to 85 8 Ld PDIP (Pb-free)
X5043S8-2.7A* X5043 AN X5045S8-2.7A X5045 AN 0 to 70 8 Ld SOIC
X5043S8Z-2.7A*
(Note)
X5043 Z AN X5045S8Z-2.7A
(Note)
X5045 Z AN 0 to 70 8 Ld SOIC (Pb-free)
X5043S8I-2.7A* X5043 AP X5045S8I-2.7A X5045 AP -40 to 85 8 Ld SOIC
X5043S8IZ-2.7A*
(Note)
X5043 Z AP X5045S8IZ-2.7A
(Note)
X5045 Z AP -40 to 85 8 Ld SOIC
(Pb-free)
X5043M8-2.7A* AEQ X5045M8-2.7A AEZ 0 to 70 8 Ld MSOP
X5043M8Z-2.7A
(Note)
DBR X5045M8Z-2.7A
(Note)
DCA 0 to 70 8 Ld MSOP (Pb-free)
X5043M8I-2.7A* AER X5045M8I-2.7A AFA -40 to 85 8 Ld MSOP
X5043M8IZ-2.7A*
(Note)
DBL X5045M8IZ-2.7A
(Note)
DBW -40 to 85 8 Ld MSOP (Pb-free)
X5043V14I-2.7A X5043V AP X5045V14I-2.7A X5045V AP -40 to 85 14 Ld TSSOP
X5043V14IZ-2.7A
(Note)
X5043V Z AP X5045V14IZ-2.7A
(Note)
X5045V Z AP -40 to 85 14 Ld TSSOP
(Pb-free)
X5043P-2.7 X5043P F X5045P-2.7 X5045P F 2.55-2.7 0 to 70 8 Ld PDIP
X5043PZ-2.7 (Note) X5043P Z F X5045PZ-2.7 (Note) X5045P Z F 0 to 70 8 Ld PDIP (Pb-free)
X5043PI-2.7 X5043P G X5045PI-2.7 X5045P G -40 to 85 8 Ld PDIP
X5043PIZ-2.7 (Note) X5043P Z G X5045PIZ-2.7 (Note) X5045P Z G -40 to 85 8 Ld PDIP (Pb-free)
X5043S8-2.7* X5043 F X5045S8-2.7* X5045 F 0 to 70 8 Ld SOIC
X5043S8Z-2.7* (Note) X5043 Z F X5045S8Z-2.7* (Note) X5045 Z F 0 to 70 8 Ld SOIC (Pb-free)
X5043S8I-2.7* X5043 G X5045S8I-2.7* X5045 G -40 to 85 8 Ld SOIC
X5043S8IZ-2.7* (Note) X5043 Z G X5045S8IZ-2.7*
(Note)
X5045 Z G -40 to 85 8 Ld SOIC (Pb-free)
X5043M8-2.7 AES X5045M8-2.7 AFB 0 to 70 8 Ld MSOP
X5043M8Z-2.7 (Note) DBP X5045M8Z-2.7 (Note) DBZ 0 to 70 8 Ld MSOP (Pb-free)
X5043M8I-2.7* AET X5045M8I-2.7 AFC -40 to 85 8 Ld MSOP
X5043M8IZ-2.7*
(Note)
DBK X5045M8IZ-2.7 (Note) DBU -40 to 85 8 Ld MSOP (Pb-free)
X5043V14I-2.7 X5043V G X5045V14I-2.7 X5045V G -40 to 85 14 Ld TSSOP
X5043V14IZ-2.7
(Note)
X5043V Z G X5045V14IZ-2.7
(Note)
X5045V Z G -40 to 85 14 Ld TSSOP
(Pb-free)
*Add "-T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Ordering Information (Continued)
PART NUMBER
RESET
(ACTIVE LOW)
PART
MARKING
PART NUMBER
RESET
(ACTIVE HIGH)
PART
MARKING
VCC
RANGE
VTRIP
RANGE
TEMP
RANGE
(°C) PACKAGE
X5043, X5045
5FN8126.2
March 16, 2006
Pin Configuration
Pin Descriptions
Serial Output (SO)
SO is a push/pull serial data output pin. During a read cycle,
data is shifted out on this pin. Data is clocked out by the
falling edge of the serial clock.
Serial Input (SI)
SI is the serial data input pin. All opcodes, byte addresses,
and data to be written to the memory are input on this pin.
Data is latched by the rising edge of the serial clock.
Serial Clock (SCK)
The Serial Clock controls the serial bus timing for data input
and output. Opcodes, addresses, or data present on the SI
pin is latched on the rising edge of the clock input, while data
on the SO pin changes after the falling edge of the clock
input.
Chip Select (CS/WDI)
When CS is high, the X5043, X5045 are deselected and the
SO output pin is at high impedance and, unless an internal
write operation is underway, the X5043, X5045 will be in the
standby power mode. CS low enables the X5043, X5045,
placing it in the active power mode. It should be noted that
after power-up, a high to low transition on CS is required prior
to the start of any operation.
Write Protect (WP)
When WP is low, nonvolatile writes to the X5043, X5045 are
disabled, but the part otherwise functions normally. When
WP is held high, all functions, including non volatile writes
operate normally. WP going low while CS is still low will
interrupt a write to the X5043, X5045. If the internal write
cycle has already been initiated, WP going low will have no
affect on a write.
Reset (RESET, RESET)
X5043, X5045, RESET/RESET is an active low/HIGH, open
drain output which goes active whenever VCC falls below the
minimum VCC sense level. It will remain active until VCC
rises above the minimum VCC sense level for 200ms.
RESET/RESET also goes active if the Watchdog timer is
enabled and CS remains either high or low longer than the
Watchdog time out period. A falling edge of CS will reset the
watchdog timer.
Principles of Operation
Power-on Reset
Application of power to the X5043, X5045 activate a Power-
on Reset Circuit. This circuit pulls the RESET/RESET pin
active. RESET/RESET prevents the system microprocessor
from starting to operate with insufficient voltage or prior to
stabilization of the oscillator. When VCC exceeds the device
VTRIP value for 200ms (nominal) the circuit releases
RESET/RESET, allowing the processor to begin executing
code.
Low Voltage Monitoring
During operation, the X5043, X5045 monitor the VCC level
and asserts RESET/RESET if supply voltage falls below a
preset minimum VTRIP
. The RESET/RESET signal prevents
the microprocessor from operating in a power fail or
brownout condition. The RESET/RESET signal remains
active until the voltage drops below 1V. It also remains active
until VCC returns and exceeds VTRIP for 200ms.
Watchdog Timer
The Watchdog Timer circuit monitors the microprocessor
activity by monitoring the WDI input. The microprocessor
must toggle the CS/WDI pin periodically to prevent an active
RESET/RESET signal. The CS/WDI pin must be toggled
from HIGH to LOW prior to the expiration of the watchdog
time out period. The state of two nonvolatile control bits in
the Status Register determines the watchdog timer period.
The microprocessor can change these watchdog bits. With
8 Ld SOIC/PDIP/MSOP
CS/WDI
WP
SO
1
2
3
4
RESET/RESET
8
7
6
5
VCC
X5043, X5045
VSS
SCK
SI
14 Ld TSSOP
CS
NC
SO
1
2
3
4
RESET/RESET
14
13
12
11
VCC
X5043, X5045
NC
NC
NC
WP
NC 5
6
7
VSS
NC
10
9
8
SCK
SI
Pin Names
SYMBOL DESCRIPTION
CS/WDI Chip Select Input
SO Serial Output
SI Serial Input
SCK Serial Clock Input
WP Write Protect Input
VSS Ground
VCC Supply Voltage
RESET/RESET Reset Output
X5043, X5045
6FN8126.2
March 16, 2006
no microprocessor action, the watchdog timer control bits
remain unchanged, even during total power failure.
VCC Threshold Reset Procedure
The X5043, X5045 are shipped with a standard VCC
threshold (VTRIP) voltage. This value will not change over
normal operating and storage conditions. However, in
applications where the standard VTRIP is not exactly right, or
if higher precision is needed in the VTRIP value, the X5043,
X5045 threshold may be adjusted. The procedure is
described below, and uses the application of a high voltage
control signal.
Setting the VTRIP Voltage
This procedure is used to set the VTRIP to a higher voltage
value. For example, if the current VTRIP is 4.4V and the new
VTRIP is 4.6V, this procedure will directly make the change. If
the new setting is to be lower than the current setting, then it
is necessary to reset the trip point before setting the new
value.
To set the new VTRIP voltage, apply the desired VTRIP
threshold voltage to the VCC pin and tie the WP pin to the
programming voltage VP
. Then send a WREN command,
followed by a write of Data 00h to address 01h. CS going
HIGH on the write operation initiates the VTRIP programming
sequence. Bring WP LOW to complete the operation.
Note: This operation also writes 00h to array address 01h.
Resetting the VTRIP Voltage
This procedure is used to set the VTRIP to a “native” voltage
level. For example, if the current VTRIP is 4.4V and the new
VTRIP must be 4.0V, then the VTRIP must be reset. When
VTRIP is reset, the new VTRIP is something less than 1.7V.
This procedure must be used to set the voltage to a lower
value.
To reset the VTRIP voltage, apply at least 3V to the VCC pin
and tie the WP pin to the programming voltage VP
. Then
send a WREN command, followed by a write of Data 00h to
address 03h. CS going HIGH on the write operation initiates
the VTRIP programming sequence. Bring WP LOW to
complete the operation.
Note: This operation also writes 00h to array address 03h.
01234567
SCK
SI
CS
06h
012345678910 12 1314 15
8 Bits
01h
02h
WP VP = 15-18V
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
12 FN8126.2
March 16, 2006
Operational Notes
The device powers-up in the following state:
1. The device is in the low power standby state.
2. A HIGH to LOW transition on CS is required to enter an
active state and receive an instruction.
3. SO pin is high impedance.
4. The Write Enable Latch is reset.
5. The Flag Bit is reset.
6. Reset Signal is active for tPURST
.
Data Protection
The following circuitry has been included to prevent
inadvertent writes:
• A WREN instruction must be issued to set the Write
Enable Latch.
•CS
must come HIGH at the proper clock count in order to
start a nonvolatile write cycle.
• Block Protect bits provide additional level of write
protection for the memory array.
•The WP
pin LOW blocks nonvolatile write operations.
24 25 26 27 28 29 30 31
SCK
SI
CS
012345678910
SCK
SI Instruction 8 Bit Address Data Byte 1
76543210
CS
32 33 34 35 36 37 38 39
Data Byte 2
76543210 Data Byte 3
76543210 Data Byte N
765 3210
12 13 14 15 16 17 18 19 20 21 22 23
6543210
9th Bit of Address
8
FIGURE 9. WRITE MEMORY SEQUENCE
X5043, X5045
13 FN8126.2
March 16, 2006
NOTES:
1. VIL min. and VIH max. are for reference only and are not tested.
2. This parameter is periodically sampled and not 100% tested.
3. SCK frequency measured from VCC x 0.1/VCC x 0.9
Absolute Maximum Ratings Recommended Operating Conditions
Temperature under bias . . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on any pin with
respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +7V
D.C. output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . 300°C
Temperature:
Commercial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage:
-2.7, -2.7A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Blank, -4.5A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
CAUTION: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional
operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC Electrical Specifications (Over the recommended operating conditions unless otherwise specified.)
SYMBOL PARAMETER TEST CONDITIONS/COMMENTS
LIMITS
UNITMIN TYP(2) MAX
ICC1 VCC Write Current (Active) SCK = 3.3MHz(3); SO, RESET, RESET = Open 3 mA
ICC2 VCC Read Current (Active) SCK = 3.3MHz(3); SI = VSS, RESET, RESET =
Open
2mA
ISB1 VCC Standby Current WDT = OFF CS = VCC, SCK, SI = VSS, VCC =5.5V 10 µA
ISB2 VCC Standby Current WDT = ON CS = VCC, SCK, SI = VSS, VCC =5.5V 50 µA
ILI Input Leakage Current SCK, SI, WP = VSS to VCC 0.1 10 µA
ILO Output Leakage Current SO, RESET, RESET = VSS to VCC 0.1 10 µA
VIL(1) Input LOW Voltage SCK, SI, WP, CS -0.5 VCC x 0.3 V
VIH(1) Input HIGH Voltage SCK, SI, WP, CS VCC x 0.7 VCC + 0.5 V
VOL Output LOW Voltage (SO) IOL = 2mA @ VCC = 2.7V
IOL = 0.5mA @ VCC = 1.8V
0.4 V
VOH1 Output HIGH Voltage (SO) VCC > 3.3V, IOH = –1.0mA VCC - 0.8 V
VOH2 Output HIGH Voltage (SO) 2V < VCC ≤ 3.3V, IOH = –0.4mA VCC - 0.4 V
VOH3 Output HIGH Voltage (SO) VCC ≤ 2V, IOH = –0.25mA VCC - 0.2 V
VOLRS Output LOW Voltage (RESET,
RESET)
IOL = 1mA 0.4 V
Capacitance TA = +25°C, f = 1MHz, VCC = 5V
SYMBOL TEST CONDITIONS MAX UNIT
COUT(2) Output Capacitance (SO, RESET, RESET) VOUT = 0V 8 pF
CIN(2) Input Capacitance (SCK, SI, CS, WP)V
IN = 0V 6 pF
X5043, X5045
14 FN8126.2
March 16, 2006
Equivalent A.C. Load Circuit at 5V VCC
NOTES:
4. This parameter is periodically sampled and not 100% tested.
5. tWC is the time from the rising edge of CS after a valid write sequence has been sent to the end of the self-timed internal nonvolatile write cycle.
5V
Output
30pF
5V
4.6kΩ
RESET/RESET
30pF
1.64kΩ
1.64kΩ
A.C. Test Conditions
Input pulse levels VCC x 0.1 to VCC x 0.9
Input rise and fall times 10ns
Input and output timing level VCC x 0.5
AC Electrical Specifications (Over recommended operating conditions, unless otherwise specified)
SYMBOL PARAMETER
2.7V–5.5V
UNITMIN MAX
DATA INPUT TIMING
fSCK Clock Frequency 0 3.3 MHz
tCYC Cycle Time 300 ns
tLEAD CS Lead Time 150 ns
tLAG CS Lag Time 150 ns
tWH Clock HIGH Time 130 ns
tWL Clock LOW Time 130 ns
tSU Data Setup Time 30 ns
tHData Hold Time 30 ns
tRI(4) Input Rise Time 2µs
tFI(4) Input Fall Time 2µs
tCS CS Deselect Time 100 ns
tWC(5) Write Cycle Time 10 ms
Data Output Timing
SYMBOL PARAMETER
2.7–5.5V
UNIT MIN MAX
fSCK Clock Frequency 0 3.3 MHz
tDIS Output Disable Time 150 ns
tVOutput Valid from Clock Low 120 ns
tHO Output Hold Time 0 ns
tRO(4) Output Rise Time 50 ns
tFO(4) Output Fall Time 50 ns
X5043, X5045
15 FN8126.2
March 16, 2006
Serial Output Timing
Serial Input Timing
Symbol Table
SCK
CS
SO
SI
MSB Out MSB–1 Out LSB Out
ADDR
LSB IN
tCYC
tVtHO tWL
tWH
tDIS
tLAG
SCK
CS
SI
SO
MSB In
tSU tRI
tLAG
tLEAD
tH
LSB In
tCS
tFI
High Impedance
WAVEFORM INPUTS OUTPUTS
Must be
steady Will be
steady
May change
from LOW
to HIGH
Will change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from HIGH
to LOW
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
N/A Center Line
is High
Impedance
X5043, X5045
16 FN8126.2
March 16, 2006
Power-Up and Power-Down Timing
NOTE:
6. This parameter is periodically sampled and not 100% tested.
CS/WDI vs. RESET/RESET Timing
VCC
tPURST tF
tRPD
RESET (X5043)
0 Volts
VTRIP
RESET (X5045)
VTRIP tPURST
tR
RESET Output Timing
SYMBOL PARAMETER MIN TYP MAX UNIT
VTRIP Reset Trip Point Voltage, (-4.5A)
Reset Trip Point Voltage, (Blank)
Reset Trip Point Voltage, (-2.7A)
Reset Trip Point Voltage, (-2.7)
4.5
4.25
2.85
2.55
4.62
4.38
2.92
2.62
4.75
4.5
3.0
2.7
V
tPURST Power-up Reset Time Out 100 200 400 ms
tRPD(6) VCC Detect to Reset/Output 500 ns
tF(6) VCC Fall Time 10 µs
tR(6) VCC Rise Time 0.1 ns
VRVALID Reset Valid VCC 1V
CS/WDI
tCST
RESET
RESET
tWDO tRST
tWDO tRST
(5043)
(5045)
RESET/RESET Output Timing
SYMBOL PARAMETER MIN TYP MAX UNIT
tWDO Watchdog Time Out Period,
WD1 = 1, WD0 = 1 (default)
WD1 = 1, WD0 = 0
WD1 = 0, WD0 = 1
WD1 = 0, WD0 = 0
100
450
1
OFF
200
600
1.4
300
800
2
ms
ms
sec
tCST CS Pulse Width to Reset the Watchdog 400 ns
tRST Reset Time Out 100 200 400 ms
X5043, X5045
17 FN8126.2
March 16, 2006
VTRIP Programming Timing Diagram
SCK
SI
CS
01h or
VCC
(VTRIP)
WP
tTSU tTHD
tVPH
tVPS
VP
VTRIP
tRP
tVPO
tPCS
02h 06h 03h
VTRIP Programming Parameters
PARAMETER DESCRIPTION MIN MAX UNIT
tVPS VTRIP Program Enable Voltage Setup time 1 µs
tVPH VTRIP Program Enable Voltage Hold time 1 µs
tPCS VTRIP Programming CS inactive time 1 µs
tTSU VTRIP Setup time 1µs
tTHD VTRIP Hold (stable) time 10 ms
tWC VTRIP Write Cycle Time 10 ms
tVPO VTRIP Program Enable Voltage Off time (Between successive adjustments) 0 µs
tRP VTRIP Program Recovery Period (Between successive adjustments) 10 ms
VPProgramming Voltage 15 18 V
VTRAN VTRIP Programmed Voltage Range 1.7 4.75 V
Vtv VTRIP Program variation after programming (0-75°C). (Programmed at 25°C.) -25 +25 mV
VTRIP programming parameters are periodically sampled and are not 100% tested.
X5043, X5045
18 FN8126.2
March 16, 2006
Packaging Information
0.118 ± 0.002
(3.00 ± 0.05)
0.040 ± 0.002
(1.02 ± 0.05)
0.150 (3.81)
Ref.
0.193 (4.90)
0.030 (0.76)
0.036 (0.91)
0.032 (0.81)
0.007 (0.18)
0.005 (0.13)
0.008 (0.20)
0.004 (0.10)
0.0216 (0.55)
7° Typ.
R 0.014 (0.36)
0.118 ± 0.002
(3.00 ± 0.05)
0.012 + 0.006 / -0.002
(0.30 + 0.15 / -0.05) 0.0256 (0.65) Typ.
8-Lead Miniature Small Outline Gull Wing Package Type M
NOTE:
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
0.220"
0.0256" Typical
0.025"
Typical
0.020"
Typical
8 PlacesFOOTPRINT
Ref.
X5043, X5045
19 FN8126.2
March 16, 2006
Packaging Information
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
0.020 (0.51)
0.016 (0.41)
0.150 (3.81)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
0.430 (10.92)
0.360 (9.14)
0.300
(7.62) Ref.
Pin 1 Index
0.145 (3.68)
0.128 (3.25)
0.025 (0.64)
0.015 (0.38)
Pin 1
Seating
0.065 (1.65)
0.045 (1.14)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.020 (0.51)
Typ. 0.010 (0.25) 0°
15°
8-Lead Plastic Du al In-Line Package Type P
Half Shoulder Width On
All End Pins Optional
.073 (1.84)
Max.
0.325 (8.25)
0.300 (7.62)
Plane
X5043, X5045
20 FN8126.2
March 16, 2006
Packaging Information
0.150 (3.80)
0.158 (4.00) 0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
Pin 1
Pin 1 Index
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7°
0.016 (0.410)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0° - 8°
X 45°
8-Lead Plastic Small Outline Gull Wing Package Type S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050"Typical
0.050"
Typical
0.030"
Typical
8 PlacesFOOTPRINT
X5043, X5045
21
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8126.2
March 16, 2006
Packaging Information
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
14-Lead Plastic, TSSOP, Package Ty pe V
See Detail “A”
.031 (.80)
.041 (1.05)
.169 (4.3)
.177 (4.5) .252 (6.4) BSC
.025 (.65) BSC
.193 (4.9)
.200 (5.1)
.002 (.05)
.006 (.15)
.047 (1.20)
.0075 (.19)
.0118 (.30)
0° - 8°
.010 (.25)
.019 (.50)
.029 (.75)
Gage Plane
Seating Plane
Detail A (20X)
X5043, X5045
