1
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
DESCRIPTION
FEATURES
■Low Noise: 40µV Possible
■High Accuracy: 1%
■Reverse Battery Protection
■Low Dropout: 340mV at Full Load
■Low Quiescent Current: 90µA
■Zero Off-Mode Current
■Fixed Output: 1.2V, 1.5V, 1.8V, 2.5V, 3.0V,
3.1V, 3.3V, 5.0V. Adj. Output also available.
■Available in RoHS Compliant, Lead Free
Packages: 5 Pin SOT-23, 8 Pin Narrow
SOIC and 8 pin 2X3 DFN
The SPX3819 is a positive voltage regulator with a low dropout voltage and low noise output. In
addition, this device offers a very low ground current of 800µA at 100mA output. The SPX3819 has
an initial tolerance of less than 1% max and a logic compatible ON/OFF switched input. When
disabled, power consumption drops to nearly zero. Other key features include reverse battery
protection, current limit, and thermal shutdown. The SPX3819 includes a reference bypass pin for
optimal low noise output performance. With its very low output temperature coefficient, this device
also makes a superior low power voltage reference.
The SPX3819 is an excellent choice for use in battery-powered applications such as cordless
telephones, radio control systems, and portable computers. It is available in several fixed voltages
-- 1.2V, 1.5V, 1.8V, 2.5V, 3.0V, 3.1V, 3.3V, 5.0V -- or with an adjustable output. This device is offered
in 8 pin NSOIC, 8 pin DFN and 5-pin SOT-23 packages.
APPLICATIONS
■Battery Powered Systems
■Cordless Phones
■Radio Control Systems
■Portable/Palm Top/Notebook Computers
TYPICAL APPLICATION CIRCUIT
+
+
GND
EN BYP
(Opt.)
ENABLE may be tied directly to V
IN
SPX3819
1
2
3 4
5
V
IN
V
OUT
TOP View
■Portable Consumer Equipment
■Portable Instrumentation
■Bar Code Scanners
■SMPS Post Regulators
SPX3819
8 Pin DFN
EN
NC
NC
NC
VIN
ADJ/BYP
VOUT
GND
5
6
7
81
2
3
4
500mA, Low-Noise LDO Voltage Regulator
SPX3819
2
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
Power Dissipation ...................................................... Internally Limited
Lead Temp. (Soldering, 5 Seconds) ........................................... 260°C
Operating Junction Temperature Range ................... -40°C to +125°C
Input Supply Voltage ........................................................ -20V to +20V
Enable Input Voltage ........................................................ -20V to +20V
PARAMETER MIN TYP MAX UNITS ♦ CONDITIONS
Output Voltage Tolerance -1 +1 %
-2 +2 ♦
Output Voltage Temperature Coef. 57 ppm/°C
Line Regulation 0.04 0.1 %/V V
IN
=V
OUT
+ 1V to 16V
Load Regulation 0.05 0.4 % I
L
= 0.1mA to 500mA
Dropout Voltage 10 60 mV I
L
= 100µA
(V
IN
-V
O
)(Note 2) 80 ♦
125 175 mV I
L
= 50mA
250 ♦
180 350 mV I
L
= 150mA
450 ♦
340 550 mV IL = 500mA
700 ♦
Quiescent Current (I
GND
) 0.05 3 µA V
ENABLE
≤0.4V
8 ♦ V
ENABLE
≤0.25V
Ground Pin Current (I
GND
) 90 150 µA I
L
= 100µA
190 ♦
250 650 µA I
L
= 50mA
900 ♦
1.0 2.0 mA I
L
= 150mA
2.5 ♦
6.5 25.0 mA I
L
= 500mA
30.0 ♦
Ripple Rejection (PSRR) 70 dB
Current Limit (I
LIMIT
) 800 mA V
OUT
= 0.0V
950 ♦
Output Noise (e
NO
) 300 µV
RMS
I
L
=10mA, C
L
=1.0µF, C
IN
=1µF,
(10Hz-100kHz)
40 µV
RMS
I
L
=10mA, C
L
=10µF, C
BYP
=1µF,
C
IN
=1µF, (10Hz-100kHz)
Input Voltage Level Logic Low (V
IL
) 0.4 V OFF
Input Voltage Level Logic High (V
IH
) 2 V ON
ENABLE Input Current 0.01 2 µA V
IL
≤0.4V
3 20 V
IH
≥2.0V
Thermal Resistance (Note 1) 191 °C/W ♦ SOT-23-5 / Junction to Ambient
128.4 °C/W ♦ NSOIC-8 / Junction to Ambient
59 °C/W ♦ DFN-8 / Junction to Ambient
ELECTRICAL CHARACTERISTICS
TJ=25°C, VOUT + 1V, for 1.2V Option VIN=VOUT + 1.2V IL=100µA, CL=1µF, and VENABLE ≥2.4V. The
♦
denotes the
specifications which apply over full operating temperature range -40°C to +85°C, unless otherwise specified.
ABSOLUTE MAXIMUM RATINGS
NOTES
Note 1: The maximum allowable power dissipation is a function of maximum operating junction temperature, TJ(max) the junction to ambient thermal
resistance, and the ambient θJA, and the ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is
given: PD(max) = (TJ(max)-TA)/θJA, exceeding the maximum allowable power limit will result in excessive die temperature; thus, the regulator will
go into thermal shutdown. The θJA of the SPX3819 is 220°C/W mounted on a PC board.
Note 2: Not applicable to output voltage 2V or less.
Input Voltage ................................................................... +2.5V to+16V
Operating Junction Temperature Range ................... -40°C to +125°C
Enable Input Voltage ........................................................... 0.0V to VIN
RECOMMENDED OPERATING CONDITIONS
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Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
TYPICAL PERFORMANCE CHARACTERISTICS
Ground Current vs Load Current Ground Current vs Input Voltage
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0 100 200 300 400 500
I
L
(mA)
I
GN D
( m A )
3.3V Device
V
IN
= 4.3V
C
L
= 1.0µF
160
150
140
130
120
100
90
80
70
60
4
8 10 12 14 16
V
IN
(V)
I
G N D
( µ A )
3.3V Device
C
L
= 1.0µF
I
L
= 100µA
Ground Current vs Load Current in Dropout Output Voltage vs Input Voltage
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0 100 200 300 400 500
I
L
(mA)
I
G N D
( m A)
3.3V Device
V
IN
= 4.3V
C
L
= 1.0µF
3.350
3.345
3.340
3.335
3.330
3.325
3.320
3.315
3.305
3.300
3.295
3.290
4 6 8 10 12 14 16
V
IN
(V)
V
OU T
(V)
3.3V Device
C
L
= 1.0µF
I
L
= 100µA
3.310
6
4
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
Dropout Voltage vs Load Current Output Voltage vs Load Current
Ground Current vs Temperature with 100µA Load Ground Current vs Temperature with 50mA Load
350
300
250
200
150
100
50
0
0 100 200 300 400 500
I
L
(mA)
D r o p o u t ( m V )
3.3V Device
C
L
= 1.0µF
0 100 200 300 400 500
I
L
(mA)
V
OUT
(V )
3.3V Device
VIN= 4.3V
CL = 1.0µF
130
120
110
100
90
80
70
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
I
G ND
(µA)
3.3V Device
VIN= 4.3µF
CL= 1.0µF
IL = 100µA
360
340
320
300
280
260
240
220
200
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
I
GN D (µA)
3.3V Device
VIN = 4.3
CL= 1.0µF
IL = 50mA
TYPICAL PERFORMANCE CHARACTERISTICS: Continued
3
.316
3
.314
3.312
3
.310
3
.308
3
.304
3
.302
3
.300
3
.306
5
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
Ground Current vs Temperature with 500mA Load Ground Current vs Temperature in Dropout
ENABLE Voltage, ON threshold, vs Input Voltage Output Voltage vs Temperature
8.0
7.5
7.0
6.5
6.0
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
I
GND
(mA)
3.3V Device
V
IN
= 4.3µF
C
L
= 1.0µF
I
L
= 500mA
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
I
GND (mA)
3.3V Device
VIN= 4.3µF
CL= 1.0µF
IL = 500mA
1.30
1.25
1.20
1.15
1.10
1.05
1.00
4 6 8 10 12 14 16
V
IN
(V)
V
EN,
On Thr eshol d
(V )
3.3V Device
C
L
= 1.0µF
I
L
= 100µA
3.400
3.380
3.360
3.340
3.320
3.300
2.280
2.260
2.240
2.220
2.200
-40 -20 0 20 40 60 80 100 120
Temperature (°C)
V
OUT (V)
3.3V Device
VIN= 4.3µF
CL= 1.0µF
IL = 500mA
TYPICAL PERFORMANCE CHARACTERISTICS: Continued
6
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
Output Noise vs Bypass Capacitor Value IL = 10mA,
10Hz - 100kHz
Line Transient Response for 3.3V Device
Load Transient Response for 3.3V Device
TYPICAL PERFORMANCE CHARACTERISTICS: Continued
0
50
100
150
200
250
300
350
1 10 100 1000 10000 100000 1000000
Bypass Cap (pF)
uV RMS
Cin = 1uFT,
Cout = 1uFT
Cin = 1uFT,
Cout = 2.2uFT
Cin = 1uFT
Cout = 10uFT
7
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
The SPX3819 requires an output capacitor for
device stability. Its value depends upon the
application circuit. In general, linear regulator
stability decreases with higher output currents.
In applications where the SPX3819 is sourcing
less current, a lower output capacitance may be
sufficient. For example, a regulator outputting
only 10mA, requires approximately half the
capacitance as the same regulator sourcing
150mA.
Bench testing is the best method for determining
the proper type and value of the capacitor since
the high frequency characteristics of electro-
lytic capacitors vary widely, depending on type
and manufacturer. A high quality 2.2µF alumi-
num electrolytic capacitor works in most appli-
cation circuits, but the same stability often can
be obtained with a 1µF tantalum electrolytic.
With the SPX3819 adjustable version, the mini-
mum value of output capacitance is a function of
the output voltage. The value decreases with
higher output voltages, since closed loop gain is
increased.
Typical Applications Circuits
A 10nF capacitor on the BYP pin will signifi-
cantly reduce output noise, but it may be left
unconnected if the output noise is not a major
concern. The SPX3819 start-up speed is in-
versely proportional to the size of the BYP
capacitor. Applications requiring a slow ramp-
up of the output voltage should use a larger
CBYP. However, if a rapid turn-on is necessary,
the BYP capacitor can be omitted.
The SPX3819’s internal reference is available
through the BYP pin.
Figure 1 represents a SPX3819 standard appli-
cation circuit. The EN (enable) pin is pulled
high (>2.0V) to enable the regulator.
To disable the regulator, EN < 0.4V.
The SPX3819 in Figure 2 illustrates a typical
adjustable output voltage configuration. Two
resistors (R1 and R2) set the output voltage. The
output voltage is calculated using the formula:
VOUT = 1.235V x [ 1 + R1/R2]
R2 must be > 10 kΩand for best results, R2
should be between 22 kΩ and 47kΩ.
APPLICATION INFORMATION
+
+
GND
EN BYP
(Opt.)
ENABLE may be tied directly to V
IN
SPX3819
1
2
3 4
5
V
IN
V
OUT
TOP View
+
+
GND
EN
Hi-ON
Lo-OFF
SPX3819
SOT-23
1
2
3 4
5
V
IN
V
OUT
R1
R2
TOP View
Figure 1. Standard Application Circuit Figure 2. Typical Adjustable Output Voltage Configuration
8
Jun 5-07 Rev E SPX3819 500mA, Low Noise LDO Voltage Regulator © 2007 Sipex Corporation
PACKAGE: PINOUTS
PACKAGE: PIN DESCRIPTION
#niP
CIOSn
#niP
NFD
#niP
3-TOS emaNniP noitpircseD
2 3 1 V
NI
t u p n I y l p p u S
8 -5 7 2 D N G d n u o r G
3 5 5 V
TU O
t u p t u O r o t a l u g e R
1 1 3 N E e l b i t a p m o c S O M C . ) t u p n i ( e l b a n E
; e l b a n e = h g i h c i g o L . t u p n i l o r t n o c
n w o d t u h s = n e p o r o w o l c i g o l
4 8 4 P Y B /J D A . t u p n i k c a b d e e F . ) t u p n i ( t s u j d A
r e d i v i d -e g a t l o v e v i t s i s e r o t t c e n n o C
k r o w t e n
- 6 , 4 - C N t c e n n o C o N
SPX3819
8 Pin DFN
EN
NC
NC
NC
VIN
ADJ/BYP
VOUT
GND
5
6
7
81
2
3
4
1
2
3
45
6
7
8
EN
ADJ/BYP GND
VOUT
VIN
GND
GND
GND
SPX3819
8 Pin nSOIC
EN GND VIN
ADJ/BYP
VOUT
SPX3819
5 Pin SOT-23
1 2
4
5
3
Note: The bottom exposed pad for the SPX3819
DFN package is connected to GND.
Datasheet Appendix & Web Link Information © 2007 Sipex Corporation
For further assistance:
Email: Sipexsupport@sipex.com
WWW Support page: http://www.sipex.com/content.aspx?p=support
Sipex Application Notes: http://www.sipex.com/applicationNotes.aspx
Product Change Notices: http://www.sipex.com/content.aspx?p=pcn
Sipex Corporation
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA95035
tel: (408) 934-7500
faX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of
any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
The following sections contain information which is more
changeable in nature and is therefore generated as appendices.
1) Package Outline Drawings
2) Ordering Information
If Available:
3) Frequently Asked Questions
4) Evaluation Board Manuals
5) Reliability Reports
6) Product Characterization Reports
7) Application Notes for this product
8) Design Solutions for this product
Solved by
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Solved by
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Appendix and Web Link Information
ORDERING INFORMATION
Part Number Accuracy MSL Level Status Package Pack Type Quantity RoHS
SPX3819S-L/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-1-8/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-2-5/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-3-0/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-3-1/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-3-3/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L-5-0/TR 0.01 L1 @ 260ºC Active NSOIC8 Tape & Reel 2500 Yes
SPX3819S-L 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-1-8 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-2-5 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-3-0 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-3-1 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-3-3 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819S-L-5-0 0.01 L1 @ 260ºC Active NSOIC8 TUBE 98 Yes
SPX3819M5-L 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-1-2 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-1-5 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-1-8 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-2-5 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-3-0 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-3-1 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-3-3 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L-5-0 0.01 L1 @ 260ºC Active SOT-23-5 Not in Bulk 2500 Yes
SPX3819M5-L/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-1-2/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-1-5/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-1-8/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-2-5/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-3-0/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-3-1/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-3-3/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819M5-L-5-0/TR 0.01 L1 @ 260ºC Active SOT-23-5 Tape & Reel 2500 Yes
SPX3819R2-L-1-2 0.01 L1 @ 250ºC CF DFN8 Not in Bulk 3000 Yes
SPX3819R2-L-1-2/TR 0.01 L1 @ 250ºC CF DFN8 Tape & Reel 3000 Yes
SPX3819S-L-1-2/TR 0.01 L1 @ 260ºC CF SOIC-8 Tape & Reel 2500 Yes
SPX3819S-L-1-5/TR 0.01 L1 @ 260ºC CF SOIC-8 Tape & Reel 2500 Yes
SPX3819S-L-1-2 0.01 L1 @ 260ºC CF SOIC-8 TUBE 98 Yes
SPX3819S-L-1-5 0.01 L1 @ 260ºC CF SOIC-8 TUBE 98 Yes
ORDERING INFORMATION
Part Number Accuracy MSL Level Status Package Pack Type Quantity RoHS
SPX3819R2-L 0.01 L1 @ 250ºC EOL DFN8 Not in Bulk 3000 Yes
SPX3819R2-L-1-5 0.01 L1 @ 250ºC EOL DFN8 Not in Bulk 3000 Yes
SPX3819R2-L-1-8 0.01 L1 @ 250ºC EOL DFN8 Not in Bulk 3000 Yes
SPX3819R2-L-3-3 0.01 L1 @ 250ºC EOL DFN8 Not in Bulk 3000 Yes
SPX3819R2-L-5-0 0.01 L1 @ 250ºC EOL DFN8 Not in Bulk 3000 Yes
SPX3819R2-1-2 0.01 L1 @ 240ºC EOL DFN8 Not in Bulk 3000 No
SPX3819R2-3-3 0.01 L1 @ 240ºC EOL DFN8 Not in Bulk 3000 No
SPX3819R2-1-2/TR 0.01 L1 @ 240ºC EOL DFN8 Tape & Reel 3000 No
SPX3819S/TR 0.01 L1 @ 240ºC EOL NSOIC8 Tape & Reel 2500 No
SPX3819S-2-5/TR 0.01 L1 @ 240ºC EOL NSOIC8 Tape & Reel 2500 No
SPX3819S 0.01 L1 @ 240ºC EOL NSOIC8 TUBE 98 No
SPX3819S-2-5 0.01 L1 @ 240ºC EOL NSOIC8 TUBE 98 No
SPX3819S-3-3/TR 0.01 L1 @ 240ºC EOL SOIC-8 Tape & Reel 2500 No
SPX3819S-1-8 0.01 L1 @ 240ºC EOL SOIC-8 TUBE 98 No
SPX3819S-3-3 0.01 L1 @ 240ºC EOL SOIC-8 TUBE 98 No
SPX3819S-5-0 0.01 L1 @ 240ºC EOL SOIC-8 TUBE 98 No
SPX3819M5 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-1-2 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-1-5 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-1-8 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-2-5 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-3-0 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-3-1 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-3-3 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5-5-0 0.01 L1 @ 240ºC EOL SOT-23-5 Not in Bulk 2500 No
SPX3819M5/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-1-2/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-1-5/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-1-8/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-2-5/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-3-0/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-3-3/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
SPX3819M5-5-0/TR 0.01 L1 @ 240ºC EOL SOT-23-5 Tape & Reel 2500 No
Solved by
TM
For further assistance:
Email: Sipexsupport@sipex.com
WWW Support page: http://www.sipex.com/content.aspx?p=support
Sipex Application Notes: http://www.sipex.com/applicationNotes.aspx
Sipex Corporation
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
tel: (408) 934-7500
fax: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not
assume any liability arising out of the application or use of any product or circuit described herein; neither
does it convey any license under its patent rights nor the rights of others.
SIPEX FAQ 1 © 2006 Sipex Corporation
For further assistance, contact Sipex Technical Support:
Sipexsupport@sipex.com
Solved by
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SPX3819: FAQ
Part Number: SPX3819
Date: Sept14-06
Question:
Assuming a nominal load of 250mA @ 3V DC, how much ground current will be consumed? With a 6V input, will
the part even get warm? How about with a 12V input?
Answer:
The SPX3819 data sheet contains a graph of ground current vs load current for your review.
Also we suggest that you download the Thermal Considerations application note which includes a few example
calculations from the SPX3819:
http://www.sipex.com/les/ApplicationNotes/LDOThermal.pdf
The Linear Regulator Heat Calculator could also prove helpful:
http://www.sipex.com/les/ApplicationNotes/ThermalCalculator.xls
Customer bench testing is strongly recommended using intended application circuit to ensure proper operation.
Question:
Is this part similar to your SP6203 CMOS part in the above regard? Or, is it like a conventional regulator (LM7805)
where the excess voltage turns into heat?
Answer:
All LDO’s will transfer most of its energy to heat. To minimize this temperature rise keep the input to output voltage
difference slightly above dropout voltage. See the applications note mentioned above.
Question:
Can ceramic capacitors be used on the output?
Answer:
Ceramic capacitors may be used for this part. For Tantalum or Aluminum Electrolytic types, keep the Equivalent
Series Resistance (ESR) as small as possible.
Question:
Considering the PSRR is 70db, what is a better strategy for ltering the 60Hz ripple from the wall cube? A big high
voltage electrolytic on the input or a smaller, low voltage ceramic on the output? Or, a combination of both?
Answer:
A small common mode choke would be best for ltering this ripple. Variations / combinations of input capacitance
might also help but bench testing would be required.
SIPEX FAQ 2 © 2006 Sipex Corporation
For further assistance, contact Sipex Technical Support:
Sipexsupport@sipex.com
Question:
Is there any practical limit to how much capacitance is used on the input or output?
Answer:
Input and output capacitance may be increased without limit.
Question:
It would appear, from the data sheet, increasing the Bypass capacitor above 0.01uF has little improvement in
terms of noise. We use a special low ESL/ESR 0.1uF ceramic as standard for RF bypassing. Any concerns
about using these on your Bypass pin as well?
Answer:
If the bypass pin is to be used a 10nF ceramic capacitor is suggested. You may also use the value / type
mentioned. The only concern with the bypass feature is that startup time is increased. If startup time is a
concern then the bypass pin should be kept open. Different values of bypass capacitor will result in different
startup times.
Question:
A portion of this application involves modulating a IR LED with a 400KHz signal having a 50% duty cycle or less.
Assumming a drive level of 1 AMP per 25µS pulse, will your device even see this as an overload and go into
current limiting? If so, should a large electrolytic be employed on the output?
Answer:
This is a little difcult to answer not knowing how you plan on modulating the LED. If the enable input is used for
modulation it is possible that the device may not react fast enough to provide an output. This is very much true
if the Bypass pin is used. If the output load exceeds the current limit trip point then the output will be turned off
to protect the device. However. if the output is always on and modulation is done with some external circuitry,
then adding extra capacitance to the output could satisfy the current demand of the LED so as not to cause
current limit activation.
Question:
This part is quite attractive in terms of its Reverse Battery Protection feature. Do you have any other more
current/better alternatives?
Answer:
For a 500mA output current device this is the best Sipex offers for package size and performance. Check our
LDO products page for all of Sipex LDO offerings.
http://www.sipex.com/productselector.aspx?family=LowDropOut
SIPEX FAQ 3 © 2006 Sipex Corporation
For further assistance, contact Sipex Technical Support:
Sipexsupport@sipex.com
Question:
If a 3V battery pack was connected to the output, without a “wall wart” connected to the input, would any
current ow back through the device?
Answer:
The datasheet does not state that this device is operable in a pre-biased output condition; therefore, leakage
may occur.
Question:
If the 3V battery pack was connected to the input, what would the output voltage be with a 250mA load?
Answer:
If the input voltage is above dropout voltage then the part will regulate for the entire output current range up
to 500mA.
Product Characterization Report
for the
SPX5205 Family of Products
SPX3819, SPX5205 Products
Prepared By: Velvet Doung, Salvador Wu & Greg West
Date: October 6, 2006
SPX5205
Product Family
Characterization Report
Page 2 of 21
11/17/2006
Table of Contents
Section Page
Introduction 3
Characterization Procedure 3
Data Summary for Key Parameters 4
Conclusions 6
Data Histograms Appendix A
SPX5205
Product Family
Characterization Report
Page 3 of 21
11/17/2006
Introduction: This product family characterization was done as part of the
qualification of Sipex’s fabrication site transfer from Sipex’s Hillview Fab in
Milpitas, CA, to a contract foundry, Silan, in Hangzhou, China. This
characterization report summarizes data for key SPX5205 product family
characteristics and contains distributions for all parameters. A complete listing of
the product numbers covered by the characterization report is included in the
“Conclusion” section of this report. A distribution for a given parameter shows
different temperature data which are at -40ºC, 25ºC, and 85ºC.
Wafer Fab: Silan
Fab Location: Hangzhou, China
Process: Silan – bp4
MS: 1631
Characterization Procedure:
Silan Lot number(s): CA10068
Hillview Lot number(s): A133102
Temperatures: Ambient (25C), 85C, -40C
Tester: TMT
Test Program: SPX5205_S_33_01_FT
SPX5205
Product Family
Characterization Report
Page 4 of 21
11/17/2006
Data Summary:
Key Parameter Across Temperature Data Summary
Parameter Units Hillview
Fab
Distribution
Mean
Hillview
Fab
Distribution
Variance
Hillview
Fab
Cpk
Silan Fab
Distribution
Mean
Silan Fab
Distribution
Variance
Silan Fab
Cpk
-40C
Vout@1mA V
3.3063 0.0145 0.1453
3.3101 0.0145 0.2313
Vout@150mA V 3.3059 0.0143 0.1377
3.3096 0.0146 0.2201
Load Reg % 0.0163 0.0239 2.5591
0.0155 0.0124 >4.0000
Vout@16V V
3.3033 0.0146 0.0755
3.3066 0.0160 0.1374
Vout@Ven16V V 3.3031 0.0146 0.0698
3.3084 0.0159 0.1756
Line Reg %/V 0.0095 0.0022 >4.0000
0.0106 0.0092 3.2365
Vdrop@100uA mV 4.4206 0.4011 >4.0000
4.8494 0.1847 >4.0000
Vdrop@150mA mV 165.9586 5.1199 >4.0000
171.5026 3.1504 >4.0000
Ien_Hi uA
2.5512 0.7638 >4.0000
6.6740 0.6094 >4.0000
Ien_Lo uA
0.0766 0.0507 >4.0000
0.0418 0.0348 >4.0000
Iq uA
0.1293 0.1387 2.0921
0.1244 0.1015 2.8759
Ignd@100uA uA
65.9978 5.4764 3.5913
61.9901 12.8836 1.6302
Ignd@150mA mA 0.1791 0.0095 >4.0000
0.1367 0.0136 >4.0000
Ilim mA
245.0682 0.7598 >4.0000
244.7949 1.0248 >4.0000
25C
Vout@1mA V 3.3116 0.0127 0.3030
3.3155 0.0052 0.9831
Vout@150mA V 3.3101 0.0127 0.2635
3.3140 0.0051 0.9141
Load Reg % 0.0454 0.0133 3.8768
0.0434 0.0161 3.2412
Vout@16V V
3.3063 0.0127 0.1658
3.3113 0.0053 0.7049
Vout@Ven16V V 3.3063 0.0127 0.1654
3.3113 0.0054 0.7008
Line Reg %/V 0.0154 0.0012 >4.0000
0.0125 0.0029 >4.0000
Vdrop@100uA mV 5.8073 0.4263 >4.0000
6.2024 0.1236 >4.0000
Vdrop@150uA mV 198.4826 1.4465 >4.0000
202.5361 1.1720 >4.0000
Ien_Hi uA
2.0744 0.5860 >4.0000
5.6495 0.7200 >4.0000
Ien_Lo uA
0.0889 0.0381 >4.0000
0.0491 0.0227 >4.0000
Iq uA
0.0712 0.0202 >4.0000
0.0848 0.0140 >4.0000
Ignd@100uA uA
67.5626 3.5699 >4.0000
68.1415 3.3238 >4.0000
Ignd@150uA mA
0.1561 0.0103 >4.0000
0.1256 0.0077 >4.0000
Ilim mA
246.5068 0.5756 >4.0000
247.4643 0.5002 >4.0000
SPX5205
Product Family
Characterization Report
Page 5 of 21
11/17/2006
85C
Vout@1mA V 3.2970 0.0109 -0.0910
3.2998 0.0058 -0.0113
Vout@150mA V 3.2945 0.0109 -0.1690
3.2950 0.0058 -0.2835
Load Reg % 0.0768 0.0226 1.8173
0.1440 0.0261 0.7146
Vout@16V V
3.3219 0.0150 0.4887
3.3184 0.0062 0.9950
Vout@Ven16V V 3.3189 0.0143 0.4418
3.3188 0.0097 0.6478
Line Reg %/V 0.0366 0.0160 1.3243
0.0310 0.0172 1.3345
Vdrop@100uA mV 7.3246 0.4241 >4.0000
8.0661 0.1438 >4.0000
Vdrop@150uA mV 234.8495 2.2662 >4.0000
239.0377 1.8582 >4.0000
Ien_Hi uA
1.7742 0.4554 >4.0000
4.6596 0.3992 >4.0000
Ien_Lo uA
0.1911 0.0379 >4.0000
0.1981 0.0446 >4.0000
Iq uA
2.2378 0.6659 -0.6196
1.5455 0.3054 -0.5954
Ignd@100uA uA
65.8955 3.1628 >4.0000
64.1807 3.4968 >4.0000
Ignd@150uA mA
0.1215 0.0122 >4.0000
0.0960 0.0086 >4.0000
Ilim mA
236.4959 0.8179 >4.0000
236.7823 0.6988 >4.0000
SPX5205
Product Family
Characterization Report
Page 6 of 21
11/17/2006
Conclusion:
Characterization data over temperature and Vcc range show datasheet
parameters meet the spec. Cpk’s for most parameters are comparable between
Hillview and Silan although many show a strong temperature dependence that
tends to produce lower Cpk’s in this analysis.
The performance of SPX5205 parts fabricated at Silan are comparable to the
current SPX5205 parts built from the Hillview fab.
This characterization report applies to the following SPX5205 family of product
part numbers:
SPX3819A1-3-3 SPX3819R2-1-5 SPX3819S-L-3-3 SPX3819U-L-3-0
SPX3819A1-L-3-3 SPX3819R2-1-8 SPX3819S-L-5-0 SPX3819U-L-3-1
SPX3819M3-1-8 SPX3819R2-2-5 SPX3819T-1-8 SPX3819U-L-3-3
SPX3819M3-3-0 SPX3819R2-3-0 SPX3819T-3-0 SPX3819U-L-5-0
SPX3819M3-3-1 SPX3819R2-3-1 SPX3819T-3-1 SPX5205M5
SPX3819M3-3-3 SPX3819R2-3-3 SPX3819T-3-3 SPX5205M5-1-2
SPX3819M3-L-1-8 SPX3819R2-5-0 SPX3819T5-1-8 SPX5205M5-1-5
SPX3819M3-L-3-0 SPX3819R2-L SPX3819T5-3-0 SPX5205M5-1-8
SPX3819M3-L-3-1 SPX3819R2-L-1-2 SPX3819T5-3-1 SPX5205M5-2-0
SPX3819M3-L-3-3 SPX3819R2-L-1-5 SPX3819T5-3-3 SPX5205M5-2-5
SPX3819M5 SPX3819R2-L-1-8 SPX3819T5-L-1-8 SPX5205M5-2-8
SPX3819M5-1-2 SPX3819R2-L-2-5 SPX3819T5-L-3-0 SPX5205M5-3-0
SPX3819M5-1-5 SPX3819R2-L-3-0 SPX3819T5-L-3-1 SPX5205M5-3-3
SPX3819M5-1-8 SPX3819R2-L-3-1 SPX3819T5-L-3-3 SPX5205M5-5-0
SPX3819M5-2-5 SPX3819R2-L-3-3 SPX3819T-L-1-8 SPX5205M5-L
SPX3819M5-3-0 SPX3819R2-L-5-0 SPX3819T-L-3-0 SPX5205M5-L-1-2
SPX3819M5-3-1 SPX3819S SPX3819T-L-3-1 SPX5205M5-L-1-5
SPX3819M5-3-3 SPX3819S-1-8 SPX3819T-L-3-3 SPX5205M5-L-1-8
SPX3819M5-5-0 SPX3819S-2-5 SPX3819U SPX5205M5-L-2-0
SPX3819M5-L SPX3819S-3-0 SPX3819U-1-8 SPX5205M5-L-2-5
SPX3819M5-L-1-2 SPX3819S-3-1 SPX3819U-2-5 SPX5205M5-L-2-8
SPX3819M5-L-1-5 SPX3819S-3-3 SPX3819U-3-0 SPX5205M5-L-3-0
SPX3819M5-L-1-8 SPX3819S-5-0 SPX3819U-3-1 SPX5205M5-L-3-3
SPX3819M5-L-2-5 SPX3819S-L SPX3819U-3-3 SPX5205M5-L-5-0
SPX3819M5-L-3-0 SPX3819S-L-1-2 SPX3819U-5-0
SPX3819M5-L-3-1 SPX3819S-L-1-5 SPX3819U5-3-3
SPX3819M5-L-3-3 SPX3819S-L-1-8 SPX3819U5-L-3-3
SPX3819M5-L-5-0 SPX3819S-L-2-5 SPX3819U-L
SPX3819R2 SPX3819S-L-3-0 SPX3819U-L-1-8
SPX3819R2-1-2 SPX3819S-L-3-1 SPX3819U-L-2-5
SPX5205
Product Family
Characterization Report
Page 7 of 21
11/17/2006
Appendix A
Characterization Data Histograms
SPX5205
Product Family
Characterization Report
Page 8 of 21
11/17/2006
HV SPX5205 - Vref @1m a
0
2
4
6
8
10
12
14
16
18
20
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vre f (v)
Frequency
cold
room
hot
Sil a n SPX5205 - Vref @1ma
0
5
10
15
20
25
30
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vre f (v)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 9 of 21
11/17/2006
HV SP X52 05 - Vref@150ma
0
2
4
6
8
10
12
14
16
18
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vref (v)
Frequency
cold
room
hot
Silan SPX5205 - Vr ef @150ma
0
5
10
15
20
25
30
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vre f (v)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 10 of 21
11/17/2006
HV SPX5202 - Load Reg
0
2
4
6
8
10
12
14
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
0.22
0.24
0.26
0.28
0.3
Loa dRe g (%)
Frequency
cold
room
hot
Si lan SPX520 2 - Load Reg
0
2
4
6
8
10
12
14
16
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
0.22
0.24
0.26
0.28
0.3
Loa dRe g (%)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 11 of 21
11/17/2006
HV SPX5205 - Vout @ Vi n= 16v
0
2
4
6
8
10
12
14
16
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vout (v)
Frequency
cold
room
hot
Sil an SPX5205 - Vout@ Vin= 16v
0
5
10
15
20
25
30
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vout (v)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 12 of 21
11/17/2006
HV SPX5205 - Vout @ Ven=16v
0
2
4
6
8
10
12
14
16
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vout (v)
Freqeuncy
cold
room
hot
Sil an SPX5205 - Vout @ Ven=16v
0
5
10
15
20
25
30
3
3.04
3.08
3.12
3.16
3.2
3.24
3.28
3.32
3.36
3.4
3.44
3.48
3.52
3.56
3.6
Vout (v)
Freqeuncy
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 13 of 21
11/17/2006
HV SPX5205 - Li neReg
0
5
10
15
20
25
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
0.11
0.12
0.13
0.14
0.15
Line Reg (%/ v)
Frequency
cold
room
hot
Si l an SPX5205 - Li neReg
0
2
4
6
8
10
12
14
16
18
20
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
0.11
0.12
0.13
0.14
0.15
Line Reg (%/ v)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 14 of 21
11/17/2006
HV SPX52 05 - Vdropou t @1 00 ua
0
5
10
15
20
25
30
35
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Vdropout (v)
Freqeuncy
cold
room
hot
Si lan SPX5 20 5 - Vdr opout@100 ua
0
5
10
15
20
25
30
35
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Vdropout (v)
Freqeuncy
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 15 of 21
11/17/2006
HV SPX5205 - Vdrop@150ma
0
5
10
15
20
25
30
35
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
Vdrop (v)
Frequency
cold
room
hot
Silan SPX5205 - Vdrop@150ma
0
5
10
15
20
25
30
35
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
Vdrop (v)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 16 of 21
11/17/2006
HV SPX5205 - I en_Hi
0
2
4
6
8
10
12
14
16
18
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Ie n (ua)
Freqeuncy
cold
room
hot
Si lan SPX5 205 - Ien_Hi
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Ie n (ua)
Freqeuncy
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 17 of 21
11/17/2006
HV SPX5205 - Ien_Lo
0
2
4
6
8
10
12
14
16
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Ie n (ua)
Freqeuncy
cold
room
hot
Si l a n SPX5205 - Ien_Lo
0
2
4
6
8
10
12
14
16
18
20
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Ie n (ua)
Freqeuncy
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 18 of 21
11/17/2006
HV SPX5205 - Q ui escent_I
0
5
10
15
20
25
30
35
0
0.4
0.8
1.2
1.6
2
2.4
2.8
3.2
3.6
4
4.4
4.8
5.2
5.6
6
Iq (ua)
Freqeuncy
cold
room
hot
Sil an SPX5205 - Q ui escent_I
0
5
10
15
20
25
30
35
0
0.4
0.8
1.2
1.6
2
2.4
2.8
3.2
3.6
4
4.4
4.8
5.2
5.6
6
Iq (ua)
Freqeuncy
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 19 of 21
11/17/2006
HV SPX5205 - I gnd@100ua
0
2
4
6
8
10
12
14
16
18
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Ignd (ua)
Frequency
cold
room
hot
Silan SPX5205 - I gnd@100ua
0
2
4
6
8
10
12
14
16
18
20
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Ignd (ua)
Frequency
cold
room
hot
SPX5205
Product Family
Characterization Report
Page 20 of 21
11/17/2006
HV SPX5205 - Ignd@150m a
0
5
10
15
20
25
30
35
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Ignd (ma)
Frequency
cold
room
hot
Si lan SPX5 205 - I gnd@150ma
0
5
10
15
20
25
30
35
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
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SPX5205
Product Family
Characterization Report
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11/17/2006
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SPX29150 Reliability Report Page 1 of 4
Reliability and Qualification Report
Silan BP4 Process Reliability Qualification
using the SPX29150
Prepared By: Salvador Wu & Greg West Reviewed By: Fred Claussen
QA Engineering VP Quality & Reliability
Date: September 15, 2006 Date: September 15, 2006
SPX29150 Reliability Report Page 2 of 4
Table Of Contents
Title Page 1
Table Of Contents 2
Device Description 2
Pin Out 2
Manufacturing Information 2
Package Information 2
Reliability Test Summary 3
Life Test Data 3
FIT Data Calculations 4
MTBF Data Calculations 4
ESD Testing 4
Early Life Failure Rate Testing 5
5L TO-263 Pb Free Package Qualification Addendum 4
Device Description:
The SPX29150/51/52/53 are 1.5A, highly accurate voltage regulators with a low dropout
voltage of 390mV (typical) @ 1.5A. These regulators are specifically designed for low
voltage applications that require a low dropout voltage and a fast transient response. They
are fully fault protected against over-current, reverse battery, and positive and negative
voltage transients. On-chip trimming adjusts the reference voltage to 1% initial accuracy.
Other features in the 5 pin versions include Enable and Error Flag.
The SPX29150/51/52/53 is offered in 3-pin and 5-pin TO-220 & TO-263 packages. For a
3A version, refer to the SPX29300 data sheet.
Manufacturing Information:
Product: SPX29150
Description: 1.5A PNP LDO
Mask Set: MS1562
Lot Number(s): SPXBP4012EC,
A135428.3 (15), A136411.2 (16)
Process: sil-bp4
Wafer Fab: Silan
Package Information:
Package Type: TO 263-5L
Package Code:: JEDEC
PIN OUT SPX29150
SPX29150 Reliability Report Page 3 of 4
Reliability Qualification Test Summary:
Stress Level
Device Lot Numbe
r
Burn-In Temp Sample Size No. Fail
168Hrs SPX29150 SPXBP401
2EC
125 °C 77 0
168Hrs SPX29150 A135428.3
(15)
125 °C 77 0
168Hrs SPX29150 A136411.2
(16)
125 °C 77 0
1000Hrs SPX29150 SPXBP401
2EC
125 °C 77 0
1000Hrs SPX29150 A135428.3
(15)
125 °C 77 0
1000Hrs SPX29150 A136411.2
(16)
125 °C 77 0
Life Test
Life testing is conducted to determine if there are any fundamental reliability related
failure mechanism(s) present in the device.
These failure mechanisms can be divided roughly into four groups:
1. Process or die related failures such as oxide defects, metallization defects, and
diffusion defects.
2. Assembly related failures such as chip mount defects, wire bond defects, molding
defects, and trim/form/singulation defects.
3. Design related defects.
4. Miscellaneous, undetermined, or application induced failures.
125C Operating Life Test Results
As part of the Sipex design qualification program, the Product/Reliability Engineering
group subjected 231 parts to 168 hours and 1000 hours of 125° C life stress testing.
168 Hour Timepoint
The 231 parts were subjected to the life test profile and completed the stress with no
failures.
1000 Hour Timepoint
231 parts were reintroduced to life stress testing, completing the 1000 hour HTOL time
point without any failures or significant shifts in process parameters
FIT Rate Calculations
FIT rate (failures in time) is the predicted number of failures per billion device hours.
This predicted value is based upon,
SPX29150 Reliability Report Page 4 of 4
• The Life Test conditions summarized in the HTOL table (time/temperature, device
quantity, failure quantity).
• The Activation Energy (Ea) for potential failure modes. The weighted Activation
Energy(Ea) of observed failure mechanisms for Sipex products has been determined
to be 0.8eV.
Based on the above criteria SPX29150 product FIT rates for 25°, 55°, and 70°C of
operation at 60% and 90% confidence levels have been calculated and listed below.
FIT Failure Rates: SPX29150 BP4 Silan Process
Confidence Level +25°C +55°C +70°C
60% 1.6 26.4 89.0
90% 3.9 64.2 216.0
1 FIT = 1 Failure per Billion Device-Hours
MTBF Calculation: SPX29150 BP4 Silan Process
Confidence Level +25°C +55°C +70°C
60% 6.15E+08 3.78E+07 1.12E+07
90% 2.53E+08 1.56E+07 4.63E+06
ESD Testing
Human Body Model ESD – 32 units were subjected to Human Body Model ESD testing
at +/- 2KV. All units passed.
Early Life Failure Rate Testing
Early Life Test – 600 units were subject to Early Life test for 48 Hours. All units passed
Additional Reliability Tests
77 of the units were placed on Unbiased HAST testing, 77 of the units were placed on Thermal
Shock testing, and 77 on -65C/+150C Temperature Cycle testing. All units passed testing as summarized
in the following table.
Test Condition Time Sample Size
# of
rejects
TEMP. Cycles -65C/+150C 500 Cycles 77 0
HAST Unbiased 130C/85%RH 96hrs 77 0
Thermal Shock -65C/+150C 500 Cycles 77 0