High Current, High Frequency, Power Inductors FLAT-PACTM FP1206 Series Applications * * * * * * * * HF FREE Environmental Data SMD Device * Storage temperature range: -40C to +125C * Operating temperature range: -40C to +125C (with derated current) * Solder reflow temperature: J-STD-020D compliant Description * * * * * * * * * * * HALOGEN Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Notebook regulators Graphics cards and battery power systems Point of load modules DCR current sensing Halogen free 125C maximum total temperature operation 8.0 x12.0 x 6.0mm surface mount package Ferrite core material High current carrying capacity, low core losses Designed for high speed, high current switch mode applications Controlled DCR tolerance for sensing circuits Inductance range from 120nH to 400nH Current range from 24 to 88 amps Frequency range up to 1MHz RoHS compliant Packaging * Supplied in tape-and-reel packaging, 620 parts per reel, 13" diameter reel Product Specifications Part Number7 FP1206R1-R12-R FP1206R1-R15-R FP1206R1-R25-R FP1206R1-R30-R FP1206R1-R40-R OCL1 FLL2 10% (nH) 120 150 250 300 400 Min. (nH) 86 108 180 216 288 Irms3 (Amps) 50 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01Vrms, Isat1 3 Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 4 Isat1: Peak current for approximately 20% rolloff at +25C. 0409 BU-SB09349 Isat14 (Amps) @25C 88 70 43 34 24 Isat25 (Amps) @125C 65 51 32 26 19 DCR (m) @20C 0.43 6.5% K-factor6 358 358 358 358 358 5 Isat2: Peak current for approximately 20% rolloff at +125C. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), I (Peak-to-peak ripple current in amps). 7 Part Number Definition: FP1206Rx-Rxx-R * FP1206 = Product code and size * Rx= DCR indicator * Rxx= Inductance value in uH, R = decimal point * -R suffix = RoHS compliant Page 1 of 4 Data Sheet: 4366 Dimensions - mm T op V iew S id e V iew 6 .0 m ax a B o tto m V iew 7 .7 0.3 S ch em atic R eco m m ended P ad Layout 2 .0 0.2 2 .8 0.2 4 .5 2 .5 1 1206Rx R xx w w llyy R 7 .7 typ. 1 1 .7 0.3 7.5 2 b The nominal DCR is measured between points "a" and "b" Part Marking: Coiltronics logo 1206Rx (Rx is the DCR indicator) Rxx = Inductance value in H. (R = Decimal point). wwllyy = Date code R = Revision level Packaging Information - mm 1.5 dia 4.0 2.0 1.75 A 1.5 dia 11.5 12.4 24.0 0.3 1206Rx Rxx wwllyy R 6.4 16.0 8.4 A User direction of feed S ection A -A Supplied in tape-and-reel packaging, 620 parts per reel, 13" diameter reel. Temperature Rise vs.Total Loss 60 T em p eratu re R ise (C ) 50 40 30 20 10 0 0 0.5 1 1.5 2 T o tal L o s s (W ) 0409 BU-SB09349 Page 2 of 4 Data Sheet: 4366 2.5 Core Loss C o re L o s s v s . Bp -p 10 1 M Hz 500 kH z 3 0 0 2 00 kH z k H z 100 kHz C o re L o ss (W ) 1 0.1 0.01 0.001 0.0001 100 1000 10000 Bp -p (G au ss ) Inductance Characteristics % o f O C L vs. % o f I sat1 100% % of O CL 80% -40C 60% 40% +25C +125C 20% 0% 0% 20% 40% 60% 80% 100% 120% % o f I s a t1 0409 BU-SB09349 Page 3 of 4 Data Sheet: 4366 140% Solder Reflow Profile TP TC -5C Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Package Thickness <2.5mm _2.5mm > TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) tP t Volume mm3 <350 235C 220C Volume mm3 _ >350 220C 220C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness <1.6mm 1.6 - 2.5mm >2.5mm ts 25C Time 25C to Peak Volume mm3 <350 260C 260C 250C Volume mm3 350 - 2000 260C 250C 245C Volume mm3 >2000 260C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak * Temperature min. (Tsmin) Standard SnPb Solder 100C Lead (Pb) Free Solder 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25C to Peak Temperature 60-120 Seconds 60-120 Seconds 3C/ Second Max. 3C/ Second Max. 183C 60-150 Seconds 217C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6C/ Second Max. 6C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Suite F Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire * LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. (c) 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com 0409 BU-SB09349 Page 4 of 4 Data Sheet: 4366