Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• Point of load modules
• DCR current sensing
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(with derated current)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape-and-reel packaging, 620 parts per reel,
13” diameter reel
Description
• Halogen free
• 125°C maximum total temperature operation
• 8.0 x12.0 x 6.0mm surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Designed for high speed, high current switch mode applications
• Controlled DCR tolerance for sensing circuits
• Inductance range from 120nH to 400nH
• Current range from 24 to 88 amps
• Frequency range up to 1MHz
• RoHS compliant
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1206 Series
0409 BU-SB09349 Page 1 of 4 Data Sheet: 4366
SMD Device
SMD Device
HALOGEN
HF
FREE
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, .01Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the
end application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3.B
p-p:(Gauss), K:
(K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps).
7 Part Number Definition: FP1206Rx-Rxx-R
• FP1206 = Product code and size
• Rx= DCR indicator
• Rxx= Inductance value in uH, R = decimal point
• -R suffix = RoHS compliant
Product Specifications
Part OCL1FLL2Irms3Isat14Isat25DCR (mΩ)
Number7± 10% (nH) Min. (nH) (Amps) (Amps) @25°C (Amps) @125°C @20°C K-factor6
FP1206R1-R12-R 120 86 88 65 358
FP1206R1-R15-R 150 108 70 51 358
FP1206R1-R25-R 250 180 50 43 32 0.43 ± 6.5% 358
FP1206R1-R30-R 300 216 34 26 358
FP1206R1-R40-R 400 288 24 19 358
Top View
Side View Bottom View Recommended Pad Layout Schematic
1
2
7.5
2.5
4.5
2.8
± 0.2
2.0
± 0.2
7.7
typ.
b
a
6.0
max
11.7
± 0.3
7.7
± 0.3
1206Rx
Rxx
wwllyy R
Dimensions - mm
User direction of feed
S ection A -A
A
A
6.4
1.5 dia
1.5 dia
4.0
2.0
16.0
1.75
11.5
24.0
± 0.3
12.4
8.4
1206Rx
Rxx
wwllyy R
0
10
20
30
40
50
60
0 0.5 1 1.5 2 2.5
Total Loss (W)
Temperature Rise (°C)
Part Marking: Coiltronics logo 1206Rx (Rx is the DCR indicator) Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level
Supplied in tape-and-reel packaging, 620 parts per reel, 13” diameter reel.
Packaging Information - mm
Temperature Rise vs.Total Loss
0409 BU-SB09349 Page 2 of 4 Data Sheet: 4366
The nominal DCR is measured between points “a” and “b”
0409 BU-SB09349 Page 3 of 4 Data Sheet: 4366
Core Loss vs. B
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (G auss)
Core Loss (W)
1
MHz
500
kH z
300
kH z
200
kHz
100
kHz
p-p
p-p
% of OCL vs. % of Isat
1
0%
20%
40%
60%
80%
100%
0% 20% 40% 60% 80% 100% 120% 140%
% of Isat
1
% of OCL
+25°C
-40°C
+125°C
Inductance Characteristics
Core Loss
© 2009 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
0409 BU-SB09349 Page 4 of 4 Data Sheet: 4366
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
T
a
a
b
b
l
l
e
e
1
1
-
-
S
S
t
t
a
a
n
n
d
d
a
a
r
r
d
d
S
S
n
n
P
P
b
b
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume
Packagemm
3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
T
a
a
b
b
l
l
e
e
2
2
-
-
L
L
e
e
a
a
d
d
(
(
P
P
b
b
)
)
F
F
r
r
e
e
e
e
S
S
o
o
l
l
d
d
e
e
r
r
(
(
T
T
c
c
)
)
Volume Volume Volume
Packagemm
3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
A
verage ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
A
verage ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
