1
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Primary Applications
Product Description
Key Features
900 MHz Low Noise Application
Board Performance
DC-4 GHz Packaged Power pHEMT
Bias conditions: Vd = 5 V, Idq = 150 mA, Vg = -0.8 V Typical
•Frequency Range: DC-4 GHz
•Package Dimensions: 4.5 x 4 x 1.5 mm
Nominal 900 MHz Low Noise Application Board
Performance:
•OTOI: 39.5 dBm
•Noise Figure: 0.6dB
•Gain: 16dB
•P1dB: 26.5dBm
•Input Return Loss: -8 dB
•Output Return Loss: -18 dB
•Bias: Vd = 5 V, Id = 150 mA, Vg = -0.8 V
(Typical)
•Cellular Base Stations
•WiMAX
•Wireless Infrastructure
•Low Noise Amplifiers
The TGF2021-04-SD is a high performance
pseudomorphic High Electron Mobility GaAs
Transistor (pHEMT) housed in a low cost SOT89
surface mount package.
The device’s ideal operating point for low noise
operation is at a drain bias of 5 V and 150 mA. At
this bias at 900 MHz when matched into 50 ohms
using external components, this device is capable
of 16 dB gain, 0.6dB noise figure, and 39.5 dBm
output IP3.
The combination of high gain, low noise, and
excellent linearity makes this an ideal component
for use in a 3G or 4G receive chain.
Evaluation boards at 900 MHz are available.
RoHS and Lead-Free compliant
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Table II
Recommended Low Noise Operating Conditions
Table I
Absolute Maximum Ratings 1/
Symbol Parameter Value Notes
Vd-Vg Drain to Gate Voltage 15.0 V
Vd Drain Voltage 12.0 V 2/
Vg Gate Voltage Range -5 to 0 V
Id Drain Current 1800 mA 2/
|Ig| Gate Current Range 28 mA
Tch Channel Temperature 200 °C 1/
Pin Input Continuous Wave Power 31 dBm 2/
1/ These ratings represent the maximum operable values for this device. Stresses beyond those listed
under “Absolute Maximum Ratings” may cause permanent damage to the device and / or affect
device lifetime. These are stress ratings only, and functional operation of the device at these
conditions is not implied.
2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed the
maximum power dissipation listed in Table IV.
Symbol Parameter 1/ Typical Value
Vd Drain Voltage 5 V
Idq Drain Current 150 mA
Vg Gate Voltage -0.8 V
1/ See assembly diagram for bias instructions.
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Table III
RF Characterization Table
Symbol Parameter Test
Conditions
Minimum Nominal Maximum Units Notes
Gain Small Signal
Gain
900 MHz 14.0 16.0 17.0 dB 1/
IRL Input Return
Loss
900 MHz -8 dB 1/
ORL Output Return
Loss
900 MHz -18 dB 1/
Psat Saturated
Output Power
900 MHz 27.5 dBm 1/
P1dB Output Power
@1dB
compression
900 MHz 25.5 26.5 dBm 1/
TOI Output TOI 900 MHz 38.0 39.5 dBm 1/ 2/
NF Noise Figure 900 MHz 0.6 1.2 dB 1/
Bias: Vd = 5 V, Idq = 150 mA, Vg = -0.8 V, typical
1/ Using 900 MHz Application Board.
2/ IP3 measured at 900MHz, 8MHz spacing, RFout=3dBm/tone
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Table IV
Power Dissipation and Thermal Properties
THERMAL INFORMATION
Parameter Test Conditions T
CH
(°C)
θ
JC
(°C/W)
Tm
(hrs)
θ
JC
Thermal Resistance
(Channel to Backside of
Package)
V
D
= 4.5 V
I
D
= 150 mA
P
DISS
= 0.675 W
T
BASE
= 85 °C
98 19 8E+07
Note: Heat transfer is conducted through the bottom of the TGF2021-04-SD
package into the printed circuit board. Thermal resistance of board is
application dependent and is not included above.
5
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Device S-Parameters (device mounted as shown on Page 15)
Bias conditions Vd=5V, Ids=150mA, Vg=-0.8V typical
FREQ GHZ MAG[S11] ANG[S11] MAG[S21] ANG[S21] MAG[S12] ANG[S12] MAG[S22] ANG[S22]
0.2 0.932 -123.072 21.427 115.942 0.021 28.395 0.646 -162.037
0.3 0.923 -144 15.412 103.793 0.024 20.995 0.687 -168.797
0.4 0.925 -156.561 11.895 96.265 0.024 17.704 0.712 -173.53
0.5 0.919 -165.822 9.652 90.224 0.025 14.82 0.714 -177.448
0.6 0.921 -173.012 8.124 85.625 0.025 9.321 0.722 179.593
0.7 0.919 -178.888 6.922 81.155 0.027 7.333 0.724 177.605
0.8 0.917 176.252 6.152 76.901 0.026 7.538 0.723 175.297
0.9 0.917 171.831 5.473 74.167 0.027 5.507 0.729 173.971
1 0.91 167.67 4.914 71.157 0.026 5.744 0.728 171.727
1.1 0.913 164.057 4.492 67.99 0.027 2.806 0.729 169.556
1.2 0.91 159.687 4.141 64.777 0.027 3.81 0.731 167.568
1.3 0.911 156.568 3.772 61.779 0.027 2.984 0.729 166.375
1.4 0.911 153.572 3.559 58.565 0.027 1.561 0.728 164.845
1.5 0.909 150.565 3.298 55.316 0.027 1.23 0.731 163.193
1.6 0.909 147.435 3.09 52.976 0.029 1.256 0.73 162.211
1.7 0.908 144.315 2.925 50.204 0.028 -0.611 0.729 160.552
1.8 0.91 140.46 2.782 47.128 0.029 -0.344 0.726 159.282
1.9 0.909 138.172 2.636 44.653 0.029 -1.169 0.73 157.476
2 0.909 135.405 2.493 41.763 0.03 -2.66 0.724 155.587
2.1 0.914 132.151 2.382 39.061 0.03 -4.208 0.732 154.236
2.2 0.901 129.373 2.296 36.38 0.031 -4.136 0.728 152.488
2.3 0.907 126.779 2.208 34.013 0.03 -5.268 0.734 151.519
2.4 0.908 123.836 2.1 31.669 0.032 -6.796 0.729 149.732
2.5 0.904 120.979 2.031 27.603 0.031 -8.985 0.728 148.29
2.6 0.908 118.128 1.97 25.477 0.032 -8.646 0.724 146.869
2.7 0.902 115.242 1.878 23.232 0.033 -8.753 0.717 145.427
2.8 0.899 111.949 1.84 20.16 0.033 -10.664 0.718 144.608
2.9 0.905 109.87 1.772 17.535 0.034 -12.762 0.719 142.216
3 0.904 106.959 1.72 14.591 0.034 -13.733 0.724 140.595
3.1 0.903 104.385 1.657 11.908 0.034 -15.628 0.719 139.267
3.2 0.908 101.359 1.631 9.029 0.035 -16.881 0.727 137.618
3.3 0.903 98.561 1.567 6.636 0.035 -17.376 0.72 135.872
3.4 0.898 95.964 1.516 4.466 0.036 -19.167 0.723 134.591
3.5 0.901 93.255 1.48 1.046 0.036 -20.739 0.72 132.781
3.6 0.902 90.562 1.452 -0.991 0.037 -20.869 0.721 131.451
3.7 0.906 87.974 1.403 -3.95 0.037 -21.813 0.709 130.368
3.8 0.905 84.898 1.378 -6.245 0.038 -23.159 0.716 128.457
3.9 0.9 82.083 1.336 -9.121 0.039 -24.762 0.719 127.044
4 0.897 79.696 1.311 -11.46 0.039 -27.234 0.722 125.654
4.1 0.908 77.169 1.305 -14.814 0.039 -28.915 0.725 123.914
4.2 0.904 74.425 1.265 -16.441 0.039 -29.261 0.717 121.907
4.3 0.901 71.483 1.238 -20.308 0.04 -31.042 0.72 120.176
4.4 0.893 68.717 1.194 -22.153 0.04 -34.044 0.716 118.433
4.5 0.895 66.877 1.2 -25.013 0.041 -35.162 0.714 116.198
4.6 0.9 63.721 1.157 -27.589 0.041 -37.19 0.704 114.38
4.7 0.898 60.691 1.135 -30.031 0.04 -37.632 0.713 112.974
4.8 0.896 57.165 1.119 -32.131 0.041 -38.749 0.721 111.711
4.9 0.89 55.163 1.102 -34.891 0.042 -40.297 0.724 109.731
5 0.892 51.923 1.083 -38.623 0.042 -43.138 0.718 108.428
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Gmax and K factor
Device mounted as shown on Page 15
Bias conditions: Vd = 5 V, Idq = 150 mA, Vg = -0.8 V Typical
7
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Measured Data 900 MHz Application Board
Bias conditions: Vd = 5 V, Id = 150 mA, Vg = -0.8 V Typical
Gain
Return Loss
8
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Measured Data, 900 MHz Application Board (at 850MHz)
Bias Conditions: Vdd = 5V
Gain, Noise Figure and OTOI vs. Ids
9
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Bias conditions: Vd = 5 V, Idq = 150 mA, Vg = -0.8 V Typical
Measured Data 900 MHz Application Board
P1dB and Psat vs. Frequency
10
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Bias conditions: Vd = 5 V, Idq = 150 mA
(measured at constant drain current using active bias circuit)
Device case temperature = 30oC above baseplate
Measured Data 900 MHz Application Board
Gain and noise figure vs. temperature (at 850MHz)
OIP3 and P1dB vs. temperature (at 850MHz)
11
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Bias Procedures
123
2
Bias-up Procedure
Vg set to -2.5 V
Vd set to +5 V
Adjust Vg more positive until Idq is 150 mA. This will be at approximately Vg = -0.8 V
Apply RF signal to input
Bias-down Procedure
Turn off RF signal at input
Reduce Vg to -2.5V. Ensure Id ~ 0 mA
Turn Vd to 0 V
Turn Vg to 0 V
Pin Signal
1 RF In (Gate)
2 Gnd (Source)
3 RF Out (Drain)
Electrical Schematic
12
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Mechanical Drawing
Units: Millimeters
13
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Evaluation Board Schematic – 900 MHz
Evaluation Board Layout
Board dimensions: 33.0 x 25.4mm
14
TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Evaluation Board Bill of Materials
C1: 4.7pF 0805 AVX 08052U4R7CAT2A
C2: 2.7pF 0805 AVX 08052U2R7BAT2A
C3 27pF 0805 AVX 08052U270GAT2A
C4: 0.47uF 0805
C5: 3.3pF 0805 AVX 08052U3R3BAT2A
C6: 27pF 0805 AVX 08052U270GAT2A
C7: 1.0uF 0805
C8: 27pF 0805 AVX 08052U270GAT2A
R1: 47R 0603
R2: 3R3 0805
L1: 22nH 0805 AVX L0805220JESTR
L2: 22nH 0805 AVX L0805220JESTR
L3: ~0.5nH, realised on board with one source via
TRL1: transmission line: w=0.75mm, l=15.8mm
TRL2: transmission line: w=0.75mm, l=16.1mm
Board material – FR4, 0.79mm thick
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
1/ The lowest possible thermal and electrical resistance for Pin 2 is critical for optimal performance. The array
of vias under Pin 2 should be as small and as dense as the PC board fabrication permits. 0.30 mm diameter
vias on 0.60 mm center to center spacing is recommended.
2/ Mounting screws in the vicinity of the package improve heat transfer to the chassis or to a heat spreader
located on the backside of the PC board. Shown are clearance holes and solder mask keepout zone for an
M2.5 socket head cap screw. Use of a split lockwasher and proper torque on the screw will prevent
compression damage to the PC board.
3/ Use of 1 oz copper (min) in the PC board construction is recommended.
4/ For lowest thermal resistance, solder mask must be removed where the copper traces on the PC board
contact the heat spreader. In this example, this would be a) backside of the PC board and b) front of the PC
board around package pin 2.
GaAs FET devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Recommended Assembly Diagram
2.6 mm Ø CLEARANCE HOLE
FOR M2.5 SOCKET HEAD CAP SCREW (2/)
4.6 mm Ø SOLDERMASK
KEEPOUT FOR LOCKWASHER (4/)
SOT-89 PACKAGE OUTLINE
ARRAY OF VIAS (1/)
7.6 X 7.6 mm COPPER AREA (3/)
1 2 3
Assembly Notes
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TGF2021-04-SD
May 2012 © Rev C
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
Ordering Information
Part Package Style
TGF2021-04-SD SOT-89, BULK
TGF2021-04-SD-T/R SOT-89, TAPE AND REEL
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board and rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using solder paste for attachment. Follow solder paste and reflow oven vendors’
recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the
table below.
Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends
on PCB and component layout and should be well controlled to ensure consistent mechanical and
electrical performance.
Clean the assembly with alcohol after soldering.
Typical Solder Reflow Profiles
Reflow Profile SnPb Pb Free
Ramp-up Rate 3 °C/sec 3 °C/sec
Activation Time and
Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C
Time above Melting Point 60 – 150 sec 60 – 150 sec
Max Peak Temperature 240 °C 260 °C
Time within 5 °C of Peak
Temperature 10 – 20 sec 10 – 20 sec
Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec
