TYPICAL APPLICATION
10/94
FEATURES
Low-Cost Power Factor
Correction
Power Factor Great er Than 0.99
Few External Parts Required
Contro lled On-Tim e Boost PWM
Zero-Curr ent Switching
Limited Peak Current
Min and Max Frequenc y Limits
Starting Current Less Than 1mA
High-Current FET Drive Output
Under-Voltage Loc kout
DESCRIPTION
The UC1852 prov ides a low-cos t solution to active power-f actor correction ( PF C)
for systems that woul d otherwise draw high peak current pul ses from AC power
lines. This circuit implements zero-current switched boost conversion, producing
sinusoidal input currents with a mi nimum of external components, while keeping
peak current substant ia lly below that of fully-discont inuous convert ers.
The UC1852 provides controlled switch on-time to regulate the output bulk DC
voltage, an off-time defined by the boost inductor, and a zero-current sensing
circuit to react ivate the swit ch cycle. Even though sw itching frequency var ies with
both load and instantaneous line voltage, it can be maintained within a reasonable
range to minimize noise generation.
While allowing higher peak switch currents than continuous PFCs such as the
UC1854, th is devic e offer s less extern al circuitry and sma ller inductors, yet better
performanc e and easier line-noise filtering than discontinuous current PF Cs with
no sacrifice in c omplexity or c ost. The ability to obta in a power factor in excess of
0.99 makes the UC1852 an optimum choice f or low-cost applications in the 50 t o
500 watt power range. Protection features of these devices include under-voltage
lockout, output clamping, peak-current limiting, and maximum-frequency
clamping.
The UC1852 family is available in 8-pin plastic and ceramic dual in-line packages,
and in the 8-pin small outline IC package (SOIC). The UC1852 is specified for
operation from -55°C to +125°C, the UC2852 is specified for operation from -40 °C
to +8 5°C, and the UC3852 is specified for operation from 0°C to +70 °C.
UC1852
UC2852
UC3852
High Power-Fac tor Preregu lato r
UDG-92001
SOIC–8 (T OP VIEW )
D Package
Unless ot her w ise stated, VCC=24V, ISET =50k to GND, RAMP=1nF to GND, ISNS=
–0.1V, VFB conne cted to CO MP, no load on OU T, –55°C<Ta<+125°C for the UC18 52,
–40°C<Ta<+85°C f or the UC2852, and 0°C<Ta<+70°C f or the UC3852, and Ta=Tj.
UC1852
UC2852
UC3852
ELECTRI CAL CHARACTERI ST ICS
ABSOLUTE MAXIMUM RATINGS
Supply Voltag e (Lo w-im peda nce Sou rce )..........................30.0V
Supply Current (High-impedance Source)......................30.0mA
OUT Cur ren t, Peak..... .... .... .... .... .... . .... .... .... .... .... ... .... .... ....±1.0A
OUT Ener gy, Capa citive Load..... .... .... .... ....... .... .... .... .... ....5.0µJ
Input Voltage, ISNS............................................................±5.0V
Input Voltage, V F B.............................................–0.3V to +10.0V
COMP Current...............................................................±10.0mA
ISET Curr ent... .... . .... .... ... .... . .... .... ... .... . .... .... ... .... . .... .... ..–1 0.0m A
Power Dissipation at T a25°C (Note 3) ..............................1.0W
Storage Temperature .......................................–65°C to +150 °C
Lead Tem per at ur e (Soldering, 10 Sec onds )...................+300°C
Note 1: All voltage s with respe ct to GND (Pin 1).
Note 2: All curre nt s are posit ive in to the specified t erminal.
Note 3: Refers to DI L-8 Packa ge. Consu lt Packaging Sec tion of
Unitrod e In te gra ted C ircuit s datab ook f or the rmal lim ita tion s and
consider at io ns of pack age.
DIL–8 (TOP VIEW)
J or N Package
CONNECTI ON DIAGRA M
PARAMETER TEST CONDI TIO NS MIN. TYP. MAX. UNIT S
Time r Sect io n
ISET Voltage 4.5 5.0 5.5 V
RAMP Charge Current RAMP=2. 5V 88 98 108 µA
RAMP Discharg e Curr ent ISNS= –1. 0V, RAMP= 1 .0V 12 28 50 mA
RAMP Satur at ion Volt age ISNS= –1.0V, IRAMP=100µA0.006 0.200 V
RAMP Thres hold - Maximum Fre quen cy VFB=10V, CO MP open 0.92 1.02 1.12 V
RAMP Th res hold - PWM Comparato r 3 .9 4 .3 4 .8 V
Current Sense Co mparator
ISNS Resta rt Thresho ld –18 –10 –4 mV
ISNS Fa ult Th res hold –550 –450 –350 mV
ISNS Inpu t Current –100 –30 100 µA
Err or Am pli fier Sectio n
VFB Input Volta ge 4.6 5.0 5.3 V
VFB Input B ias Current –5.0 0 –0 .03 5.00 µA
COMP Sink Cur rent COMP= 7. 5V 10 mA
COMP Source Current COMP=2.5V –300 –175 –100 µA
COMP Clam p Voltage VFB=0.0V, CO MP open 9.2 10.0 10.6 V
OUT O utp ut
OUT Sat ura tion Voltag e High VCC=13V, IOUT= –200mA, RAMP=2V 0.5 1.7 2.5 V
OUT Sat ura tion Voltag e Low IOUT=200mA, ISNS= –1.0V 0.5 1.6 2.2 V
OUT Sat ura tion Voltag e Low @ 10m A I OUT=10mA, ISNS= –1.0V 0.05 0.40 V
OUT C lamp Voltag e IOUT= –200mA, RAMP=2V 10.0 12.0 14.5 V
OUT Volta ge dur ing UVLO I OUT=100mA, VCC=0V 0.5 1.0 2.2 V
Over al l Secti on
Inactive Supp ly Current VCC=10V 0.2 0.4 1.0 mA
Activ e Supply Cur rent 3 .0 6 .0 10.0 mA
VCC Clamp Voltage ICC=25mA 30 33 36 V
VCC Turn -On Threshold 14.5 16.3 17.5 V
VCC Turn -Off Threshold 10.5 11.5 13.0 V
VCC Threshold Hysteresis 3 5 7 V
UDG-92002
2
DETAILED BLOCK DIAGRAM
COMP: COMP is the output of the error ampli fier and the
input of the PWM comparator. To limit PWM on-ti me, this
pin is clamped to approximately 10V. To implement soft
start, the CO M P pin can be pulled low and ramped up with
a PNP transistor, a capacitor, and a resistor.
GND: Ground for all funct ions is through this pin.
ISET: The dominant function is of this pin is to program
RAMP charging current. RAMP charging current is
approximately 5V divided by the external resistor placed
from ISET to ground. Resistors in the range of 10k to
50k are recommended, producing currents in the range
of 10 0µA to 50 0µA.
A second function of ISET is as reference output. The ISET
pin is normally regulated to 5V ±10%. It is critical that this
pin only see the loading of the RAMP programming resistor,
but a high input-impedance comparator or amplifier may be
connected to this pin or to a tap on the RAMP programming
resistor if required.
The third funct ion of the IS ET pin is as a FAULT output . In
the event of an over-c urrent fault, the ISET pin is forced to
approximately 9V by the fault comparator. This can be used
to trip an external protection circuit which can disable the
load or start a fault rest art cyc le.
ISNS: Th is input to the zero and over curr ent com parator s
is specially built to allow operation over a ±5V dynamic
range. In noisy systems or systems with very high Q
inductors, it is desirable to filter the signal entering the ISNS
input to prevent premature restart or fault cycles. For best
accuracy, ISNS should be connected to a current sense
resistor through no more than 200 ohm s.
OUT: The out put of a high-c urrent power driver capable of
driving the gate of a power MOSFET with peak currents
exceeding ±500mA. To prevent damage to the power
MOSFET, the OUT pin is internally driven by a 12V supply.
However, lead inductance between the OUT pin and the
load can cause overshoot and ringing. External current
boost t ransistors will increase t his overshoot and ringing. If
there is any significant distance between the IC and the
MOSFET, external clamp diodes and/or series damping
resistors may be required. OUT is actively held low when
the VCC is below the UVLO thr eshold.
RAMP: A controlled on-time PW M requires a timer whose
time can be modulated by an external voltage. The timer
current is programmed by a resistor from ISET to GND. A
capacitor from RAMP to GND sets the on time in
conjunction with the voltage on COMP. Recommended
values for the timer capacitors are between 100pF and 1nF.
VCC: VCC is the logic and control power connection for this
device. VCC current is the sum of active device supply
current and the average OUT current. Knowing the
maximum operating frequency and the MOSFET gate
charge (Qg), average OUT current can be estimated by:
IOUT = Q g × F
To prevent noise problems, bypass VCC to GND with bot h
a ceramic and an electrolytic capacitor .
VFB: VFB is the error amplifier inverting input. This input
serves as both the voltage sense input to the error amplifier
UC1852
UC2852
UC3852
PIN DESCRIPTIONS
UDG-92003
3
Max Frequency vs. Rset and Ct
Rset, k
Maximum
Frequency,
kHz
10
100
1000
1 10 100
100pF
500pF
1nF
3nF
OUT Rise and Fall Time
Load Capacitance, nF
ns
0
50
100
150
200
0510
Rise Time
Fall Time
Error Amplifier Gain and Phase
Frequency, kHz
Gain
(dB)
Phase
(deg)
-20
0
20
40
60
80
100
10 100 1000 10000
Phase
Gain
Max On-Time vs. Rset and Ct
Rset, k
Maximum
On-Time
µ
s
1
10
100
1000
1 10 100
100pF
300pF
1nF
3nF
10nF
UC1852
UC2852
UC3852
UDG-92006
UDG-92008
UDG-92005
TYPICAL CHARACTERISTICS
UDG-92007
4
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. MERRI MACK , NH 03054
TEL. (603) 424-2410 FAX (603) 424-3460
APPLI CATION INFO RMATIO N: A 100 Watt Power Factor Prere gul ator
This circuit demonstrates a complete power factor preregulator based on the UC3852. This preregulator will supply
up to 100 watts at 400VDC and exhibit power factor greater than 0.995 with less than 10% total harmonic distortion.
Operating input range is 90V to 160V RMS at 50Hz to 60Hz.
This design is intentionally simple, yet fully functional. The UC3852 can also be used in designs featuring soft start,
over-voltage protection, wide power-line voltage operation, and fault latching. For more information on applying
the UC3852, refer to Unitrode A pplication Note U–132.
PARTS LIST
UC1852
UC2852
UC3852
UDG-92004
C1 0.47µF/25 0VAC X2 C lass Polyester
C2 1n F/16V Cer am ic
C3 68µF/35V Aluminum Electrolytic
C4 180pF/16V Ceramic
C5 0.1µF/16V Polye ster or Cera mic
C6 82µF/45 0V A luminu m Electr olyt ic
D1 2A/50 0V Bridge Rectifier (Collmer
KBPC106 or Powertex MB11A02V60)
D2 100m A/5 0V Sw itchin g Diode (1N4148 )
D3 2A/50 0V 250n s Recov ery -Tim e Rect if ier
(Mo torola M R856 )
IC1 UC3852N Power Fact or Controller IC
Q1 IRF83 0 4.5A/ 500V 1.5 Power FET
L1 680µH ( Renco RL3792 with
10 Turn 24 AWG Secondary )
R1 150k, 14W
R2 0.2, 12W Carbon Composition
R3 10, 14W
R4 13.3k, 14W
R5 1M, 14W
R6 20k, 14W
R7 200k, 12W
R8 200k, 12W
5
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UC1852J OBSOLETE CDIP J 8 TBD Call TI Call TI
UC1852J883B OBSOLETE CDIP J 8 TBD Call TI Call TI
UC2852D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2852DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2852DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2852DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2852N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2852NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3852D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3852DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3852DTR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3852DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3852N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3852NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2852DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3852DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2852DTR SOIC D 8 2500 346.0 346.0 29.0
UC3852DTR SOIC D 8 2500 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2008
Pack Materials-Page 2
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