UC1852 UC2852 UC3852 High Power-Factor Preregulator FEATURES * Low-Cost Power Factor Correction * Power Factor Greater Than 0.99 * Few External Parts Required * Controlled On-Time Boost PWM * Zero-Current Switching * Limited Peak Current * Min and Max Frequency Limits * Starting Current Less Than 1mA * High-Current FET Drive Output * Under-Voltage Lockout DESCRIPTION The UC1852 provides a low-cost solution to active power-factor correction (PFC) for systems that would otherwise draw high peak current pulses from AC power lines. This circuit implements zero-current switched boost conversion, producing sinusoidal input currents with a minimum of external components, while keeping peak current substantially below that of fully-discontinuous converters. The UC1852 provides controlled switch on-time to regulate the output bulk DC voltage, an off-time defined by the boost inductor, and a zero-current sensing circuit to reactivate the switch cycle. Even though switching frequency varies with both load and instantaneous line voltage, it can be maintained within a reasonable range to minimize noise generation. While allowing higher peak switch currents than continuous PFCs such as the UC1854, this device offers less external circuitry and smaller inductors, yet better performance and easier line-noise filtering than discontinuous current PFCs with no sacrifice in complexity or cost. The ability to obtain a power factor in excess of 0.99 makes the UC1852 an optimum choice for low-cost applications in the 50 to 500 watt power range. Protection features of these devices include under-voltage lockout, output clamping, peak-current limiting, and maximum-frequency clamping. The UC1852 family is available in 8-pin plastic and ceramic dual in-line packages, and in the 8-pin small outline IC package (SOIC). The UC1852 is specified for operation from -55C to +125C, the UC2852 is specified for operation from -40C to +85C, and the UC3852 is specified for operation from 0C to +70C. TYPICAL APPLICATION UDG-92001 10/94 UC1852 UC2852 UC3852 CONNECTION DIAGRAM ABSOLUTE MAXIMUM RATINGS Supply Voltage (Low-impedance Source)..........................30.0V Supply Current (High-impedance Source) ......................30.0mA OUT Current, Peak .............................................................1.0A OUT Energy, Capacitive Load............................................ 5.0J Input Voltage, ISNS ............................................................5.0V Input Voltage, VFB............................................. -0.3V to +10.0V COMP Current ...............................................................10.0mA ISET Current..................................................................-10.0mA Power Dissipation at Ta25C (Note 3) ..............................1.0W Storage Temperature ....................................... -65C to +150C Lead Temperature (Soldering, 10 Seconds) ................... +300C Note 1: All voltages with respect to GND (Pin 1). Note 2: All currents are positive into the specified terminal. Note 3: Refers to DIL-8 Package. Consult Packaging Section of Unitrode Integrated Circuits databook for thermal limitations and considerations of package. DIL-8 (TOP VIEW) SOIC-8 (TOP VIEW) J or N Package D Package UDG-92002 ELECTRICAL CHARACTERISTICS Unless otherwise stated, VCC=24V, ISET=50k to GND, RAMP=1nF to GND, ISNS= -0.1V, VFB connected to COMP, no load on OUT, -55C<Ta<+125C for the UC1852, -40C<Ta<+85C for the UC2852, and 0C<Ta<+70C for the UC3852, and Ta=Tj. PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNITS 4.5 5.0 5.5 V Timer Section ISET Voltage RAMP Charge Current RAMP=2.5V 88 98 108 A RAMP Discharge Current ISNS= -1.0V, RAMP=1.0V 12 28 50 mA RAMP Saturation Voltage ISNS= -1.0V, IRAMP=100A RAMP Threshold - Maximum Frequency VFB=10V, COMP open RAMP Threshold - PWM Comparator 0.006 0.200 V 0.92 1.02 1.12 V 3.9 4.3 4.8 V Current Sense Comparator ISNS Restart Threshold -18 -10 -4 mV ISNS Fault Threshold -550 -450 -350 mV ISNS Input Current -100 -30 100 A 4.6 5.0 5.3 V -5.00 -0.03 5.00 Error Amplifier Section VFB Input Voltage VFB Input Bias Current A COMP Sink Current COMP=7.5V 10 mA COMP Source Current COMP=2.5V -300 -175 -100 A COMP Clamp Voltage VFB=0.0V, COMP open 9.2 10.0 10.6 V OUT Saturation Voltage High VCC=13V, IOUT= -200mA, RAMP=2V 0.5 1.7 2.5 V 0.5 OUT Output OUT Saturation Voltage Low IOUT=200mA, ISNS= -1.0V OUT Saturation Voltage Low @ 10mA IOUT=10mA, ISNS= -1.0V OUT Clamp Voltage IOUT= -200mA, RAMP=2V OUT Voltage during UVLO IOUT=100mA, VCC=0V VCC=10V 1.6 2.2 V 0.05 0.40 V 10.0 12.0 14.5 V 0.5 1.0 2.2 V 0.2 0.4 1.0 mA 3.0 6.0 10.0 mA 30 33 36 V Overall Section Inactive Supply Current Active Supply Current VCC Clamp Voltage ICC=25mA VCC Turn-On Threshold 14.5 16.3 17.5 V VCC Turn-Off Threshold 10.5 11.5 13.0 V 3 5 7 V VCC Threshold Hysteresis 2 UC1852 UC2852 UC3852 DETAILED BLOCK DIAGRAM UDG-92003 PIN DESCRIPTIONS accuracy, ISNS should be connected to a current sense resistor through no more than 200 ohms. COMP: COMP is the output of the error amplifier and the input of the PWM comparator. To limit PWM on-time, this pin is clamped to approximately 10V. To implement soft start, the COMP pin can be pulled low and ramped up with a PNP transistor, a capacitor, and a resistor. ISET: The dominant function is of this pin is to program RAMP charging current. RAMP charging current is approximately 5V divided by the external resistor placed from ISET to ground. Resistors in the range of 10k to 50k are recommended, producing currents in the range of 100A to 500A. OUT: The output of a high-current power driver capable of driving the gate of a power MOSFET with peak currents exceeding 500mA. To prevent damage to the power MOSFET, the OUT pin is internally driven by a 12V supply. However, lead inductance between the OUT pin and the load can cause overshoot and ringing. External current boost transistors will increase this overshoot and ringing. If there is any significant distance between the IC and the MOSFET, external clamp diodes and/or series damping resistors may be required. OUT is actively held low when the VCC is below the UVLO threshold. A second function of ISET is as reference output. The ISET pin is normally regulated to 5V 10%. It is critical that this pin only see the loading of the RAMP programming resistor, but a high input-impedance comparator or amplifier may be connected to this pin or to a tap on the RAMP programming resistor if required. RAMP: A controlled on-time PWM requires a timer whose time can be modulated by an external voltage. The timer current is programmed by a resistor from ISET to GND. A capacitor from RAMP to GND sets the on time in conjunction with the voltage on COMP. Recommended values for the timer capacitors are between 100pF and 1nF. The third function of the ISET pin is as a FAULT output. In the event of an over-current fault, the ISET pin is forced to approximately 9V by the fault comparator. This can be used to trip an external protection circuit which can disable the load or start a fault restart cycle. VCC: VCC is the logic and control power connection for this device. VCC current is the sum of active device supply current and the average OUT current. Knowing the maximum operating frequency and the MOSFET gate charge (Qg), average OUT current can be estimated by: ISNS: This input to the zero and over current comparators is specially built to allow operation over a 5V dynamic range. In noisy systems or systems with very high Q inductors, it is desirable to filter the signal entering the ISNS input to prevent premature restart or fault cycles. For best IOUT = Q g x F GND: Ground for all functions is through this pin. To prevent noise problems, bypass VCC to GND with both a ceramic and an electrolytic capacitor. VFB: VFB is the error amplifier inverting input. This input serves as both the voltage sense input to the error amplifier 3 UC1852 UC2852 UC3852 TYPICAL CHARACTERISTICS Error Amplifier Gain and Phase Max Frequency vs. Rset and Ct 100 1000 80 100pF 500pF 1nF Phase 3nF 60 Gain (dB) 40 Phase (deg) 20 Maximum Frequency, 100 kHz Gain 0 10 -20 10 100 1000 Frequency, kHz 1 10000 10 100 Rset, k UDG-92005 UDG-92006 Max On-Time vs. Rset and Ct OUT Rise and Fall Time 1000 200 Fall Time 150 100 Maximum On-Time s 10nF ns 100 3nF 10 1nF Rise Time 50 300pF 100pF 1 0 1 10 100 0 Rset, k 5 10 Load Capacitance, nF UDG-92007 UDG-92008 4 APPLICATION INFORMATION: A 100 Watt Power Factor Preregulator UC1852 UC2852 UC3852 UDG-92004 This circuit demonstrates a complete power factor preregulator based on the UC3852. This preregulator will supply up to 100 watts at 400VDC and exhibit power factor greater than 0.995 with less than 10% total harmonic distortion. Operating input range is 90V to 160V RMS at 50Hz to 60Hz. This design is intentionally simple, yet fully functional. The UC3852 can also be used in designs featuring soft start, over-voltage protection, wide power-line voltage operation, and fault latching. For more information on applying the UC3852, refer to Unitrode Application Note U-132. PARTS LIST C1 0.47F/250VAC X2 Class Polyester Q1 L1 IRF830 4.5A/500V 1.5 Power FET 680H (Renco RL3792 with 10 Turn 24 AWG Secondary) C2 1nF/16V Ceramic C3 68F/35V Aluminum Electrolytic C4 180pF/16V Ceramic R1 150k, 14W C5 0.1F/16V Polyester or Ceramic R2 0.2, 12W Carbon Composition C6 82F/450V Aluminum Electrolytic R3 10, 14W D1 2A/500V Bridge Rectifier (Collmer KBPC106 or Powertex MB11A02V60) R4 13.3k, 14W R5 1M, 14W D2 100mA/50V Switching Diode (1N4148) R6 20k, 14W D3 2A/500V 250ns Recovery-Time Rectifier (Motorola MR856) R7 200k, 12W IC1 UC3852N Power Factor Controller IC R8 200k, 12W UNITRODE INTEGRATED CIRCUITS 7 CONTINENTAL BLVD. * MERRIMACK, NH 03054 TEL. (603) 424-2410 * FAX (603) 424-3460 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) UC1852J OBSOLETE CDIP J 8 TBD Call TI Call TI UC1852J883B OBSOLETE CDIP J 8 TBD Call TI Call TI UC2852D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2852DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2852DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2852DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2852N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2852NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3852D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3852DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3852DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3852DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3852N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3852NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UC2852DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UC3852DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2852DTR SOIC D 8 2500 346.0 346.0 29.0 UC3852DTR SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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