All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS Board to Board Connector
QG23 Series
Receptacle, S/T, SMT Type
0.4mm [.0157”] Pitch
0.9mm [.0354”] Mated
Height
Mechanical
CONNECTOR MATING FORCE: 170 gf/pin MAX.
CONNECTOR UNMATING FORCE: 10 gf/pin MIN.
Durability: 20 cycles
Electrical
Operating Voltage: 30V AC RMS max.
Current Rating: 0.3A max.
Contact Resistance: 100m
Ω
max.
Dielectric Withstanding Voltage: 100V AC/1 min.
Insulation Resistance: 50M
Ω
Physical
Housing: Hi-Temp. Thermoplastic, UL 94V-0 rated in Black Color
Contact: BeCu
Plating: See “ORDERING INFORMATION”
Operating Temperature: -35
℃
to +85
℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: Q G 2 3 * * 4 3 1 Y - H04 - T R
Contact Pitch
40=40 Pin
2=Female
BTB Conn.
Number of Contact
3=S/T,SMT
Body & Terminal Type
Conn. Type
4=0.4MM Mating Height
3=0.9MM
Y=5~10u" Gold Plating
Variation Code
Package
Extension Code
Contact Area Plating
Running Number
TR=Tape & Reel
1=Without Anchor and Without
Boss and Withou t shielding
50=50 Pin
