07/2007
AWT6309
HELP2TM AWS/KPCS CDMA 3.4V/28dBm
Linear Power Amplifier Module
PRELIMINARY DA T A SHEET - Rev 1.3
M9 Package
8 Pin 3 mm x 3 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
FEATURES
• InGaP HBT Technology
• High Efficiency:
41 % @ +28 dBm output
22 % @ +17 dBm output
• Low Quiescent Current: 14 mA
• Low Leakage Current in Shutdown Mode: <1 μA
• Internal Voltage Regulation
• Optimized for a 50 Ω System
• Low Profile Miniature Surface Mount Package:
1 mm
• CDMA 1XRTT, 1xEV -DO Compliant
• Pinout Enables Easy Phone Board Migration
From 4 mm x 4 mm Package
• RoHS-Compliant Package, 250 oC MSL-3
APPLICATIONS
• AWS/KPCS CDMA Wireless Handsets and
Data Devices
PRODUCT DESCRIPTION
The AWT6309 meets the increasing demands for
higher efficiency and smaller footprint in CDMA 1X
handsets. The package pinout was chosen to
enable handset manufacturers to switch from a
4 mm x 4 mm PA module with few layout changes
while reducing board area requirements by 44%.
The AWT6309 uses ANADIGICS’ exclusive InGaP-
Plus™ technology, which combines HBT and
pHEMT devices on the same die, to enable state-of-
the-art reliability, temperature stability, and
ruggedness. The AWT6309 is part of ANADIGICS’
High-Efficiency-at-Low-Power (HELP™) family of
CDMA power amplifiers, which deliver low quiescent
currents and significantly greater efficiency without
a costly external DAC or DC-DC converter. Through
selectable bias modes, the AWT6309 achieves
optimal efficiency across different output power
levels, specifically at low- and mid-range power
levels where the PA typically operates, thereby
dramatically increasing handset talk-time and
standby-time. Its built-in voltage regulator eliminates
the need for external voltage regulation
components. The 3 mm x 3 mm x 1 mm surface mount
package incorporates matching networks optimized
for output power, efficiency, and linearity in a 50 Ω
system.
2PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
Figure 2: Pinout (X-ray T op View)
T able 1: Pin Description
PIN NAME DESCRIPTION
1V
BATT
Batter y Volta ge
2RF
IN
RF Input
3V
MODE
Mode Control Voltage
4V
EN
PA Ena ble Vo lta ge
5GNDGround
6GNDGround
7RF
OUT
RF O utput
8V
CC
S upp ly Volta g e
PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
3
ELECTRICAL CHARACTERISTICS
T able 2: Absolute Minimum and Maximum Ratings
Stresses in excess of the absolute ratings may cause permanent
damage. Functional operation is not implied under these conditions.
Exposure to absolute ratings for extended periods of time may
adversely affect reliability.
T able 3: Operating Ranges
The device may be operated safely over these conditions; however, parametric performance is guaranteed
only over the conditions defined in the electrical specifications.
Notes:
(1) For operation at VCC = +3.2 V, POUT is derated by 0.5 dB.
PARAMETER MIN MAX UNIT
Supp ly Volt ag e (V
CC
and V
BATT
)0+5V
Mode Control Voltage (V
MODE
)0+3.5V
Enab le Volta ge (V
EN
)0+3.5V
RF Input P ower ( P
IN
)-+10 dBm
Storage Temperature (T
STG
)-40+150°C
PARAMETER MIN TYP MAX UNIT COMMENTS
Operati ng Frequency (f) 1710 - 1780 MHz
Supply Voltage (V
CC
and V
BATT
) +3.2 +3.4 +4.2 V
Enable Vo ltage (V
EN
)+2.2
0+2.4
-+3.1
+0.5 VPA "o n"
PA "s hut d own"
Mod e Co ntrol Volt ag e (V
MODE
)
+2.2
0+2.4
-+3.1
+0.5 VLow Bi as Mode
Hig h Bias Mode
RF Outp ut P o we r (P
OUT
) 27.5
(1)
+28.0 - dBm
Case Temperature (T
C
)-30-+85°C
4PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
T able 4: Electrical Specifications - CDMA Operation
(TC = +25 °C, VBATT = VCC = +3.4 V, VEN = +2.4 V, 50 ΩΩ
ΩΩ
Ω system, IS-95 uplink waveform)
Notes:
1. ACPRs and Efficiency Limits apply at 1745 MHz (IS-95 modulation).
PARAMETER MIN TYP MAX UNIT COMMENTS
Gain 25
13
13
27
15
15
30
17
17 dB
POUT = +28 dB m, VMODE = 0 V
POUT = +17 dBm, VMODE = +2.4 V
POUT = +18 dBm, VMODE = +2.4 V,
VCC = +3.7 V
Adja ce nt Channe l Power
at +1.25 MHz offset
Primary Channel BW - 1.23 MHz
Adja ce nt Channe l BW = 30 kHz -
-
-
-50
-54
-52
-47
-47
-47 dBc POUT = +28 d Bm, VMODE = 0 V
POUT = +17 dBm, VMODE = +2.4 V
POUT = +18 dBm, VMODE = +2.4 V,
VCC = +3.7 V
Adja ce nt Channe l Power
at +2.25 MHz offset
Primary Channel BW - 1.23 MHz
Adja ce nt Channe l BW = 30 kHz -
--62
-60 -57
-57 dBc POUT = +2 8 dBm, VMODE = 0 V
POUT = +17 dBm, VMODE = +2.4 V
Power-Added E fficiency 37
18 41
22 -
-%POUT = +28 dB m, VMODE = 0 V
POUT = +17 dBm, VMODE = +2.4 V
Quie scent Current (Icq) - 14 20 mA through VCC pin, VMODE = +2.4 V
Enable Current - 0.3 0.8 mA through V EN pin, PA "on"
Mo d e Contro l C urre nt - 0 .3 0 .8 mA through VMODE pin, VMODE = +2.4 V
Battery C urrent - 2.5 5 mA through VBATT pin, V MODE = +2.4 V
Leakage Current - <1 5 µA VCC = +4.2 V, V EN = 0 V,
VMODE = 0 V
Noi se in Receive Band -
-
-
-132
-136
-136
-131
-135
-134 dBm/Hz 1840 MHz to 1870 MHz
2110 MHz to 2155 MHz
1574 MHz to 1577 MHz
Harmonics
2fo
3fo, 4fo -
--40
-55 -30
-30 dBc
Input Impedance - - 2:1 VS WR
Spurious Out put Le vel
( al l spur ious out put s) ---65dBc
POUT < +28 dBm
In-band load VSWR < 5:1
Out-of-band load VS WR < 10 :1
Applies over all operating rang es
Load mismatch stress with no
permanent degradati on or failure 8:1 - - V SWR Applies over full operating range
PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
5
APPLICA TION INFORMA TION
To ensure proper performance, refer to all related
Application Notes on the ANADIGICS web site:
http://www.anadigics.com
Shutdown Mode
The power amplifier may be placed in a shutdown
mode by applying logic low levels (see Operating
Ranges table) to both the VEN and VMODE voltages.
T able 5: Bias Control
Bias Modes
The power amplifier may be placed in either a Low
Bias mode or a High Bias mode by applying the
appropriate logic level (see Operating Ranges table)
to the VMODE voltage. The Bias Control table lists the
recommended modes of operation for various
applications.
Figure 3: Application Circuit
APPLICATION P
OUT
LEVELS LOGIC V
EN
V
MODE
CDMA - low power <+17 dBm Low +2.4 V +2.4 V
CDMA - hi g h power >+17 dB m Hi g h +2.4 V 0 V
Shutdown - Shutdown 0 V 0 V
6PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
P ACKAGE OUTLINE
Figure 4: M9 Package Outline - 8 Pin 3 mm x 3 mm x 1 mm Surface Mount Module
Figure 5: Branding Specification
PRELIMINARY DATA SHEET - Rev 1.3
07/2007
AWT6309
7
COMPONENT P ACKAGING
T able 6: T ape & Reel Dimensions
Figure 6: T ape & Reel Packaging
PACKAGE TYPE TA PE WIDTH POC KET PITCH REEL CAPACITY MAX REEL DIA
3 mm x 3 mm x 1 mm 12 mm 4 mm 2500 7"
WARNING
ANADIGICS products are not intended for use in life support appliances, devices or systems. Use of an ANADIGICS
product in any such application without written consent is prohibited.
IMPORTANT NOTICE
ANADIGICS, Inc.
141 Mount Bethel Road
Warren, New Jersey 07059, U.S.A.
Tel: +1 (908) 668-5000
Fax: +1 (908) 668-5132
URL: http://www.anadigics.com
E-mail: Mktg@anadigics.com
ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without
notice. The product specifications contained in Advanced Product Information sheets and Preliminary Data Sheets are
subject to change prior to a product’s formal introduction. Information in Data Sheets have been carefully checked and are
assumed to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges
customers to verify that the information they are using is current before placing orders.
PRELIMINARY DATA SHEET - Rev 1.3
07/2007
8
AWT6309
ORDERING INFORMA TION
ORDER NUMBER TEMPERATURE
RANGE PACKAGE
DESCRIPTION COMPONENT PACKAGING
AWT6309RM9Q7 -30 °C to +85 °C Ro HS-Com pliant 8 Pin
3 mm x 3 mm x 1 mm
Surface Mount Module Tape and Reel, 2500 pieces per Reel
AWT6309RM9P9 -30 °C to +85 °C RoHS-Co m pliant 8 Pin
3 mm x 3 mm x 1 mm
Surface Mount Module Partial Tape and Teel
