Ver. 201007 Multilayer Power Inductor CIG21F Series (2012/ EIA 0805) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability 0.9~1.6mm 0.8~ 1.2mm 2.0~3.6mm DIMENSION Type 21 Dimension [mm] L W t d 2.00.1 1.250.1 0.5max 0.5+0.2 -0.3 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance() Max. CIG21FR47MNC 0805/2012 0.47 20 % 0.12 25 % 1.10 CIG21F1R0MNC 0805/2012 1.0 20 % 0.19 25 % 0.80 CIG21F1R5MNC 0805/2012 1.5 20 % 0.25 25 % 0.70 CIG21F2R2MNC 0805/2012 2.2 20 % 0.34 25 % 0.60 Rated Current: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:20) Operating temperature range -40 to +85C Test equipment:Agilent 4291B+16193A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201007 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 21 (3) F (4) 1R0 (5) M (6) N (7) C (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (F:Low Profile) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 4000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.