LM321
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SNOS935B FEBRUARY 2001REVISED MARCH 2013
LM321 Low Power Single Op Amp
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1FEATURES DESCRIPTION
The LM321 brings performance and economy to low
2 (VCC = 5V, TA= 25°C. Typical values unless power systems. With a high unity gain frequency and
specified.) a specified 0.4V/µs slew rate, the quiescent current is
Gain-Bandwidth Product 1MHz only 430µA/amplifier (5V). The input common mode
Low Supply Current 430µA range includes ground and therefore the device is
able to operate in single supply applications as well
Low Input Bias Current 45nA as in dual supply applications. It is also capable of
Wide Supply Voltage Range +3V to +32V comfortably driving large capacitive loads.
Stable With High Capacitive Loads The LM321 is available in the SOT-23 package.
Single Version of LM324 Overall the LM321 is a low power, wide supply range
performance op amp that can be designed into a
APPLICATIONS wide range of applications at an economical price
without sacrificing valuable board space.
Chargers
Power Supplies
Industrial: Controls, Instruments
Desktops
Communications Infrastructure
Connection Diagram Application Circuit
SOT-23 DC Summing Amplifier
(VIN's 0 VDC and VOVDC)
Top View
Where: V0= V1+ V2- V3- V4, (V1+V2)
(V3+ V4) to keep VO> 0 VDC
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2001–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM321
SNOS935B FEBRUARY 2001REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Differential Input Voltage ±Supply Voltage
Input Current (VIN <0.3V) (2) 50mA
Supply Voltage (V+- V) 32V
Input Voltage 0.3V to +32V
Output Short Circuit to GND,
V+15V and TA= 25°C (3) Continuous
Storage Temperature Range 65°C to 150°C
Junction Temperature (4) 150°C
Mounting Temperature
Lead Temp (Soldering, 10 sec) 260°C
Infrared (10 sec) 215°C
Thermal Resistance to Ambient (θJA) 265°C/W
ESD Tolerance (5) 300V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector base junction of
the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is
also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the op amps to go to
the V+voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and
normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than 0.36V (at
25°C).
(3) Short circuits from the output V+can cause excessive heating and eventual destruction. When considering short circuits to ground the
maximum output current is approximately 40mA independent of the magnitude of V+. At values of supply voltage in excess of +15V,
continuous short circuits can exceed the power dissipation ratings and cause eventual destruction.
(4) The maximum power dissipation is a function of TJ(MAX),θJA , and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
(5) Human Body Model, 1.5kin series with 100pF.
Operating Ratings (1)
Temperature Range 40°C to 85°C
Supply Voltage 3V to 30V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
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Electrical Characteristics
Unless otherwise specified, all limits specified for at TA= 25°C; V+= 5V, V= 0V, VO= 1.4V. Boldface limits apply at
temperature extremes.
Symbol Parameter Conditions Min Typ Max Units
(1) (2) (1)
VOS Input Offset Voltage (3) 2 7 mV
9
IOS Input Offset Current 5 50 nA
150
IBInput Bias Current (4) 45 250 nA
500
VCM Input Common-Mode Voltage Range V+= 30V (5) 0 V+- 1.5 V
For CMRR > = 50dB V+-2
AVLarge Signal Voltage Gain (V+= 15V, RL= 2k25 100 V/mV
VO= 1.4V to 11.4V) 15
PSRR Power Supply Rejection Ratio RS10k, 65 100 dB
V+5V to 30V
CMRR Common Mode Rejection Ratio RS10k65 85 dB
VOOutput Swing VOH V+= 30V, RL= 2k26 V
V+= 30V, RL= 10k27 28
VOL V+= 5V, RL= 10k5 20 mV
ISSupply Current, No Load V+= 5V 0.430 1.15 mA
0.7 1.2
V+= 30V 0.660 2.85
1.5 3
ISOURCE Output Current Sourcing VID = +1V, V+= 15V, 20 40 mA
VO= 2V 10 20
ISINK Output Current Sinking VID =1V 10 20
V+= 15V, VO= 2V 5 8 mA
VID =1V
V+= 15V, VO= 0.2V 12 100 µA
IOOutput Short Circuit to Ground V+= 15V 40 85 mA
(6)
SR Slew Rate V+= 15V, RL= 2k,
VIN = 0.5 to 3V 0.4 V/µs
CL= 100pF, Unity Gain
GBW Gain Bandwidth Product V+= 30V, f = 100kHz,
VIN = 10mV, RL=2k, 1 MHz
CL= 100pF
φm Phase Margin 60 deg
THD Total Harmonic Distortion f = 1kHz, AV= 20dB
RL= 2k, VO= 2VPP, 0.015 %
CL= 100pF, V+= 30V
enEquivalent Input Noise Voltage f = 1kHz, RS= 10040 nV/
V+= 30V
(1) All limits are specified by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) VO1.4V, RS= 0with V+from 5V to 30V; and over the full input common-mode range (0V to V+- 1.5V) at 25°C.
(4) The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
(5) The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25°C). The
upper end of the common-mode voltage range is V+- 1.5V at 25°C, but either or both inputs can go to +32V without damage,
independent of the magnitude of V+.
(6) Short circuits from the output V+can cause excessive heating and eventual destruction. When considering short circuits to ground the
maximum output current is approximately 40mA independent of the magnitude of V+. At values of supply voltage in excess of +15V,
continuous short circuits can exceed the power dissipation ratings and cause eventual destruction.
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Simplified Schematic
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Typical Performance Characteristics
Unless otherwise specified, VS= +5V, single supply, TA= 25°C.
Small Signal Pulse Response Large Signal Pulse Response
Supply Current Sinking Current
vs. vs.
Supply Voltage Output Voltage
Source Current
vs.
Output Voltage Open Loop Frequency Response
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APPLICATION HINTS
The LM321 op amp can operate with a single or dual power supply voltage, has true-differential inputs, and
remain in the linear mode with an input common-mode voltage of 0 VDC. This amplifier operates over a wide
range of power supply voltages, with little change in performance characteristics. At 25°C amplifier operation is
possible down to a minimum supply voltage of 3V.
Large differential input voltages can be easily accommodated and, as input differential voltage protection diodes
are not needed, no large input currents result from large differential input voltages. The differential input voltage
may be larger than V+without damaging the device. Protection should be provided to prevent the input voltages
from going negative more than 0.3 VDC (at 25°C).An input clamp diode with a resistor to the IC input terminal
can be used.
To reduce the power supply drain, the amplifier has a class A output stage for small signal levels which converts
to class B in a large signal mode. This allows the amplifiers to both source and sink large output currents.
Therefore both NPN and PNP external current boost transistors can be used to extend the power capability of
the basic amplifiers. The output voltage needs to raise approximately 1 diode drop above ground to bias the on-
chip vertical PNP transistor for output current sinking applications.
For AC applications, where the load is capacitively coupled to the output of the amplifier, a resistor should be
used, from the output of the amplifier to ground to increase the class A bias current and to reduce distortion.
Capacitive loads which are applied directly to the output of the amplifier reduce the loop stability margin. Values
of 50pF can be accommodated using the worst-case non-inverting unity gain connection. Large closed loop
gains or resistive isolation should be used if large load capacitance must be driven by the amplifier.
The bias network of the LM321 establishes a supply current which is independent of the magnitude of the power
supply voltage over the range of from 3 VDC to 30 VDC.
Output short circuits either to ground or to the positive power supply should be of short time duration. Units can
be destroyed, not as a result of the short circuit current causing metal fusing, but rather due to the large increase
in IC chip dissipation which will cause eventual failure due to excessive junction temperatures. The larger value
of output source current which is available at 25°C provides a larger output current capability at elevated
temperatures than a standard IC op amp.
The circuits presented in the section on typical applications emphasize operation on only a single power supply
voltage. If complementary power supplies are available, all of the standard op amp circuits can be used. In
general, introducing a pseudo-ground (a bias voltage reference of V+/2) will allow operation above and below this
value in single power supply systems. Many application circuits are shown which take advantage of the wide
input common-mode voltage range which includes ground. In most cases, input biasing is not required and input
voltages which range to ground can easily be accommodated.
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SNOS935B FEBRUARY 2001REVISED MARCH 2013
TYPICAL APPLICATIONS
Non-Inverting DC Gain (0V Input = 0V Output)
DC Summing Amplifier (V)
Amplitude Modulator Circuit (IN's 0 VDC and VOVDC)
Where: V0= V1+ V2- V3- V4, (V1+V2)(V3+ V4) to keep VO> 0
VDC
Power Amplifier LED Driver
V0= 0 VDC for VIN = 0 VDC, AV= 10
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Fixed Current Sources Lamp Driver
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SNOS935B FEBRUARY 2001REVISED MARCH 2013
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM321MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A63A
LM321MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A63A
LM321MFX NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 A63A
LM321MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A63A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM321MF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM321MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM321MFX SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Oct-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM321MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LM321MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM321MFX SOT-23 DBV 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Oct-2013
Pack Materials-Page 2
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