Actel CQFP – FBGA484 Adapter Boards
(SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484)
Contents
1). Introduction
2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly
instructions
3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
instructions
4). Appendix C -- Gull Wing Surface mount Foot Soldering Instructions
5). Appendix D – CQ256 Package Pin Assignment List
6). Appendix E – FG484 Package Pin Assignment List
1). Introduction
Actel CQFP- FBGA Adapter Boards
Introduction
Actel’s expanded Adapter Board offering allows for easy prototyping. The
CQFP to FBGA Adapter boards (SI-SX32-ACQ256SFG484 and SI-SX72-
ACQ256SFG484) are specifically built for prototyping for the SXA and SXS
families. This solution allows a customer to prototype with an A54SX32A-FG484
device and then for production switch to either an A54SX32A-CQ256 or an
RT54SX32S-CQ256 device. Likewise, customers can prototype with an
A54SX72A-FG484 device and then for production switch to either an A54SX72A-
CQ256 or an RT54SX72S-CQ256 device.
Figure 1. CQ256 to FG484 via CQFP to FBGA adapter board
Figure 2. Assembled “CQFP to FBGA adapter socket” Adapter Board with socket (SI-SX32-
ACQ256SFG484)
1
Figure 3. Before assembly of “CQFP to FBGA adapter socket” (SI-SX32-CQ256SFG484)
Top from left - adapter board, top frame
Bottom from left – compression plate, top lid
Assembly Procedure
The bottom piece of the adapter board should be soldered either reflow
soldered or manual soldered to the customer’s board based on Ironwood “Gull
Wing Surface mount Foot Soldering Instructions” in Appendix C (Figure 4). The
top frame can then be tightened to the bottom piece using a .05” wrench (figure
5). The programmed FG484 packaged part can then be placed on the top frame
(figure 6). Place the compression plate and top lid on top (figure 7 & 8). Secure
the top lid by tightening down with a .05” wrench (figure 9). Use the Pre-Set 3 in-
labs Torque-Limiting Screw Driver to apply force to compress the package (figure
10)
Figure 4. Assembly step 1- solder adapter board bottom to PCB
2
Figure 5. Assembly step 2 – tighten top frame with 0.5” wrench
Figure 6. Assembly step 3 – place in FG484 in socket
Figure 7. Assembly step 4 –place the compression plate on top of device
3
Figure 8. Assembly step 5 – put on top lid
Figure 9. Assembly step 6 – tighten top lid with .05” wrench
Figure 10. Assembly step 7 – tighten top compression screw using Pre-Set 3 lbf-in Torque
Limiting Screw driver
During prototyping, if the design code changes and a new FPGA device is
needed, it is very easy to remove the top lid and compression plate to replace the
FPGA. To insert a new-programmed part, just place it on the top frame and
replace the compression plate and top lid. This can be repeated multiple times
during the prototyping design phase.
4
NOTE:
1). For more detailed assembly information also refer to Ironwood
Electronics C4002 & C4228 assembly Instructions, online at
www.ironwoodelectronics.com
2). Torque Limiting Screw Driver can be Mountz, Inc product. Refer
Mountz, Inc products online at www.mountztorque.com
Mountz part #
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
5
2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and
Assembly instructions
Note:
Tighten top compression screw using preset 3 lbf-in Torque
Limiting Screwdriver.
Torque Limiting Screw Driver can be Mountz, Inc product
Refer Mountz, Inc products online at www.mountztorque.com
Mountz part#
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
0.5mm
Lead coplanarity
0.005" max.
15.67mm
[0.617"]
Side View
Description: BGA to QFP package converter
484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP, 0.5mm
gull-wing leads. Pin assignment: A54Sx32A CQ256 to A54SX72A FG484
DETAIL A
1
32.23mm
[1.269"]
3.54mm [0.139"]
3.16mm [0.124"]
41.9mm [1.650"]
41.9mm
[1.650"]
39.3mm
[1.547"]
1
27mm
10:4
Status: Released
Drawing: M. Tully
Scale: ______ Rev: B
Date: 10/2/01
Modified: 1/29/02, MT
File: C4228 Dwg.mcd
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
2.03mm
[0.080"] 0.28mm
[0.011"]
0.49mm [0.019"] 0.18mm [0.007"]
0.91mm
[0.036"] max.
1.3mm
[0.051"]
Leads: material- BeCu Alloy 194; plating- 80/20 SnPb.
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm [1/2
oz.] Cu clad. SnPb plating.
2
1
Specifications:
Operating Temperature Range (1) -40 ° C. to 55 ° C
Storage Temperature Range (1) -62 ° C. to 85 ° C
Solderability (2) 260 ° C, 5 sec. ma ximu m
Maximum Temperature, Substrate 290 ° C, 5 sec. maximum
260 ° C, 5 sec. maximum
Throug h path Resistance 10 milliohms at 200 mA
Packaging (3) Be st com mercial pra ctic es
(1) per Mil-STD-202, method 107, test condition A
(2) per Mil-STD-202, method 208 (soldering heat per Method 210, condition B)
(3) Packaging contains Ironwood Electronics part number, Ironwood Electronics name and quantity of parts per shipment
DETAIL A
12
2
15:1
Status: Released
Drawing: M. Tully
Scale: ______ Rev: B
Date: 10/2/01
Modified: 1/29/02, MT
File: C4228 Dwg.mcd
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
C4228 Assembly Instructions
1. Install th e socket base assembly (A) on the target PCB using the Gullwing Surface Mount Soldering Instruction document.
Solder procedure #2 or #3 are recommended to induc e the least amount of thermal stresses on the base adaptor
2. Place the Socket/El asto m e r asse m bly (B) on to the socket base, aligning the orientatio n mark on the asse m bly with the A1 indicator
on the adaptor board (see page 4 for details).
WARNING: ASSEMBLY (B) MUST BE REMOVED IF THE BASE WILL BE SUBJECT TO
REFLOW AGAIN. THE ELASTOMER WILL NOT WITHSTAND TEMPERATURES ABOVE 100
degrees C.
3. Using the 4 Hex head screws (C), attach the Socket / Elastom er assembly onto the socket base .
4. Place BGA package (solder bal l side down) into the socket. NOTE : BG A or ientation into socket is critical.
5. Place th e com pession plate (D), on top of the BGA package, ori ent at ion is not importa nt.
6. Install th e Socket Top asse mbly (E) by placing it over the socket lid screws and rotating.
7. Turn the compression screw (F) clockwi se, until it makes contact with the compression plate.
8. Using a torque limiting screw driver or wrench set to 3 in-lbs, tighte n th e com pression screw.
Socket Base
Assembly
Socket
Top Assembly
Compression Screw
Compression plate
BGA
Package
Socket Lid
3
TARGET PCB
Socket / Elastomer assembly
A
B
D
C
E
Hex head screw
Socket lid screws,
DO NOT ADJUST
F
63/37 SnPB
Eutictic or equivalent
low temperature solder
10:4
Status: Released
Drawing: M. Tully
Scale: ______ Rev: B
Date: 10/2/01
Modified: 1/29/02, MT
File: C4228 Dwg.mcd
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
4
Top view: Lid in initial attachment position
Noting BGA pin A1 orientation
(white silkscreen) on the
adaptor board and Socket /
Elastomer assembly orientation
mark, attach the assembly
onto the socket base
Side view
Socket / Elastomer assembly
with orientation mark
Note: The socket base assembly
will have to be assembled to the
Gull-wing adaptor board only
once. In use, the complete
adaptor will only require the lid
and compression plate to be
removed to exchange BGA IC’s
1
BGA pin A1
10:4
Status: Released
Drawing: M. Tully
Scale: ______ Rev: B
Date: 10/2/01
Modified: 1/29/02, MT
File: C4228 Dwg.mcd
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
5
Socket Lid: Black anodized 6061 Aluminum. Thickness = 2.0mm.
Socket base scre w: Socket head cap, 18-8 St ainles steel, 0-80 fine thread , 9.00mm long.
Elastomer Guide: Non-clad FR4. Thickness = 0.75mm.
Compression Plate: Black anodized 6061 Aluminum. Thickness = 2.5mm.
Elastomer: 30 mic ron dia go ld plated brass filaments arranged symmetrically in a
silicone rubber (63.5 deg ree angle). Thickness = 1.00mm.
Socket bas e: Black anodized 6061 Aluminum. Thickness = 5mm.
Ball Guide: Kapton poly imide.
Socket l id scre w: Socket head cap, 18-8 St ainless steel, 0-80 fine thread , 5.85mm lon g.
Compression screw: Black anodized 6061 Aluminum. Thickness = 5mm, Hex socket = 5mm.
1
2
3
4
5
6
7
8
9
2
341
5
6
7
8
9
Materials:
10:4
Status: Released
Drawing: M. Tully
Scale: ______ Rev: B
Date: 10/2/01
Modified: 1/29/02, MT
File: C4228 Dwg.mcd
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and
Assembly instructions
Note:
Tighten top compression screw using preset 3 lbf-in Torque
Limiting Screwdriver.
Torque Limiting Screw Driver can be Mountz, Inc product
Refer Mountz, Inc products online at www.mountztorque.com
Mountz part#
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
0.5mm
Lead coplanarity
0.005" max.
15.67mm
[0.617"]
Side View
Description: BGA to QFP package converter
484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP, 0.5mm
gull-wing leads.
DETAIL A
1
32.23mm
[1.269"]
3.54mm [0.139"]
3.16mm [0.124"]
41.9mm [1.650"]
41.9mm
[1.650"]
39.3mm
[1.547"]
1
27mm
Status: Released
Drawing: M. Tully
Scale: 1:0.4 Rev: E
Date: 6/5/01
Modified: 1/28/02 . MT
File: C4002 Dwg.mcd
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
2.03mm
[0.080"] 0.28mm
[0.011"]
0.49mm [0.019"] 0.18mm [0.007"]
0.91mm
[0.036"] max.
1.3mm
[0.051"]
Leads: material- BeCu Alloy 194; plating- 80/20 SnPb.
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm [1/2
oz.] Cu clad. SnPb plating.
2
1
Specifications:
Operating Temperature Range (1) -40 ° C. to 55 ° C
Storage Temperature Range (1) -62 ° C. to 85 ° C
Solderability (2) 260 ° C, 5 sec. ma ximu m
Maximum Temperature, Substrate 290 ° C, 5 sec. maximum
260 ° C, 5 sec. maximum
Throug h path Resistance 10 milliohms at 200 mA
Packaging (3) Be st com mercial pra ctic es
(1) per Mil-STD-202, method 107, test condition A
(2) per Mil-STD-202, method 208 (soldering heat per Method 210, condition B)
(3) Packaging contains Ironwood Electronics part number, Ironwood Electronics name and quantity of parts per shipment
DETAIL A
12
2
Status: Released
Drawing: M. Tully
Scale: 1:0.4 Rev: E
Date: 6/5/01
Modified: 1/28/02 . MT
File: C4002 Dwg.mcd
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
C4002 Assembly Instructions
1. Install th e socket base assembly (A) on the target PCB using the Gullwing Surface Mount Soldering Instruction document.
Solder procedure #2 or #3 are recommended to induc e the least amount of thermal stresses on the base adaptor
2. Place the Socket/El asto m e r asse m bly (B) on to the socket base, aligning the orientatio n mark on the asse m bly with the A1 indicator
on the adaptor board (see page 4 for details).
WARNING: ASSEMBLY (B) MUST BE REMOVED IF THE BASE WILL BE SUBJECT TO
REFLOW AGAIN. THE ELASTOMER WILL NOT WITHSTAND TEMPERATURES ABOVE 100
degrees C.
3. Using the 4 Hex head screws (C), attach the Socket / Elastom er assembly onto the socket base .
4. Place BGA package (solder bal l side down) into the socket. NOTE : BG A or ientation into socket is critical.
5. Place th e com pession plate (D), on top of the BGA package, ori ent at ion is not importa nt.
6. Install th e Socket Top asse mbly (E) by placing it over the socket lid screws and rotating.
7. Turn the compression screw (F) clockwi se, until it makes contact with the compression plate.
8. Using a torque limiting screw driver or wrench set to 3 in-lbs, tighte n th e com pression screw.
Socket Base
Assembly
Socket
Top Assembly
Compression Screw
Compression plate
BGA
Package
Socket Lid
3
TARGET PCB
Socket / Elastomer assembly
A
B
D
C
E
Hex head screw
Socket lid screws,
DO NOT ADJUST
F
63/37 SnPB
Eutictic or equivalent
low temperature solder
Status: Released
Drawing: M. Tully
Scale: 1:0.4 Rev: E
Date: 6/5/01
Modified: 1/28/02 . MT
File: C4002 Dwg.mcd
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
4
Top view: Lid in initial attachment position
Noting BGA pin A1 orientation
(white silkscreen) on the
adaptor board and Socket /
Elastomer assembly orientation
mark, attach the assembly
onto the socket base
Side view
Socket / Elastomer assembly
with orientation mark
Note: The socket base assembly
will have to be assembled to the
Gull-wing adaptor board only
once. In use, the complete
adaptor will only require the lid
and compression plate to be
removed to exchange BGA IC’s
1
BGA pin A1
Status: Released
Drawing: M. Tully
Scale: 1:0.4 Rev: E
Date: 6/5/01
Modified: 1/28/02 . MT
File: C4002 Dwg.mcd
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
5
Socket Lid: Black anodized 6061 Aluminum. Thickness = 2.0mm.
Socket base scre w: Socket head cap, 18-8 St ainles steel, 0-80 fine thread , 9.00mm long.
Elastomer Guide: Non-clad FR4. Thickness = 0.75mm.
Compression Plate: Black anodized 6061 Aluminum. Thickness = 2.5mm.
Elastomer: 30 mic ron dia go ld plated brass filaments arranged symmetrically in a
silicone rubber (63.5 deg ree angle). Thickness = 1.00mm.
Socket bas e: Black anodized 6061 Aluminum. Thickness = 5mm.
Ball Guide: Kapton poly imide.
Socket l id scre w: Socket head cap, 18-8 St ainless steel, 0-80 fine thread , 5.85mm lon g.
Compression screw: Black anodized 6061 Aluminum. Thickness = 5mm, Hex socket = 5mm.
1
2
3
4
5
6
7
8
9
2
341
5
6
7
8
9
Materials:
Status: Released
Drawing: M. Tully
Scale: 1:0.4 Rev: E
Date: 6/5/01
Modified: 1/28/02 . MT
File: C4002 Dwg.mcd
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC .
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-810 0
www.ironwoodelectronics.com
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolera nces ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
PAGE
____ of 5
4). Appendix C -- Gull Wing Surface mount Foot Soldering Instructions
Gull Wing Surface mount Foot Soldering Instructions
The gull wing style, surface mount foot (parts with a 'SF-'
prefix and a '-G' suffix) is designed to solder to a quad
flat pack (QFP) surface mount land pattern. The emulator
foot emulates the physical characteristics of a QFP gull
wing package very closely, allowing the foot to be
soldered to a target board land pattern using the methods
commonly employed in attaching actual QFP packages.
The recommended method is explained below with visual
aids showing the step-by-step process. This method has
produced very good results. Figure 1 shows the surface
mount emulator foot and a clean target printed circuit
board. The steps involved in the soldering process follow.
CAUTION: During secondary reflow (i.e. mounting the
emulator foot to a board), the temperature profile should
be tightly controlled. The gull wing leads are attached to
the emulator foot with 95/5 tin/silver solder(melting point
245°C). If the temperature during reflow exceeds 245°C,
it will cause bridging between the leads or create opens at
the clip head. The peak temperature during reflow should
not reach more than 240°C. Peaks to 260°C are allowed
only if the residence time is less that 40 seconds above
240°C. If you are attaching the emulator board to a target
board using a hot soldering iron, this can easily happen.
We strongly recommend that furnaces are profiled every
day.
Figure 1: Target PCB/Emulator Foot
REFLOW OVEN - Soldering method #1
(a) Determine an appropriate temperature solder paste for
your application.
(b) Apply a continuous bead of paste to the target PCB
pads as shown in Figure 2. Cover approximately 1/3 of the
pad between the center of the pad and the outer edge. Begin with this amount and add additional paste after
reflow, if necessary (excessive paste on an initial trial will
be difficult to remove).
Figure 2: Apply Solder Paste
Figure 3: Align foot on the lands
(c) Note the target PCB QFP land pattern and the
emulator foot Pin 1 locations.
(d) Align and place the emulator foot onto the solder
paste and land pattern as shown in Figure 3. 'Pick and
place' equipment or a vacuum pen, are recommended (if
they will accommodate the foot), but, handling the foot
by the gold pins and placing on the land pattern by hand
will suffice.
(e) Reflow target PCB with emulator foot in reflow oven
(convection, IR, etc.). The recommended reflow profile is
shown in the Figure 5. Time and temperature settings will
be determined by the manufactures of the solder paste and
Gull wing Surface mount Foot Soldering Instructions (continued)
reflow oven. The Ironwood gull wing foot has a larger thermal mass than an actual QFP package, and therefore,
may require longer reflow time and/or higher temperature
settings.
(f) Inspect solder fillets. Add additional solder paste to
solder deficient areas as needed or remove excess with
small tip solder iron and copper desoldering braid (Figure
4). If the solder has not completely reflowed, add solder
flux and repeat step (e).
Because of the construction of the emulator foot, a Low
Temperature solder paste must be used. Set reflow
equipment to the lowest setting that will reflow the solder
paste. Reflow the emulator foot with target assembly in a
temperature range of 185 - 210 degree C. This can be
varied depending upon the profile of the oven and the
customer assemblies. The above temperature range is safe
for soldering the emulator foot without thermal damage to
the foot. It is recommended that reflow oven be set for a minimum time initially. If reflow was not complete,
reflux and reflow for a longer duration.
Figure 4: Removing excess solder
250
200
150
100
50
0
100 200 300 400 500
Preheat Flux Activation Reflow Cool-Down
<2°C
per Second
150 - 180 Seconds
<2°C
per Second
1° to 3°C
per Second
Time (seconds)
Temperature
(°C)
Maximum Package Body Temperature
Solder Temperature Melting Point
Figure 5: Recommended Convection Oven Reflow Profile
HOT AIR TOOL - Soldering method #2
Repeat steps (a) through (d) in method #1. The surface tension present between the solder and the emulator
foot in method #1 will not be present in method #2, due to the fact that only a small portion of the solder in this
method will be liquid at one time. It is necessary therefore, to align the foot over the land pattern with greater
accuracy.
Page 2 of 4 reflow instruction, Rev. C
Gull wing Surface mount Foot Soldering Instructions (continued)
(e) Reflow, with a hot air wand/gun, the solder over a few of the pads in opposite corners (diagonally) of the land
pattern (Figure 6).
(f) Check the foot alignment.
(g) Continue by reflowing the remaining solder paste. Add or remove solder as needed (see step (f) in method
1.).
Figure 6: Reflow using hot air tool
SOLDERING IRON - Soldering method #3
This method has produced very good results but may be
more time consuming than the other two methods.
Caution must be used when touching the soldering iron
tip to the emulator foot. Excessive heat or pressure may
damage the pads on the side of the foot.
(a) Using a small diameter solder wire (approx. 0.015" or
smaller) and a very fine tipped soldering iron, add enough
solder to two opposite corner (diagonal) pads to cover
them.
(b) Align and place the emulator foot over the QFP land
pattern (see steps (c) and (d) in method 1).
(c) Holding the foot in place, by pressing down gently on
the gold terminal pins, place the iron tip on the two pads
to reflow the solder. This will tack and keep the foot in
alignment.
(d) Under a microscope or magnifying lens, if available, solder the remaining edge pads of the foot to the target
PCB land pattern using a liberal amount of solder (shorts
between adjacent pads can be removed later).
Figure 7: Finished Solder Fillets
(e) Apply a generous amount of flux along the side of the
foot.
(f) Tilt the PCB and emulator foot at 30 - 45 degree
angle. Start at one corner and pull the tip of the iron
along the side of the foot to remove excess solder
deposits. Clean the tip of the iron often. Repeat this step
several times starting at a point on the foot ahead of the
excess solder. Continue along the side of the foot until
shorts are removed and a fillet is present between feet
and target PCB pads.
(g) Repeat steps (e) and (f) for the remaining three sides.
The finished solder connections are shown in Figure 7.
reflow instruction, Rev. C
Removing or Desoldering
Conventional methods can be used to remove a surface mount foot from your
target board, however we recommend the use of PRB Line® D’SOLDER™.;
This SMT device removal product avoids the use of excessive heat that can
compromise the integrity of our product and your target board. The specially
Page 3 of 4
Gull wing Surface mount Foot Soldering Instructions (continued)
formulated alloy and flux make desoldering quick and easy. This solution can be a time and money saver for
many applications. (P/N TL-DS123)
3. filename: GSI.doc, Rev C” with footer autotext filename, Rev. C.Replaced pcb with PCB.
Page 4 of 4 reflow instruction, Rev. C
5). Appendix D – CQ256 Package Pin Assignment List
HiRel SX-A Family FPGAs
34 Preliminary v1.0
Package Pin Assignments (continued)
256-Pin CQFP (Top View)
256-Pin
CQFP
Pin #1
Index
256 255 254 253 252 251 250 249 248 200 199 198 197 196 195 194 193
65 66 67 68 69 70 71 72 73 121 122 123 124 125 126 127 128
129
130
131
132
133
134
135
136
137
185
186
187
188
189
190
191
192
64
63
62
61
60
59
58
57
56
8
7
6
5
4
3
2
1
HiRel SX-A Family FPGAs
Preliminary v1.0 35
256-Pin CQFP
Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function
1 GND GND 53 I/O I/O
2 TDI, I/O TDI, I/O 54 I/O I/O
3 I/O I/O 55 I/O I/O
4 I/O I/O 56 I/O GND
5 I/O I/O 57 I/O I/O
6 I/O I/O 58 I/O I/O
7 I/O I/O 59 GND GND
8 I/O I/O 60 I/O I/O
9 I/O I/O 61 I/O I/O
10 I/O I/O 62 I/O I/O
11 TMS TMS 63 I/O I/O
12 I/O I/O 64 I/O I/O
13 I/O I/O 65 I/O I/O
14 I/O I/O 66 I/O I/O
15 I/O I/O 67 I/O I/O
16 I/O I/O 68 I/O I/O
17 I/O VCCI 69 I/O I/O
18 I/O I/O 70 I/O I/O
19 I/O I/O 71 I/O I/O
20 I/O I/O 72 I/O I/O
21 I/O I/O 73 I/O VCCI
22 I/O I/O 74 I/O I/O
23 I/O I/O 75 I/O I/O
24 I/O I/O 76 I/O I/O
25 I/O I/O 77 I/O I/O
26 I/O I/O 78 I/O I/O
27 I/O I/O 79 I/O I/O
28 VCCI VCCI 80 I/O I/O
29 GND GND 81 I/O I/O
30 VCCA VCCA 82 I/O I/O
31 GND GND 83 I/O I/O
32 I/O I/O 84 I/O I/O
33 I/O I/O 85 I/O I/O
34 TRST, I/O TRST, I/O 86 I/O I/O
35 I/O I/O 87 I/O I/O
36 I/O VCCA 88 I/O I/O
37 I/O GND 89 I/O QCLKA
38 I/O I/O 90 PRB, I/O PRB, I/O
39 I/O I/O 91 GND GND
40 I/O I/O 92 VCCI VCCI
41 I/O I/O 93 GND GND
42 I/O I/O 94 VCCA VCCA
43 I/O I/O 95 I/O I/O
44 I/O I/O 96 HCLK HCLK
45 I/O I/O 97 I/O I/O
46 VCCA VCCA 98 I/O QCLKB
47 I/O VCCI 99 I/O I/O
48 I/O I/O 100 I/O I/O
49 I/O I/O 101 I/O I/O
50 I/O I/O 102 I/O I/O
51 I/O I/O 103 I/O I/O
52 I/O I/O 104 I/O I/O
HiRel SX-A Family FPGAs
36 Preliminary v1.0
105 I/O I/O 157 I/O I/O
106 I/O I/O 158 GND GND
107 I/O I/O 159 NC NC
108 I/O I/O 160 GND GND
109 I/O I/O 161 VCCI VCCI
110 GND GND 162 I/O VCCA
111 I/O I/O 163 I/O I/O
112 I/O I/O 164 I/O I/O
113 I/O I/O 165 I/O I/O
114 I/O I/O 166 I/O I/O
115 I/O I/O 167 I/O I/O
116 I/O I/O 168 I/O I/O
117 I/O I/O 169 I/O I/O
118 I/O I/O 170 I/O I/O
119 I/O I/O 171 I/O I/O
120 I/O VCCI 172 I/O I/O
121 I/O I/O 173 I/O I/O
122 I/O I/O 174 VCCA VCCA
123 I/O I/O 175 GND GND
124 I/O I/O 176 GND GND
125 I/O I/O 177 I/O I/O
126 TDO, I/O TDO , I/O 178 I/O I/O
127 I/O I/O 179 I/O I/O
128 GND GND 180 I/O I/O
129 I/O I/O 181 I/O I/O
130 I/O I/O 182 I/O I/O
131 I/O I/O 183 I/O VCCI
132 I/O I/O 184 I/O I/O
133 I/O I/O 185 I/O I/O
134 I/O I/O 186 I/O I/O
135 I/O I/O 187 I/O I/O
136 I/O I/O 188 I/O I/O
137 I/O I/O 189 GND GND
138 I/O I/O 190 I/O I/O
139 I/O I/O 191 I/O I/O
140 I/O I/O 192 I/O I/O
141 VCCA VCCA 193 I/O I/O
142 I/O VCCI 194 I/O I/O
143 I/O GND 195 I/O I/O
144 I/O VCCA 196 I/O I/O
145 I/O I/O 197 I/O I/O
146 I/O I/O 198 I/O I/O
147 I/O I/O 199 I/O I/O
148 I/O I/O 200 I/O I/O
149 I/O I/O 201 I/O I/O
150 I/O I/O 202 I/O VCCI
151 I/O I/O 203 I/O I/O
152 I/O I/O 204 I/O I/O
153 I/O I/O 205 I/O I/O
154 I/O I/O 206 I/O I/O
155 I/O I/O 207 I/O I/O
156 I/O I/O 208 I/O I/O
256-Pin CQFP (Continued)
Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function
HiRel SX-A Family FPGAs
Preliminary v1.0 37
209 I/O I/O 233 I/O I/O
210 I/O I/O 234 I/O I/O
211 I/O I/O 235 I/O I/O
212 I/O I/O 236 I/O I/O
213 I/O I/O 237 I/O I/O
214 I/O I/O 238 I/O I/O
215 I/O I/O 239 I/O I/O
216 I/O I/O 240 GND GND
217 I/O I/O 241 I/O I/O
218 I/O QCLKD 242 I/O I/O
219 CLKA CLKA 243 I/O I/O
220 CLKB CLKB 244 I/O I/O
221 VCCI VCCI 245 I/O I/O
222 GND GND 246 I/O I/O
223 NC NC 247 I/O I/O
224 GND GND 248 I/O I/O
225 PRA, I/O PRA, I/O 249 I/O VCCI
226 I/O I/O 250 I/O I/O
227 I/O I/O 251 I/O I/O
228 I/O VCCA 252 I/O I/O
229 I/O I/O 253 I/O I/O
230 I/O I/O 254 I/O I/O
231 I/O QCLKC 255 I/O I/O
232 I/O I/O 256 TCK, I/O TCK, I/O
256-Pin CQFP (Continued)
Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function Pin
Number HiRel A54SX32A
Function HiRel A54SX72 A
Function
6). Appendix E – FG484 Package Pin Assignment List
SX-A Family FPGAs
74 v3.0
Package Pin Assignments (Continued)
484-Pin FBGA (Top View)
123 4 5 6 7 8 9 10 11121314 15161718 19 20212223 242526
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
v3.0 75
SX-A Family FPGAs
484-Pin FBGA
Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function
A1 NC NC AB11 I/O I/O AD5 I/O I/O
A2 NC NC AB12 PRB, I/O PRB, I/O AD6 I/O I/O
A3 NC I/O AB13 VCCA VCCA AD7 I/O I/O
A4 NC I/O AB14 I/O I/O AD8 I/O I/O
A5 NC I/O AB15 I/O I/O AD9 VCCI VCCI
A6 I/O I/O AB16 I/O I/O AD10 I/O I/O
A7 I/O I/O AB17 I/O I/O AD11 I/O I/O
A8 I/O I/O AB18 I/O I/O AD12 I/O I/O
A9 I/O I/O AB19 I/O I/O AD13 VCCI VCCI
A10 I/O I/O AB20 TDO, I/O TDO, I/O AD14 I/O I/O
A11 NC I/O AB21 GND GND AD15 I/O I/O
A12 NC I/O AB22 NC I/O AD16 I/O I/O
A13 I/O I/O AB23 I/O I/O AD17 VCCI VCCI
A14 NC NC AB24 I/O I/O AD18 I/O I/O
A15 NC I/O AB25 NC I/O AD19 I/O I/O
A16 NC I/O AB26 NC I/O AD20 I/O I/O
A17 I/O I/O AC1 I/O I/O AD21 I/O I/O
A18 I/O I/O AC2 I/O I/O AD22 I/O I/O
A19 I/O I/O AC3 I/O I/O AD23 VCCI VCCI
A20 I/O I/O AC4 NC I/O AD24 NC I/O
A21 NC I/O AC5 VCCI VCCI AD25 NC I/O
A22 NC I/O AC6 I/O I/O AD26 NC I/O
A23 NC I/O AC7 VCCI VCCI AE1 NC NC
A24 NC I/O AC8 I/O I/O AE2 I/O I/O
A25 NC NC AC9 I/O I/O AE3 NC I/O
A26 NC NC AC10 I/O I/O AE4 NC I/O
AA1 NC I/O AC11 I/O I/O AE5 NC I/O
AA2 NC I/O AC12 I/O QCLKA AE6 NC I/O
AA3 VCCA VCCA AC13 I/O I/O AE7 I/O I/O
AA4 I/O I/O AC14 I/O I/O AE8 I/O I/O
AA5 I/O I/O AC15 I/O I/O AE9 I/O I/O
AA22 I/O I/O AC16 I/O I/O AE10 I/O I/O
AA23 I/O I/O AC17 I/O I/O AE11 NC I/O
AA24 I/O I/O AC18 I/O I/O AE12 I/O I/O
AA25 NC I/O AC19 I/O I/O AE13 I/O I/O
AA26 NC I/O AC20 VCCI VCCI AE14 I/O I/O
AB1 NC NC AC21 I/O I/O AE15 NC I/O
AB2 VCCI VCCI AC22 I/O I/O AE16 NC I/O
AB3 I/O I/O AC23 NC I/O AE17 I/O I/O
AB4 I/O I/O AC24 I/O I/O AE18 I/O I/O
AB5 NC I/O AC25 NC I/O AE19 I/O I/O
AB6 I/O I/O AC26 NC I/O AE20 I/O I/O
AB7 I/O I/O AD1 I/O I/O AE21 NC I/O
AB8 I/O I/O AD2 I/O I/O AE22 NC I/O
AB9 I/O I/O AD3 GND GND AE23 NC I/O
AB10 I/O I/O AD4 I/O I/O AE24 NC I/O
SX-A Family FPGAs
76 v3.0
AE25 NC NC B19 I/O I/O D13 I/O I/O
AE26 NC NC B20 I/O I/O D14 I/O I/O
AF1 NC NC B21 NC I/O D15 I/O I/O
AF2 NC NC B22 NC I/O D16 I/O I/O
AF3 NC I/O B23 NC I/O D17 I/O I/O
AF4 NC I/O B24 NC I/O D18 I/O I/O
AF5 NC I/O B25 I/O I/O D19 I/O I/O
AF6 NC I/O B26 NC NC D20 I/O I/O
AF7 I/O I/O C1 NC I/O D21 VCCI VCCI
AF8 I/O I/O C2 NC I/O D22 GND GND
AF9 I/O I/O C3 NC I/O D23 I/O I/O
AF10 I/O I/O C4 NC I/O D24 I/O I/O
AF11 NC I/O C5 I/O I/O D25 NC I/O
AF12 NC NC C6 VCCI VCCI D26 NC I/O
AF13 HCLK HCLK C7 I/O I/O E1 NC I/O
AF14 I/O QCLKB C8 I/O I/O E2 NC I/O
AF15 NC I/O C9 VCCI VCCI E3 I/O I/O
AF16 NC I/O C10 I/O I/O E4 I/O I/O
AF17 I/O I/O C11 I/O I/O E5 GND GND
AF18 I/O I/O C12 I/O I/O E6 TDI, IO TDI, IO
AF19 I/O I/O C13 PRA, I/O PRA, I/O E7 I/O I/O
AF20 NC I/O C14 I/O I/O E8 I/O I/O
AF21 NC I/O C15 I/O QCLKD E9 I/O I/O
AF22 NC I/O C16 I/O I/O E10 I/O I/O
AF23 NC I/O C17 I/O I/O E11 I/O I/O
AF24 NC I/O C18 I/O I/O E12 I/O I/O
AF25 NC NC C19 I/O I/O E13 VCCA VCCA
AF26 NC NC C20 VCCI VCCI E14 CLKB CLKB
B1 NC NC C21 I/O I/O E15 I/O I/O
B2 NC NC C22 I/O I/O E16 I/O I/O
B3 NC I/O C23 I/O I/O E17 I/O I/O
B4 NC I/O C24 I/O I/O E18 I/O I/O
B5 NC I/O C25 NC I/O E19 I/O I/O
B6 I/O I/O C26 NC I/O E20 I/O I/O
B7 I/O I/O D1 NC I/O E21 I/O I/O
B8 I/O I/O D2 TMS TMS E22 I/O I/O
B9 I/O I/O D3 I/O I/O E23 I/O I/O
B10 I/O I/O D4 VCCI VCCI E24 I/O I/O
B11 NC I/O D5 NC I/O E25 VCCI VCCI
B12 NC I/O D6 TCK, I/O TCK, I/O E26 GND GND
B13 VCCI VCCI D7 I/O I/O F1 VCCI VCCI
B14 CLKA CLKA D8 I/O I/O F2 NC I/O
B15 NC I/O D9 I/O I/O F3 NC I/O
B16 NC I/O D10 I/O I/O F4 I/O I/O
B17 I/O I/O D11 I/O I/O F5 I/O I/O
B18 VCCI VCCI D12 I/O QCLKC F22 I/O I/O
484-Pin FBGA (Continued)
Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function
v3.0 77
SX-A Family FPGAs
F23 I/O I/O K17 GND GND N5 I/O I/O
F24 I/O I/O K22 I/O I/O N10 GND GND
F25 I/O I/O K23 I/O I/O N11 GND GND
F26 NC I/O K24 NC NC N12 GND GND
G1 NC I/O K25 NC I/O N13 GND GND
G2 NC I/O K26 NC I/O N14 GND GND
G3 NC I/O L1 NC I/O N15 GND GND
G4 I/O I/O L2 NC I/O N16 GND GND
G5 I/O I/O L3 I/O I/O N17 GND GND
G22 I/O I/O L4 I/O I/O N22 VCCA VCCA
G23 VCCA VCCA L5 I/O I/O N23 I/O I/O
G24 I/O I/O L10 GND GND N24 I/O I/O
G25 NC I/O L11 GND GND N25 I/O I/O
G26 NC I/O L12 GND GND N26 NC NC
H1 NC I/O L13 GND GND P1 NC I/O
H2 NC I/O L14 GND GND P2 NC I/O
H3 I/O I/O L15 GND GND P3 I/O I/O
H4 I/O I/O L16 GND GND P4 I/O I/O
H5 I/O I/O L17 GND GND P5 VCCA VCCA
H22 I/O I/O L22 I/O I/O P10 GND GND
H23 I/O I/O L23 I/O I/O P11 GND GND
H24 I/O I/O L24 I/O I/O P12 GND GND
H25 NC I/O L25 I/O I/O P13 GND GND
H26 NC I/O L26 I/O I/O P14 GND GND
J1 NC I/O M1 NC NC P15 GND GND
J2 NC I/O M2 I/O I/O P16 GND GND
J3 I/O I/O M3 I/O I/O P17 GND GND
J4 I/O I/O M4 I/O I/O P22 I/O I/O
J5 I/O I/O M5 I/O I/O P23 I/O I/O
J22 I/O I/O M10 GND GND P24 VCCI VCCI
J23 I/O I/O M11 GND GND P25 I/O I/O
J24 I/O I/O M12 GND GND P26 I/O I/O
J25 VCCI VCCI M13 GND GND R1 NC I/O
J26 NC I/O M14 GND GND R2 NC I/O
K1 I/O I/O M15 GND GND R3 I/O I/O
K2 VCCI VCCI M16 GND GND R4 I/O I/O
K3 I/O I/O M17 GND GND R5 TRST, I/O TRST, I/O
K4 I/O I/O M22 I/O I/O R10 GND GND
K5 VCCA VCCA M23 I/O I/O R11 GND GND
K10 GND GND M24 I/O I/O R12 GND GND
K11 GND GND M25 NC I/O R13 GND GND
K12 GND GND M26 NC I/O R14 GND GND
K13 GND GND N1 I/O I/O R15 GND GND
K14 GND GND N2 VCCI VCCI R16 GND GND
K15 GND GND N3 I/O I/O R17 GND GND
K16 GND GND N4 I/O I/O R22 I/O I/O
484-Pin FBGA (Continued)
Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function
SX-A Family FPGAs
78 v3.0
R23 I/O I/O U3 I/O I/O V25 NC I/O
R24 I/O I/O U4 I/O I/O V26 NC I/O
R25 NC I/O U5 I/O I/O W1 I/O I/O
R26 NC I/O U10 GND GND W2 I/O I/O
T1 NC I/O U11 GND GND W3 I/O I/O
T2 NC I/O U12 GND GND W4 I/O I/O
T3 I/O I/O U13 GND GND W5 I/O I/O
T4 I/O I/O U14 GND GND W22 I/O I/O
T5 I/O I/O U15 GND GND W23 VCCA VCCA
T10 GND GND U16 GND GND W24 I/O I/O
T11 GND GND U17 GND GND W25 NC I/O
T12 GND GND U22 I/O I/O W26 NC I/O
T13 GND GND U23 I/O I/O Y1 NC I/O
T14 GND GND U24 I/O I/O Y2 NC I/O
T15 GND GND U25 VCCI VCCI Y3 I/O I/O
T16 GND GND U26 I/O I/O Y4 I/O I/O
T17 GND GND V1 NC I/O Y5 NC I/O
T22 I/O I/O V2 NC I/O Y22 I/O I/O
T23 I/O I/O V3 I/O I/O Y23 I/O I/O
T24 I/O I/O V4 I/O I/O Y24 VCCI VCCI
T25 NC I/O V5 I/O I/O Y25 I/O I/O
T26 NC I/O V22 VCCA VCCA Y26 I/O I/O
U1 I/O I/O V23 I/O I/O
U2 VCCI VCCI V24 I/O I/O
484-Pin FBGA (Continued)
Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function Pin
Number A54SX32A
Function A54SX72A
Function
