INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC2317N-R04 1
CPC2317N
60V Dual Single-Pole SOIC OptoMOS® Relay
One Normally-Open Pole & One Normally-Closed Pole
Part # Description
CPC2317N 8-Pin SOIC (50/tube)
CPC2317NTR 8-Pin SOIC (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 120 mArms / mADC
On-Resistance (max) 16
LED Current to operate 1 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• 1500Vrms Input/Output Isolation
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to radiated EM fields
• Wave Solderable
• Small 8-Pin SOIC Package
• Tape & Reel Version Available
The CPC2317N is a miniature device with one
independent normally-open (1-Form-A) solid state
relay and one independent normally-closed
(1-Form-B) solid state relay in an 8-pin SOIC package.
It employs optically coupled MOSFET technology to
provide 1500Vrms of input to output isolation.
The optically coupled outputs, which use IXYS
Integrated Circuits Division's patented OptoMOS
architecture, are controlled by a highly efficient
infrared LED.
This device uses IXYS Integrated Circuits Division’s
state of the art, double-molded vertical construction
packaging to produce one of the world’s smallest
relays. It is ideal for replacing larger, less-reliable reed
and electromechanical relays.
Approvals
Switching Characteristics of
Normally-Open
(Form-A) Devices
Switching Characteristics of
Normally-Closed
(Form-B) Devices
Form-B
IF
10%
90%
ILOAD
ton
toff
Form-A
IF
ILOAD
10%
90%
ton toff
+ Control
– Control
Load
Load
1
2
3
4
7
8
5
6
+ Control
– Control
Load
Load
Form-B - Normally Closed
Form-A - Normally Open
• UL Recognized Component: File E76270
• CSA Approval Pending
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R04
CPC2317N
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Total Power Dissipation 1600 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
Soldering Temperature (10 Seconds) 260 °C
1 Derate linearly 5mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Normally Open (Form-A) Continuous 1IF=1mA IL- - 120 mArms / mADC
Normally Closed (Form-B) Continuous 1IF=0mA
Peak t =10ms ILPK - - ±350 mAP
On-Resistance 2IL=120mA RON --16
Switching Speeds
Turn-On IF=5mA, VL=10V ton --3 ms
Turn-Off toff --3
Off-State Leakage Current VL=60VPILEAK --1 µA
Output Capacitance
Normally Open (Form-A) IF=0mA, VL=50V, f=1MHz
COUT
-5 - pF
Normally Closed (Form-B) IF=5mA, VL=50V, f=1MHz -10 -
Input Characteristics
Input Control Current to Activate 3IL=100mA IF- 0.40 1 mA
Input Control Current to Deactivate - IF0.1 0.35 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF
1 Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
INTEGRATED CIRCUITS DIVISION
CPC2317N
www.ixysic.com 3
R04
Common Performance Data @ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=100mA)
35
30
25
20
15
10
5
0
80 84 88 9282 86 90
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
(Form-A IF=0mA, Form-B IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=20mA
IF=50mA
Typical IF for Switch Operation
vs. Temperature
(IL=80mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
60
70
80
90
100
110
120
130
Maximum Load Current
vs. Temperature
(Form-A IF=2mA, Form-B IF=0mA)
Blocking Voltage (VP)
-40
91
89
87
85
83
81
79
77
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
(Form-A IF=0mA, Form-B IF=2mA)
Temperature (ºC) Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
0.9
0.5
0.7
0.3
0.1
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R04
CPC2317N
Form-A Performance Data @ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
1.0 1.2 1.4 1.61.1 1.3 1.5
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=100mA)
0.26 0.30 0.34 0.380.360.320.28
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IL=100mA, IF=5mA)
35
30
25
20
15
10
5
0
On-Resistance (:)
Device Count (N)
6.8 6.9 7.17.0 7.47.2 7.3
Typical On-Resistance Distribution
(N=50, IL=100mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current vs. Load Voltage
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
1.0
1.5
2.0
2.5
3.0
3.5
Typical Turn-On Time vs. Temperature
(IL=50mA)
IF=2mA
IF=5mA
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IL=50mA)
Temperature (ºC)
I
F
=5mA
I
F
=2mA
-40
14
12
10
8
6
4
-20 0 20 40 60 80 100
2
Steady State
Instantaneous
IF=5mA
IF=5mA
IF=2mA
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IL=Max Rated @ Temperature)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
(Measured Across Pins 5&6)
(IF=0mA, VL=60V)
Temperature (ºC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
4
6
8
10
12
14
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
INTEGRATED CIRCUITS DIVISION
CPC2317N
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R04
Form-B Performance Data @ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
0.28 0.32 0.36 0.400.30 0.34 0.38
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=2mA, IL=150mA)
0.30 0.34 0.38 0.420.400.360.32
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=2mA, IL=150mA)
35
30
25
20
15
10
5
0
5.0 5.2 5.4 5.65.1 5.3 5.5
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=150mA)
On-Resistance (:)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1 -0.5 -0.25 0 0.25 0.5 1
Typical Load Current vs. Load Voltage
-0.75 0.75
Typical Turn-On Time vs. Temperature
(IF=2mA, IL=50mA)
Turn-On Time (ms)
-40
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Temperature (ºC)
Turn-Off Time (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Turn-Off Time vs. Temperature
(IF=2mA, IL=50mA)
-40
8
7
6
5
4
3
2
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(IF=0mA, IL=150mA)
Temperature (ºC)
On-Resistance (:)
Leakage (µA)
-40
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-On Time
vs. LED Forward Current
(IL=50mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
050
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mA)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
5
10
15
20
25
30
35
40
Output Capacitance vs. Load Voltage
(IF=0.5mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R04
CPC2317N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC2317N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time Maximum Refl ow Cycles
CPC2317N 260ºC for 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after soldering processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC2317N-R04
©Copyright 2014, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
11/19/2014
For additional information please visit our website at: www.ixysic.com
7
CPC2317N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Land Pattern
2.184 MAX
(0.086 MAX)
0.838 ± 0.102
(0.033 ± 0.004) 0.381 ± 0.051
(0.015 ± 0.002)
Pin to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.432 ± 0.127
(0.017 ± 0.005)
0.203 ± 0.025
(0.008 ± 0.001)
1.016 ± 0.025
(0.040 ± 0.001)
5.60
(0.22)
1.30
(0.051)
0.55
(0.022)
2.54
(0.100)
9.347 ± 0.203
(0.368 ± 0.008)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
Pin 1
CPC2317N
CPC2317NTR Tape & Reel
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
7.50 ± 0.10
16.00 ± 0.30
1.75 ± 0.10 8.00 ± 0.104.00 ± 0.10
2.00 ± 0.10
9.65 ± 0.106.50
1.20
2.85 ± 0.10
2.35 ± 0.10
6.55 ± 0.10
3.50
Ø1.50
+0.1, -0
Ø1.50 MIN
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
