Datasheet CAN Transceiver for Automotive BD41041FJ-C General Description Key Specifications BD41041FJ-C is a transceiver LSI for CAN communication (Fully ISO 11898-2:2016 compliant). It is equipped with circuitry that functions as transmitter and receiver, necessary for High-speed CAN communication (up to 1Mbps) Recommended Operating Voltage Range: 4.75V to 5.25V VCC, TXD, RXD, STB Absolute Maximum Rating: -0.3V to +7.0V CANH, CANL, SPLIT Absolute Maximum Rating: -27V to +40V Features Package AEC-Q100 Qualified(Note 1) Transmission Rate of 40kbps to 1Mbps Power Saving Mode Correspondence SPLIT Voltage Output for Stabilizing Recessive Bus Level Under Voltage Detection Function Thermal Shutdown (TSD) Function TXD Dominant Time-out Function (Normal Mode) CAN Bus Dominant Time-out Function (Standby Mode) Bus Wake-up Capability W(Typ) x D(Typ) x H(Max) SOP-J8 4.90mm x 6.00mm x 1.65mm (Note 1) Grade1 Application CAN Communication for Automotive Networks Typical Application Circuit VBAT VBAT 5V Regulator VCC 5V Regulator RXD VCC CANH BD41041FJ-C (Transceiver) Micro Contoroller VCC STB 60(Note 2) GND CANL RXD VCC CANH BD41041FJ-C (Transceiver) 60(Note 2) Micro Contoroller SPLIT TXD GND CANH CANL GND 60(Note 2) SPLIT 60(Note 2) TXD 4.7nF(Note 2) CANH STB GND CANL 4.7nF(Note 2) CANL CAN Bus Line (Note 2) Resistor value, capacitor value and connection about SPLIT should be selected by ECU specification. Capacitor value should be selected between 1nF to 100nF. Figure 1. Typical Application Circuit Product structure : Silicon monolithic integrated circuit www.rohm.com (c) 2012 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018 Rev.002 BD41041FJ-C Pin Configuration SOP-J8 TXD 1 8 STB GND 2 7 CANH VCC 3 6 CANL RXD 4 5 SPLIT Figure 2. Pin Configuration(TOP VIEW) Pin Descriptions Table 1. Pin Description Function Pin No. Pin Name 1 TXD Transmission data input pin with pull-up resistance. 2 GND Ground 3 VCC Power supply 4 RXD Receive data output 5 SPLIT Common-mode stabilization output 6 CANL LOW-level CAN bus line 7 CANH HIGH-level CAN bus line 8 STB Mode control input with pull-up resistance. HIGH : Standby mode LOW : Normal mode. Block Diagram VCC VCC 3 TXD INPUT TXD 1 VCC DOMINANT TIME-OUT SLOPE CONTROL VCC DRIVER TSD & UVLO STB INPUT STB 8 CANH 7 CANL 6 MODE CONTROL COMMON VOLTAGE DRIVER VREF IREF RXD OUTPUT VCC RECEIVER STANDBY RXD 4 SPLIT WAKE-UP FILTER SPLIT 5 RECEIVER NORMAL GND 2 Figure 3. Block Diagram www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Mode of Operation BD41041FJ-C operates on Power-OFF mode, Standby mode or Normal mode depending on the logic state of STB pin and voltage of VCC (see Figure 4 for the state transition of each mode of operation) RXD CAN bus SPLIT Power off mode H or Hi-z Hi-z Hi-z VCCVUVOFF VCC>VUVOFF Standby mode H (No wake-up request detected) RXD L (Wake-up request detected) Pull down CAN bus SPLIT Hi-z STB=LOW and VCC>VUVSTB STB=HIGH or VCCVUVSTB Normal mode H (CAN bus=Recessive) RXD L (CAN bus=Dominant) Recessive (TXD=H) CAN bus Dominant (TXD=L) SPLIT VCC/2 Figure 4. State Transition Chart A diode is inserted on the RXD pin at the VCC side to prevent the reverse current to VCC. But a diode becomes invalid in Normal mode. When it changed to Normal mode by STB=LOW while TXD=LOW, Dominant output to CAN bus is stopped. After TXD=HIGH once and then TXD=LOW again, Dominant output to CAN bus is started. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Mode of Operation - continued 1. Power-OFF Mode The Power OFF mode is the state in which the transceiver function is turned off due to an abnormal drop in VCC. In this mode, the IC cannot receive the Wake-up signal from CAN bus. 2. Standby Mode The Standby Mode is the state in which electric power is saved by turning off all circuits except those with Receiver Standby, Wake up Filter and Dominate Time-out functions. RXD will output the wake up signal from CAN bus. 3. Normal Mode The Normal mode is the state in which the transceiver is available for normal CAN communication. It transmits and receives data via the bus lines CANH and CANL. In this mode, TXD can transmit data to the CAN bus and RXD can receive data from the CAN bus. In addition, SPLIT outputs the voltage of VCC/2. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Absolute Maximum Ratings Table 2. Absolute Maximum Ratings Parameter Symbol Rating Unit VCC -0.3 to +7.0 V VSTB, VTXD -0.3 to +7.0 V VRXD -0.3 to +7.0 V VCANH, VCANL, VSPLIT -27 to +40 V Differencial Voltage between CANH and CANL VDIFF -5.0 to +10.0 V Junction Max Temperature Tjmax 150 C Tstg -55 to +150 C Supply Voltage Input Voltage Output Voltage Input/Output Voltage Storage Temperature Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Thermal Resistance(Note 3) Table 3. Thermal Resistance Parameter Thermal Resistance (Typ) Symbol Unit 1s(Note 5) 2s2p(Note 6) JA 149.3 76.9 C/W JT 18 11 C/W SOP-J8 Junction to Ambient Junction to Top Characterization Parameter(Note 4) (Note 3) Based on JESD51-2A(Still-Air) (Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 5) Using a PCB board based on JESD51-3(Table 4). (Note 6) Using a PCB board based on JESD51-7(Table 5). Table 4. 1 Layer Board Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m Table 5. 4 Layers Board Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m Recommended Operating Conditions Table 6. Recommended Operating Ranges Parameter Symbol Limit Min Typ Max Unit Supply Voltage Range VCC 4.75 5.00 5.25 V Operating Temperature Range Topr -40 +25 +125 C Capacitance of Pin SPLIT(Note 7) CSPLIT 1.0 4.7 100.0 nF Conditions (Note 7) Set the capacity of the condenser not to surpass a range of the value of standard in consideration of temperature characteristics and dc-bias properties. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Electrical Characteristics The following specifications are 4.75VVCC5.25V, conditions of -40CTopr125C The Typ level is VCC=5V, Topr=25C unless otherwise specified. Table 7. Electrical Characteristics (VCC) Parameter Symbol Limit Min Typ Max Unit Operating Current 1 ICCSTB - 10 15 A Operating Current 2 ICCREC - 5.0 7.5 mA Operating Current 3 ICCDOM - 45 65 mA Under Voltage Detection Voltage 1 VUVSTB 3.50 - 4.75 V Under Voltage Detection Voltage 2 VUVOFF 1.30 - 2.95 V Parameter HIGH Level Input Voltage LOW Level Input Voltage Table 8. Electrical Characteristics (STB) Limit Symbol Min Typ Max 0.7 x VIH_STB VCC VCC +0.3 x VIL_STB 0.0 VCC Conditions Standby mode; STB=HIGH Normal mode, Recessive; STB=LOW TXD=HIGH RLOAD=60 Normal mode, Dominant; STB=LOW TXD=LOW RLOAD=60 Unit Conditions V V HIGH Level Input Current IIH_STB -1 - +1 A VSTB=VCC LOW Level Input Current IIL_STB -15 - -1 A VSTB=0V Table 9. Electrical Characteristics (TXD) Parameter Symbol Limit Min 0.7 x VCC Typ Max - VCC HIGH Level Input Voltage VIH_TXD LOW Level Input Voltage VIL_TXD 0.0 - HIGH Level Input Current IIH_TXD -5 LOW Level Input Current IIL_TXD -260 Unit Conditions V - +0.3 x VCC +5 A VTXD=VCC -150 -30 A VTXD=0V V Table 10. Electrical Characteristics (RXD) Parameter Normal Mode Time Output HIGH Current Normal Mode Time Output LOW Current www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Symbol Limit Unit Conditions Min Typ Max IOH_RXD -8 - -1 mA VRXD=VCC-0.4V IOL_RXD 1 - 12 mA VRXD=0.4V 7/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Electrical Characteristics - continued Table 11. Electrical Characteristics (SPLIT) Parameter Symbol Limit Leakage Current 1 IIL_SPLIT Min 0.3 x VCC 0.3 x VCC 0.45 x VCC -5 Leakage Current 2 IIH_SPLIT -5 Output Voltage 1 VILN_SPLIT Output Voltage 2 VILP_SPLIT Output Voltage 3 VRL_SPLIT www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 8/22 Typ - Max 0.7 x VCC 0.7 x VCC 0.55 x VCC +5 - +5 - Unit Conditions V ILOAD=-500A V ILOAD=500A V RLOAD=1M A VSPLIT=-27V A VSPLIT=40V TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Electrical Characteristics - continued Table 12. Electrical Characteristics (CANH, CANL) Parameter Symbol Limit Unit Conditions Min Typ Max VCM_CAN -12.0 +2.5 +12.0 V CANH Dominant Output Voltage VDOM_CANH 2.75 3.50 4.50 V RLOAD = 50 to 65 CANL Dominant Output Voltage CANH-CANL Dominant Output Voltage CANH-CANL Dominant Output Voltage2 VDOM_CANL 0.50 1.50 2.25 V RLOAD = 50 to 65 VDOM_DIFF 1.5 - 3.0 V RLOAD = 50 to 65 VDOM_DIFF2 1.5 - 5.0 V RLOAD = 2240 VAC_SYM 0.9 x VCC - 1.1 x VCC V RLOAD = 60 CSPLIT = 4.7nF fTXD = 500kHz CANH+CANL-VCC Dominant Output Voltage VDOM_SYM -400 - +400 mV CANH Recessive Output Voltage VREC_CANH 2.0 3.0 V no Load CANL Recessive Output Voltage VREC_CANL 2.0 3.0 V no Load VREC_DIFF1 -50 - +50 mV no Load VREC_DIFF2 -120 - +12 mV RLOAD=60 IDOM_CANH -100 - - mA VCANH=-3V CANL Dominant Output Current IDOM_CANL - - 100 mA VCANL=18V CANH Recessive Output Current IREC_CANH -5 - +5 mA VCANH=-27V to +40V CANL Recessive Output Current IREC_CANL -5 - +5 mA VCANL=-27V to +40V CANH Standby Output Voltage VSTB_CANH -0.1 - +0.1 V no Load CANL Standby Output Voltage CANH-CANL Stanby Differential Output Voltage VSTB_CANL -0.1 - +0.1 V no Load VDIFF_STB -0.2 - +0.2 V no load CANH Leakage Current IOFF_CANH -3 - +3 A CANL Leakage Current IOFF_CANL -3 - +3 A CANH Input Impedance RI_CANH 6 15 28 k VCC=0V VCANH=5V VCC=0V VCANL=5V -2.0VVCANH+7.0V CANL Input Impedance CANH, CANL Input Impedance Offset CANH, CANL Differential Input Impedance RI_CANL 6 15 28 k -2.0VVCANL+7.0V RI_OFFSET -3 - +3 % VCANH=+5.0V, VCANL=+5.0V RI_DIFF 12 30 52 k -2.0VVCANH+7.0V -2.0VVCANL+7.0V VRX_NRM_R -3.0 - +0.5 V -12.0VVCANH+12.0V -12.0VVCANL+12.0V Common Voltage Range CANH+CANL Output Waveform Symmetry CANH-CANL Recessive Output Voltage 1 CANH-CANL Recessive Output Voltage 2 CANH Dominant Output Current Differential Input Voltage Range "Recessive" (Normal Mode) 0.5 x VCC 0.5 x VCC RLOAD=60 Differential Input Voltage Range "Dominant" (Normal Mode) Normal Mode Receiver Detection Voltage Hysteresis Differential Input Voltage Range "Recessive" (Standby Mode) VRX_NRM_D 0.9 - 8.0 V -12.0VVCANH+12.0V -12.0VVCANL+12.0V VRX_NRM_HYS 100 - 300 mV -12.0VVCANH+12.0V -12.0VVCANL+12.0V VRX_STB_R -3.0 - +0.4 V -12.0VVCANH+12.0V -12.0VVCANL+12.0V Differential Input Voltage Range "Dominant" (Standby Mode) VRX_STB_D 1.15 - 8.00 V -12.0VVCANH+12.0V -12.0VVCANL+12.0V www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 9/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Electrical Characteristics - continued Parameter Delay Time from TXD to Bus Dominant Delay Time from TXD to Bus Recessive Delay Time from Bus Dominant to RXD Delay Time from Bus Recessive to RXD Propagation Delay from TXD to RXD Fall Propagation Delay from TXD to RXD Rise Table 13. Electrical Characteristics (Timing) Limit Symbol Min Typ Max Unit Conditions RLOAD=60 CLOAD=100pF RLOAD=60 CLOAD=100pF tTXD_DOM - - 140 ns tTXD_REC - - 140 ns tDOM_RXD - - 140 ns CRXD=15pF tREC_RXD - - 140 ns CRXD=15pF tTXD_RXD_F 60 - 220 ns tTXD_RXD_R 60 - 220 ns Bus Wake-up Time tBUS_WK 0.5 - 5.0 s Standby to Normal Mode tSTB_NRM 7 - 47 s TXD Dominant Time-out tDOM_TON 0.8 - 10.0 ms In Normal Mode Bus Dominant Time-out tDOM_TOS 0.8 - 10.0 ms In Standby Mode www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10/22 RLOAD=60 CLOAD=100pF RLOAD=60 CLOAD=100pF VRX_STB_D=1.15V to 5.00V TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Timing Chart CANH CANL CANH-CANL 1.15V RXD 30% tBUS_WK Figure 5. Standby Mode Function TXD 50% CANH CANL CANH-CANL 0.9V 0.5V RXD 50% tT XD_DOM tT XD_REC tDOM_RXD tREC_RXD Figure 6. Normal Mode Function www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Timing Chart - continued STB 50% 0.25 X V CC CANH CANL 0.25 X V CC SPLIT tST B_NRM Mode Standby Mode Normal Mode Figure 7. Transition from Standby Mode to Normal Mode 70% 30% TXD tBit(T XD) 5 x tBit(T XD) tT XD_RXD_F CANH CANL CANH-CANL 70% RXD 30% tT XD_RXD_R Figure 8. Propagation Delay from TXD to RXD www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 12/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Fail Safe Function 1. Thermal Shut Down Thermal shut down is a function to automatically stop output to the CAN bus during an abnormal heat generation overrun. When the junction temperature of the IC becomes higher than a sensed temperature (Typ 170C), CAN bus changes to the Recessive state. When the junction temperature of the IC is less than the detection release temperature(Typ 155C), the thermal shut down function is cancelled by setting TXD HIGH. Attention: The sensed temperature reaches 150C to 190C, and the hysteresis temperature is 5C to 30 C. The sensed temperature/hysteresis temperature is not inspected for shipped samples. In addition, please avoid system designs that operate near the absolute maximum ratings as the temperature protective circuits activate when the limits are exceeded. TXD CANH CANL CANH-CANL RXD Tj > TSD enable temperature Tj < TSD disable temperature Thermal shut dow n is enable Tj < TSD disable temperature and TXD = HIGH Thermal shut dow n is disable Figure 9. Thermal Shutdown Operating www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 13/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Fail Safe Function - continued 2. TXD Dominant Time-out TXD dominant time-out is a function to automatically stop the output to CAN bus when TXD is set LOW during Normal mode. If TXD dominant time-out is enabled, CAN bus changes to the Recessive state. The TXD dominant time-out is released by setting TXD to HIGH. tDOM_T ON TXD 50% CANH CANL CANH-CANL 0.5V RXD TXD dominant time-out is enable TXD=HIGH TXD dominant time-out is disable Figure 10. TXD Dominant Time-out Operating www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Fail Safe Function - continued 3. CAN Bus Dominant Time-out CAN Bus Dominant Time-out is a function to automatically stop the LOW output to RXD when CAN bus is set to Dominant during Standby Mode. If CAN bus dominant time-out is enabled, RXD becomes HIGH. The CAN bus dominant time-out is released by setting the CAN bus to Recessive. CANH CANL tDOM_TOS CANH-CANL 1.15V 70% RXD CAN bus dominant time-out is enable CAN bus = Recessive CAN bus dominant time-out Figure 11. RXD Dominant Time-out Operating www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Evaluation Circuit Diagram 1. tTXD_DOM, tTXD_REC, tTXD_RXD_F, tTXD_RXD_R 5V 47F 100nF VCC RXD CANH CANH BD41041FJ-C (Transceiver) TXD SPLIT STB GND 15pF RLOAD =60 OPEN CANL CLOAD =100pF CANL 2. tDOM_RXD, tREC_RXD 5V 47F 100nF VCC CANH CANH RXD BD41041FJ-C (Transceiver) OPEN SPLIT TXD STB 15pF GND OPEN CANL CANL 3. VAC_SYM 5V 47F 100nF OPEN VCC RXD CANH CANH RLOAD =30 BD41041FJ-C (Transceiver) SPLIT TXD RLOAD =30 STB GND CANL CANL CSPLIT =4.7nF Figure 12. Evaluation Circuit Diagram www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C I/O Equivalent Circuits (1)TXD (4)RXD VCC TXD RXD (5)SPLIT (6)CANL SPLIT CANL (7)CANH (8)STB VCC STB CANH Figure 13. I/O Equivalent Circuits www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Operational Notes - continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 14. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Ordering Information B D 4 1 0 Part Number 4 1 F J Package FJ:SOP-J8 - CE2 Packaging and forming specification C: Automotive E2: Embossed tape and reel Marking Diagram SOP-J8(TOP VIEW) Part Number Marking 4 1 0 4 1 LOT Number Pin 1 Mark www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Physical Dimension and Packing Information Package Name www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 SOP-J8 21/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 BD41041FJ-C Revision History Date 15.Feb.2018 27.Dec.2018 Revision 001 002 www.rohm.com (c) 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Changes New Release P1 Typical Application Circuit Added explanation of resistor valude, capacitor value, connection about SPLIT. P2 Block Diagram Deleated "STB" in RXD OUTPUT block. P3 Mode of Operation Modified to "H or Hi-Z" from "Hi-Z" at RXD in Power off mode. Modified to "STB=LOW and VCC>VUVSTB" from "STB=LOW and TXD=HIGH and VCC>VUVSTB" at the conditions to change to Normal mode from Standby mode. Added explanation of a diode at the RXD pin. Added explanation of the operation when it changed to the Normal mode by STB=LOW while TXD=LOW. P7 Table 8. Electrical Characteristics (STB) HIGH Level Input Voltage Modified the max value to "VCC" from "VCC+0.3". LOW Level Input Voltage Modified the min value to "0.0" from "-0.3". P7 Table 9. Electrical Characteristics (TXD) HIGH Level Input Voltage Modified the max value to "VCC" from "VCC+0.3". LOW Level Input Voltage Modified the min value to "0.0" from "-0.3". P11 Figure 6 Deleted "tTXD_RXD_F" and "tTXD_RXD_R". Modified the RXD threshold value to "50%". P12 Figure 7 Modified to "0.25 x VCC" from "0.5 x VCC". P12 Figure 8 Added Figure 8 to define "tTXD_RXD_F" and "tTXD_RXD_R". P16 Application Example Deleted 22/22 TSZ02201-0E2E0H600170-1-1 TSZ02201-0E2E0H600170-1-2 27.Dec.2018Rev.002 Rev.002 27.Dec.2018 Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001