Semiconductor Components Industries, LLC, 1999
November, 1999 – Rev. 3 1Publication Order Number:
MC33201/D
MC33201 MC33202
MC33204
Rail-to-Rail Operational
Amplifiers
The MC33201/2/4 family of operational amplifiers provide
rail–to–rail operation on both the input and output. The inputs can be
driven as high as 200 mV beyond the supply rails without phase
reversal on the outputs, and the output can swing within 50 mV of each
rail. This rail–to–rail operation enables the user to make full use of the
supply voltage range available. It is designed to work at very low
supply voltages (±0.9 V) yet can operate with a supply of up to +12 V
and ground. Output current boosting techniques provide a high output
current capability while keeping the drain current of the amplifier to a
minimum. Also, the combination of low noise and distortion with a
high slew rate and drive capability make this an ideal amplifier for
audio applications.
•Low Voltage, Single Supply Operation
(+1.8 V and Ground to +12 V and Ground)
•Input Voltage Range Includes both Supply Rails
•Output Voltage Swings within 50 mV of both Rails
•No Phase Reversal on the Output for Over–driven Input Signals
•High Output Current (ISC = 80 mA, Typ)
•Low Supply Current (ID = 0.9 mA, Typ)
•600 Ω Output Drive Capability
•Extended Operating Temperature Ranges
(–40° to +105°C and –55° to +125°C)
•Typical Gain Bandwidth Product = 2.2 MHz
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See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
P SUFFIX
CASE 626
(Quad, Top View)
8
1
(SO–8)
D SUFFIX
CASE 751
81
P SUFFIX
CASE 646
14
1(SO–14)
D SUFFIX
CASE 751A
14 1
Output 1
Inputs 1
VEE
VCC
Output 2
Inputs 2
1
2
6
7
8
5
3
2
1
4
Output 1
Inputs 1
VCC
Output 4
Inputs 4
112
13
14
11
3
2
1
4
105
96
Output 2 8
7
Inputs 2 2
4
3
VEE
Inputs 3
Output 3
(Dual, Top View)
6
7
8
5
3
2
1
4
NC
Inputs
VEE
NC
VCC
NC
Output
(Single, Top View)
(TSSOP–14)
DTB SUFFIX
CASE 948G
14
1
(Micro–8)
DM SUFFIX
CASE 846A
81
MC33201 MC33202 MC33204
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2
Vin – Vout
Figure 1. Circuit Schematic
(Each Amplifier)
VEE
VCC
VCC
VCC
VCC
Vin +
VEE
This device contains 70 active transistors (each amplifier).
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage (VCC to VEE) VS+13 V
Input Differential Voltage Range VIDR (Note 1) V
Common Mode Input Voltage Range (Note 2) VCM VCC + 0.5 V to
VEE – 0.5 V V
Output Short Circuit Duration ts(Note 3) sec
Maximum Junction Temperature TJ+150 °C
Storage Temperature Tstg – 65 to +150 °C
Maximum Power Dissipation PD(Note 3) mW
NOTES: 1.The differential input voltage of each amplifier is limited by two internal parallel back–to–back diodes. For additional differential input voltage
range, use current limiting resistors in series with the input pins.
2.The input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. Therefore, the voltage on
either input must not exceed either supply rail by more than 500 mV.
3.Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. (See Figure 2)
MC33201 MC33202 MC33204
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3
DC ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic VCC = 2.0 V VCC = 3.3 V VCC = 5.0 V Unit
Input Offset Voltage
VIO (max)
MC33201
MC33202
MC33204
±8.0
±10
±12
±8.0
±10
±12
±6.0
±8.0
±10
mV
Output Voltage Swing
VOH (RL = 10 kΩ)
VOL (RL = 10 kΩ)1.9
0.10 3.15
0.15 4.85
0.15 Vmin
Vmax
Power Supply Current
per Amplifier (ID)1.125 1.125 1.125 mA
Specifications at VCC = 3.3 V are guaranteed by the 2.0 V and 5.0 V tests. VEE = Gnd.
DC ELECTRICAL CHARACTERISTICS (VCC = + 5.0 V, VEE = Ground, TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Input Offset Voltage (VCM 0 V to 0.5 V, VCM 1.0 V to 5.0 V)
MC33201: TA = + 25°C
MC33201: TA = – 40° to +105°C
MC33201: TA = – 55° to +125°C
MC33202: TA = + 25°C
MC33202: TA = – 40° to +105°C
MC33202: TA = – 55° to +125°C
MC33204: TA = + 25°C
MC33204: TA = – 40° to +105°C
MC33204: TA = – 55° to +125°C
3VIO–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
6.0
9.0
13
8.0
11
14
10
13
17
mV
Input Offset Voltage Temperature Coef ficient (R S = 50 Ω)
TA = – 40° to +105°C
TA = – 55° to +125°C
4∆VIO/∆T–
–2.0
2.0 –
–
µV/°C
Input Bias Current (VCM = 0 V to 0.5 V, VCM = 1.0 V to 5.0 V)
TA = + 25°C
TA = – 40° to +105°C
TA = – 55° to +125°C
5, 6 IIB–
–
–
80
100
–
200
250
500
nA
Input Offset Current (VCM = 0 V to 0.5 V, VCM = 1.0 V to 5.0 V)
TA = + 25°C
TA = – 40° to +105°C
TA = – 55° to +125°C
–IIO–
–
–
5.0
10
–
50
100
200
nA
Common Mode Input Voltage Range – VICR VEE – VCC V
Large Signal Voltage Gain (VCC = + 5.0 V, VEE = – 5.0 V)
RL = 10 kΩ
RL = 600 Ω
7 AVOL 50
25 300
250 –
–
kV/V
Output Voltage Swing (VID = ±0.2 V)
RL = 10 kΩ
RL = 10 kΩ
RL = 600 Ω
RL = 600 Ω
8, 9, 10 VOH
VOL
VOH
VOL
4.85
–
4.75
–
4.95
0.05
4.85
0.15
–
0.15
–
0.25
V
Common Mode Rejection (Vin = 0 V to 5.0 V) 11 CMR 60 90 – dB
Power Supply Rejection Ratio
VCC/VEE = 5.0 V/Gnd to 3.0 V/Gnd 12 PSRR 500 25 –µV/V
Output Short Circuit Current (Source and Sink) 13, 14 ISC 50 80 – mA
Power Supply Current per Amplifier (VO = 0 V)
TA = – 40° to +105°C
TA = – 55° to +125°C
15 ID–
–0.9
0.9 1.125
1.125
mA
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4
AC ELECTRICAL CHARACTERISTICS (VCC = + 5.0 V, VEE = Ground, TA = 25°C, unless otherwise noted.)
Characteristic Figure Symbol Min Typ Max Unit
Slew Rate
(VS = ±2.5 V, VO = – 2.0 V to + 2.0 V, RL = 2.0 kΩ, AV = +1.0) 16, 26 SR 0.5 1.0 –V/µs
Gain Bandwidth Product (f = 100 kHz) 17 GBW – 2.2 – MHz
Gain Margin (RL = 600 Ω, CL = 0 pF) 20, 21, 22 AM– 12 – dB
Phase Margin (RL = 600 Ω, CL = 0 pF) 20, 21, 22
O
M– 65 – Deg
Channel Separation (f = 1.0 Hz to 20 kHz, AV = 100) 23 CS – 90 – dB
Power Bandwidth (VO = 4.0 Vpp, RL = 600 Ω, THD ≤ 1 %) BWP– 28 – kHz
Total Harmonic Distortion (RL = 600 Ω, VO = 1.0 Vpp, AV = 1.0)
f = 1.0 kHz
f = 10 kHz
24 THD –
–0.002
0.008 –
–
%
Open Loop Output Impedance
(VO = 0 V, f = 2.0 MHz, AV = 10) ZO– 100 – Ω
Differential Input Resistance (VCM = 0 V) Rin – 200 – kΩ
Differential Input Capacitance (VCM = 0 V) Cin – 8.0 – pF
Equivalent Input Noise Voltage (RS = 100 Ω)
f = 10 Hz
f = 1.0 kHz
25 en–
–25
20 –
–Hz
nV/
Equivalent Input Noise Current
f = 10 Hz
f = 1.0 kHz
25 in–
–0.8
0.2 –
–
pA/
Hz
MC33201 MC33202 MC33204
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5
300
260
220
180
T
A
, AMBIENT TEMPERATURE (°C)
100
140
P
E
R
CEN
T
A
G
E
O
F
A
MPLIFI
E
RS
(
%
)
TCVIO, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (µV/°C)
50
30
0
40
10
20
AVOL, OPEN LOOP VOLTAGE GAIN (kV/V)
Figure 2. Maximum Power Dissipation
versus Temperature Figure 3. Input Offset Voltage Distribution
PERCENTAGE OF AMPLIFIERS (%)
40
35
VIO, INPUT OFFSET VOLTAGE (mV)
30
25
15
0
20
Figure 4. Input Offset Voltage
Temperature Coefficient Distribution
2500
2000
1000
500
0
TA, AMBIENT TEMPERA TURE ( °C)
Figure 5. Input Bias Current
versus Temperature
Figure 6. Input Bias Current
versus Common Mode Voltage Figure 7. Open Loop Voltage Gain versus
Temperature
150
50
0
–50
V
C
M, INPUT COMMON MODE VOLTAGE (V)
1500
PD(max)
,
M
A
XIMUM P
O
W
E
R
D
ISSIP
A
TI
ON
(
mW
)
200
160
120
80
TA, AMBIENT TEMPERA TURE ( °C)
0
IIB , INPUT BIAS CURRENT (nA)
40
5.0
10
VCC = + 5.0 V
VEE = Gnd
VCM > 1.0 V
VCM = 0 V to 0.5 V
IIB
,
I
N
PUT BI
A
S
C
URR
EN
T
(
n
A)
100
–100
–150
– 200
– 250 – 55 – 40 – 25 0 25 70 85 125
– 50 0 20 40 50–10 10 30–30–40 –20
–10 0 4.0 8.0 10– 55 – 40 – 25 0 25 50 85 125
2.0 4.0
– 2.0 2.0 6.0– 6.0– 8.0 – 4.0
–55 – 40 – 25 0 25 70 85 125
0 6.0 8.0 10 12 105
8 and 14 Pin DIP Pkg
SO–14 Pkg
SO–8 Pkg
360 amplifiers tested from
3 (MC33204) wafer lots
VCC = + 5.0 V
VEE = Gnd
TA = 25°C
DIP Package
360 amplifiers tested from
3 (MC33204) wafer lots
VCC = + 5.0 V
VEE = Gnd
TA = 25°C
DIP Package
VCC = + 5.0 V
VEE = Gnd
RL = 600 Ω
∆VO = 0.5 V to 4.5 V
VCC = 12 V
VEE = Gnd
TA = 25°C
TSSOP–14 Pkg
MC33201 MC33202 MC33204
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6
VO, OUTPUT VOLT AGE (V )
pp VO, OUTPUT VOLT AGE (V )
pp
40
20
100
80
60
Vout, OUTPUT VOLTAGE (V)
0
f, FREQUENCY (Hz)
12
0
9.0
3.0
6.0
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
AV = +1.0
TA = 25°C
Figure 8. Output Voltage Swing
versus Supply Voltage Figure 9. Output Saturation Voltage
versus Load Current
V
IL, LOAD CURRENT (mA)
VEE
Figure 10. Output Voltage
versus Frequency
12
10
6.0
2.0
0
VCC,VEE SUPPLY VOLTAGE (V)
Figure 11. Common Mode Rejection
versus Frequency
Figure 12. Power Supply Rejection
versus Frequency Figure 13. Output Short Circuit Current
versus Output Voltage
120
80
60
f, FREQUENCY (Hz)
8.0
100
80
60
40
f, FREQUENCY (Hz)
0
CMR, COMMON MODE REJECTION (dB)
20
VCC = + 6.0 V
VEE = – 6.0 V
TA = – 55° to +125°C
PSR, POWER SUPPLY REJECTION (dB)
100
40
20
0
VCC = + 6.0 V
VEE = – 6.0 V
TA = – 55° to +125°C
VCC = + 6.0 V
VEE = – 6.0 V
TA = 25°C
4.0
SAT, OUTPUT SATURATION VOLT AGE (V)
TA = 25°C
TA = – 55°C
PSR+
PSR–
ISC , OUTPUT SHORT CIRCUIT CURRENT (mA)
Source
Sink
VCC = + 5.0 V
VEE = – 5.0 V
TA = 125°C
TA = 125°CTA = – 55°C
TA = 25°C
10 100 1.0 k 10 k 100 k 1.0 M 0 1.0 2.0 3.0 4.0 5.0 6.0
1.0 k 100 k 1.0 M10 k
01520±1.0 ±2.0 105.0
10 100 1.0 k 10 k 100 k 1.0 M
±3.0 ±4.0 ±5.0 ±6.0
RL = 600 Ω
TA = 25°C
VCC
VCC – 0.2 V
VCC – 0.4 V
VEE + 0.4 V
VEE + 0.2 V
MC33201 MC33202 MC33204
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7
, EXCESS PHASE (DEGREES)
VCC, VEE, SUPPLY VOL TAGE (V)
ISC , OUTPUT SHORT CIRCUIT CURRENT (mA)SR, SLEW RATE (V/ s)µ
TA, AMBIENT TEMPERA TURE ( °C)
VCC = + 2.5 V
VEE = – 2.5 V
VO = ±2.0 V
Figure 14. Output Short Circuit Current
versus Temperature Figure 15. Supply Current per Amplifier
versus Supply Voltage with No Load
I
Figure 16. Slew Rate
versus Temperature
TA, AMBIENT TEMPERA TURE ( °C)
Figure 17. Gain Bandwidth Product
versus Temperature
Figure 18. Voltage Gain and Phase
versus Frequency Figure 19. Voltage Gain and Phase
versus Frequency
f, FREQUENCY (Hz)
GBW , GAIN BANDWIDTH PRODUCT (MHz)
A , OPEN LOOP VOLTAGE GAIN (dB)
VCC = + 5.0 V
VEE = Gnd
CC, SUPPLY CURRENT PER AMPLIFIER (mA)
TA = 125°C
TA = – 55°C
Source
Sink TA = 25°C
+Slew Rate
–Slew Rate
TA, AMBIENT TEMPERA TURE ( °C)
VCC = + 2.5 V
VEE = – 2.5 V
f = 100 kHz
VOL
, EXCESS PHASE (DEGREES)
f, FREQUENCY (Hz)
O
O
70
50
30
10
–10
–30
2.0
0
1.5
0.5
1.0
2.0
1.6
0
150
125
75
25
0
70
50
30
100
4.0
3.0
2.0
0
1.0
10
–10
–30
50
1.2
0.8
0.4
±1.0 ±2.0 ±3.0 ±4.0 ±5.0 ±6.0
10 k 100 k 1.0 M 10 M
– 55 – 40 – 25 25 70 1250 85 105 ±0
– 55 – 40 – 25 25 70 1250 85 105 – 55 – 40 – 25 25 70 1250 85 105
10 k 100 k 1.0 M 10 M
240
40
80
120
160
200
40
80
120
160
200
240
A , OPEN LOOP VOLTAGE GAIN (dB)
VOL
1A – Phase, CL = 0 pF
1B – Gain, CL = 0 pF
2A – Phase, CL = 300 pF
2B – Gain, CL = 300 pF
1A – Phase, VS = ±6.0 V
1B – Gain, VS = ±6.0 V
2A – Phase, VS = ±1.0 V
2B – Gain, VS = ±1.0 V
VS = ±6.0 V
TA = 25°C
RL = 600 Ω
CL = 0 pF
TA = 25°C
RL = 600 Ω
1A
2A
2B
1B
1A
2A
2B 1B
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8
M, PHASE MARGIN (DEGREES)
i , INPUT REFERRED NOISE CURRENT (pA/ Hz)
n
50
40
30
e , EQUIVALENT INPUT NOISE VOLTAGE (nV/ Hz)
20
10
0
n
RT, DIFFERENTIAL SOURCE RESISTANCE (Ω)
CL, CAPACITIVE LOAD (pF)
80
0
70
40
Figure 20. Gain and Phase Margin
versus Temperature Figure 21. Gain and Phase Margin
versus Differential Source Resistance
75
60
0
Figure 22. Gain and Phase Margin
versus Capacitive Load
70
60
40
10
0
TA, AMBIENT TEMPERA TURE ( °C)
Figure 23. Channel Separation
versus Frequency
Figure 24. Total Harmonic Distortion
versus Frequency Figure 25. Equivalent Input Noise Voltage
and Current versus Frequency
10
1.0
0.1
f, FREQUENCY (Hz)
50
150
90
60
0
CS, CHANNEL SEPARA TION (dB)
30
THD, TOTAL HARMONIC DISTOR TION (%)
0.01
0.001
20
45
30
15
Phase Margin
Gain Margin
f, FREQUENCY (Hz)
f, FREQUENCY (Hz)
M, PHASE MARGIN (DEGREES)
30
AM, GAIN MARGIN (dB)
AM, GAIN MARGIN (dB)
60
10
20
30
50
AM, GAIN MARGIN (dB)
AV = 10
120
AV = 100
AV = 10
AV = 1.0
AV = 100
M, PHASE MARGIN (DEGREES)
O
O
O
100 1.0 k 10 k 100 k
10 100 1.0 k 100 k
– 55 – 40 – 25 25 70 1250 85 105 10
10 100 1.0 k 100 1.0 k 10 k
10 100 10 k 100 k10 k 1.0 k
5.0
4.0
3.0
2.0
1.0
0
70
60
40
10
0
50
20
30
75
60
0
45
30
15
16
0
14
8.0
12
2.0
4.0
6.0
10
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
CL = 100 pF
VCC = + 6.0 V
VEE = – 6.0 V
TA = 25°C
Phase Margin
Phase Margin
Gain Margin
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
AV = 100
TA = 25°C
Gain Margin
VCC = + 6.0 V
VEE = – 6.0 V
VO = 8.0 Vpp
TA = 25°C
VCC = + 5.0 V
TA = 25°C
VO = 2.0 Vpp
VEE = – 5.0 V
RL = 600 ΩVCC = + 6.0 V
VEE = – 6.0 V
TA = 25°C
Noise Voltage
Noise Current
AV = 1000
MC33201 MC33202 MC33204
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9
DETAILED OPERATING DESCRIPTION
General Information
The MC33201/2/4 family of operational amplifiers are
unique in their ability to swing rail–to–rail on both the input
and the output with a completely bipolar design. This offers
low noise, high output current capability and a wide
common mode input voltage range even with low supply
voltages. Operation is guaranteed over an extended
temperature range and at supply voltages of 2.0 V, 3.3 V and
5.0 V and ground.
Since the common mode input voltage range extends from
VCC to VEE, it can be operated with either single or split
voltage supplies. The MC33201/2/4 are guaranteed not to
latch or phase reverse over the entire common mode range,
however, the inputs should not be allowed to exceed
maximum ratings.
Circuit Information
Rail–to–rail performance is achieved at the input of the
amplifiers by using parallel NPN–PNP differential input
stages. When the inputs are within 800 mV of the negative
rail, the PNP stage is on. When the inputs are more than 800
mV greater than VEE, the NPN stage is on. This switching
of input pairs will cause a reversal of input bias currents (see
Figure 6). Also, slight differences in offset voltage may be
noted between the NPN and PNP pairs. Cross–coupling
techniques have been used to keep this change to a
minimum.
In addition to its rail–to–rail performance, the output stage
is current boosted to provide 80 mA of output current,
enabling the op amp to drive 600 Ω loads. Because of this
high output current capability, care should be taken not to
exceed the 150°C maximum junction temperature.
O, OUTPUT VOLT AGE (50 mV/DIV)V
t, TIME (10 µs/DIV)
Figure 26. Noninverting Amplifier Slew Rate Figure 27. Small Signal Transient Response
t, TIME (5.0 µs/DIV)
Figure 28. Large Signal Transient Response
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
CL = 100 pF
TA = 25°C
O, OUTPUT VOLT AGE (2.0 mV/DIV)
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
CL = 100 pF
AV = 1.0
TA = 25°C
V
VCC = + 6.0 V
VEE = – 6.0 V
RL = 600 Ω
CL = 100 pF
TA = 25°C
t, TIME (10 µs/DIV)
O, OUTPUT VOLT AGE (2.0 V/DIV)V
MC33201 MC33202 MC33204
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10
ORDERING INFORMATION
Operational
Amplifier Function Device Operating
Temperature Range Package Shipping
MC33201D SO–8 98 Units / Rail
MC33201DR2 TA= –40 ° to +105°CSO–8 2500 Units / Tape & Reel
Single
MC33201P Plastic DIP 50 Units / Rail
Single
MC33201VD SO–8 98 Units / Rail
MC33201VDR2 TA = –40 ° to +125°CSO–8 2500 Units / Tape & Reel
MC33201VP Plastic DIP 50 Units / Rail
MC33202D SO–8 98 Units / Rail
MC33202DR2
TA= –40
°
to +105
°
C
SO–8 2500 Units / Tape & Reel
MC33202DMR2
TA
= –
40
°
to
+105°C
Micro–8 4000 Units / Tape & Reel
Dual MC33202P Plastic DIP 50 Units / Rail
MC33202VD SO–8 98 Units / Rail
MC33202VDR2 TA = –40 ° to +125°CSO–8 2500 Units / Tape & Reel
MC33202VP Plastic DIP 50 Units / Rail
MC33204D SO–14 55 Units / Rail
MC33204DR2 SO–14 2500 Units / Tape & Reel
MC33204DTB TA= –40 ° to +105°CTSSOP–14 96 Units / Rail
Quad
MC33204DTBR2 TSSOP–14 2500 Units / Tape & Reel
Quad
MC33204P Plastic DIP 25 Units / Rail
MC33204VD SO–14 55 Units / Rail
MC33204VDR2 TA = –40 ° to +125°CSO–14 2500 Units / Tape & Reel
MC33204VP Plastic DIP 25 Units / Rail
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11
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14
58
F
NOTE 2 –A–
–B–
–T–
SEATING
PLANE
H
J
GDK
N
C
L
M
M
A
M
0.13 (0.005) B M
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.40 10.16 0.370 0.400
B6.10 6.60 0.240 0.260
C3.94 4.45 0.155 0.175
D0.38 0.51 0.015 0.020
F1.02 1.78 0.040 0.070
G2.54 BSC 0.100 BSC
H0.76 1.27 0.030 0.050
J0.20 0.30 0.008 0.012
K2.92 3.43 0.115 0.135
L7.62 BSC 0.300 BSC
M––– 10 ––– 10
N0.76 1.01 0.030 0.040
__
(SO–8)
D SUFFIX
PLASTIC PACKAGE
CASE 751–05
ISSUE R
SEATING
PLANE
14
58
A0.25 MCBSS
0.25 MBM
h
q
C
X 45
_
L
DIM MIN MAX
MILLIMETERS
A1.35 1.75
A1 0.10 0.25
B0.35 0.49
C0.18 0.25
D4.80 5.00
E1.27 BSCe3.80 4.00
H5.80 6.20
h
0 7
L0.40 1.25
q
0.25 0.50
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
EH
A
Be
B
A1
CA
0.10
MC33201 MC33202 MC33204
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12
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
17
14 8
B
A
F
HG D K
C
N
L
J
M
SEATING
PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L0.300 BSC 7.62 BSC
M0 10 0 10
N0.015 0.039 0.39 1.01
____
(SO–14)
D SUFFIX
PLASTIC PACKAGE
CASE 751A–03
ISSUE F NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P7 PL
14 8
71 M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
–T–
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
____
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13
PACKAGE DIMENSIONS
(TSSOP–14)
DTB SUFFIX
PLASTIC PACKAGE
CASE 948G–01
ISSUE O
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C––– 1.20 ––– 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L–U–
SEATING
PLANE
0.10 (0.004)
–T–
ÇÇ
ÇÇ
SECTION N–N
DETAIL E
JJ1
K
K1
ÉÉ
ÉÉ
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
–V–
14X REFK
N
N
MC33201 MC33202 MC33204
http://onsemi.com
14
PACKAGE DIMENSIONS
(Micro–8)
DM SUFFIX
PLASTIC PACKAGE
CASE 846A–02
ISSUE D
S
B
M
0.08 (0.003) A S
TDIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C––– 1.10 ––– 0.043
D0.25 0.40 0.010 0.016
G0.65 BSC 0.026 BSC
H0.05 0.15 0.002 0.006
J0.13 0.23 0.005 0.009
K4.75 5.05 0.187 0.199
L0.40 0.70 0.016 0.028
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–B–
–A–
D
K
G
PIN 1 ID
8 PL
0.038 (0.0015)
–T– SEATING
PLANE C
HJL
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15
Notes
MC33201 MC33202 MC33204
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16
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