ZXMN3A04DN8
ISSUE 2 - OCTOBER 2002
4
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage V(BR)DSS 30 VID=250µA, VGS=0V
Zero Gate Voltage Drain Current IDSS 0.5 µAVDS=30V, VGS=0V
Gate-Body Leakage IGSS 100 nA VGS=±20V, VDS=0V
Gate-Source Threshold Voltage VGS(th) 1.0 VID=250µA, VDS=V
GS
Static Drain-Source On-State Resistance
(1) RDS(on) 0.02
0.03 Ω
ΩVGS=10V, ID=12.6A
VGS=4.5V, ID=10.6A
Forward Transconductance (3) gfs 22.1 SV
DS=15V,ID=12.6A
DYNAMIC (3)
Input Capacitance Ciss 1890 pF VDS=15V, VGS=0V,
f=1MHz
Output Capacitance Coss 349 pF
Reverse Transfer Capacitance Crss 218 pF
SWITCHING(2) (3)
Turn-On Delay Time td(on) 5.2 ns
VDD =15V, ID=1A
RG=6.0Ω,V
GS=10V
Rise Time tr6.1 ns
Turn-Off Delay Time td(off) 38.1 ns
Fall Time tf20.2 ns
Gate Charge Qg19.9 nC VDS=15V,VGS=5V,
ID=6.5A
Total Gate Charge Qg36.8 nC VDS=15V,VGS=10V,
ID=6.5A
Gate-Source Charge Qgs 5.8 nC
Gate-Drain Charge Qgd 7.1 nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1) VSD 0.85 0.95 VT
J=25°C, IS=6.8A,
VGS=0V
Reverse Recovery Time (3) trr 18.4 ns TJ=25°C, IF=2.3A,
di/dt= 100A/µs
Reverse Recovery Charge (3) Qrr 11 nC
ELECTRICAL CHARACTERISTICS (at TA= 25°C unless otherwise stated).
NOTES
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.