PACKAGE OUTLINES SOT78 (TO-220AB) SOT82 SOT186(TO-220) SOT186A (Isolated TO-220AB) SOT199 SOT399 (TOP3D) SOT429 (TO-247) SOT430 (TOP3L) Page 754 755 756 757 758 759 760 761 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB E SOT78 A A1 P q D1 D L1 L2(1) Q b1 L 1 2 3 b e c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A A1 b b1 c D D1 E e L L1 L2 max. P q Q mm 4.5 4.1 1.39 1.27 0.9 0.7 1.3 1.0 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 2.54 15.0 13.5 3.30 2.79 3.0 3.8 3.6 3.0 2.7 2.6 2.2 Note 1. Terminals in this zone are not tinned. OUTLINE VERSION SOT78 1998 Sep 23 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-11 TO-220AB 754 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; 3 leads (in-line) SOT82 E A q P D L1 Q L 1 2 3 c w M b e e1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT A b c D E e e1 L L1 max. P Q q w mm 2.8 2.3 0.88 0.65 0.58 0.47 11.1 10.5 7.8 7.2 2.29 4.58 16.5 15.3 2.54 3.1 2.5 1.5 0.9 3.9 3.5 0.254 Note 1. Terminal dimensions within this zone are uncontrolled to allow for body and terminal irregularities. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-06-11 SOT82 1998 Sep 23 EUROPEAN PROJECTION 755 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 exposed tabs SOT186 E E1 A P A1 m q D1 D L1 Q b1 L L2 1 2 3 b c w M e e1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 c D D1 E E1 e e1 L L1(1) L2 m P Q q w mm 4.4 4.0 2.9 2.5 0.9 0.7 1.5 1.3 0.55 0.38 17.0 16.4 7.9 7.5 10.2 9.6 5.7 5.3 2.54 5.08 14.3 13.5 4.8 4.0 10 0.9 0.5 3.2 3.0 1.4 1.2 4.4 4.0 0.4 Note 1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned. OUTLINE VERSION SOT186 1998 Sep 23 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-11 TO-220 756 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 E SOT186A A A1 P q D1 T D j L2 L1 K Q b1 L b2 1 2 3 b c w M e e1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) (1) UNIT mm A 4.6 4.0 A1 2.9 2.5 b b1 b2 0.9 0.7 1.1 0.9 1.4 1.2 c 0.7 0.4 D 15.8 15.2 D1 6.5 6.3 E 10.3 9.7 e 2.54 e1 j K 5.08 2.7 2.3 0.6 0.4 L L1 14.4 3.30 13.5 2.79 L2 max. 3 P Q q 3.2 3.0 2.6 2.3 3.0 2.6 T (2) 2.5 w 0.4 Notes 1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned. 2. Both recesses are 2.5 x 0.8 max. depth OUTLINE VERSION SOT186A 1998 Sep 23 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-11 TO-220 757 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads (in-line) SOT199 E E1 m A A1 P q D L1 Q b1 L 1 2 3 e b c w M e1 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 c D E E1 e e1 L mm 5.2 4.8 3.4 3.0 1.2 1.0 2.1 1.9 0.6 0.5 21.5 20.5 15.3 14.7 7.8 6.8 5.45 10.9 16.5 15.7 (1) L1 3.7 3.3 m P Q q w 0.8 0.6 3.3 3.1 2.1 1.9 6.2 5.8 0.4 45 Note 1. Terminals in this zone are not tinned. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT199 1998 Sep 23 EUROPEAN PROJECTION ISSUE DATE 97-06-27 758 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads E m SOT399 A A1 P q D2 D D1 q1 L1 k Q b1 b2 L 1 2 3 b e w M c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 b2 c D mm 5.8 4.8 3.3 2.7 1.2 0.9 2.2 1.8 4.7 4.2 0.9 0.6 27 26 D1 D2 E 22.5 10.2 21.5 9.9 16 15 e k L 5.45 2.2 1.8 19.1 18.1 L1 (1) 5.4 4.8 m P Q q q1 0.8 0.6 3.4 3.1 3.4 3.2 4.7 4.3 25.7 25.1 w 0.4 27 23 Note 1. Tinning of terminals are uncontrolled within zone L1. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT399 1998 Sep 23 EUROPEAN PROJECTION ISSUE DATE 98-11-06 759 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247 SOT429 E P A A1 q S R D Y L1(1) Q b2 L 1 2 3 c w M b b1 e e 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1 b2 c D E e L mm 5.3 4.7 1.9 1.7 1.2 0.9 2.2 1.8 3.2 2.8 0.9 0.6 21 20 16 15 5.45 16 15 (1) L1 4.0 3.6 P Q q R S w Y 3.7 3.3 2.6 2.4 5.3 3.5 3.3 7.5 7.1 0.4 15.7 15.3 6 4 17 13 Note 1. Tinning of terminals are uncontrolled within zone L1. OUTLINE VERSION SOT429 1998 Sep 23 REFERENCES IEC JEDEC EIAJ TO-247 EUROPEAN PROJECTION ISSUE DATE 98-04-07 760 Philips Semiconductors Power Bipolar Transistors Package outlines Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead JUMBO TO-247 E SOT430 A P A1 q R S D Y R1 R2 R2 L1(1) Q b2 L 1 2 3 c w M b b1 e e 0 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 b mm 5.3 2.3 1.0 0.8 b1 b2 c max. max. max. 2.5 3.5 0.8 D E max. 26.5 20.5 25.5 L min. L1 P Q max. q R R1 R2 S w Y 5.45 19.5 2.5 3.5 3.1 3.0 6.0 4.0 3.0 1.5 16 0.4 20.5 19.5 e Note 1. Terminals are uncontrolled within zone L1. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT430 1998 Sep 23 EUROPEAN PROJECTION ISSUE DATE 97-06-23 761