DEVICE DESCRIPTION
The ZXFV302 is a 4:1 high speed analog switch
designed for use as a buffered video multiplexer and
other high-speed applications.
It features low different gain and phase distortion. The
highspeedhighoutputcurrentcapabilityprovides75⍀
cable drive for use in high performance video
applications.
The input channel is selected by means of two logic
lines using an internal decoder. An output enable line
allows expansion to eight channels using two devices
ZXFV302asshownintheexampleapplicationfigure1.
An alternative device, ZXFV301 provides the same
functionality and pin-out as the ZXFV302 but with four
separate logic lines controlling the switch channels
directly.
FEATURES AND BENEFITS
•3dB Bandwidth 300MHz
•Slew rate 450V/ s
•Differential gain 0.01%
•Differential phase 0.04⬚
•Output current 40mA
•Stable up to 100pF load
•⫾5 Volt supply
•Supply current 17mA
•16 pin SO package
APPLICATIONS
•Video routing and switching
•CCTV switching
•Video distribution selection
•RGB multiplexing
•High frequency instrumentation Data acquisition
•Data acquisition
ZXFV302
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4:1 HIGH SPEED MULTIPLEXER
Part Number Container Increment
ZXFV302N16TA Reel 7″500
ZXFV302N16TC Reel 13″2500
Ordering information
3
1
2
4
5
6
7
8 9
10
11
12
13
14
15
16
ZXFV302
IN1
0V
0V
0V
OUT
IN2
IN3
IN4
V+
V-
0V
EN
NC
A1
A0
NC
Connection Diagram
Fig.1:Typical Application for 8 channel CCTV
ABSOLUTE MAXIMUM RATINGS
Supply voltage VCC -0.5V to +6V
Supply voltage VEE -6V to +0.5V
Analog inputs to ground VEE -0.5V to VCC +0.5V
Digital inputs to ground -0.5V to VCC +0.5V
Outputs to ground* VEE -0.5V to VCC +0.5V
Output current, max continous 40mA
Operating Ambient Temperature Range -40⬚C to 85⬚C Storage -65⬚C to 150⬚C
Operating Junction temperature TJMAX 150⬚C**
**The thermal resistance from the semiconductor die to ambient is typically 120⬚C/W when the SO16 package is
mounted on a PCB in free air. The power dissipation of the device when loaded must be designed to keep the
device junction temperature below TJMAX.
*During power-up and power-down, these voltage ratings require an appropriate sequence of applying and
removing signals and power supplies.
ZXFV302
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PARAMETER CONDITIONS TEST MIN TYP MAX UNIT
Supply Voltage V+ 4.75 5 5.25 V
Supply Voltage V- -5.25 -5 -4.75 V
Positive supply current P 13 17 21 mA
Negative supply current P 9 13 18 mA
Voltage gain DC P 0.99 1.000 1.01 V/V
Input Common mode Voltage P ⫾3V
Input resistance P 45 k⍀
Output offset Voltage All channels held at 0V P -10 +11 +30 mV
Input bias current Active channels held at 0V P -25 -11 +5 A
Output Voltage swing P ⫾3V
Output drive current P 40 mA
Output resistance C 1 ⍀
Output resistance Disabled (EN low) P 1.5 3 4.5 M⍀
Positive PSRR P 40 54 dB
Negative PSRR P 30 51 dB
Small signal bandwidth1C 300 MHz
Slew rate, 25% to 75% 2V pk-pk C 450 V/s
Logic input HIGH VHmin C2V
Logic input LOW VLmax C 0.8 V
Logic input current IINHIGH logic input voltage = 5V C 5 pA
Logic input current IINLOW logic input voltage = 0V C -70 A
ELECTRICAL CHARACTERISTICS
⫾5V power supplies, Tamb = 25⬚C unless otherwise stated. RL= 150⍀, CL= 10pF
Characteristics apply to channel selected, and EN input HIGH unless otherwise stated
Test level: P = 100% production test
C = characterised only
ZXFV302
ISSUE 4 - NOVEMBER 2002
3
A1 A0 EN OUT
XX0HiZ
001IN1
011IN2
101IN3
111IN4
Truth table for selection of input channel
Notes: The ‘select’ waveform represents a change in the the 2 bit control word A0 and A1.
tHIGH is equivalent to tLOW but , applies for a positive going transition of OUT.
Fig.2: TIMING DIAGRAM
PARAMETER CONDITIONS TEST MIN TYP MAX UNIT
tON Vout = ⫾2V, see timing diagram C 35 ns
tOFF Vout = ⫾2V, see timing diagram C 10 ns
tLOW Vout = ⫾2V, see timing diagram C 50 ns
tHIGH Vout = ⫾2V, see timing diagram C 40 ns
Cross-talk, all hostile110MHz, 0dBm in C 75 dB
Differential Gain C 0.01 %
Differential Phase C 0.04 deg
Switching transients,
magnitude All channels held at 0V C 50 mV
Switching transients,
duration All channels held at 0V C 25 ns
ELECTRICAL CHARACTERISTICS
⫾5V power supplies, Tamb = 25⬚C unless otherwise stated. RL= 150⍀, CL= 10pF
Characteristics apply to channel selected, and EN input HIGH unless otherwise stated
Test level:P = 100% production test
C = characterised only
Notes:
1. Bandwidth and cross talk measured using Zetex Evaluation Circuit Board detailed later in this datasheet.
ZXFV302
ISSUE 4 - NOVEMBER 2002
4
CHARACTERISTICS
APPLICATIONS INFORMATION
Introduction
A typical circuit application is outlined in Figure 1,
above, where two devices are combined to provide
8-to-1 multiplexing. A more detailed basic application
circuit for 4 dc-coupled channels is given in Figure 3,
and an AC coupled circuit for 8 channels is shown in
Figure 4. These circuits are suitable for 75⍀
transmissionlineconnections atboththeinput andthe
output and are useful for distribution of wide-band
signals such as video via cables. The 75⍀reverse
terminating resistor at the output gives the correct
matching condition to a terminated video cable. The
amplifier load is then 150⍀.
The wide bandwidth of this device necessitates some
care in the layout of the printed circuit. Partly for this
reason, an Evaluation Circuit board is available and is
described in a later paragraph. A continuous ground
plane is required under the device and its signal
connection paths, to provide the shortest possible
ground return paths for signals and power supply
filtering. A double-sided or multi-layer PCB
construction is required, with plated-through via holes
providing closely spaced low-inductance connections
from some components to the continuous ground
plane (someoftheseholesarenotvisibleinthefigures
for the Evaluation Circuit Board – artworks and NC drill
output can be provided if required).
For the power supply filtering, low inductance surface
mount capacitors are normally required. It has been
found that very good RF decoupling is provided on
each supply using a 1000 pF NPO size 0805 ceramic
surfacemount capacitor,closestto thedevicepin, with
anadjacent0.1 FX7Rcapacitor. Otherconfigurations
arepossibleanditmaybefoundthatasingle0.01For
0.1 F X7R capacitor, size 0805 or smaller, on each
supply gives good results. However this should be
supported by larger decoupling capacitors elsewhere
on the printed circuit board. Values of 1 to 10 F are
recommended, particularly where the voltage
regulatorsare locatedmore than afew inchesfrom the
device. These larger capacitors are recommended to
be solid tantalum electrolytic or ceramic types.
Evaluation Circuit
An evaluation circuit is available, constructed on a
double-sideprintedcircuitboard.Thecircuit is suitable
for both the ZXFV301 and ZXFV302 and either device
maybefitted. Figures5and6showthecircuitdiagram,
and the layout of components and copper. A parts list
is provided below. This layout serves as a useful
example for many applications, showing the practical
implementation of the advice given above in the
Introduction.
BNC connector sockets allow connection to test
instrumentsvia 50⍀cables.The outputcircuit includes
a resistor matching circuit to present a load of 150⍀to
the device and simultaneously provide 50⍀output
impedance. The attenuation of this matching circuit is
15.45 dB. As the device has unity voltage gain, the
overall loss when loaded by 75⍀is also 15.45 dB.
EVALUATION CIRCUIT PARTS LIST:
ZXFV302
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5
QTY CCT-REF VALUE DESCRIPTION
Resistors, surface mount
4 R1,R2,R3,R4 51R 0805
4 R5,R6,R7,R8 22k 0805
1 R9 120R 0805
1 R10 62R 0805
1 R11 10R 0805
5 R12 to R16 47k 0805
Capacitors, surface mount
6 100nF 25V ceramic 0805
X7R
2 1nF 50V ceramic 0805
NPO
210F 16V Tant Elec size
C
Integrated Circuits
1U1 ᎏZetex ZXF 301N16
or ZXFV302N16
Miscellaneous
5ᎏBNC Socket, PCB
straight flange,
e.g. Tyco
B35N14H999X99
1ᎏ3-way PCB screw
terminal block IMO
20.501/3SB
1SW1 ᎏDIL switch, 8 way
10 TP1 to TP10 ᎏPCB test terminal,
red, W.Hughes
100-107
ZXFV302
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Figure 3: BASIC APPLICATION CIRCUIT, 4 CHANNEL DC COUPLED, DUAL SUPPLIES
ZXFV302
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Figure 4: CCTV CIRCUIT WITH 8 CAMERA FROM SINGLE SUPPLY
ZXFV302
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Figure 5: EVALUATION CIRCUIT & PRINTED BOARD LAYOUT
SHOWING TOP COPPER (overall dimensions 4x3 inches)
ZXFV302
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Figure 6: EVALUATION CIRCUIT BOARD BOTTOM COPPER
(viewed through from top)
Notes
ZXFV302
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Notes
ZXFV302
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ZXFV302
ISSUE 4 - NOVEMBER 2002
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Europe
Zetex plc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4422
Fax: (44) 161 622 4420
uk.sales@zetex.com
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY11788
USA
Telephone: (631) 360 2222
Fax: (631) 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza, Tower 1
Hing Fong Road
Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services
concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or
service. For the latest product information, log on to
www.zetex.com
© Zetex plc 2002
PACKAGE OUTLINE
DIM Millimetres Inches
MIN MAX MIN MAX
A 9.80 10.00 0.386 0.394
B 1.27 BSC 0.05 BSC
C 0.53 REF 0.02 REF
D 0.33 0.51 0.013 0.020
E 3.80 4.00 0.15 0.157
F 1.35 1.75 0.053 0.069
G 0.10 0.25 0.004 0.01
H 0°8°0°8°
I 0.40 1.27 0.016 0.05
J 5.80 6.20 0.228 0.244
Conforms to JEDEC MS-012AC Iss C (SO16N)
