Technical Data 4324 Effective June 2017
Supersedes June 2008
Product features
•11.0 x 8.0 x 4.90mm surface mount package
•Ferrite core material
•High current carrying capacity
•Low core losses
•Controlled DCR tolerance for sensing circuits
•Inductance range from 101nH to 226nH
•Current range from 39 to 81Amps
•Frequency range up to 2MHz
•Halogen free, lead free, RoHS compliant
Applications
•Multi-phase regulators
•Voltage Regulator Module (VRM)
•Portable electronics
•Servers and workstations
•Data networking and storage systems
•Notebook and desktop computers
•Graphics cards and battery power systems
•DCR sensing
•Storage temperature range (component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
FP1105
High current power inductors
Pb
HALOGEN
HF
FREE
SMD Device
Environmental data
2
Technical Data 4324
Effective June 2017
FP1105
High current power inductors
www.eaton.com/electronics
Packaging information - mm
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1105Rx-Rxx-R
• Rx is the DCR indicator• FP1105 = Product code and size
• Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant
Product Specifications
Part Number OCL1± 10% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6
FP1105R1-R10-R 100 72 81 63 467
FP1105R1-R12-R 120 86 66 50 467
FP1105R1-R15-R 150 109 46 54 42 0.35 ± 8.6% 467
FP1105R1-R20-R 192 138 42 34 467
FP1105R1-R22-R 226 163 39 28 467
A = 11.0 Max. B = 8.0 Max. C = 4.9 Max. D = 2.4 ± 0.2 E = 2.3 ± 0.3 F = 6.2 Typ.
1
2
wwllyy
B
A
E
F
Top View Bottom ViewLeft View
2.8
2.8
5.8
Rxx
1
2a
b
Recommended Pad Layout Schematic
CD
1105Rx
R
Part Marking: 1105Rx (Rx = DCR indicator) Rxx = inductance value in μH (R = decimal point) wwllyy = date code R = revision level
Nominal DCR is measured from point “a” to point “b.”
Dimensions- mm
SECTION A-A
A
A
1.5 dia
1.5 dia
4.0
2.0
12.0
1.75
11.5
24.0
+/-0.3
User direction of feed
1
2
8.2
wwllyy
Rxx
5.2
11.3
1105Rx
R
Supplied in tape-and-reel packaging, 900 parts per reel, 13” diameter reel.
Packaging Information - mm
3
FP1105
High current power inductors
www.eaton.com/electronics
Technical Data 4324
Effective June 2017
Temperature rise vs. total loss
50
40
30
20
10
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
Total loss (W)
Temperature rise(
°C
)
Core Loss vs Bp-p
10 1MHz 500kHz
300kHz
200kHz
1100kHz
0.1
0.01
0.001
0.0001
100 1000 10000
BB p - p (Gauss)
Core Loss (W)
Inductance characteristics
OCL vs. Is
at1
100%
80%
60%
40%
+125°C
20%
+25°C
-40°C
0%
0% 20%40%60%80%100% 120%
% of I 1
s
a
t
% of OCL
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4324 BU-SB08211
May 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4324
Effective June 2017
FP1105
High current power inductors
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
