AA032P1-A4 - Alpha Industries, Inc.

Alpha Industries, Inc. [978] 241-7000 •Fax [978] 241-7906 •Email sales@alphaind.com •www.alphaind.com 1

Specifications subject to change without notice. 1/02A

29–32 GHz Surface Mount

Medium Power Amplifier

Features

■Surface Mount Package

■11 dB Gain

■24 dBm P1 dB Output Power

■100% DC and RF Testing

AA032P1-A4

Patent Pending

Description

The AA032P1-A4 is a broadband millimeterwave medium

power amplifier in a rugged surface mount package that

is compatible with high-volume solder installation. The

amplifier is designed for use in millimeterwave

communication and sensor systems as an output stage

or driver in the transmit chain or LO chain when high gain

and high linearity is required. The robust ceramic

surface mount package provides excellent electrical

performance and a high degree of environmental

protection for long-term reliability. All amplifiers are

screened at the operating frequencies prior to shipment

for guaranteed performance. Amplifier is targeted for high-

volume millimeterwave applications such as point-to-point

and point-to-multipoint wireless communications systems

and satellite communication systems.

Parameter Symbol Min. Typ. Max. Unit

Bandwidth BW 29 32 GHz

Small Signal Gain1G911 dB

Output Power at 1 dB Gain Compression2P1 dB 23 24 dBm

Input Return Loss4RLI9dB

Output Return Loss4RLO7dB

Temperature Coefficient of Gain4dG/dT -0.038 dB/C

Drain Current3ID400 450 mA

Electrical Specifications at 25°C (VD= 6 V, VG= -1 V)

Pin Out

AA032P1-A4

YYWW

RF In RF Out

Orientation

Indicated by

Missing

Castellations

N/CVGVD

N/C N/C N/C

1. Small signal gain over entire bandwidth is measured on 100% of parts.

2. Output power P1 dB is measured at 31 GHz on 100% of parts.

3. Drain current is measured on 100% of parts.

4. Not measured on 100% of parts.

Preliminary

29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4

2Alpha Industries, Inc. [978] 241-7000 •Fax [978] 241-7906 •Email sales@alphaind.com •www.alphaind.com

Specifications subject to change without notice. 1/02A

Characteristic Value

Operating Temperature (TC) -55°C to +85°C

Storage Temperature (TST) -65°C to +125°C

Bias Voltage (VD)7 V

Power In (PIN) 22 dBm

Absolute Maximum Ratings

(dB)

Frequency (GHz)

S-Parameters

-20

-10

25 30 35 40

S21

S11

S22

Output Power (dBm)

Input Power (dBm)

Output Power vs. Input Power

3 6 9 12 15 18

P1 dB = 23.0 dBm @ 28 GHz

P1 dB = 24.7 dBm @ 30 GHz

P1 dB = 23.9 dBm @ 32 GHz

P1 dB = 24.3 dBm

@ 31GHz

(dB)

Frequency (GHz)

Gain vs. Temperature

-20

-10

27 29 31 33 35

+85˚C

-55˚C

+25˚C

P1 dB (dBm)

Frequency (GHz)

P1 dB vs. Frequency

29 30 31 32

6.0 V

5.5 V

Typical Performance Data (VD= 6 V, VG= -1 V)

Outline Drawing

YYWW

0.080

(0.20 mm)

0.037

(0.94 mm)

0.040

(1.02 mm)

0.065

(1.65 mm)

0.026

(0.66 mm)

0.153

(3.87 mm)

0.145

(3.68 mm)

0.054

(1.37 mm)

0.014

(0.36 mm)

0.056 (1.42 mm)

0.285

(7.24 mm)

0.291 (7.39 mm)

0.275 (6.98 mm)

0.306

(7.77 mm)

0.040 (1.02 mm)

29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4

Alpha Industries, Inc. [978] 241-7000 •Fax [978] 241-7906 •Email sales@alphaind.com •www.alphaind.com 3

Specifications subject to change without notice. 1/02A

Typical S-Parameters at 25°C (VD= 6 V, VG= -1 V)

Frequency S11 S21 S12 S22

(GHz) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.) Mag. (dB) Ang. (Deg.)

10 -0.5 -94 -35.3 4 -61.1 -114 -0.5 44

12 -0.7 -158 -50.8 -154 -51.1 176 -0.3 0

14 -1.0 111 -56.9 100 -55.0 99 -0.4 -37

16 -1.3 39 -43.2 83 -43.0 84 -0.9 -96

18 -0.8 -36 -40.3 31 -45.1 8 -1.3 -147

20 -0.6 -109 -29.3 17 -39.2 62 -1.1 166

22 -1.0 -165 -15.8 -76 -52.1 41 -2.1 104

24 -2.4 77 -3.6 171 -38.7 -48 -3.3 -3

25 -2.8 -7 1.4 106 -46.4 -65 -3.3 -55

26 -3.1 -75 5.3 43 -39.8 -37 -2.7 -105

27 -3.5 -136 9.8 -24 -32.0 -75 -2.8 -152

28 -6.1 159 12.7 -104 -28.7 -156 -6.7 162

29 -8.7 121 13.1 179 -28.4 132 -17.0 145

30 -7.8 60 12.6 111 -28.0 77 -16.3 -177

31 -5.7 1 12.1 51 -28.6 22 -19.6 177

32 -5.0 -52 11.9 -13 -28.4 -23 -26.1 118

33 -6.6 -86 10.5 -71 -28.9 -66 -14.2 14

34 -7.5 -129 10.3 -124 -27.7 -114 -9.4 -10

35 -9.8 167 11.0 178 -26.9 -177 -10.8 -39

36 -13.4 143 10.7 111 -26.1 123 -16.7 -114

37 -7.6 163 8.8 39 -26.1 65 -11.9 149

38 -5.8 129 6.3 -25 -23.7 25 -10.7 99

39 -8.7 77 2.2 -87 -21.4 -16 -11.5 47

40 -4.8 23 -0.4 -141 -19.8 -72 -9.2 9

Biasing

For biasing on, adjust VGfrom 0 to approximately -1 V.

Adjust VDfrom 0 to desired value (5 V–6 V recommended).

Adjust VGto achieve desired ID(400 mA recommended).

For biasing off, reverse the biasing on procedure.

29–32 GHz Surface Mount Medium Power Amplifier AA032P1-A4

4Alpha Industries, Inc. [978] 241-7000 •Fax [978] 241-7906 •Email sales@alphaind.com •www.alphaind.com

Specifications subject to change without notice. 1/02A

Alpha-2TM Surface Mount Package

Handling and Mounting

Millimeterwave components require careful mounting

design to maintain optimal performance. The Alpha-2TM

surface mount package (patent pending) provides a

rugged and repeatable electrical connection using

standard solder techniques.

The -A4 package is one of several parts in the Alpha-2TM

surface mount package family.

Handling

The -A4 surface mount package is very rugged. However,

due to ceramic’s brittle nature, one should exercise care

when handling with metal tools. Do not apply heavy

pressure to the lid. Vacuum tools may be used to pick and

place this part.

Only personnel trained in both ESD precautions and

handling precautions should be allowed to handle these

packages.

Package Construction

The -A4 surface mount package consists of a base and

a lid. The package base is ceramic with filled vias and

plated castellations.The package lid is unplated alumina.

The lid seal is epoxy.

Mounting Design

The -A4 surface mount package is installed on top of a printed

circuit board on a specially designed footprint.

Mounting footprint geometry for the -A4 package will be

supplied by Alpha Industries in electronic format upon request.

Mounting the Package

The -A4 surface mount package is compatible with high-

volume surface mount installation using solder. RF and DC

connections are accomplished with metallized edge

castellations that hold solder fillets. Ground connections are

accomplished by both metallized edge castellations and

filled vias to the bottom of the package. Care should be

taken to ensure that there are no voids or gaps in the solder

so that good RF, DC and ground contact is maintained.

-A4 Surface Mount Package Installation.

Printed Circuit Board

Rogers 4003,

0.008" (0.20 mm) Thick

or Equivalent

Electrically & Thermally

Conductive Ground Plane

RF In

RF Out

DC Bias Lines

(Up to 3 per side)

DC Bias Lines

(Up to 3 per side)

Footprint Geometry for -A4 Surface Mount Package.

DC Connections

RF In

Via Holes

to Ground

RF Out

DC Connections