○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/20
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・14・001
Voltage Detector (Reset) IC Series for Automotive Application
Free Time Delay Setting
CMOS Voltage Detector (Reset) IC
BD52xx-2C Series and BD53xx-2C Series
General Description
ROHM's BD52xx-2C and BD53xx-2C series are highly
accurate, low current consumption Voltage Detector
ICs with a capacitor controlled time delay. The lineup
includes N-channel open drain output (BD52xx-2C)
and CMOS output (BD53xx-2C) so that the users can
select depending on the application. The devices are
available for specific detection voltage ranging from
0.9V to 5.0V with 0.1V increment.
The time delay has ±50% accuracy in the overall
operating temperature range of -40°C to 125°C.
Special Features
AEC-Q100 Qualified (Note1)
Nano Energy
Delay Time Setting controlled by external capacitor
Two output types (Nch open drain and CMOS output)
Very small, lightweight and thin package
Package SSOP5 is similar to SOT-23-5 (JEDEC)
(Note1: Grade 1)
Key Specifications
Detection Voltage: 0.9V to 5.0V (Typ.)
0.1V step
Ultra-Low Current Consumption: 270nA (Typ.)
Time Delay Accuracy: ±50% (-40°C to +125°C, )
(CT pin capacitor ≥ 1nF)
Special Characteristics
Detection Voltage Accuracy:
±3%±12mV (VDET=0.9V to 1.6V)
±3% (VDET=1.7V to 5.0V)
Package
SSOP5: W(typ) x D(typ) x H(max)
2.90mm x 2.80mm x 1.25mm
Application
All automotive devices that requires voltage detection
Application Circuit
Pin Configuration
SSOP5
TOP VIEW
Pin Description
Nano Energy is a combination of technologies which realizes ultra low quiescent current operation.
SSOP5
PIN No.
Symbol
Function
1
VOUT
Output pin
2
VDD
Power supply voltage
3
GND
GND
4
N.C.
No connection pin
5
CT
Capacitor connection pin
for output delay time setting
Figure 1. Open Drain Output Type
BD52xx-2C Series
VOUT
VDD
GND
N.C.
CT
Lot No.
Marking
N.C. pin is electrically open and can
be connected to either VDD or GND.
VDD1
VDD2
GND
CCT
RL
BD52xx-2C
RST
Microcontroller
VDD1
GND
CCT
BD53xx-2C
RST
Microcontroller
Datashee
t
2/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Ordering Information
Lineup
Output Type
Open Drain
CMOS
Detection Voltage
Marking
Part Number
Marking
Part Number
5.0V
1Z
BD5250
90
BD5350
4.9V
1Y
BD5249
89
BD5349
4.8V
1X
BD5248
88
BD5348
4.7V
1W
BD5247
87
BD5347
4.6V
1V
BD5246
86
BD5346
4.5V
1U
BD5245
85
BD5345
4.4V
1T
BD5244
84
BD5344
4.3V
1S
BD5243
83
BD5343
4.2V
1R
BD5242
82
BD5342
4.1V
1Q
BD5241
81
BD5341
4.0V
1P
BD5240
80
BD5340
3.9V
1N
BD5239
79
BD5339
3.8V
08
BD5238
78
BD5338
3.7V
07
BD5237
77
BD5337
3.6V
06
BD5236
76
BD5336
3.5V
05
BD5235
75
BD5335
3.4V
04
BD5234
74
BD5334
3.3V
03
BD5233
73
BD5333
3.2V
02
BD5232
72
BD5332
3.1V
01
BD5231
71
BD5331
3.0V
5G
BD5230
70
BD5330
2.9V
Z9
BD5229
69
BD5329
2.8V
Z8
BD5228
68
BD5328
2.7V
Z7
BD5227
67
BD5327
2.6V
XS
BD5226
66
BD5326
2.5V
XR
BD5225
65
BD5325
2.4V
24
BD5224
64
BD5324
2.3V
23
BD5223
63
BD5323
2.2V
22
BD5222
62
BD5322
2.1V
21
BD5221
61
BD5321
2.0V
20
BD5220
60
BD5320
1.9V
19
BD5219
59
BD5319
1.8V
18
BD5218
58
BD5318
1.7V
17
BD5217
57
BD5317
1.6V
16
BD5216
56
BD5316
1.5V
15
BD5215
55
BD5315
1.4V
14
BD5214
54
BD5314
1.3V
13
BD5213
53
BD5313
1.2V
12
BD5212
52
BD5312
1.1V
11
BD5211
51
BD5311
1.0V
10
BD5210
5F
BD5310
0.9V
09
BD5209
5E
BD5309
Part
Output Type
Detection Voltage
Package
Product Rank
Packaging and forming
specification
Number
52 : Open Drain
09 : 0.9V
G : SSOP5
C : for Automotive
TR : Embossed tape and reel
53 : CMOS
0.1V step
50 : 5.0V
B
D
x
x
-
T
R
x
x
x
C
2
3/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Absolute Maximum Ratings (Ta=-40°C to +125°C)
Parameter
Symbol
Limit
Unit
Power Supply Voltage
VDD-GND
-0.3 to +7
V
Output Voltage
Nch Open Drain Output
VOUT
GND-0.3 to +7
V
CMOS Output
GND-0.3 to VDD+0.3
Output Current
Io
70
mA
Operating Temperature Range
Topr
-40 to +125
°C
Junction Temperature Range
Tj
-40 to +150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
SSOP5
Junction to Ambient
θJA
376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
40
30
°C/W
(Note 1)Based on JESD51-2A(Still-Air).
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
4/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VDD=0.8V to 6V)
Parameter
Symbol
Condition
Limit
Unit
Min
Typ
Max
Detection Voltage
VDET
VDET=0.9V to 1.6V, VDD=HL, RL=100kΩ
VDET(T)
×0.97
-0.012
VDET(T)
VDET(T)
×1.03
+0.012
V
VDET=1.7V to 5.0V, VDD=HL, RL=100kΩ
VDET (T)
×0.97
VDET(T)
VDET(T)
×1.03
Hysteresis Voltage
∆VDET
VDD=LHL, RL=100kΩ
VDET
×0.03
VDET
×0.05
VDET
×0.07
V
Circuit Current when ON
IDD1
VDD= VDET-0.2V
-
0.23
1.50
µA
Circuit Current when OFF
IDD2
VDD= VDET+0.5V
-
0.27
1.60
µA
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=-40°C to 125°C, RL=100kΩ
0.80
-
-
V
“Low” Output Voltage (Nch)
VOL
VDD=0.8V, ISINK = 0.17mA, VDET=0.9V to 1.6V
-
-
0.4
V
VDD=1.2V, ISINK = 1.0mA, VDET=1.7V to 5.0V
-
-
0.4
VDD=2.4V, ISINK = 2.0mA, VDET=2.7V to 5.0V
-
-
0.4
“High” Output Voltage (Pch)
VOH
VDD=4.8V, ISOURCE=2.0mA,
VDET(0.9V to 4.2V)
VDD-0.4
-
-
V
VDD=6.0V, ISOURCE=2.5mA,
VDET(0.9V to 5.0V)
VDD-0.4
-
-
Output Leak Current (BD52xx)
ILEAK
VDD= VDS=6V
-
-
1.0
µA
Delay Time (L → H)
tPLH
VOUT＝GND→50%, CT=0.01μF
Note 1 Note 2
27.7
55.5
83.2
ms
VDET(T) : Standard Detection Voltage(0.9V to 5.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Note 1 tPLH : VDD=(VDET(T)–0.1V) → (VDET(T)+0.5V) for VDET=0.9V to 1.2V
tPLH : VDD=(VDET(T)–0.5V) → (VDET(T)+0.5V) for VDET=1.3V to 5.0V
Note 2 CT delay capacitor range: open to 4.7µF.
5/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Block Diagram
Figure 3. BD52xx-2C Series
Figure 4. BD53xx-2C Series
Delay
Circuit
*1: Parasitic Diode
Delay
Circuit
*1: Parasitic Diode
*1
*1
*1
VOUT
T
Vref
VDD
GND
CT
Delay
Circuit
VOUT
Vref
VDD
GND
CT
Delay
Circuit
*1
*1
*1
*1
6/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 1 2 3 4 5 6
Circuit Current : IDD(µA)
Supply Voltage : VDD (V)
Figure 5. Circuit Current vs. VDD
Typical Performance Curves
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
BD5209G-2C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 1 2 3 4 5 6
Circuit Current : IDD(µA)
Supply Voltage : VDD (V)
Figure 7. Circuit Current vs. VDD
BD5230G-2C
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Circuit Current : IDD(µA)
Temperature : Ta (°C)
Figure 8. Circuit Current vs. Temp
BD5230G-2C
VDD=VDET+0.5V
VDD=VDET-0.2V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Circuit Current : IDD(µA)
Temperature : Ta (°C)
Figure 6. Circuit Current vs. Temp
VDD=VDET+0.5V
VDD=VDET-0.2V
BD5209G-2C
7/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.7 0.8 0.9 1.0 1.1 1.2
Output Voltage : VOUT(V)
Supply Voltage : VDD (V)
Figure 11. Detection Voltage
BD5209G-2C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 1 2 3 4 5 6
Circuit Current : IDD(µA)
Supply Voltage : VDD (V)
Figure 9. Circuit Current vs. VDD
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
BD5250G-2C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Circuit Current : IDD(µA)
Temperature : Ta (°C)
Figure 10. Circuit Current vs. Temp
VDD=VDET+0.5V
VDD=VDET-0.2V
BD5250G-2C
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
-40 -25 -10 5 20 35 50 65 80 95 110 125
Detection Voltage : VDET(V)
Temperature : Ta (°C)
Figure 12. Detection Voltage and Release Voltage
VDET + ΔVDET
VDET
BD5209G-2C
8/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
6.0
2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5
Output Voltage : VOUT(V)
Supply Voltage : VDD (V)
Figure 13. Detection Voltage
BD5230G-2C
0.0
1.0
2.0
3.0
4.0
5.0
6.0
4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6
Output Voltage : VOUT(V)
Supply Voltage : VDD (V)
Figure 15. Detection Voltage
BD5250G-2C
BC
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
5.6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Detection Voltage : VDET(V)
Temperature : Ta (°C)
Figure 16. Detection Voltage and Release Voltage
VDET + ΔVDET
VDET
BD5250G-2C
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
-40 -25 -10 5 20 35 50 65 80 95 110 125
Detection Voltage : VDET(V)
Temperature : Ta (°C)
Figure 14. Detection Voltage and Release Voltage
VDET + ΔVDET
VDET
BD5230G-2C
9/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Output Voltage : VOUT(V)
Supply Voltage : VDD (V)
Figure 17. I/O Characteristics
Pull-up to 5V
Pull-up resistance: 100kΩ
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
BD5230G-2C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Output Voltage : VOUT(V)
Supply Voltage : VDD (V)
Figure 18. I/O Characteristics
Pull-up to VDD
Pull-up resistance: 100kΩ
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
BD5230G-2C
0.0
0.2
0.4
0.6
0.8
1.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Minimum Operating Voltage: VOPL(V)
Temperature : Ta (°C)
Figure 19. Operating Limit Voltage
Pull-up to 5V
Pull-up resistance: 100kΩ
0.0
0.2
0.4
0.6
0.8
1.0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Minimum Operating Voltage: VOPL(V)
Temperature : Ta (°C)
Figure 20. Operating Limit Voltage
Pull-up to VDD
Pull-up resistance: 100kΩ
10/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
0
10
20
30
40
50
60
70
0.0 1.0 2.0 3.0 4.0 5.0
"High" Output Current : IOH(mA)
Drain-Source Voltage : VDS (V)
Figure 21. “High” Output Current
Typical Performance Curves - continued
VDD = 1.2V
BD5309G-2C
VDD = 2V
VDD = 3V
VDD = 4V
0
10
20
30
40
50
60
70
0.0 0.5 1.0 1.5 2.0 2.5 3.0
"Low" Output Current : IOL(mA)
Drain-Source Voltage : VDS (V)
Figure 22. “Low” Output Current
VDD = 2V
VDD = 1.2V
VDD = 0.85V
BD5250G-2C
0
10
20
30
40
50
60
70
0.0 0.5 1.0 1.5 2.0 2.5 3.0
"Low" Output Current : IOL(mA)
Supply Voltage : VDD (V)
Figure 24. “Low” Output Current (VDS=0.5V)
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
BD5220G-2C
0
5
10
15
20
25
30
35
0.0 1.0 2.0 3.0 4.0 5.0 6.0
"High" Output Current : IOH(mA)
Supply Voltage : VDD (V)
Figure 23. “High” Output Current (VDS=0.5V)
BD5309G-2C
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
11/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
0
10
20
30
40
50
60
70
0.0001 0.001 0.01 0.1 1 10
Delay Time (H~L) : tPHL(µs)
CT Pin Capacitance : CCT (µF)
Figure 28. Output Delay Time (H to L)
Typical Performance Curves - continued
0
10
20
30
40
50
60
70
-40 -25 -10 5 20 35 50 65 80 95 110 125
Delay Time (H~L) : tPHL(µs)
Temperature : Ta (°C)
Figure 26. Output Delay Time (H to L)
0
10
20
30
40
50
60
70
80
-40 -25 -10 5 20 35 50 65 80 95 110 125
Delay Time (L~H) : tPLH(ms)
Temperature : Ta (°C)
Figure 25. Output Delay Time (L to H)
CCT=4.7nF
CCT=10nF
0.1
1
10
100
1000
10000
100000
0.0001 0.001 0.01 0.1 1 10
Delay Time (L~H) : tPLH(ms)
CT Pin Capacitance : CCT (µF)
Figure 27. Output Delay Time (L to H)
Ta=125°C
Ta=105°C
Ta=25°C
Ta=-40°C
12/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Application Information
1. Explanation of Operation
For both the open drain type (Figure 29) and the CMOS output type (Figure 30), the detection and release voltages
are used as threshold voltages. When the voltage applied to the VDD pin reaches the applicable threshold voltage,
the VOUT pin voltage switches from either “High” to “Low” or from “Low” to “High”. BD52xx-2C series and
BD53xx-2C series have delay time function which set tPLH (output “Low” to ”High”) using an external capacitor
connected in CT pin (CCT). Because the BD52xx-2C series uses an open drain output type, it is necessary to connect
a pull up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes
VDD or the voltage of the other power supply].
2. Setting of Detector Delay Time
Delay time L to H (tPLH) is the time when VOUT rises to 1/2 of VDD after VDD rises up and beyond the release
voltage (VDET+∆VDET). The delay time (tPLH) at the rise of VDD is determined by delay coefficient, CT capacitor and
delay time when CT pin is open (tCTO) and calculated from the following formula. When CT capacitor ≥ 1nF, tCTO has
less effect and tPLH computation is shown on Example No.2. The result has ±50% tolerance within the operating
temperature range of -40°C to +125°C
Formula: (Ta=25°C)
    [s]
where:
CCT is the CT pin external capacitor
Delay Coefficient is equal to 5.55 x 106
tCTO is the delay time when CT=open Note1
Note1: tCTO is design guarantee only; outgoing inspection is not done on all products.
Example No.1:
CT capacitor = 100pF
 󰇛   󰇜     
 󰇛   󰇜     
 󰇛   󰇜    
Example No.2:
CT capacitor = 1nF
    
Temperature
Delay Time (tCTO)
Min
Typ
Max
Ta = -40°C to +125°C
15µs
50µs
150µs
Figure 29. (BD52xx-2C type internal block diagram)
Figure 30. (BD53xx-2C type internal block diagram)
VOUT
Vref
VDD
GND
CT
Delay
Circuit
VOUT
Vref
VDD
GND
CT
Delay
Circuit
13/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
3. Timing Waveform
The following shows the relationship between the input voltage VDD and the output voltage VOUT when the power supply
voltage VDD is sweep up and sweep down.
1. When the power supply turns on, the Output Voltage (VOUT) is undefined until VDD overcomes the Operating
Voltage Limit (VOPL).
2. VOUT will turn to “Low” as VDD increases above VOPL but less than the Release Voltage (VDET+ΔVDET),
3. When VDD exceeds the Release Voltage (VDET+ΔVDET), delay time (tPLH) set by capacitor at CT pin (CCT)
will happen then VOUT will switch from “Low” to “High”.
4. VOUT will remain “High” until VDD do not fall below the Detection Voltage (VDET).
5. When VDD drops below VDET, VOUT will switch from “High” to “Low” with a delay of tPHL.
*The potential difference between the detection voltage and the release voltage is known as the Hysteresis
Voltage width (∆VDET). The system is designed such that the output will not toggle with power supply fluctuations
within this hysteresis width, preventing malfunctions due to noise.
Figure 31. BD52xx-2C Set-up
Figure 32. Timing Diagram
⑤
VDET
VDET+ΔVDET
VOPL: <0.8V
t
VDD
t
VOUT
tPLH
undefined
undefined
1
2
3
4
2
3
4
5
1
2
Hysteresis Voltage (ΔVDET)
5
tPHL
tPLH
tPHL
VOUT
Vref
VDD
GND
CT
Delay
Circuit
RL
VDD
CCT
14/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
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TSZ22111・15・001
4. Circuit Applications
(1) Examples of common application circuits
Application examples of BD52xx-2C series
(Open-drain output type) and BD53xx-2C series
(CMOS output type) are shown below.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD52xx-2C) device
with a load resistance RL attached as shown
in Figure33.
CASE2: Power supply of the microcontroller (VDD1) is
the same as the power supply of the reset detection
(VDD1).
Use a CMOS output type (BD53xx-2C) device or an
open-drain output type (BD52xx-2C) device with a
pull-up resistor between the output and VDD1.
(2) The following is an example of circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open
drain output type (BD52xx-2C series) to the microcontroller’s input with pull-up resistor to the supply voltage of the
microcontroller (VDD3) as shown in Figure 35. By pulling-up to VDD3, output “High” voltage of micro-controller power
supply is possible.
Figure 33. Open Drain Output Type
Figure 34. CMOS Output type
Figure 35. OR Circuit Connection Application
VDD1
BD52xx-2C
VDD2
GND
CCT
RL
RST
Microcontroller
VDD1
VDD3
GND
CCT
RL
VDD2
CCT
BD52xx-2C
NO.1
BD52xx-2C
NO.2
Microcontroller
RST
VDD1
BD53xx-2C
GND
CCT
RST
Microcontroller
15/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
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TSZ22111・15・001
Circuit Applications (continued)
(3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will
flow into the circuit when the output level switches from “Low” to “High” or vice versa. Inrush current is a sudden
surge of current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This
current flow may cause malfunction in the systems operation such as output oscillations, etc.
Figure 36. Resistor Divider Connection Application Figure 37. VDD Voltage vs. Current Consumption
A voltage drop [Inrush current (I1)] × [input resistor (RA)] is caused by the inrush current, and causes the input
voltage to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below
the detection voltage, the output voltage switches from “High” to “Low”. At this time, the inrush current stops flowing
through output “Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which
again causes the inrush current to flow and the voltage to drop. This operation repeats and will result to oscillation.
In case resistor divider will not use and only RA will use, same response will happen.
Note1: The circuit connection mentioned above does not guarantee successful operation.
Please perform thorough evaluation using the actual application and set countermeasures
VDD
0
IDD
VDET
Inrush Current
0.1
1.0
10.0
100.0
1.0 2.0 3.0 4.0 5.0 6.0
Inrush Current : IDD (µA)
Supply Voltage : VDD (V)
Figure 38. IDD Inrush Current Ta=25°C
BD5309G-2C
0
10
20
30
40
50
60
70
80
90
100
-40 -25 -10 5 20 35 50 65 80 95 110 125
Inrush Current : IDD (µA)
Temperature : Ta (°C)
Figure 39. IDD Inrush Current VDD=6V
BD5309G-2C
(Note1)
CVDD
(CVDD≥0.1μF)
VOUT
(Note1)
RA
(RA≤100kohm)
VDD
BD52xx-2C
BD53xx-2C
GND
RB
I1
V1
16/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Circuit Applications (continued)
Depending on the application set-up, there are times that VDD voltage is always below the Release Voltage (VDET+ΔVDET)
because of the effect of inrush current as shown in Figure 40.
Figure 40. VDD Drop Caused by Inrush Current
VDET
VDET+ΔVDET
t
Voltage
V1
Hysteresis Voltage (ΔVDET)
VDD
ΔVDROP = Inrush Current x RA
17/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Line
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line
impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line
18/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
Operational Notes – continued
12. Regarding Input Pins of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Bypass Capacitor for Noise Rejection
To help reject noise, put more than 0.1µF capacitor between VDD pin and GND. Be careful when using extremely big
capacitor as transient response will be affected.
16. The VDD line impedance might cause oscillation because of the detection current.
17. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
18. External Parameters
The recommended value of CT Capacitor is from open to 4.7µF and pull-up resistance value is 50kΩ to 1MΩ. There are
many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not
guarantee correct operation. Please verify and confirm using practical applications.
19. When VDD falls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage,
output will be equivalent to pull-up voltage.
20. Power-on Reset Operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
21. CT Pin Discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
22. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed
between the CT and GND pin, it is recommended to insert 1MΩ resistor between CT and VDD pin. However, delay time
will change when resistor is connected externally to CT pin so verify the delay time requirements when using this set-up.
Also, when similar leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower
than 1/10 of the impedance of assumed leakage route.
19/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
External Dimension Diagram, Packaging and Forming Specification
Package Name
SSOP5
20/20
BD52xx-2C Series BD53xx-2C Series
TSZ02201-0R7R0G300200-1-2
© 2016 ROHM Co., Ltd. All rights reserved.
05.Jul.2018 Rev.002
www.rohm.com
TSZ22111・15・001
Revision History
Date
Revision
Changes
2016/04/25
001
New
2018/07/05
002
Add notation of “Nano Energy”
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
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only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Datasheet
Part Number BD5247G-2C
Package SSOP5
Unit Quantity 3000
Minimum Package Quantity 3000
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
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