E13C5H2F-137.472M TR - Ecliptek Corporation

RoHS

E13C5H2F-137.472M TR

E13C5 H 2 F -137.472M TR

Series

RoHS Compliant (Pb-free) 3.3V 6 Pad 3.2mm x 5mm

Ceramic SMD LVPECL Oscillator

Frequency Tolerance/Stability

±50ppm Maximum over -40°C to +85°C

Duty Cycle

50 ±5(%)

Packaging Options

Tape & Reel

Nominal Frequency

137.472MHz

Logic Control / Additional Output

Tri-State and Complementary Output

ELECTRICAL SPECIFICATIONS

Nominal Frequency 137.472MHz

Frequency Tolerance/Stability ±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance (at 25°C),

Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,

First Year Aging at 25°C, Shock, and Vibration)

Supply Voltage +3.3Vdc ±5%

Input Current 75mA Maximum

Output Voltage Logic High (Voh) Vcc-1.025Vdc Minimum from 0°C to +85°C, Vcc-1.085Vdc Minimum from -40°C to +0°C

Output Voltage Logic Low (Vol) Vcc-1.620Vdc Maximum from 0°C to +85°C, Vcc-1.555Vdc Maximum from -40°C to +0°C

Rise/Fall Time 300pSec Typical, 700pSec Maximum (Measured at 20% to 80% of Waveform)

Duty Cycle 50 ±5(%) (Measured at 50% of Waveform)

Load Drive Capability 50 Ohms into Vcc-2.0Vdc

Output Logic Type LVPECL

Phase Noise -60dBc/Hz at 10Hz Offset, -95dBc/Hz at 100Hz Offset, -125dBc/Hz at 1kHz Offset, -143dBc/Hz at 10kHz

Offset, -145dBc/Hz at 100kHz Offset, -145dBc/Hz at 1MHz Offset, -146dBc/Hz at 10MHz Offset (All Values

are Typical, Fo=156.250MHz)

Logic Control / Additional Output Tri-State and Complementary Output

Tri-State Input Voltage (Vih and Vil) Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc

Maximum to Disable High Impedance Output and Complementary Output

Standby Current 30µA Maximum (Without Load)

RMS Phase Jitter 0.4pSec Typical, 1pSec Maximum (Fj=12kHz to 20MHz)

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Flammability UL94-V0

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Mechanical Shock MIL-STD-883, Method 2002, Condition B

Moisture Resistance MIL-STD-883, Method 1004

Moisture Sensitivity J-STD-020, MSL 1

Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010, Condition B

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 1 of 6

E13C5H2F-137.472M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

3.20

±0.15 1.30

MAX

1.20

±0.15

1.27

±0.15 1.00

±0.15

0.64

±0.10

2.54

±0.15

5.00

±0.15

PIN CONNECTION

1 Tri-State

2 No Connect

3 Case/Ground

4 Output

5 Complementary Output

6 Supply Voltage

LINE MARKING

1E137.47

E=Ecliptek Designator

2XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of the Year

ZZ=Week of the Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X6)

All Dimensions in Millimeters

0.27 (X4)

0.80 (X2)

1.40 (X6)

1.00 (X6)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 2 of 6

E13C5H2F-137.472M TR

Pin Connections

1 Tri-State

2 No Connect

3 Ground

4 Output

5 Complementary Output

6 Supply Voltage (VDD)

Power

Supply

Power

Supply Power

Supply

Oscilloscope

Probe 2

(Note 2)

Probe 1

(Note 2)

Current

Meter

Voltage

Meter

Frequency

Counter

Switch

0.01µF

(Note 1)

0.1µF

(Note 1)

50 Ohms

Supply

Voltage

(VDD)

Tri-State

Complementary

Output

Connect

Ground

50 Ohms

Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)

to the package ground and supply voltage pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is

recommended.

Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.

Test Circuit for Tri-State and Complementary Output

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 3 of 6

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

E13C5H2F-137.472M TR

16.0 ±0.3

7.5 ±0.1

6.75 ±0.1

4.0 ±0.1

2.0 ±0.1

8.0 ±0.1 B0*

DIA 1.5 +0.1/-0.0

A0*

0.30 ±0.1

K0*

22.4 MAX

360 MAX

Quantity Per Reel: 1,000 units

16.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 4 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

E13C5H2F-137.472M TR

High Temperature Infrared/Convection

TS MAX to TL (Ramp-up Rate) 3°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) 150°C

- Temperature Typical (TS TYP) 175°C

- Temperature Maximum (TS MAX) 200°C

- Time (tS MIN) 60 - 180 Seconds

Ramp-up Rate (TL to TP)3°C/second Maximum

Time Maintained Above:

- Temperature (TL)217°C

- Time (tL)60 - 150 Seconds

Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum

Target Peak Temperature (TP Target) 250°C +0/-5°C

Time within 5°C of actual peak (tp)20 - 40 seconds

Ramp-down Rate 6°C/second Maximum

Time 25°C to Peak Temperature (t) 8 minutes Maximum

Moisture Sensitivity Level Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 5 of 6

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

E13C5H2F-137.472M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev B 2/20/2010 | Page 6 of 6