RH117H#PBF - LINEAR TECHNOLOGY - Datasheet.Directory

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

1 of 7

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April 2017

FCX558

400V PNP HIGH VOLTAGE TRANSISTOR IN SOT89

Features

 BVCEO > -400V

 IC = -200mA High Continuous Current

 ICM = -500mA Peak Pulse Current

 Excellent hFE Characteristics up to -100mA

 Low Saturation Voltage VCE(sat) < -200mV @ -20mA

 Complementary NPN Type: FCX458

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

 Case: SOT89

 Case Material: Molded Plastic. “Green” Molding Compound.

UL Flammability Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish - Matte Tin Plated Leads,

Solderable per MIL-STD-202, Method 208

 Weight: 0.05 grams (Approximate)

Ordering Information (Note 4)

Product

Compliance

Marking

Reel Size (inches)

Tape Width (mm)

Quantity per Reel

FCX558TA

AEC-Q101

P58

7

12

1,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.

Marking Information

P58 = Product Type Marking Code

Top View

Device Symbol

Top View

Pin Out

SOT89

C

E

C

B

C

E

B

P58

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

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April 2017

FCX558

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Limit

Unit

Collector-Base Voltage

VCBO

-400

V

Collector-Emitter Voltage

VCEO

-400

V

Emitter-Base Voltage

VEBO

-7

V

Continuous Collector Current

IC

-200

mA

Peak Pulse Current

ICM

-500

mA

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 5)

PD

0.7

W

(Note 6)

1

(Note 7)

1.5

(Note 8)

2

Thermal Resistance, Junction to Ambient Air

(Note 5)

RθJA

178

°C/W

(Note 6)

125

(Note 7)

83

(Note 8)

60

Thermal Resistance, Junction to Lead

(Note 9)

RθJL

22

Operating and Storage Temperature Range

TJ, TSTG

-65 to +150

°C

ESD Ratings (Note 10)

Characteristic

Symbol

Value

Unit

JEDEC Class

Electrostatic Discharge - Human Body Model

ESD HBM

4,000

V

3A

Electrostatic Discharge - Machine Model

ESD MM

400

V

C

Notes: 5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided

1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.

6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper.

7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper.

8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper.

9. Thermal resistance from junction to solder-point (on the exposed collector pad).

10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

Thermal Characteristics and Derating Information

0500 1000 1500 2000 2500

0

1

2

3

0500 1000 1500 2000 2500

40.0

60.0

80.0

100.0

120.0

140.0

2oz copper

1oz copper

TA=25°C

Copper Area (sqmm)

Maximum Power (W)

2oz copper

1oz copper

Copper Area (sqmm)

Thermal Resistance (°C/W)

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

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FCX558

Thermal Characteristics and Derating Information (cont.)

020 40 60 80 100 120 140 160

0.0

0.2

0.4

0.6

0.8

1.0

1.2 15mm x 15mm 1oz FR4 PCB

020 40 60 80 100 120 140 160

0.0

0.2

0.4

0.6

0.8

1.0

Max Power Dissipation (W)

Temperature (°C)

Derating Curve

MRP 1oz FR4 PCB

Derating Curve

Temperature (°C)

Max Power Dissipation (W)

100µ 1m 10m 100m 110 100 1k

0

10

20

30

40

50

60

70

80

90

100

110

120

130 15mm x 15mm 1oz FR4 PCB

Transient Thermal Impedance

D=0.5

D=0.2

D=0.1

Single Pulse

D=0.05

Thermal Resistance (°C/W)

Pulse Width (s) 100µ 1m 10m 100m 110 100 1k

1

10

100 15mm x 15mm 1oz FR4 PCB

Single Pulse

TA=25°C

Pulse Power Dissipation

Pulse Width (s)

Maximum Power (W)

100µ 1m 10m 100m 110 100 1k

0

20

40

60

80

100

120

140

160

180 MRP 1oz FR4 PCB

Transient Thermal Impedance

D=0.5

D=0.2

D=0.1

Single Pulse

D=0.05

Thermal Resistance (°C/W)

Pulse Width (s) 100µ 1m 10m 100m 110 100 1k

1

10

100 MRP 1oz FR4 PCB

Single Pulse

TA=25°C

Pulse Power Dissipation

Pulse Width (s)

Maximum Power (W)

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

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FCX558

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ.

Max

Unit

Test Condition

Collector-Base Breakdown Voltage

BVCBO

-400

-540

-

V

IC = -100µA

Collector-Emitter Breakdown Voltage (Note 11)

BVCEO

-400

-510

-

V

IC = -1mA

Collector-Emitter Breakdown Voltage

BVCES

-400

-540

V

IC = -100µA

Emitter-Base Breakdown Voltage

BVEBO

-7

-8.2

-

V

IE = -100µA

Collector Cutoff Current

ICBO

-

<-1

-100

nA

VCB = -320V

Emitter Cutoff Current

ICES

-

<-1

-100

nA

VCE = -320V

Emitter Cutoff Current

IEBO

-

<-1

-20

nA

VEB = -6V

DC Current Transfer Static Ratio (Note 11)

hFE

100

15

-

300

-

IC = -1mA, VCE = -10V

IC = -50mA, VCE = -10V

IC = -100mA, VCE = -10V

Collector-Emitter Saturation Voltage (Note 11)

VCE(sat)

-

-0.2

-0.5

V

IC = -20mA, IB = -2mA

IC = -50mA, IB = -6mA

Base-Emitter Saturation Voltage (Note 11)

VBE(sat)

-

-0.9

V

IC = -50mA, IB = -5mA

Base-Emitter Turn-on Voltage (Note 11)

VBE(on)

-

-0.9

V

IC = -50mA, VCE = -10V

Transitional Frequency

fT

50

-

MHz

IE = -10mA, VCE = -20V

f = 20MHz

Output Capacitance

Cobo

-

5

pF

VCB = -20V, f = 1MHz,

Switching Times

ton

-

95

-

nS

IC = -50mA, VC = -100V

IB1 = -5mA, IB2 = -10mA

toff

1,600

Note: 11. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%.

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

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FCX558

Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

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FCX558

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between

device terminals and PCB tracking.

H1

EH

D1

B

e

c

L

A

D

8° (4X)

D2

E2

z

L1

R0.200

B1

Y4

X2

Y1

X

YY2

Y3

G

C

X1

SOT89

Dim

Min

Max

Typ

A

1.40

1.60

1.50

B

0.50

0.62

0.56

B1

0.42

0.54

0.48

c

0.35

0.43

0.38

D

4.40

4.60

4.50

D1

1.62

1.83

1.733

D2

1.61

1.81

1.71

E

2.40

2.60

2.50

E2

2.05

2.35

2.20

e

-

1.50

H

3.95

4.25

4.10

H1

2.63

2.93

2.78

L

0.90

1.20

1.05

L1

0.327

0.527

0.427

z

0.20

0.40

0.30

All Dimensions in mm

Dimensions

Value

(in mm)

C

1.500

G

0.244

X

0.580

X1

0.760

X2

1.933

Y

1.730

Y1

3.030

Y2

1.500

Y3

0.770

Y4

4.530

FCX558

Datasheet Number: DS33059 Rev. 7 - 2

7 of 7

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April 2017

FCX558

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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