Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. SCCS059B - August 1994 - Revised September 2001 Features * Ioff supports partial-power-down mode operation * Edge-rate control circuitry for significantly improved noise characteristics * Typical output skew < 250 ps * ESD > 2000V * TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages * Industrial temperature range of -40C to +85C * VCC = 5V 10% CY74FCT16543T Features: * 64 mA sink current, 32 mA source current * Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25C CY74FCT162543T Features: * Balanced 24 mA output drivers * Reduced system switching noise * Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA= 25C CY74FCT162H543T Features: * Bus hold retains last active state * Eliminates the need for external pull-up or pull-down resistors CY74FCT16543T CY74FCT162543T CY74FCT162H543T 16-Bit Latched Transceivers Functional Description The CY74FCT16543T and CY74FCT162543T are 16-bit, high-speed, low power latched transceivers that are organized as two independent 8-bit D-type latched transceivers containing two sets of eight D-type latches with separate Latch Enable (LEAB, LEAB) and Output Enable (OEAB, OEAB) controls for each set to permit independent control of inputting and outputting in either direction of data flow. For data flow from A to B, for example, the A-to-B input Enable (CEAB) must be LOW in order to enter data from A or to take data from B as indicated in the truth table. With CAEB LOW, a LOW signal on the A-to-B Latch Enable (LEAB) makes the A-to-B latches transparent; a subsequent LOW-to-HIGH transition of the LEAB signal puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB and OEAB both LOW, the three-state B output buffers are active and reflect the data present at the output of the A latches. Control of data from B to A is similar, but uses CEAB, LEAB, and OEAB inputs flow-through pinout and small shrink packaging and in simplifying board design. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The CY74FCT16543T is ideally suited for driving high-capacitance loads and low-impedance backplanes. The CY74FCT162543T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162543T is ideal for driving transmission lines. The CY74FCT162H543T is a 24-mA balanced output part that has "bus hold" on the data inputs. The device retains the input's last state whenever the input goes to high impedance. This eliminates the need for pull-up/down resistors and prevents floating inputs. Copyright (c) 2001, Texas Instruments Incorporated CY74FCT16543T CY74FCT162543T CY74FCT162H543T Logic Block Diagrams Pin Configuration 1OEBA Top View SSOP/TSSOP 1CEBA 1LEBA 1OEAB 1OEAB 1LEAB 1CEAB 1CEAB 1LEAB GND 1A 1 C D 1A 1 1B 1 1A 2 V CC 1A 3 1A 4 C D 1A 5 GND 1A 6 TO 7 OTHER CHANNELS 1A 7 FCT16543T-1 1A 8 2OEBA 2A 1 2CEBA 2A 2 2LEBA 2CEAB 2A 3 GND 2A 4 2A 5 2LEAB 2A 6 2OEAB C D 2A 1 V CC 2A 7 2A 8 2B 1 GND 2CEAB 2LEAB 2OEAB C D TO 7 OTHER CHANNELS 56 55 3 4 5 6 7 8 9 54 53 52 51 50 49 48 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1OEBA 1LEBA 1CEBA GND 1B 1 1B 2 VCC 1B 3 1B 4 1B 5 GND 1B 6 1B 7 1B 8 2B 1 2B 2 2B 3 GND 2B 4 2B 5 2B 6 VCC 2B 7 2B 8 GND 2CEBA 2LEBA 2OEBA FCT16543T-3 FCT16543T-2 Function Table[1] Pin Description Name 1 2 Description OEAB A-to-B Output Enable Input (Active LOW) OEBA B-to-A Output Enable Input (Active LOW) CEAB A-to-B Enable Input (Active LOW) CEBA B-to-A Enable Input (Active LOW) LEAB A-to-B Latch Enable Input (Active LOW) LEBA B-to-A Latch Enable Input (Active LOW) A A-to-B Data Inputs or B-to-A Three-State Outputs[9] B B-to-A Data Inputs or A-to-B Three-State Outputs[9] Inputs CEAB Latch Status Output Buffers LEAB OEAB A to B B H X X Storing High Z X H X Storing X X X H X High Z L L L Transparent Current A Inputs L H L Storing Previous A Inputs[2] Maximum Ratings[3, 4] (Above which the useful life may be impaired. For user guidelines, not tested.) Power Dissipation .......................................................... 1.0W Storage Temperature .....................Com'l -55C to +125C Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015) Ambient Temperature with Power Applied .................................Com'l -55C to +125C Operating Range DC Input Voltage .................................................-0.5V to +7.0V Range DC Output Voltage ..............................................-0.5V to +7.0V Industrial DC Output Current (Maximum Sink Current/Pin) ........................... -60 to +120 mA 2 Ambient Temperature VCC -40C to +85C 5V 10% CY74FCT16543T CY74FCT162543T CY74FCT162H543T Electrical Characteristics Over the Operating Range Parameter Description VIH Input HIGH Voltage VIL Input LOW Voltage Test Conditions Min. Typ.[5] Max. 2.0 V 0.8 [6] VH Input Hysteresis VIK Input Clamp Diode Voltage VCC=Min., IIN=-18 mA IIH Input HIGH Current IIL Input LOW Current IOZH Unit 100 mV -1.2 V VCC=Max., VI=VCC 1 A VCC=Max., VI=GND 1 A High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=2.7V 1 A IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=0.5V 1 A IOS Short Circuit Current[7] VCC=Max., VOUT=GND -80 -200 mA IO Output Drive Current[7] VCC=Max., VOUT=2.5V -50 -180 mA 1 A IOFF Power-Off Disable VCC=0V, VOUT 4.5V[8] -0.7 V -140 Notes: 1. A-to-B data flow shown; B-to-A flow control is the same, except using CEBA, LEBA, and OEBA. 2. Data prior to LEAB LOW-to-HIGH Transition H = HIGH Voltage Level. L = LOW Voltage Level. X = Don't Care. Z = High Impedance. 3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 5. Typical values are at VCC= 5.0V, TA= +25C ambient. 6. This parameter is specified but not tested. 7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 8. Tested at +25C. 9. On the 74FCT162H543T, these pins have bus hold. 3 CY74FCT16543T CY74FCT162543T CY74FCT162H543T Output Drive Characteristics for CY74FCT16543T Parameter VOH VOL Min. Typ.[5] VCC=Min., IOH=-3 mA 2.5 3.5 VCC=Min., IOH=-15 mA 2.4 3.5 VCC=Min., IOH=-32 mA 2.0 3.0 Description Output HIGH Voltage Output LOW Voltage Test Conditions VCC=Min., IOL=64 mA Max. Unit V 0.2 0.55 V Min. Typ.[5] Max. Unit VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA VCC=5V, VIN=VIH or VIL, VOUT=1.5V -60 -115 -150 mA 2.4 3.3 Output Drive Characteristics for CY74FCT162543T, CY74FCT162H543T Parameter IODL Description Output LOW Current [7] [7] Test Conditions IODH Output HIGH Current VOH Output HIGH Voltage VCC=Min., IOH=-24 mA VOL Output LOW Voltage VCC=Min., IOL=24 mA V 0.3 0.55 V Typ.[5] Max. Unit Capacitance[6] (TA = +25C, f = 1.0 MHz) Parameter Description Test Conditions CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Typ.[5] Max. Unit 5 500 A Power Supply Characteristics Parameter Description Test Conditions ICC Quiescent Power Supply Current VCC=Max. VIN0.2V, VINVCC-0.2V ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max. VIN=3.4V[10] 0.5 1.5 mA ICCD Dynamic Power Supply Current[11] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, OE=GND VIN=VCC or VIN=GND 60 100 A/MHz IC Total Power Supply Current[12] VCC=Max., f1=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling, OE=GND VIN=VCC or VIN=GND 0.6 1.5 mA VIN=3.4V or VIN=GND 0.9 2.3 mA VIN=VCC or VIN=GND 2.4 4.5[13] mA VIN=3.4V or VIN=GND 6.4 16.5[13] mA VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Sixteen Bits Toggling, OE=GND Notes: 10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 12. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 4 CY74FCT16543T CY74FCT162543T CY74FCT162H543T Switching Characteristics Over the Operating Range[14] CY74FCT16543T CY74FCT162543T Parameter Description CY74FCT16543AT CY74FCT162543AT Min. Max. Min. Max. Unit Fig. No.[15] tPLH tPHL Propagation Delay Transparent Mode A to B or B to A 1.5 8.5 1.5 6.5 ns 1, 3 tPLH tPHL Propagation Delay LEBA to A, LEAB to B 1.5 12.5 1.5 8.0 ns 1, 5 tPZH tPZL Output Enable Time OEBA or OEAB to A or B CEBA or CEAB to A or B 1.5 12.0 1.5 9.0 ns 1, 7, 8 tPHZ tPLZ Output Disable Time OEBA or OEAB to A or B CEBA or CEAB to A or B 1.5 9.0 1.5 7.5 ns 1, 7, 8 tSU Set-up Time HIGH or LOW A or B to LEAB or LEBA 2.0 -- 2.0 -- ns 4 tH Hold Time HIGH or LOW A or B to LEAB or LEBA 2.0 -- 2.0 -- ns 4 tW LEBA or LEAB Pulse Width LOW 4.0 -- 4.0 -- ns 5 tSK(O) Output Skew[16] -- 0.5 -- 0.5 ns -- CY74FCT16543CT CY74FCT162543CT CY74FCT162H543CT Parameter Description Min. Max. Unit Fig. No.[15] tPLH tPHL Propagation Delay Transparent Mode A to B or B to A 1.5 5.1 ns 1, 3 tPLH tPHL Propagation Delay LEBA to A, LEAB to B 1.5 5.6 ns 1, 5 tPZH tPZL Output Enable Time OEBA or OEAB to A or B CEBA or CEAB to A or B 1.5 7.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time OEBA or OEAB to A or B CEBA or CEAB to A or B 1.5 6.5 ns 1, 7, 8 tSU Set-up Time HIGH or LOW A or B to LEAB or LEBA 2.0 -- ns 4 tH Hold Time HIGH or LOW A or B to LEAB or LEBA 2.0 -- ns 4 tW LEBA or LEAB Pulse Width LOW 4.0 -- ns 5 tSK(O) Output Skew[16] -- 0.5 ns -- Notes: 14. Minimum limits are specified but not tested on Propagation Delays. 15. See "Parameter Measurement Information" in the General Information section. 16. Skew between any two outputs of the same package switching in the same directional. This parameter is ensured by design. 5 CY74FCT16543T CY74FCT162543T CY74FCT162H543T Ordering Information CY74FCT16543 Speed (ns) Ordering Code 5.1 CY74FCT16543CTPVC/PVCT 6.5 8.5 Package Name Package Type Operating Range O56 56-Lead (300-Mil) SSOP Industrial CY74FCT16543ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial CY74FCT16543TPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial Ordering Information CY74FCT162543 Speed (ns) 5.1 Ordering Code Package Name Package Type 74FCT162543CTPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT162543CTPVC O56 56-Lead (300-Mil) SSOP Operating Range Industrial 74FCT162543CTPVCT O56 56-Lead (300-Mil) SSOP 6.5 74FCT162543ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial 8.5 CY74FCT162543TPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial Ordering Information CY74FCT162H543T Speed (ns) 5.1 Ordering Code 74FCT162H543CTPACT Package Name Z56 Package Type 56-Lead (240-Mil) TSSOP 6 Operating Range Industrial CY74FCT16543T CY74FCT162543T CY74FCT162H543T Package Diagrams 56-Lead Shrunk Small Outline Package O56 56-Lead Thin Shrunk Small Outline Package Z56 7 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74FCT162543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543ETPACT OBSOLETE TSSOP DGG 56 74FCT162543ETPVCT OBSOLETE SSOP DL 56 74FCT162543TPVCG4 ACTIVE SSOP DL 56 74FCT162543TPVCTG4 ACTIVE SSOP DL 74FCT162H543CTPACT ACTIVE TSSOP 74FCT16543ATPACTE4 ACTIVE 74FCT16543ATPACTG4 20 TBD Lead/Ball Finish MSL Peak Temp (3) Call TI Call TI Call TI TBD Call TI Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543CTPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543TPVCG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162543CTPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT162543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT162543TPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543CTPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT16543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT16543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16543TPVC ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU 20 20 20 20 20 20 20 Addendum-Page 1 Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT16543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162H543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162543ATPACT TSSOP DGG 56 2000 330.0 24.4 74FCT162543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 74FCT162H543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT162543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT16543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162543ATPACT TSSOP DGG 56 2000 346.0 346.0 41.0 74FCT162543CTPACT TSSOP DGG 56 2000 346.0 346.0 41.0 74FCT162543CTPVCT SSOP DL 56 1000 346.0 346.0 49.0 74FCT162H543CTPACT TSSOP DGG 56 2000 346.0 346.0 41.0 CY74FCT162543TPVCT SSOP DL 56 1000 346.0 346.0 49.0 CY74FCT16543ATPACT TSSOP DGG 56 2000 346.0 346.0 41.0 CY74FCT16543CTPVCT SSOP DL 56 1000 346.0 346.0 49.0 CY74FCT16543TPVCT SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI Call TI Call TI 74FCT162543ETPVCT OBSOLETE SSOP DL 56 74FCT162543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT162543TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74FCT16543TPVCTG4 OBSOLETE SSOP DL 56 CY74FCT162543CTPVC ACTIVE SSOP DL 56 CY74FCT162543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT162543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT162543TPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT162543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD 20 Green (RoHS & no Sb/Br) Addendum-Page 1 Call TI Samples (Requires Login) 74FCT162543ATPACT TBD (3) Call TI CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543CTPVC ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT16543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT16543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI CY74FCT16543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI CY74FCT16543TPVC ACTIVE SSOP DL 56 CY74FCT16543TPVCT OBSOLETE SSOP DL 56 FCT162543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM FCT162543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) TBD Samples (Requires Login) CY74FCT16543ATPACT 20 (3) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 25-Aug-2012 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.6 1.8 12.0 24.0 Q1 74FCT162543ATPACT TSSOP DGG 56 2000 330.0 24.4 74FCT162543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 74FCT162543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT162543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 CY74FCT16543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 CY74FCT16543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 8.6 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74FCT162543ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0 74FCT162543CTPACT TSSOP DGG 56 2000 367.0 367.0 45.0 74FCT162543CTPVCT SSOP DL 56 1000 367.0 367.0 55.0 CY74FCT162543TPVCT SSOP DL 56 1000 367.0 367.0 55.0 CY74FCT16543ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0 CY74FCT16543CTPVCT SSOP DL 56 1000 367.0 367.0 55.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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