CY74FCT16543ATPACT - Texas Instruments

16-Bit Latched Transceivers

SCCS059B - August 1994 - Revised September 2001

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modiﬁed to remove devices not offered. CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Features

•I

off supports partial-power-down mode operation

• Edge-rate control circuitry for signiﬁcantly improved

noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

• Industrial temperature range of −40˚C to +85˚C

•V

CC = 5V ± 10%

CY74FCT16543T Features:

• 64 mA sink current, 32 mA source current

• Typical VOLP (ground bounce) <1.0V at VCC = 5V,

TA = 25˚C

CY74FCT162543T Features:

• Balanced 24 mA output drivers

• Reduced system switching noise

• Typical VOLP (ground bounce) <0.6V at VCC = 5V,

TA= 25˚C

CY74FCT162H543T Features:

• Bus hold retains last active state

• Eliminates the need for external pull-up or pull-down

resistors

Functional Description

The CY74FCT16543T and CY74FCT162543T are 16-bit,

high-speed,lowpowerlatchedtransceiversthatareorganizedastwo

independent 8-bit D-type latched transceivers containing two sets of

eight D-type latches with separate Latch Enable (LEAB, LEAB) and

Output Enable (OEAB, OEAB) controls for each set to permit

independent control of inputting and outputting in either direction of

data flow. For data flow from A to B, for example, the A-to-B input

Enable(CEAB) mustbe LOWin orderto enter data fromAor to take

data from B as indicated in the truth table. With CAEB LOW, a LOW

signal on the A-to-B Latch Enable (LEAB) makes the A-to-B latches

transparent; a subsequent LOW-to-HIGH transition of the LEAB

signal puts the A latches in the storage mode and their outputs no

longer change with the A inputs. With CEAB and OEAB both LOW,

thethree-stateBoutputbuffersareactiveandreflectthedatapresent

at the output of the A latches. Control of data from B to A is similar,

but uses CEAB, LEAB, and OEAB inputs flow-through pinout and

small shrink packaging and in simplifying board design.

This device is fully speciﬁed for partial-power-down

applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backﬂow through the device

when it is powered down.

The CY74FCT16543T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162543T has 24-mA balanced output drivers

with current limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for

minimal undershoot and reduced ground bounce. The

CY74FCT162543T is ideal for driving transmission lines.

TheCY74FCT162H543T is a 24-mAbalanced output part that

has “bus hold” on the data inputs. The device retains the

input’s last state whenever the input goes to high impedance.

This eliminates the need for pull-up/down resistors and

prevents ﬂoating inputs.

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Maximum Ratings[3, 4]

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature .....................Com’l −55°C to +125°C

Ambient Temperature with

Power Applied.................................Com’l −55°C to +125°C

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage..............................................−0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Logic Block Diagrams PinConfiguration

1OEAB

SSOP/TSSOP

Top View

GND

VCC

FCT16543T-1

FCT16543T-2

TO 7 OTHER CHANNELS

1B1

1OEBA

1A1

1CEBA

1LEAB

1OEAB

1LEBA

1CEAB

2B1

2OEBA

2A1

2CEBA

2OEAB

2LEBA

2CEAB

1LEAB

1CEAB

1A1

VCC

GND

2LEAB

1A2

1A3

1A5

1A4

1A6

1A7

1A8

GND

2A1

2A2

2A3

2A4

2A5

2A6

2A7

2A8

GND

2OEAB

2CEAB

2LEAB

1OEBA

GND

VCC

1LEBA

1CEBA

1B1

VCC

GND

1B2

1B3

1B5

1B4

1B6

1B7

1B8

GND

2B1

2B2

2B3

2B4

2B6

2B7

2B8

GND

2OEBA

2CEBA

2LEBA

2B5

FCT16543T-3

TO 7 OTHER CHANNELS

Pin Description

Name Description

OEAB A-to-B Output Enable Input (Active LOW)

OEBA B-to-A Output Enable Input (Active LOW)

CEAB A-to-B Enable Input (Active LOW)

CEBA B-to-A Enable Input (Active LOW)

LEAB A-to-B Latch Enable Input (Active LOW)

LEBA B-to-A Latch Enable Input (Active LOW)

A A-to-B Data Inputs or B-to-A Three-State Outputs[9]

B B-to-A Data Inputs or A-to-B Three-State Outputs[9]

Function Table[1]

Inputs Latch

Status Output

Buffers

CEAB LEAB OEAB A to B B

H X X Storing High Z

X H X Storing X

X X H X High Z

L L L Transparent Current A

Inputs

L H L Storing Previous A

Inputs[2]

Operating Range

Range Ambient

Temperature VCC

Industrial −40°C to +85°C 5V ± 10%

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.[5] Max. Unit

VIH Input HIGH Voltage 2.0 V

VIL Input LOW Voltage 0.8 V

VHInput Hysteresis[6] 100 mV

VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 mA −0.7 −1.2 V

IIH Input HIGH Current VCC=Max., VI=VCC ±1µA

IIL Input LOW Current VCC=Max., VI=GND ±1µA

IOZH High Impedance Output Cur-

rent (Three-State Output pins) VCC=Max., VOUT=2.7V ±1µA

IOZL High Impedance Output Cur-

rent (Three-State Output pins) VCC=Max., VOUT=0.5V ±1µA

IOS Short Circuit Current[7] VCC=Max., VOUT=GND −80 −140 −200 mA

IOOutput Drive Current[7] VCC=Max., VOUT=2.5V −50 −180 mA

IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[8] ±1µA

Notes:

1. A-to-B data ﬂow shown; B-to-A ﬂow control is the same, except using CEBA, LEBA, and OEBA.

2. Data prior to LEAB LOW-to-HIGH Transition

H = HIGH Voltage Level. L = LOW Voltage Level.

X = Don’t Care. Z = High Impedance.

3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature

range.

4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

5. Typical values are at VCC= 5.0V, TA= +25˚C ambient.

6. This parameter is speciﬁed but not tested.

7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values. Otherwise prolonged shorting

of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter

tests, IOS tests should be performed last.

8. Tested at +25˚C.

9. On the 74FCT162H543T, these pins have bus hold.

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Output Drive Characteristics for CY74FCT16543T

Parameter Description Test Conditions Min. Typ.[5] Max. Unit

VOH Output HIGH Voltage VCC=Min., IOH=−3 mA 2.5 3.5 V

VCC=Min., IOH=−15 mA 2.4 3.5

VCC=Min., IOH=−32 mA 2.0 3.0

VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Output Drive Characteristics for CY74FCT162543T, CY74FCT162H543T

Parameter Description Test Conditions Min. Typ.[5] Max. Unit

IODL Output LOW Current[7] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA

IODH Output HIGH Current[7] VCC=5V, VIN=VIH or VIL, VOUT=1.5V −60 −115 −150 mA

VOH Output HIGH Voltage VCC=Min., IOH=−24 mA 2.4 3.3 V

VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance[6] (TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.[5] Max. Unit

CIN Input Capacitance VIN = 0V 4.5 6.0 pF

COUT Output Capacitance VOUT = 0V 5.5 8.0 pF

Power Supply Characteristics

Parameter Description Test Conditions Typ.[5] Max. Unit

ICC QuiescentPowerSupplyCurrent VCC=Max. VIN≤0.2V,

VIN≥VCC−0.2V 5 500 µA

∆ICC QuiescentPowerSupplyCurrent

(TTL inputs HIGH) VCC=Max. VIN=3.4V[10] 0.5 1.5 mA

ICCD Dynamic Power Supply

Current[11] VCC=Max., One Input

Toggling, 50% Duty Cycle,

Outputs Open, OE=GND

VIN=VCC or

VIN=GND 60 100 µA/MHz

ICTotal Power Supply Current[12] VCC=Max., f1=10 MHz,

50% Duty Cycle, Outputs

Open, One Bit Toggling,

OE=GND

VIN=VCC or

VIN=GND 0.6 1.5 mA

VIN=3.4V or

VIN=GND 0.9 2.3 mA

VCC=Max., f1=2.5 MHz,

50% Duty Cycle, Outputs

Open, Sixteen Bits Toggling,

OE=GND

VIN=VCC or

VIN=GND 2.4 4.5[13] mA

VIN=3.4V or

VIN=GND 6.4 16.5[13] mA

Notes:

10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.

11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

12. IC=I

QUIESCENT + IINPUTS + IDYNAMIC

IC=I

CC+∆ICCDHNT+ICCD(f0/2 + f1N1)

ICC = Quiescent Current with CMOS input levels

∆ICC = Power Supply Current for a TTL HIGH input

(VIN=3.4V)

DH= Duty Cycle for TTL inputs HIGH

NT= Number of TTL inputs at DH

ICCD = Dynamic Current caused by an input transition pair

(HLH or LHL)

f0= Clock frequency for registered devices, otherwise zero

f1= Input signal frequency

N1= Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

13. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Switching Characteristics Over the Operating Range[14]

CY74FCT16543T

CY74FCT162543T CY74FCT16543AT

CY74FCT162543AT Fig.

No.[15]

Parameter Description Min. Max. Min. Max. Unit

tPLH

tPHL Propagation Delay

Transparent Mode

A to B or B to A

1.5 8.5 1.5 6.5 ns 1, 3

tPLH

tPHL Propagation Delay

LEBA to A, LEAB to B 1.5 12.5 1.5 8.0 ns 1, 5

tPZH

tPZL Output Enable Time

OEBA or OEAB to A or B

CEBA or CEAB to A or B

1.5 12.0 1.5 9.0 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time

OEBA or OEAB to A or B

CEBA or CEAB to A or B

1.5 9.0 1.5 7.5 ns 1, 7, 8

tSU Set-up Time HIGH or LOW

A or B to LEAB or LEBA 2.0 — 2.0 — ns 4

tHHold Time HIGH or LOW

A or B to LEAB or LEBA 2.0 — 2.0 — ns 4

tWLEBA or LEAB Pulse Width LOW 4.0 — 4.0 — ns 5

tSK(O) Output Skew[16] — 0.5 — 0.5 ns —

CY74FCT16543CT

CY74FCT162543CT

CY74FCT162H543CT Fig.

No.[15]

Parameter Description Min. Max. Unit

tPLH

tPHL Propagation Delay

Transparent Mode

A to B or B to A

1.5 5.1 ns 1, 3

tPLH

tPHL Propagation Delay

LEBA to A, LEAB to B 1.5 5.6 ns 1, 5

tPZH

tPZL Output Enable Time

OEBA or OEAB to A or B

CEBA or CEAB to A or B

1.5 7.8 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time

OEBA or OEAB to A or B

CEBA or CEAB to A or B

1.5 6.5 ns 1, 7, 8

tSU Set-up Time HIGH or LOW

A or B to LEAB or LEBA 2.0 — ns 4

tHHold Time HIGH or LOW

A or B to LEAB or LEBA 2.0 — ns 4

tWLEBA or LEAB Pulse Width LOW 4.0 — ns 5

tSK(O) Output Skew[16] — 0.5 ns —

Notes:

14. Minimum limits are speciﬁed but not tested on Propagation Delays.

15. See “Parameter Measurement Information” in the General Information section.

16. Skew between any two outputs of the same package switching in the same directional. This parameter is ensured by design.

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Ordering Information CY74FCT162H543T

Ordering Information CY74FCT16543

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

5.1 CY74FCT16543CTPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

6.5 CY74FCT16543ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial

8.5 CY74FCT16543TPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

Ordering Information CY74FCT162543

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

5.1 74FCT162543CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial

CY74FCT162543CTPVC O56 56-Lead (300-Mil) SSOP

74FCT162543CTPVCT O56 56-Lead (300-Mil) SSOP

6.5 74FCT162543ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial

8.5 CY74FCT162543TPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

5.1 74FCT162H543CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial

CY74FCT16543T

CY74FCT162543T

CY74FCT162H543T

Package Diagrams

56-Lead Shrunk Small Outline Package O56

56-Lead Thin Shrunk Small Outline Package Z56

PACKAGING INFORMATION

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

74FCT162543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

74FCT162543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI

74FCT162543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162H543CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT162543CTPVC ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT162543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT162543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT162543TPVC ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT162543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543CTPVC ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT16543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT16543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT16543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT16543TPVC ACTIVE SSOP DL 56 20 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 27-Sep-2007

Addendum-Page 1

Orderable Device Status (1) Package

Type Package

Drawing Pins Package

Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

CY74FCT16543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162H543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162H543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS &

no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 27-Sep-2007

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm) W

(mm) Pin1

Quadrant

74FCT162543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

74FCT162543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

74FCT162543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

74FCT162H543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

CY74FCT162543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

CY74FCT16543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

CY74FCT16543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

CY74FCT16543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162543ATPACT TSSOP DGG 56 2000 346.0 346.0 41.0

74FCT162543CTPACT TSSOP DGG 56 2000 346.0 346.0 41.0

74FCT162543CTPVCT SSOP DL 56 1000 346.0 346.0 49.0

74FCT162H543CTPACT TSSOP DGG 56 2000 346.0 346.0 41.0

CY74FCT162543TPVCT SSOP DL 56 1000 346.0 346.0 49.0

CY74FCT16543ATPACT TSSOP DGG 56 2000 346.0 346.0 41.0

CY74FCT16543CTPVCT SSOP DL 56 1000 346.0 346.0 49.0

CY74FCT16543TPVCT SSOP DL 56 1000 346.0 346.0 49.0

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Mar-2008

Pack Materials-Page 2

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040078/F 12/97

48 PINS SHOWN

0,25

0,15 NOM

Gage Plane

6,00

6,20 8,30

7,90

0,75

0,50

Seating Plane

0,27

0,17

1,20 MAX

0,08

0,10

0,50

0°–8°

14,10

13,90

DIM

A MAX

A MIN

PINS **

12,40

12,60

17,10

16,90

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040048/E 12/01

48 PINS SHOWN

0.730

(18,54)

0.720

(18,29)

4828

0.370

(9,40)

(9,65)

0.380

Gage Plane

DIM

0.420 (10,67)

0.395 (10,03)

A MIN

A MAX

0.010 (0,25)

PINS **

0.630

(16,00)

(15,75)

0.620

0.010 (0,25)

Seating Plane

0.020 (0,51)

0.040 (1,02)

0.008 (0,203)

0.0135 (0,343)

0.008 (0,20) MIN

0.110 (2,79) MAX

0.299 (7,59)

0.291 (7,39)

0.004 (0,10)

0.005 (0,13)

0.025 (0,635)

0°–ā8°

0.005 (0,13)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

PACKAGE OPTION ADDENDUM

www.ti.com 25-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

74FCT162543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

74FCT162543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI

74FCT162543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT162543TPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543CTPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543TPVCG4 ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

74FCT16543TPVCTG4 OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT162543CTPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT162543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT162543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT162543TPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT162543TPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 25-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CY74FCT16543ATPACT ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543CTPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543CTPVCT ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543ETPAC OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT16543ETPACT OBSOLETE TSSOP DGG 56 TBD Call TI Call TI

CY74FCT16543ETPVC OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT16543ETPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI

CY74FCT16543TPVC ACTIVE SSOP DL 56 20 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CY74FCT16543TPVCT OBSOLETE SSOP DL 56 TBD Call TI Call TI

FCT162543ATPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543ATPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPACTE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPACTG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

FCT162543CTPVCTG4 ACTIVE SSOP DL 56 1000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

PACKAGE OPTION ADDENDUM

www.ti.com 25-Aug-2012

Addendum-Page 3

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

74FCT162543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

74FCT162543CTPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

74FCT162543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

CY74FCT162543TPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

CY74FCT16543ATPACT TSSOP DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1

CY74FCT16543CTPVCT SSOP DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Aug-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

74FCT162543ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0

74FCT162543CTPACT TSSOP DGG 56 2000 367.0 367.0 45.0

74FCT162543CTPVCT SSOP DL 56 1000 367.0 367.0 55.0

CY74FCT162543TPVCT SSOP DL 56 1000 367.0 367.0 55.0

CY74FCT16543ATPACT TSSOP DGG 56 2000 367.0 367.0 45.0

CY74FCT16543CTPVCT SSOP DL 56 1000 367.0 367.0 55.0

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Aug-2012

Pack Materials-Page 2

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040048/E 12/01

48 PINS SHOWN

0.730

(18,54)

0.720

(18,29)

4828

0.370

(9,40)

(9,65)

0.380

Gage Plane

DIM

0.420 (10,67)

0.395 (10,03)

A MIN

A MAX

0.010 (0,25)

PINS **

0.630

(16,00)

(15,75)

0.620

0.010 (0,25)

Seating Plane

0.020 (0,51)

0.040 (1,02)

0.008 (0,203)

0.0135 (0,343)

0.008 (0,20) MIN

0.110 (2,79) MAX

0.299 (7,59)

0.291 (7,39)

0.004 (0,10)

0.005 (0,13)

0.025 (0,635)

0°–ā8°

0.005 (0,13)

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

4040078/F 12/97

48 PINS SHOWN

0,25

0,15 NOM

Gage Plane

6,00

6,20 8,30

7,90

0,75

0,50

Seating Plane

0,27

0,17

1,20 MAX

0,08

0,10

0,50

0°–8°

14,10

13,90

DIM

A MAX

A MIN

PINS **

12,40

12,60

17,10

16,90

0,15

0,05

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

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