TD62064,074APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064APG,TD62064AFG,TD62074APG,TD62074AFG 4ch High-Current Darlington Sink Driver The TD62064APG/AFG and TD62074APG/AFG are high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads and all units of TD62074APG/AFG feature uncommitted collectors and emitters for isolated darlington applications. For proper operation, the substrate (SUB) must be connected to the most negative voltage. Applications include relay, hammer, lamp and stepping motor drivers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product. TD62064APG TD62074APG TD62064AFG TD62074AFG Features * Output current (single output) 1.5 A (max) * High sustaining voltage output 50 V (min) (TD62064APG/AFG, 074APG/AFG) * Output clamp diodes: TD62064APG/AFG * Isolated darlington array: TD62074APG/AFG * Input compatible with TTL and 5 V CMOS * GND and SUB terminal = Heat sink * Package type-APG: DIP-16 pin * Package type-AFG: HSOP-16 pin Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) 1 2006-06-13 TD62064,074APG/AFG Pin Assignment (top view) TD62064APG Heat sink & GND O4 NC I4 I3 NC O3 16 15 14 13 12 11 10 9 1 COM 2 O1 3 I1 4 5 6 I2 7 O2 8 COM Heat sink & GND TD62074APG Heat sink & SUB O4 GND I4 I3 GND O3 16 15 14 13 12 11 10 9 1 O1 2 GND 3 I1 4 5 6 I2 7 GND 8 O2 Heat sink & SUB TD62064AFG O4 NC I4 NC 16 15 14 13 1 COM 2 O1 3 I1 4 NC Heat sink & GND Heat sink & GND NC I3 NC O3 12 11 10 9 5 NC 6 I2 7 O2 8 COM TD62074AFG O4 GND I4 16 15 14 13 1 O1 2 3 4 I1 GND Heat sink & GND Heat sink & GND GND I3 O3 12 11 10 9 5 I2 6 7 8 O2 GND 2 2006-06-13 TD62064,074APG/AFG Schematics (each driver) TD62074APG/AFG COMMON 1.1 k 8.2 k 8.2 k 230 Input Output 230 Input Output 1.1 k TD62064APG/AFG GND GND SUB Note: The input and output parasitic diodes cannot be used as clamp diodes. Precautions for Using (1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. (2) If a TD62064APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 1 and 8) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. Please adhere to the device's absolute maximum ratings. Toshiba recommends that zener diodes be connected between the diodes (pins 1 and 8) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please adhere to the device's absolute maximum ratings. If a TD62074APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that a diode be connected between the output pin (as the anode) and the secondary power supply pin. Please adhere to the device's absolute maximum ratings. Absolute Maximum Ratings (Ta = 25C) Characteristics Output sustaining voltage Output current Symbol Rating Unit VCE (SUS) -0.5 to 50 V IOUT 1.5 A/ch Input current IIN 50 mA Input voltage VIN -0.5 to 17 V Clamp diode reverse voltage VR (Note 1) 50 V Clamp diode forward current IF (Note 1) 1.5 A Isolated voltage VSUB (Note 2) 50 V APG Power dissipation PD AFG 1.47/2.7 (Note 3) W 0.9/1.4 (Note 4) Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note 1: TD62064APG/AFG Note 2: TD62074APG/AFG Note 3: On glass epoxy PCB (50 x 50 x 1.6 mm Cu 50%) Note 4: On glass epoxy PCB (60 x 30 x 1.6 mm Cu 30%) 3 2006-06-13 TD62064,074APG/AFG Recommended Operating Conditions (Ta = -40 to 85C) Symbol Test Condition Min Typ. Max Unit VCE (SUS) 0 50 V 0 1250 Characteristics Output sustaining voltage DC1 circuit, Ta = 25C Tpw = 25 ms 4 circuits Tj = 120C Ta = 85C APG (Note 1) Output current IOUT AFG (Note 2) 0 1250 0 390 Duty = 10% 0 907 Duty = 50% 0 172 0 8 2.5 8 VIN Input voltage Duty = 10% Duty = 50% Output ON VIN (ON) Output OFF IOUT = 1.25 A mA/ch V VIN (OFF) 0 0.4 Input current IIN 0 20 mA Clamp diode reverse voltage VR 0 50 V Clamp diode forward current IF 1.25 A V Isolation voltage TD62064APG/AFG VSUB Power dissipation PD AFG 50 Ta = 85C (Note 1) 1.4 Ta = 85C (Note 2) 0.7 Min Typ. Max VCE = 50 V, Ta = 25C 50 VCE = 50 V, Ta = 85C 500 IOUT = 1.25 A, IIN = 2 mA 1.6 IOUT = 0.75 A, IIN = 935 A 1.25 TD62074APG/AFG APG W Note 1: On glass epoxy PCB (50 x 50 x 1.6 mm Cu 50%) Note 2: On glass epoxy PCB (60 x 30 x 1.6 mm Cu 30%) Electrical Characteristics (Ta = 25C) Symbol Test Circuit ICEX 1 VCE (sat) 2 hFE 2 VIN (ON) 3 IR 4 Clamp diode forward voltage VF Input capacitance Characteristics Output leakage current Output saturation voltage DC current transfer ratio Input voltage (output on) Test Condition IOUT = 1.0 A 800 IOUT = 0.25 A 1500 IOUT = 1.25 A, IIN = 2 mA 2.4 VCE = 2 V Unit A V V VR = 50 V, Ta = 25C 50 VR = 50 V, Ta = 85C 100 5 IF = 1.25 A 2.0 V CIN 6 VIN = 0 V, f = 1 MHz 15 pF Turn-ON delay tON 7 CL = 15 pF, VOUT = 50 V, RL = 42 0.1 s Turn-OFF delay tOFF 7 CL = 15 pF, VOUT = 50 V, RL = 42 1.0 s Clamp diode leakage current 4 A 2006-06-13 TD62064,074APG/AFG Test Circuit 1. ICEX 2. VCE (sat), hFE Open 3. VIN (ON) Open Open ICEX IIN IOUT IOUT Open VCE 4. IR VIN (ON) VCE, VCE (sat) 5. VF VCE 6. CIN Open VF IR VR Open fi IF Capacitance bridge LO Open Open Open Open VIN 7. tON, tOFF Input Open VOUT RL Pulse generator (Note 1) Output VIN (Note 1) tf tr Input CL = 15 pF (Note 2) 90% 50% 10% VIH = 2.4 V 90% 50% 50 s 10% 0 tOFF tON VOH Output 50% 50% VOL Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance 5 2006-06-13 TD62064,074APG/AFG IOUT - VCE (sat) IIN - VIN 1.5 TD62064APG TD62074APG TD62064APG TD62074APG (mA) 1.0 max IIN 25C max typ. Input current Output current IOUT (A) 12 0.5 0 0 0.5 1.0 1.5 4 0 1.0 2.0 min typ. 8 2.0 Collector-emitter saturation voltage VCE (sat) (V) 3.0 Input voltage IOUT - IIN 4.0 5.0 VIN (V) PD - Ta 3.0 PD (W) 300 Ta = 75 C 25 -30 Power dissipation Output current IOUT (1) DIP-16 pin on glass epoxy PCB (50 x 50 x 1.6 mm Cu 50%) (1) VCE = 2 V (mA) 400 200 100 0 50 100 150 Input current IIN 2.4 (2) DIP-16 pin free air 1.8 (3) PFP-16 pin on glass epoxy PCB (60 x 30 x 1.6 mm Cu 30%) (2) 1.2 (4) 0.6 0 0 200 (4) PFP-16 pin free air (3) (A) 40 80 Ambient temperature IOUT - Duty cycle 160 120 Ta (C) IOUT - Duty cycle 1500 1500 n=1 (mA) n=3 n=2 n=4 900 Output current IOUT Output current IOUT (mA) n=1 1200 600 300 TD62064APG 1200 n=4 n=2 600 300 TD62064APG Ta = 85C n-ch ON 20 n=3 900 Ta = 25C 0 0 200 n-ch ON 40 Duty Cycle 60 80 0 0 100 (%) 20 40 Duty Cycle 6 60 80 100 (%) 2006-06-13 TD62064,074APG/AFG IOUT - Duty cycle IOUT - Duty cycle 1500 1500 (mA) n=4 n=3 n=2 Output current IOUT Output current IOUT (mA) n=1 1200 900 600 300 TD62064AFG 1200 n=1 n=3 900 n=4 600 300 Ta = 25C 20 TD62064AFG Ta = 85C n-ch ON 0 0 n=2 n-ch ON 40 Duty Cycle 60 80 0 0 100 (%) 20 40 Duty Cycle 7 60 80 100 (%) 2006-06-13 TD62064,074APG/AFG Package Dimensions Weight: 1.11 g (typ.) 8 2006-06-13 TD62064,074APG/AFG Package Dimensions Weight: 0.50 g (typ.) 9 2006-06-13 TD62064,074APG/AFG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 10 2006-06-13 TD62064,074APG/AFG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 11 2006-06-13 TD62064,074APG/AFG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 060116EBA * The information contained herein is subject to change without notice. 021023_D * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 12 2006-06-13