CBT3257ADS,118 - NXP Semiconductors / Philips Semiconductors

1. General description

The CBT3257A is a quad 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer.

The low ON resistance of the switch allows inputs to be connected to outputs without

adding propagation delay or generating additional ground bounce noise.

Output enable (OE) and select-control (S) inputs select the appropriate nB1 and nB2

outputs for the nA input data.

The CBT3257A is characterized for operation from −40 °Cto+85°C.

2. Features

n5Ω switch connection between two ports

nTTL-compatible input levels

nMinimal propagation delay through the switch

nLatch-up protection exceeds 500 mA per JEDEC standard JESD78 class II level A

nESD protection:

uHBM JESD22-A114E exceeds 2000 V

uMM JESD22-A115-A exceeds 200 V

uCDM JESD22-C101C exceeds 1000 V

nMultiple package options

nSpeciﬁed from −40 °Cto+85°C

3. Ordering information

CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Rev. 04 — 19 March 2009 Product data sheet

Table 1. Ordering information

Type number Temperature range Package

Name Description Version

CBT3257AD −40 °Cto+85°C SO16 plastic small outline package; 16 leads;

body width 3.9 mm SOT109-1

CBT3257ADB −40 °Cto+85°C SSOP16 plastic shrink small outline package; 16 leads;

body width 5.3 mm SOT338-1

Product data sheet Rev. 04 — 19 March 2009 2 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

[1] Also known as QSOP16.

4. Functional diagram

CBT3257ADS −40 °Cto+85°C SSOP16[1] plastic shrink small outline package; 16 leads;

body width 3.9 mm; lead pitch 0.635 mm SOT519-1

CBT3257APW −40 °Cto+85°C TSSOP16 plastic thin shrink small outline package; 16 leads;

body width 4.4 mm SOT403-1

CBT3257ABQ −40 °Cto+85°C DHVQFN16 plastic dual in-line compatible thermal enhanced

very thin quad ﬂat package; no leads; 16 terminals;

body 2.5 × 3.5 × 0.85 mm

SOT763-1

Table 1. Ordering information

…continued

Type number Temperature range Package

Name Description Version

Fig 1. Logic diagram

002aab779

1A 1B1

1B2

2A 2B1

2B2

3A 3B1

3B2

4A 4B1

4B2

Product data sheet Rev. 04 — 19 March 2009 3 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

5. Pinning information

5.1 Pinning

Fig 2. Pin conﬁguration SOT109-1 (SO16) and

SOT519-1 (SSOP16) Fig 3. Pin conﬁguration SOT338-1 (SSOP16) and

SOT403-1 (TSSOP16)

CBT3257A

1B1 OE

1B2 4B1

1A 4B2

2B1 4A

2B2 3B1

2A 3B2

GND 3A

001aai364

15 CBT3257A

1B1 OE

1B2 4B1

1A 4B2

2B1 4A

2B2 3B1

2A 3B2

GND 3A

001aai365

(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input.

Fig 4. Pin conﬁguration SOT763-1 (DHVQFN16)

001aai366

CBT3257A

2A 3B2

2B2 3B1

2B1 4A

1A 4B2

1B2 4B1

1B1 OE

GND

VCC

Transparent top view

7 10

6 11

5 12

4 13

3 14

2 15

terminal 1

index area

GND(1)

Product data sheet Rev. 04 — 19 March 2009 4 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

5.2 Pin description

6. Functional description

7. Limiting values

[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.

[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 °C.

[3] For SSOP16 and TSSOP16 package: Ptot derates linearly with 5.5 mW/K above 70 °C.

[4] For DHVQFN16 package: Ptot derates linearly with 4.5 mW/K above 70 °C.

Table 2. Pin description

Symbol Pin Description

S 1 select control input

1B1, 2B1, 3B1, 4B1, 2, 5, 11, 14 B1 outputs/inputs

1B2, 2B2, 3B2, 4B2 3, 6, 10, 13 B2 outputs/inputs

1A, 2A, 3A, 4A 4, 7, 9, 12 A inputs/outputs

GND 8 ground (0 V)

OE 15 output enable (active LOW)

VCC 16 positive supply voltage

Table 3. Function selection

H = HIGH voltage level; L = LOW voltage level; X = Don’t care.

Inputs Switch

OE S

L L nA to nB1

L H nA to nB2

H X switch off

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +7.0 V

VIinput voltage [1] −0.5 +7.0 V

ISW switch current continuous current through each switch - 128 mA

IIK input clamping current VI<0V −50 −mA

Tstg storage temperature −65 +150 °C

Ptot total power dissipation Tamb = −40 °C to +125 °C

SO16 package [2] - 500 mW

SSOP16 package [3] - 500 mW

TSSOP16 package [3] - 500 mW

DHVQFN16 package [4] - 500 mW

Product data sheet Rev. 04 — 19 March 2009 5 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

8. Recommended operating conditions

9. Static characteristics

[1] All typical values are measured at VCC =5V; T

amb =25°C.

[2] This is the increase in supply current for each input that is at the speciﬁed TTL voltage level rather than VCC or GND.

[3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is

determined by the lowest voltage of the two (A or B) terminals.

Table 5. Operating conditions

All unused control inputs of the device must be held at V

or GND to ensure proper device operation.

Symbol Parameter Conditions Min Max Unit

VCC supply voltage 4.5 5.5 V

VIH HIGH-level input voltage 2.0 - V

VIL LOW-level input voltage - 0.8 V

Tamb ambient temperature operating in free-air −40 +85 °C

Table 6. Static characteristics

amb

−

C to +85

Symbol Parameter Conditions Min Typ[1] Max Unit

VIK input clamping voltage VCC = 4.5 V; II=−18 mA - - −1.2 V

Vpass pass voltage VI=V

CC = 5.0 V; IO=−100 µA 3.4 3.6 3.9 V

IIinput leakage current VCC = 5.5 V; VI= GND or 5.5 V - - ±1µA

ICC supply current VCC = 5.5 V; IO= 0 mA;

VI=V

CC or GND --3µA

∆ICC additional supply current per input;VCC = 5.5 V; one input at

3.4 V, other inputs at VCC or GND [2] - - 2.5 mA

CIinput capacitance control pins; VI= 3 V or 0 V - 3.3 - pF

Cio(off) off-state input/output capacitance A port; VO= 3 V or 0 V; OE = VCC - 9.9 - pF

B port; VO= 3 V or 0 V; OE = VCC - 6.4 - pF

RON ON resistance VCC = 4.5 V [3]

VI=0V; I

I=64mA - 5 7 Ω

VI=0V; I

I=30mA - 5 7 Ω

VI= 2.4 V; II= 15 mA - 10 15 Ω

Product data sheet Rev. 04 — 19 March 2009 6 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

10. Dynamic characteristics

[1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON

resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance).

[2] tPLH and tPHL are the same as tpd.

tPZL and tPZH are the same as ten.

tPLZ and tPHZ are the same as tdis.

11. AC waveforms

Table 7. Dynamic characteristics

amb

−

C to +85

C; V

= 4.5 V to 5.5 V; for test circuit see Figure 7.

Symbol Parameter Conditions Min Max Unit

tpd propagation delay nA to nBn or nBn to nA; see Figure 5 [1][2] - 0.25 ns

S to nA or nBn; see Figure 5 [1][2] 1.6 5.0 ns

ten enable time OE to nA or nBn; see Figure 6 [2] 1.8 5.1 ns

S to nA or nBn; see Figure 6 [2] 1.6 5.2 ns

tdis disable time OE to nA or nBn; see Figure 6 [2] 2.2 5.5 ns

S to nA or nBn; see Figure 6 [2] 1.0 5.0 ns

Measurement points are given in Table 8.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 5. The input (nA; nBn) to output (nBn; nA) or input (S) to output (nBn; nA) propagation delay times

001aai367

VMVM

input

0 V

VOH

output

VOL

tPHL tPLH

Product data sheet Rev. 04 — 19 March 2009 7 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Measurement points are given in Table 8.

VOL and VOH are typical voltage output levels that occur with the output load.

Fig 6. Enable and disable times

001aai368

tPLZ

tPHZ

outputs

disabled outputs

enabled

outputs

enabled

output

LOW-to-OFF

OFF-to-LOW

output

HIGH-to-OFF

OFF-to-HIGH

OE, S input

VOL

VOH

VCC

GND

tPZL

tPZH

Table 8. Measurement points

Supply voltage Input Output

VCC VIVMVMVXVY

4.5 V to 5.5 V GND to 3.0 V 1.5 V 1.5 V VOL + 0.3 V VOH − 0.3 V

Product data sheet Rev. 04 — 19 March 2009 8 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

12. Test information

Test data is given in Table 9.

Deﬁnitions for test circuit:

RL = Load resistance.

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.

VEXT = External voltage for measuring switching times.

Fig 7. Test circuit for measuring switching times

VMVM

10 %

90 %

0 V

negative

pulse

positive

pulse

0 V

VMVM

90 %

10 %

001aae331

VEXT

VCC

VIVO

DUT

Table 9. Test data

Supply voltage Input Load VEXT

VCC VItr, tfCLRLtPLH, tPHL tPLZ, tPZL tPHZ, tPZH

4.5 V to 5.5 V GND to 3.0 V ≤ 2.5 ns 50 pF 500 Ωopen 7.0 V open

Product data sheet Rev. 04 — 19 March 2009 9 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

13. Package outline

Fig 8. Package outline SOT109-1 (SO16)

detail X

vMA

(A )

pin 1 index

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 10.0

9.8 4.0

3.8 1.27 6.2

5.8 0.7

0.6 0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT109-1 99-12-27

03-02-19

076E07 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.39

0.38 0.16

0.15 0.05

1.05

0.041

0.244

0.228 0.028

0.020 0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

Product data sheet Rev. 04 — 19 March 2009 10 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Fig 9. Package outline SOT338-1 (SSOP16)

UNIT A1A2A3bpcD

(1) E(1) eH

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.21

0.05 1.80

1.65 0.25 0.38

0.25 0.20

0.09 6.4

6.0 5.4

5.2 0.65 1.25

7.9

7.6 1.03

0.63 0.9

0.7 1.00

0.55 8

0.130.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT338-1 99-12-27

03-02-19

(1)

vMA

16 9

detail X

(A )

MO-150

pin 1 index

0 2.5 5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1

max.

Product data sheet Rev. 04 — 19 March 2009 11 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Fig 10. Package outline SOT519-1 (SSOP16)

UNIT A1A2A3bpcD

(1) E(1) eH

ELL

pZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.25

0.10 1.55

1.40 0.25 0.31

0.20 0.25

0.18 5.0

4.8 4.0

3.8 0.635 1

6.2

5.8 0.89

0.41 0.18

0.05 8

0.180.2 0.09

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

SOT519-1 99-05-04

03-02-18

(1)

vMA

16 9

detail X

(A )

0 2.5 5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1

max.

1.73

Product data sheet Rev. 04 — 19 March 2009 12 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Fig 11. Package outline SOT403-1 (TSSOP16)

UNIT A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.30

0.19 0.2

0.1 5.1

4.9 4.5

4.3 0.65 6.6

6.2 0.4

0.3 0.40

0.06 8

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT403-1 MO-153 99-12-27

03-02-18

0.25

16 9

detail X

(A )

vMA

0 2.5 5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1

max.

1.1

pin 1 index

Product data sheet Rev. 04 — 19 March 2009 13 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

Fig 12. Package outline SOT763-1 (DHVQFN16)

terminal 1

index area

0.51

A1Eh

UNIT ye

0.2

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 3.6

3.4

2.15

1.85

2.6

2.4 1.15

0.85

2.5

0.30

0.18

0.05

0.00 0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT763-1 MO-241 - - -- - -

0.5

0.3

0.1

0.05

0 2.5 5 mm

scale

SOT763-1

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

A(1)

max.

AA1c

detail X

y1C

15 10

terminal 1

index area

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

02-10-17

03-01-27

Product data sheet Rev. 04 — 19 March 2009 14 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

14. Abbreviations

15. Revision history

Table 10. Abbreviations

Acronym Description

CDM Charged Device Model

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

CBT3257A_4 20090319 Product data sheet - CBT3257A_3

Modiﬁcations: •Table 4 “Limiting values” modiﬁed.

CBT3257A_3 20080704 Product data sheet - CBT3257A_2

CBT3257A_2 20070704 Product data sheet - CBT3257A_1

CBT3257A_1 20051027 Product data sheet - -

Product data sheet Rev. 04 — 19 March 2009 15 of 16

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

16.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors CBT3257A

Quad 1-of-2 multiplexer/demultiplexer

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 March 2009

Document identifier: CBT3257A_4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Functional description . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Recommended operating conditions. . . . . . . . 5

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

11 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

17 Contact information. . . . . . . . . . . . . . . . . . . . . 15

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16