SN74LVC2G14 www.ti.com SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 Dual Schmitt-Trigger Inverter Check for Samples: SN74LVC2G14 FEATURES DESCRIPTION * This dual Schmitt-trigger inverter is designed for 1.65V to 5.5-V VCC operation. 1 2 * * * * * * * * * * * Available in the Texas Instruments NanoFreeTM Package Supports 5-V VCC Operation Inputs Accept Voltages to 5.5 V Max tpd of 5.4 ns at 3.3 V Low Power Consumption, 10-A Max ICC 24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection Support Translation Down (5V to 3.3V; 3.3V to 1.8V) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 1000-V Charged-Device Model (C101) DBV PACKAGE (TOP VIEW) 1A 1 6 NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT-) signals. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. DCK PACKAGE (TOP VIEW) 1Y GND 2 5 VCC 2A 3 4 2Y YZP PACKAGE (BOTTOM VIEW) 1A 1 6 1Y GND 2 5 VCC 2A 3 4 2Y 2A 3 4 2Y GND 2 5 VCC 1A 1 6 1Y See mechanical drawings for dimensions. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated SN74LVC2G14 SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Function Table (Each Inverter) INPUT A OUTPUT Y H L L H Logic Diagram (Positive Logic) 1A 2A 1 6 3 4 1Y 2Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range -0.5 6.5 UNIT V (2) VI Input voltage range -0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) -0.5 6.5 V VO Voltage range applied to any output in the high or low state (2) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA (3) Continuous current through VCC or GND JA Tstg (1) (2) (3) (4) 2 Package thermal impedance (4) DBV package 165 DCK package 259 YZP package 123 Storage temperature range -65 150 V C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 SN74LVC2G14 www.ti.com SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 Recommended Operating Conditions (1) VCC Supply voltage VI Input voltage VO Output voltage IOH Operating Data retention only High-level output current MIN MAX 1.65 5.5 1.5 5.5 V 0 VCC V VCC = 1.65 V -4 VCC = 2.3 V -8 -16 VCC = 3 V -32 4 VCC = 2.3 V 8 16 VCC = 3 V (1) Operating free-air temperature mA 24 VCC = 4.5 V TA mA -24 VCC = 1.65 V Low-level output current V 0 VCC = 4.5 V IOL UNIT 32 -40 125 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 3 SN74LVC2G14 SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 www.ti.com Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VT+ Positive-going input threshold voltage VT- Negative-going input threshold voltage VT Hysteresis (VT+ - VT-) VOH VOL II A input TYP (1) -40C to 125C MAX MIN TYP (1) MAX 1.65 V 0.7 1.4 0.7 1.4 2.3 V 1 1.7 1 1.7 3V 1.3 2.2 1.3 2.2 4.5 V 1.9 3.1 1.9 3.1 5.5 V 2.2 3.7 2.2 3.7 1.65 V 0.3 0.7 0.3 0.7 2.3 V 0.4 1 0.4 1 3V 0.6 1.3 0.6 1.3 4.5 V 1.1 2 1.1 2 5.5 V 1.4 2.5 1.4 2.5 1.65 V 0.3 0.8 0.3 0.8 2.3 V 0.4 0.9 0.4 0.9 3V 0.4 1.1 0.4 1.1 4.5 V 0.6 1.3 0.6 1.3 5.5 V 0.7 1.4 0.7 1.4 1.65 V to 4.5 V IOH = -100 A -40C to 85C MIN VCC - 0.1 VCC - 0.1 IOH = -4 mA 1.65 V 1.2 1.2 IOH = -8 mA 2.3 V 1.9 1.9 IOH = -16 mA 3V 2.4 2.4 IOH = -24 mA 3V 2.3 2.3 IOH = -32 mA 4.5 V 3.8 3.8 IOL = 100 A 1.65 V to 4.5 V 0.1 0.1 IOL = 4 mA 1.65 V 0.45 0.45 IOL = 8 mA 2.3 V 0.3 0.3 IOL = 16 mA 3V 0.4 0.4 IOL = 24 mA 3V 0.55 0.55 IOL = 32 mA 4.5 V 0.55 0.55 VI = 5.5 V or GND UNIT V V V V V 0 to 5.5 V 5 5 A 0 10 10 A Ioff VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 1.65 V to 5.5 V 10 10 A ICC One input at VCC - 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 500 A CI VI = VCC or GND (1) 4 3.3 V 4 pF All typical values are at VCC = 3.3 V, TA = 25C. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 SN74LVC2G14 www.ti.com SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC2G14 -40C to 85C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 3.9 9.5 1.9 5.7 2 5.4 1.5 4.3 ns Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC2G14 -40C to 125C PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 3.9 10.5 1.9 6.5 2 6.0 1.5 4.7 ns Operating Characteristics TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 16 17 18 21 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 UNIT pF 5 SN74LVC2G14 SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 www.ti.com Parameter Measurement Information VLOAD S1 RL From Output Under Test Open TEST GND CL (see Note A) S1 Open VLOAD tPLH/tPHL tPLZ/tPZL tPHZ/tPZH RL GND LOAD CIRCUIT INPUTS VCC 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 5 V 0.5 V VI tr/tf VCC VCC 3V VCC 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL VD VCC/2 VCC/2 1.5 V VCC/2 2 x VCC 2 x VCC 6V 2 x VCC 30 pF 30 pF 50 pF 50 pF 1 kW 500 W 500 W 500 W 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tW tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VOH Output VM VOL tPHL tPLZ VLOAD/2 VM tPZH VM VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH VOH Output VM tPZL tPHL VM VI Output Control VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + VD VOL tPHZ VM VOH - VD VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 W. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 SN74LVC2G14 www.ti.com SCES200M - APRIL 1999 - REVISED NOVEMBER 2013 REVISION HISTORY Changes from Revision L (January 2007) to Revision M Page * Updated document to new TI data sheet format. ................................................................................................................. 1 * Added ESD warning. ............................................................................................................................................................ 2 * Updated operating temperature range. ................................................................................................................................. 3 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: SN74LVC2G14 7 PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74LVC2G14DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DBVTE4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C142 ~ C145 ~ C14F ~ C14K ~ C14R) SN74LVC2G14DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14DCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (CF5 ~ CFF ~ CFK ~ CFR) SN74LVC2G14YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 (CF7 ~ CFN) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Oct-2013 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVC2G14 : * Automotive: SN74LVC2G14-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) SN74LVC2G14DBVR SOT-23 DBV 6 3000 178.0 9.0 3.17 1.37 4.0 8.0 Q3 SN74LVC2G14DBVR SOT-23 DBV 6 3000 178.0 9.2 SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3 3.17 3.23 1.37 4.0 8.0 SN74LVC2G14DBVT SOT-23 DBV 6 250 180.0 9.2 Q3 3.17 3.23 1.37 4.0 8.0 SN74LVC2G14DBVT SOT-23 DBV 6 250 178.0 Q3 9.2 3.3 3.2 1.55 4.0 8.0 Q3 SN74LVC2G14DCKR SC70 DCK 6 3000 SN74LVC2G14DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 180.0 9.2 2.3 2.55 1.2 4.0 8.0 SN74LVC2G14DCKR SC70 DCK 6 Q3 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3 SN74LVC2G14DCKT SC70 DCK SN74LVC2G14DCKT SC70 DCK 6 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 6 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 SN74LVC2G14YZPR DSBGA YZP Q3 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 3.23 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 SN74LVC2G14DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0 SN74LVC2G14DBVT SOT-23 DBV 6 250 205.0 200.0 33.0 SN74LVC2G14DBVT SOT-23 DBV 6 250 180.0 180.0 18.0 SN74LVC2G14DCKR SC70 DCK 6 3000 180.0 180.0 18.0 SN74LVC2G14DCKR SC70 DCK 6 3000 205.0 200.0 33.0 SN74LVC2G14DCKR SC70 DCK 6 3000 180.0 180.0 18.0 SN74LVC2G14DCKT SC70 DCK 6 250 205.0 200.0 33.0 SN74LVC2G14DCKT SC70 DCK 6 250 180.0 180.0 18.0 SN74LVC2G14YZPR DSBGA YZP 6 3000 220.0 220.0 35.0 Pack Materials-Page 2 D: Max = 1.418 mm, Min =1.358 mm E: Max = 0.918 mm, Min =0.858 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated