MPC8347AVRADB - Freescale Semiconductor, Inc.

Freescale Semiconductor

The MPC8347EA PowerQUICC II Pro i s a next generation

PowerQUICC II integrated host processor. The

MPC8347EA contains a processor core built on Power

Architecture™ technology with system logic for

networking, storage, and general-purpose embedded

applications. For functional characteristics of the processor,

refer to th e MPC8349EA PowerQUICC II Pro Integrated

Host Processor Family Refere nce Manual.

T o locate published errata or updates for this document, refer

to the MPC8347EA product summary page on our website

listed on the back cover of this document or, contact your

local Freescale sales office.

Document Number: MPC8347EAEC

Rev. 10, 05/2010

Contents

1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6

3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10

4. Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13

6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 15

7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

8. Ethernet: Three-Speed Ethernet, MII Management . 22

9. USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

11. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

12. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

13. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

14. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

15. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

16. IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

17. SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

18. Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 53

19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

21. System Design Information . . . . . . . . . . . . . . . . . . . 90

22. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 93

23. Document Revision History . . . . . . . . . . . . . . . . . . . 95

MPC8347EA PowerQUICC II Pro

Integrated Host Processor Hardware

Specifications

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

2Freescale Semiconductor

Overview

NOTE

The information in this document is accurate for revis ion 3.x silicon and

later (in other words, for orderable part numbers ending in A or B). For

information on revis ion 1.1 silicon a nd earlier ve rsions, see the MPC8347E

PowerQUIC C II Pro Integrated Host Processor Hardware Specifications.

See Section 22.1, “Part Numbers Fully Addressed by This Document,” for

silicon revision level determination.

1Overview

This section provides a high-level overview of the device features. Figure 1 shows the major functiona l

units within the MPC8347EA.

Figure 1. MPC8347EA Block Diagram

Major features of the device are as follows:

• Embedded PowerPC e300 processor core; operates at up to 667 MHz

— High-performance, superscalar processor core

— Floating-point, integer, loa d/store, system register, and branch processing units

— 32-Kbyte instruction cache, 32-Kbyte data cache

— Lockable portion of L1 cache

— Dynamic power management

— Software-compatible with the other Freescale proc essor fa milies that implement Power

Architecture technology

• Double data rate, DDR1/DDR2 SDRAM memory controller

— Programmable timing supporting DDR1 and DDR2 SDR AM

— 32- or 64-bit data interface, up to 400 MHz data rate for TB GA, 266 MHz for PBGA

DUART

Dual I2C

Timers

GPIO

Security Interrupt

Controller

Dual

Role

High-Speed

Local Bus

DDR

SDRAM

Controller

Host

32KB

D-Cache

e300 Core

32KB

I-Cache

USB 2.0 10/100/1000 SEQ

PCI DMA

Ethernet

10/100/1000

Ethernet

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 3

Overview

— Up to four physical banks (chip selects), each bank up to 1 Gbyte independently addressable

— DRAM chip configurations from 64 Mbits to 1 Gbit with x8/x16 data ports

— Full error checking and correction (ECC) support

— Support for up to 16 simultaneous open pages (up to 32 pages for DDR2)

— Contiguous or discontiguous memory mapping

— Read-modify-write support

— Sleep-mode support for SDRAM self refresh

— Auto refresh

— On-the-fly power management using CKE

— Registered DIMM support

— 2.5-V SSTL 2 compatib le I/O for DDR1, 1 .8-V SSTL2 comp at ib le I/O for DDR2

• Dual three-speed (10/100/1000) Ethernet controllers (TSECs)

— Dual controllers designed to comply with IEEE 802.3™, 802.3u™, 820. 3x™, 802.3z™,

802.3ac™ standards

— Ethernet physical interfaces:

– 1000 Mbps IEEE Std. 802.3 GMII /RGMII, IEEE Std. 802.3z TBI/RT BI, full-duplex

– 10/100 Mbps IEEE Std. 802.3 MII full- and half-duplex

— Buffer desc riptors are backward-compatible with MPC8260 and MPC860T 10/100

programming models

— 9.6-Kbyte jumbo frame support

— RMON statistics support

— Internal 2-Kbyte transmit and 2-Kbyte receive FIFOs per TSEC module

— MII management interface for control and status

— Programmable CRC generation and checking

• PCI i nte rfa c e

— Designed to comply with PCI Specification Revision 2.3

— Data bus width:

– 32-bit data PCI interface operating at up to 66 MHz

— PCI 3.3 -V compatible

— PCI host bridge capabilities

— PCI agent mode on PCI inte rf a ce

— PCI-to-memory and memory-to-PC I str eaming

— Memory prefetching of PCI read accesses and support for delayed read transactions

— Posting of processor-t o-PCI and PCI-to-memory writes

— On-chip arbitration supporting five masters on PCI

— A cces ses to all PCI address spaces

— Parity supported

— S electable hardw are-enfor ced coher ency

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

4Freescale Semiconductor

Overview

— Address translation units for address mapping between host and peripheral

— Dual address cycl e for target

— Internal configuration registers accessible from PCI

• Security engine is optimized to handle all the algorithms ass oci ated with IPS ec, SSL/T LS , SRTP,

IEEE Std. 802.11i®, iSCSI, and IK E processing. The secur ity engine contains four

crypto-channels, a controller, and a set of crypto execution units (EUs ):

— Public key execution unit (PKEU) :

– RSA and Diff ie-Hellman algori thms

– Programmable field size up to 2048 bits

– Elliptic curve cryptography

– F2m and F(p) modes

– Programmable field size up to 511 bits

— Data encr yption standard (DES) execution unit (DEU)

– DES and 3DES algorithms

– Two key (K1, K2) or three key (K1, K2, K3) for 3DES

– ECB a nd CBC mode s for both DES and 3DES

— Advanced encr yption standard unit (AESU)

– Implements the Rijndael symmetric-key cipher

– Key lengths of 128, 192, and 256 bi ts

– ECB, CBC, CC M, and counter (CTR) modes

— XOR parity generation accelerator for RAID a pplicat ions

— ARC four execution unit (AFEU)

– Stre am ciph er compatible with the RC4 algorithm

– 40- to 128-bit programmable key

— Message digest execution unit (MDEU)

– SHA with 160-, 224-, or 256-bit message digest

– MD5 with 128-bit message digest

– HMAC with either algorithm

— Random number generator (RNG)

— Four crypto-channels, each supporting multi-command descriptor chains

– Static and/or dynamic assignment of crypto-execution units through an integrated controller

– Buffer size of 256 bytes for each execution unit, with flow contr ol for large data sizes

• Universal serial bus (USB) dual role controller

— USB on-the-go mode with both device and host functionality

— Complies with USB specifica tion Rev. 2.0

— Can operate as a stand-alone USB device

– One ups tream facing port

– Six programmable USB endpoints

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 5

Overview

— Can operate as a stand-alone USB host controller

– USB root hub with one downstream-facing port

– Enha nced host controller interface (E HCI) compatibl e

– High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1. 5 Mbps) operations

— External PHY with UTMI, serial and UTM I+ low-pin interface (ULPI)

• Univers al seria l bus (USB) multi- port host controlle r

— Can operate as a stand-alone USB host controller

– USB root hub with one or two downstream-facing ports

– Enha nced host controller interface (E HCI) compatibl e

– Complies with USB Specification Rev. 2.0

— High-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations

— Dire ct connection to a high-speed device without an external hub

— External PHY with serial and low-pin count (ULPI) interfaces

• Local bus controller (LBC)

— Multiplexed 32-bit address and data operating at up to 133 MHz

— Eight chip select s for eight external sl aves

— Up to eight-beat burst transfers

— 32-, 16-, and 8-bit port sizes controlled by an on-chip me mory controller

— Three protocol engines on a per chip select basis:

– General-purpose chip select machine (GPCM)

– Three user-programmabl e machi nes ( UPMs)

– Dedicated singl e data rate SDRAM controller

— Parity support

— Default boot ROM chip select with configurable bus width (8-, 16-, or 32-bit)

• Programmable inter rupt controller (PIC)

— Functional and programming compatibility with the MPC8260 interrupt controller

— Support for 8 external and 35 internal discrete interrupt sources

— S upport for 1 extern al (optional) and 7 internal machine checkstop interrupt sources

— Programmable highest priority request

— Four groups of interrupts with programmable priority

— External and internal interrupts directed to host processor

— Redirec ts interr upts to exter nal INTA pin in core disable mode.

— Unique vector number for each interrupt s ource

• Dual industry-standard I2C interfaces

— Two- wire int erface

— Multiple master support

— Master or slave I2C mode s upport

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

6Freescale Semiconductor

Electrical Characteristics

— On-chip digital filtering rejects spikes on the bus

— System initialization data optionally loaded from I2C-1 EPROM by boot sequencer embedded

hardware

• DMA controlle r

— F our independent virtual channels

— Concurrent execution across multiple channels with programmable bandwidth control

— Handsha king (external control) signals for all channels : DMA_DREQ[0:3],

DMA_DACK[0:3], DMA_DDONE[0:3]

— All channels accessible to local core and remote PCI masters

— Misaligned trans fer capabili ty

— Data chaining and direct mode

— Interrupt on completed segment and chain

• DUART

— Two 4-wire interfaces (RxD, TxD, RTS, CTS)

— Programming model compatible with the original 16450 UART and the PC16550D

• Serial periphera l interface (SPI) for master or slave

• General- purpose parallel I/O (GPIO)

— 52 parallel I/O pins multiplexed on various chip interfaces

• Syste m timers

— Periodic interrupt timer

— Real-time clock

— S oftware watchdog timer

— Eight general-purpose timers

• Designed to comply with IEEE Std. 1149.1™, JTAG boundary scan

• Integrated PCI bus and SDRAM clock generation

2 Electrical Characteristics

This section provides th e AC and DC electrical specif i cati ons and the rmal charact er isti cs f or the

MPC8347EA. The device is currently targeted to these specifications. Some of thes e specifications are

independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buf fer

design specifications.

2.1 Overall DC Electrical Characteristics

This s ection cove rs the ratings, conditions , and othe r characteristics.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 7

Electrical Characteristics

2.1.1 Absolute Maximum Ratings

Table 1 provides the absolute maximum ratings.

Table 1. Absolute Maximum Ratings1

Characteristic Symbol Max Value Unit Notes

Core supply voltage VDD –0.3 to 1.32 (1.36 max

for 667-MHz core

frequency)

V—

PLL supply voltage AVDD –0.3 to 1.32 (1.36 max

for 667-MHz core

frequency)

V—

DDR and DDR2 DRAM I/O voltage GVDD –0.3 to 2.75

–0.3 to 1.98

V—

Three-speed Ethernet I/O, MII management voltage LVDD –0.3 to 3.63 V —

PCI, local bus, DUART, system control and power management, I2C,

and JTAG I/O voltage

OVDD –0.3 to 3.63 V —

Input voltage DDR DRAM signals MVIN –0.3 to (GVDD + 0.3) V 2, 5

DDR DRAM reference MVREF –0.3 to (GVDD + 0.3) V 2, 5

Three-speed Ethernet signals LVIN –0.3 to (LVDD + 0.3) V 4, 5

Local bus, DUART, CLKIN, system control and

power management, I2C, and JTAG signals

OVIN –0.3 to (OVDD + 0.3) V 3, 5

PCI OVIN –0.3 to (OVDD + 0.3) V 6

Storage temperature range TSTG –55 to 150 °C—

Notes:

1Functional and tested operating conditions are given in Ta b l e 2 . Absolute maximum ratings are stress ratings only, and

functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during

power-on reset and power-down sequences.

3Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during

power-on reset and power-down sequences.

4Caution: LV IN must not exceed LVDD by more than 0.3 V. This limit can be exceeded for a maximum of 20 ms during power-on

reset and power-down sequences.

5(M,L,O)VIN and MVREF may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.

6OVIN on the PCI interface can overshoot/undershoot according to the PCI Electrical Specification for 3.3-V operation, as

shown in Figure 3.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

8Freescale Semiconductor

Electrical Characteristics

2.1.2 Power Supply Voltage Specification

Table 2 provides the recommended operating conditions for t he MPC8347EA. Note that the values in

Table 2 are the recommended and test ed operating conditions. Prope r device operation outside these

conditions is not guaranteed.

Figure 2 shows the undershoot and overshoot voltages at the interfaces of the MPC8347EA.

Figure 2. Overshoot/Undershoot Voltage for GVDD/OVDD/LVDD

Table 2. Recommended Operating Conditions

Characteristic Symbol Recommended

Value Unit Notes

Core supply voltage for 667-MHz core frequency VDD 1.3 V ± 60 mV V 1

Core supply voltage VDD 1.2 V ± 60 mV V 1

PLL supply voltage for 667-MHz core frequency AVDD 1.3 V ± 60 mV V 1

PLL supply voltage AVDD 1.2 V ± 60 mV V 1

DDR and DDR2 DRAM I/O voltage GVDD 2.5 V ± 125 mV

1.8 V ± 90 mV

V—

Three-speed Ethernet I/O supply voltage LVDD1 3.3 V ± 330 mV

2.5 V ± 125 mV

V—

Three-speed Ethernet I/O supply voltage LVDD2 3.3 V ± 330 mV

2.5 V ± 125 mV

V—

PCI, local bus, DUART, system control and power

management, I2C, and JTAG I/O voltage

OVDD 3.3 V ± 330 mV V —

Note:

1GVDD, LVDD, OVDD

, AVDD, and VDD must track each other and must vary in the same direction—either in the positive or

negative direction.

GND

GND – 0.3 V

GND – 0.7 V Not to Exceed 10%

G/L/OVDD + 20%

G/L/OVDD

G/L/OVDD + 5%

of tinterface1

1. tinterface refers to the clock period associated with the bus clock interface.

VIH

VIL

Note:

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 9

Electrical Characteristics

Figure 3 shows the undershoot and overshoot voltage of the PCI interface of the MPC8347EA for the

3.3-V signals, respectively.

Figure 3. Maximum AC Waveforms on PCI Interface for 3.3-V Signaling

2.1.3 Output Driver Characteristics

Table 3 provides information on the characteristics of the output driver strengths. The values are

prelimina ry estimates .

2.2 Power Sequencing

The device does not require the core supply voltage and I/O supply voltages to be applied in any particular

order. Note that during the power ramp up, before the power supplies are stable, there may be a period of

time that I/ O pins are actively driven. After the power is stable, as long as PORESET is asserted, most I/O

pins are three-stated. To minimize the time that I/O pins are actively driven, it is recommended to apply

core voltage before I/O voltage and assert PO RESET before the power supplies fully ramp up.

Table 3. Output Drive Capability

Driver Type Output Impedance

(Ω)

Supply

Voltage

Local bus interface utilities signals 40 OVDD = 3.3 V

PCI signals (not including PCI output clocks) 25

PCI output clocks (including PCI_SYNC_OUT) 40

DDR signal 18 GVDD = 2.5 V

DDR2 signal 18

36 (half strength mode)

GVDD = 1.8 V

TSEC/10/100 signals 40 LVDD = 2.5/3.3 V

DUART, system control, I2C, JTAG, USB 40 OVDD = 3.3 V

GPIO signals 40 OVDD = 3.3 V,

LVDD = 2.5/3.3 V

Undervoltage

Waveform

Overvoltage

Waveform

11 ns

(Min)

+7.1 V

7.1 V p-to-p

(Min)

4 ns

(Max)

–3.5 V

7.1 V p-to-p

(Min)

62.5 ns

+3.6 V

0 V

4 ns

(Max)

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

10 Freescale Semiconductor

Power Characteristics

3 Power Characteristics

The estimated typical power dissipation for the MPC8347EA device is shown in Table 4.

Table 4. MPC8347EA Power Dissipation1

1The values do not include I/O supply power (OVDD, LVDD, GVDD) or AVDD. For I/O power values, see Ta bl e 5 .

Core

Frequency

(MHz)

CSB

Frequency

(MHz)

Typical at TJ= 65 Typical2,3

2Typical power is based on a voltage of VDD = 1.2 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark

application.

3Thermal solutions may need to design to a value higher than typical power based on the end application, TA target, and I/O

power.

Maximum4

4Maximum power is based on a voltage of VDD = 1.2 V, worst case process, a junction temperature of TJ = 105°C, and an

artificial smoke test.

Unit

PBGA 266 266 1.3 1.6 1.8 W

133 1.1 1.4 1.6 W

400 266 1.5 1.9 2.1 W

133 1.4 1.7 1.9 W

400 200 1.5 1.8 2.0 W

100 1.3 1.7 1.9 W

TBGA 333 333 2.0 3.0 3.2 W

166 1.8 2.8 2.9 W

400 266 2.1 3.0 3.3 W

133 1.9 2.9 3.1 W

450 300 2.3 3.2 3.5 W

150 2.1 3.0 3.2 W

500 333 2.4 3.3 3.6 W

166 2.2 3.1 3.4 W

533 266 2.4 3.3 3.6 W

133 2.2 3.1 3.4 W

6675,6

5Typical power is based on a voltage of VDD = 1.3 V, a junction temperature of TJ = 105°C, and a Dhrystone benchmark

application.

6Maximum power is based on a voltage of VDD = 1.3 V, worst case process, a junction temperature of TJ = 105°C, and an

artificial smoke test.

333 3.5 4.6 5 W

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 11

Power Characteristics

Table 5 shows the estimated typical I/O power dissipation for MPC8347EA.

Table 5. MPC8347EA Typical I/O Power Dissipation

Interface Parameter

DDR2

GVDD

(1.8 V)

DDR1

GVDD

(2.5 V)

OVDD

(3.3 V)

LVDD

(3.3 V)

LVDD

(2.5 V) Unit Comments

DDR I/O

65% utilization

2.5 V

Rs = 20 Ω

Rt = 50 Ω

2 pair of clocks

200 MHz, 32 bits 0.31 0.42 — — — W —

200 MHz, 64 bits 0.42 0.55 — — — W —

266 MHz, 32 bits 0.35 0.5 — — — W —

266 MHz, 64 bits 0.47 0.66 — — — W —

300 MHz,1 32 bits

1TBGA package only.

0.37 0.54 — — — W —

300 MHz,1 64 bits 0.50 0.7 — — — W —

333 MHz,1 32 bits 0.39 0.58 — — — W —

333 MHz,1 64 bits 0.53 0.76 — — — W —

400 MHz,1 32 bits 0.44 — — — — —

400 MHz,1 64 bits 0.59 — — — — —

PCI I/O

load = 30 pF

33 MHz, 32 bits — — 0.04 — — W —

66 MHz, 32 bits — — 0.07 — — W —

Local bus I/O

load = 25 pF

167 MHz, 32 bits — — 0.34 — — W —

133 MHz, 32 bits — — 0.27 — — W —

83 MHz, 32 bits — — 0.17 — — W —

66 MHz, 32 bits — — 0.14 — — W —

50 MHz, 32 bits — — 0.11 — — W —

TSEC I/O

load = 25 pF

MII — — — 0.01 — W Multiply by number of

interfaces used.

GMII or TBI — — — 0.06 — W

RGMII or RTBI — — — — 0.04 W

USB 12 MHz — — 0.01 — — W Multiply by 2 if using

2 ports.

480 MHz — —0.2——W

Other I/O — — 0.01 — — W —

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

12 Freescale Semiconductor

Clock Input Timing

4 Clock Input Timing

This section provides the clock input DC and AC electrical character istics for the device.

4.1 DC Electrical Characteristics

Table 6 provides the clock input (CLKIN/PCI_SYNC_IN) DC timing specifications for the MPC8347EA.

4.2 AC Electrical Characteristics

The pr imary clock source for t he M PC8347EA can be one of two i nputs, CLKIN or P CI_CLK, depending

on whether the device is configured in PCI host or PCI agent mode. Table 7 provides the clock input

(CLKIN/PCI_CLK) AC timing specifications for the device.

Table 6. CLKIN DC Timing Specifications

Parameter Condition Symbol Min Max Unit

Input high voltage — VIH 2.7 OVDD +0.3 V

Input low voltage — VIL –0.3 0.4 V

CLKIN input current 0 V ≤VIN ≤OVDD IIN — ±10 μA

PCI_SYNC_IN input current 0 V ≤VIN ≤0.5 V or

OVDD –0.5V≤VIN ≤OVDD

IIN — ±10 μA

PCI_SYNC_IN input current 0.5 V ≤VIN ≤ OVDD – 0.5 V IIN — ±50 μA

Table 7. CLKIN AC Timing Specifications

Parameter/Condition Symbol Min Typical Max Unit Notes

CLKIN/PCI_CLK frequency fCLKIN ——66MHz1, 6

CLKIN/PCI_CLK cycle time tCLKIN 15 — — ns —

CLKIN/PCI_CLK rise and fall time tKH, tKL 0.6 1.0 2.3 ns 2

CLKIN/PCI_CLK duty cycle tKHK/tCLKIN 40 — 60 % 3

CLKIN/PCI_CLK jitter — — — ±150 ps 4, 5

Notes:

1. Caution: The system, core, USB, security, and TSEC must not exceed their respective maximum or minimum operating

frequencies.

2. Rise and fall times for CLKIN/PCI_CLK are measured at 0.4 and 2.7 V.

3. Timing is guaranteed by design and characterization.

4. This represents the total input jitter—short term and long term—and is guaranteed by design.

5. The CLKIN/PCI_CLK driver’s closed loop jitter bandwidth should be < 500 kHz at –20 dB. The bandwidth must be set low to

allow cascade-connected PLL-based devices to track CLKIN drivers with the specified jitter.

6. Spread spectrum clocking is allowed with 1% input frequency down-spread at maximum 50 KHz modulation rate regardless

of input frequency.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 13

RESET Initialization

4.3 TSEC Gigabit Reference Clock Timing

Table 8 provides the TSEC gigabit reference cloc ks (EC_GTX_CLK12 5) AC timing specif ications.

5 RESET Initialization

This section describes the DC and AC electrical specifications for the reset initialization timing and

electrical requirements of the MPC8347EA.

5.1 RESET DC Electrical Characteristics

Table 9 provides the DC electrical char acter istics for the R ESET pins of the MPC8347EA.

Table 8. EC_GTX_CLK125 AC Timing Specifications

At recommended operating conditions with LVDD = 2.5 ± 0.125 mV/ 3.3 V ± 165 mV

Parameter/Condition Symbol Min Typical Max Unit Notes

EC_GTX_CLK125 frequency tG125 — 125 — MHz —

EC_GTX_CLK125 cycle time tG125 —8—ns—

EC_GTX_CLK rise and fall time

LV DD = 2.5 V

LV DD = 3.3 V

tG125R/tG125F ——

0.75

1.0

ns 1

EC_GTX_CLK125 duty cycle

GMII, TBI

1000Base-T for RGMII, RTBI

tG125H/tG125

—

EC_GTX_CLK125 jitter — — — ±150 ps 2

Notes:

1. Rise and fall times for EC_GTX_CLK125 are measured from 0.5 and 2.0 V for LVDD = 2.5 V and from 0.6 and 2.7 V for

LVDD =3.3V.

2. EC_GTX_CLK125 is used to generate the GTX clock for the eTSEC transmitter with 2% degradation. The EC_GTX_CLK125

duty cycle can be loosened from 47%/53% as long as the PHY device can tolerate the duty cycle generated by the eTSEC

GTX_CLK. See Section 8.2.4, “RGMII and RTBI AC Timing Specifications for the duty cycle for 10Base-T and 100Base-T

reference clock.

Table 9. RESET Pins DC Electrical Characteristics1

Characteristic Symbol Condition Min Max Unit

Input high voltage VIH —2.0OV

DD +0.3 V

Input low voltage VIL — –0.3 0.8 V

Input current IIN ——±5μA

Output high voltage2VOH IOH = –8.0 mA 2.4 — V

Output low voltage VOL IOL = 8.0 mA — 0.5 V

Output low voltage VOL IOL = 3.2 mA — 0.4 V

Notes:

1. This table applies for pins PORESET

, HRESET, SRESET, and QUIESCE.

2. HRESET and SRESET are open drain pins, thus VOH is not relevant for those pins.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

14 Freescale Semiconductor

RESET Initialization

5.2 RESET AC Electrical Characteristics

Table 10 provid es the reset initialization AC timing specification s of t he MPC8347EA.

Table 11 lists the PLL and DLL lock times.

Table 10. RESET Initialization Timing Specifications

Parameter/Condition Min Max Unit Notes

Required assertion time of HRESET or SRESET (input) to activate reset flow 32 — tPCI_SYNC_IN 1

Required assertion time of PORESET with stable clock applied to CLKIN when the

MPC8347EA is in PCI host mode

32 — tCLKIN 2

Required assertion time of PORESET with stable clock applied to PCI_SYNC_IN

when the MPC8347EA is in PCI agent mode

32 — tPCI_SYNC_IN 1

HRESET/SRESET assertion (output) 512 — tPCI_SYNC_IN 1

HRESET negation to SRESET negation (output) 16 — tPCI_SYNC_IN 1

Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and

CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8347EA is

in PCI host mode

4—t

CLKIN 2

Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:2] and

CFG_CLKIN_DIV) with respect to negation of PORESET when the MPC8347EA is

in PCI agent mode

4—t

PCI_SYNC_IN 1

Input hold time for POR configuration signals with respect to negation of HRESET 0— ns—

Time for the MPC8347EA to turn off POR configuration signals with respect to the

assertion of HRESET

—4 ns 3

Time for the MPC8347EA to turn on POR configuration signals with respect to the

negation of HRESET

1—t

PCI_SYNC_IN 1, 3

Notes:

1. tPCI_SYNC_IN is the clock period of the input clock applied to PCI_SYNC_IN. In PCI host mode, the primary clock is applied

to the CLKIN input, and PCI_SYNC_IN period depends on the value of CFG_CLKIN_DIV. See the

MPC8349EA

PowerQUICC II Pro Integrated Host Processor Family Reference Manual

2. tCLKIN is the clock period of the input clock applied to CLKIN. It is valid only in PCI host mode. See the

MPC8349EA

PowerQUICC II Pro Integrated Host Processor Family Reference Manual

3. POR configuration signals consist of CFG_RESET_SOURCE[0:2] and CFG_CLKIN_DIV.

Table 11. PLL and DLL Lock Times

Parameter/Condition Min Max Unit Notes

PLL lock times — 100 μs—

DLL lock times 7680 122,880 csb_clk cycles 1, 2

Notes:

1. DLL lock times are a function of the ratio between the output clock and the coherency system bus clock (csb_clk). A 2:1 ratio

results in the minimum and an 8:1 ratio results in the maximum.

2. The csb_clk is determined by the CLKIN and system PLL ratio. See Section 19, “Clocking.”

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 15

DDR and DDR2 SDRAM

6 DDR and DDR2 SDRAM

This section describes the DC and AC electrical specifications for the DDR SDRAM interface of the

MPC8347EA. Note that DDR SDRAM is GVDD(typ) = 2.5 V and DDR2 SDRAM is GVDD(typ) = 1.8 V.

The AC electri cal specif i cat ions ar e the sa me for DDR and DRR2 SDRAM.

NOTE

The information in this document is accurate for revis ion 3.0 silicon and

later. For information on revision 1.1 silicon and earlier versions see the

MPC8347E PowerQUICC II Pro Integrated Host Processor Hardware

Specifications. See Section 22. 1, “Part Numbers Fully Addressed by This

Document,” for silicon re vision level determination.

6.1 DDR and DDR2 SDRAM DC Electrical Characteristics

Table 12 provid es the recommended operating conditions for the DDR2 SDRAM component(s) of the

MPC8347EA when GVDD(typ) = 1.8 V.

Table 12. DDR2 SDRAM DC Electrical Characteristics for GVDD(typ) = 1.8 V

Parameter/Condition Symbol Min Max Unit Notes

I/O supply voltage GVDD 1.71 1.89 V 1

I/O reference voltage MVREF 0.49 ×GVDD 0.51 ×GVDD V2

I/O termination voltage VTT MVREF –0.04 MV

REF +0.04 V 3

Input high voltage VIH MVREF +0.125 GV

DD +0.3 V —

Input low voltage VIL –0.3 MVREF –0.125 V —

Output leakage current IOZ –9.9 9.9 μA4

Output high current (VOUT = 1.420 V) IOH –13.4 — mA —

Output low current (VOUT = 0.280 V) IOL 13.4 — mA —

Notes:

1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.

2. MVREF is expected to equal 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak noise

on MVREF cannot exceed ±2% of the DC value.

3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to equal

MVREF

. This rail should track variations in the DC level of MVREF.

4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

16 Freescale Semiconductor

DDR and DDR2 SDRAM

Table 13 provides the DDR2 capacitance when GVDD(typ) = 1.8 V.

Table 14 provid es the recommended operating conditions for the DDR SDRAM component(s) when

GVDD(typ) = 2.5 V.

Table 15 provides the DDR capacitance when GVDD(typ) = 2.5 V.

Table 13. DDR2 SDRAM Capacitance for GVDD(typ) = 1.8 V

Parameter/Condition Symbol Min Max Unit Notes

Input/output capacitance: DQ, DQS, DQS CIO 68pF1

Delta input/output capacitance: DQ, DQS, DQS CDIO —0.5pF1

Note:

1. This parameter is sampled. GVDD = 1.8 V ± 0.090 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.

Table 14. DDR SDRAM DC Electrical Characteristics for GVDD(typ) = 2.5 V

Parameter/Condition Symbol Min Max Unit Notes

I/O supply voltage GVDD 2.375 2.625 V 1

I/O reference voltage MVREF 0.49 ×GVDD 0.51 ×GVDD V2

I/O termination voltage VTT MVREF –0.04 MV

REF +0.04 V 3

Input high voltage VIH MVREF +0.18 GV

DD +0.3 V —

Input low voltage VIL –0.3 MVREF –0.18 V —

Output leakage current IOZ –9.9 –9.9 μA4

Output high current (VOUT = 1.95 V) IOH –15.2 — mA —

Output low current (VOUT = 0.35 V) IOL 15.2 — mA —

Notes:

1. GVDD is expected to be within 50 mV of the DRAM GVDD at all times.

2. MVREF is expected to be equal to 0.5 × GVDD, and to track GVDD DC variations as measured at the receiver. Peak-to-peak

noise on MVREF may not exceed ±2% of the DC value.

3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be

equal to MVREF

. This rail should track variations in the DC level of MVREF.

4. Output leakage is measured with all outputs disabled, 0 V ≤ VOUT ≤ GVDD

Table 15. DDR SDRAM Capacitance for GVDD(typ) = 2.5 V

Parameter/Condition Symbol Min Max Unit Notes

Input/output capacitance: DQ, DQS CIO 68pF1

Delta input/output capacitance: DQ, DQS CDIO —0.5pF1

Note:

1. This parameter is sampled. GVDD = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = GVDD/2, VOUT (peak-to-peak) = 0.2 V.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 17

DDR and DDR2 SDRAM

Table 16 provides t he current draw charact er isti cs f or MV REF.

6.2 DDR and DDR2 SDRAM AC Electrical Characteristics

This section provides the AC electrical characteristics for the DDR and DDR2 SDRAM interface.

6.2.1 DDR and DDR2 SDRAM Input AC Timing Specifications

Table 17 provid es the input AC timing specifications for the DDR2 SDRAM when GVDD(typ) = 1.8 V.

Table 18 provid es the input AC timing specifications for the DDR SDRAM when GVDD(typ) = 2.5 V.

Table 19 provid es the input AC timing specifications for the DDR SDRAM interface.

Table 16. Current Draw Characteristics for MVREF

Parameter/Condition Symbol Min Max Unit Note

Current draw for MVREF IMVREF — 500 μA1

Note:

1. The voltage regulator for MVREF must supply up to 500 μA current.

Table 17. DDR2 SDRAM Input AC Timing Specifications for 1.8-V Interface

At recommended operating conditions with GVDD of 1.8 ± 5%.

Parameter Symbol Min Max Unit Notes

AC input low voltage VIL —MV

REF – 0.25 V —

AC input high voltage VIH MVREF + 0.25 — V —

Table 18. DDR SDRAM Input AC Timing Specifications for 2.5-V Interface

At recommended operating conditions with GVDD of 2.5 ± 5%.

Parameter Symbol Min Max Unit Notes

AC input low voltage VIL —MV

REF – 0.31 V —

AC input high voltage VIH MVREF + 0.31 — V —

Table 19. DDR and DDR2 SDRAM Input AC Timing Specifications

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter Symbol Min Max Unit Notes

Controller Skew for MDQS—MDQ/MECC/MDM tCISKEW ps 1, 2

400 MHz –600 600 3

333 MHz –750 750 —

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

18 Freescale Semiconductor

DDR and DDR2 SDRAM

Figure 4 illustrates the DDR input timing diagram showing the tDISKEW timing parameter.

Figure 4. DDR Input Timing Diagram

6.2.2 DDR and DDR2 SDRAM Output AC Timing Specifications

Table 20 shows the DDR and DDR2 output AC timing spec ifications.

266 MHz –750 750 —

200 MHz –750 750 —

Notes:

1. tCISKEW represents the total amount of skew consumed by the controller between MDQS[n] and any corresponding bit that

will be captured with MDQS[n]. This should be subtracted from the total timing budget.

2. The amount of skew that can be tolerated from MDQS to a corrresponding MDQ signal is called tDISKEW. This can be

determined by the equation: tDISKEW = ± (T/4 – abs (tCISKEW)); where T is the clock period and abs (tCISKEW) is the absolute

value of tCISKEW.

3. This specification applies only to the DDR interface.

Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter Symbol 1Min Max Unit Notes

MCK[n] cycle time, (MCK[n]/MCK[n] crossing) (PBGA

package)

tMCK 5—ns2

MCK[n] cycle time, (MCK[n]/MCK[n] crossing) (TBGA

package)

tMCK 7.5 — ns 2

ADDR/CMD/MODT output setup with respect to MCK tDDKHAS ns 3

400 MHz 1.95 —

Table 19. DDR and DDR2 SDRAM Input AC Timing Specifications (continued)

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter Symbol Min Max Unit Notes

MCK[n]

MCK[n] tMCK

MDQ[x]

MDQS[n]

tDISKEW

D1D0

tDISKEW

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 19

DDR and DDR2 SDRAM

333 MHz 2.40 —

266 MHz 3.15 —

200 MHz 4.20 —

ADDR/CMD/MODT output hold with respect to MCK tDDKHAX ns 3

400 MHz 1.95 —

333 MHz 2.40 —

266 MHz 3.15 —

200 MHz 4.20 —

MCS(n) output setup with respect to MCK tDDKHCS ns 3

400 MHz 1.95 —

333 MHz 2.40 —

266 MHz 3.15 —

200 MHz 4.20 —

MCS(n) output hold with respect to MCK tDDKHCX ns 3

400 MHz 1.95 —

333 MHz 2.40 —

266 MHz 3.15 —

200 MHz 4.20 —

MCK to MDQS Skew tDDKHMH –0.6 0.6 ns 4

MDQ/MECC/MDM output setup with respect to

MDQS

tDDKHDS,

tDDKLDS

ps 5

400 MHz 700 —

333 MHz 775 —

266 MHz 1100 —

200 MHz 1200 —

MDQ/MECC/MDM output hold with respect to MDQS tDDKHDX,

tDDKLDX

ps 5

400 MHz 700 —

333 MHz 900 —

266 MHz 1100 —

200 MHz 1200 —

MDQS preamble start tDDKHMP –0.5 × tMCK – 0.6 –0.5 × tMCK + 0.6 ns 6

Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued)

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter Symbol 1Min Max Unit Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

20 Freescale Semiconductor

DDR and DDR2 SDRAM

Figure 5 shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (tDDKHMH).

Figure 5. Timing Diagram for tDDKHMH

MDQS epilogue end tDDKHME –0.6 0.6 ns 6

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. Output hold time can be read as DDR timing (DD) from

the rising or falling edge of the reference clock (KH or KL) until the output goes invalid (AX or DX). For example, tDDKHAS

symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes from the high (H) state until outputs (A) are

set up (S) or output valid time. Also, tDDKLDX symbolizes DDR timing (DD) for the time tMCK memory clock reference (K) goes

low (L) until data outputs (D) are invalid (X) or data output hold time.

2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.

3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the

ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by

1/2 applied cycle.

4. tDDKHMH follows the symbol conventions described in note 1. For example, tDDKHMH describes the DDR timing (DD) from the

rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). tDDKHMH can be modified through control of the

DQSS override bits in the TIMING_CFG_2 registerand is typically set to the same delay as the clock adjust in the CLK_CNTL

register. The timing parameters listed in the table assume that these two parameters are set to the same adjustment value.

See the

MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual

for the timing modifications

enabled by use of these bits.

5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC

(MECC), or data mask (MDM). The data strobe should be centered inside the data eye at the pins of the microprocessor.

6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that tDDKHMP follows the

symbol conventions described in note 1.

Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued)

At recommended operating conditions with GVDD of (1.8 or 2.5 V) ± 5%.

Parameter Symbol 1Min Max Unit Notes

MDQS

MCK[n]

tMCK

MDQS

tDDKHMH(min) = –0.6 ns

tDDKHMHmax) = 0.6 ns

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 21

DUART

Figure 6 shows the DDR SDRAM output timing diagram.

Figure 6. DDR SDRAM Output Timing Diagram

Figure 7 provides the AC test load for the DDR bus.

Figure 7. DDR AC Test Load

7DUART

This section describes the DC and AC electrical specifications for the DUART inte rface of the

MPC8347EA.

7.1 DUART DC Electrical Characteristics

Table 21 provid es the DC electrical characteristics for the DUART interface of the MPC8347EA.

Table 21. DUART DC Electrical Characteristics

Parameter Symbol Min Max Unit

High-level input voltage VIH 2OV

DD + 0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current (0.8 V ≤ VIN ≤ 2 V) IIN —±5 μA

ADDR/CMD/MODT

tDDKHMH

tDDKLDS

tDDKHDS

MDQ[x]

MDQS[n]

MCK[n]

MCK[n] tMCK

tDDKLDX

tDDKHDX

D1D0

tDDKHAX,tDDKHCX

Write A0 NOOP

tDDKHMP

tDDKHAS,tDDKHCS

tDDKHME

Output Z0 = 50 Ω

RL = 50 Ω

GVDD/2

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

22 Freescale Semiconductor

Ethernet: Three-Speed Ethernet, MII Management

7.2 DUART AC Electrical Specifications

Table 22 provid es the AC timing parameters for the DUAR T interface of the MPC8347EA.

8 Ethernet: Three-Speed Ethernet, MII Management

This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and

MII management.

8.1 Three-Speed Ethernet Controller

(TSEC)—GMII/MII/TBI/RGMII/RTBI Electrical Characteristics

The electrical characteristics specified here apply to gigabit media independent interface (GMII),the media

independent interface (MII), ten-bit interface (TBI), reduced gigabit media inde pendent

inter face (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output

(MDIO) and management data clock (MDC). The MII, GMII , and TBI interfa ces are defined for 3.3 V,

and the RGMII and RTBI interfaces are defined for 2.5 V. The RGMII and RTBI interfaces follow the

Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device Specification,

Version 1.2a (9/22/2000) . The electrical char acteristics for MDIO and MDC are specified in Section 8.3,

“Etherne t Management Interface Electrical Char acter istics .”

High-level output voltage, IOH = –100 μAV

OH OVDD – 0.2 — V

Low-level output voltage, IOL = 100 μAV

OL —0.2V

Table 22. DUART AC Timing Specifications

Parameter Value Unit Notes

Minimum baud rate 256 baud —

Maximum baud rate > 1,000,000 baud 1

Oversample rate 16 — 2

Notes:

1. Actual attainable baud rate will be limited by the latency of interrupt processing.

2. The middle of a start bit is detected as the 8th sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are

sampled each 16th sample.

Table 21. DUART DC Electrical Characteristics (continued)

Parameter Symbol Min Max Unit

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 23

Ethernet: Three-Speed Ethernet, MII Management

8.1.1 TSEC DC Electrical Characteristics

GMII, MII, T BI, RGM II, and RTBI drive rs and receivers comply with the DC parametric attributes

specified in Table 23 and Table 24. The RGMII and R TBI signals in Table 24 are based on a 2.5-V CMOS

interface voltage as defined by JEDEC EIA/JESD8-5.

8.2 GMII, MII, TBI, RGMII, and RTBI AC Timing Specifications

The AC timing spe cifications for GMII, MII, TBI, RGMII, and RTBI are presented in this section.

8.2.1 GMII Timing Specifications

This section describes the GMII transmit and receive AC timing specif ications.

Table 23. GMII/TBI and MII DC Electrical Characteristics

Parameter Symbol Conditions Min Max Unit

Supply voltage 3.3 V LVDD2 — 2.97 3.63 V

Output high voltage VOH IOH = –4.0 mA LVDD = Min 2.40 LVDD +0.3 V

Output low voltage VOL IOL = 4.0 mA LVDD = Min GND 0.50 V

Input high voltage VIH ——2.0LV

DD +0.3 V

Input low voltage VIL — — –0.3 0.90 V

Input high current IIH VIN1 = LVDD —40μA

Input low current IIL VIN1 = GND –600 — μA

Notes:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply.

Table 24. RGMII/RTBI (When Operating at 2.5 V) DC Electrical Characteristics

Parameters Symbol Conditions Min Max Unit

Supply voltage 2.5 V LVDD — 2.37 2.63 V

Output high voltage VOH IOH = –1.0 mA LVDD = Min 2.00 LVDD +0.3 V

Output low voltage VOL IOL = 1.0 mA LVDD = Min GND – 0.3 0.40 V

Input high voltage VIH —LV

DD = Min 1.7 LVDD +0.3 V

Input low voltage VIL —LV

DD = Min –0.3 0.70 V

Input high current IIH VIN1 = LVDD —10μA

Input low current IIL VIN1 = GND –15 — μA

Note:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

24 Freescale Semiconductor

Ethernet: Three-Speed Ethernet, MII Management

8.2.1.1 GMII Transmit AC Timing Specifications

Table 25 provides the GMII transmit AC timing specifications.

Figure 8 shows the GMII transmit AC timing diagram.

Figure 8. GMII Transmit AC Timing Diagram

Table 25. GMII Transmit AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

GTX_CLK clock period tGTX —8.0 — ns

GTX_CLK duty cycle tGTXH/tGTX 43.75 — 56.25 %

GTX_CLK to GMII data TXD[7:0], TX_ER, TX_EN delay tGTKHDX 0.5 — 5.0 ns

GTX_CLK clock rise time (20%–80%) tGTXR ——1.0ns

GTX_CLK clock fall time (80%–20%) tGTXF ——1.0ns

GTX_CLK125 clock period tG1252—8.0 — ns

GTX_CLK125 reference clock duty cycle measured at LVDD/2 tG125H/tG125 45 — 55 %

Notes:

1. The symbols for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and

t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing (GT)

with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching the

valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock

reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. In general,

the clock reference symbol is based on three letters representing the clock of a particular function. For example, the subscript

of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate

letter: R (rise) or F (fall).

2. This symbol represents the external GTX_CLK125 signal and does not follow the original symbol naming convention.

GTX_CLK

TXD[7:0]

GTKHDX

GTX

GTXH

GTXR

GTXF

TX_EN

TX_ER

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 25

Ethernet: Three-Speed Ethernet, MII Management

8.2.1.2 GMII Receive AC Timing Specifications

Table 26 provides the GMII receive AC timing specifications.

Figure 9 shows the GMII receive AC timing diagram.

Figure 9. GMII Receive AC Timing Diagram

Table 26. GMII Receive AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

RX_CLK clock period tGRX —8.0—ns

RX_CLK duty cycle tGRXH/tGRX 40 — 60 %

RXD[7:0], RX_DV, RX_ER setup time to RX_CLK tGRDVKH 2.0 — — ns

RXD[7:0], RX_DV, RX_ER hold time to RX_CLK tGRDXKH 0.5 — — ns

RX_CLK clock rise (20%–80%) tGRXR ——1.0ns

RX_CLK clock fall time (80%–20%) tGRXF ——1.0ns

Note:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing

(GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going

to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input

signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. In general, the clock

reference symbol is based on three letters representing the clock of a particular function. For example, the subscript of tGRX

represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:

R (rise) or F (fall).

RX_CLK

RXD[7:0]

tGRDXKH

tGRX

tGRXH

tGRXR

tGRXF

tGRDVKH

RX_DV

RX_ER

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

26 Freescale Semiconductor

Ethernet: Three-Speed Ethernet, MII Management

8.2.2 MII AC Timing Specifications

This section describes the MII transm it and recei ve AC timing specificati ons.

8.2.2.1 MII Transmit AC Timing Specifications

Table 27 provide s the MII transmit AC timing specifications.

Figure 10 shows the MII transmit AC timing diagra m.

Figure 10. MII Transmit AC Timing Diagram

Table 27. MII Transmit AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

TX_CLK clock period 10 Mbps tMTX —400—ns

TX_CLK clock period 100 Mbps tMTX —40—ns

TX_CLK duty cycle tMTXH/tMTX 35 — 65 %

TX_CLK to MII data TXD[3:0], TX_ER, TX_EN delay tMTKHDX 1 5 15 ns

TX_CLK data clock rise (20%–80%) tMTXR 1.0 — 4.0 ns

TX_CLK data clock fall (80%–20%) tMTXF 1.0 — 4.0 ns

Note:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing

(MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). In general, the clock reference

symbol is based on two to three letters representing the clock of a particular function. For example, the subscript of tMTX

represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter:

R (rise) or F (fall).

TX_CLK

TXD[3:0]

tMTKHDX

tMTX

tMTXH

tMTXR

tMTXF

TX_EN

TX_ER

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 27

Ethernet: Three-Speed Ethernet, MII Management

8.2.2.2 MII Receive AC Timing Specifications

Table 28 provides the MII re cei ve AC timing specificati ons.

Figure 11 provides the AC test load for TSEC.

Figure 11. TSEC AC Test Load

Figure 12 shows the MII rec eiv e AC timing diagram.

Figure 12. MII Receive AC Timing Diagram

Table 28. MII Receive AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

RX_CLK clock period 10 Mbps tMRX —400— ns

RX_CLK clock period 100 Mbps tMRX —40—ns

RX_CLK duty cycle tMRXH/tMRX 35 — 65 %

RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns

RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns

RX_CLK clock rise (20%–80%) tMRXR 1.0—4.0ns

RX_CLK clock fall time (80%–20%) tMRXF 1.0—4.0ns

Note:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing

(MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to

the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals

(D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. In general, the clock

reference symbol is based on three letters representing the clock of a particular functionl. For example, the subscript of tMRX

represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter:

R (rise) or F (fall).

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

RX_CLK

RXD[3:0]

tMRDXKH

tMRX

tMRXH

tMRXR

tMRXF

RX_DV

RX_ER tMRDVKH

Valid Data

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28 Freescale Semiconductor

Ethernet: Three-Speed Ethernet, MII Management

8.2.3 TBI AC Timing Specifications

This section describes the TBI transmit and receive AC timing specifications.

8.2.3.1 TBI Transmit AC Timing Specifications

Table 29 provides the TBI transmit AC timing specifications.

Figure 13 shows the TBI trans mit AC timing diagram.

Figure 13. TBI Transmit AC Timing Diagram

Table 29. TBI Transmit AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

GTX_CLK clock period tTTX —8.0—ns

GTX_CLK duty cycle tTTXH/tTTX 40 — 60 %

GTX_CLK to TBI data TXD[7:0], TX_ER, TX_EN delay tTTKHDX 1.0 — 5.0 ns

GTX_CLK clock rise (20%–80%) tTTXR ——1.0ns

GTX_CLK clock fall time (80%–20%) tTTXF ——1.0ns

GTX_CLK125 reference clock period tG1252—8.0—ns

GTX_CLK125 reference clock duty cycle tG125H/tG125 45 — 55 ns

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTTKHDV symbolizes the TBI transmit

timing (TT) with respect to the time from tTTX (K) going high (H) until the referenced data signals (D) reach the valid state (V)

or setup time. Also, tTTKHDX symbolizes the TBI transmit timing (TT) with respect to the time from tTTX (K) going high (H) until

the referenced data signals (D) reach the invalid state (X) or hold time. In general, the clock reference symbol is based on

three letters representing the clock of a particular function. For example, the subscript of tTTX represents the TBI (T) transmit

(TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall).

2. This symbol represents the external GTX_CLK125 and does not follow the original symbol naming convention

GTX_CLK

TXD[7:0]

tTTX

tTTXH

tTTXR

tTTXF

tTTKHDX

TX_EN

TX_ER

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 29

Ethernet: Three-Speed Ethernet, MII Management

8.2.3.2 TBI Receive AC Timing Specifications

Table 30 provides the TBI receive AC timing spe cifications.

Figure 14 shows the TBI receive AC timing diagram.

Figure 14. TBI Receive AC Timing Diagram

Table 30. TBI Receive AC Timing Specifications

At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.

Parameter/Condition Symbol1Min Typ Max Unit

PMA_RX_CLK clock period tTRX 16.0 ns

PMA_RX_CLK skew tSKTRX 7.5 — 8.5 ns

RX_CLK duty cycle tTRXH/tTRX 40 — 60 %

RXD[7:0], RX_DV, RX_ER (RCG[9:0]) setup time to rising

PMA_RX_CLK tTRDVKH22.5 — — ns

RXD[7:0], RX_DV, RX_ER (RCG[9:0]) hold time to rising

PMA_RX_CLK

tTRDXKH21.5 — — ns

RX_CLK clock rise time (20%–80%) tTRXR 0.7 — 2.4 ns

RX_CLK clock fall time (80%–20%) tTRXF 0.7 — 2.4 ns

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tTRDVKH symbolizes TBI receive timing

(TR) with respect to the time data input signals (D) reach the valid state (V) relative to the tTRX clock reference (K) going to

the high (H) state or setup time. Also, tTRDXKH symbolizes TBI receive timing (TR) with respect to the time data input signals

(D) went invalid (X) relative to the tTRX clock reference (K) going to the high (H) state. In general, the clock reference symbol

is based on three letters representing the clock of a particular function. For example, the subscript of tTRX represents the TBI

(T) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). For

symbols representing skews, the subscript SK followed by the clock that is being skewed (TRX).

2. Setup and hold time of even numbered RCG are measured from the riding edge of PMA_RX_CLK1. Setup and hold times

of odd-numbered RCG are measured from the riding edge of PMA_RX_CLK0.

PMA_RX_CLK1

RCG[9:0]

tTRX

tTRXH

tTRXR

tTRXF

tTRDVKH

PMA_RX_CLK0

tTRDXKH

tTRDVKH

tTRDXKH

tTRXH

Even RCG Odd RCG

tSKTRX

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Ethernet: Three-Speed Ethernet, MII Management

8.2.4 RGMII and RTBI AC Timing Specifications

Table 31 pre s ents the RGMII and RTBI AC timing specifications .

Table 31. RGMII and RTBI AC Timing Specifications

At recommended operating conditions with LVDD of 2.5 V ± 5%.

Parameter/Condition Symbol1Min Typ Max Unit

Data to clock output skew (at transmitter) tSKRGT –0.5 — 0.5 ns

Data to clock input skew (at receiver)2tSKRGT 1.0 — 2.8 ns

Clock cycle duration3tRGT 7.2 8.0 8.8 ns

Duty cycle for 1000Base-T4, 5 tRGTH/tRGT 45 50 55 %

Duty cycle for 10BASE-T and 100BASE-TX3, 5 tRGTH/tRGT 40 50 60 %

Rise time (20%–80%) tRGTR — — 0.75 ns

Fall time (80%–20%) tRGTF — — 0.75 ns

GTX_CLK125 reference clock period tG126—8.0—ns

GTX_CLK125 reference clock duty cycle tG125H/tG125 47 — 53 %

Notes:

1. In general, the clock reference symbol for this section is based on the symbols RGT to represent RGMII and RTBI timing. For

example, the subscript of tRGT represents the TBI (T) receive (RX) clock. Also, the notation for rise (R) and fall (F) times

follows the clock symbol. For symbols representing skews, the subscript is SK followed by the clock being skewed (RGT).

2. This implies that PC board design requires clocks to be routed so that an additional trace delay of greater than 1.5 ns is added

to the associated clock signal.

3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.

4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet clock domains as long

as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned.

5. Duty cycle reference is LVDD/2.

6. This symbol represents the external GTX_CLK125 and does not follow the original symbol naming convention.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 31

Ethernet: Three-Speed Ethernet, MII Management

Figure 15 shows the RBMII and RTBI AC timing and multiplexing diagrams.

Figure 15. RGMII and RTBI AC Timing and Multiplexing Diagrams

8.3 Ethernet Management Interface Electrical Characteristics

The electrical char acter i stics specified here apply to the MII manageme nt inter fac e signals management

data input/output (MDIO) and manageme nt data clock (MDC) . The electri cal ch aract eris ti cs for GMII,

RGMII, TBI and RTBI are specif ied in Sectio n 8.1, “Three- Speed Ether net Controller

(TSEC)—G MII/MII/TBI/R G MII/RTBI Ele c t rical Char acte ristics .”

8.3.1 MII Management DC Electrical Characteristics

The MDC and MDIO are defined to operate at a supply voltage of 2.5 or 3.3 V. The DC electrical

characteristics for MDIO and MDC are provided in Table 32 and Table 33.

Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V

Parameter Symbol Conditions Min Max Unit

Supply voltage (2.5 V) LVDD — 2.37 2.63 V

Output high voltage VOH IOH = –1.0 mA LVDD = Min 2.00 LVDD +0.3 V

Output low voltage VOL IOL = 1.0 mA LVDD = Min GND – 0.3 0.40 V

Input high voltage VIH —LV

DD = Min 1.7 — V

Input low voltage VIL —LV

DD = Min –0.3 0.70 V

GTX_CLK

tRGT

tRGTH

tSKRGT

TX_CTL

TXD[8:5]

TXD[7:4]

TXD[9]

TXERR

TXD[4]

TXEN

TXD[3:0]

(At Transmitter)

TXD[8:5][3:0]

TXD[7:4][3:0]

TX_CLK

(At PHY)

RX_CTL

RXD[8:5]

RXD[7:4]

RXD[9]

RXERR

RXD[4]

RXDV

RXD[3:0]

RXD[8:5][3:0]

RXD[7:4][3:0]

RX_CLK

(At PHY)

tSKRGT

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Ethernet: Three-Speed Ethernet, MII Management

8.3.2 MII Management AC Electrical Specifications

Table 34 provides the MII ma nagement AC timing specifi cations.

Input high current IIH VIN1 = LVDD —10μA

Input low current IIL VIN = LVDD –15 — μA

Note:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

Table 33. MII Management DC Electrical Characteristics Powered at 3.3 V

Parameter Symbol Conditions Min Max Unit

Supply voltage (3.3 V) LVDD —2.973.63V

Output high voltage VOH IOH = –1.0 mA LVDD = Min 2.10 LVDD +0.3 V

Output low voltage VOL IOL = 1.0 mA LVDD = Min GND 0.50 V

Input high voltage VIH —2.00—V

Input low voltage VIL — — 0.80 V

Input high current IIH LVDD = Max VIN1 = 2.1 V — 40 μA

Input low current IIL LVDD = Max VIN = 0.5 V –600 — μA

Note:

1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.

Table 34. MII Management AC Timing Specifications

At recommended operating conditions with LVDD is 3.3 V ± 10% or 2.5 V ± 5%.

Parameter/Condition Symbol1Min Typ Max Unit Notes

MDC frequency fMDC —2.5—MHz2

MDC period tMDC —400—ns—

MDC clock pulse width high tMDCH 32 — — ns —

MDC to MDIO delay tMDKHDX 10 — 170 ns 3

MDIO to MDC setup time tMDDVKH 5——ns—

MDIO to MDC hold time tMDDXKH 0——ns—

MDC rise time tMDCR — — 10 ns —

Table 32. MII Management DC Electrical Characteristics Powered at 2.5 V (continued)

Parameter Symbol Conditions Min Max Unit

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 33

Ethernet: Three-Speed Ethernet, MII Management

Figure 16 shows the MII management AC timing diagram.

Figure 16. MII Management Interface Timing Diagram

MDC fall time tMDHF — — 10 ns —

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMDKHDX symbolizes management data

timing (MD) for the time tMDC from clock reference (K) high (H) until data outputs (D) are invalid (X) or data hold time. Also,

tMDDVKH symbolizes management data timing (MD) with respect to the time data input signals (D) reach the valid state (V)

relative to the tMDC clock reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention

is used with the appropriate letter: R (rise) or F (fall).

2. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the maximum frequency is 8.3 MHz

and the minimum frequency is 1.2 MHz; for a csb_clk of 375 MHz, the maximum frequency is 11.7 MHz and the minimum

frequency is 1.7 MHz).

3. This parameter is dependent on the csb_clk speed (that is, for a csb_clk of 267 MHz, the delay is 70 ns and for a csb_clk of

333 MHz, the delay is 58 ns).

Table 34. MII Management AC Timing Specifications (continued)

At recommended operating conditions with LVDD is 3.3 V ± 10% or 2.5 V ± 5%.

Parameter/Condition Symbol1Min Typ Max Unit Notes

MDC

tMDDXKH

tMDC

tMDCH

tMDCR

tMDCF

tMDDVKH

tMDKHDX

MDIO

(Input)

(Output)

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34 Freescale Semiconductor

USB

9USB

This section provides the AC and DC electrical specifications for the USB interface of the MPC8347EA.

9.1 USB DC Electrical Characteristics

Table 35 provides the DC electrical characteristics for the USB interface.

9.2 USB AC Electrical Specifications

Table 36 descr ibes the general timing parameters of the USB interface of the MPC8347EA.

Table 35. USB DC Electrical Characteristics

Parameter Symbol Min Max Unit

High-level input voltage VIH 2OV

DD +0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current IIN —±5 μA

High-level output voltage, IOH = –100 μAV

OH OVDD –0.2 — V

Low-level output voltage, IOL = 100 μAV

OL —0.2V

Table 36. USB General Timing Parameters (ULPI Mode Only)

Parameter Symbol1Min Max Unit Notes

USB clock cycle time tUSCK 15 — ns 2–5

Input setup to USB clock—all inputs tUSIVKH 4—ns2–5

Input hold to USB clock—all inputs tUSIXKH 1—ns2–5

USB clock to output valid—all outputs tUSKHOV —7ns2–5

Output hold from USB clock—all outputs tUSKHOX 2—ns2–5

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tUSIXKH symbolizes USB timing (US) for

the input (I) to go invalid (X) with respect to the time the USB clock reference (K) goes high (H). Also, tUSKHOX symbolizes

USB timing (US) for the USB clock reference (K) to go high (H), with respect to the output (O) going invalid (X) or output hold

time.

2. All timings are in reference to USB clock.

3. All signals are measured from OVDD/2 of the rising edge of the USB clock to 0.4 ×OVDD of the signal in question for 3.3 V

signaling levels.

4. Input timings are measured at the pin.

5. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the

component pin is less than or equal to that of the leakage current specification.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 35

Local Bus

Figure 17 and Figure 18 provide the AC test load and signals for the U SB, respectively.

Figure 17. USB AC Test Load

Figure 18. USB Signals

10 Local Bus

This section descr ibes t he DC and AC electrical speci f icat ions for the local bus interf ace of the

MPC8347EA.

10.1 Local Bus DC Electrical Characteristics

Table 37 provides the DC electrical characteristics for the local bus interface.

Table 37. Local Bus DC Electrical Characteristics

Parameter Symbol Min Max Unit

High-level input voltage VIH 2OV

DD +0.3 V

Low-level input voltage VIL –0.3 0.8 V

Input current IIN —±5μA

High-level output voltage, IOH = –100 μAV

OH OVDD –0.2 — V

Low-level output voltage, IOL = 100 μAV

OL —0.2V

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

Output Signals:

tUSKHOV

USB0_CLK/USB1_CLK/DR_CLK

Input Signals

tUSIXKH

tUSIVKH

tUSKHOX

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36 Freescale Semiconductor

Local Bus

10.2 Local Bus AC Electrical Specification

Table 38 and Table 39 describe the general timing paramete rs of the l ocal bus interfa ce of the

MPC8347EA.

Table 38. Local Bus General Timing Parameters—DLL On

Parameter Symbol1Min Max Unit Notes

Local bus cycle time tLBK 7.5 — ns 2

Input setup to local bus clock (except LUPWAIT) tLBIVKH1 1.5 — ns 3, 4

LUPWAIT input setup to local bus clock tLBIVKH2 2.2 — ns 3, 4

Input hold from local bus clock (except LUPWAIT) tLBIXKH1 1.0 — ns 3, 4

LUPWAIT Input hold from local bus clock tLBIXKH2 1.0 — ns 3, 4

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT1 1.5 — ns 5

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT2 3—ns6

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT3 2.5 — ns 7

Local bus clock to LALE rise tLBKHLR —4.5ns—

Local bus clock to output valid (except LAD/LDP and LALE) tLBKHOV1 —4.5ns—

Local bus clock to data valid for LAD/LDP tLBKHOV2 —4.5ns3

Local bus clock to address valid for LAD tLBKHOV3 —4.5ns3

Output hold from local bus clock (except LAD/LDP and LALE) tLBKHOX1 1—ns3

Output hold from local bus clock for LAD/LDP tLBKHOX2 1—ns3

Local bus clock to output high impedance for LAD/LDP tLBKHOZ —3.8ns8

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB)

for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one

(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output

(O) going invalid (X) or output hold time.

2. All timings are in reference to the rising edge of LSYNC_IN.

3. All signals are measured from OVDD/2 of the rising edge of LSYNC_IN to 0.4 ×OVDD of the signal in question for 3.3 V

signaling levels.

4. Input timings are measured at the pin.

5. tLBOTOT1 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than

the load on the LAD output pins.

6. tLBOTOT2 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the

load on the LAD output pins.

7. tLBOTOT3 should be used when RCWH[LALE] is set and when the load on the LALE output pin equals the load on the LAD

output pins.

8. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the

component pin is less than or equal to that of the leakage current specification.

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Freescale Semiconductor 37

Local Bus

Figure 19 provides the AC test load for the local bus.

Figure 19. Local Bus C Test Load

Table 39. Local Bus General Timing Parameters—DLL Bypass9

Parameter Symbol1Min Max Unit Notes

Local bus cycle time tLBK 15 — ns 2

Input setup to local bus clock tLBIVKH 7—ns3, 4

Input hold from local bus clock tLBIXKH 1.0 — ns 3, 4

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT1 1.5 — ns 5

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT2 3—ns6

LALE output fall to LAD output transition (LATCH hold time) tLBOTOT3 2.5 — ns 7

Local bus clock to output valid tLBKLOV —3ns3

Local bus clock to output high impedance for LAD/LDP tLBKHOZ —4ns8

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tLBIXKH1 symbolizes local bus timing (LB)

for the input (I) to go invalid (X) with respect to the time the tLBK clock reference (K) goes high (H), in this case for clock one

(1). Also, tLBKHOX symbolizes local bus timing (LB) for the tLBK clock reference (K) to go high (H), with respect to the output

(O) going invalid (X) or output hold time.

2. All timings are in reference to the falling edge of LCLK0 (for all outputs and for LGTA and LUPWAIT inputs) or the rising edge

of LCLK0 (for all other inputs).

3. All signals are measured from OVDD/2 of the rising/falling edge of LCLK0 to 0.4 ×OVDD of the signal in question for 3.3 V

signaling levels.

4. Input timings are measured at the pin.

5. tLBOTOT1 should be used when RCWH[LALE] is set and when the load on the LALE output pin is at least 10 pF less than the

load on the LAD output pins.

6. tLBOTOT2 should be used when RCWH[LALE] is not set and when the load on the LALE output pin is at least 10 pF less than

the load on the LAD output pins.the

7. tLBOTOT3 should be used when RCWH[LALE] is not set and when the load on the LALE output pin equals to the load on the

LAD output pins.

8. For purposes of active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered

through the component pin is less than or equal to the leakage current specification.

9. DLL bypass mode is not recommended for use at frequencies above 66 MHz.

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

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38 Freescale Semiconductor

Local Bus

Figure 20 through Figure 25 show the local bus signals.

Figure 20. Local Bus Signals, Nonspecial Signals Only (DLL Enabled)

Figure 21. Local Bus Signals, Nonspecial Signals Only (DLL Bypass Mode)

Output Signals:

LA[27:31]/LBCTL/LBCKE/LOE

LSDA10/LSDWE/LSDRAS/

LSDCAS/LSDDQM[0:3]

tLBKHOV

LSYNC_IN

Input Signals:

LAD[0:31]/LDP[0:3]

Output (Data) Signals:

LAD[0:31]/LDP[0:3]

Output (Address) Signal:

LAD[0:31]

LALE

tLBIXKH

tLBIVKH

tLBIXKH

tLBKHOX

tLBKHOZ

tLBKHLR

tLBOTOT

tLBKHOZ

tLBKHOX

Output Signals:

LSDA10/LSDWE/LSDRAS/

LSDCAS/LSDDQM[0:3]

LCLK[n]

Input Signals:

LAD[0:31]/LDP[0:3]

Output Signals:

LAD[0:31]/LDP[0:3]

LALE

Input Signal:

LGTA

tLBIXKH

tLBKLOV

tLBKHOZ

tLBOTOT

tLBIVKH

tLBIXKH

tLBKLOV

tLBIVKH

LA[27:31]/LBCTL/LBCKE/LOE

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 39

Local Bus

Figure 22. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Enabled)

Figure 23. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 2 (DLL Bypass Mode)

LSYNC_IN

UPM Mode Input Signal:

LUPWAIT

tLBIXKH2

tLBIVKH2

tLBIVKH1

tLBIXKH1

tLBKHOZ1

Input Signals:

LAD[0:31]/LDP[0:3]

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKHOV1

tLBKHOZ1

LCLK

UPM Mode Input Signal:

LUPWAIT

tLBIXKH

tLBIVKH

tLBIXKH

tLBKHOZ

Input Signals:

LAD[0:31]/LDP[0:3]

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKLOV

tLBKHOZ

(DLL Bypass Mode)

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40 Freescale Semiconductor

Local Bus

Figure 24. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Bypass Mode)

LCLK

UPM Mode Input Signal:

LUPWAIT

tLBIXKH

tLBIVKH

tLBIXKH

tLBKHOZ

UPM Mode Output Signals:

LCS[0:7]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:7]/LWE

tLBKLOV

tLBKHOZ

Input Signals:

LAD[0:31]/LDP[0:3]

(DLL Bypass Mode)

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Freescale Semiconductor 41

JTAG

Figure 25. Local Bus Signals, GPCM/UPM Signals for LCCR[CLKDIV] = 4 (DLL Enabled)

11 JTAG

This section describes the DC and AC electrical specifications for the IEEE Std. 1 149.1 (JTAG) interface

of the MPC8347EA.

11.1 JTAG DC Electrical Characteristics

Table 40 provid es the DC electrical characteristics for the IEEE Std. 1 149.1 (JTAG) interface of the

MPC8347EA.

Table 40. JTAG Interface DC Electrical Characteristics

Characteristic Symbol Condition Min Max Unit

Input high voltage VIH —OV

DD –0.3 OV

DD +0.3 V

Input low voltage VIL — –0.3 0.8 V

Input current IIN ——±5μA

Output high voltage VOH IOH = –8.0 mA 2.4 — V

LSYNC_IN

UPM Mode Input Signal:

LUPWAIT

tLBIXKH2

tLBIVKH2

tLBIVKH1

tLBIXKH1

tLBKHOZ1

Input Signals:

LAD[0:31]/LDP[0:3]

UPM Mode Output Signals:

LCS[0:3]/LBS[0:3]/LGPL[0:5]

GPCM Mode Output Signals:

LCS[0:3]/LWE

tLBKHOV1

tLBKHOZ1

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

42 Freescale Semiconductor

JTAG

11.2 JTAG AC Timing Specifications

This section describes the AC electrical specifications for the IEEE Std. 1 149. 1 (JTAG) interface of the

MPC8347EA. Table 41 provides the JTAG AC timing specifications as defined in Figure 27 through

Figure 30.

Output low voltage VOL IOL = 8.0 mA — 0.5 V

Output low voltage VOL IOL = 3.2 mA — 0.4 V

Table 41. JTAG AC Timing Specifications (Independent of CLKIN)1

At recommended operating conditions (see Ta bl e 2 ).

Parameter Symbol2Min Max Unit Notes

JTAG external clock frequency of operation fJTG 033.3MHz—

JTAG external clock cycle time t JTG 30 — ns —

JTAG external clock pulse width measured at 1.4 V tJTKHKL 15 — ns —

JTAG external clock rise and fall times tJTGR, tJTGF 02ns—

TRST assert time tTRST 25 — ns 3

Input setup times:

Boundary-scan data

TMS, TDI

tJTDVKH

tJTIVKH

—

Input hold times:

Boundary-scan data

TMS, TDI

tJTDXKH

tJTIXKH

—

Valid times:

Boundary-scan data

TDO

tJTKLDV

tJTKLOV

Output hold times:

Boundary-scan data

TDO

tJTKLDX

tJTKLOX

—

Table 40. JTAG Interface DC Electrical Characteristics (continued)

Characteristic Symbol Condition Min Max Unit

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 43

JTAG

Figure 26 provides the AC test load for TDO and the boundary-scan outputs of the MPC8347EA.

Figure 26. AC Test Load for the JTAG Interface

Figure 27 provides the JTAG clock input timing diagram.

Figure 27. JTAG Clock Input Timing Diagram

Figure 28 provides the TRST timing diag ram.

Figure 28. TRST Timing Diagram

JTAG external clock to output high impedance:

Boundary-scan data

TDO

tJTKLDZ

tJTKLOZ

5, 6

Notes:

1. All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question.

The output timings are measured at the pins. All output timings assume a purely resistive 50 Ω load (see Figure 17).

Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing

(JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going

to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D)

went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. In general, the clock reference symbol is

based on three letters representing the clock of a particular function. For rise and fall times, the latter convention is used with

the appropriate letter: R (rise) or F (fall).

3. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.

4. Non-JTAG signal input timing with respect to tTCLK.

5. Non-JTAG signal output timing with respect to tTCLK.

6. Guaranteed by design and characterization.

Table 41. JTAG AC Timing Specifications (Independent of CLKIN)1 (continued)

At recommended operating conditions (see Ta bl e 2 ).

Parameter Symbol2Min Max Unit Notes

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

JTAG

tJTKHKL tJTGR

External Clock VMVMVM

tJTG tJTGF

VM = Midpoint Voltage (OVDD/2)

TRST

VM = Midpoint Voltage (OVDD/2)

VM VM

tTRST

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

44 Freescale Semiconductor

JTAG

Figure 29 provides the boundary-scan timing diagram.

Figure 29. Boundary-Scan Timing Diagram

Figure 30 provide s the test access port timing diagram.

Figure 30. Test Access Port Timing Diagram

VM = Midpoint Voltage (OVDD/2)

VM VM

tJTDVKH

tJTDXKH

Boundary

Data Outputs

Boundary

Data Outputs

JTAG

External Clock

Boundary

Data Inputs

Output Data Valid

tJTKLDX

tJTKLDZ

tJTKLDV

Input

Data Valid

Output Data Valid

VM = Midpoint Voltage (OVDD/2)

VM VM

tJTIVKH

tJTIXKH

JTAG

External Clock

Output Data Valid

tJTKLOX

tJTKLOZ

tJTKLOV

Input

Data Valid

Output Data Valid

TDI, TMS

TDO

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 45

I2C

12 I2C

This section describes the DC and AC electrical ch aracteristics for the I2C interface of the MP C8347EA.

12.1 I2C DC Electrical Characteristics

Table 42 provides the DC electrical characteristics for the I2C interface of the MPC8347EA.

12.2 I2C AC Electrical Specifications

Table 43 pr ovides the AC timing parameters for the I2C interface of the MPC8347EA. Note that all values

refer to V IH(min) and V IL(max) leve ls (s e e Table 42).

Table 42. I2C DC Electrical Characteristics

At recommended operating conditions with OVDD of 3.3 V ± 10%.

Parameter Symbol Min Max Unit Notes

Input high voltage level VIH 0.7 ×OVDD OVDD +0.3 V

Input low voltage level VIL –0.3 0.3 ×OVDD V

Low level output voltage VOL 00.2×OVDD V1

Output fall time from VIH(min) to VIL(max) with a bus

capacitance from 10 to 400 pF

tI2KLKV 20 + 0.1 ×CB250 ns 2

Pulse width of spikes which must be suppressed by the

input filter

tI2KHKL 050ns3

Input current each I/O pin (input voltage is between

0.1 ×OVDD and 0.9 ×OVDD(max)

II–10 10 μA4

Capacitance for each I/O pin CI—10pF

Notes:

1. Output voltage (open drain or open collector) condition = 3 mA sink current.

2. CB = capacitance of one bus line in pF.

3. Refer to the

MPC8349EA Integrated Host Processor Family Reference Manual,

for information on the digital filter used.

4. I/O pins obstruct the SDA and SCL lines if OVDD is switched off.

Table 43. I2C AC Electrical Specifications

Parameter Symbol1Min Max Unit

SCL clock frequency fI2C 0400kHz

Low period of the SCL clock tI2CL 1.3 — μs

High period of the SCL clock tI2CH 0.6 — μs

Setup time for a repeated START condition tI2SVKH 0.6 — μs

Hold time (repeated) START condition (after this period, the first clock

pulse is generated)

tI2SXKL 0.6 — μs

Data setup time tI2DVKH 100 — ns

Data hold time:CBUS compatible masters

I2C bus devices

tI2DXKL —

—

0.93

μs

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

46 Freescale Semiconductor

I2C

Figure 31 provides the AC test load for the I2C.

Figure 31. I2C AC Test Load

Figure 32 shows the AC timing diagram for the I2C bus.

Figure 32. I2C Bus AC Timing Diagram

Fall time of both SDA and SCL signals5tI2CF __ 300 ns

Setup time for STOP condition tI2PVKH 0.6 — μs

Bus free time between a STOP and START condition tI2KHDX 1.3 — μs

Noise margin at the LOW level for each connected device (including

hysteresis)

VNL 0.1 ×OVDD —V

Noise margin at the HIGH level for each connected device (including

hysteresis)

VNH 0.2 ×OVDD —V

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tI2DVKH symbolizes I2C timing (I2) with

respect to the time data input signals (D) reach the valid state (V) relative to the tI2C clock reference (K) going to the high (H)

state or setup time. Also, tI2SXKL symbolizes I2C timing (I2) for the time that the data with respect to the start condition (S)

goes invalid (X) relative to the tI2C clock reference (K) going to the low (L) state or hold time. Also, tI2PVKH symbolizes I2C

timing (I2) for the time that the data with respect to the stop condition (P) reaches the valid state (V) relative to the tI2C clock

reference (K) going to the high (H) state or setup time. For rise and fall times, the latter convention is used with the appropriate

letter: R (rise) or F (fall).

2. The device provides a hold time of at least 300 ns for the SDA signal (referred to the VIH(min) of the SCL signal) to bridge

the undefined region of the falling edge of SCL.

3. The maximum tI2DVKH must be met only if the device does not stretch the LOW period (tI2CL) of the SCL signal.

4. CB = capacitance of one bus line in pF.

5.)The device does not follow the “I2C-BUS Specifications” version 2.1 regarding the tI2CF AC parameter.

Table 43. I2C AC Electrical Specifications (continued)

Parameter Symbol1Min Max Unit

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

SrS

SDA

SCL

tI2CF

tI2SXKL

tI2CL

tI2CH

tI2DXKL

tI2DVKH

tI2SXKL

tI2SVKH

tI2KHKL

tI2PVKH

tI2CR

tI2CF

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 47

PCI

13 PCI

This section describes the DC and AC electrical specifications for the PCI bus of the MPC8347EA.

13.1 PCI DC Electrical Characteristics

Table 44 provid es the DC electrical characteristics for the PC I interface of the MPC8347EA.

13.2 PCI AC Electrical Specifications

This section describes the general AC ti ming parameters of the P CI bus of the MPC8347EA. Note that the

PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the device is

configured as a host or agent device. Table 45 prov ides the PCI AC timing specifi cations at 66 MHz.

Table 44. PCI DC Electrical Characteristics

Parameter Symbol Test Condition Min Max Unit

High-level input voltage VIH VOUT ≥VOH (min) or 2 OVDD +0.3 V

Low-level input voltage VIL VOUT ≤VOL (max) –0.3 0.8 V

Input current IIN VIN1= 0 V or VIN = OVDD —±5 μA

High-level output voltage VOH OVDD = min,

IOH = –100 μA

OVDD –0.2 — V

Low-level output voltage VOL OVDD = min,

IOL = 100 μA

—0.2V

Note:

1. The symbol VIN, in this case, represents the OVIN symbol referenced in Ta b le 1 .

Table 45. PCI AC Timing Specifications at 66 MHz1

Parameter Symbol2Min Max Unit Notes

Clock to output valid tPCKHOV —6.0ns3

Output hold from clock tPCKHOX 1—ns3

Clock to output high impedance tPCKHOZ —14ns3, 4

Input setup to clock tPCIVKH 3.0 — ns 3, 5

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48 Freescale Semiconductor

PCI

Table 46 provides the PCI AC timing specific ations at 33 MHz.

Figure 33 provides the AC test load for PCI.

Figure 33. PCI AC Test Load

Input hold from clock tPCIXKH 0—ns3, 5

Notes:

1. PCI timing depends on M66EN and the ratio between PCI1/PCI2. Refer to the PCI chapter of the reference manual for a

description of M66EN.

2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with

respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going

to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went

high (H) relative to the frame signal (F) going to the valid (V) state.

3. See the timing measurement conditions in the

PCI 2.3 Local Bus Specifications

4. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the

component pin is less than or equal to the leakage current specification.

5. Input timings are measured at the pin.

Table 46. PCI AC Timing Specifications at 33 MHz

Parameter Symbol1Min Max Unit Notes

Clock to output valid tPCKHOV —11ns2

Output hold from clock tPCKHOX 2—ns2

Clock to output high impedance tPCKHOZ —14ns2, 3

Input setup to clock tPCIVKH 3.0 — ns 2, 4

Input hold from clock tPCIXKH 0—ns2, 4

Notes:

1. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tPCIVKH symbolizes PCI timing (PC) with

respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, tSYS, reference (K) going

to the high (H) state or setup time. Also, tPCRHFV symbolizes PCI timing (PC) with respect to the time hard reset (R) went

high (H) relative to the frame signal (F) going to the valid (V) state.

2. See the timing measurement conditions in the

PCI 2.3 Local Bus Specifications

3. For active/float timing measurements, the Hi-Z or off-state is defined to be when the total current delivered through the

component pin is less than or equal to the leakage current specification.

4. Input timings are measured at the pin.

Table 45. PCI AC Timing Specifications at 66 MHz1 (continued)

Parameter Symbol2Min Max Unit Notes

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 49

Timers

Figure 34 shows the PCI input AC timing diagram.

Figure 34. PCI Input AC Timing Diagram

Figure 35 shows the PCI output AC timing diagram.

Figure 35. PCI Output AC Timing Diagram

14 Timers

This section describes the DC and AC electrica l specific a tions for the timers.

14.1 Timer DC Electrical Characteristics

Table 47 provides the DC electrical characteristics for the MPC8347EA timer pins, including TIN, TOUT,

TGATE, and RTC_CLK.

Table 47. Timer DC Electrical Characteristics

Characteristic Symbol Condition Min Max Unit

Input high voltage VIH —2.0OV

DD +0.3 V

Input low voltage VIL — –0.3 0.8 V

Input current IIN ——±5μA

Output high voltage VOH IOH = –8.0 mA 2.4 — V

Output low voltage VOL IOL = 8.0 mA — 0.5 V

Output low voltage VOL IOL = 3.2 mA — 0.4 V

tPCIVKH

CLK

Input

tPCIXKH

CLK

Output Delay

tPCKHOV

High-Impedance

tPCKHOZ

Output

tPCKHOX

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

50 Freescale Semiconductor

GPIO

14.2 Timer AC Timing Specifications

Table 48 provid es the timer input and output AC timing specifications.

15 GPIO

This section describes the DC and AC electrical specifications for the GPIO.

15.1 GPIO DC Electrical Characteristics

Table 49 provid es the DC electrical characteristics for the MPC8347EA GPIO.

15.2 GPIO AC Timing Specifications

Table 50 provid es the GPIO input and output AC timing specifications.

Table 48. Timers Input AC Timing Specifications1

Characteristic Symbol2Min Unit

Timers inputs—minimum pulse width tTIWID 20 ns

Notes:

1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN.

Timings are measured at the pin.

2. Timer inputs and outputs are asynchronous to any visible clock. Timer outputs should be synchronized before use by external

synchronous logic. Timer inputs are required to be valid for at least tTIWID ns to ensure proper operation.

Table 49. GPIO DC Electrical Characteristics

Characteristic Symbol Condition Min Max Unit

Input high voltage VIH —2.0OV

DD +0.3 V

Input low voltage VIL — –0.3 0.8 V

Input current IIN ——±5μA

Output high voltage VOH IOH = –8.0 mA 2.4 — V

Output low voltage VOL IOL = 8.0 mA — 0.5 V

Output low voltage VOL IOL = 3.2 mA — 0.4 V

Table 50. GPIO Input AC Timing Specifications1

Characteristic Symbol2Min Unit

GPIO inputs—minimum pulse width tPIWID 20 ns

Notes:

1. Input specifications are measured from the 50 percent level of the signal to the 50 percent level of the rising edge of CLKIN.

Timings are measured at the pin.

2. GPIO inputs and outputs are asynchronous to any visible clock. GPIO outputs should be synchronized before use by external

synchronous logic. GPIO inputs must be valid for at least tPIWID ns to ensure proper operation.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 51

IPIC

16 IPIC

This section describes the DC and AC electrical specifications for the external interrupt pins.

16.1 IPIC DC Electrical Characteristics

Table 51 provides the DC electrical characteristics for the external interrupt pins.

16.2 IPIC AC Timing Specifications

Table 52 provid es the IPIC input and output AC timing specifications.

17 SPI

This section describes the SPI DC and AC electrical specific ations.

17.1 SPI DC Electrical Characteristics

Table 53 provide s th e SPI DC electr ical chara ct er ist ics.

Table 51. IPIC DC Electrical Characteristics1

Characteristic Symbol Condition Min Max Unit Notes

Input high voltage VIH —2.0OV

DD +0.3 V —

Input low voltage VIL — –0.3 0.8 V —

Input current IIN ——±5μA—

Output low voltage VOL IOL = 8.0 mA — 0.5 V 2

Output low voltage VOL IOL = 3.2 mA — 0.4 V 2

Notes:

1. This table applies for pins IRQ[0:7], IRQ_OUT, and MCP_OUT.

2. IRQ_OUT and MCP_OUT are open-drain pins; thus VOH is not relevant for those pins.

Table 52. IPIC Input AC Timing Specifications1

Characteristic Symbol2Min Unit

IPIC inputs—minimum pulse width tPICWID 20 ns

Notes:

1. Input specifications are measured at the 50 percent level of the IPIC input signals. Timings are measured at the pin.

2. IPIC inputs and outputs are asynchronous to any visible clock. IPIC outputs should be synchronized before use by external

synchronous logic. IPIC inputs must be valid for at least tPICWID ns to ensure proper operation in edge triggered mode.

Table 53. SPI DC Electrical Characteristics

Characteristic Symbol Condition Min Max Unit

Input high voltage VIH —2.0OV

DD +0.3 V

Input low voltage VIL — –0.3 0.8 V

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52 Freescale Semiconductor

SPI

17.2 SPI AC Timing Specifications

Table 54 provides the SPI input and output AC timing specifica tions.

Figure 36 provides the AC test load for the SPI.

Figure 36. SPI AC Test Load

Input current IIN ——±5μA

Output high voltage VOH IOH = –8.0 mA 2.4 — V

Output low voltage VOL IOL = 8.0 mA — 0.5 V

Output low voltage VOL IOL = 3.2 mA — 0.4 V

Table 54. SPI AC Timing Specifications1

Characteristic Symbol2Min Max Unit

SPI outputs valid—Master mode (internal clock) delay tNIKHOV —6ns

SPI outputs hold—Master mode (internal clock) delay tNIKHOX 0.5 — ns

SPI outputs valid—Slave mode (external clock) delay tNEKHOV —8ns

SPI outputs hold—Slave mode (external clock) delay tNEKHOX 2—ns

SPI inputs—Master mode (internal clock input setup time tNIIVKH 4—ns

SPI inputs—Master mode (internal clock input hold time tNIIXKH 0—ns

SPI inputs—Slave mode (external clock) input setup time tNEIVKH 4—ns

SPI inputs—Slave mode (external clock) input hold time tNEIXKH 2—ns

Notes:

1. Output specifications are measured from the 50 percent level of the rising edge of CLKIN to the 50 percent level of the signal.

Timings are measured at the pin.

2. The symbols for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs

and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tNIKHOX symbolizes the internal timing

(NI) for the time SPICLK clock reference (K) goes to the high state (H) until outputs (O) are invalid (X).

Table 53. SPI DC Electrical Characteristics (continued)

Characteristic Symbol Condition Min Max Unit

Output Z0 = 50 ΩOVDD/2

RL = 50 Ω

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 53

Package and Pin Listings

Figure 37 and Figure 38 represe nt the AC timings from Table 54. Note that although the specifications

generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge

is the active edge.

Figure 37 shows the SPI timings in slave mode (external clock).

Figure 37. SPI AC Timing in Slave Mode (External Clock) Diagram

Figure 38 shows the SPI timings in master mode (internal clock).

Figure 38. SPI AC Timing in Master Mode (Internal Clock) Diagram

18 Package and Pin Listings

This s ection details package par ameters, pin assignments , and dimensions. The MPC8347EA is available

in two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See Section 18.1,

“Package Parameters for the MPC8347EA TBGA,,” Section 18.2, “Mechanical Dimensions for the

MPC8347EA TBGA,Section 18.3, “Package Parameters for the MPC8347EA PBGA ,” and Section 18.4,

“Mechanical Dimensions for the MPC8347EA PBGA. ”

18.1 Package Parameters for the MPC8347EA TBGA

The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape

ball grid array (TBGA).

Package outline 35 mm × 35 mm

Interconnects 672

SPICLK (Input)

tNEIXKH

tNEIVKH

tNEKHOX

Input Signals:

SPIMOSI

(See Note)

Output Signals:

SPIMISO

(See Note)

Note: The clock edge is selectable on SPI.

SPICLK (Output)

tNIIXKH

tNIKHOX

Input Signals:

SPIMISO

(See Note)

Output Signals:

SPIMOSI

(See Note)

Note: The clock edge is selectable on SPI.

tNIIVKH

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

54 Freescale Semiconductor

Package and Pin Listings

Pitch 1.00 mm

Module height (typical) 1.46 mm

Solder balls 62 Sn/36 Pb/2 Ag (ZU package)

96.5 Sn/3.5Ag (VV package)

Ball dia meter (typical) 0.64 mm

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 55

Package and Pin Listings

18.2 Mechanical Dimensions for the MPC8347EA TBGA

Figure 39 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,

672-TBGA package.

Figure 39. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA TBGA

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Parallelism measurement must exclude any effect of mark on top surface of package.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

56 Freescale Semiconductor

Package and Pin Listings

18.3 Package Parameters for the MPC8347EA PBGA

The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,

620 plas tic ball grid array (PB GA).

Package outline 29 mm × 29 mm

Interconnects 620

Pitch 1.00 mm

Module height (maximum) 2.46 mm

Module height (typical) 2.23 mm

Module height (minimum) 2.00 mm

Solder balls 62 Sn/36 Pb/2 Ag (ZQ package)

96.5 Sn/3.5Ag (VR package)

Ball dia meter (typical) 0.60 mm

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 57

Package and Pin Listings

18.4 Mechanical Dimensions for the MPC8347EA PBGA

Figure 40 shows the mechanical dimensions and bottom surface nomenclature for the MPC8347EA,

620-PBGA package.

Notes:

1. All dimensions are in millimeters.

2. Dimensioning and tolerancing per ASME Y14. 5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

Figure 40. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8347EA PBGA

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

58 Freescale Semiconductor

Package and Pin Listings

18.5 Pinout Listings

Table 55 provid es the pinout listing for the MPC8347EA, 672 TBGA package.

Table 55. MPC8347EA (TBGA) Pinout Listing

Signal Package Pin Number Pin Type Power

Supply Notes

PCI

PCI_INTA/IRQ_OUT B34 O OVDD 2

PCI_RESET_OUT C33 O OVDD —

PCI_AD[31:0] G30, G32, G34, H31, H32, H33, H34,

J29, J32, J33, L30, K31, K33, K34,

L33, L34, P34, R29, R30, R33, R34,

T31, T32, T33, U31, U34, V31, V32,

V33, V34, W33, W34

I/O OVDD —

PCI_C/BE[3:0] J30, M31, P33, T34 I/O OVDD —

PCI_PAR P32 I/O OVDD —

PCI_FRAME M32 I/O OVDD 5

PCI_TRDY N29 I/O OVDD 5

PCI_IRDY M34 I/O OVDD 5

PCI_STOP N31 I/O OVDD 5

PCI_DEVSEL N30 I/O OVDD 5

PCI_IDSEL J31 I OVDD —

PCI_SERR N34 I/O OVDD 5

PCI_PERR N33 I/O OVDD 5

PCI_REQ[0] D32 I/O OVDD —

PCI_REQ[1]/CPCI1_HS_ES D34 I OVDD —

PCI_REQ[2:4] E34, F32, G29 I OVDD —

PCI_GNT0 C34 I/O OVDD —

PCI_GNT1/CPCI1_HS_LED D33 O OVDD —

PCI_GNT2/CPCI1_HS_ENUM E33 O OVDD —

PCI_GNT[3:4] F31, F33 O OVDD —

M66EN A19 I OVDD —

DDR SDRAM Memory Interface

MDQ[0:63] D5, A3, C3, D3, C4, B3, C2, D4, D2,

E5, G2, H6, E4, F3, G4, G3, H1, J2,

L6, M6, H2, K6, L2, M4, N2, P4, R2,

T4, P6, P3, R1, T2, AB5, AA3, AD6,

AE4, AB4, AC2, AD3, AE6, AE3, AG4,

AK5, AK4, AE2, AG6, AK3, AK2, AL2,

AL1, AM5, AP5, AM2, AN1, AP4, AN5,

AJ7, AN7, AM8, AJ9, AP6, AL7, AL9,

AN8

I/O GVDD —

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 59

Package and Pin Listings

MECC[0:4]/MSRCID[0:4] W4, W3, Y3, AA6, T1 I/O GVDD —

MECC[5]/MDVAL U1 I/O GVDD —

MECC[6:7] Y1, Y6 I/O GVDD —

MDM[0:8] B1, F1, K1, R4, AD4, AJ1, AP3, AP7,

OGV

DD —

MDQS[0:8] B2, F5, J1, P2, AC1, AJ2, AN4, AL8,

I/O GVDD —

MBA[0:1] AD1, AA5 O GVDD —

MA[0:14] W1, U4, T3, R3, P1, M1, N1, L3, L1,

K2, Y2, K3, J3, AP2, AN6

OGV

DD —

MWE AF1 O GVDD —

MRAS AF4 O GVDD —

MCAS AG3 O GVDD —

MCS[0:3] AG2, AG1, AK1, AL4 O GVDD —

MCKE[0:1] H3, G1 O GVDD 3

MCK[0:5] U2, F4, AM3, V3, F2, AN3 O GVDD —

MCK[0:5] U3, E3, AN2, V4, E1, AM4 O GVDD —

MODT[0:3] AH3, AJ5, AH1, AJ4 O GVDD —

MBA[2] H4 O GVDD —

MDIC0 AB1 I/O — 10

MDIC1 AA1 I/O — 10

Local Bus Controller Interface

LAD[0:31] AM13, AP13, AL14, AM14, AN14,

AP14, AK15, AJ15, AM15, AN15,

AP15, AM16, AL16, AN16, AP16,

AL17, AM17, AP17, AK17, AP18,

AL18, AM18, AN18, AP19, AN19,

AM19, AP20, AK19, AN20, AL20,

AP21, AN21

I/O OVDD —

LDP[0]/CKSTOP_OUT AM21 I/O OVDD —

LDP[1]/CKSTOP_IN AP22 I/O OVDD —

LDP[2]/LCS[4] AN22 I/O OVDD —

LDP[3]/LCS[5] AM22 I/O OVDD —

LA[27:31] AK21, AP23, AN23, AP24, AK22 O OVDD —

LCS[0:3] AN24, AL23, AP25, AN25 O OVDD —

LWE[0:3]/LSDDQM[0:3]/LBS[0:3] AK23, AP26, AL24, AM25 O OVDD —

LBCTL AN26 O OVDD —

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

60 Freescale Semiconductor

Package and Pin Listings

LALE AK24 O OVDD —

LGPL0/LSDA10/cfg_reset_source0 AP27 I/O OVDD —

LGPL1/LSDWE/cfg_reset_source1 AL25 I/O OVDD —

LGPL2/LSDRAS/LOE AJ24 O OVDD —

LGPL3/LSDCAS/cfg_reset_source2 AN27 I/O OVDD —

LGPL4/LGTA/LUPWAIT/LPBSE AP28 I/O OVDD —

LGPL5/cfg_clkin_div AL26 I/O OVDD —

LCKE AM27 O OVDD —

LCLK[0:2] AN28, AK26, AP29 O OVDD —

LSYNC_OUT AM12 O OVDD —

LSYNC_IN AJ10 I OVDD —

General Purpose I/O Timers

GPIO1[0]/DMA_DREQ0/GTM1_TIN1/

GTM2_TIN2

F24 I/O OVDD —

GPIO1[1]/DMA_DACK0/GTM1_TGATE1/

GTM2_TGATE2

E24 I/O OVDD —

GPIO1[2]/DMA_DDONE0/GTM1_TOUT1 B25 I/O OVDD —

GPIO1[3]/DMA_DREQ1/GTM1_TIN2/

GTM2_TIN1

D24 I/O OVDD —

GPIO1[4]/DMA_DACK1/GTM1_TGATE2/

GTM2_TGATE1

A25 I/O OVDD —

GPIO1[5]/DMA_DDONE1/GTM1_TOUT2/

GTM2_TOUT1

B24 I/O OVDD —

GPIO1[6]/DMA_DREQ2/GTM1_TIN3/

GTM2_TIN4

A24 I/O OVDD —

GPIO1[7]/DMA_DACK2/GTM1_TGATE3/

GTM2_TGATE4

D23 I/O OVDD —

GPIO1[8]/DMA_DDONE2/GTM1_TOUT3 B23 I/O OVDD —

GPIO1[9]/DMA_DREQ3/GTM1_TIN4/

GTM2_TIN3

A23 I/O OVDD —

GPIO1[10]/DMA_DACK3/GTM1_TGATE4/

GTM2_TGATE3

F22 I/O OVDD —

GPIO1[11]/DMA_DDONE3/GTM1_TOUT4/

GTM2_TOUT3

E22 I/O OVDD —

USB Port 1

MPH1_D0_ENABLEN/DR_D0_ENABLEN A26 I/O OVDD —

MPH1_D1_SER_TXD/DR_D1_SER_TXD B26 I/O OVDD —

MPH1_D2_VMO_SE0/DR_D2_VMO_SE0 D25 I/O OVDD —

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 61

Package and Pin Listings

MPH1_D3_SPEED/DR_D3_SPEED A27 I/O OVDD —

MPH1_D4_DP/DR_D4_DP B27 I/O OVDD —

MPH1_D5_DM/DR_D5_DM C27 I/O OVDD —

MPH1_D6_SER_RCV/DR_D6_SER_RCV D26 I/O OVDD —

MPH1_D7_DRVVBUS/DR_D7_DRVVBUS E26 I/O OVDD —

MPH1_NXT/DR_SESS_VLD_NXT D27 I OVDD —

MPH1_DIR_DPPULLUP/

DR_XCVR_SEL_DPPULLUP

A28 I/O OVDD —

MPH1_STP_SUSPEND/

DR_STP_SUSPEND

F26 O OVDD —

MPH1_PWRFAULT/

DR_RX_ERROR_PWRFAULT

E27 I OVDD —

MPH1_PCTL0/DR_TX_VALID_PCTL0 A29 O OVDD —

MPH1_PCTL1/DR_TX_VALIDH_PCTL1 D28 O OVDD —

MPH1_CLK/DR_CLK B29 I OVDD —

USB Port 0

MPH0_D0_ENABLEN/DR_D8_CHGVBUS C29 I/O OVDD —

MPH0_D1_SER_TXD/DR_D9_DCHGVBUS A30 I/O OVDD —

MPH0_D2_VMO_SE0/DR_D10_DPPD E28 I/O OVDD —

MPH0_D3_SPEED/DR_D11_DMMD B30 I/O OVDD —

MPH0_D4_DP/DR_D12_VBUS_VLD C30 I/O OVDD —

MPH0_D5_DM/DR_D13_SESS_END A31 I/O OVDD —

MPH0_D6_SER_RCV/DR_D14 B31 I/O OVDD —

MPH0_D7_DRVVBUS/DR_D15_IDPULLUP C31 I/O OVDD —

MPH0_NXT/DR_RX_ACTIVE_ID B32 I OVDD —

MPH0_DIR_DPPULLUP/DR_RESET A32 I/O OVDD —

MPH0_STP_SUSPEND/DR_TX_READY A33 I/O OVDD —

MPH0_PWRFAULT/DR_RX_VALIDH C32 I OVDD —

MPH0_PCTL0/DR_LINE_STATE0 D31 I/O OVDD —

MPH0_PCTL1/DR_LINE_STATE1 E30 I/O OVDD —

MPH0_CLK/DR_RX_VALID B33 I OVDD —

Programmable Interrupt Controller

MCP_OUT AN33 O OVDD 2

IRQ0/MCP_IN/GPIO2[12] C19 I/O OVDD —

IRQ[1:5]/GPIO2[13:17] C22, A22, D21, C21, B21 I/O OVDD —

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

62 Freescale Semiconductor

Package and Pin Listings

IRQ[6]/GPIO2[18]/CKSTOP_OUT A21 I/O OVDD —

IRQ[7]/GPIO2[19]/CKSTOP_IN C20 I/O OVDD —

Ethernet Management Interface

EC_MDC A7 O LVDD1 —

EC_MDIO E9 I/O LVDD1 2

Gigabit Reference Clock

EC_GTX_CLK125 C8 I LVDD1 —

Three-Speed Ethernet Controller (Gigabit Ethernet 1)

TSEC1_COL/GPIO2[20] A17 I/O OVDD —

TSEC1_CRS/GPIO2[21] F12 I/O LVDD1 —

TSEC1_GTX_CLK D10 O LVDD1 3

TSEC1_RX_CLK A11 I LVDD1 —

TSEC1_RX_DV B11 I LVDD1 —

TSEC1_RX_ER/GPIO2[26] B17 I/O OVDD —

TSEC1_RXD[7:4]/GPIO2[22:25] B16, D16, E16, F16 I/O OVDD —

TSEC1_RXD[3:0] E10, A8, F10, B8 I LVDD1 —

TSEC1_TX_CLK D17 I OVDD —

TSEC1_TXD[7:4]/GPIO2[27:30] A15, B15, A14, B14 I/O OVDD —

TSEC1_TXD[3:0] A10, E11, B10, A9 O LVDD1 11

TSEC1_TX_EN B9 O LVDD1 —

TSEC1_TX_ER/GPIO2[31] A16 I/O OVDD —

Three-Speed Ethernet Controller (Gigabit Ethernet 2)

TSEC2_COL/GPIO1[21] C14 I/O OVDD —

TSEC2_CRS/GPIO1[22] D6 I/O LVDD2 —

TSEC2_GTX_CLK A4 O LVDD2 —

TSEC2_RX_CLK B4 I LVDD2 —

TSEC2_RX_DV/GPIO1[23] E6 I/O LVDD2 —

TSEC2_RXD[7:4]/GPIO1[26:29] A13, B13, C13, A12 I/O OVDD —

TSEC2_RXD[3:0]/GPIO1[13:16] D7, A6, E8, B7 I/O LVDD2 —

TSEC2_RX_ER/GPIO1[25] D14 I/O OVDD —

TSEC2_TXD[7]/GPIO1[31] B12 I/O OVDD —

TSEC2_TXD[6]/DR_XCVR_TERM_SEL C12 O OVDD —

TSEC2_TXD[5]/DR_UTMI_OPMODE1 D12 O OVDD —

TSEC2_TXD[4]/DR_UTMI_OPMODE0 E12 O OVDD —

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 63

Package and Pin Listings

TSEC2_TXD[3:0]/GPIO1[17:20] B5, A5, F8, B6 I/O LVDD2 —

TSEC2_TX_ER/GPIO1[24] F14 I/O OVDD —

TSEC2_TX_EN/GPIO1[12] C5 I/O LVDD2 3

TSEC2_TX_CLK/GPIO1[30] E14 I/O OVDD —

DUART

UART_SOUT[1:2]/MSRCID[0:1]/LSRCID[0:1] AK27, AN29 O OVDD —

UART_SIN[1:2]/MSRCID[2:3]/LSRCID[2:3] AL28, AM29 I/O OVDD —

UART_CTS[1]/MSRCID4/LSRCID4 AP30 I/O OVDD —

UART_CTS[2]/MDVAL/ LDVAL AN30 I/O OVDD —

UART_RTS[1:2] AP31, AM30 O OVDD —

I2C interface

IIC1_SDA AK29 I/O OVDD 2

IIC1_SCL AP32 I/O OVDD 2

IIC2_SDA AN31 I/O OVDD 2

IIC2_SCL AM31 I/O OVDD 2

SPI

SPIMOSI/LCS[6] AN32 I/O OVDD —

SPIMISO/LCS[7] AP33 I/O OVDD —

SPICLK AK30 I/O OVDD —

SPISEL AL31 I OVDD —

Clocks

PCI_CLK_OUT[0:2] AN9, AP9, AM10 O OVDD —

PCI_CLK_OUT[3]/LCS[6] AN10 O OVDD —

PCI_CLK_OUT[4]/LCS[7] AJ11 O OVDD —

PCI_SYNC_IN/PCI_CLOCK AK12 I OVDD —

PCI_SYNC_OUT AP11 O OVDD 3

RTC/PIT_CLOCK AM32 I OVDD —

CLKIN AM9 I OVDD —

JTAG

TCK E20 I OVDD —

TDI F20 I OVDD 4

TDO B20 O OVDD 3

TMS A20 I OVDD 4

TRST B19 I OVDD 4

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

64 Freescale Semiconductor

Package and Pin Listings

Test

TEST D22 I OVDD 6

TEST_SEL AL13 I OVDD 7

PMC

QUIESCE A18 O OVDD —

System Control

PORESET C18 I OVDD —

HRESET B18 I/O OVDD 1

SRESET D18 I/O OVDD 2

Thermal Management

THERM0 K32 I — 9

Power and Ground Signals

AVDD1 L31 Power for e300

PLL (1.2 V)

nominal, 1.3 V

for 667 MHz)

AVDD1—

AVDD2 AP12 Power for

system PLL

(1.2 V)

nominal, 1.3 V

for 667 MHz)

AVDD2—

AVDD3 AE1 Power for DDR

DLL (1.2 V)

nominal, 1.3 V

for 667 MHz)

——

AVDD4 AJ13 Power for LBIU

DLL (1.2 V)

nominal, 1.3 V

for 667 MHz)

AVDD4—

GND A1, A34, C1, C7, C10, C11, C15, C23,

C25, C28, D1, D8, D20, D30, E7, E13,

E15, E17, E18, E21, E23, E25, E32,

F6, F19, F27, F30, F34, G31, H5, J4,

J34, K30, L5, M2, M5, M30, M33, N3,

N5, P30, R5, R32, T5, T30, U6, U29,

U33, V2, V5, V30, W6, W30, Y30,

AA2, AA30, AB2, AB6, AB30, AC3,

AC6, AD31, AE5, AF2, AF5, AF31,

AG30, AG31, AH4, AJ3, AJ19, AJ22,

AK7, AK13, AK14, AK16, AK18, AK20,

AK25, AK28, AL3, AL5, AL10, AL12,

AL22, AL27, AM1, AM6, AM7, AN12,

AN17, AN34, AP1, AP8, AP34

———

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 65

Package and Pin Listings

GVDD A2, E2, G5, G6, J5, K4, K5, L4, N4, P5,

R6, T6, U5, V1, W5, Y5, AA4, AB3,

AC4, AD5, AF3, AG5, AH2, AH5, AH6,

AJ6, AK6, AK8, AK9, AL6

Power for DDR

DRAM I/O

voltage

(2.5 V)

GVDD —

LVDD1 C9, D11 Power for

three-speed

Ethernet #1

and for

Ethernet

management

interface I/O

(2.5 V, 3.3 V)

LVDD1—

LVDD2 C6, D9 Power for

three-speed

Ethernet #2

I/O (2.5 V,

3.3 V)

LVDD2—

VDD E19, E29, F7, F9, F11,F13, F15, F17,

F18, F21, F23, F25, F29, H29, J6,

K29, M29, N6, P29, T29, U30, V6,

V29, W29, AB29, AC5, AD29, AF6,

AF29, AH29, AJ8, AJ12, AJ14, AJ16,

AJ18, AJ20, AJ21, AJ23, AJ25, AJ26,

AJ27, AJ28, AJ29, AK10

Power for core

(1.2 V

nominal, 1.3 V

for 667 MHz)

VDD —

OVDD B22, B28, C16, C17, C24, C26, D13,

D15, D19, D29, E31, F28, G33, H30,

L29, L32, N32, P31, R31, U32, W31,

Y29, AA29, AC30, AE31, AF30, AG29,

AJ17, AJ30, AK11, AL15, AL19, AL21,

AL29, AL30, AM20, AM23, AM24,

AM26, AM28, AN11, AN13

PCI, 10/100

Ethernet, and

other standard

(3.3 V)

OVDD —

MVREF1 M3 I DDR

reference

voltage

—

MVREF2 AD2 I DDR

reference

voltage

—

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

66 Freescale Semiconductor

Package and Pin Listings

Table 56 provid es the pinout listing for the MPC8347EA, 620 PBGA package.

No Connection

NC W32, AA31, AA32, AA33, AA34,

AB31, AB32, AB33, AB34, AC29,

AC31, AC33, AC34, AD30, AD32,

AD33, AD34, AE29, AE30, AH32,

AH33, AH34, AM33, AJ31, AJ32,

AJ33, AJ34, AK32, AK33, AK34,

AM34, AL33, AL34, AK31, AH30,

AC32, AE32, AH31, AL32, AG34,

AE33, AF32, AE34, AF34, AF33,

AG33, AG32, AL11, AM11, AP10, Y32,

Y34, Y31, Y33

———

Notes:

1. This pin is an open-drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD

2. This pin is an open-drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD.

3. During reset, this output is actively driven rather than three-stated.

4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.

5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications.

6. This pin must always be tied to GND.

7. This pin must always be pulled up to OVDD

8. This pin must always be left not connected.

9. Thermal sensitive resistor.

10.It is recommended that MDIC0 be tied to GRD using an 18 Ω resistor and MDIC1 be tied to DDR power using an 18 Ω

resistor.

11.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or

actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.

Table 56. MPC8347EA (PBGA) Pinout Listing

Signal Package Pin Number Pin Type Power

Supply Notes

PCI

PCI1_INTA/IRQ_OUT D20 O OVDD 2

PCI1_RESET_OUT B21 O OVDD —

PCI1_AD[31:0] E19, D17, A16, A18, B17, B16, D16,

B18, E17, E16, A15, C16, D15, D14,

C14, A12, D12, B11, C11, E12, A10,

C10, A9, E11, E10, B9, B8, D9, A8,

C9, D8, C8

I/O OVDD —

PCI1_C/BE[3:0] A17, A14, A11, B10 I/O OVDD —

PCI1_PAR D13 I/O OVDD —

PCI1_FRAME B14 I/O OVDD 5

PCI1_TRDY A13 I/O OVDD 5

Table 55. MPC8347EA (TBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 67

Package and Pin Listings

PCI1_IRDY E13 I/O OVDD 5

PCI1_STOP C13 I/O OVDD 5

PCI1_DEVSEL B13 I/O OVDD 5

PCI1_IDSEL C17 I OVDD —

PCI1_SERR C12 I/O OVDD 5

PCI1_PERR B12 I/O OVDD 5

PCI1_REQ[0] A21 I/O OVDD

PCI1_REQ[1]/CPCI1_HS_ES C19 I OVDD —

PCI1_REQ[2:4] C18, A19, E20 I OVDD —

PCI1_GNT0 B20 I/O OVDD —

PCI1_GNT1/CPCI1_HS_LED C20 O OVDD —

PCI1_GNT2/CPCI1_HS_ENUM B19 O OVDD —

PCI1_GNT[3:4] A20, E18 O OVDD —

M66EN L26 I OVDD —

DDR SDRAM Memory Interface

MDQ[0:63] AC25, AD27, AD25, AH27, AE28,

AD26, AD24, AF27, AF25, AF28,

AH24, AG26, AE25, AG25, AH26,

AH25, AG22, AH22, AE21, AD19,

AE22, AF23, AE19, AG20, AG19,

AD17, AE16, AF16, AF18, AG18,

AH17, AH16, AG9, AD12, AG7, AE8,

AD11, AH9, AH8, AF6, AF8, AE6,

AF1, AE4, AG8, AH3, AG3, AG4, AH2,

AD7, AB4, AB3, AG1, AD5, AC2, AC1,

AC4, AA3, Y4, AA4, AB1, AB2, Y5, Y3

I/O GVDD —

MECC[0:4]/MSRCID[0:4] AG13, AE14, AH12, AH10, AE15 I/O GVDD —

MECC[5]/MDVAL AH14 I/O GVDD —

MECC[6:7] AE13, AH11 I/O GVDD —

MDM[0:8] AG28, AG24, AF20, AG17, AE9, AH5,

AD1, AA2, AG12

OGV

DD —

MDQS[0:8] AE27, AE26, AE20, AH18, AG10, AF5,

AC3, AA1, AH13

I/O GVDD —

MBA[0:1] AF10, AF11 O GVDD —

MA[0:14] AF13, AF15, AG16, AD16, AF17,

AH20, AH19, AH21, AD18, AG21,

AD13, AF21, AF22, AE1, AA5

OGV

DD —

MWE AD10 O GVDD —

MRAS AF7 O GVDD —

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

68 Freescale Semiconductor

Package and Pin Listings

MCAS AG6 O GVDD —

MCS[0:3] AE7, AH7, AH4, AF2 O GVDD —

MCKE[0:1] AG23, AH23 O GVDD 3

MCK[0:5] AH15, AE24, AE2, AF14, AE23, AD3 O GVDD —

MCK[0:5] AG15, AD23, AE3, AG14, AF24, AD2 O GVDD —

MODT[0:3] AG5, AD4, AH6, AF4 O GVDD —

MBA[2] AD22 O GVDD —

MDIC0 AG11 I/O — 9

MDIC1 AF12 I/O — 9

Local Bus Controller Interface

LAD[0:31] T4, T5, T1, R2, R3, T2, R1, R4, P1, P2,

P3, P4, N1, N4, N2, N3, M1, M2, M3,

N5, M4, L1, L2, L3, K1, M5, K2, K3, J1,

J2, L5, J3

I/O OVDD —

LDP[0]/CKSTOP_OUT H1 I/O OVDD —

LDP[1]/CKSTOP_IN K5 I/O OVDD —

LDP[2]/LCS[4] H2 I/O OVDD —

LDP[3]/LCS[5] G1 I/O OVDD —

LA[27:31] J4, H3, G2, F1, G3 O OVDD —

LCS[0:3] J5, H4, F2, E1 O OVDD —

LWE[0:3]/LSDDQM[0:3]/LBS[0:3] F3, G4, D1, E2 O OVDD —

LBCTL H5 O OVDD —

LALE E3 O OVDD —

LGPL0/LSDA10/cfg_reset_source0 F4 I/O OVDD —

LGPL1/LSDWE/cfg_reset_source1 D2 I/O OVDD —

LGPL2/LSDRAS/LOE C1 O OVDD —

LGPL3/LSDCAS/cfg_reset_source2 C2 I/O OVDD —

LGPL4/LGTA/LUPWAIT/LPBSE C3 I/O OVDD —

LGPL5/cfg_clkin_div B3 I/O OVDD —

LCKE E4 O OVDD —

LCLK[0:2] D4, A3, C4 O OVDD —

LSYNC_OUT U3 O OVDD —

LSYNC_IN Y2 I OVDD —

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 69

Package and Pin Listings

General Purpose I/O Timers

GPIO1[0]/DMA_DREQ0/GTM1_TIN1/

GTM2_TIN2

D27 I/O OVDD —

GPIO1[1]/DMA_DACK0/GTM1_TGATE1/

GTM2_TGATE2

E26 I/O OVDD —

GPIO1[2]/DMA_DDONE0/GTM1_TOUT1 D28 I/O OVDD —

GPIO1[3]/DMA_DREQ1/GTM1_TIN2/

GTM2_TIN1

G25 I/O OVDD —

GPIO1[4]/DMA_DACK1/GTM1_TGATE2/

GTM2_TGATE1

J24 I/O OVDD —

GPIO1[5]/DMA_DDONE1/GTM1_TOUT2/

GTM2_TOUT1

F26 I/O OVDD —

GPIO1[6]/DMA_DREQ2/GTM1_TIN3/

GTM2_TIN4

E27 I/O OVDD —

GPIO1[7]/DMA_DACK2/GTM1_TGATE3/

GTM2_TGATE4

E28 I/O OVDD —

GPIO1[8]/DMA_DDONE2/GTM1_TOUT3 H25 I/O OVDD —

GPIO1[9]/DMA_DREQ3/GTM1_TIN4/

GTM2_TIN3

F27 I/O OVDD —

GPIO1[10]/DMA_DACK3/

GTM1_TGATE4/GTM2_TGATE3

K24 I/O OVDD —

GPIO1[11]/DMA_DDONE3/

GTM1_TOUT4/GTM2_TOUT3

G26 I/O OVDD —

USB Port 1

MPH1_D0_ENABLEN/DR_D0_ENABLEN C28 I/O OVDD —

MPH1_D1_SER_TXD/DR_D1_SER_TXD F25 I/O OVDD —

MPH1_D2_VMO_SE0/DR_D2_VMO_SE0 B28 I/O OVDD —

MPH1_D3_SPEED/DR_D3_SPEED C27 I/O OVDD —

MPH1_D4_DP/DR_D4_DP D26 I/O OVDD —

MPH1_D5_DM/DR_D5_DM E25 I/O OVDD —

MPH1_D6_SER_RCV/DR_D6_SER_RCV C26 I/O OVDD —

MPH1_D7_DRVVBUS/DR_D7_DRVVBUS D25 I/O OVDD —

MPH1_NXT/DR_SESS_VLD_NXT B26 I OVDD —

MPH1_DIR_DPPULLUP/

DR_XCVR_SEL_DPPULLUP

E24 I/O OVDD —

MPH1_STP_SUSPEND/

DR_STP_SUSPEND

A27 O OVDD —

MPH1_PWRFAULT/

DR_RX_ERROR_PWRFAULT

C25 I OVDD —

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

70 Freescale Semiconductor

Package and Pin Listings

MPH1_PCTL0/DR_TX_VALID_PCTL0 A26 O OVDD —

MPH1_PCTL1/DR_TX_VALIDH_PCTL1 B25 O OVDD —

MPH1_CLK/DR_CLK A25 I OVDD —

USB Port 0

MPH0_D0_ENABLEN/DR_D8_CHGVBUS D24 I/O OVDD —

MPH0_D1_SER_TXD/DR_D9_DCHGVBUS C24 I/O OVDD —

MPH0_D2_VMO_SE0/DR_D10_DPPD B24 I/O OVDD —

MPH0_D3_SPEED/DR_D11_DMMD A24 I/O OVDD —

MPH0_D4_DP/DR_D12_VBUS_VLD D23 I/O OVDD —

MPH0_D5_DM/DR_D13_SESS_END C23 I/O OVDD —

MPH0_D6_SER_RCV/DR_D14 B23 I/O OVDD —

MPH0_D7_DRVVBUS/DR_D15_IDPULLUP A23 I/O OVDD —

MPH0_NXT/DR_RX_ACTIVE_ID D22 I OVDD —

MPH0_DIR_DPPULLUP/DR_RESET C22 I/O OVDD —

MPH0_STP_SUSPEND/DR_TX_READY B22 I/O OVDD —

MPH0_PWRFAULT/DR_RX_VALIDH A22 I OVDD —

MPH0_PCTL0/DR_LINE_STATE0 E21 I/O OVDD —

MPH0_PCTL1/DR_LINE_STATE1 D21 I/O OVDD —

MPH0_CLK/DR_RX_VALID C21 I OVDD —

Programmable Interrupt Controller

MCP_OUT E8 O OVDD 2

IRQ0/MCP_IN/GPIO2[12] J28 I/O OVDD —

IRQ[1:5]/GPIO2[13:17] K25, J25, H26, L24, G27 I/O OVDD —

IRQ[6]/GPIO2[18]/CKSTOP_OUT G28 I/O OVDD —

IRQ[7]/GPIO2[19]/CKSTOP_IN J26 I/O OVDD —

Ethernet Management Interface

EC_MDC Y24 O LVDD1 —

EC_MDIO Y25 I/O LVDD1 2

Gigabit Reference Clock

EC_GTX_CLK125 Y26 I LVDD1 —

Three-Speed Ethernet Controller (Gigabit Ethernet 1)

TSEC1_COL/GPIO2[20] M26 I/O OVDD —

TSEC1_CRS/GPIO2[21] U25 I/O LVDD1 —

TSEC1_GTX_CLK V24 O LVDD1 3

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 71

Package and Pin Listings

TSEC1_RX_CLK U26 I LVDD1 —

TSEC1_RX_DV U24 I LVDD1 —

TSEC1_RX_ER/GPIO2[26] L28 I/O OVDD —

TSEC1_RXD[7:4]/GPIO2[22:25] M27, M28, N26, N27 I/O OVDD —

TSEC1_RXD[3:0] W26, W24, Y28, Y27 I LVDD1 —

TSEC1_TX_CLK N25 I OVDD —

TSEC1_TXD[7:4]/GPIO2[27:30] N28, P25, P26, P27 I/O OVDD —

TSEC1_TXD[3:0] V28, V27, V26, W28 O LVDD1 10

TSEC1_TX_EN W27 O LVDD1 —

TSEC1_TX_ER/GPIO2[31] N24 I/O OVDD —

Three-Speed Ethernet Controller (Gigabit Ethernet 2)

TSEC2_COL/GPIO1[21] P28 I/O OVDD —

TSEC2_CRS/GPIO1[22] AC28 I/O LVDD2 —

TSEC2_GTX_CLK AC27 O LVDD2 —

TSEC2_RX_CLK AB25 I LVDD2 —

TSEC2_RX_DV/GPIO1[23] AC26 I/O LVDD2 —

TSEC2_RXD[7:4]/GPIO1[26:29] R28, T24, T25, T26 I/O OVDD —

TSEC2_RXD[3:0]/GPIO1[13:16] AA25, AA26, AA27, AA28 I/O LVDD2 —

TSEC2_RX_ER/GPIO1[25] R25 I/O OVDD —

TSEC2_TXD[7]/GPIO1[31] T27 I/O OVDD —

TSEC2_TXD[6]/DR_XCVR_TERM_SEL T28 O OVDD —

TSEC2_TXD[5]/DR_UTMI_OPMODE1 U28 O OVDD —

TSEC2_TXD[4]/DR_UTMI_OPMODE0 U27 O OVDD —

TSEC2_TXD[3:0]/GPIO1[17:20] AB26, AB27, AA24, AB28 I/O LVDD2 —

TSEC2_TX_ER/GPIO1[24] R27 I/O OVDD —

TSEC2_TX_EN/GPIO1[12] AD28 I/O LVDD2 3

TSEC2_TX_CLK/GPIO1[30] R26 I/O OVDD —

DUART

UART_SOUT[1:2]/MSRCID[0:1]/LSRCID[0:1] B4, A4 O OVDD —

UART_SIN[1:2]/MSRCID[2:3]/LSRCID[2:3] D5, C5 I/O OVDD —

UART_CTS[1]/MSRCID4/LSRCID4 B5 I/O OVDD —

UART_CTS[2]/MDVAL/LDVAL A5 I/O OVDD —

UART_RTS[1:2] D6, C6 O OVDD —

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

72 Freescale Semiconductor

Package and Pin Listings

I2C interface

IIC1_SDA E5 I/O OVDD 2

IIC1_SCL A6 I/O OVDD 2

IIC2_SDA B6 I/O OVDD 2

IIC2_SCL E7 I/O OVDD 2

SPI

SPIMOSI/LCS[6] D7 I/O OVDD —

SPIMISO/LCS[7] C7 I/O OVDD —

SPICLK B7 I/O OVDD —

SPISEL A7 I OVDD —

Clocks

PCI_CLK_OUT[0:2] Y1, W3, W2 O OVDD —

PCI_CLK_OUT[3]/LCS[6] W1 O OVDD —

PCI_CLK_OUT[4]/LCS[7] V3 O OVDD —

PCI_SYNC_IN/PCI_CLOCK U4 I OVDD —

PCI_SYNC_OUT U5 O OVDD 3

RTC/PIT_CLOCK E9 I OVDD —

CLKIN W5 I OVDD —

JTAG

TCK H27 I OVDD —

TDI H28 I OVDD 4

TDO M24 O OVDD 3

TMS J27 I OVDD 4

TRST K26 I OVDD 4

Test

TEST F28 I OVDD 6

TEST_SEL T3 I OVDD 6

PMC

QUIESCE K27 O OVDD —

System Control

PORESET K28 I OVDD —

HRESET M25 I/O OVDD 1

SRESET L27 I/O OVDD 2

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 73

Package and Pin Listings

Thermal Management

THERM0 B15 I — 8

Power and Ground Signals

AVDD1 C15 Power for e300

PLL (1.2 V)

nominal, 1.3 V

for 667 MHz)

AVDD1—

AVDD2 U1 Power for

system PLL

(1.2 V)

nominal, 1.3 V

for 667 MHz)

AVDD2—

AVDD3 AF9 Power for DDR

DLL (1.2 V

nominal, 1.3 V

for 667 MHz)

—

AVDD4 U2 Power for LBIU

DLL (1.2 V

nominal, 1.3 V

for 667 MHz)

AVDD4—

GND A2, B1, B2, D10, D18, E6, E14, E22,

F9, F12, F15, F18, F21, F24, G5, H6,

J23, L4, L6, L12, L13, L14, L15, L16,

L17, M11, M12, M13, M14, M15, M16,

M17, M18, M23, N11, N12, N13, N14,

N15, N16, N17, N18, P6, P11, P12,

P13, P14, P15, P16, P17, P18, P24,

R5, R11, R12, R13, R14, R15, R16,

R17, R18, R23, T11, T12, T13, T14,

T15, T16, T17, T18, U6, U11, U12,

U13, U14, U15, U16, U17, U18, V12,

V13, V14, V15, V16, V17, V23, V25,

W4, Y6, AA23, AB24, AC5, AC8,

AC11, AC14, AC17, AC20, AD9,

AD15, AD21, AE12, AE18, AF3, AF26

———

GVDD U9, V9, W10, W19, Y11, Y12, Y14,

Y15, Y17, Y18, AA6, AB5, AC9, AC12,

AC15, AC18, AC21, AC24, AD6, AD8,

AD14, AD20, AE5, AE11, AE17, AG2,

AG27

Power for DDR

DRAM I/O

voltage

(2.5 V)

GVDD —

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

74 Freescale Semiconductor

Package and Pin Listings

LVDD1 U20, W25 Power for

three-speed

Ethernet #1

and for

Ethernet

management

interface I/O

(2.5 V, 3.3 V)

LVDD1—

LVDD2 V20, Y23 Power for

three-speed

Ethernet #2

I/O (2.5 V,

3.3 V)

LVDD2—

VDD J11, J12, J15, K10, K11, K12, K13,

K14, K15, K16, K17, K18, K19, L10,

L11, L18, L19, M10, M19, N10, N19,

P9, P10, P19, R10, R19, R20, T10,

T19, U10, U19, V10, V11, V18, V19,

W11, W12, W13, W14, W15, W16,

W17, W18

Power for core

(1.2 V)

VDD —

OVDD B27, D3, D11, D19, E15, E23, F5, F8,

F11, F14, F17, F20, G24, H23, H24,

J6, J14, J17, J18, K4, L9, L20, L23,

L25, M6, M9, M20, P5, P20, P23, R6,

R9, R24, U23, V4, V6

PCI, 10/100

Ethernet, and

other standard

(3.3 V)

OVDD —

MVREF1 AF19 I DDR

reference

voltage

—

MVREF2 AE10 I DDR

reference

voltage

—

No Connection

NC V1, V2, V5 — — —

Notes:

1. This pin is an open-drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to OVDD

2. This pin is an open-drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to OVDD.

3. During reset, this output is actively driven rather than three-stated.

4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.

5. This pin should have a weak pull-up if the chip is in PCI host mode. Follow the PCI specifications.

6. This pin must always be tied to GND.

7. This pin must always be left not connected.

8. Thermal sensitive resistor.

9. It is recommended that MDIC0 be tied to GRD using an 18 Ω resistor and MDIC1 be tied to DDR power using an 18 Ω resistor.

10.TSEC1_TXD[3] is required an external pull-up resistor. For proper functionality of the device, this pin must be pulled up or

actively driven high during a hard reset. No external pull-down resistors are allowed to be attached to this net.

Table 56. MPC8347EA (PBGA) Pinout Listing (continued)

Signal Package Pin Number Pin Type Power

Supply Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 75

Clocking

19 Clocking

Figure 41 shows the internal distribution of the clocks.

Figure 41. MPC8347EA Clock Subsystem

The primary clock source can be one of two inputs, CLKIN or PCI_CLK, depending on whether the device

is configured in PCI host or PCI agent mode. When the MPC8347EA is configured as a PCI host device,

CLKIN is its primary input clock. CLKIN fe eds the PCI clock divider (÷2) and the multiplexors for

PCI_SYNC_OUT and PC I_CLK_OUT. The CFG_CLKIN_DIV configuration input selec ts whether

CLKIN or CLKIN/2 is driven out on the PCI_SYNC_OUT signal. The OCCR[PCICDn] parameters select

whether CLKIN or CLKI N/2 is driven out on the PCI_CLK_OUTn signals.

PCI_SYNC _OUT is connected externally to PCI_SYNC_IN to allow the internal c lock subsyste m to

synchronize to the system PCI clocks. PCI_SYNC_OUT must be connected properly to PCI_SYNC_IN,

with equal delay to all PC I agent devic es in the sys tem, to allow the MPC8347EA to function. When the

device is configured as a PCI agent device, PCI_CLK is the primary input clock and the CLKIN signal

should be tied to GND.

Core PLL

System PLL

DDR

LBIU

LSYNC_IN

LSYNC_OUT

LCLK[0:2]

MCK[0:5]

core_clk

e300 Core

csb_clk

to Rest

CLKIN

csb_clk

DDR

Memory

Local Bus

PCI_CLK_OUT[0:4]

PCI_SYNC_OUT

PCI_CLK/

Clock

Unit

of the Device

ddr_clk

lbiu_clk

CFG_CLKIN_DIV

PCI Clock

PCI_SYNC_IN

Device

Memory

Device

To Loca l B us

Memory

Controller

To DDR

Memory

Controller

DLL

Clock

Div

Divider

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

76 Freescale Semiconductor

Clocking

As shown in Figure 41, the primary clock input (frequency) is multiplied up by the system phase-locked

loop (PLL) and the clock unit to create the coherent system bus clock (csb_clk), the internal c loc k for the

DDR controller (ddr_clk), and the internal clock for the local bus interf ace uni t (lbiu_clk).

The csb_clk fr equency is derived from a complex set of factors that can be simplified into the following

equation:

csb_clk = {PCI_SYNC_IN × (1 + CFG_CLKIN_DIV)} × SPMF

In PCI host mode, PCI_S YNC_I N × (1 + CFG_CLKIN_DIV) is the CLKIN frequency.

The csb_clk s erves as the clock input to the e 300 core. A second PLL inside the e300 core multiplies the

csb_clk frequency to create the internal clock for the e300 core (core_clk). The system and core PLL

multiplie rs a re s e lect ed by the SPMF and C O R EPLL fie lds in the reset configuration word low (RC WL),

which is loaded at power-on reset or by one of the hard-coded reset options. See the chapter on reset,

clocking, and initialization in the MPC8349E A Reference Manual for more inform ation on the c lock

subsystem.

The internal ddr_clk frequency is determined by the following equation:

ddr_clk = csb_clk × (1 + RCWL[DDRCM])

ddr_clk is not the external memory bus frequency; ddr_clk passes through the DDR clock divider (÷2) to

create the differential DDR memory bus clock outputs (MCK and MCK). However, the data rate is the

same frequency as ddr_clk.

The internal lbiu_clk frequency is determined by the following equation:

lbiu_clk = csb_clk × (1 + RCWL[LBIUCM])

lbiu_clk is not the external local bus frequency; lbiu_clk passes through the LBIU clock divider to create

the external local bus clock outputs (LSYNC_OUT and LCLK[0:2]). The LBIU clock divider ratio is

controlled by LCCR[CLKDIV].

In addition, some of the internal units may have to be shut off or operate at lower frequen cy than the

csb_clk frequency. Those units have a default clock ratio that can be configured by a memory-mapped

Table 58 provid es the operating frequencies for the MPC8347EA TBGA under recommended opera ting

conditions (see Table 2). All frequency combinations shown in the table below may not be available.

Maximum ope rating frequencies depend on the part ordered, see Secti on 22.1, “Part Numbers Fully

Table 57. Configurable Clock Units

Unit Default

Frequency Options

TSEC1

csb_clk/3

Off,

csb_clk, csb_clk/2, csb_clk/3

TSEC2, I2C1

csb_clk/3

Off,

csb_clk, csb_clk/2, csb_clk/3

Security core

csb_clk/3

Off,

csb_clk,

csb_clk/2,

csb_clk/3

USB DR, USB MPH

csb_clk/3

Off, csb_clk, csb_clk/2,

csb_clk/3

PCI and DMA complex

csb_clk

Off,

csb_clk

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 77

Clocking

Addressed by This Document,” for part ordering details and contact your Freescale Sales Representative

or authorized distributor for more information.

Table 59 provid es the operating frequencies for the MPC8347EA PBGA under recommended operating

conditions.

Table 58. Operating Frequencies for TBGA

Characteristic1

1The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen so that the resulting

csb_clk

, MCLK,

LCLK[0:2], and

core_clk

frequencies do not exceed their respective maximum or minimum operating frequencies. The value

of SCCR[ENCCM], SCCR[USBDRCM], and SCCR[USBMPHCM] must be programmed so that the maximum internal

operating frequency of the Security core and USB modules does not exceed the respective values listed in this table.

400 MHz 533 MHz 667 MHz Unit

e300 core frequency (

core_clk

) 266–400 266–533 266–667 MHz

Coherent system bus frequency (

csb_clk

) 100–266 100–333 100–333 MHz

DDR1 memory bus frequency (MCK)2

2The DDR data rate is 2x the DDR memory bus frequency.

100–133 100–133 100–166.67 MHz

DDR2 memory bus frequency (MCK)3

3The DDR data rate is 2x the DDR memory bus frequency.

100–133 100–200 100–200 MHz

Local bus frequency (LCLK

4The local bus frequency is 1/2, 1/4, or 1/8 of the

lbiu_clk

frequency (depending on LCCR[CLKDIV]) which is in turn 1x or 2x

the

csb_clk

frequency (depending on RCWL[LBIUCM]).

16.67–133 16.67–133 16.67–133 MHz

PCI input frequency (CLKIN or PCI_CLK) 25–66 25–66 25–66 MHz

Security core maximum internal operating frequency 133 133 166 MHz

USB_DR, USB_MPH maximum internal operating

frequency

133 133 166 MHz

Table 59. Operating Frequencies for PBGA

Characteristic1

1The CLKIN frequency, RCWL[SPMF], and RCWL[COREPLL] settings must be chosen so that the resulting

csb_clk

, MCLK,

LCLK[0:2], and

core_clk

frequencies do not exceed their respective maximum or minimum operating frequencies. The value

of SCCR[ENCCM], SCCR[USBDRCM], and SCCR[USBMPHCM] must be programmed so that the maximum internal

operating frequency of the Security core and USB modules does not exceed the respective values listed in this table.

266 MHz 333 MHz 400 MHz Unit

e300 core frequency (

core_clk

) 200–266 200–333 200–400 MHz

Coherent system bus frequency (

csb_clk

) 100–266 MHz

DDR1 memory bus frequency (MCK)2

2The DDR data rate is 2x the DDR memory bus frequency.

100–133 MHz

DDR2 memory bus frequency (MCK)3100–133 MHz

Local bus frequency (LCLK

)416.67–133 MHz

PCI input frequency (CLKIN or PCI_CLK) 25–66 MHz

Security core maximum internal operating frequency 133 MHz

USB_DR, USB_MPH maximum internal operating

frequency

133 MHz

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

78 Freescale Semiconductor

Clocking

19.1 System PLL Configuration

The system PLL is c ontrolled by the RCWL[SPMF] parameter. Table 60 shows the multiplication factor

encodings for the system PLL.

As described in Section 19, “Clocking,” the LBIU CM, DDRCM, and SPMF paramete rs in the reset

configuration word low and the CFG_CLKIN_DIV configuration input signal select the ratio between the

primary clock input (CLKIN or PCI_CLK) and the internal coherent system bus clock (csb_clk). Table 61

3The DDR data rate is 2x the DDR memory bus frequency.

4The local bus frequency is 1/2, 1/4, or 1/8 of the

lbiu_clk

frequency (depending on LCCR[CLKDIV]) which is in turn 1x or 2x

the

csb_clk

frequency (depending on RCWL[LBIUCM]).

Table 60. System PLL Multiplication Factors

RCWL[SPMF] System PLL Multiplication Factor

0000 × 16

0001 Reserved

0010 × 2

0011 × 3

0100 × 4

0101 × 5

0110 × 6

0111 × 7

1000 × 8

1001 × 9

1010 × 10

1011 × 11

1100 × 12

1101 × 13

1110 × 14

1111 × 15

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 79

Clocking

and Table 62 show the expected frequency values for the CSB frequency for select csb_clk to

CLKIN/PCI_SYNC_I N ratios.

Table 61. CSB Frequency Options for Host Mode

CFG_CLKIN_DIV

at Reset1

1CFG_CLKIN_DIV selects the ratio between CLKIN and PCI_SYNC_OUT.

SPMF

csb_clk

Input Clock

Ratio2

2CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode.

DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation

at this frequency.

Input Clock Frequency (MHz)2

16.67 25 33.33 66.67

csb_clk

Frequency (MHz)

Low 0010 2 : 1 133

Low 0011 3 : 1 100 200

Low 0100 4 : 1 100 133 266

Low 0101 5 : 1 125 166 333

Low 0110 6 : 1 100 150 200

Low 0111 7 : 1 116 175 233

Low 1000 8 : 1 133 200 266

Low 1001 9 : 1 150 225 300

Low 1010 10 : 1 166 250 333

Low 1011 11 : 1 183 275

Low 1100 12 : 1 200 300

Low 1101 13 : 1 216 325

Low 1110 14 : 1 233

Low 1111 15 : 1 250

Low 0000 16 : 1 266

High 0010 2 : 1 133

High 0011 3 : 1 100 200

High 0100 4 : 1 133 266

High 0101 5 : 1 166 333

High 0110 6 : 1 200

High 0111 7 : 1 233

High 1000 8 : 1

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

80 Freescale Semiconductor

Clocking

19.2 Core PLL Configuration

RCWL[COREPLL] selects the ratio between the internal coherent system bus clock (csb_clk) and the e300

core clock (core_clk). Table 63 shows the encodings f or RCWL [ CORE P LL]. CORE PLL values that ar e

not listed in Table 63 should be considered as reserved.

Table 62. CSB Frequency Options for Agent Mode

CFG_CLKIN_DIV

at Reset1

1CFG_CLKIN_DIV doubles csb_clk if set high.

SPMF

csb_clk

Input Clock

Ratio2

2CLKIN is the input clock in host mode; PCI_CLK is the input clock in agent mode.

DDR2 memory may be used at 133 MHz provided that the memory components are specified for operation

at this frequency.

Input Clock Frequency (MHz)2

16.67 25 33.33 66.67

csb_clk

Frequency (MHz)

Low 0010 2 : 1 133

Low 0011 3 : 1 100 200

Low 0100 4 : 1 100 133 266

Low 0101 5 : 1 125 166 333

Low 0110 6 : 1 100 150 200

Low 0111 7 : 1 116 175 233

Low 1000 8 : 1 133 200 266

Low 1001 9 : 1 150 225 300

Low 1010 10 : 1 166 250 333

Low 1011 11 : 1 183 275

Low 1100 12 : 1 200 300

Low 1101 13 : 1 216 325

Low 1110 14 : 1 233

Low 1111 15 : 1 250

Low 0000 16 : 1 266

High 0010 4 : 1 100 133 266

High 0011 6 : 1 100 150 200

High 0100 8 : 1 133 200 266

High 0101 10 : 1 166 250 333

High 0110 12 : 1 200 300

High 0111 14 : 1 233

High 1000 16 : 1 266

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 81

Clocking

NOTE

Core VCO frequency = core frequency × VCO divider

VCO divider must be set properly so that the core VCO frequency is in the

range of 800–1800 MHz.

Table 63. e300 Core PLL Configuration

RCWL[COREPLL]

core_clk

csb_clk

Ratio VCO Divider1

1Core VCO frequency = core frequency × VCO divider. The VCO divider must be set properly so that the core VCO frequency

is in the range of 800–1800 MHz.

0–1 2–5 6

nn 0000 n PLL bypassed

(PLL off,

csb_clk

clocks core directly)

PLL bypassed

(PLL off,

csb_clk

clocks core directly)

00 0001 01:1 2

01 0001 01:1 4

10 0001 01:1 8

11 0001 01:1 8

00 0001 1 1.5:1 2

01 0001 1 1.5:1 4

10 0001 1 1.5:1 8

11 0001 1 1.5:1 8

00 0010 02:1 2

01 0010 02:1 4

10 0010 02:1 8

11 0010 02:1 8

00 0010 1 2.5:1 2

01 0010 1 2.5:1 4

10 0010 1 2.5:1 8

11 0010 1 2.5:1 8

00 0011 03:1 2

01 0011 03:1 4

10 0011 03:1 8

11 0011 03:1 8

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

82 Freescale Semiconductor

Clocking

19.3 Suggested PLL Configurations

Table 64 s hows suggested PLL configurations for 33 and 66 MHz input clocks.

Table 64. Suggested PLL Configurations

Ref

No.1

RCWL 400 MHz Device 533 MHz Device 667 MHz Device

SPMF CORE

PLL

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

33 MHz CLKIN/PCI_CLK Options

922 1001 0100010 —————f30033300300

723 0111 0100011 33 233 350 33 233 350 33 233 350

604 0110 0000100 33 200 400 33 200 400 33 200 400

624 0110 0100100 33 200 400 33 200 400 33 200 400

803 1000 0000011 33 266 400 33 266 400 33 266 400

823 1000 0100011 33 266 400 33 266 400 33 266 400

903 1001 0000011 — 3330045033300450

923 1001 0100011 — 3330045033300450

704 0111 0000011 — 3323346633233466

724 0111 0100011 — 3323346633233466

A03 1010 0000011 — 33 333 500 33 333 500

804 1000 0000100 — 3326653333266533

705 0111 0000101 — — 33 233 583

606 0110 0000110 — — 33 200 600

904 1001 0000100 — — 33 300 600

805 1000 0000101 — — 33 266 667

A04 1010 0000100 — — 33 333 667

66 MHz CLKIN/PCI_CLK Options

304 0011 0000100 66 200 400 66 200 400 66 200 400

324 0011 0100100 66 200 400 66 200 400 66 200 400

403 0100 0000011 66 266 400 66 266 400 66 266 400

423 0100 0100011 66 266 400 66 266 400 66 266 400

305 0011 0000101 — 6620050066200500

503 0101 0000011 — 66 333 500 66 333 500

404 0100 0000100 — 6626653366266533

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 83

Thermal

20 Thermal

This section describes the thermal specifications of the MPC8347EA.

20.1 Thermal Characteristics

Table 65 provides the package thermal characteristics for the 672 35 ×35 mm TBGA of the MPC8347EA.

306 0011 0000110 — — 66 200 600

405 0100 0000101 — — 66 266 667

504 0101 0000100 — — 66 333 667

1The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and

COREPLL settings given in the table.

2The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.

Table 65. Package Thermal Characteristics for TBGA

Characteristic Symbol Value Unit Notes

Junction-to-ambient natural convection on single-layer board (1s) RθJA 14 °C/W 1, 2

Junction-to-ambient natural convection on four-layer board (2s2p) RθJMA 11 °C/W 1, 3

Junction-to-ambient (@ 200 ft/min) on single-layer board (1s) RθJMA 11 °C/W 1, 3

Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p) RθJMA 8°C/W 1, 3

Junction-to-ambient (@ 2 m/s) on single-layer board (1s) RθJMA 9°C/W 1, 3

Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p) RθJMA 7°C/W 1, 3

Junction-to-board thermal RθJB 3.8 °C/W 4

Junction-to-case thermal RθJC 1.7 °C/W 5

Table 64. Suggested PLL Configurations (continued)

Ref

No.1

RCWL 400 MHz Device 533 MHz Device 667 MHz Device

SPMF CORE

PLL

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

84 Freescale Semiconductor

Thermal

Table 66 provides th e package thermal characteristics for the 620 29 ×29 mm PBGA of the MPC8347EA.

20.2 Thermal Management Information

For the following sections, PD = (VDD ×IDD) + PI/O where PI/O is the p ower di ssipation of the I /O drivers.

See Table 5 for I/O power dissipation values.

Junction-to-package natural convection on top ψJT 1°C/W 6

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 66. Package Thermal Characteristics for PBGA

Characteristic Symbol Value Unit Notes

Junction-to-ambient natural convection on single-layer board (1s) RθJA 21 °C/W 1, 2

Junction-to-ambient natural convection on four-layer board (2s2p) RθJMA 15 °C/W 1, 3

Junction-to-ambient (@ 200 ft/min) on single-layer board (1s) RθJMA 17 °C/W 1, 3

Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p) RθJMA 12 °C/W 1, 3

Junction-to-board thermal RθJB 6°C/W 4

Junction-to-case thermal RθJC 5°C/W 5

Junction-to-package natural convection on top ψJT 5°C/W 6

Notes

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 65. Package Thermal Characteristics for TBGA (continued)

Characteristic Symbol Value Unit Notes

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 85

Thermal

20.2.1 Estimation of Junction Temperature with Junction-to-Ambient

Thermal Resistance

An estimation of the chip junction temper ature , TJ, can be obtained from the equation:

TJ = TA + (R

JA × PD)

where:

TJ = junction temperature (°C)

TA = ambi ent t emp erat ure for the package (°C)

JA = junction-to-ambient thermal resistance (°C/W)

PD = powe r dissipation in the package (W)

The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy

estimation of thermal performance. Generally, the value obtained on a single-layer boar d is appropriate for

a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually

appropriate if the board has low power dissipation and the components are well separated. Test cases have

demonstrate d that errors of a factor of two (in the quantity TJ–T

A) are possible.

20.2.2 Estimation of Junction Temperature with Junction-to-Board

Thermal Resistance

The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal

resistance. The thermal performance of any component is s trongly dependent on the power dissipation of

surrounding components. In addition, the ambient temperature varies widely within the application. For

many natural convection and especially closed box applications, the board temperature at the per imeter

(edge) of the package is approximat ely th e same as the local air temperatur e near the device. Specifying

the local ambient conditions e xplicitly a s the board temperature provides a more precise description of the

local ambient conditions that determine the temperature of the device.

At a known board temperature, the junction temperature is estimated using the following equation:

TJ = TA + (R

JA × PD)

where:

TJ = junction temperature (°C)

TA = ambi ent t emp erat ure for the package (°C)

JA = junction-to-ambient thermal resistance (°C/W)

PD = powe r dissipation in the package (W)

When the heat loss from the package case to the air can be ignored, acceptable predictions of junction

temperature can be ma de. The application board should be similar to the thermal test condition: the

component is sol dered to a board with internal planes.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

86 Freescale Semiconductor

Thermal

20.2.3 Experimental Determination of Junction Temperature

To determine the junction temperature of the device in the application after prototypes are available, use

the thermal char acte rization parameter (

JT) to determine the junction temperature and a measure of the

temperature at the top center of the package case using the following equation:

TJ = TT + (

JT × PD)

where:

TJ = junction temperature (°C)

TT = thermocouple temperature on top of package (°C)

JT = junction-to-ambient thermal resistance (°C/W)

PD = powe r dissipation in the package (W)

The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type

T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so

that the thermocouple junction rests on the package. A small amount of epoxy is placed over the

thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire

is placed flat against the package case to avoid measurement errors caus ed by cooling effects of the

ther mocouple wire.

20.2.4 Heat Sinks and Junction-to-Case Thermal Resistance

Some application environments require a heat sink to provide the necessary thermal management of the

device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case

ther mal resist ance and a case-to-ambie nt thermal re sistan ce:

JA = R

JC + R

where:

JA = junction-to-ambient thermal resistance (°C/W)

JC = junction-to-case thermal resistance (°C/W)

CA = case-to-ambient thermal resistance (°C/W)

JC is device-related and cannot be influenced by the user. The user controls the ther mal environment to

change the case-to-ambient thermal resistance, R

CA. For instance, the user can change the size of the heat

sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit

board, or change the thermal dissipation on the printed-circuit board surrounding the device.

The thermal performance of devices with heat sinks has been simulated with a few commercially available

heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,

adjacent component power dissipation) and the physical spac e available. Beca use there is not a standard

application environment, a standard heat sink is not required.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 87

Thermal

Table 67 and Table 68 show heat sink the rmal resistance for TBGA and PBGA of the MPC8347EA.

Table 67. Heat Sink and Thermal Resistance of MPC8347EA (TBGA)

Heat Sink Assuming Thermal Grease Air Flow

35 ×35 mm TBGA

Thermal Resistance

AAVID 30 ×30 ×9.4 mm pin fin Natural convection 10

AAVID 30 ×30 ×9.4 mm pin fin 1 m/s 6.5

AAVID 30 ×30 ×9.4 mm pin fin 2 m/s 5.6

AAVID 31 ×35 ×23 mm pin fin Natural convection 8.4

AAVID 31 ×35 ×23 mm pin fin 1 m/s 4.7

AAVID 31 ×35 ×23 mm pin fin 2 m/s 4

Wakefield, 53 ×53 ×25 mm pin fin Natural convection 5.7

Wakefield, 53 ×53 ×25 mm pin fin 1 m/s 3.5

Wakefield, 53 ×53 ×25 mm pin fin 2 m/s 2.7

MEI, 75 ×85 ×12 no adjacent board, extrusion Natural convection 6.7

MEI, 75 ×85 ×12 no adjacent board, extrusion 1 m/s 4.1

MEI, 75 ×85 ×12 no adjacent board, extrusion 2 m/s 2.8

MEI, 75 ×85 ×12 mm, adjacent board, 40 mm side bypass 1 m/s 3.1

Table 68. Heat Sink and Thermal Resistance of MPC8347EA (PBGA)

Heat Sink Assuming Thermal Grease Air Flow

29 ×29 mm PBGA

Thermal Resistance

AAVID 30 ×30 ×9.4 mm pin fin Natural convection 13.5

AAVID 30 ×30 ×9.4 mm pin fin 1 m/s 9.6

AAVID 30 ×30 ×9.4 mm pin fin 2 m/s 8.8

AAVID 31 ×35 ×23 mm pin fin Natural convection 11.3

AAVID 31 ×35 ×23 mm pin fin 1 m/s 8.1

AAVID 31 ×35 ×23 mm pin fin 2 m/s 7.5

Wakefield, 53 ×53 ×25 mm pin fin Natural convection 9.1

Wakefield, 53 ×53 ×25 mm pin fin 1 m/s 7.1

Wakefield, 53 ×53 ×25 mm pin fin 2 m/s 6.5

MEI, 75 ×85 ×12 no adjacent board, extrusion Natural convection 10.1

MEI, 75 ×85 ×12 no adjacent board, extrusion 1 m/s 7.7

MEI, 75 ×85 ×12 no adjacent board, extrusion 2 m/s 6.6

MEI, 75 ×85 ×12 mm, adjacent board, 40 mm side bypass 1 m/s 6.9

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

88 Freescale Semiconductor

Thermal

Accurate thermal design requires thermal modeling of the application environment using computational

fluid dynamic s software which can model both the conduction cooling and the convection cooling of the

air moving through the application. Simplified thermal models of the packages can be assembled using the

junction- to-ca se and junction-to-boa rd thermal re si stanc es listed in the thermal resistanc e table. More

detailed thermal mode ls can be made available on request.

Heat sink vendors include the following list:

Aavid Thermalloy 603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech 408-567-8082

473 Sapena Ct. #12

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC) 818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Millennium Electronics (MEI) 408- 436-8770

Loroco Sites

671 East Brokaw Road

San Jose, CA 95112

Internet: www.mei-thermal.com

Tyco Electronics 800-522-2800

Chip Coolers™

P.O. Box 3668

Harrisbur g, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering 603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Interface material vendors include the following:

Chomerics, Inc. 781-935-4850

77 Dragon Ct.

Woburn, MA 01801

Internet: www.chomerics.com

Dow-Corning Corpora tion 800-248-2481

Dow-Corning Electronic Materials

P.O. Box 994

Midland, MI 48686-0997

Internet: www.dowcorning.com

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 89

Thermal

Shin-Etsu MicroSi, Inc. 888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.c om

The Bergquist Company 800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany. com

20.3 Heat Sink Attachment

When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.

The spring clip should connect to the printed-circuit board, either to the board itsel f, to hooks soldered to

the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the

package from the board. Such peeling forces reduc e the solder joint lifetime of the package. The

recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive

attachment should attach to painted or plastic surfaces, and its perf ormanc e should be verifi ed under the

application requirements.

20.3.1 Experimental Determination of the Junction Temperature with a

Heat Sink

When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the

interface between the case of the package and the interface material. A clearance slot or hole is normally

required in the heat sink. Minimize the size of the clearance to minimize the change in thermal

performance caused by removing part of the thermal interface to the heat sink. Because of the experimental

dif ficulties with this technique, many engineers measure the heat sink temperature and then back calculate

the case temperature using a separate measurement of the thermal resistance of the interface. From this

case temperat ur e, the junction temper at ure is determ ined from the junction-to-c ase t her mal resistance.

TJ = TC + (R

JC × PD)

where:

TJ = junction temperature (°C)

TC = case t emp er ature of the package (°C)

JC = junction-to-case thermal resistance (°C/W)

PD = powe r dissipation (W )

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

90 Freescale Semiconductor

System Design Information

21 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC8347EA.

21.1 System Clocking

The MPC8347E A includes two PLLs:

1. The platform PL L generates the platform clock from the externally supplied CLKIN input. The

frequency ratio between the platform and CLKIN is selected using the platform PLL ratio

configuration bits as described in Section 19. 1, “System PLL Configuration.”

2. The e300 core PLL generates the core clock as a slave to the platform clock. The frequency ratio

between the e300 core clock and the platform clock is selected using the e300 PLL ratio

configuration bits as described in Section 19. 2, “Core PLL Configuration.”

21.2 PLL Power Supply Filtering

Each PLL gets power through independent power supply pins (AVDD1, AVDD2, respectively). The AVDD

level should always equal to VDD, and preferably these voltages are derived directly from VDD through a

low frequency filter scheme .

There are a number of ways to provide power reliably to the PLLs, but the recommended solution is to

provide four independent filter circuits as illus trated in Figure 42, one to each of the four AVDD pins.

Independent filters to each PLL reduce the opportunity to cause noise injection from one PLL to the other.

The circuit filters noise in the PLL resonant frequency range from 500 kHz to 10 MHz. It should be built

with surface mount capacitors with minimum ef fective series inductance (ESL). Consistent with the

recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of Black Magic

(Prentice Hall, 1993), multiple sm al l capacitors of equal value are recommended over a single large value

capacitor.

To minimize noise coupled from nearby circuits, each circuit should be placed as closely as possible to the

specific AVDD pin being s upplied. It should be possible to r oute directly f rom the capacitors to the AVDD

pin, which is on the periphery of package, without the inductance of vias.

Figure 42 shows the PLL power supply filter circuit.

Figure 42. PLL Power Supply Filter Circuit

21.3 Decoupling Recommendations

Due to large address and da ta buses and high operati ng frequencies, the MPC8347EA can generate

transient power sur ges and high frequency noise in its power supply, especially while driving large

VDD AVDD (or L2AVDD)

2.2 µF 2.2 µF

GND Low ESL Surface Mount Capacitors

10 Ω

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 91

System Design Information

capacitive loads. This noise must be prevented from reaching other components in the MPC8347EA

system, and the device itself requires a cle an, tightly r egulated source of power. Therefore, the system

designer should place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pin of the

device. These capacitors should receive their power from separate VDD, OV DD, G VDD, LVDD, and GND

power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly under

the device using a standard escape patter n. Others can surround the part.

These capacitors should ha ve a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)

capacitors should be us ed to minimize lead inductance, preferably 0402 or 0603 sizes.

In addition, distribute several bulk storage capacitors around the PCB, fee ding the VDD, OVDD, G VDD,

and LVDD planes, to enable quick rechargi ng of the smaller chip capacitors. These bulk capacitors should

have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should a lso

be connected to the power and ground pla nes through two vias to minimize inductance. Suggested bulk

capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON).

21.4 Connection Recommendations

To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low

inputs should be tied to OVDD, G V DD, o r LVDD as required. Unused active high inputs should be

connected to GND. A ll NC (no-connect) signals must remain unconnected.

Power and gr ound connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins of

the MPC8347EA.

21.5 Output Buffer DC Impedance

The MPC8 347EA drivers are characterized over process, voltage, and temperature. For all buses, the

driver is a push-pull single-ended driver type (open drain for I2C).

To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD

or GND. T hen the value of each re sistor is varied until the pad voltage is OVDD/2 (see Figure 43). The

output impedance is the average of two components, the resistances of the pull-up and pull -down devices.

When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

92 Freescale Semiconductor

System Design Information

OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each

other in value. Then, Z0 = (RP + RN)/2.

Figure 43. Driver Impedance Measurement

Two measurements give the value of this resistance and the strength of the driver current source. First, the

output voltage is measured while driving logic 1 without an external dif ferential termination resistor . The

measured voltage is V1 = Rsource × Isource. Second, the output voltage is measured while driving logic 1

with an external precision diff e rential termination resistor of value Rterm. The meas ured voltage is

V2=(1/(1/R

1+1/R

2)) × Isource. Solving for the output impedance gives Rsource = Rterm × (V1/V2–1). The

drive current is then Isource =V

1/Rsource.

Table 69 summari zes the signal i mpedance targets. T he driver impedance are targeted at minimum VDD,

nominal OVDD, 105°C.

21.6 Configuration Pin Multiplexing

The MPC8347E A power-on configuration options can be set through e xternal pull-up or pull-down

resistors of 4.7 kΩ on certain output pins (see the customer-visible configuration pins). These pins are used

as output only pins in normal operation.

Table 69. Impedance Characteristics

Impedance

Local Bus, Ethernet,

DUART, Control,

Configuration, Power

Management

PCI Signals

(Not Including PCI

Output Clocks)

PCI Output Clocks

(Including

PCI_SYNC_OUT)

DDR DRAM Symbol Unit

RN42 Target 25 Target 42 Target 20 Target Z0W

RP42 Target 25 Target 42 Target 20 Target Z0W

Differential NA NA NA NA ZDIFF W

Note: Nominal supply voltages. See Ta bl e 1 , Tj = 105°C.

OVDD

OGND

Pad

Data

SW1

SW2

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 93

Ordering Information

However , while HRESET is asserted, these pins are treated as inputs, and the value on these pins is latched

when PORESET deass ert s. Then the input receiver is disabled and the I/O circuit takes on its normal

function. Careful board layout with stubless connections to these pull-up/pull-down resistors coupled with

the large value of the pull-up/pull-down resist or should minimize the disr uption of signal quality or s peed

for the output pins.

21.7 Pull-Up Resistor Requirements

The MPC8347EA requires high resistance pull-up resistors (10 kΩ is recommended) on open-drain pins,

including I2C pins, the Ether net Management MDIO pin, and IPIC interrupt pins.

For more information on required pull-up re sistors and the connections required for the JTA G interface,

refer to application note AN2931, P ower QUIC C Design Check lis t.

22 Ordering Information

This section presents ordering information for the device discussed in this document, and it shows an

example of how the parts are marked.

NOTE

The information in this document is accurate for revis ion 3.x silicon and

later (in other words, for orderable part numbers ending in A or B). For

information on revis ion 1.1 silicon a nd earlier ve rsions, see the MPC8347E

PowerQUIC C II Pro Integrated Host Processor Hardware Specifications

(Document Order No. MPC8347EEC).

22.1 Part Numbers Fully Addressed by This Document

Table 70 s hows an analysis of the Freescale part numbering nomenclature for the MPC8347EA. The

individual part numbers correspond to a maximum processor core frequency. Each part number also

contains a revision code that refers to the die mask revision number . For available frequency configuration

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

94 Freescale Semiconductor

Ordering Information

parts including extended temperatures, refer to the device product summary page on our website listed on

the back cover of this document or , contact your local Freescale sales off ice.

Table 71 s hows the SVR settings by device and packag e type.

Table 70. Part Numbering Nomenclature

MPC nnnn e t pp aa a r

Product

Code

Part

Identifier

Encryption

Acceleration

Temperature1

Range Package2Processor

Frequency3Platform

Frequency

Revision

Level

MPC 8347 Blank = Not

included

E = included

Blank = 0 to 105°C

C = –40 to 105°C

ZU =TBGA

VV = PB free TBGA

ZQ = PBGA

VR = PB Free PBGA

e300 core

speed

AD = 266

AG = 400

AJ = 533

AL = 667

D = 266

F = 3334

B = 3.1

Notes:

1. For temperature range = C, processor frequency is limited to 400 (PBGA) with a platform frequency of 266 and up to 533

(TBGA) with a platform frequency of 333

2. See Section 18, “Package and Pin Listings,” for more information on available package types.

3. Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this

specification support all core frequencies. Additionally, parts addressed by Part Number Specifications may support other

maximum core frequencies.

4. ALF marked parts support DDR1 data rate up to 333 MHz (at 333 MHz CSB as the 'F' marking implies) and DDR2 data rate

up to 400 MHz (at 200 MHz CSB). AJF marked parts support DDR1 and DDR2 data rate up to 333 MHz (at a CSB of 333

MHz).

Table 71. SVR Settings

Device Package SVR (Rev. 3.0)

MPC8347EA TBGA 8052_0030

MPC8347A TBGA 8053_0030

MPC8347EA PBGA 8054_0030

MPC8347A PBGA 8055_0030

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 95

Document Revision History

22.2 Part Marking

Parts are marked as in the example shown in Figure 44.

Figure 44. Freescale Part Marking for TBGA or PBGA Devices

23 Document Revision History

Table 72 provid es a revision history of this document.

Table 72. Document Revision History

Rev.

Number Date Substantive Change(s)

10 05/2010 • In Ta bl e 2 5 through Table 30, changed VIL(min) to VIH(max) to (20%–80%).

• Added Ta b l e 8 , “EC_GTX_CLK125 AC Timing Specifications.”

95/2009 •In Section 18.3, “Package Parameters for the MPC8347EA PBGA, changed solder ball for TBGA

and PBGA from 95.5 Sn/0.5 Cu/4 Ag to 96.5 Sn/3.5 Ag.

•In Ta b le 5 8 , updated frequecy for DDR2, from 100-200 to 100-133 at core frequency = 533MHz.

•In Ta b l e 5 9 , added two columns for the DDR1 and DDR2 memory bus frequency.

•In Table 70, footnote 1, changed 667(TBGA) to 533(TBGA). footnote 4, added data rate for DDR1

and DDR2.

Notes:

ATWLYYWW is the traceability code.

MPCnnnnetppaaar

core/platform MHZ

ATWLYYWW

CCCCC

TBGA/PBGA

*MMMMM YWWLAZ

CCCCC is the country code.

MMMMM is the mask number.

YWWLAZ is the assembly traceability code.

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

96 Freescale Semiconductor

Document Revision History

8 2/2009 • Added footnote 6 to Ta ble 7.

•In Section 9.2, “USB AC Electrical Specifications,” clarified that AC table is for ULPI only.

•In Ta b le 3 9 , corrected tLBKHOV parameter to tLBKLOV (output data is driven on falling edge of clock

in DLL bypass mode). Similarly, made the same correction to Figure 21, Figure 23, and Figure 24

for output signals.

• Added footnote 10 and 11 to Table 55 and Ta b l e 5 6 .

•In Section 21.1, “System Clocking,” removed “(AVDD1)” and “(AVDD2”) from bulleted list.

•In Section 21.2, “PLL Power Supply Filtering,” in the second paragraph, changed “provide five

independent filter circuits,” and “the five AVDD pins” to provide four independent filter circuits,” and

“the four AVDD pins.”

•In Ta b l e 5 8 , corrected the max csb_clk to 266 MHz.

•In Ta b l e 6 4 , added PLL configurations 903, 923, A03, A23, and 503 for 533 MHz

• Added footnote 4 to Ta ble 7 0.

•In Table 70, updated note 1 to say the following: “For temperature range = C, processor frequency

is limited to 533 (TBGA) and 400 (PBGA) with a platform frequency of 266.”

74/2007 •In Ta bl e 3 , “Output Drive Capability,” changed the values in the Output Impedance column and

added USB to the seventh row.

•In Ta b l e 4 , “Operating Frequencies for TBGA,” added column for 400 MHz.

•In Section 21.7, “Pull-Up Resistor Requirements,“ deleted last two paragraphs and after first

paragraph, added a new paragraph.

• Deleted Section 21.8, “JTAG Configuration Signals,” and Figure 43, “JTAG Interface Connection.”

6 3/2007 • Page 1, updated first paragraph to reflect PowerQUICC II Pro information.

• In Table 18, “DDR and DDR2 SDRAM Input AC Timing Specifications,” added note 2 to tCISKEW

and deleted original note 3; renumbered the remaining notes.

•

• In Figure 43, “JTAG Interface Connection,” updated with new figure.

• In Table 57, “Operating Frequencies for TBGA,” in the ‘Coherent system bus frequency (

csb_clk

)’

row, changed the value in the 533 MHz column to 100-333.

• In Table 63, “Suggested PLL Configurations,” under the subhead, ‘33 MHz CLKIN/PCI_CLK

Options,’ added row A03 between Ref. No. 724 and 804. Under the subhead ‘66 MHz

CLKIN/PCI_CLK Options,’ added row 503 between Ref. No. 305 and 404. For Ref. No. 306,

changed the CORE PLL value to 0000110.

• In Section 23, “Ordering Information,” replaced first paragraph and added a note.

• In Section 23.1, “Part Numbers Fully Addressed by this Document,” replaced first paragraph.

5 1/2007 • In Table 1, “Absolute Maximum Ratings,” added (1.36 max for 667-MHz core frequency).

• In Table 2, “Recommended Operating Conditions,” added a row showing nominal core supply

voltage of 1.3 V for 667-MHz parts.

• In Table 4, “MPC8347EA Power Dissipation,” added two footnotes to 667-MHz row showing

nominal core supply voltage of 1.3 V for 667-MHz parts.

• In Table 54, “MPC8347EA (TBGA) Pinout Listing,” updated VDD row to show nominal core supply

voltage of 1.3 V for 667-MHz parts.

4 12/2006 Table 19, “DDR and DDR2 SDRAM Output AC Timing Specifications,” modified Tddkhds for 333 MHz

from 900 ps to 775 ps.

Table 72. Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor 97

Document Revision History

3 11/2006 • Updated note in introduction.

• In the features list in Section 1, “Overview,” updated DDR data rate to show 266 MHz for PBGA

parts for all silicon revisions, and 400 MHz for DDR2 for TBGA parts for silicon Rev. 2 and 3.

• In Table 5, “MPC8347EA Typical I/O Power Dissipation,” added GVDD 1.8-V values for DDR2;

added table footnote to designate rates that apply only to the TBGA package.

•

• In Section 23, “Ordering Information,” replicated note from document introduction.

2 8/2006 • Changed all references to revision 2.0 silicon to revision 3.0 silicon.

• Changed VIH minimum value in Table 39, “JTAG Interface DC Electrical Characteristics,” to

OVDD –0.3.

• In Table 40, “PCI DC Electrical Characteristics,” changed high-level input voltage values to min

= 2 and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8.

• In Table 44, “PCI DC Electrical Characteristics,” changed higl-level input voltage values to min = 2

and max = OVDD + 0.3; changed low-level input voltage values to min = (–0.3) and max = 0.8.

• Updated DDR2 I/O power values in Table 5, “MPC8347EA Typical I/O Power Dissipation.”

• In Table 63, “Suggested PLL Configurations,” deleted reference-number rows 902 and 703.

1 4/2006 • Removed Table 20, “Timing Parameters for DDR2-400.”

• Changed ADDR/CMD to ADDR/CMD/MODT in Table 9, “DDR and DDR2 SDRAM Output AC

Timing Specifications,” rows 2 and 3, and in Figure 2, “DDR SDRAM Output Timing Diagram.

• Changed Min and Max values for VIH and VIL in Table 40,“PCI DC Electrical Characteristics.”

• In Table 51, “MPC8347EA (TBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout

Listing,” modified rows for MDICO and MDIC1 signals and added note ‘It is recommended that

MDICO be tied to GRD using an 18 Ω resistor and MCIC1 be tied to DDR power using an 18 Ω

resistor.’

• In Table 51, “MPC8347EA (TBGA) Pinout Listing,” and Table 52, “MPC8347EA (PBGA) Pinout

Listing,” in row AVDD3 changed power supply from “AVDD3” to ‘—.’

0 3/2006 Initial public release.

Table 72. Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

Document Number: MPC8347EAEC

Rev. 10

05/2010

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