1. Product profile
1.1 General description
Three electrically isolated high-speed switching diodes, encapsulated in very small SMD
plastic packages.
1.2 Features
■Very small SMD plastic packages
■High-speed switching
■Three electrically isolated diodes
■Low capacitance.
1.3 Applications
■General purpose switching in surface mounted circuits.
1.4 Quick reference data
BAS16VV; BAS16VY
Triple high-speed switching diodes
Rev. 02 — 10 September 2004 Product data sheet
Table 1: Product overview
Type number Package Configuration
Philips EIAJ
BAS16VV SOT666 - triple isolated diode
BAS16VY SOT363 SC-88 triple isolated diode
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRreverse voltage - - 100 V
IFRM repetitive peak forward current - - 450 mA
trr reverse recovery time - - 4 ns
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 2 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
2. Pinning information
3. Ordering information
4. Marking
[1] * = p: Made in Hong Kong
* = t: Made in Malaysia
* = W: Made in China
5. Limiting values
Table 3: Discrete pinning
Pin Description Simplified outline Symbol
1 anode (diode 1)
2 anode (diode 2)
3 anode (diode 3)
4 cathode (diode 3)
5 cathode (diode 2)
6 cathode (diode 1)
001aab555
6 45
1 32
sym043
654
123
Table 4: Ordering information
Type number Package
Name Description Version
BAS16VV - plastic surface mounted package; 6 leads SOT666
BAS16VY SC-88 plastic surface mounted package; 6 leads SOT363
Table 5: Marking
Type number Marking code[1]
BAS16VV 53
BAS16VY 16*
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRRM repetitive peak reverse
voltage - 100 V
VRreverse voltage - 100 V
IFforward current - 200 mA
IFRM repetitive peak forward
current - 450 mA
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 3 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
[1] Tj = 25 °C prior to surge; see Figure 2.
[2] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[3] Single diode loaded.
[4] Solder points at pins 2, 3, 5 and 6.
6. Thermal characteristics
[1] Refer to SOT666 standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, 1 cm2 collector mounting
pad.
[4] Solder points at pins 2, 3, 5 and 6.
IFSM non-repetitive peak forward
current square wave [1] -
tp = 1 µs - 4.5 A
tp = 1 ms - 1 A
tp = 1 s - 0.5 A
Ptot total power dissipation
SOT666 Tamb ≤ 25 °C[2] [3] - 180 mW
SOT363 Tsp = 85 °C[4] - 250 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 6: Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction
to ambient in free air
SOT666 [1] [2] - - 700 K/W
[2] [3] - - 410 K/W
Rth(j-s) thermal resistance from junction
to soldering point
SOT363 [4] - - 260 K/W
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 4 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
7. Characteristics
[1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
[2] When switched from IF = 10 mA; tr = 20 ns.
Table 8: Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage see Figure 1
IF = 1 mA - - 715 mV
IF = 10 mA - - 855 mV
IF = 50 mA - - 1 V
IF = 150 mA - - 1.25 V
IRreverse current see Figure 3
VR = 25 V - - 30 nA
VR = 75 V - - 1 µA
VR = 25 V; Tj = 150 °C--30µA
VR = 75 V; Tj = 150 °C--50µA
Cddiode
capacitance VR = 0 V; f = 1 MHz;
see Figure 4 - - 1.5 pF
trr reverse recovery
time see Figure 5 [1] --4ns
Vfr forward recovery
voltage see Figure 6 [2] - - 1.75 V
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 5 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
(1) Tj= 150 °C; typical values.
(2) Tj=25°C; typical values.
(3) Tj=25°C; maximum values.
Based on square wave currents.
Tj = 25 °C prior to surge.
Fig 1. Forward current as a function of forward
voltage. Fig 2. Maximum permissible non-repetitive peak
forward current as a function of pulse duration.
f = 1 MHz; Tj = 25 °C.
Fig 3. Reverse current as a function of junction
temperature. Fig 4. Diode capacitance as a function of reverse
voltage; typical values.
02
300
IF
(mA)
0
100
200
mbg382
1VF (V)
(1) (2) (3)
mgw103
tp (µs)
110
4
103
10 102
1
10
IFSM
(A)
10−1
105
104
10 200
0
mga884
100 Tj (°C)
IR
(nA)
103
102
75 V
25 V
typ
max
VR = 75 V
typ
0816124
0.8
0.6
0
0.4
0.2
mbg446
VR (V)
Cd
(pF)
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 6 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
8. Test information
Input signal: Reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty factor δ≤ 0.05.
Oscilloscope: Rise time tr = 0.35 ns.
(1) IR = 1 mA.
Fig 5. Reverse recovery voltage test circuit and waveforms.
trr
(1)
+ IFt
output signal
trtpt
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50 ΩIF
D.U.T.
Ri = 50 Ω
SAMPLING
OSCILLOSCOPE
mga881
Input signal: Forward pulse rise time tr = 20 ns; forward current pulse duration tp≥ 100 ns; duty factor δ≤ 0.005.
Fig 6. Forward recovery voltage test circuit and waveforms.
trt
tp
10 %
90 %
I
input
signal
RS = 50 Ω
I
Ri = 50 Ω
OSCILLOSCOPE
1 kΩ450 Ω
D.U.T.
mga882
Vfr
t
output
signal
V
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 7 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
9. Package outline
Fig 7. Package outline SOT666.
UNIT bpcDE e1HELpw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
01-01-04
01-08-27
IEC JEDEC EIAJ
mm 0.27
0.17 0.18
0.08 1.7
1.5 1.3
1.1 0.5
e
1.0 1.7
1.5 0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT666
bp
pin 1 index
D
e1
e
A
Lp
detail X
HE
E
A
S
0 1 2 mm
scale
A
0.6
0.5
c
X
123
456
Plastic surface mounted package; 6 leads SOT666
YS
wMA
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 8 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
Fig 8. Package outline SOT363 (SC-88).
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT363 SC-88
wBM
bp
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
4
56
Plastic surface mounted package; 6 leads SOT363
UNIT A1
max bpcDEe1HELpQywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
97-02-28
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 9 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
10. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Table 9: Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 10000
BAS16VV SOT666 4 mm pitch, 8 mm tape and reel - -115 -
BAS16VY SOT363 4 mm pitch, 8 mm tape and reel; T1 -115 - -135
4 mm pitch, 8 mm tape and reel; T2 -125 -165
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 10 of 12
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
11. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Order number Supersedes
BAS16VV_BAS16VY_2 20040910 Product data sheet - 9397 750 13856 BAS16VY_1
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•Type number BAS16VV added.
•Table 2 “Quick reference data”: table added.
•Table 6 “Limiting values”: maximum value of VRRM changed from 85 V to 100 V.
•Table 6 “Limiting values”: maximum value of VR changed from 75 V to 100 V.
BAS16VY_1 20030408 Product specification - 9397 750 10909 -
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
9397 750 13856 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet Rev. 02 — 10 September 2004 11 of 12
12. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 10 September 2004
Document order number: 9397 750 13856
Published in The Netherlands
Philips Semiconductors BAS16VV; BAS16VY
Triple high-speed switching diodes
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 9
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
12 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 11
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
15 Contact information . . . . . . . . . . . . . . . . . . . . 11
