Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. D1
3/10/2015
Copyright © 2015 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
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est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-
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Solution, Inc. receives written assurance to its satisfaction, that:
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IS62WV25616DALL/DBLL, IS65WV25616DBLL
256K x 16 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC SRAM
FEATURES
• High-speed access time: 35, 45, 55 ns
• CMOSlowpoweroperation
30 mW (typical) operating
6µW(typical)CMOSstandby
• TTLcompatibleinterfacelevels
• Singlepowersupply
1.65V--2.2V Vdd (IS62WV25616DALL)
2.3V--3.6V Vdd (IS62/65WV25616DBLL)
• Fullystaticoperation:noclockorrefresh
required
• Threestateoutputs
• Datacontrolforupperandlowerbytes
• IndustrialandAutomotivetemperaturesupport
• Lead-freeavailable
• 2CSoptionavailable
DESCRIPTION
TheISSIIS62WV25616DALLandIS62/65WV25616DBLL
arehigh-speed,lowpower,4MbitSRAMsorganizedas
256K words by 16 bits. It is fabricated using ISSI's high-
performanceCMOStechnology.Thishighlyreliableprocess
coupled with innovative circuit design techniques, yields
high-performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselcted) or when CS1isLOW,CS2isHIGHandboth
LB and UB are HIGH, the device assumes a standby mode
at which the power dissipation can be reduced down with
CMOSinputlevels.
Easy memory expansion is provided by using Chip Enable
andOutputEnableinputs.TheactiveLOWWriteEnable(WE)
controls both writing and reading of the memory. A data byte
allows Upper Byte (UB)andLowerByte(LB) access.
TheIS62WV25616DALLandIS62/65WV25616DBLLare
packaged in the JEDEC standard 44-PinTSOP(TYPEII)
and 48-pin mini BGA (6mmx8mm).
FUNCTIONAL BLOCK DIAGRAM
MARCH 2015
A0-A17
CS1
CS2
OE
WE
256K x 16
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
V
DD
I/O
DATA
CIRCUIT
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
UB
LB
IS62WV25616DALL/DBLL, IS65WV25616DBLL
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev. D1
3/10/2015
PIN DESCRIPTIONS
A0-A17 Address Inputs
I/O0-I/O15 DataInputs/Outputs
CS1, CS2 Chip Enable Input
OE OutputEnableInput
WE Write Enable Input
LB Lower-byteControl(I/O0-I/O7)
UB Upper-byteControl(I/O8-I/O15)
NC No Connection
Vdd Power
GND Ground
44-Pin mini TSOP (Type II)
(Package Code T)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A4
A3
A2
A1
A0
CS1
I/O0
I/O1
I/O2
I/O3
V
DD
GND
I/O4
I/O5
I/O6
I/O7
WE
A16
A15
A14
A13
A12
A5
A6
A7
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
V
DD
I/O11
I/O10
I/O9
I/O8
NC
A8
A9
A10
A11
A17
PIN CONFIGURATIONS
48- ball mini BGA (6mm x 8mm)
(Package Code B)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
LB OE A0 A1 A2 NC
I/O8UB A3 A4 CSI I/O0
I/O9I/O10 A5 A6 I/O1I/O2
GND I/O11 A17 A7 I/O3VDD
VDD I/O12 NC A16 I/O4GND
I/O14 I/O13 A14 A15 I/O5I/O6
I/O15 NC A12 A13 WE I/O7
NC A8 A9 A10 A11 NC
48-Pin mini BGA (6mm x 8mm)*
2 CS Option (Package Code B2)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
LB OE A0 A1 A2 CS2
I/O
8
UB A3 A4 CS1 I/O
0
I/O
9
I/O
10
A5 A6 I/O
1
I/O
2
GND I/O
11
A17 A7 I/O
3
VDD
VDD I/O
12
NC A16 I/O
4
GND
I/O
14
I/O
13
A14 A15 I/O
5
I/O
6
I/O
15
NC A12 A13 WE I/O
7
NC A8 A9 A10 A11 NC
*Available upon request
Integrated Silicon Solution, Inc. — www.issi.com 3
Rev. D1
3/10/2015
IS62WV25616DALL/DBLL, IS65WV25616DBLL
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter Value Unit
Vterm TerminalVoltagewithRespecttoGND –0.5toVdd + 0.5 V
Vdd VddRelatestoGND –0.3to4.0 V
tstg StorageTemperature –65to+150 °C
Pt Power Dissipation 1.0 W
Notes:
1.StressgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycausepermanentdamageto
thedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditions
above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
CAPACITANCE(1,2)
Symbol Parameter Conditions Max. Unit
Cin Input Capacitance Vin = 0V 6 pF
Ci/O Input/OutputCapacitance VOut = 0V 8 pF
Notes:
1.Testedinitiallyandafteranydesignorprocesschangesthatmayaffecttheseparameters.
2. Testconditions:T
a = 25°C, f=1MHz,Vdd = 3.3V.
TRUTH TABLE
I/O PIN
Mode WE CS1 CS2 OE LB UB I/O0-I/O7 I/O8-I/O15 VDD Current
NotSelected X H X X X X High-Z High-Z isb1, isb2
X X L X X X High-Z High-Z isb1, isb2
X X X X H H High-Z High-Z isb1, isb2
OutputDisabled H L H H L X High-Z High-Z iCC
H L H H X L High-Z High-Z iCC
Read H L H L L H dOut High-Z iCC
H L H L H L High-Z dOut
H L H L L L dOut dOut
Write L L H X L H din High-Z iCC
L L H X H L High-Z din
L L H X L L din din
IS62WV25616DALL/DBLL, IS65WV25616DBLL
4 Integrated Silicon Solution, Inc. — www.issi.com
Rev. D1
3/10/2015
AC TEST LOADS
Figure 1.
R1
5 pF
Including
jig and
scope
R2
OUTPUT
VTM
Figure 2.
AC TEST CONDITIONS
Parameter Unit Unit Unit
(2.3V-3.6V) (3.3V + 5%) (1.65V-2.2V)
InputPulseLevel 0.4VtoVdd - 0.3V 0.4V to Vdd - 0.3V 0.4V to Vdd - 0.3V
InputRiseandFallTimes 1V/ns 1V/ns 1V/ns
InputandOutputTiming VDD/2 VDD + 0.05 0.9V
andReferenceLevel(VRef) 2
OutputLoad SeeFigures1and2 SeeFigures1and2 SeeFigures1and2
R1( Ω ) 1005 1213 13500
R2( Ω ) 820 1378 10800
Vtm (V) 3.0V 3.3V 1.8V
R1
30 pF
Including
jig and
scope
R2
OUTPUT
VTM
Integrated Silicon Solution, Inc. — www.issi.com 5
Rev. D1
3/10/2015
IS62WV25616DALL/DBLL, IS65WV25616DBLL
DC ELECTRICAL CHARACTERISTICS (OverOperatingRange)
VDD = 2.3V-3.6V
Symbol Parameter Test Conditions Min. Max. Unit
VOH OutputHIGHVoltage Vdd = Min.,iOH = –1.0mA 1.8 — V
VOL OutputLOWVoltage Vdd = Min.,iOL = 2.1mA — 0.4 V
ViH Input HIGH Voltage 2.0 Vdd + 0.3 V
ViL InputLOWVoltage(1) –0.3 0.8 V
iLi InputLeakage GND≤ Vin ≤ Vdd –1 1 µA
iLO OutputLeakage GND ≤ VOut ≤ Vdd, OutputsDisabled –1 1 µA
Note:
1. ViL (min.) = –0.3V DC; ViL(min.)=–2.0VAC(pulsewidth<10ns).Not100%tested.
ViH (max.) = Vdd + 0.3V dC; ViH (max.) = Vdd + 2.0V aC(pulsewidth<10ns).Not100%tested.
DC ELECTRICAL CHARACTERISTICS (OverOperatingRange)
VDD = 3.3V + 5%
Symbol Parameter Test Conditions Min. Max. Unit
VOH OutputHIGHVoltage Vdd = Min.,iOH = –1mA 2.4 — V
VOL OutputLOWVoltage Vdd = Min.,iOL = 2.1mA — 0.4 V
ViH Input HIGH Voltage 2 Vdd + 0.3 V
ViL InputLOWVoltage(1) –0.3 0.8 V
iLi InputLeakage GND≤ Vin ≤ Vdd –1 1 µA
iLO OutputLeakage GND ≤ VOut ≤ Vdd, OutputsDisabled –1 1 µA
Note:
1. ViL (min.) = –0.3V DC; ViL(min.)=–2.0VAC(pulsewidth<10ns).Not100%tested.
ViH (max.) = Vdd + 0.3V dC; ViH (max.) = Vdd + 2.0V aC(pulsewidth<10ns).Not100%tested.
DC ELECTRICAL CHARACTERISTICS (OverOperatingRange)
VDD = 1.65V-2.2V
Symbol Parameter Test Conditions VDD Min. Max. Unit
VOH OutputHIGHVoltage iOH = -0.1mA 1.65-2.2V 1.4 — V
VOL OutputLOWVoltage iOL = 0.1mA 1.65-2.2V — 0.2 V
ViH Input HIGH Voltage 1.65-2.2V 1.4 Vdd + 0.2 V
ViL(1) InputLOWVoltage 1.65-2.2V –0.2 0.4 V
iLi InputLeakage GND≤ Vin ≤ Vdd –1 1 µA
iLO OutputLeakage GND ≤ VOut ≤ Vdd, OutputsDisabled –1 1 µA
Note:
1. ViL (min.) = –0.3V DC; ViL(min.)=–2.0VAC(pulsewidth<10ns).Not100%tested.
ViH (max.) = Vdd + 0.3V dC; ViH (max.) = Vdd + 2.0V aC(pulsewidth<10ns).Not100%tested.
IS62WV25616DALL/DBLL, IS65WV25616DBLL
6 Integrated Silicon Solution, Inc. — www.issi.com
Rev. D1
3/10/2015
POWER SUPPLY CHARACTERISTICS(1) (OverOperatingRange)
-35 -45 -55
Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Unit
iCC VddDynamicOperating Vdd = Max., Com. — 20 — 15 — 15 mA
Supply Current iOut = 0 mA, f = fmaX Ind./AutoA1 — 25 — 18 — 15
CE = ViL Auto.A3 — 30 — 25 — 25
Vin ≥ Vdd – 0.3V, or typ.(2) 10
Vin ≤ 0.4V
iCC1 Operating Vdd = Max., Com. — 3 — 3 — 3 mA
Supply Current iOut = 0 mA, f = 0 Ind./AutoA1 — 3 — 3 — 3
CE = ViL Auto.A3 — 3 — 3 — 3
Vin ≥ Vdd – 0.3V, or
Vin ≤ 0.4V
isb2 CMOSStandby Vdd = Max.,
Com.
— 5 — 5 — 5
µA
Current(CMOSInputs) CS1
≥
Vdd – 0.2V,
Ind./Auto A1
— 10 — 10
— 10
CS2
≤ 0.2V,
Auto. A3
—
30
— 30
— 30
Vin
≥
Vdd – 0.2V, or
typ.(2)
2
Vin
≤
0.2V, f = 0
OR
ULBControl Vdd=Max.,CS1 = ViL, Cs2=ViH
Vin ≤ 0.2V, f = 0; UB / LB = Vdd–0.2V
Note:
1. At f = fmaX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
2.TypicalvaluesaremeasuredatVdd=3.0V,Ta = 25oCandnot100%tested.
OPERATING RANGE (VDD)
Range Ambient Temperature VDD (45 nS) VDD (35 nS)
Commercial 0°Cto+70°C 2.3V-3.6V 3.3V+5%
Industrial –40°Cto+85°C 2.3V-3.6V 3.3V+5%
Automotive(A1) –40°Cto+85°C 2.3V-3.6V 3.3V+5%
OPERATING RANGE (VDD)
Range Ambient Temperature VDD Speed
Commercial 0°Cto+70°C 1.65V-2.2V 45ns
Industrial –40°Cto+85°C 1.65V-2.2V 55ns
Automotive –40°Cto+125°C 1.65V-2.2V 55ns
OPERATING RANGE (VDD)
Range Ambient Temperature VDD (45 nS)
Automotive(A3) –40°Cto+125°C 2.3V-3.6V
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Rev. D1
3/10/2015
IS62WV25616DALL/DBLL, IS65WV25616DBLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (OverOperatingRange)
35 ns 45 ns 55 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
trC ReadCycleTime 35 — 45 — 55 — ns
taa AddressAccessTime — 35 — 45 — 55 ns
tOHa OutputHoldTime 10 — 10 — 10 — ns
taCs1/taCs2 CS1/CS2AccessTime — 35 — 45 — 55 ns
tdOe OEAccessTime — 10 — 20 — 25 ns
tHzOe(2) OEtoHigh-ZOutput 0 10 0 15 0 20 ns
tLzOe(2) OEtoLow-ZOutput 3 — 5 — 5 — ns
tHzCs1/tHzCs2(2) CS1/CS2toHigh-ZOutput 0 10 0 15 0 20 ns
tLzCs1/tLzCs2(2) CS1/CS2toLow-ZOutput 5 — 5 — 10 — ns
tba LB, UBAccessTime — 35 — 45 — 55 ns
tHzb LB, UBtoHigh-ZOutput 0 15 0 15 0 20 ns
tLzb LB, UBtoLow-ZOutput 0 — 0 — 0 — ns
Notes:
1. Testconditionsassumesignaltransitiontimesof5nsorless,timingreferencelevelsof0.9V/1.5V,inputpulselevelsof0.4to
Vdd-0.2V/Vdd-0.3VandoutputloadingspeciedinFigure1.
2. TestedwiththeloadinFigure2.Transitionismeasured±500mVfromsteady-statevoltage.Not100%tested.
IS62WV25616DALL/DBLL, IS65WV25616DBLL
8 Integrated Silicon Solution, Inc. — www.issi.com
Rev. D1
3/10/2015
DATA VALID
PREVIOUS DATA VALID
t
AA
t
OHA
t
OHA
t
RC
DOUT
ADDRESS
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = ViL, CS2 = WE = ViH, UB or LB = ViL)
t
RC
t
OHA
t
AA
t
DOE
t
LZOE
t
ACE1/
t
ACE2
t
LZCE1/
t
LZCE2
t
HZOE
HIGH-Z DATA VALID
t
HZCS1/
t
HZCS2
ADDRESS
OE
CS1
CS2
DOUT
LB, UB
t
HZB
t
BA
t
LZB
AC WAVEFORMS
READ CYCLE NO. 2(1,3) (CS1, CS2, OE, AND UB/LB Controlled)
Notes:
1. WEisHIGHforaReadCycle.
2. Thedeviceiscontinuouslyselected.OE, CS1, UB, or LB = ViL. Cs2=WE=ViH.
3. Address is valid prior to or coincident with CS1LOWtransition.
Integrated Silicon Solution, Inc. — www.issi.com 9
Rev. D1
3/10/2015
IS62WV25616DALL/DBLL, IS65WV25616DBLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2)(OverOperatingRange)
35 ns 45 ns 55 ns
Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
twC WriteCycleTime 35 — 45 — 55 — ns
tsCs1/tsCs2 CS1/CS2toWriteEnd 25 — 35 — 45 — ns
taw AddressSetupTimetoWriteEnd 25 — 35 — 45 — ns
tHa AddressHoldfromWriteEnd 0 — 0 — 0 — ns
tsa AddressSetupTime 0 — 0 — 0 — ns
tPwb LB, UBValidtoEndofWrite 25 — 35 — 45 — ns
tPwe WEPulseWidth 25 — 35 — 40 — ns
tsd DataSetuptoWriteEnd 20 — 20 — 25 — ns
tHd DataHoldfromWriteEnd 0 — 0 — 0 — ns
tHzwe(3) WELOWtoHigh-ZOutput — 10 — 20 — 20 ns
tLzwe(3) WEHIGHtoLow-ZOutput 3 — 5 — 5 — ns
Notes:
1. Testconditionsassumesignaltransitiontimesof5nsorless,timingreferencelevelsof0.9V/1.5V,inputpulselevelsof0.4Vto
Vdd-0.2V/Vdd-0.3VandoutputloadingspeciedinFigure1.
2.
TheinternalwritetimeisdenedbytheoverlapofCS1LOW,CS2HIGHandUB or LB, and WELOW.AllsignalsmustbeinvalidstatestoinitiateaWrite,but
any one can go inactive to
terminatetheWrite.TheDataInputSetupandHoldtimingarereferencedtotherisingorfallingedgeofthesignalthatterminatesthe
write.
3. TestedwiththeloadinFigure2.Transitionismeasured±500mVfromsteady-statevoltage.Not100%tested.
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10 Integrated Silicon Solution, Inc. — www.issi.com
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AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CS1 Controlled, OE=HIGHorLOW)
DATA-IN VALID
DATA UNDEFINED
t
WC
t
SCS1
t
SCS2
t
AW
t
HA
t
PWE
tHZWE
HIGH-Z
tLZWE
t
SA
t
SD
t
HD
ADDRESS
CS1
CS2
WE
DOUT
DIN
LB, UB
t
PWB
Notes:
1. WRITEisaninternallygeneratedsignalassertedduringanoverlapoftheLOWstatesontheCS1 , CS2 and WE inputs and at
least one of the LB and UBinputsbeingintheLOWstate.
2. WRITE=(CS1) [ (LB) = (UB) ] (WE).
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IS62WV25616DALL/DBLL, IS65WV25616DBLL
AC WAVEFORMS
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
IS62WV25616DALL/DBLL, IS65WV25616DBLL
12 Integrated Silicon Solution, Inc. — www.issi.com
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DATA-IN VALID
DATA UNDEFINED
t
WC
t
SCS1
t
SCS2
t
AW
t
HA
t
PWE
t
HZWE
HIGH-Z
t
LZWE
t
SA
t
SD
t
HD
ADDRESS
OE
CS1
CS2
WE
LB, UB
DOUT
DIN
AC WAVEFORMS
WRITE CYCLE NO. 3 (WE Controlled: OEisLOWDuringWriteCycle)
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IS62WV25616DALL/DBLL, IS65WV25616DBLL
DATA UNDEFINED
t
WC
ADDRESS 1 ADDRESS 2
t
WC
HIGH-Z
t
PBW
WORD 1
LOW
WORD 2
t
HD
t
SA
t
HZWE
ADDRESS
CS1
UB, LB
WE
D
OUT
D
IN
OE
DATA
IN
VALID
t
LZWE
t
SD
t
PBW
DATA
IN
VALID
t
SD
t
HD
t
SA
t
HA t
HA
UB_CSWR4.eps
HIGH
CS2
AC WAVEFORMS
WRITE CYCLE NO. 4 (UB/LB Controlled)
IS62WV25616DALL/DBLL, IS65WV25616DBLL
14 Integrated Silicon Solution, Inc. — www.issi.com
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3/10/2015
DATA RETENTION WAVEFORM (CS1 Controlled)
V
DD
CS1 ≥ V
DD
- 0.2V
t
SDR
t
RDR
V
DR
CS1
GND
Data Retention Mode
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol Parameter Test Condition Min. Max. Unit
Vdr VddforDataRetention SeeDataRetentionWaveform 1.2 3.6 V
idr DataRetentionCurrent Vdd = 1.2V, CS1 ≥ Vdd–0.2V Com. — 3 µA
Ind. — 7
Auto. — 20
typ.(1) 1
tsdr DataRetentionSetupTime SeeDataRetentionWaveform 0 — ns
trdr RecoveryTime SeeDataRetentionWaveform trC — ns
Note: 1.TypicalvaluesaremeasuredatVdd=3.0V,Ta = 25oCandnot100%tested.
DATA RETENTION WAVEFORM (CS2 Controlled)
V
DD
CS2 ≤ 0.2V
t
SDR
t
RDR
V
DR
0.4V
CE2
GND
Data Retention Mode
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IS62WV25616DALL/DBLL, IS65WV25616DBLL
IS62WV25616DBLL (2.3V - 3.6V)
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
45 IS62WV25616DBLL-45TI TSOP
IS62WV25616DBLL-45TLI TSOP,Lead-free
45 IS62WV25616DBLL-45BI miniBGA(6mmx8mm)
IS62WV25616DBLL-45BLI miniBGA(6mmx8mm),Lead-free
55 IS62WV25616DBLL-55TLI TSOP,Lead-free
ORDERING INFORMATION
IS62WV25616DALL (1.65V-2.2V)
Commercial Range: 0°C to +70°C
Speed (ns) Order Part No. Package
70 IS62WV25616DALL-55TL TSOP,Lead-free
Industrial Range: –40°C to +85°C
Speed (ns) Order Part No. Package
55 IS62WV25616DALL-55TI TSOP
IS62WV25616DALL-55TLI TSOP,Lead-free
55 IS62WV25616DALL-55BI miniBGA(6mmx8mm)
IS62WV25616DALL-55BLI miniBGA(6mmx8mm),Lead-free
IS65WV25616DBLL (2.3V - 3.6V)
Automotive (A1) Range: –40°C to +85°C
Speed (ns) Order Part No. Package
45 IS65WV25616DBLL-45CTLA1 TSOP,Lead-free,CopperLeadframe
Automotive (A3) Range: –40°C to +125°C
Speed (ns) Order Part No. Package
55 IS65WV25616DBLL-55CTLA3 TSOP,Lead-free,CopperLeadframe
IS62WV25616DALL/DBLL, IS65WV25616DBLL
16 Integrated Silicon Solution, Inc. — www.issi.com
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2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
1. CONTROLLING DIMENSION : MM
NOTE :
Θ
Θ
06/04/2008
Package Outline
Integrated Silicon Solution, Inc. — www.issi.com 17
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IS62WV25616DALL/DBLL, IS65WV25616DBLL
2. Reference document : JEDEC MO-207
1. CONTROLLING DIMENSION : MM .
NOTE :
08/12/2008
Package Outline