99
Fast-Acting Chip Fuses
11
Fast-acting chip fuses help provide overcurrent protection
on systems using DC power sources up to 63VDC. The
fuse’s monolithic, multilayer design provides the highest
hold current in the smallest footprint, reduces diffusion-
related aging, improves product reliability and resilience,
and enhances high-temperature performance in a wide
range of circuit designs.
These RoHS-compliant surface mount devices offer
strong arc suppression characteristics and facilitate the
development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electronics.
• Small size with high-current ratings
• Excellent temperature stability
• High reliability and resilience
• Strong arc suppression characteristics
• RoHS compliant
• Halogen free
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
• Monolithic, multilayer design
• High-temperature performance
• -55°C to +125°C operating range
• Laptops
• Digital cameras
• Cell phones
Benefits Features
Applications
• Printers
• DVD players
• Portable electronics
• Game systems
• LCD monitors
• Scanners
Fast-Acting Chip Fuses
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100
11
RoHS Compliant, ELV Compliant HF Halogen Free
% of rated current Clear time at 25°C
100% 4 hours min.
250% 5 seconds max.
400% 0.05 seconds max.
Clear Time Characteristics for Fast-Acting Chip FusesTable FF1
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Fast-Acting Chip Fuses
Table FF2
0402SFF050F/24 0.50 0.380 24 35
0402SFF075F/24 0.75 0.210 24 35
0402SFF100F/24 1.00 0.120 24 35
0402SFF150F/24 1.50 0.056 24 35
0402SFF200F/24 2.00 0.035 24 35
0402SFF300F/24 3.00 0.021 24 35
0402SFF400F/24 4.00 0.014 24 35
Part Number
Rated Current
(A)
Nominal Cold DCR*
(Ω)
Voltage
(VDC)
Current
(A)
Typical Electrical
Characteristics
Max.
Interrupt Ratings
0603SFF050F/32 0.50 0.485 32 50
0603SFF075F/32 0.75 0.254 32 50
0603SFF100F/32 1.00 0.131 32 50
0603SFF150F/32 1.50 0.059 32 35
0603SFF200F/32 2.00 0.044 32 35
0603SFF250F/32 2.50 0.032 32 35
0603SFF300F/32 3.00 0.025 32 35
0603SFF350F/32 3.50 0.024 32 35
0603SFF400F/32 4.00 0.018 32 35
0603SFF500F/32 5.00 0.013 32 35
0603SFF600F/24 6.00 0.010 24 35
Part Number
Rated Current
(A)
Nominal Cold DCR*
(Ω)
Voltage
(VDC)
Current
(A)
Typical Electrical
Characteristics
Max.
Interrupt Ratings
1206SFF050F/63 0.50 0.500 63 50
1206SFF075F/63 0.75 0.330 63 50
1206SFF100F/63 1.00 0.220 63 50
1206SFF150F/63 1.50 0.120 63 50
1206SFF175F/63 1.75 0.100 63 50
1206SFF200F/63 2.00 0.050 63 50
1206SFF250F/32 2.50 0.035 32 50
1206SFF300F/32 3.00 0.031 32 50
1206SFF400F/32 4.00 0.022 32 45
1206SFF500F/32 5.00 0.015 32 45
1206SFF600F/24 6.00 0.012 24 45
1206SFF700F/24 7.00 0.011 24 45
1206SFF800F/24 8.00 0.008 24 45
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
Part Number
Rated Current
(A)
Nominal Cold DCR*
(Ω)
Voltage
(VDC)
Current
(A)
Typical Electrical
Characteristics
Max.
Interrupt Ratings
0402 (1005mm) Fast-Acting Chip Fuses
0603 (1608mm) Fast-Acting Chip Fuses
1206 (3216mm) Fast-Acting Chip Fuses
0.063
(1. 6 0)
0.039±0.004
(1.00±0.10)
0.020±0.004
(0.51±0.10)
0.010±0.004
(0.25±0.10)
0.020±0.004
(0.51±0.10)
S
Shape and
Dimensions
Inch (mm)
Recommended
Pad Layout
Inch (mm)
0.028
(0.70)
0.024
(0.60)
0.016
(0.40)
0
Shape and
Dimensions
Inch (mm)
Recommended
Pad Layout
Inch (mm)
0.031±0.006
(0.80±0.15)
0
0.031±0.006
(0.80±0.15)
0.014±0.006
(0.36±0.15)
0.063±0.006
(1. 6 0±0.15)
0
0.110
(2.80)
0.039
(1.00)
0.043
(1. 0 9)
0.024
(0.60)
0
Shape and
Dimensions
Inch (mm)
Recommended
Pad Layout
Inch (mm)
0.063±0.008
(1. 6 0±0.20) 0.126±0.008
(3.20±0.20)
0.043±0.008
(1. 10±0.20)
0.020±0.010
(0.51±0.25)
0.173
(4.40)
0.071
(1. 8 0)
0.057
(1. 4 5)
0.059
(1. 5 0)
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101
Fast-Acting Chip Fuses
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RoHS Compliant, ELV Compliant HF Halogen Free
Family Performance CurvesFigure FF1-FF6
0.1 10110 0
Clear-Time (s)
10
1
0.1
0.01
0.001
Current (A)
0402SFF Average Time Current Curves
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.2A
E = 1.5A
F = 2.0A
G = 2.5A
H = 3.0A
I = 4.0A
ABC
DE
F
G
HI
0.001 0.01 0.1 1 10
10 00
10 0
10
1
0.1
0.01
0.001
I²t (A²s)
Time (s)
0402SFF I²t vs. t Curves
A = 0.5A
B = 0.75A
C = 1.0A
D = 1.5A
E = 2.0A
F = 3.0A
G = 4.0A
A
B
C
D
E
F
G
Figure FF2Figure FF1
10
1
0.1
0.01
0.001
10.1 10 10 0
Current (A)
Clear-Time (s)
0603SFF Average Time Current Curves
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.5A
E = 2.0A
F = 2.5A
G = 3.0A
H = 3.5A
I = 4.0A
J = 5.0A
K = 6.0A
A B C D E FGHIJK
0.001 0.01 0.1 1 10
10 000
10 00
10 0
10
1
0.1
0.01
0.001
I²t (A²s)
Time (s)
0603SFF I²t vs. t Curves
B
C
D
E
F
G
H
I
J
K
A = 0.5A
B = 0.75A
C = 1.0A
D = 1.5A
E = 2.0A
F = 2.5A
G = 3.0A
H = 3.5A
I = 4.0A
J = 5.0A
K = 6.0A A
Figure FF4Figure FF3
Note: Curves are nominal
Note: Curves are nominal
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102
11
RoHS Compliant, ELV Compliant HF Halogen Free
Family Performance Curves
... Cont’d
Figure FF1-FF6
0.1 10110 0
Clear-Time (s)
10
1
0.1
0.01
0.001
Current (A)
1206SFF Average Time Current Curves
AB CDEFGHIJKLM
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.5A
E = 1.7A
F = 2.0A
G = 2.5A
H = 3.0A
I = 4.0A
J = 5.0A
K = 6.0A
L = 7.0A
M = 8.0A
I²t (A²s)
10 000
10 00
10 0
10
1
0.1
0.01
0.001
Time (s)
1206SFF I²t vs. t Curves
0.001 0.01 0.1 1 10
A
B
C
D
E
F
G
H
I
J
K
L
M
A = 0.5A
B = 0.75A
C = 1.0A
D = 1.5A
E = 1.75A
F = 2.0A
G = 2.5A
H = 3.0A
I = 4.0A
J = 5.0A
K = 6.0A
L = 7.5A
M = 8.0A
Figure FF6Figure FF5
Operating temperature -55°C to +125°C
Mechanical vibration Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Mechanical shock Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Thermal shock Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Resistance to soldering heat Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Solderability Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Moisture resistance Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Salt spray Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
Construction body material Ceramic
Termination material Silver, Nickel, Tin
Fuse element Silver
% De-rating
105
10 0
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
Maximum Operating Temperature (˚C)
-55 -35 -15 5 25 45 65 85 105 125 145
Temperature Effect on Current Rating
Environmental Specifications for Fast-Acting Chip FusesTable FF3
Material Specifications for Fast-Acting Chip FusesTable FF4
Thermal Derating Current for Fast-Acting Chip FusesFigure FF7
Note: Curves are nominal
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Fast-Acting Chip Fuses
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RoHS Compliant, ELV Compliant HF Halogen Free
Insulation resistance after opening
20,000Ωminimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower -
post-clearing insulation values. Under normal fault conditions values. Under normal fault conditions
Raychem fuses provide sufficient insulation resistance for circuit protection.
Current carrying capacity Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
0402 (1005) 10,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper 55
0603 (1608) 4,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Plastic 55
1206 (3216) 3,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Plastic 55
Electrical Specifications for Fast-Acting Chip FusesTable FF5
Packaging Information for Fast-Acting Chip FusesTable FF6
Range
Performance Testing Method Min. Max.
MVR ASTM D1238 3.60 4.40
Vicat softening temperature ASTM D1525 97.8 -
Elasticity at break ASTM D638 50.0 -
Tape and Reel Material Characteristics for Fast-Acting Chip FusesTable FF7
Tape and Reel Specifications for Fast-Acting Chip FusesTable FF8
Size
Reel Quantity
(pcs) Reel Diameter Reel Width
Carrier
Tape Size Tape Type
Reels per Outside
Shipment Box
Outside Shipment
Boxes per Overpack
Dimension in inches (mm)
Mark 0402 (1005) 0603 (1608) 1206 (3216)
E10.069±0.004 (1.75±0.10) 0.069±0.004 (1.75±0.10) 0.069±0.004 (1.75±0.10)
F 0.138±0.002 (3.50±0.05) 0.138±0.002 (3.50±0.05) 0.138±0.002 (3.50±0.05)
W 0.318±0.004 (8.00±0.10) 0.318±0.004 (8.00±0.10) 0.318±0.004 (8.00±0.10)
P10.079±0.004 (2.00±0.10) 0.157±0.004 (4.00±0.10) 0.157±0.004 (4.00±0.10)
P00.157±0.004 (4.00±0.10) 0.157±0.004 (4.00±0.10) 0.157±0.004 (4.00±0.10)
P20.040±0.002 (1.00±0.05) 0.079±0.002 (2.00±0.05) 0.079±0.002 (2.00±0.05)
D00.059±0.004 (1.50+0.10/-0.00) 0.059±0.004 (1.50+0.10/-0.00) 0.059±0.004 (1.50+0.10/-0.00)
D1-- - - 0.039 max (1.00 max)
t 0.009±0.001 (0.23±0.02) 0.009±0.001 (0.23±0.02) 0.009±0.001 (0.23±0.02)
A00.026±0.004 (0.67±0.10) 0.036±0.004 (0.92±0.10) 0.071±0.004 (1.80±0.10)
B00.046±0.004 (1.17±0.10) 0.071±0.004 (1.80±0.10) 0.138±0.004 (3.50±0.10)
K00.025±0.004 (0.63±0.10) 0.033±0.004 (0.85±0.10) 0.050±0.004 (1.27±0.10)
Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s.
Recommended Soldering Temperature Profile for Fast-Acting Chip FusesFigure FF8
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11
RoHS Compliant, ELV Compliant HF Halogen Free
Part Numbering System for Fast-Acting Chip Fuses
1206 SF F 400 F / 24 -2
Packaging
-2 = Tape and Reel
Voltage Rating (V)
Special Code
F = RoHS Compliant
M = Marked
Rated Current
050 =0.50 Amps
400 =4Amps
Fuse Blow Type
F = Fast Acting
S = Slow Blow
H = High Current
SF = SurfaceMount Fuse
Size (1206, 0603, 0402)
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and
test each product selected for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the
information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Tyco Electronics’ Standard Terms and
Conditions of Sale for this product, and in no case willTyco Electronics be liable for any incidental, indirect, or consequential damages arising from
the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition,Tyco Electronics reserves the right
to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer.
Taped Component Dimensions for Fast-Acting Chip FusesFigure FF9
P0
E1
F
W
P2
D0
D1
A0
P1
B0
K0
t
Reel Dimensions for Fast-Acting Chip FusesFigure FF10
Dimension
Description Mark Dimensions (mm)
Hub outer diameter B 60
Reel inside width W19
Reel outside width W211.4
Tape width 8
B
W2
W1
Agency Approvals for Fast-Acting Chip Fuses
UL File # E197536
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