81
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
Lead-Free/Green SP724
General Purpose ESD Protection - SP724 Series
Description
Features
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t &4%$BQBCJMJUZQFS)#.4UBOEBSET
- IEC 61000-4-2, Direct Discharge .......... 8kV (Level 4)
- IEC 61000-4-2, Air Discharge ...............15kV (Level 4)
- MIL STD 3015.7 ................................................ >8kV
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to +20V (Single-Ended Voltage), and ±10V (Differential
Voltage)
t 1FBL$VSSFOU$BQBCJMJUZ
- IEC 61000-4-5 (8/20μs) ....................................... ±3A
- Single Pulse, 100μs Pulse Width ..................... ±2.2A
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Applications
The SP724 is a quad array of transient voltage clamping
circuits designed to suppress ESD and other transient over-
voltage events. The SP724 is used to help protect sensitive
digital or analog input circuits on data, signal, or control
lines operating on power supplies up to 20VDC.
The SP724 is comprised of bipolar SCR/diode structures
to protect up to four independent lines by clamping
transients of either polarity to the power supply rails. The
SP724 offers very low leakage (1nA Typical) and low input
capacitance (3pF Typical). Additionally, the SP724 is rated
to withstand the IEC 61000-4-2 ESD specification for both
contact and air discharge methods to level 4.
The SP724 is connected to the sensitive input line and its
associated power supply lines. Clamping action occurs
during the transient pulse, turning on the diode and fast
triggering SCR structures when the voltage on the input
line exceeds one VBE threshold above the V+ supply (or one
VBE threshold below the V- supply). Therefore, the SP724P
operation is unaffected by poor power supply regulation or
voltage fluctuations within its operating range.
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Input Protection
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Protection
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Pinout
Functional Block Diagram
2
V+
V-
IN
3, 4 AND 6
IN
1
5
I/O I/OV+
I/O I/OV–
654
123
SP724
(SOT-23)
TOP VIEW
Notes:
1. The design of the SP724 SCR/Diode ESD Protection Arrays are covered by Littelfuse
patent 4567500.
2. The full ESD capability of the SP724 is achieved when wired in a circuit that includes
connection to both the V+ and V- pins. When handling individual devices, follow proper
procedures for electrostatic discharge.
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS Pb GREEN
SP724 Series 3pF 8kV Diode Array
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
82
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
General Purpose ESD Protection - SP724 Series
Absolute Maximum Ratings
Parameter Rating Units
Continuous Supply Voltage, (V+) - (V-) +20 V
Forward Peak Current, IIN to VCC , GND
(Refer to Figure 5) ±2.2, 100μs A
Electrical Characteristics TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified
Thermal Information
Parameter Rating Units
Thermal Resistance (Typical, Note 3) JA
oC/W
SOT Package 220 oC/W
Maximum Storage Temperature Range -65 to 150 oC
Maximum Junction Temperature 150 oC
Maximum Lead Temperature
(Soldering 20-40s) (SOT - Lead Tips Only) 260 oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Note: 3. JA is measured with the component mounted on an evaluation PC board in free air.
Parameter Symbol Test Conditions Min Typ Max Units
Operating Voltage Range,
VSUPPLY = [(V+) - (V-)] (Notes 4, 5) VSUPPLY 1 - 20 V
Forward Voltage Drop
Forward Voltage Drop
IN to V- VFWDL IIN = 1A (Peak Pulse) - 2 - V
IN to V+ VFWDH -2- V
Input Leakage Current IIN -10 1 10 nA
Quiescent Supply Current IQUIESCENT V+ = 20V, V- = GND - - 100 nA
Equivalent SCR ON Threshold (Note 6) - 1.1 - V
Equivalent SCR ON Resistance VFWD/IFWD (Note 6) - 1.0 - Ω
Input Capacitance CIN -3-pF
Notes:
4. In automotive and other battery charging systems, the SP724 power supply lines should be externally protected for load dump and reverse battery. When the V+ and V- Pins are connected
to the same supply voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP724
supply pins to limit reverse battery current to within the rated maximum limits.
5. Bypass capacitors of typically 0.01μF or larger should be connected closely between the V+ and V- Pins for all applications.
6. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance. These characteristics are given here for information to determine peak current and
dissipation under EOS conditions.
Note:
ESD Ratings and Capability - See Figure 1, Table 1
Typical Application of the SP724
+VCC
INPUT
DRIVERS
SP724 INPUT PROTECTION CIRCUIT (1 OF 4 SHOWN)
OR
SIGNAL
SOURCES
IN 1, 3, 4 AND 6
SP724
V-
TO +VCC
LINEAR OR
DIGITAL IC
INTERFACE
V+
+VCC
0.001μF
Application as an Input Clamp for Over-voltage, Greater than 1VBE
Above V+ or less than -1VBE below V-)
83
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
Lead-Free/Green SP724
General Purpose ESD Protection - SP724 Series
ESD Capability
ESD rating is dependent on the defined test standard. The
evaluation results for various test standards and methods
based on Figure 1 are shown in Table 1.3
The SP724 has a Level 4 rating when tested to the IEC
61000-4-2 Human Body Model (HBM) standard and
connected in a circuit in which the V+ and V- pins have
a return path to ground. Level 4 specifies a required
capability greater than 8kV for direct discharge and greater
than 15kV for air discharge.
The “Modified” MIL-STD-3015.7 condition is defined as an
“in-circuit” method of ESD testing, the V+ and V- pins have
a return path to ground.The SP724 ESD capability is greater
than 8kV with 100pF discharged through 1.5kΩ. By strict
definition of the standard MIL-STD-3015.7 method using
“pin-to-pin” device testing, the ESD voltage capability is
greater than 2kV.
For the SP724 EIAJ IC121 Machine Model (MM) standard,
the ESD capability is typically greater than 1.8kV with
200pF discharged through 0kΩ.
The Charged Device model is based upon the self-
capacitance of the SOT-23 package through 0kΩ.
Standard Type/Mode RDCD±VD
IEC 61000-4-2
(Level 4)
HBM, Air Discharge 330 Ω 150pF 15kV
HBM, Direct Discharge 330 Ω 150pF 8kV
MIL-STD-3015.7 Modified HBM 1.5k Ω 100pF 8kV †
Standard HBM 1.5k Ω 100pF 2kV
EIAJ IC121 Machine Model 0k Ω 200pF 400V
US ESD DS 5.3 Charged Device
Model 0k Ω NA 3kV
H.V.
SUPPLY
VD
IN
DUT
CD
R1
IEC 1000-4-2: R150 to 100M
RD
CHARGE
SWITCH
DISCHARGE
SWITCH
MIL STD 3015.7: R
1
1 to 10M
†Upper limit of laboratory test set.
600 800 1000 1200
200
160
120
80
40
0
SINGLE PULSE
TA = 25°C
FORWARD SCR VOLTAGE DROP (mV)
FORWARD SCR CURRENT (mA)
5
4
3
2
1
0
TA = 25°C
SINGLE PULSE
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
FORWARD SCR VOLTAGE DROP (V)
0123
FORWARD SCR CURRENT (A)
Figure 1: Electrostatic Discharge Test
Table 1: ESD Test Conditions
Figure 3: High Current SCR Forward Voltage Drop CurveFigure 2: Low Current SCR Forward Voltage Drop Curve
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
84
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
General Purpose ESD Protection - SP724 Series
Peak Transient Current Capability for Long Duration Surges
The peak transient current capability is inversely
proportional to the width of the current pulse. Testing was
done to fully evaluate the SP724’s ability to withstand long
duration current pulses using the circuit of Figure 4. Figure
5 shows the point of overstress as defined by increased
leakage in excess of the data sheet published limits.
The safe operating range of the transient peak current
should be limited to no more than 75% of the measured
overstress level for any given pulse width as shown in the
curve of Figure 5.
The test circuit of Figure 4 is shown with a positive pulse
input. For a negative pulse input, the (-) current pulse input
goes to an SP724 ‘IN’ input pin and the (+) current pulse
input goes to the SP724 V- pin. The V+ to V- supply of the
SP724 must be allowed to float. (i.e., It is not tied to the
ground reference of the current pulse generator.)
Note that two input pins of the SP724 may be paralleled to
improve current (and ESD) capability. The sustained peak
current capability is increased to nearly twice that of a
single pin.
+
-CURRENT
SENSE
VOLTAGE
PROBE
+
-
R1 ~ 10 TYPICAL
SP724
VX
VX ADJ. 10V/A TYPICAL
R1
(-)
(+)
C1 ~ 100 μF
C1
VARIABLE TIME DURATION
CURRENT PULSE GENERATOR
123
654
0.001 0.01 0.1 1 10
7
6
5
4
3
2
1
0
100 1000
8
SQUARE WAVE PULSE WIDTH (ms)
PEAK CURRENT (A)
NOTE: TO ENSURE SAFE OPERATION LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN.
TA = 25ºC
V+ TO V-SUPPLY = 15V
Showing the Measured Point of Overstress in Amperes vs
pulse width time in milliseconds
Figure 5: SP724 Typical Nonrepetitive Peak Current
Pulse Capability
Figure 4: Typical SP724 Peak Current Test Circuit
with a Variable Pulse Width Input
85
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
Lead-Free/Green SP724
General Purpose ESD Protection - SP724 Series
Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
PreheatPrehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
L
to
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
Package SOT23-6
Pins 6
JEDEC MO-178
Millimeters Inches Notes
Min Max Min Max
A0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b0.350 0.500 0.0138 0.0196 -
C0.080 0.220 0.0031 0.009 -
D2.800 3.000 0.11 0.118 3
E2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L0.100 0.600 0.004 0.023 4,5
N666
a 1 1 -
M2.590 0.102 -
O0.690 .027 TYP -
P0.990 .039 TYP -
R0.950 0.038 -
O
P
R
M
Recommended Solder Pad Layout
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
86
TVS Diode Arrays (SPA
Family of Products)
Revision: March 20, 2012
SP724 Lead-Free/Green Series
General Purpose ESD Protection - SP724 Series
Part Numbering System
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Product Characteristics
Ordering Information
Part Number Temp.
Range (ºC)
Package Marking Min.
Order
Qty.
SP724AHTG -40 to 105 Tape and Reel 724G 3000
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
2.0mm
4.0mm
C
L
1.7 5mm
1.5mm
DIA. HOLE
8mm
4.0mm
8.4mm
180mm
14.4mm
13mm
60mm
ACCESS HOLE
USER DIRECTION OF FEED PIN 1
SOT-23 (8mm POCKET PITCH)
Package Type
Tape and Reel
SP AH T
“Green
RoHS Compliant
G
724
AH: SOT-23
Series
Silicon Protection
Array (SPA
TM
)
Family of
TVS Diode Arrays
Notes:
1. All dimensions are in millimeters.
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.