PC713VxNSZXF
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC713V)
2. Approved by VDE, DIN EN60747-5-2(∗) (as an
option), file No. 40008189 (as model No. PC713V)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. Home appliances
2. Programmable controllers
3. Personal computer peripherals
■ Applications
DIP 6 pin Includes Base Terminal
Connection Photocoupler
1. 6 pin DIP package
2. Double transfer mold package (Ideal for Flow
Soldering)
3. With base terminal
4. High collector-emitter voltage (VCEO:80V)
5. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
6. RoHS directive compliant
■ Description
PC713VxNSZXF Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 6 pin DIP, available in SMT
gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
1
Sheet No.: D2-A04302FEN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC713VxNSZXF Series
■ Internal Connection Diagram
Anode
Cathode
NC
Emitter
1
1
2
3
4
Collector
5
Base
6
2
6
5
3 4
2
Sheet No.: D2-A04302FEN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC713VxNSZXF] 2. Through-Hole (VDE option) [ex. PC713VxYSZXF]
3. SMT Gullwing Lead-Form [ex. PC713VxNIPXF]4. SMT Gullwing Lead-Form (VDE option)
[ex. PC713VxYIPXF]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
PC713V
SHARP
mark
"S"
Anode
mark
Date code
Factory
identification mark
Rank mark
7.12±0.3
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
Rank mark
4
VDE
Identification mark
Anode
mark
PC713V
SHARP
mark
"S"
Date code
Factory
identification mark
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
Rank mark
PC713V
SHARP
mark
"S"
Date code
Anode
mark
Factory
identification mark
7.12±0.5
7.62±0.3
Epoxy resin
Rank mark
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
4
VDE
Identification mark
Anode
mark
1 2 3
6 5 4
PC713V
SHARP
mark
"S"
Date code
VDE
Identification mark
Factory
identification mark
PC713VxNSZXF Series
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.35gProduct mass : approx. 0.35g
Product mass : approx. 0.36gProduct mass : approx. 0.36g
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
3
repeats in a 20 year cycle
Sheet No.: D2-A04302FEN
Rank mark
Refer to the Model Line-up
PC713VxNSZXF Series
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please Contact the local SHARP sales reprsentative to see the actual status of
the production.
Factory identification mark
Sheet No.: D2-A04302FEN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Collector-base breakdown voltage
Emitter-base breakdown voltage
Current transfer ratio
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
MIN.
−
−
−
80
6
2.5
−
5×1010
−
−
−
−
TYP.
1.2
30
−
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
250
100
−
−
−
30
0.2
−
1.0
−
18
18
Unit
V
V
pF
nA
V
V
mA
V
Ω
pF
kHz
µs
µs
Symbol
VF
Ct
ICEO
BVCEO
BVCBO
BVEBO
IC
VCE (sat)
fC
tr
tf
RISO
Cf
Response time Rise time
Fall time
Input
Output
IF=20mA
V=0, f=1kHz
Reverse current −−10 µAIRVR=4V
Peak forward voltage −−3.0 VVFM IFM=0.5A
VCE=50V, IF=0
IC=0.1mA, IF=0
IC=0.1mA, IF=0
IE=10µA, IF=0
IF=5mA, VCE=5V
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
VCE=5V, IC=2mA, RL=100Ω −3dB
IF=20mA, IC=1mA
80
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation
Reverse voltage
mW
V
Output
Collector-emitter voltage
V
Emitter-collector voltage
Collector-base voltage
Emitter-base voltage
V
V
V
Collector current mA
Collector power dissipation
mW
*2 Isolation voltage
Operating temperature
Total power dissipation
˚C
mW
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VR
VCEO
VECO
VCBO
VEBO
IC
PC
Viso (rms)
Topr
Ptot
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Rating
50
1
70
6
80
6
80
6
50
150
−25 to +100
170
−40 to +125
260
5kV
4
PC713VxNSZXF Series
Sheet No.: D2-A04302FEN
■ Model Line-up
Rank mark
with or without
A
B
C
A or B
B or C
A, B or C
PC713V0NSZXF
PC713V1NSZXF
PC713V2NSZXF
PC713V3NSZXF
PC713V5NSZXF
PC713V6NSZXF
PC713V8NSZXF
PC713V0YSZXF
PC713V1YSZXF
PC713V2YSZXF
PC713V3YSZXF
PC713V5YSZXF
PC713V6YSZXF
PC713V8YSZXF
−−−−−− Approved
PC713V0NIZXF
PC713V1NIZXF
PC713V2NIZXF
PC713V3NIZXF
PC713V5NIZXF
PC713V6NIZXF
PC713V8NIZXF
PC713V0YIZXF
PC713V1YIZXF
PC713V2YIZXF
PC713V3YIZXF
PC713V5YIZXF
PC713V6YIZXF
PC713V8YIZXF
PC713V0NIPXF
PC713V1NIPXF
PC713V2NIPXF
PC713V3NIPXF
PC713V5NIPXF
PC713V6NIPXF
PC713V8NIPXF
PC713V0YIPXF
PC713V1YIPXF
PC713V2YIPXF
PC713V3YIPXF
PC713V5YIPXF
PC713V6YIPXF
PC713V8YIPXF
Lead Form
Package
Model No.
DIN EN60747-5-2
Sleeve Taping
Through-Hole
50pcs / sleeve 1 000pcs / reel
SMT Gullwing
−−−−−− Approved −−−−−− Approved
IC [mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
4.0 to 13.0
6.5 to 20.0
4.0 to 20.0
5
Please contact a local SHARP sales representative to inquire about production status.
PC713VxNSZXF Series
Sheet No.: D2-A04302FEN
0
30
0 100 125
40
50
60
20
10
Forward current IF (mA)
-25 25 50 55 75
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs. Ambient
Temperature
0
0 125
100
200
50
150
25 50 75 100
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
−25
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
50˚C 25˚C
0˚C
0 0.5 1 1.5 2 2.5 3 3.5
10
100
1
Forward voltage VF (V)
Forward current IF (mA)
−25˚C
Ta=75˚C
Fig.6 Forward Current vs. Forward Voltage
Duty ratio
0.01
0.1
1
10
1
Peak forward current IFM (A)
10−310−210−1
Pulse width≤100µs
Ta=25˚C
Fig.5 Peak Forward Current vs. Duty Ratio
Fig.4 Total Power Dissipation vs. Ambient
Temperature
6
PC713VxNSZXF Series
Total power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
50
00255075100 125
−25
100
150
170
200
250
Diode power dissipation P (mW)
100
80
70
60
40
20
0025 5575100 125
−25
Ambient temperature Ta (˚C)
50
Sheet No.: D2-A04302FEN
7
250−25 50 75
10−10
100
10−9
10−8
10−7
10−6
10−5
10−11
Ambient temperature Ta (˚C)
Collector dark current I
CEO
(A)
VCE=50V
RBE=∞
Fig.11 Collector Dark Current vs. Ambient
Temperature
Fig.12 Collector-base Dark Current vs.
Ambient Temperature
100
0
50
150
05075100−25 25
Ambient temperature Ta (˚C)
Relative current transfer ratio (%)
IF=5mA
VCE=5V
RBE=∞
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0.02
0.04
0.06
0.08
0.1
0.12
0.14
020406080100
Ambient temperature Ta(˚C)
Collector-emitter saturation voltage VCE(sat) (V)
−25
IF=20mA
IC=1mA
RBE=∞
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
10−9
10−8
10−10
10−11
2505075100 125
Ambient temperature Ta (˚C)
Collector dark current ICBO (A)
VCB=50V
RBE=∞
PC713VxNSZXF Series
0
200
1
40
80
120
160
180
140
100
60
20
10
Forward current IF (mA)
Current transfer ratio CTR (%)
RBE=∞
500kΩ
100kΩ
VCE=5V
Ta=25˚C
Fig.7 Current Transfer Ratio vs. Forward
Current
0
0
5
30
123456789
10
15
20
25
20mA
10mA
5mA
Collector current IC (mA)
Collector-emitter voltage VCE (V)
IF=30mA RBE=∞
Ta=25˚C
PC (MAX.)
Fig.8 Collector Current vs. Collector-
emitter Voltage
Sheet No.: D2-A04302FEN
8
−20
0
1
−10
10010
Voltage gain Av (dB)
Frequency f (kHz)
RL=10kΩ1kΩ
100Ω
VCE=5V
IC=2mA
RBE=∞
Ta=25˚C
Fig.15 Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.16 Test Circuit for Frequency Response
VCC
RL
Output
RD
VCE
Please refer to the conditions in Fig.15
PC713VxNSZXF Series
0.1
1
0.1 1 10
10
100
Load resistance RL (kΩ)
Response time (µs)
td
ts
tf
tr
VCE=2V
IC=2mA
RBE=∞
Ta=25˚C
Fig.13 Response Time vs. Load Resistance Fig.14 Test Circuit for Response Time
90%
10%
Output
Input
RL
Input Output
VCE
Please refer to the conditions in Fig.13
VCC
RD
tdts
trtf
Sheet No.: D2-A04302FEN
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
2.542.54
1.7
2.2
8.2
(Unit : mm)
● Design guide
■ Design Considerations
PC713VxNSZXF Series
Sheet No.: D2-A04302FEN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC713VxNSZXF Series
Sheet No.: D2-A04302FEN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
● Presence of ODC
11
PC713VxNSZXF Series
Sheet No.: D2-A04302FEN
■ Package specification
12
12.0
6.7
5.8
10.8
520
±2
PC713VxNSZXF Series
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
Sheet No.: D2-A04302FEN
13
● Tape and Reel package
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC713VxNSZXF Series
PC713VxNSZXF Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
14
Sheet No.: D2-A04302FEN
■ Important Notices
[E218]
