DSPIC30F4011-30I/P - MICROCHIP - Datasheet.Directory

dsPIC30F4011/4012

Data Sheet

High-Performance,

16-Bit Digital Signal Controllers

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

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IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defen d, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC32 logo, rfPIC and UNI/O are registered trademarks of

Microchip Te chnology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified

logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,

TSHARC, UniWinDriver, WiperLock and ZENA are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-60932-713-2

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:200 2 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in Calif ornia

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microper ipher als, nonvol ati le memo ry and

analog product s. In addition, Microchip ’s quality system for th e design

and manufacture of development systems is ISO 9001:2000 certified.

dsPIC30F4011/4012

High-Performance, Modified RISC CPU:

• Modified Harvard architecture

• C compiler optimized instruction set architecture

with flexible addressi ng modes

• 83 base instructions

• 24-bit wide instructions, 16-bit wide data path

• 48 Kbytes on-chip Flash program space

(16K instruction words)

• 2 Kbytes of on-chip data RAM

• 1 Kbyte of nonvolatile data EEPROM

• Up to 30 MIPS operation:

- DC to 40 MHz externa l clock input

- 4 MHz-10 MHz oscillator input with

PLL active (4x, 8x, 16x)

• 30 interrupt sources:

- Three external interrupt sources

- Eight user-selectable priority levels for each

interrupt source

- Four processor trap sources

• 16 x 16-bit working register array

DSP Engine Features:

• Dual data fetch

• Accumulator write-back for DSP operations

• Modulo and Bit-Reversed Addressing modes

• Two, 40-bit wide accumulators with optional

saturation logic

• 17-bit x 17-bit single-cycle hardware

fractional/inte ger multiplier

• All DSP instructions are single cycle

• ±16-bit, single-cycle shift

Peripheral Features:

• High-current sink/source I/O pins: 25 mA/25 mA

•Timer module with programmable prescaler:

- Five 16-bi t timers/counters; optionally pair

16-bit timers into 32-bit timer modules

• 16-bit Capture input functions

• 16-bit Compare/PWM output functions

• 3-wire SPI modules (supports 4 Frame modes)

•I

2C™ module supports Multi-Master/Slave mode

and 7-bit/10-bit addressing

• Two UART modules with FIFO Buffers

• CAN module, 2.0B compliant

Motor Control PWM Module Features:

• Six PWM output channels:

- Complementary or Independent Output

modes

- Edge and Center-Aligned modes

• Three duty cycle generators

• Dedicated time base

• Programmable output polarity

• Dead-time control for Complementary mode

• Manual output control

• Trigger for A/D conversions

Quadrature Encoder Interface Module

Features:

• Phase A, Phase B and Index Pulse input

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-bit Timer/Counter mode

• Interrupt on position counter rollover/underflow

Analog Features:

• 10-bit Analog-to-Digital Converter (ADC) with

four Sample and Holde (S&H) inputs:

- 1 Msps conversion rate

- Nine input channels

- Conversion available during Sleep and Idle

• Programmable Brown-out Reset

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

High-Performance, 16-Bit Digital Signal Controllers

dsPIC30F4011/4012

Special Digital Signal Controller

Features:

• Enhanced Flash program memory:

- 10,000 erase/write cycl e (min.) for

industrial temperature rang e, 100K (typical)

• Data EEPROM memory:

- 100,000 erase/write cycle (min.) for

industrial temperature range, 1M (typical)

• Self-reprogrammable under software control

• Power-on Reset (POR), Power-up Timer (PWR T)

and Oscillator Start-up Timer (OST)

• Flexible Watchdog Timer (WDT) with on-chip,

low-power RC oscillator for reliable operation

• Fail-Safe Clock Monitor operation detects clock

failure and switches to on-chip, low-power

RC oscillator

• Programmable code protection

• In-Circuit Serial Programming™ (ICSP™)

• Selectable Power Management modes:

- Sleep, Idle and Alternate Clock modes

CMOS Technology:

• Low-power, high-speed Flash technology

• Wide operating voltage range (2.5V to 5.5V)

• Industrial and Extended temperature ranges

• Low-power consumption

dsPIC30F Motor Control and Power Conversion Family

Device Pins Program

Mem. Bytes/

Instructions

SRAM

Bytes EEPROM

Bytes Timer

16-bit Input

Cap

Output

Comp/Std

PWM

Motor

Control

PWM

10-bit A/D

1 Msps Quad

Enc

UART

SPI

I2C™

CAN

dsPIC30F4012 28 48K/16K 2048 1024 5 4 2 6 ch 6 ch Yes 1 1 1 1

dsPIC30F4011 40/44 48K/16K 2048 1024 5 4 4 6 ch 9 ch Yes 2 1 1 1

dsPIC30F4011/4012

Pin Diagrams

AN7/RB7

AN6/OCFA/RB6

C1RX/RF0

C1TX/RF1

OC3/RD2

EMUC2/OC1/IC1/INT1/RD0

AN8/RB8

dsPIC30F4011

MCLR

VDD

VSS

EMUD2/OC2/IC2/INT2/RD1

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSC2/CLKO/RC15

OSC1/CLKI

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3H/RE5

AVDD

AVSS

OC4/RD3

VSS

VDD

SCK1/RF6

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

PWM3L/RE4

VDD

U2RX/CN17/RF4

U2TX/CN18/RF5

AN4/QEA/IC7/CN6/RB4

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

AN5/QEB/IC8/CN7/RB5

FLTA/INT0/RE8

VSS

AN3/INDX/CN5/RB3

40-Pin PDIP

PGD/EMUD/U1TX/SDO1/SCL/RF3

SCK1/RF6

EMUC2/OC1/IC1/INT1/RD0

OC3/RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

VSS

OC4/RD3

EMUD2/OC2/IC2/INT2/RD1

FLTA/INT0/RE8

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

AVSS

PWM1L/RE0

PWM1H/RE1

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

VSS

C1RX/RF0

C1TX/RF1

U2RX/CN17/RF4

U2TX/CN18/RF5

PGC/EMUC/U1RX/SDI1/SDA/RF2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

44-Pin TQFP

dsPIC30F4011

PWM2L/RE2

dsPIC30F4011/4012

Pin Diagrams (Continued)

44-Pin QFN(1)

330

232

dsPIC30F4011

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

C1RX/RF0

C1TX/RF1

U2RX/CN17/RF4

U2TX/CN18/RF5

PGC/EMUC/U1RX/SDI1/SDA/RF2

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

PGD/EMUD/U1TX/SDO1/SCL/RF3

SCK1/RF6

EMUC2/OC1/IC1/INT1/RD0

OC3/RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

OC4/RD3

EMUD2/OC2/IC2/INT2/RD1

FLTA/INT0/RE8

VSS

AVSS

VDD

VSS

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

VSS

NC 12

Note 1: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.

dsPIC30F4011/4012

Pin Diagrams (Continued)

dsPIC30F4012

MCLR

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5VSS

VDD

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AVDD

AVSS

AN2/SS1/CN4/RB2

EMUD2/OC2/IC2/INT2/RD1 EMUC2/OC1/IC1/INT1/RD0

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 VSS

OSC2/CLKO/RC15

OSC1/CLKI VDD

FLTA/INT0/SCK1/OCFA/RE8

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

AN5/QEB/IC8/CN7/RB5

AN4/QEA/IC7/CN6/RB4

AN3/INDX/CN5/RB3

28-Pin SPDIP and SOIC

44-Pin QFN(1)

330

232

dsPIC30F4012

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

FLTA/INT0/SCK1/OCFA/RE8

EMUC2/OC1/IC1/INT1/RD0

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD2/OC2/IC2/INT2/RD1

VDD

VSS

AVSS

VDD

VSS

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

VSS

NC 14

13 44

Note 1: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.

dsPIC30F4011/4012

Table of Content s

1.0 Device Overview .......................................................................................................................................................................... 9

2.0 CPU Architecture Overview........................................................................................................................................................ 17

3.0 Memory Organization................................................................................................................................................................. 25

4.0 Address Generator Units............................................................................................................................................................ 37

5.0 Interrupts.................................................................................................................................................................................... 43

6.0 Flash Program Memory.............................................................................................................................................................. 49

7.0 Data EEPROM Memory............................................................................................................................................................. 55

8.0 I/O Ports..................................................................................................................................................................................... 61

9.0 Timer1 Module ........................................................................................................................................................................... 67

10.0 Timer2/3 Module ........................................................................................................................................................................ 71

11.0 Timer4/5 Module ....................................................................................................................................................................... 77

12.0 Input Capture Module................................................................................................................................................................. 81

13.0 Output Compare Module..................................................................................... ....................................................................... 85

14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 91

15.0 Motor Control PWM Module....................................................................................................................................................... 97

16.0 SPI™ Module ........................................................................................................................................................................... 109

17.0 I2C™ Module ........................................................................................................................................................................... 113

18.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 121

19.0 CAN Module............................................................................................................................................................................. 129

20.0 10-bit, High-Speed Analog-to-Digital Converter (ADC) Module ............................................................................................... 139

21.0 System Integration ................................................................................................................................................................... 151

22.0 Instruction Set Summary.......................................................................................................................................................... 165

23.0 Develo pment Support............................................................................................................................................................... 173

24.0 Electrical Characteristics.......................................................................................................................................................... 177

25.0 Packaging Information.............................................................................................................................................................. 219

The Microchip Web Site..................................................................................................................................................................... 235

Customer Change Notification Service.............................................................................................................................................. 235

Customer Support.............................................................................................................................................................................. 235

Reader Response.............................................................................................................................................................................. 236

Product Identification System............................................................................................................................................................. 237

TO OUR VALUED CUSTOMERS

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enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via

E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We

welcome your feedback.

Most Current Data Sheet

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http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

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Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of

silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

using.

Customer Notific at ion Syst em

dsPIC30F4011/4012

1.0 DEVICE OVERVIEW

This document contains device-specific information for

the dsPIC30F4011/4012 devices. The dsPIC30F

devices contain extensive Digital Signal Processor

(DSP) functionality within a high-performance, 16-bit

microcontroller (MCU) architecture. Figure 1-1 and

Figure 1-2 illustrate device block diagrams for the

dsPIC30F4011 and dsPIC30F40 12 devices.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Programmer’s Reference Manual”

(DS70157).

dsPIC30F4011/4012

FIGURE 1-1: dsPIC30F4011 BLOCK DIAGRAM

AN8/RB8

Power-up

Timer

Oscillator

S t art-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode and

Control

OSC1/CLKI

MCLR

, V

AN4/QEA/IC7/CN6/RB4

UART1,

SPI1 Motor Control

PWM

Timing

Generation

CAN

AN5/QEB/IC8/CN7/RB5

PCH

PCL

Program Counter

ALU<16>

Address Latch

Program Memory

(48 Kbytes)

Data Latch

X Data Bus

C™

QEI

AN6/OCFA/RB6

AN7/RB7

PCU

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

10-bit ADC

Timers

PWM3H/RE5

FLTA/INT0/RE8

U2TX/CN18/RF5

SCK1/RF6

Input

Capture

Module

Output

Compa re

Module

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

PORTB

C1RX/RF0

C1TX/RF1

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

PORTF

PORTD

16 16

16 x 16

W Reg Array

Divide

Unit

Engine

DSP

Decode

ROM Lat ch

Y Data Bus

Effect ive Addr ess

X RAGU

X WAG U

Y AGU

EMUD3/AN0/V

REF

+/CN2/RB0

EMUC3/AN1/V

REF

-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

OSC2/CLKO/RC15

U2RX/CN17/RF4

, AV

UART2

PORTC

PORTE

Interrupt

Controller PSV & Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data LatchData Latch

Y Data

(1 Kbyte)

RAM X Data

(1 Kbyte)

RAM

Address

Latch Address

Latch

Control Signals

to Various

EMUC2/OC1/IC1/INT1/RD0

EMUD2/OC2/IC2/INT2/RD1

OC3/RD2

OC4/RD3

Data EEPROM

(1 Kbyte)

Blocks

dsPIC30F4011/4012

FIGURE 1-2: dsPIC30F4012 BLOCK DIAGRAM

Power-up

Timer

Oscillator

S t art-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode and

Control

OSC1/CLKI

MCLR

, V

AN4/QEA/IC7/CN6/RB4

UART1,

SPI1, Motor Control

PWM

Timing

Generation

CAN

AN5/QEB/IC8/CN7/RB5

PCH PCL

Program Counter

ALU<16>

Address Latch

Program Memory

(48 Kbytes)

Data Latch

X Data Bus

C™

QEI

PCU

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

10-bit ADC

Timers PWM3H/RE5

FLTA/INT0/SCK1/OCFA/RE8

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

PORTB

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

PORTF

PORTD

16 16

16 x 16

W Reg Array

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bus

Effective Address

X RAGU

X WAGU

Y AGU EMUD3/AN0/V

REF

+/CN2/RB0

EMUC3/AN1/V

REF

-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

OSC2/CLKO/RC15

, AV

UART2

PORTC

PORTE

Interrupt

Controller PSV & Table

Data Acces s

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data LatchData Latch

Y Data

(1 Kbyte)

RAM X Data

(1 Kbyte)

RAM

Address

Latch Address

Latch

Control Signals

to Various

EMUC2/OC1/IC1/INT1RD0

EMUD2/OC2/IC2/INT2/RD1

Data EEPROM

(1 Kbyte)

SPI2

Blocks

dsPIC30F4011/4012

Table 1-1 provides a brief description of the de vice I/O

pinout and the functions that are multiplexed to a port

pin. Multiple functions may exist on one port pin. When

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-1: dsPIC30F4011 I/O PIN DESCRIPTIONS

Pin Name Pin

Type Buffer

Type Description

AN0-AN8 I Analo g Analog input channels. AN0 and AN1 are also used for device programming

data and clock inputs, respectively.

AVDD P P Positive supply for analog module. This pin must be conne cted at all times.

AVSS P P Ground reference for analog module. This pin must be connected at all times.

CLKI

CLKO I

OST/CMOS

—External clock source input. Always associated with OSC1 pin function.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7

CN17-CN18 I ST Input change notification inputs. Can be software programmed for internal

weak pull-ups on all inputs.

C1RX

C1TX I

OST

—CAN1 bus receive pin.

CAN1 bus transmit pin.

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Primary Communication Channel data input/o utput pin.

ICD Primary Communication Channel clock input/ou tput pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel cloc k input/output pin.

IC1, IC2, IC7,

IC8 I ST Capture inputs 1, 2, 7 and 8.

INDX

QEA

QEB

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase B input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

INT0

INT1

INT2

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

—

PWM Fault A input.

PWM1 low output.

PWM1 high output.

PWM2 low output.

PWM2 high output.

PWM3 low output.

PWM3 high output.

MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an

active-low Reset to the device.

OCFA

OC1-OC4 I

OST

—Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 through 4.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F4011/4012

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator crystal input. ST buffer when configured in RC mode; CMOS

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC I/O

IST

ST In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB8 I/O ST PORTB is a bidirectional I/O port.

RC13-RC15 I/O ST PORTC is a bidirectional I/O port.

RD0-RD3 I/O ST PORTD is a bidirectional I/O port.

RE0-RE5,

RE8 I/O ST PORTE is a bidirectional I/O port.

RF0-RF6 I/O ST PORTF is a bidirectional I/ O port.

SCK1

SDI1

SDO1

SS1

I/O

—

Synchronous serial clock input/output for SPI1.

SPI1 data in.

SPI1 data out.

SPI1 slave synchronization.

SCL

SDA I/O

I/O ST

ST Synchronous serial clock input/output for I2C™.

Synchronous serial data input/output for I2C.

SOSCO

SOSCI O

I—

ST/CMOS 32 kHz low-power oscillator crystal output.

32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherwise.

T1CK

T2CK I

IST

ST Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

U2RX

U2TX

—

UART1 receive.

UART1 transmit.

UART1 alternate receive.

UART1 alternate transmit.

UART2 receive.

UART2 transmit.

VDD P — Positive supply for logic and I/O pins.

VSS P — Gro und reference for logic and I/O pins.

VREF+ I Analog Analog voltage reference (high) input.

VREF- I Analog Analog voltage reference (low) in put.

TABLE 1-1: dsPIC30F4011 I/O PIN DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F4011/4012

Table 1-2 provides a brief description of the de vice I/O

pinout and the functions that are multiplexed to a port

pin. Multiple functions may exist on one port pin. When

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-2: dsPIC30F4012 I/O PIN DESCRIPTIONS

Pin Name Pin

Type Buffer

Type Description

AN0-AN5 I Analo g Ana log input channels. AN0 and AN1 are also used for device programming

data and clock inputs, respectively.

AVDD P P Positive supply for analog module. This pin must be conne cted at all times.

AVSS P P Ground reference for analog module. This pin must be connected at all times.

CLKI

CLKO I

OST/CMOS

—External clock source input. Always associated with OSC1 pin function.

Oscillator crystal output. Connects to crystal or resonator in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7 I ST Input change notification inputs. Can be software programmed for internal

weak pull-ups on all inputs.

C1RX

C1TX I

OST

—CAN1 bus receive pin.

CAN1 bus transmit pin.

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Primary Communication Channel data input/o utput pin.

ICD Primary Communication Channel clock input/ou tput pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel cloc k input/output pin.

IC1, IC2, IC7,

IC8 I ST Capture inputs 1, 2, 7 and 8.

INDX

QEA

QEB

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase B input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

INT0

INT1

INT2

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

—

PWM Fault A input.

PWM1 low output.

PWM1 high output.

PWM2 low output.

PWM2 high output.

PWM3 low output.

PWM3 high output.

MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an

active-low Reset to the device.

OCFA

OC1, OC2 I

OST

—Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 and 2.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F4011/4012

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator crystal input. ST buffer when configured in RC mode; CMOS

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC I/O

IST

ST In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB5 I/O ST PORTB is a bidirectional I/O port.

RC13-RC15 I/O ST PORTC is a bidirectional I/O port.

RD0-RD1 I/O ST PORTD is a bidirectional I/O port.

RE0-RE5,

RE8 I/O ST PORTE is a bidirectional I/O port.

RF2-RF3 I/O ST PORTF is a bidirectional I/ O port.

SCK1

SDI1

SDO1

SS1

I/O

—

Synchronous serial clock input/output for SPI1.

SPI1 Data In.

SPI1 Data Out.

SPI1 Slave Synchronization

SCL

SDA I/O

I/O ST

ST Synchronous serial clock input/output for I2C™.

Synchronous serial data input/output for I2C.

SOSCO

SOSCI O

I—

ST/CMOS 32 kHz low-power oscillator crystal output.

32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherwise.

T1CK

T2CK I

IST

ST Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

—

UART1 receive.

UART1 transmit.

UART1 alternate receive.

UART1 alternate transmit.

VDD P — Positive supply for logic and I/O pins.

VSS P — Gro und reference for logic and I/O pins.

VREF+ I Analog Analog voltage reference (high) input.

VREF- I Analog Analog voltage reference (low) in put.

TABLE 1-2: dsPIC30F4012 I/O PIN DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

2.0 CPU ARCHITECTURE

OVERVIEW

2.1 Core Overview

The core has a 24-bit instruction word. The Program

Counter (PC) is 23 bits wide with the Least Sign ificant

bit (LSb) always clear (see Section 3.1 “Program

Address Space”), and the Most Significant bit (MSb)

is ignored during normal program execution, except for

certain specialized instructions. Thus, the PC can

address up to 4M instruction words of user program

space. An instruction prefetch mechanism is used to

help maintain throughput. Program loop constructs,

free from loop count management overhead, are

supported using the DO an d REPEAT instructions, both

of which are interruptible at any point.

The working register array consists of 16x16-bit

registers, each of which can act as data, address or off-

set registers. One working register (W15) ope rates as

a software Stack Pointer for interrupts and calls.

The data space is 64 Kbytes (32K words) and is split into

two blocks, referred to as X and Y data memory. Each

block has its own independ ent Address Generation Unit

(AGU). Most instructions operate solely through the X

memory, AGU, which provides the appearance of a sin-

gle, unified data space. The Multiply-Accumulate (MAC)

class of dual source DSP instructions operate through

both the X and Y AGUs, splitti ng the data address space

into two parts (see Section 3.2 “Data Address

Space”). The X and Y data space boundary is device-

specific and cannot be altered by the user. Each data

word consists of 2 bytes, and most instructions can

address data ei ther as wo rds or bytes.

There are two methods of accessing data stored in

program memory:

• The upper 32 Kbytes of data sp ace memory can be

mapped into the lower half (user sp ace) of program

space at any 16K program word boundary, defined

by the 8-bit Program Space Visibility Page (PSV-

PAG) register. This lets any instructio n access pro-

gram space as if it were dat a space, with a

limitation that the a ccess requires an additiona l

cycle. Moreover, only the lower 16 bits of each

instruction word can be accessed using this

method.

• SWWLinear indirect access of 32K word pages

within program space is also possible, using any

working register via table read and write instruc-

tions. Table read and write instructions can be

used to access all 24 bits of an instruction word.

Overhead-free circular buffers (Modulo Addressing)

are supported in both X and Y address spaces. This is

primarily intended to remove the loop overhead for

DSP algorithms.

The X AGU also supports Bit-Reversed Addressing on

destination effective addresses, to greatly simplify input

or output data reordering for radix-2 FFT algorithms.

Refer to Section 4.0 “Address Generator Units” for

details on Modulo and Bit-Reversed Addressing.

The core supports Inherent (no operand), Relative, Lit-

eral, Memory Direct, Register Di rect, Register Indirect,

Instructions are associated with predefined addressing

modes, depending upon their functional requi rements.

For most instructions, the core is capable of executing

a data (or program data) memory read, a working reg-

ister (data) read, a data memory write and a program

(instruction) memory read per instruction cycle. As a

result, 3-operand instructions are supported, allowing

C = A + B operations to be executed in a single cycle.

A DSP engine has been included to significantly

enhance the core arithmetic capability and throughput.

It features a high-speed, 17-bit by 17-bit multiplier, a

40-bit ALU, two 40-bit saturating accumulators and a

40-bit bidirectional barrel shifter. Data in the accumula-

tor, or any working register, can be shifted up to 16 bits

right or 16 bits left in a single cycle. The DSP instruc-

tions operate seamlessly with all other instructions and

have been designed for optimal real-time performance.

The MAC class of instructions can concurrently fetch

two data operands from memory, while multiplying two

W registers. To enable this concurrent fetchin g of data

operands, the data space has been split for these

instructions and is linear for all others. This has been

achieved in a transparent and flexible manner by

dedicating certain working registers to each address

space for the MAC class of instructions.

The core does not support a multi-stage instruction

pipeline. However, a single-stage instruction prefetch

mechanism is used, which accesses and partially

decodes instructions a cycle ahead of execution in order

to maximize available execution time. Most instructions

execute in a single cycle with certain exceptions.

The core features a vectored exception processing

structure for traps and interrup ts, with 62 indepen dent

vectors. The exceptions consist of up to 8 traps (of

which 4 are reserved) and 54 interrupts. Each interrupt

is prioritized based on a user-assigned priority between

1 and 7 (1 being the lowest priority and 7 being the

highest) in conjunction with a predetermined ‘natural

order’. Trap s have fixed priorities, ranging from 8 to 15.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

dsPIC30F4011/4012

2.2 Programmer ’s Model

The programmer’s model is shown in Figure 2-1 and

consists of 16x16-bit working registers (W0 through

W15), 2x40-bit accumulators (ACCA and ACCB),

STATUS register (SR), Data Table Page register

(TBLPAG), Program Space Visibility Page register

(PSVPAG), DO and REPEAT registers (DOSTART,

DOEND, DCOUNT and RCOUNT) and Program Coun-

ter (PC). The working registers can act as data,

address or offset registers. All registers are memory

mapped. W0 acts as the W register for file register

addressing.

Some of these registers have a shado w register asso-

ciated with each of them, as shown in Figure 2-1. The

shadow register is used as a temporary holding register

and can transfer its contents to or from its host register

upon the occurrence of an event. None of the shado w

registers are accessible directly. The following rules

apply for transfer of registers into and out of shadows.

•PUSH.S and POP.S

W0, W1, W2, W3, SR (DC, N, OV, Z and C bits

only) are transferred.

•DO instruction

DOSTART, DOEND, DCOUNT shadows are

pushed on loop start and popped on loop end.

When a byte operation is performed on a working

mapped working registers is that both the Least and

Most Significant Bytes can be manipulated through

byte wide data memory space accesses.

2.2.1 SOFTWARE STACK POINTER/

FRAME POINTER

The dsPIC Digital Signal Controllers contain a software

stack. W15 is the dedicated software Stack Pointer

(SP) and is automatically modified by exception pro-

cessing and subroutine calls and returns. However,

W15 can be referenced by any instruction in th e same

manner as all other W registers. This simplifies the

reading, writing and manipulation of the Stack Pointer

(e.g., creating stack frames).

W15 is initialized to 0x0800 during a Reset. The user

may reprogram the SP during initialization to any

location within data space.

W14 has been dedica ted as a Stack Frame Pointer as

defined by the LNK and ULNK instructions. However,

W14 can be referenced by any instruction in th e same

manner as all other W registers.

2.2.2 STATUS REGISTER

The dsPIC DSC core has a 16-bit ST A TUS register (SR),

the Least Significant Byte of which is referred to as the

SR Low Byte (SRL) and the Most Significant Byte as the

SR High Byte (SRH). See Figure 2-1 for SR layout.

SRL contains all the DSP ALU operation Status flags

(including the Z bit), as well as the CPU Interrupt Prior-

ity Level Status bits, IPL<2:0>, and the Repeat Active

Status bit, RA. During exception processing, SRL is

concatenated with the MSB of the PC to form a

complete word value which is then stacked.

The upper byte of the SR register contains the DSP

Adder/Subtracter Status bits, the DO Loop Active bit

(DA) and the Digit Carry (DC) Status bit.

2.2.3 PROGRAM COUNTER

The Program Counter is 23 bits wide. Bit 0 is always

clear; therefore, the PC can address up to 4M

instruction words.

Note: In order to protect against misaligned

stack accesses, W15<0> is always clear.

dsPIC30F4011/4012

FIGURE 2-1: dsPIC30F4011/4012 PROGRAMMER’S MODEL

TABPAG

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

STATUS Register

Working Registers

DSP Operand

Registers

W10

W11

W12/DSP Offset

W13/DSP Write-Back

W14/Frame Pointer

W15/Stack Pointer

DSP Address

Registers

AD39 AD0AD31

DSP

Accumulators ACCA

ACCB

PSVPAG

7 0Program Space Visibility Page Address

OA OB SA SB

RCOUNT

15 0REPEAT Loop Counter

DCOUNT

15 0DO Loop Counter

DOSTART

22 0 DO Loop Start Address

IPL2 IPL1

SPLIM Stack Pointer Limit Register

AD15

SRL

PUSH.S Shadow

DO Shadow

OAB SAB

15 0 Core Configuration Register

Legend

CORCON

DA DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

DO Loop End Address

DOEND

dsPIC30F4011/4012

2.3 Divide Support

The dsPIC DSCs feature a 16/16-bit signed fractional

divide operation, as well as 32/16-bit and 16/16-bit

signed and unsigned integer divide operations, in the

form of single instruction iterative divides. The following

instructions and data sizes are supported:

1. DIVF – 16/16 signed fractional divide

2. DIV.sd – 32/16 signed divide

3. DIV.ud – 32/16 unsigned divide

4. DIV.s – 16/16 signed divide

5. DIV.u – 16/16 unsigned divide

The divide instructions must be executed within a

REPEAT loop. Any other form of execution (e.g. a series

of discrete divide instructions) will not function correctly

because the instruction flow depends on RCOUNT. The

divide instruction does not automatically set up the

RCOUNT value and it must, therefore, be explicitly and

correctly specified in the REPEAT instruction, as shown in

Table 2-1 (REPEAT executes the target instruction

{operand value + 1} times). The REPEAT loop count must

be set up for 18 iterations of the DIV/DIVF instruction.

Thus, a complete divide operation requires 19 cycles.

TABLE 2-1: DIVIDE INSTRUCTIONS

2.4 DSP Engine

The DSP engine consists of a high-speed, 17-bit x

17-bit multiplier, a barrel shifter and a 40-bit adder/

subtracter (with two target accumulators, round and

saturation logic).

The dsPIC30F devices have a single instruction flow

which can execute either DSP or MCU instructions.

Many of the hardware resources are shared between

the DSP and MCU instructions. For example, the

instruction set has both DSP and MCU multiply

instructions which use the same hardware multiplier.

The DSP engine also has the capability to perform

inherent accumulator-to-accumulator operations which

require no additional data. These instructions are ADD,

SUB and NEG.

The DS0 engine has various option s selected through

various bits in the CPU Core Configuration register

(CORCON), as listed below:

1. Fractional or integer DSP multiply (IF).

2. Signed or unsigned DSP multiply (US).

3. Conventional or convergent rounding (RND).

4. Automatic saturation on/off for ACCA (SATA).

5. Automatic saturation on/off for ACCB (SATB).

6. Automatic saturation on/off for writes to data

memory (SATDW).

7. Accumulator Saturation mode selection

(ACCSAT).

A block diagram of the DSP engine is shown in

Figure 2-2.

Note: The divide flow is interruptible. However,

the user needs to save the context as

appropriate.

Instruction Function

DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1

DIV.sd Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

DIV.s Signed divide: Wm/Wn → W0; Rem → W1

DIV.ud Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

DIV.u Unsigned divide: Wm/Wn → W0; Rem → W1

Note: For CORCON layout, see Table 3-3.

TABLE 2-2: DSP INSTRUCTION

SUMMARY

Instruction Algebraic Operatio n

CLR A = 0

ED A = (x – y)2

EDAC A = A + (x – y)2

MAC A = A + (x * y)

MOVSAC No change in A

MPY A = x * y

MPY.N A = – x * y

MSC A = A – x * y

dsPIC30F4011/4012

FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM

Zero Backfill

Sign-Extend

Barrel

Shifter

40-bit Accumulator A

40-bit Accumulator B Round

Logic

X Data Bus

To/From W Array

Adder

Saturate

Negate

16 16

40 40

Y Data Bus

Carry/Borrow Out

Carry/Borrow In

Multiplier/Scaler

17-bit

dsPIC30F4011/4012

2.4.1 MULTIPLIER

The 17x17-bit multiplier is capable of signed or

unsigned operation and can multiplex its output using a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. Unsigned operands are zero-extende d

into the 17th bit of the multiplier input value. Signed

operands are sign-extended into the 17th bit of the mul-

tiplier input value. The output of the 17x17-bit multiplier/

scaler is a 33-bit value, which is sign-extended to

40 bits. Integer data is inherently represented as a

signed two’s complement value, where the MSB is

defined as a sign bit. Generally speaking, the ran ge of

an N-bit two’s complement integer is -2N-1 to 2N-1 – 1.

For a 16-bit integer, the data range is -32768 (0x8000)

to 32767 ( 0x7FFF), includin g 0. For a 32-bit i nteger , the

data range is -2,147,483,648 (0x8000 0000) to

2,147,483,645 (0x7FFF FFFF).

When the multiplier is configured for fractional multipli-

cation, the data is represented as a two’s complement

fraction, where the MSB is defined as a sign bit and the

radix point is implied to lie just after the sign bit

(QX format). The range of an N-bit two’s complement

fraction with this i mplied radix point is -1.0 to (1-21-N).

For a 16-bit fraction, the Q15 data range is -1.0

(0x8000) to 0.999969482 (0x7FFF), including 0, and

has a precision of 3.01518x10-5. In Fractional mode, a

16x16 multiply operation generates a 1.31 product,

which has a pre c i s i o n of 4.65661x 1 0-10.

The same multiplier is used to support the DSC multiply

instructions, which include integer 16-bit signed,

unsigned and mixed sign multiplies.

The MUL instruction may be directed to use byte or

word-sized operands. Byte operands direct a 16-bit

result, and word operands direct a 32-bit result to the

specified register(s) in the W array.

2.4.2 DATA ACCUMULATORS AND

ADDER/SUBTRACTER

The data accumulator consists of a 40-bit adder/

subtracter with automatic sign extension logic. It

can select one of two accumulators (A or B) as its

pre-accumulation source and post-accumulation desti-

nation. For the ADD and LAC instructions, the data to be

accumulated or loaded can be optionally scaled via the

barrel shifter, prior to accumulation.

2.4.2.1 Adder/Subtracter, Overflow and

Saturation

The adder/subtracter is a 40- bit a dder w ith an option al

zero input into one side and either true or complement

data into the other input. In the case of addition, the

carry/borrow input is active-high and the other input is

true data (not complemented), whereas in the case of

subtraction, the carry/borrow input is a ctive-low and the

other input is complemented. The adder/subtracter

generates Overflow Status bits, SA/SB and OA/OB,

which are latched and reflected in the ST A TUS register .

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits are not identical to each other.

The adder has an additional saturation block which

controls accumulator data saturation, if selected. It

uses the result of the adder, the Overflow Status bits

described above, and the SATA/B (CORCON<7:6>)

and ACCSAT (CORCON<4>) mode control bits to

determine when and to what value to sa turate.

Six STATUS register bits have been provided to

support saturation and overflow; they are:

1. OA: ACCA overflowed into guard bits.

2. OB: ACCB overflowed into guard bits.

3. SA: ACCA saturated (bit 31 overflow and

saturation).

ACCA overflowed into guard bits and saturated

(bit 39 overflow and saturation).

4. SB: ACCB saturated (bit 31 overflow and

saturation).

ACCB overflowed into guard bits and saturated

(bit 39 overflow and saturation).

5. OAB: Logical OR of OA and OB.

6. SAB: Logical OR of SA and SB.

The OA and OB bits are modified each time data

passes through the adder/subtracter. When set, they

indicate that the most recent ope ration has overflowed

into the accumulator guard bits (bits 32 through 39).

Also, the OA and OB bits can optionally generate an

arithmetic warning trap when set and the

corresponding Overflow Trap Flag Enable bit (OVATE,

OVBTE) in the INTCON1 register (refer to Section 5.0

“Interrupts”) is set. This allows the user to take

immediate action, for example, to correct system gain.

dsPIC30F4011/4012

The SA and SB bits are modified each time data passes

through the adder/subtracter but can only be clea red by

the user. When set, they indicate that the accumulator

has overflowed its maximum range (bit 31 for 32-bit

saturation or bit 39 for 40-bit saturation ) and is saturated

(if saturation is enabled). When saturation is not

enabled, SA and SB default to bit 39 overflow and thus

indicate that a cat astrophic overflow has occurred. If the

COVTE bit in the INTCON1 register is set, SA and SB

bits ge nerate an arithmetic warning trap wh en saturation

is disabled.

The overflow and saturation Status bits can optionally

be viewed in the STATUS register (SR) as the logical

OR of OA and OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). This allows programmers to check

one bit in the STATUS register to determine if either

accumulator has overflowed, or one bit to determin e if

either accumulator has saturated. This would be useful

for complex number arithmetic which typically uses

both the accumulators.

The device supports three Saturation and Overflow

modes:

1. Bit 39 Overflow and Saturation:

When bit 39 overflow and saturation occurs, the

saturation logic loads the maximally positive 9.31

(0x7FFFFFFFFF) or maximally negative 9.31

value (0x8000000000) into the target

accumulator. The SA or SB bit is set and

remains set until cleared by the user. This is

referred to as ‘super saturation’ and provides

protection against erroneous data or unexpected

algorithm problems (e.g., gain calculations).

2. Bit 31 Overflow and Saturation:

When bit 31 overflow and saturation occurs, the

saturation logic then loads the maximally posi-

tive 1.31 value (0x007FFFFFFF) or maximally

negative 1.31 value (0x0080000000) into the

target accumulator. The SA or SB bit is set and

remains set until cleared by the user. When this

Saturation mode is in effect, the guard bits are not

used (so the OA, OB or OAB bit s are never set).

3. Bit 39 Catastroph i c Ov erflow

The bit 39 overflow Status bit from the adder is

used to set the SA or SB bit, which remain set

until cleared by the user . No saturation operation

is performed and the accumula tor is allowed to

overflow (destroying its sign). If the COVTE bit in

the INTCON1 register is set, a catastrophic

overflow can initiate a trap exception.

2.4.2.2 Accumulator ‘Write-Back’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the accumulator that is not targeted by the instruction

into data space memory. The write is performed across

the X bus into combined X and Y address space. The

following addressing modes are supported:

1. W13, Register Direct:

The rounded contents of the non-target

accumulator are written into W13 as a

1.15 fraction.

2. [W13]+ = 2, Register Indirect with Post-Increment:

The rounded contents of the non-target accumu-

lator are written into the address pointed to by

W13 as a 1.15 fraction. W13 is then

incremented by 2 (for a word write).

2.4.2.3 Round Logic

The round logic is a combinational block, which per-

forms a conventional (biased ) or convergent (unbiased)

round function during an accumulator write (store). The

Round mode is determined by the state of the RND bit

in the CORCON register. It generates a 16-bit, 1.15 data

value which is passed to the data space write saturation

logic. If rounding is not indicated by the instruction, a

truncated 1.15 data value is stored and the least

significant word is simply discarded.

Conventional rounding takes bit 15 of the accumulator,

zero-extends it and adds it to the ACCxH word (bits 16

through 31 of the accumulator). If the ACCxL word (bits

0 through 15 of the accumulator) is between 0x8000

and 0xFFFF (0x8000 included), ACCxH is incre-

mented. If ACCxL is between 0x0000 and 0x7FFF,

ACCxH is left unchanged. A consequence of this algo-

rithm is that over a succession of random rounding

operations, the value tends to be biased slightly

positive.

Convergent (or unbiased) rounding operates in the

same manner as conventi onal rounding, except when

ACCxL equals 0x8000. If this is the case, the LSb

(bit 16 of the accumulator) of ACCxH is examined. If it

is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not

modified. Assuming that bit 16 is effectively random in

nature, this scheme removes any rounding bias that

may accumulate.

The SAC and SAC.R instructions store either a trun-

cated (SAC) or rounded (SAC.R) version of the contents

of the target accumulator to data memory, via the X bus

(subject to data saturation, see Section 2.4.2.4 “Data

Space Write Saturation”). Note that for the MAC class

of instructions, the accumulator write-back operation

functions in the same manner, addressing combined

DSC (X and Y) data space though the X bus. For this

class of instructions, the data is always subject to

rounding.

dsPIC30F4011/4012

2.4.2.4 Data Space Write Saturation

In addition to adder/subtracter saturation, writes to data

space may also be saturated, but without affecting the

contents of the source accumulator . The data space write

saturation logic block accepts a 16-bit, 1.15 fractional

value from the round logic block as its input, together with

overflow status from the original source (accumulator)

and the 16-bit round adder. These are combined and

used to select the appropriate 1.15 fractional value as

output to write to data space memory.

If the SATDW bit in th e CORCON register is set, data

(after rounding or truncation) is tested for overflow and

adjusted accordingly. For input data greater than

0x007FFF, data written to memory is forced to the max-

imum positive 1.15 value, 0x7FFF. For input data less

than 0xFF8000, data written to memory is forced to the

maximum negative 1.15 value, 0x8000. The MSb of the

source (bit 39) is used to determine the sign of the

operand being tested.

If the SATDW bit in the CORCON register is not set, the

input data is always passed through unmodified under

all conditions.

2.4.3 BARREL SHIFTER

The barrel shifter is capable of performing up to 16-bit

arithmetic or logic right shifts, or up to 16-bit left shifts

in a single cycle. The source can be either of the two

DSP accumulators or the X bus (to support multi-bit

shifts of register or memory data).

The shifter requires a signed binary value to determine

both the magnitude (number of bits) and direction of the

shift operation. A positive value shifts the operand right.

A negative value shifts the operand left. A value o f ‘0’

does not modify the operand.

The barrel shifter is 40 bits wide, thereby obtaining a

40-bit result for DSP shift operations and a 16-bit result

for MCU shift operations. Data from the X bus is

presented to the barrel shifter between bit positions 16

to 31 for right shifts, and bit positions 0 to 15 for left

shifts.

dsPIC30F4011/4012

3.0 MEMORY ORGANIZATION

3.1 Program Address Space

The program address space is 4M instruction words. It

is addressable by the 23-bit PC, table instruction

Effective Address (EA) or data space EA, when

program space is mapped into data space as defined

by Table 3-1. Note that the program space address is

incremented by two between successive program

words in order to provide compatibility with data space

addressing.

User program space access is restricted to the lower

4M instruction word address range (0x000000 to

0x7FFFFE) for all accesses other than TBLRD/TBLWT,

which use TBLP AG<7> to determine user or configura-

tion space access. In Table 3-1, read/write instructions,

bit 23 allows access to the De vice ID, the User ID an d

the Configuration bits; otherwise, bit 23 is always clear .

FIGURE 3-1:

PROGRAM SPACE

MEMORY MAP FOR

dsPIC30F4011/4012

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Reset – Target Address

User Memory

Space

000000

00007E

000002

000080

Device Configuration

User Flash

Program Memory

008000

007FFE

Configuration Memory

Space

Data EEPROM

(16K instructions)

(1 Kbyte)

800000

F80000

Registers F8000E

F80010

DEVID (2) FEFFFE

FF0000

FFFFFE

Reserved F7FFFE

Reserved

7FFC00

7FFBFE

(Read ‘0’s)

8005FE

800600

UNITID (32 instr.)

8005BE

8005C0

Reset – GOTO Instruction

000004

Reserved

7FFFFE

Reserved

000100

0000FE

000084

Alternate Vector Table

Reserved

Interrupt Vector Table Vector Tables

dsPIC30F4011/4012

TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION

FIGURE 3-2: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

Access Type Access

Space Program Space Address

<23> <22:16> <15> <14:1> <0>

Instruction Access User 0PC<22:1> 0

TBLRD/TBLWT User

(TBLPAG<7> = 0)TBLPAG<7:0> Data EA<15:0>

TBLRD/TBLWT Configuration

(TBLPAG<7> = 1)TBLPAG<7:0> Data EA<15:0>

Program Space Visibility User 0PSVPAG<7:0> Data EA<14:0>

0Program Counter

23 bits

PSVPAG Reg

8 bits

15 bits

Program

Using

Select

TBLPAG Reg

8 bits

16 bits

Using

Byte

24-bit EA

1/0

Select

User/

Configuration

Table

Instruction

Program

Space

Counter

Using

Space

Select

Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.

Visibility

dsPIC30F4011/4012

3.1.1 DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

This architecture fetches 24-bit wide program memory.

Consequently, instructions are always aligned. How-

ever, as the architecture is modified Harva rd, data can

also be present in program space.

There are two methods by which program space can

be accessed; via special table instructions, or through

the remapping of a 16K word program space page into

the upper half of data space (see Section 3.1.2 “Data

Access From Program Memory Using Program

Space Visibility”). The TBLRDL and TBLWTL instruc-

tions offer a direct method of reading or writing the least

significant word (lsw) of any address within program

space, without going through data space. The TBLRDH

and TBLWTH instructions are the only method whereby

the upper 8 bits of a program space word can be

accessed as data.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two, 16-bit

word-wide address spaces, residing side by side, each

with the same address range. TBLRDL and TBLWTL

access the space which contains the least significant

data word, and TBLRDH and TBLWTH access the space

which contains the Most Significant Byte of data.

Figure 3-2 illustrates how the EA is created for table

operations and data space accesses (PSV = 1). Here,

P<23:0> refers to a program space word, whereas

D<15:0> refers to a data space word.

A set of table instructions i s provided to move byte or

word-sized data to and from program space (see

Figure 3-3 and Figure 3-4).

1. TBLRDL: Table Read Low

Word: Read the lsw of the program address;

P<15:0> maps to D<15:0>.

Byte: Read one of the LSBs of the program

address;

P<7:0> maps to the destination byte when byte

select = 0;

P<15:8> maps to the destination byte when byte

select = 1.

2. TBLWTL: Table Write Low (refer to Section 6.0

“Flash Program Memory” for details on Flash

programming).

3. TBLRDH: Table Read High

Word: Read the msw of the progra m address;

P<23:16> maps to D<7:0>; D<15:8> will always

be = 0.

Byte: Read one of the MSBs of the program

address;

P<23:16> maps to the destination byte when

byte select = 0;

The destination byte will always be ‘0’ when byte

select = 1.

4. TBLWTH: Table Write High (refer to Section 6.0

“Flash Program Memory” for details on Flash

programming).

FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’).

TBLRDL.W

TBLRDL.B (Wn<0> = 1)

TBLRDL.B (Wn<0> = 0)

dsPIC30F4011/4012

FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE)

3.1.2 DATA ACCESS FROM PROGRAM

MEMORY USING PROGRAM SPACE

VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word progra m space page. This

provides transparent access of stored constant data

from X data space without the need to use special

instructions (i.e., TBLRDL/H, TBLWTL/H instructions).

Program space access through the data space occurs

if the MSb of the data space EA is set and program

space visibility is enabled by setting the PSV bit in the

Core Control register (CORCON). The functions of

CORCON are discussed in Section 2.4 “DSP

Engine”.

Data accesses to this area add an additional cycle to

the instruction being executed, since two program

memory fetches are required.

Note that the upper half of addressable data space is

always part of the X data space. Therefore, when a

DSP operation uses program space mapping to access

this memory region, Y data space should typically con-

tain state (variable) data for DSP operations, whereas

X data space should typically contain coefficient

(constant) data.

Although each data space address, 0x8000 and higher ,

maps directly into a corresponding program memory

address (see Figure 3-5), only the lower 16 bi ts of the

24-bit program word are used to contain the data. The

upper 8 bits should be programmed to force an illegal

instruction to maintain machine robustness. For

information on instruction encod ing, refer to the “16-bit

MCU and DSC Programmer’s Reference Manual”

(DS70157).

Note that by incrementing the PC by 2 for each

program memory word, the Least Significant 15 bits of

data space addresses directly map to the Least

Significant 15 bits in the corresponding program space

addresses. The remaining bits are provided by the

Program S pace Visibility Page register , PSVP AG<7:0>,

as shown in Figure 3-5.

For instructions that use PSV which are executed

outside a REPEAT loop:

• The following instructions require one instruction

cycle in addition to the specified execution time:

-MAC class of instructions with data operand

prefetch

-MOV instruction s

-MOV.D instructions

• All other instructions require two instruction cycles

in addition to the specified execution time of the

instruction.

For instructions that use PSV which are executed

inside a REPEAT loop:

• The following instances require two instruction

cycles in addition to the specified execution time

of the instruction:

- Execution in the first iteration

- Execution in the last iteration

- Execution pr ior to exiting the loop due to an

interrupt

- Execution upon re-entering the loop after an

interrupt is serviced

• Any other iteration of the REPEAT loop allows the

instruction, accessing data using PSV, to execute

in a single cycle.

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDH.W

TBLRDH.B (Wn<0> = 1)

TBLRDH.B (Wn<0> = 0)

Note: PSV access is temporarily disabled during

table reads/writes.

dsPIC30F4011/4012

FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION

3.2 Data Address Space

The core has two data spaces. The data spaces can be

considered either separate (for some DSP instruc-

tions), or as one unified linear address range (for MCU

instructions). The data spaces are accessed using two

Address Generation Units (AGUs) and separate data

paths.

3.2.1 DATA SPACE MEMORY MAP

The data space memory is split into two blocks, X and

Y data space. A key element of this architecture is that

Y space is a subset of X space, and is fully contained

within X space. In order to provide an apparent linear

addressing space, X and Y spaces have contiguous

addresses.

When executing any instruction other than one of the

MAC class of instructions, the X block consists of the

64-Kbyte data address space (including all Y

addresses). When executing one of the MAC class of

instructions, the X block consists of the 64-Kbyte data

address space excluding the Y address block (for data

reads only). In other words, all other instructions regard

the entire data memory as one composite address

space. The MAC class instructions extract the Y addre ss

space from data space and address it using EAs

sourced from W10 and W11. The remaining X data

space is addressed using W8 and W9. Both address

spaces are concurrently accessed only with the MAC

class instructions.

A data space memory map is shown in Figure 3-6.

Figure 3-7 illustrates a graphical summary of how X

and Y data spaces are accessed for MCU and DSP

instructions.

23 15 0

PSVPAG(1)

EA<15> =

EA<15> = 1

Data

Space

Data Space Program Space

15 23

0x0000

0x8000

0xFFFF

0x00

0x000100

0x007FFE

Dat a Read

Upper Half of Data

Sp ace is Mapped

into Program Space

Note: PSVPAG is an 8-bit register containing bits <22:15> of the program sp ace address

(i.e., it defines the page in program space to which the upper half of data space is being mapped).

0x001200

Address

Concatenation

BSET CORCON,#2 ; PSV bit set

MOV #0x00, W0 ; Set PSVPAG register

MOV W0, PSVPAG

MOV 0x9200, W0 ; Access program memory location

; using a data space access

dsPIC30F4011/4012

FIGURE 3-6: dsPIC30F4011/4012 DATA SPACE MEMORY MAP

0x0000

0x07FE

0x0BFE

0xFFFE

LSB

Address

16 bits

LSBMSB

MSB

Address

0x0001

0x07FF

0x0BFF

0xFFFF

0x8001 0x8000

Optionally

Mapped

into Program

Memory

0x0FFF 0x0FFE

0x10000x1001

0x0801 0x0800

0x0C01

0x0C00

Near Data

Space

2-Kbyte

SFR Space

2-Kbyte

SRAM Space

4096 Bytes

Unimplemented (X)

X Data

SFR Space

X Data RAM (X)

Y Data RAM (Y)

dsPIC30F4011/4012

FIGURE 3-7: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE

SFR SPACE

(Y SP ACE)

X SP ACE

SFR SPACE

UNUSED

X SPACE

Y SPACE

UNUSED

Non-MAC Class Ops (Read/Write) MAC Class Ops Read-Only

Indirect EA using any W Indirect EA using W8, W9 Indirect EA using W10, W11

MAC Class Ops (Write)

dsPIC30F4011/4012

3.2.2 DATA SPACES

The X data space is used by all instructions and sup-

ports all addressing modes. There are separate read

and write data buses. The X read data bus is the return

data path for all instructions that view data space as

combined X and Y address space. It is also the X

address space data path for the dual operand read

instructions (MAC class). The X write data bus is the

only write path to data space for all instructions.

The X data space also supports Modulo Addressing for

all instructions, subject to addressing mode restric-

tions. Bit-Reversed Addressing is only supported for

writes to X data space.

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED,

EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to pro-

vide two concurrent data read paths. No writes occur

across the Y bus. This class of instructions dedicates

two W register pointers, W10 and W11, to always

address Y data space, independent of X data space,

whereas W8 and W9 always address X data space.

Note that during accumulator write-back, the data

address space is considered a combination of X and Y

data spaces, so the write occurs across the X bus.

Consequently, the write can be to any address in the

entire data space.

The Y data space can only be used for the data

prefetch operation associated with the MAC class of

instructions. It also supports Modulo Addressing for

automated circular buffers. Of course, all other instruc-

tions can access the Y data address space through the

X data path, as part of the composite linear space.

The boundary between the X and Y data spaces is

defined as shown in Figure 3-6 and is not user-

programmable. Should a n EA point to data outside its

own assigned address space, or to a location outside

physical memory, an all-zero word/byte is returned. For

example, although Y address space is visible by all

non-MAC instructions using any addressing mode, an

attempt by a MAC instruction to fetch data from that

space, using W8 or W9 (X Space Pointers), returns

0x0000.

All Effective Addresses (EA) are 16 bits wide and point

to bytes within the data space. Therefore, the data

space address range is 64 Kbytes or 32K words.

3.2.3 DATA SPACE WIDTH

The core data width is 16-bits. All internal registers are

organized as 16-bit wide words. Data space memory is

organized in byte addressable, 16-bit wide blocks.

3.2.4 DATA ALIGNMENT

To help maintain backward compatibility with PIC®

devices and improve data space memory usage effi-

ciency, the dsPIC30F instruction set supports both

word and byte operations. Data is aligned in data mem-

ory and registers as words, but all data space EAs

resolve to bytes. Data byte reads read the complete

word, which contains the byte, using the LSb of any EA

to determine which byte to select. The selected byte is

placed onto the LSB of the X data path (no byte

accesses are possible from the Y data path as the MAC

class of instructions can only fetch words). That is, data

memory and registers are organized as two parallel

byte-wide entities, with shared (word) address decode,

but separate write lines. Data byte writes only write to

the corresponding side of the array or register which

matches the byte address.

As a consequence of this byte accessibility , all Effective

Address calcul ations (including those generated by the

DSP operations, which are restricted to word-sized

data) are internally scaled to step through word-aligned

memory. For example, the core would recognize that

Post-Modified Register Indirect Addressing mode,

[Ws++], will result in a value of Ws + 1 for byte

operations and Ws + 2 for word operations.

All word accesses must be aligned to an even address.

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word opera-

tions, or translating from 8-bit MCU code. Should a

misaligned read or write be attempted, an address

error trap is generated. If th e error occurred on a read,

the instruction underway is completed, whereas if it

occurred on a write, the instruction will be executed but

the write does not occur. In either case, a trap is then

executed, allowing the system and/or user to examine

the machine state prior to execution of the address

Fault.

FIGURE 3-8: DATA ALIGNMENT

TABLE 3-2: EFFECT OF INVALID

MEMORY ACCESSES

Attempted Operation Data Returned

EA = an unimplemented address 0x0000

W8 or W9 used to access Y data

space in a MAC instruction 0x0000

W10 or W11 used to access X

data space in a MAC instr uction 0x0000

15 8 7 0

0001

0003

0005

0000

0002

0004

Byte 1 Byte 0

Byte 3 Byte 2

Byte 5 Byte 4

LSBMSB

dsPIC30F4011/4012

All byte loads into any W register are loaded into the

LSB; the MSB is not modified.

A sign-extend (SE) instruction is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the MSB of any W register by executing a

zero-extend (ZE) instruction on the appropriate

address.

Although most instructions are capable of operating on

word or byte data sizes, it should be noted that some

instructions, including the DSP instructions, operate

only on words.

3.2.5 NEAR DATA SPACE

An 8-Kbyte ‘near ’ data space is reserved in X address

memory space between 0x0000 and 0x1FFF, which is

directly addressable via a 13-bit absolute address field

within all memory direct instructions. The remaining X

address space and all of the Y address space is

addressable indirectly . Additionally, the whole of X data

space is addressable using MOV instructions, which

support Memory Direct Addressing with a 16-bit

address field.

3.2.6 SOFTWARE STACK

The dsPIC DSC contains a software stack. W15 is used

as the Stack Pointer.

The Stack Pointer always points to the first available

free word and grows from lower addresses towards

higher addresses. It pre-decrements for stack pops and

post-increments for stack pushes, as shown in

Figure 3-9. Note that for a PC push during any CALL

instruction, the MSB of the PC is zero-extended before

the push, ensuring that the MSB is always clear.

There is a Stack Pointer Limit register (SPLIM) associ-

ated with the Stack Pointer. SPLIM is uninitialized at

Reset. As is the case for the Stack Pointer, SPLIM<0>

is forced to ‘0’, because all stack operations must be

word-aligned. Whenever an Effective Address (EA) is

generated, using W15 as a source or destination

pointer, the address thus generated is compared with

the value in the SPLIM register. If the contents of the

St ack Pointer (W15) and the SPLIM register are equal,

and a push operation is performed, a stack error trap

will not occur. The stack error trap will occur on a sub-

sequent push operation. Thus, for example, if it is desir-

able to cause a stack error trap when the stack grows

beyond address 0x2000 in RAM, initialize the SPLIM

with the value, 0x1FFE.

Similarly, a S tack Pointer underflow (stack error) trap is

generated when the Stack Pointer address is found to

be less than 0x0800, thus preventing the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM register should not be immediately

followed by an indirect read operation usi ng W15.

FIGURE 3-9: CALL STACK FRAME

Note: A PC push during exception processing

concatenates the SRL register to the MSB

of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Addres s

PUSH: [W15++]

POP: [--W15]

0x0000

PC<22:16>

dsPIC30F4011/4012

TABLE 3-3: CORE REGISTER MAP(1)

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

W0 0000 W0/WREG 0000 0000 0000 0000

W1 0002 W1 0000 0000 0000 0000

W2 0004 W2 0000 0000 0000 0000

W3 0006 W3 0000 0000 0000 0000

W4 0008 W4 0000 0000 0000 0000

W5 000A W5 0000 0000 0000 0000

W6 000C W6 0000 000 0 0000 0000

W7 000E W7 0000 0000 0000 0000

W8 0010 W8 0000 0000 0000 0000

W9 0012 W9 0000 0000 0000 0000

W10 0014 W10 0000 0000 0000 0000

W11 0016 W11 0000 0000 0000 0000

W12 0018 W12 0000 0000 0000 0000

W13 001A W13 0000 0000 0000 0000

W14 001C W14 0000 000 0 0000 0000

W15 001E W15 0000 1000 0000 0000

SPLIM 0020 SPLIM 0000 0000 0000 0000

ACCAL 0022 ACCAL 0000 0000 0000 0000

ACCAH 0024 ACCAH 0000 0000 0000 0000

ACCAU 0026 Sign Extension (ACCA<39>) ACCAU 0000 0000 0000 0000

ACCBL 0028 ACCBL 0000 0000 0000 0000

ACCBH 002A ACCBH 0000 0000 0000 0000

ACCBU 002C Sign Extension (ACCB<39>) ACCBU 0000 0000 0000 0000

PCL 002E PCL 0000 0000 0000 0000

PCH 0030 — — — — — — — — —PCH0000 0000 0000 0000

TBLPAG 0032 — — — — — — — —TBLPAG0000 0000 0000 0000

PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000

RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu

DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu

DOSTARTL 003A DOSTARTL 0 uuuu uuuu uuuu uuu0

DOSTARTH 003C — — — — — — — — —DOSTARTH0000 0000 0uuu uuuu

DOENDL 003E DOENDL 0 uuuu uuuu uuuu uuu0

DOENDH 0040 — — — — — — — — — DOENDH 0000 0000 0uuu uuuu

SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000

CORCON 0044 — — — US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000

MODCON 0046 XMODEN YMODEN — — BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000

XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

dsPIC30F4011/4012

XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1

YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0

YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1

XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu

DISICNT 0052 —— DISICNT<13:0> 0000 0000 0000 0000

TABLE 3-3: CORE REGISTER MAP(1) (CONTINUED)

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

4.0 ADDRESS GENERATOR UNITS

The dsPIC DSC core contains two independent

address generator units: the X AGU and Y AGU. The Y

AGU supports word-sized data reads for the DSP MAC

class of instructions only. The dsPIC Digital Signal

Controller AGUs support three types of data

addressing:

• Linear Addressing

• Modulo (Circular) Addressing

• Bit-Reversed Addressing

Linear and Modulo Data Addressing modes can be

applied to data space or program space. Bit-Reversed

Addressing is only applicable to data space addresses.

4.1 Instruction Addressing Modes

The addressing modes in Table 4-1 form the basis of

the addressing modes optimized to support the specific

features of individual instructions. The addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

4.1.1 FILE REGISTER INSTRUCTIONS

Most file register instructions use a 13-bit address field

(f) to directly address data present in the first

8192 bytes of data memory (near data space). Most file

which is denoted as WREG in these instructions. The

destination is typically either the same file register, or

WREG (with the exception of the MUL instruction),

which writes the result to a regist er or register p air. The

MOV instruction allows additional flexibility and can

access the entire data space during file register

operation.

4.1.2 MCU INSTRU CTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where Operand 1 is always a working register (i.e., the

addressing mode can only be Register Direct), which is

referred to as Wb. Operand 2 can be a W register,

fetched from data memory or a 5-bit literal. The result

location can either be a W register or an address

location. The following addressing modes are

supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Not all instructions support all the

addressing modes given above. Individual

instructions may support different subsets

of these addressing mode s.

Addressing Mode Description

File Register Direct The address of the file register is specified explicitly.

decremented) by a constant value.

to form the EA.

dsPIC30F4011/4012

4.1.3 MOVE AND ACCU MU LATOR

INSTRUCTIONS

Move instructions and the DSP accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

addressing modes supported by most MCU instruc-

tions, move and accumulator instru ctions also support

mode, also referred to as Register Indexed mode.

In summary, the following addressing modes are

supported by move and accumulator instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Litera l Offset

• 8-bit Literal

• 16-bit Lite ral

4.1.4 MAC INSTRUCTIONS

The dual source opera nd DSP instructio ns (CLR, ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also

referred to as MAC instructions, utilize a simplified set of

addressing modes to allow the user to effectively

manipulate the Data Pointers through register indirect

tables.

The two source operand prefetch registers must be

members of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 will always be directed to the X

RAGU, and W10 and W1 1 will always be directed to the

Y AGU. The Effective Addresses (EA) generated

(before and after modification) must, therefore, be valid

addresses within X data space for W8 and W9, and Y

data space for W10 and W11.

In summary, the following addressing modes are

supported by the MAC class of instructions:

• Register Indirect

• Register Indirect Post-Modified by 2

• Register Indirect Post-Modified by 4

• Register Indirect Post-Modified by 6

• Register Indirect with Register Offset (Indexed)

4.1.5 OTHER INSTRUCTIONS

Besides the various addressing modes outlined above,

some instructions use literal constants of various sizes.

For example, BRA (branch) instructions use 16-bit

signed literals to specify the branch destination directly ,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, such as ADD Acc, the

source of an operand or result is implied by the opcode

itself. Certain operations, such as NOP, do not have any

operands.

4.2 Modulo Addressing

Modulo Addressing is a method of providing an auto-

mated means to support circular data buffers using

hardware. The objective is to remove the need for soft-

ware to perform data address boundary checks when

executing tightly looped code, as is typical in many

DSP algorithms.

Modulo Addressing can operate in either data or pro-

gram space (since the Data Pointer mechanism is

essentially the same for both). One circular buffer can be

supported in each of the X (which also provides the

pointers into program space) and Y data spaces. Modulo

Addressing can operate on any W register poin ter . How-

ever, it is not advisable to use W14 or W15 for Modulo

Addressing, since these two registers are used as the

St ack Frame Poi nter and Stack Pointer, respectively.

In general, any particular circular buffer can only be

configured to operate in one direction, as there are

certain restrictions on the buffer start address (for incre-

menting buffers) or end address (for decrementing buf-

fers) based upon the direction of the buffer.

The only exception to the usage restricti ons is for buf-

fers which have a p ower-of-2 length. As these buffers

satisfy the start and end address criteria, they may

operate in a Bidirectional mode (i.e., address boundary

checks will be performed on both the lower and upper

address boundaries).

Note: For the MOV instructions, the addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (register offset) field

is shared between both source and

destination (but typically only used by one).

Note: Not all instructions support all the

addressing modes given above. Individual

instructions may support different subsets

of these addressing modes.

Note: Register Indirect with Register Offset

Addressing is only available for W9 (in X

data space) and W11 (in Y data space).

dsPIC30F4011/4012

4.2.1 START AND END ADDRESS

The Modulo Addressing scheme requires that a start and

end address be specified and loaded into the 16-bit Mod-

ulo Buffer Address registers: XMODSRT, XMODEND,

YMODSRT and YMODEND (see Table 3-3).

The length of a circular buffer is not directly specified. It

is determined by the difference between the

corresponding start and end addresses. The maximum

possible length of the circular buffer is 32K words

(64 Kbytes).

4.2.2 W ADDRE SS REGIS TER

SELECTION

The Modulo and Bit-Reversed Addressing Control reg-

ister, MODCON<15:0>, contains enable flags as well

as a W register field to specify the W Address registers.

The XWM and YWM fields select which registers oper-

ate with Modulo Addressing. If XWM = 15, X RAGU and

X WAGU Modulo Addressing are d isabled. Similarly, if

YWM = 15, Y AGU Modulo Addressing is disabled.

The X Address Space Pointer W register (XWM), to

which Modulo Addressing is to be appli ed, is stored in

MODCON<3:0> (see Table 3-3). Modulo Addressing is

enabled for X data space when XWM is set to any value

other than 15 and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM), to

which Modulo Addressing is to be appli ed, is stored in

MODCON<7:4>. Modulo Addressing is enabled for Y

data space when YWM is set to any value other than 15

and the YMODEN bit is set at MODCON<14>.

FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE

Note: Y space Modulo Addressing EA calcula-

tions assume word-sized data (LSb of

every EA is always clear).

0x1100

0x1163

Start Addr = 0x1100

End Addr = 0x1163

Length = 0x0032 words

Byte

Address MOV #0x1100,W0

MOV W0, XMODSRT ;set modulo start address

MOV #0x1163,W0

MOV W0,MODEND ;set modulo end address

MOV #0x8001,W0

MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x0000,W0 ;W0 holds buffer fill value

MOV #0x1110,W1 ;point W1 to buffer

DO AGAIN,#0x31 ;fill the 50 buffer locations

MOV W0, [W1++] ;fill the next location

AGAIN: INC W0,W0 ;increment the fill value

dsPIC30F4011/4012

4.2.3 MODULO ADDRESSING

APPLICABILITY

Modulo Addressing can be applied to the Effective

Address (EA) calculation associated with any W register .

It is important to realize that the address boundaries

check for addresses less than or greater than the upper

(for incrementing buffers) and lower (for decrementing

buffers) b oundary addresses (not just equal to). Address

changes may, therefore, jump beyond boundaries and

still be adjusted correctly.

4.3 Bit-Reversed Addressing

Bit-Reversed Addressing is intended to simplify data

reordering for radix-2 FFT algorithms. It is supported by

the X AGU for data writes only.

The modifier , which may be a constant value or register

contents, is regarded as having its bit order reversed.

The address source and destination are kept in normal

order. Thus, the only operand requiring reversa l is the

modifier.

4.3.1 BIT-REVERSED ADDRESSING

IMPLEMENTATION

Bit-Reversed Addressing is enabled when:

1. BWM (W register selection) in the MODCON reg-

ister is any value other than 15 (the stack can not

be accessed using Bit-Reversed Addressing)

and

2. The BREN bit is set in the XBREV register and

3. The addressing mode used is Register Indirect

with Pre-Increment or Post-Increment.

If the length of a bit-reversed buffer is M = 2N bytes,

then the last ’N’ bits of the data buffer start address

must be zeros.

XB<14:0> is the Bit-Reversed Addressing modifier, or

‘pivot point’, which is typically a constant. In the case of

an FFT computation, its value is equal to half of the FFT

data buffer size.

When enabled, Bit-Reversed Addressing is only

executed for Register Indirect with Pre-Increment or

Post-Increment Addressing mode and word-sized data

writes. It will not function for any other addressing

mode or for byte-sized data, and normal addresses will

be generated instead. When Bit-Re versed Addressing

is active, the W Address Pointer will always be added

to the address modifier (XB) and the offset associated

with the Register Indirect Addressing mode will be

ignored. In addition, as word-sized data is a

requirement, the LSb of the EA is ignored (and a lways

clear).

If Bit-Reversed Addressing has already been enabled

by setting the BREN bit (XBREV<15>), then a write to

the XBREV register should not be immediately followed

by an indirect read operation using the W reg ister that

has been designated as the Bit-Reversed Pointer.

FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE

Note: The modulo corrected Effective Address

is written back to the register only when

Pre-Modify or Post-Modify Addressing

mode is used to compute the Effective

Address. When an address offset (e.g.,

[W7+W2]) is used, Modulo Addressing

correction is performed, but the contents

of the register remain unchanged.

Note: All bit-reversed EA calculations assume

word-sized data (LSb of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note: Modulo Addressing and Bit-Reversed

Addressing should not be enabled

together. In the event that the user

attempts to do this, Bit-Reversed

Addressing will assume priority when

active for the X WAGU, and X WAGU

Modulo Addressing will be disabled.

However, Modulo Addressing will

continue to function in the X RAGU.

b3 b2 b1 0

b2 b3 b4 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

Bit-Reversed Address

XB = 0x0008 for a 16-Word Bit-Reversed Buffer

b7 b6 b5 b1

b7 b6 b5 b4b11 b10 b9 b8

b11 b10 b9 b8

b15 b14 b13 b12

Sequential Address

Pivot Point

dsPIC30F4011/4012

TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER

Normal Address Bit-Reversed Address

A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal

0000 00000 0

0001 11000 8

0010 20100 4

0011 31100 12

0100 40010 2

0101 51010 10

0110 60110 6

0111 71110 14

1000 80001 1

1001 91001 9

1010 10 0101 5

1011 11 1101 13

1100 12 0011 3

1101 13 1011 11

1110 14 0111 7

1111 15 1111 15

Buffer Size (W ords ) XB<14:0> Bit-Reversed Address Modifier Value(1)

32768 0x4000

16384 0x2000

8192 0x1000

4096 0x0800

2048 0x0400

1024 0x0200

512 0x0100

256 0x0080

128 0x0040

64 0x0020

32 0x0010

16 0x0008

8 0x0004

4 0x0002

2 0x0001

Note 1: Modifier values for buffer sizes greater than 1024 words will exceed the available data memory on the

dsPIC30F4011/4012 devices.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

5.0 INTERRUPTS

The dsPIC30F4011/4012 has 30 interrupt sources and

4 processor exceptions (traps), which must be

arbitrated based on a priority scheme.

The CPU is responsible for reading the Interrupt V ector

Table (IVT) and transferring the address contained in

the interrupt vector to the program counter. The inter-

rupt vector is transferred from the program data bus

into the program counter via a 24-bit wide multiplexer

on the input of the program counter.

The Interrupt V ector Table (IVT) and Alternate Interrupt

Vector Table (AIVT) are placed near the beginning of

program memory (0x000004). The IVT and AIVT are

shown in Figure 5-1.

The interrupt controller is responsible for pre-

processing the interrupts and processor exceptions,

prior to their being presented to the processor core.

The peripheral interrupts and traps are enabled,

prioritized and controlled using centralized Special

Function Registers:

• IFS0<15:0>, IFS1<15:0>, IFS2< 15:0>

All interrupt request flags are maintained in these

three registers. The flags are set by their respec-

tive peripherals or external signals, and they are

cleared via software.

• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>

All interrupt ena b l e co ntrol bits are maintained in

these three registers. These control bits are used

to individually enable interrup ts from the

peripherals or external signals.

• IPC0<15:0>... IPC11<7:0>

The user-assignable priority level associated with

each of these interrupts is held centrally in these

twelve registers.

•IPL<3:0>

The current CPU priority level is explicitly stored

in the IP L bits. IP L<3 > is pr esen t in t he C OR CON

STATUS register (SR) in the processor core.

• INTCON1<15:0>, INTCON2<15:0>

Global interrupt control functions are derived from

these two registers. INTCON1 contains the con-

trol and status flags for the processor exceptions.

The INTCON2 register controls the external

interrupt request signal behavior and the use of

the AIVT.

All interrupt sources can be user-assigned to one of

seven priority levels, 1 through 7, via the IPCx

registers. Each interrupt source is associated with an

interrupt vector, as shown in Table 5-1. L evels 7 and 1

represent the highest and lowest maskable priorities,

respectively.

If the NSTDIS bit (INTCON1<15>) is set, nesting of

interrupts is prevented. Thus, if an interrupt is currently

being serviced, processing of a new interrupt is pre-

vented, even if the new interrupt is of higher priority

than the one currently being serviced.

Certain interrupts have specialized contro l bits for fea-

tures like edge or level triggered interrupts, interrupt-

on-change, etc. Control of these features remains

within the peripheral module which generates the

interrupt.

The DISI instruction can be used to disable the

processing of interrupts of priorities 6 and lower for a

certain number of instructions, during which the DISI bit

(INTCON2<14>) remains set.

When an inte rrupt is servic ed, the PC is loaded with the

address stored in the vector location in program memory

that corresponds to the interrupt. There are 63 different

vectors within the IVT (refer to Figure 5-2). These vec-

tors are contained in locations 0x000004 through

0x0000FE of program memory (refer to Figure 5-2).

These locations contain 24-bit addresses, and in order

to preserve robustness, an address error trap will take

place should the PC attempt to fetch any of these words

during normal execution. This prevents execution of

random data as a result of accidentally decrementing a

PC into vector space, accidentally mapping a data space

address into vector space or the PC rolling over to

0x000000 after reaching the end of implemented

program memory space. Execution of a GOTO instruction

to this vector space will also generate an address error

trap.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

“dsPIC30F Family Reference Manual”

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Interrupt flag bits get set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit. User

software should ensure the appropriate

interrupt flag bits are clear prior to

enabling an interrupt.

Note: Assigning a priority level of 0 to an

interrupt source is equivalent to disabl ing

that interrupt.

Note: The IPL bits become read-only whenever

the NSTDIS bit has been set to ‘1’.

dsPIC30F4011/4012

5.1 Interrupt Priority

The user-assignable Interrupt Priority (IP<2:0>) bits for

each individual interrupt source are located in the Least

Significant 3 bits of each nib ble within the IPCx regis-

ter(s). Bit 3 of each nibb le i s not used an d is re ad as a

‘0’. These bits define the priority level assigned to a

particular interrupt by the user.

Since more than one interrupt request sou rce may be

assigned to a specific user-assigned priority level, a

means is provided to assign priority within a given level.

This method is cal l e d “N at ural Order Prior ity ”.

Natural order priority is determined by the position of

an interrupt in the vector table, and only affects

interrupt operation when multiple interrupts with the

same user-assigned priority become pending at the

same time.

Table 5-1 lists the interrupt numbers and interrupt

sources for the dsPIC DSCs and their associated

vector numbers.

The ability for the user to assign every interrupt to one

of seven priority levels implies that the user can assign

a very high overall priority level to an interrupt with a

low natural order priority . For example, the PLVD (Low-

Voltage Detect) can be given a priority of 7. The INT0

(External Interrupt 0) may be assigned to priority

level 1, thus giving it a very low effective priority.

TABLE 5-1: INTERRUPT VECTOR TA BLE

Note: The user-assignable priority levels start at

0 as the lowest priority, and leve l 7 as the

highest priority.

Note 1: The natural order priority scheme has 0

as the highest priority and 53 as the

lowest priority.

2: The natural order priority number is the

same as the INT number.

INT

Number Vector

Number Interrupt Source

Highest Natural Order Priority

0 8 INT0 – External Interrupt 0

1 9 IC1 – Input Capture 1

2 10 OC1 – Output Compare 1

3 11 T1 – Timer1

4 12 IC2 – Input Capture 2

5 13 OC2 – Output Compare 2

6 14 T2 – Timer2

7 15 T3 – Timer3

816SPI1

9 17 U1RX – UART1 Rec e iver

10 18 U1TX – UART1 Transmitter

11 19 ADC – ADC Convert Done

12 20 NVM – NVM Write Complete

13 21 SI2C – I2C™ Slave Interrupt

14 22 MI2C – I2C Master Interrupt

15 23 Input Change Interrupt

16 24 INT1 – External Interrupt 1

17 25 IC7 – Input Capture 7

18 26 IC8 – Input Capture 8

19 27 OC3 – Output Compare 3

20 28 OC4 – Output Compare 4

21 29 T4 – Timer4

22 30 T5 – Timer5

23 31 INT2 – External Interrupt 2

24 32 U2RX – UART2 Receiver

25 33 U2TX – UART2 Transmitter

26 34 Reserved

27 35 C1 – Combined IRQ for CAN1

28 36 Reserved

29 37 Reserved

30 38 Reserved

31 39 Reserved

32 40 Reserved

33 41 Reserved

34 42 Reserved

35 43 Reserved

36 44 Reserved

37 45 Reserved

38 46 Reserved

39 47 PW M – PW M P erio d Ma tc h

40 48 QEI – QEI Interrupt

41 49 Reserved

42 50 Reserved

43 51 FLTA – PWM Fault A

44 52 Reserved

45-53 53-61 Reserved

Lowest Natural Orde r Prio ri ty

dsPIC30F4011/4012

5.2 Reset Sequence

A Reset is not a true exception, because the interrupt

controller is not involved in the Reset process. The pro-

cessor initializes its registers in response to a Reset,

which forces the PC to zero. The processor then begins

program execution at location 0x000000. A GOTO

instruction is stored in the first program memory loca-

tion, immediately followed by the address target for the

GOTO instruction. The processor executes the GOTO to

the specified address and then begins operation at the

specified target (start) address.

5.2.1 RESET SOURCES

There are 5 sources of error which will cause a device

reset.

• W atchdog Time-out:

The watchdog has timed out, indicating that the

processor is no longer executing the correct flow

of code.

• Uninitialized W Register Trap:

An attempt to use an uninitialized W register as

an Address Pointer will cause a Reset.

• Illegal Instruction Trap:

Attempted execution of any unused opcodes will

result in an illegal instruction trap. Note that a

fetch of an illegal instruction does not result in an

illegal instruction trap if that instruction is flushed

prior to execution due to a flow change.

• Brown-out Reset (BOR):

A momentary dip in the power supply to the

device has been detected which may result in

malfunction.

• Trap Lockout:

Occurrence of multiple trap conditions

simultaneously will cause a Reset.

5.3 Traps

Traps can be considered as non-maskable interrupts,

indicating a software or hardware error which adhere to

a predefined prio rity, as shown in Figure 5-1. They are

intended to provide the user a means to correct errone-

ous operation during debug and when operating within

the application.

Note that many of these trap conditions can only be

detected when they occur . Consequently , the question-

able instruction is allowed to complete prior to trap

exception processing. If the user chooses to recover

from the error, the result of the erroneous action that

caused the trap may have to be corrected.

There are 8 fixed priority levels for traps, Level 8

through Level 15, which means that the IPL3 is always

set during processing of a trap.

If the user is not currently executing a trap and he sets

the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all

interrupts are disabled, but traps can still be processed.

5.3.1 TRAP SOURCES

The following traps are provided with increasing

priority. However , since all traps can be nested, priority

has little effect.

5.3.1.1 Math Error Trap

The math error trap executes under the following four

circumstances:

1. Should an attempt be made to divide by zero,

the divide operation will be aborted on a cycle

boundary and the trap taken.

2. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes an overflow from bit 31 and the

accumulator guard bits are not utilized.

3. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes a catastrophic overflow from bit 39

and all saturation is disabled.

4. If the shift amount specified in a shift instruction

is greater than the maximum allowed shift

amount, a trap will occur.

Note: If the user does not intend to take correc-

tive action in the event of a trap error

condition, these vectors must be loaded

with the address of a default handler that

simply contains the RESET instruction. If,

on the other hand, one of the vectors

containing an invalid address is called, an

address error trap is generated.

dsPIC30F4011/4012

5.3.1.2 Address Error Trap

This trap is initiated when any of the following

circumstances occurs:

1. A misaligned data word access is attempted.

2. A data fetch from an unimplemented data

memory location is attempted.

3. A data access of an unimplemented program

memory location is attempted.

4. An instruction fetch from vector space is

attempted.

5. Execution of a “BRA #literal” instruction, or a

“GOTO #literal” instruction, where literal

is an unimplemented program memory address.

6. Executing instructions after modifying the PC to

point to unimplemented program memory

addresses. The PC may be mo dified by loading

a value into the stack and executing a RETURN

instruction.

5.3.1.3 Stack Error Trap

This trap is initiated under the following conditions:

1. The Stack Pointer is loaded with a va lue which

is greater than the (user-programmable) limit

value written into the SPLIM register (stack

overflow).

2. The Stack Pointer is loaded with a va lue which

is less than 0x0800 (simple stack underflow).

5.3.1.4 Oscillator Fail Trap

This trap is initiated if the external oscillator fails and

operation becomes reliant on an internal RC backup.

5.3.2 HARD AND SOFT TRAPS

It is possible that multiple traps can become active

within the same cycle (e.g., a misaligned word stack

write to an overflowed address). In such a case, the

fixed priority shown in Figure 5-2 is implemented,

which may requi re the user to check if other traps are

pending in order to completely correct the Fault.

‘Soft’ traps include exceptions of priority level 8 through

level 11, inclusive. The arithmetic error trap (level 11)

falls into this category of traps.

‘Hard’ traps include exceptions of priority level 12

through level 15, inclusive. The address error (level

12), stack error (level 13) and oscillator error (level 14)

traps fall into this category.

Each hard trap that occurs must be acknowledged

before code execution of any type may continue. If a

lower priority hard trap occurs while a higher priority

trap is pending, acknowledged or is being processed, a

hard trap conflict will occur.

The device is automatically Reset in a hard trap conflict

condition. The TRAPR status bit (RCON<15>) is set

when the Reset occurs, so that the condition may be

detected in software.

FIGURE 5-1: TRAP VECTORS

Note: In the MAC class of instructions, wherein

the data space is split into X and Y data

space, unimplemented X space includes

all of Y space and unimplemented Y

space includes all of X space.

Address Error Trap Vector

Oscillator Fail Trap Vector

Stack Error Tr ap Vector

Reserved Vector

Math Error Trap Vector

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

Math Error Trap Vector

Decreasing

Priority

0x000000

0x000014

Reserved

Stack Error Tr ap Vector

Reserved Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

IVT

AIVT

0x000080

0x00007E

0x0000FE

Reserved

0x000094

Reset – GOTO Instruction

Reset – GOTO Address 0x000002

Reserved 0x000082

0x000084

0x000004

Reserved Vector

—

Interrupt 0 Vector

—

dsPIC30F4011/4012

5.4 Interrupt Sequence

All interrupt event flags are sampled in the beginning of

each instruction cycle by the IFSx registers. A pending

interrupt request (IRQ) is indicated by the flag bit being

equal to a ‘1’ in an IFSx register . The IRQ will cause an

interrupt to occur if the corresponding bit in the interrupt

enable (IECx) register is se t. For the remainder of th e

instruction cycle, the priorities of all pending interrupt

requests are evaluated.

If there is a pending IRQ with a priority level greater

than the current processor priori ty level in the IPL b its,

the processor will be interrupted.

The processor then stacks the current program counter

and the low byte of the processor STATUS register

(SRL), as shown in Figure 5-2. The low byte of the

ST A TUS register cont ains the processor priority level at

the time prior to the beginning of the interrupt cycle.

The processor then loads the priority level for this inter-

rupt into the STATUS register. This action will disable

all lower priority interrupts until the completion of the

Interrupt Service Routine (ISR).

FIGURE 5-2: INTERRUPT STACK

FRAME

The RETFIE (return from interrupt) instruction will

unstack the program counter and STATUS registers to

return the processor to its state prior to the interrupt

sequence.

5.5 Alternate Interrupt Vector Table

In program memory, the Interrupt Vector Table (IVT) is

followed by the Alternate Interrupt Vector Table (AIVT),

as shown in Figure 5-1. Access to the Alternate Inter-

rupt Vector Table is provided by the ALTIVT bit in the

INTCON2 register. If the ALTIVT bit is set, all interrupt

and exception processes will use the altern ate vectors

instead of the default vectors. The alternate vectors are

organized in the same man ner as the default vectors.

The AIVT supports emulation and debugging efforts by

providing a means to switch between an application

and a support environment, without requiring the inter-

rupt vectors to be reprogrammed. This feature also

enables switch ing between applications for evaluation

of different software algorithms at run time.

If the AIVT is not required, the program memory

allocated to the AIVT may be used for other purpose s.

AIVT is not a protected section and may be freely

programmed by the user.

5.6 Fast Context Saving

A context saving option is available using shadow reg-

isters. Shadow registers are provided for the DC, N,

OV, Z and C bits in SR, and the registers W0 through

W3. The shadows are only one-level deep. The

shadow registers are accessible using the PUSH.S and

POP.S instructions only.

When the processor vectors to an interrupt, the

PUSH.S instruction can be used to store the current

value of the aforementioned registers into their

respective shadow registers.

If an ISR of a certain priority uses the PUSH.S and

POP.S instructions for fast context saving, then a

higher priority ISR should not include the same instruc-

tions. Users must save the key registers in software

during a lower priority interrupt if the higher priority ISR

uses fast context saving.

5.7 External Interrupt Requests

The interrupt controller supports three external inter-

rupt request signals, INT0-INT2. These inputs are edge

sensitive; they require a low-to-high, or a high-to-low

transition, to generate an interrupt request. The

INTCON2 register has three bits, INT0EP-INT2EP, that

select the polarity of the edge detection circuitry.

5.8 Wake-up from Sleep and Idle

The interrupt controller may be used to wake-up the

processor from either Sleep or Idle modes if Sleep or

Idle modes are active when the interrupt is generated.

If an enabled interrupt request of sufficient priority is

received by the interrupt controller, then the standard

interrupt request is presented to the processor. At the

same time, the processor will wake-up from Sleep or

Idle and begin execution of the ISR needed to process

the interrupt request.

Note 1: The user can always lower the priority

level by writing a new value into SR. The

Interrupt Service Routine must clear the

interrupt flag bits in the IFSx register

before lowering the processor interrupt

priority in order to avoid recursive

interrupts.

2: The IPL3 bit (CORCON<3>) is always

clear when interrupts are being pro-

cessed. It is set only during executio n of

traps.

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

PUSH: [W15++]

POP : [--W15]

0x0000

PC<15:0>

SRL IPL3 PC<22:16>

dsPIC30F4011/4012

TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP(1)

SFR

Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL —0000 0000 0000 0000

INTCON2 0082 ALTIVT DISI — — — — — — — — — — — INT2EP INT1EP INT0EP 0000 0000 0000 0000

IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000

IFS1 0086 — — — —C1IF— U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000

IFS2 0088 — — — —FLTAIF—— QEIIF PWMIF — — — — — — — 0000 0000 0000 0000

IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000

IEC1 008E — — — —C1IE— U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000

IEC2 0090 — — — —FLTAIE—— QEIIE PWMIE — — — — — — — 0000 0000 0000 0000

IPC0 0094 — T1IP<2:0> —OC1IP<2:0>—IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100

IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> —IC2IP<2:0>0100 0100 0100 0100

IPC2 0098 —ADIP<2:0>— U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0 100

IPC3 009A — CNIP<2:0> —MI2CIP<2:0>— SI2CIP<2:0> —NVMIP<2:0>0100 0100 0100 0100

IPC4 009C — OC3IP<2:0> — IC8IP<2:0> —IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100

IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> —OC4IP<2:0>0100 0100 0100 0 100

IPC6 00A0 — C1IP<2:0> — — — — — U2TXIP<2:0> — U2RXIP<2:0> 0100 0000 0100 0100

IPC7 00A2 — — — — — — — — — — — — — — — — 0000 0000 0000 0000

IPC8 00A4 — — — — — — — — — — — — — — — — 0000 0000 0000 0000

IPC9 00A6 — PWMIP<2:0> — — — — — — — — — — — — 0100 0000 0100 0100

IPC10 00A8 — FLTAIP<2:0> — — — — — — — — —QEIIP<2:0>0100 0000 0000 0100

IPC11 00AA — — — — — — — — — — — — — — — — 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

6.0 FLASH PROGRAM MEMORY

The dsPIC30F family of devices contains internal

program Flash memory for executing user code. There

are two methods by which the user can program this

memory:

1. In-Circuit Serial Programming™ (ICSP™)

2. Run-T ime Self-Programming (RTSP)

6.1 In-Circuit Serial Programming

(ICSP)

dsPIC30F devices can be serially programmed while in

the end application circuit. This is simply done with two

lines for Programming Clock and Programming Data

(which are named PGC and PGD, respectively), and

three other lines for Power (VDD), Ground (VSS) and

Master Clear (MCLR). This allows customers to manu-

facture boards with unprogrammed devices, and then

program the digital signal controller just before shipping

the product. This also allows the mo st recent firmwa re

or a custom firmware to be programmed.

6.2 Run-Time Self-Programming

(RTSP)

RTSP is accomplished using TBLRD (table read) and

TBLWT (table write) instructions.

With RTSP, the user may erase program memory,

32 instructions (96 bytes) at a time, and can write

program memory data, 32 instructions (96 bytes) at a

time.

6.3 Table Instruction Operation Summary

The TBLRDL and the TBLWTL instructions are used to

read or write to bits <15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

Word or Byte mode.

The TBLRDH and TBLWTH instructions are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTH can access program memory in Word or

Byte mode.

A 24-bit program memory address is formed using

bits<7:0> of the TBLPAG register and the Effective

Address (EA) from a W regist er, specified in the table

instruction, as shown in Figure 6-1.

FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

0Program Counter

24 bits

NVMADRU Reg

8 bits 16 bits

Program

Using

TBLPAG Reg

8 bits

Working Reg EA

16 bits

Using

Byte

24-bit EA

1/0

Select

Table

Instruction

NVMADR

Addressing

Counter

Using

NVMADR Reg EA

User/Configuration

Space Select

dsPIC30F4011/4012

6.4 RTSP Operation

The dsPIC30F Flash program memory is organized

into rows and panels. Each row consists of 32 instruc-

tions or 96 bytes. Each panel consists of 128 rows or

4K x 24 instructions. RTSP allows the user to erase one

row (32 instructions) at a time and to program

32 instructions at one time.

Each panel of program memory contains write l atches

that hold 32 instructions of programming data. Prior to

the actual programming ope ration, the write data must

be loaded into the panel write latches. The data to be

programmed into the panel is loaded in sequential

order into the write latches: instruction 0, instruction 1,

etc. The addresses loaded must always be from a

32 address boundary.

The basic sequence for RTSP programming is to set up

a Table Pointer, then do a series of TBLWT instructions

to load the write latches. Programming is performed by

setting the special bits in the NVMCON register.

32 TBLWTL and 32 TBLWTH instructions are required

to load the 32 instructions.

All of the table write operat ions are single-word writes

(2 instruction cycles) because only the table latches are

written.

After the latches are written, a programming operation

needs to be initiated to program the data.

The Flash program memory is readable, writable and

erasable during normal operation over the entire VDD

range.

6.5 RTSP Control Registers

The four SFRs used to read and write the program

Flash memory are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

6.5.1 NVMCON REGISTER

The NVMCON register controls which blocks are to be

erased, which memory type is to be programmed and

the start of the programming cycle.

6.5.2 NVMADR REGISTER

The NVMADR register is used to hold the lower two

bytes of the Effective Address. The NVMADR register

captures the EA<15:0> of the last table instruction that

has been executed and selects the row to write.

6.5.3 NVMADRU REGISTER

The NVMADRU register is used to hold the upper byte

of the Effective Address. The NVMADRU register cap-

tures the EA<23:16> of the last table instruction that

has been executed.

6.5.4 NVMKEY REGISTER

NVMKEY is a write-only register that is used for write

protection. To start a programming or an erase

sequence, the user must consecutively write 0x55 and

0xAA to the NVMKEY register. Refer to Section 6.6

“Programming Operations” for further details.

Note: The user can also directly write to the

NVMADR and NVMADRU registers to

specify a program memory address for

erasing or programming.

dsPIC30F4011/4012

6.6 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. A programming operation is nominally 2 msec in

duration and the processor stalls (waits) until the oper-

ation is finished. Setting the WR bit (NVMCON<15>)

starts the operation, and the WR bit is automatically

cleared when the operation is finished.

6.6.1 PROGRAMMING ALGORITHM FOR

PROGRAM FLASH

The user can erase or program one row of program

Flash memory at a time. The general process is:

1. Read one ro w of program Flash (32 instruction

words) and store into data RAM as a data

“image”.

2. Update the data image with the desired new

data.

3. Erase program Flash row.

a) Set up NVMCON register for multi-word,

program Flash, erase and set WREN bit.

b) Write address of row to be erased into

NVMADRU/NVMDR.

c) Wr it e 0x55 to NVMKEY.

d) Write 0xAA to NVMKEY.

e) Set the WR bit. This will begin erase cycle.

f) CPU will stall for the duration of the erase

cycle.

g) The WR bit is cleared when erase cycle

ends.

4. Write 32 instruction words of data from data

RAM “image” into the program Flash write

latches.

5. Program 32 instruction words into program

Flash.

a) Set up NVMCON register for multi-word,

program Flash, program and set WREN bit.

b) Write 0x55 to NVMKEY.

c) Write 0xAA to NVMKEY.

d) Set the WR bit. This will begin program

cycle.

e) CPU will stall for duration of the program

cycle.

f) The WR bit is cleared by the hardware

when program cycle ends.

6. Repeat steps 1 through 5 as needed to program

desired amount of program Flash memory.

6.6.2 ERASING A ROW OF PROGRAM

MEMORY

Example 6-1 shows a code sequence that can be used

to erase a row (32 instructions) of program memory.

EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write

; program memory selected, and writes enabled

MOV #0x4041,W0 ;

MOV W0,NVMCON ; Init NVMCON SFR

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR),W0 ;

MOV W0,NVMADRU ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer

MOV W0, NVMADR ; Intialize NVMADR SFR

DISI #5 ; Block all interrupts with priority < 7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F4011/4012

6.6.3 LOADING WRITE LATCHES

Example 6-2 shows a sequence of instructions that

can be used to load the 96 bytes of write latches.

32 TBLWTL and 32 TBLWTH instructions are needed to

load the write latches selected by the Table Pointer.

EXAMPLE 6-2: LOADING WRITE LATCHES

6.6.4 INITIATING THE PROGRAMMING

SEQUENCE

For protection, the write initiate sequence for NVMKEY

must be used to allow any era se or prog ram o peratio n

to proceed. After the programming command has been

executed, the user must wait for the programming time

until programming is complete. The two instructions

following the start of the programming sequence

should be NOPs.

EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000,W0 ;

MOV W0,TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000,W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0,W2 ;

MOV #HIGH_BYTE_0,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1,W2 ;

MOV #HIGH_BYTE_1,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2,W2 ;

MOV #HIGH_BYTE_2,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

•

; 31st_program_word

MOV #LOW_WORD_31,W2 ;

MOV #HIGH_BYTE_31,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

Note: In Example 6-2, the contents of the upper byte of W3 have no effect.

DISI #5 ; Block all interrupts with priority < 7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F4011/4012

TABLE 6-1: NVM REGISTER MAP(1)

File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

NVMCON 0760 WR WREN WRERR — — — —TWRI — PROGOP<6:0> 0000 0000 0000 0000

NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu

NVMADRU 0764 — — — — — — — — — NVMADR<22:16> 0000 0000 uuuu uuuu

NVMKEY 0766 — — — — — — — —KEY<7:0> 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

7.0 DATA EEPROM MEMORY

The data EEPROM memory is readable and writable

during normal operation over the entire VDD range. The

data EEPROM memory is directly mapped in the

program memory address space.

The four SFRs used to read and write the program

Flash memory are used to access data EEPROM

memory, as well. As described in Section 6.0 “Flash

Program Memory”, these registers are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

The EEPROM data memory allows read and write of

single words and 16-word blo cks. When interfacing to

data memory, NVMADR, in conjunction with the

NVMADRU register, is used to address the EEPROM

location being accessed. TBLRDL and TBLWTL instruc-

tions are used to read and write data EEPROM. The

dsPIC30F401 1/4012 devices have 1 Kbyte (512 words)

of data EEPROM, with an address range from

0x7FFC00 to 0x7FFFFE.

A word write operation should be preceded by an erase

of the corresponding memory location(s). The write

typically requires 2 ms to complete, but the write time

will vary with voltage and temperature.

A program or erase operation on the data EEPROM

does not stop the instruction flow. The user is respon-

sible for waiting for the appropriate duration of time

before initiating another data EEPROM write/erase

operation. Attempting to read the data EEPROM while

a programming or erase operation is in progress results

in unspecified data.

Control bit, WR, initiates write operations, similar to

program Flash writes. This bit cannot be cleared, only

set, in software. This bit is cleared in hardware at the

completion of the write o peration. The inability to clear

the WR bit in software prevents the accidental or

premature termination of a write operation.

The WREN bit, when set, will allow a write operation.

On power-up, the WREN bit is clear . The WRERR bit is

set when a write operation is interrupted by a MCLR

Reset, or a WDT Time-out Reset, during normal oper-

ation. In these situations, following Reset, the user can

check the WRERR bit and rewrite the location. The

address register, NVMADR, remains unchanged.

7.1 Reading the Data EEPROM

A TBLRD instruction reads a word at the current pro-

gram word address. This example uses W0 as a

pointer to data EEPROM. The result is placed in

EXAMPLE 7-1: DATA EEPROM READ

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Interrupt flag bit, NVMIF in the IFS0

must be cleared in software.

MOV #LOW_ADDR_WORD,W0 ; Init Pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1

TBLPAG

TBLRDL [ W0 ], W4 ; read data EEPROM

dsPIC30F4011/4012

7.2 Erasing Data EEPROM

7.2.1 ERASING A BLOCK OF DATA

EEPROM

In order to erase a block of data EEPROM, the

NVMADRU and NVMADR registers must initially

point to the block of memory to be erased. Configure

NVMCON for erasing a block of data EEPROM and

set the WR and WREN bits in the NVMCON register.

Setting the WR bit initiates the erase, as shown in

Example 7-2.

EXAMPLE 7-2: DATA EEPROM BLOCK ERASE

7.2.2 ERASING A WORD OF DATA

EEPROM

The TBLPAG and NVMADR registers must point to

the block. Select erase a block of data Flash and set

the WR and WREN bits in the NVMCON register.

Setting the WR bit initiates the erase, as shown in

Example 7-3.

EXAMPLE 7-3: DATA EEPROM W ORD ERASE

; Select data EEPROM block, WR, WREN bits

MOV #0x4045,W0

MOV W0,NVMCON ; Initialize NVMCON SFR

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority < 7

; for next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

; Select data EEPROM word, WR, WREN bits

MOV #0x4044,W0

MOV W0,NVMCON

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

dsPIC30F4011/4012

7.3 Writing to the Data EEPROM

To write an EEPROM data location, the following

sequence must be followed:

1. Erase data EEPROM word.

a) Select word, data EEPROM; erase and set

WREN bit in NVMCON register.

b) Write address of word to be erased into

NVMADRU/NVMADR.

c) Enable NVM interrupt (optional).

d) Write 0x55 to NV MKEY.

e) Write 0xAA to NVMKEY.

f) Set the WR bit. This will begin erase cycle.

g) Either poll NVMIF bit or wait for NVMIF

interrupt.

h) The WR bit is cleared when the erase cycle

ends.

2. Write data word into data EEPROM write

latches.

3. Program 1 data word into data EEPROM.

a) Select word, data EEPROM; program and

set WREN bit in NVMCON register.

b) Enable NVM write done interrupt (optional).

c) Wr it e 0x55 to NVMKEY.

d) Write 0xAA to NVMKEY.

e) Set the WR bit. This will begin program

cycle.

f) Either poll NVMIF bit or wait for NVM

interrupt.

g) The WR bit is cleared whe n the write cycle

ends.

The write will not initiate if the above sequence is not

exactly followed (write 0x55 to NVMKEY, write 0xAA to

NVMCON, then set WR bit) for each word. It is strongly

recommended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in NVMCON must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution. The WREN bit should be kep t clear at all times

except when updati ng the EEPR OM. The WREN bit is

not cleared by hardware.

After a write sequence has been initiated, clearing the

WREN bit will not affect the current write cycle. The WR

bit will be inhibited from being set unless the WREN bit

is set. The WREN bit must be set on a previous

instruction. Both WR and WREN cannot be set with the

same instruction.

At the completion of the write cycle, the WR bit is

cleared in hardware and the Nonvolatile Memory Write

Complete Interrupt Flag bit (NVMIF) is set. The user

may either enable this in terrupt or poll this bit. NVMIF

must be cleared by software.

7.3.1 WRITING A WORD OF DATA

EEPROM

Once the user has erased the word to be programmed,

then a table write instruction is used to write one write

latch, as shown in Example 7-4.

EXAMPLE 7-4: DATA EEPROM WORD WRITE

; Point to data memory

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #LOW(WORD),W2 ; Get data

TBLWTL W2,[ W0] ; Write data

; The NVMADR captures last table access address

; Select data EEPROM for 1 word op

MOV #0x4004,W0

MOV W0,NVMCON

; Operate key to allow write operation

DISI #5 ; Block all interrupts with priority < 7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate program sequence

NOP

; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

dsPIC30F4011/4012

7.3.2 WRITING A BLOCK OF DATA

EEPROM

To write a block of data EEPROM, write to all sixteen

latches first, then set the NVMCON register and

program the block.

EXAMPLE 7-5: DATA EEPROM BLOCK WRITE

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #data1,W2 ; Get 1st data

TBLWTL W2,[ W0]++ ; write data

MOV #data2,W2 ; Get 2nd data

TBLWTL W2,[ W0]++ ; write data

MOV #data3,W2 ; Get 3rd data

TBLWTL W2,[ W0]++ ; write data

MOV #data4,W2 ; Get 4th data

TBLWTL W2,[ W0]++ ; write data

MOV #data5,W2 ; Get 5th data

TBLWTL W2,[ W0]++ ; write data

MOV #data6,W2 ; Get 6th data

TBLWTL W2,[ W0]++ ; write data

MOV #data7,W2 ; Get 7th data

TBLWTL W2,[ W0]++ ; write data

MOV #data8,W2 ; Get 8th data

TBLWTL W2,[ W0]++ ; write data

MOV #data9,W2 ; Get 9th data

TBLWTL W2,[ W0]++ ; write data

MOV #data10,W2 ; Get 10th data

TBLWTL W2,[ W0]++ ; write data

MOV #data11,W2 ; Get 11th data

TBLWTL W2,[ W0]++ ; write data

MOV #data12,W2 ; Get 12th data

TBLWTL W2,[ W0]++ ; write data

MOV #data13,W2 ; Get 13th data

TBLWTL W2,[ W0]++ ; write data

MOV #data14,W2 ; Get 14th data

TBLWTL W2,[ W0]++ ; write data

MOV #data15,W2 ; Get 15th data

TBLWTL W2,[ W0]++ ; write data

MOV #data16,W2 ; Get 16th data

TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.

MOV #0x400A,W0 ; Select data EEPROM for multi word op

MOV W0,NVMCON ; Operate Key to allow program operation

DISI #5 ; Block all interrupts with priority < 7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start write cycle

NOP

dsPIC30F4011/4012

7.4 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in appli cations where excessive writes

can stress bits near the specification limit.

7.5 Protection Against Spurious Write

There are conditio ns when th e de vice may not wan t to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared;

also, the Power-up Timer prevents EEPROM write.

Together , the write initiate sequence and the WREN bit

help prevent an accidental write during brown-out,

power glitch or software malfunction.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

8.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared between the peripherals and

the parallel I/O ports.

All I/O input ports feature Schmitt Trigger inputs for

improved noise immunity.

8.1 Parallel I/O (PIO) Ports

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

may be read, but the output driver for the Pa rallel Port

bit will be disabled. If a peripheral is enabled, but the

peripheral is not actively drivin g a pin, th at pin may be

driven by a port.

All port pins have three registers directly associated

with the operation of the port pin. The Data Direction

or an output. If the Data Direction register bit is a ‘1’,

then the pin is an input. All port pins are defined as

input s af ter a R eset. Re ads from the latch (LATx), read

the latch. Writes to the latch, write the latch (LATx).

Reads from the port (PORTx), read the port pins and

writes to the port pins, write the latch (LATx).

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabled. That means the corresponding LATx and

TRISx registers and the port pin will read as zeros.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nevertheless

regarded as a dedicated port because there is no

other competing source of outputs. An ex ample is the

INT4 pin.

The format of the registers for PORTx are shown in

Table 8-1.

The TRISx (Data Direction) register controls the direc-

tion of the pins. T he LATx register supplies data to the

outputs and is readable/writable. Reading the PORTx

to the PORTx register modifies the contents of the

LATx register.

A parallel I/O (PIO) port that shares a pin with a periph-

eral is, in general, subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has ownership of the output data and control signals of

the I/O pad cell. Figure 8-2 shows how ports are shared

with other peripherals and the associated I/O cell (pad)

to which they are connected. Table 8-1 and Table 8-2

show the formats of the registers for the sh ared ports,

PORTB through PORTG.

FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

WR LAT +

TRIS Latch

I/O Pad

WR PORT

Data Bus

Data Latch

Read LAT

Read PORT

Read TRIS

WR TRIS

I/O Cell

Dedicated Port M od u l e

dsPIC30F4011/4012

FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

8.2 Configuring Analog Port Pins

The use of the ADPCFG and TRIS registers control the

operation of the A/D port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared

(output), the digital output level (VOH or VOL) will be

converted.

When reading the PORT register , all pins configured as

analog input channels will read as cleared (a low level).

Pins configured as digital inputs will not convert an ana-

log input. Analog levels on any pin tha t is defined a s a

digital input (including the ANx pins), may cause the

input buffer to consume current that exceeds the

device specifications.

8.2.1 I/O PORT WRITE/READ TIMING

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically this instruction

would be a NOP.

EXAMPLE 8-1: PORT WRITE/READ

EXAMPLE

WR LAT +

TRIS Latch

I/O Pad

WR PORT

Data Bus

Data Latch

Read LAT

Read PORT

Read TRIS

WR TRIS

Peripheral Output Data

Peripheral Input Data

I/O Cell

Peripheral Module

Peripheral Output Enable

PIO Module

Output Multiplexers

Input Data

Peripheral Module Enable

Output Enable

Output Data

MOV 0xFF00, W0 ; Configure PORTB<15:8>

; as inputs

MOV W0, TRISBB ; and PORTB<7:0> as outputs

NOP ; Delay 1 cycle

BTSS PORTB, #13 ; Next Instruction

dsPIC30F4011/4012

TABLE 8-1: dsPIC30F4011 PORT REGISTER MAP(1)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 — — — — — — — TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0001 1111 1111

PORTB 02C8 — — — — — — — RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CA — — — — — — — LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — — — — 1110 0000 0000 0000

PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — — — — 0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — — — — 0000 0000 0000 0000

TRISD 02D2 — — — — — — — — — — — — TRISD3 TRISD2 TRISD1 TRISD0 0000 0000 0000 1111

PORTD 02D4 — — — — — — — — — — — — RD3 RD2 RD1 RD0 0000 0000 0000 0000

LATD 02D6 — — — — — — — — — — — — LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000

TRISE 02D8 — — — — — — —TRISE8—— TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0001 0011 1111

PORTE 02DA — — — — — — —RE8—— RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000

LATE 02DC — — — — — — —LATE8—— LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000

TRISF 02DE — — — — — — — — — TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111

PORTF 02E0 — — — — — — — — — RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000

LATF 02E2 — — — — — — — — — LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

TABLE 8-2: dsPIC30F4012 PORT REGISTER MAP(1)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 — — — — — — — — — — TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0000 0011 1111

PORTB 02C8 — — — — — — — — — — RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CB — — — — — — — — — — LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — — — — 1110 0000 0000 0000

PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — — — — 0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — — — — 0000 0000 0000 0000

TRISD 02D2 — — — — — — — — — — — — — — TRISD1 TRISD0 0000 0000 0000 0011

PORTD 02D4 — — — — — — — — — — — — — — RD1 RD0 0000 0000 0000 0000

LATD 02D6 — — — — — — — — — — — — — —LATD1LATD00000 0000 0000 0000

TRISE 02D8 — — — — — — —TRISE8—— TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0001 0011 1111

PORTE 02DA — — — — — — —RE8—— RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000

LATE 02DC — — — — — — —LATE8—— LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000

TRISF 02EE — — — — — — — — — — — — TRISF3 TRISF2 — — 0000 0000 0000 1100

PORTF 02E0 — — — — — — — — — — — —RF3RF2— — 0000 0000 0000 0000

LATF 02E2 — — — — — — — — — — — — LATF3 LATF2 — — 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

8.3 Input Change Notification Module

The input change notification module provides the

dsPIC30F devices the ability to generate interrupt

requests to the processor in response to a change of

state on selected input pins. This module is capable of

detecting input change of states, even in Sleep mode,

when the clocks are disabled. There are 10 external

signals (CN0 through CN7, CN17 and CN18) that may

be selected (enabled) for generating an interrupt

request on a change of state.

Please refer to the pin diagrams for CN pin location s.

TABLE 8-3: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)(1)

SFR Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000

CNEN2 00C2 ————— CN18IE(2) CN17IE(2) —0000 0000 0000 0000

CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000

CNPU2 00C6 ————— CN18PUE(2) CN17PUE(2) —0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F F a m i l y Refe rence Ma nu al” (DS70046) for descriptions of register bit fields.

2: These bits are not avail able on dsPIC30F4012 devices.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

9.0 TIMER1 MODULE

This section describes the 16-bit general purpose

Timer1 module and associated operational modes.

Figure 9-1 depicts the simplified block diagram of the

16-bit Timer1 module.

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated block diagrams for the operational modes of the

timers.

The T imer1 module is a 16-bit timer which can serve as

the time counter for the Real-Time Clock, or operate as

a free-running, interval timer/counter. The 16-bit timer

has the following modes:

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Further, the following operational characteristics are

supported:

• Timer gate operation

• Selectable prescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or fallin g

edge of external gate signal

These operating modes are determined by setting the

appropriate bit(s) i n the 16-bit SFR , T1CON. Figure 9-1

present s a b lock diagram of the 16-bit timer module.

16-bit Timer Mode: In the 16-bit T imer mode, the timer

increments on every instruction cycle up to a match

value, preloaded into the Period register, PR1, then

resets to 0 and continues to count.

When the CPU goe s into the Idle mode, the timer will

stop incrementing unless the TSIDL (T1CON<13>)

bit = 0. If TSIDL = 1, the timer module logic will resume

the incrementing sequence upon termination of the

CPU Idle mode.

16-bit Synchronous Counter Mode: In the 16-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in PR1,

then resets to 0 and continues.

When the CPU goe s into the Idle mode, the timer will

stop incrementing unless the respective TSIDL bit = 0.

If TSIDL = 1, the timer module logic will resume the

incrementing sequence upon termination of the CPU

Idle mode.

16-bit Asynchronous Counter Mode: In the 16-bit

Asynchronous Counter mode, the timer increm ents on

every rising edge of the applied external clock signal.

The timer counts up to a match value preloaded in PR1,

then resets to 0 and continues.

When the timer is configured for the Asynchronous mode

of operation, and the CPU goes into the Idle mode, the

timer will stop incrementing if TSIDL = 1.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Timer1 is a ‘Type A’ timer. Please refer to

the specifications for a Type A timer in

Section 24.0 “Electrical Characteristics”

of this document.

dsPIC30F4011/4012

FIGURE 9-1: 16-BIT TI MER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)

9.1 Timer Gate Operation

The 16-bit timer can be placed in the Gated Time Accu-

mulation mode. This mode allows the internal TCY to

increment the respective timer when the gate input

signal (T1CK pin) is asserted high. Control bit, TGAT E

(T1CON<6>), must be set to enable this mode. The

timer must be enabled (TON = 1) and the timer clock

source set to internal (TCS = 0).

When the CPU goes into the Idle mode, the timer will

stop incrementing unless TSIDL = 0. If TSIDL = 1, the

timer will resume the incrementing sequence upon

termination of the CPU Idle mode.

9.2 Timer Prescaler

The input clock (FOSC/4 or external clock) to the 16-bit

T imer has a prescale option of 1:1, 1:8, 1:64 and 1:256

selected by control bits, TCKPS<1:0> (T1CON<5:4>).

The prescaler counter is cleared when any of the

following occurs:

• A write to the TMR1 register

• Clearing of the TON bit (T1CON<15>)

• A device Reset, such as a POR and BOR

However, if the timer is disabled (TON = 0), then the

timer prescaler cannot be reset since the prescaler

clock is halted.

The TMR1 register is not cleared when the T1CON

9.3 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will operate if:

• The timer module is enabled (TON = 1) and

• The timer clock source is selected as external

(TCS = 1) and

• The TSYNC bit (T1CON<2>) is asserted to a logic

‘0’, which defines the external clock source as

asynchronous

When all three conditions are true, the timer will

continue to count up to the Period register and be reset

to 0x0000.

When a match between the timer and the Period regis-

ter occurs, an interrupt can be generated if the

respective timer interrupt enable bit is asserted.

TON

Sync

SOSCI

SOSCO/

PR1

T1IF

Equal Comparator x 16

TMR1

Reset

LPOSCEN

Event Flag

TSYNC

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

T1CK

TCS

TGATE

Gate

Sync

dsPIC30F4011/4012

9.4 Timer Interrupt

The 16-bit timer has the ability to generate an interrupt

on period match. When the timer count matches the

Period register , the T1IF bit is asserted and an interrupt

will be generated, if enabled. The T1IF bit must be

cleared in software. The Timer Interrupt Flag, T1IF, is

located in the IFS0 control register in the interrupt

controller.

When the Gated Time Accumulation mode is enabled,

an interrupt will also be generated on the falling edge of

the gate signal (at the end of the accumulation cycle).

Enabling an interrupt is accomplished via the respec-

tive T imer Interrupt Enable bit, T1IE. The timer interrupt

enable bit is located in the IEC0 Control register in the

interrupt controller.

9.5 Real-Time Clock

Timer1, when operating in Real-Time Clock (RTC)

mode, provides time-of-day and event time-stamping

capabilities. Key operational features of the RTC are:

• Operation from 32 kHz LP oscillator

• 8-bit prescaler

• Low power

• Real-Time Clock interrupts

These operating modes a re determined by setting the

appropriate bit(s) in the T1C ON Control register

FIGURE 9-2: RECOMMENDED

COMPONENTS FOR

TIMER1 LP OSCILLATOR

REAL-TIME CLOCK (RTC)

9.5.1 RTC OSCILLATOR OPERATION

When TON = 1, TCS = 1 and TGATE = 0, the timer

increments on the rising edge of the 32 kHz LP oscilla-

tor output signal, up to the value specified in the Period

The TSYNC bit must be asserted to a logic ‘0’

(Asynchronous mode) for correct operation.

Enabling LPOSCEN (OSCCON<1>) will disable the

normal Timer and Counter modes and enable a timer

carry-out wake-up event.

When the CPU enters Sleep mode, the RTC will con-

tinue to operate, provided the 32 kHz external crystal

oscillator is active and the control bits have not been

changed. The TSIDL bit should be cleared to ‘0’ in

order for RTC to continue operation in Idle mode.

9.5.2 RTC INTERRUPTS

When an interrupt event occurs, the respective Timer

Interrupt Flag, T1IF, is asserted and an interrupt will be

generated, if enabled. The T1 IF bit must be cleared in

software. The respective Timer Interrupt Flag, T1IF, is

located in the IFS0 Status register in the interrupt

controller.

Enabling an interrupt is accomplished via the

respective Timer Interrupt Enable bit, T1IE. The Timer

Interrupt Enable bit is located in the IEC0 control

SOSCI

SOSCO

dsPIC30FXXXX

32.768 kHz

XTAL

C1 = C2 = 18 pF; R = 100K

dsPIC30F4011/4012

TABLE 9-1: TIMER1 REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR1 0100 T imer1 Register uuuu uuuu uuuu uuuu

PR1 0102 Period Register 1 1111 1111 1111 1111

T1CON 0104 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS —0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

10.0 TIMER2/3 MODULE

This section describes the 32-bit general purpose timer

module (Timer2/3) and associated operational modes.

Figure 10-1 depicts the simplified bl ock diag ram of th e

32-bit Timer2/3 module. Figure 10-2 and Figure 10-3

show Timer2/3 configured as two independent 16-bit

timers, Timer2 and Timer3, respectively.

The Timer2/3 module is a 32-bit timer, which can be

configured as two 16-bit timers, with selectable operat-

ing modes. These timers are utilized by other

peripheral modules, such as:

• Input Capture

• Output Com pare/Simpl e PWM

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated block diagrams for the operational modes of the

timers.

The 32-bit timer has the following modes:

• Two independent 16-bit timers (Timer2 and

Timer3) with all 16-bit operating modes (except

Asynchronous Counter mode)

• Single 32-bit timer operation

• Single 32-bit synchronous counter

Further, the following operational characteristics are

supported:

• ADC Event Trigger

• Timer Gate Operation

• Selectable Prescaler Settings

• Timer Operation During Idle and Sleep Modes

• Interrupt on a 32-bit Period Register Match

These operating modes a re determined by setting the

appropriate bit(s) in the 16-bit T2CON and T3CON

SFRs.

For 32-bit timer/counter operation, Timer2 is the least

significant word and Timer3 is the most significant word

of the 32-bit timer.

16-bit Mode: In the 16-bit mode, Timer2 and Timer3

can be configured as two independent 16-bit timers.

Each timer can be set up in either 16-bit T imer mode or

16-bit Synchronous Counter mode. See Section 9.0

“Timer1 Module”, T imer1 Module, for details on these

two operating modes.

The only functional difference between Timer2 and

Timer3 is that Timer2 provides synchronization of the

clock prescaler output. This is useful for high-frequency

external clock inputs.

32-bit Timer Mode: In the 32-bit T imer mode, the timer

increments on every instruction cycle up to a match

value, preloaded into the combined 32-bit Period

count.

For synchronous 32-bit reads of the Timer2/Timer3

pair, reading the least significant word (TMR2 register)

will cause the msw to be read and latched into a 16-bit

holding register, termed TMR3HLD.

For synchronous 32-bit writes, the holding register

(TMR3HLD) must first be written to. When followed by

a write to the TMR2 register , the contents of TMR3HLD

will be transferred and latched into the MSB of the

32-bit timer (TMR3).

32-bit Synchronous Counter Mode: In the 32-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in the

combined 32-bit period register, PR3/PR2, then resets

to 0 and continues.

When the timer is configured for the Synchronous

Counter mode of operation and the CPU goes into the

Idle mode, the timer will stop incrementing unless the

TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer

module logic will resume the incrementing sequence

upon termination of the CPU Id le mode.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Timer2 is a ‘Type B’ timer and Timer3 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 24.0

“Electrical Characteristics” of this

document.

Note: For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits

are used for setup and control. Timer2

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer3 Interrupt Flag

(T3IF) and the interrupt is enabled with the

Timer3 Interrupt Enable bit (T3IE).

dsPIC30F4011/4012

FIGURE 10-1: 32-BIT TIMER 2/3 BLOCK DIAGRAM

TMR3 TMR2

T3IF

Equal Comparator x 32

PR3 PR2

Reset

LSB

MSB

Event Flag

Note: Timer configuration bit, T32 (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T2CON register.

Data Bus<15:0>

TMR3HLD

Read TMR2

Write TMR2 16

TGATE(T2CON<6>)

(T2CON<6>)

TGATE

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

ADC Event Trigger

Sync

dsPIC30F4011/4012

FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM

FIGURE 10-3: 16-BIT TIMER3 BLOCK DIAGRAM

TON

Sync

PR2

T2IF

Equal Comparator x 16

TMR2

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

TON

PR3

T3IF

Equal Comparator x 16

TMR3

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

ADC Event Trigger

Sync

Note: The dsPIC30F4011/4012 devices do not have external pin inputs to Ti mer3. In these devices, the following

modes should not be used:

1. TCS = 1.

2. TCS = 0 and TGATE = 1 (gated time accumulation).

dsPIC30F4011/4012

10.1 Timer Gate Operation

The 32-bit timer can be placed in the Gated Time Accu-

mulation mode. This mode allows the internal TCY to

increment the respective timer when the gate input sig-

nal (T2CK pin) is asserted high. Control bit, TGATE

(T2CON<6>), must be set to enable this mode. When

in this mode, Timer2 is the originating clock source.

The TGATE setting is ignored for Timer3. The timer

must be enabled (TON = 1) and the timer clock source

set to internal (TCS = 0).

The falling edge of the external signal terminates the

count operation but does not reset the timer. The user

must reset the timer in order to start counting from zero.

10.2 ADC Event Trigger

When a match occurs between the 32-bit timer (TMR3/

TMR2) and the 32-bit co mbined Period register (PR3/

PR2), a special ADC trigger event signal is generate d

by Timer3.

10.3 Timer Prescaler

The input clock (F OSC/4 or external clock) to the timer

has a prescale option of 1:1, 1:8, 1:64 and 1:256,

selected by control bits, TCKPS<1:0> (T2CON<5:4>

and T3CON<5:4>). For the 32-bit timer operation, the

originating clock source is T imer2. The prescaler oper-

ation for Timer3 is not applicable in this mode. The

prescaler counter is cleared when any of the followin g

occurs:

• A write to the TMR2/TMR3 register

• Clearing either of the TON bits (T2CON<15> or

T3CON<15>) to ‘0’

• A device Reset, such as a POR and BOR

However, if the timer is disabled (TON = 0), then the

Timer 2 prescaler cannot be reset, since the prescaler

clock is halted.

The TMR2/TMR3 register is not cleared when the

T2CON/T3CON register is written.

10.4 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

10.5 Timer Interrupt

The 32-bit timer module can generate an interrupt on

period match, or on the falling edge of the external gate

signal. When the 32-bit timer count matches the

respective 32-bit Period regi ster, or th e falling edge of

the external “gate” signal is detected, the T3IF bit

(IFS0<7>) is asserted and an interrupt will be gener-

ated, if enabled. In this mode, the T3IF interrupt flag is

used as the source of the interrupt. The T3IF bit must

be cleared in software.

Enabling an interrupt is accomplished via the

respective T imer Interrupt Enable bit, T3IE (IEC0<7>).

dsPIC30F4011/4012

TABLE 10-1: TIMER2/3 REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR2 0106 T imer2 Register uuuu uuuu uuuu uuuu

TMR3HLD 0108 T imer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu

TMR3 010A T imer3 Register uuuu uuuu uuuu uuuu

PR2 010C Period Register 2 1111 1111 1111 1111

PR3 010E Period Register 3 1111 1111 1111 1111

T2CON 0110 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000 0000 0000 0000

T3CON 0112 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

11.0 TIMER4/5 MODULE

This section describes the second 32-bit general

purpose timer module (Timer4/5) and associated

operational modes. Figure 11-1 depicts the simplified

block diagram of the 32-bit Timer4/5 module.

Figure 11-2 and Figure 11-3 illustrate Timer4/5

configured as two independent 16-bit timers, Timer4

and Timer5, respectively.

The Timer4/5 module is similar in operation to the

Timer 2/3 module. However, there are some

differences, which are as follows:

• The Timer4/5 module does not support the ADC

event trigger feature

• Timer4/5 can not be utilized by other perip he ra l

modules such as input capture and output compare

The operating modes of the Timer4/5 module are

determined by setting the appropriate bit(s) in the 16-bit

T4CON and T5CON SFRs.

For 32-bit timer/counter operation, Timer4 is the least

significant word and Timer5 is the most significant word

of the 32-bit timer.

FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Timer4 is a ‘Type B’ timer and Timer5 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 24.0

“Electrical Characteristics” of this

document.

Note: For 32-bit timer operation, T5CON control

bits are ignored. Only T4CON control bits

are used for setup and control. Timer4

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer5 Interrupt Flag

(T5IF) and the interrupt is enabled with the

Timer5 Interrupt Enable bit (T5IE).

TMR5 TMR4

T5IF

Equal Comparator x 32

PR5 PR4

Reset

LSB

MSB

Event Flag

Note 1: T4CK is not implemented and this line is tied to VSS.

2: Timer configuration bit, T32 (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control bits are

respective to the T4CO N regist e r.

Data Bus<15:0>

TMR5HLD

Read TMR4

Write TMR4 16

CK TGATE(T4CON<6>)

(T4CON<6>)

TGATE

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

T4CK(1)

dsPIC30F4011/4012

FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM

FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM

TON

Sync

PR4

T4IF

Equal Comparator x 16

TMR4

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

T4CK(1)

Note 1: T4CK is not implemented and this line is tied to VSS.

TON

PR5

T5IF

Equal Comparat or x 16

TMR5

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

ADC Event Trigger

Sync

Note: The dsPIC30F4011/4012 devices do not have an external pin input to Timer5. In these devices, the

following modes should not be used:

1. TCS = 1.

2. TCS = 0 and TGATE = 1 (gated time accumulation).

dsPIC30F4011/4012

TABLE 11-1: TIMER4/5 REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR4 0114 Timer4 Register uuuu uuuu uuuu uuuu

TMR5HLD 0116 T imer5 Holding Register (For 32-bit operations only) uuuu uuuu uuuu uuuu

TMR5 0118 Timer5 Register uuuu uuuu uuuu uuuu

PR4 011A Period Register 4 1111 1111 1111 1111

PR5 011C Period Register 5 1111 1111 1111 1111

T4CON 011E TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T45 —TCS—0000 0000 0000 0000

T5CON 0120 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS—0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

12.0 INPUT CAPTURE MODULE

This section describes the input capture module and

associated operational modes. The features provided by

this module are useful in applications requiring

frequency (period) and pulse measurement. Figure 12-1

depicts a block diagram of the input capture module.

Input capture is useful for such modes as:

• Frequency/Period/Pulse Measurements

• Additional Sources of External Interrupts

The key operational features of the input capture

module are:

• Simple Capture Event mode

• Timer2 and Timer3 mode selection

• Interrupt on input capture event

These operating modes are determined by setting the

appropriate bits in the ICxCON register (where x = 1, 2,

...N). The dsPIC30F4011/4012 devices have four

capture channels.

FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: The dsPIC30F4011/4012 devices have

four capture inputs: IC1, IC2, IC7 and IC8.

The naming of these four capture chan-

nels is intentional and preserves so ftware

compatibility with other dsPIC Digital

Signal Controllers.

ICxBUF

Prescaler

ICx

ICM<2:0>

Mode Select

Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture

channels 1 through N.

Set Flag

ICxIF

ICTMR

T2_CNT T3_CNT

Edge

Detection

Logic

Clock

Synchronizer

1, 4, 16

From Timer Module

16 16

FIFO

R/W

Logic

ICI<1:0>

ICBNE, ICOV

ICxCON Interrupt

Logic

Set Flag

ICxIF

Data Bus

dsPIC30F4011/4012

12.1 Simple Capture Event Mode

The simple capture events in the dsPIC30F product

family are:

• Capture every falling edge

• Capture ev ery risi ng ed ge

• Capture every 4th rising edge

• Capture every 16th rising edge

• Capture every rising and falling edge

These simple Input Capture modes are configured by

setting the appropriate bits ICM<2:0> (ICxCON< 2:0>).

12.1.1 CAPTURE PRESCALER

There are four input capture prescaler se ttings, speci-

fied by bits, ICM<2:0> (ICxCON<2:0>). Whe never the

capture channel is turned off, the prescaler counter will

be cleared. In addition, any Reset will clear the

prescaler counter.

12.1.2 CAPTURE BUFFER OPERATION

Each capture channel has an associated FIFO buffer

which is four, 16-bit words deep. There are two status

flags which provide status on the FIFO buffer:

• ICBNE – Inp ut Ca pture Buffer Not Empty

• ICOV – Input Capture Overflow

The ICBNE bit will be set on the first input capture event

and remain set until all capture events have been read

from the FIFO. As each word is read from the FIFO, the

remaining words are advanced by one position within

the buffer.

In the event that the FIFO is full with four capture

events, and a fifth capture event occurs prior to a read

of the FIFO, an overflow condition will occur and the

ICOV bit will be set to a logic ‘1’. The fifth capture event

is lost and is not stored in the FIFO. No additional

events will be captured till all four events have been

read from the bu ffer.

If a FIFO read is performed after the last read and no

new capture event has been received, the read will

yield indeterminate results.

12.1.3 TIMER2 AND TIMER3 SELECTION

MODE

Each capture channel can select between one of two

timers for the time base, Ti mer2 or Timer3.

Selection of the timer resource is accomplished

through SFR bit, ICTMR (ICxCON<7>). Timer3 is the

default timer resource available for the input capture

module.

12.1.4 HALL SENSOR MODE

When the input capture module is set for capture on

every edge, rising and falling, ICM<2:0> = 001, the fol-

lowing operations are performed by the input capture

logic:

• The input capture interrupt flag is set on every

edge, rising and falling.

• The interrupt on Capture mode setting bits,

ICI<1:0>, is ignored, si nce every capture

generates an interrupt.

• A capture overflow condition is not generated in

this mode.

12.2 Input Capture Operation During

Sleep and Idle Modes

An input capture event wi ll g enerate a devi ce wake -up

or interrupt, if enabled, if the device is in CPU Idle or

Sleep mode.

Independent of the timer being enabled, the input

capture module will wake-up from the CPU Sleep or Idle

mode when a capture event occurs, if ICM<2:0> = 111

and the interrupt enable bit is asserted. The same wake-

up can generate an interrupt if the conditions for

processing the interrupt have been satisfied. The wake-

up feature is useful as a method of adding extra external

pin interrupts.

12.2.1 INPUT CAPTURE IN CPU SLEEP

MODE

CPU Sleep mode allows input capture module opera-

tion with reduced functionality. In the CPU Sleep

mode, the ICI<1:0> bits are not applicable, and the

input capture module can on ly function as an external

interrupt source.

The capture module must be configured for interrupt

only on the rising ed ge (ICM<2:0> = 111) in order for

the input capture module to be used while the device

is in Sleep mode. The prescale setti ngs of 4:1 or 16:1

are not applicable in this mode.

12.2.2 INPUT CAPTURE IN CPU IDLE

MODE

CPU Idle mode allows input capture module operation

with full functionality. In the CPU Idle mode, the interrupt

mode selected by the ICI<1:0> bits are applicable, as

well as the 4:1 and 16:1 capture prescale settings w hich

are defined by control bits ICM<2:0>. This mode

requires the selected timer to be enabled. More over , the

ICSIDL bit must be asserted to a logic ‘0’.

If the input capture module is defined as

ICM<2:0> = 111 in CPU Idle mode, the input capture

pin will serve only as an external interrupt pin.

dsPIC30F4011/4012

12.3 Input Capture Interrupts

The input capture channels have the ability to generate

an interrupt, based upon the selected number of

capture events. The selection number is set by contro l

bits, ICI<1:0> (ICxCON<6:5>).

Each channel provides an interrupt flag (ICxIF) bit. The

respective capture channel interrupt flag is located in

the corresponding IFSx register.

Enabling an interrupt is accomplished via the respec-

tive Capture Channel Interrupt Enable (ICxIE) bit. The

capture interrupt enable bit is located in the

corresponding IECx register.

dsPIC30F4011/4012

TABLE 12-1: INPUT CAPTURE REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu

IC1CON 0142 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu

IC2CON 0146 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu

IC7CON 015A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu

IC8CON 015E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

13.0 OUTPUT COMPARE MODULE

This section describes the output compare module and

associated operational modes. The features provided

by this module are useful in applications requiring

operational modes, such as:

• Generation of Variable Width Output Pulses

• Power Factor Correction

Figure 13-1 illustrates a block diagram of the output

compare module.

The key operational features of the output compare

module include:

• Timer2 and Timer3 Selection mode

• Simple Output Compare Match mode

• Dual Output Compare Match mode

• Simple PWM mode

• Output Compare during Sleep and Idle modes

• Interrupt on Output Compare/PWM Event

These operating modes are determined by setting the

appropriate bits in the 16-bit OCxCON SFR (where x = 1,

2, ... N). The dsPIC30F4011/4012 devices have

4/ 2 compare channels, respectively.

OCxRS and OCxR in the figure represent the Dual

Compare registers. In the Dual Compare mode, the

OCxR register is used for the first compare and OCxRS

is used for the second compare.

FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

OCxR

Comparator

Output

Logic QS

OCM<2:0>

Output Enable

OCx

Set Flag bit,

OCxIF

OCxRS

Mode Select

Note: Where ‘x’ is shown, reference is made to t he registers associated with the r espe ctive output compare channels 1

through N.

OCFA

OCTSEL 01

T2P2_MATCH

TMR2<15:0 TMR3<15:0> T3P3_MATCH

From Timer Module

(for x = 1, 2, 3 or 4)

dsPIC30F4011/4012

13.1 Timer2 and T imer3 Selection Mode

Each output compare channel can select between one

of two 16-bit timers: T imer2 or Timer3.

The selection of the timers is controlled by the OCTSEL

bit (OCxCON<3>). T imer2 is the default timer resource

for the output compare module.

13.2 Simple Output Compare Match

Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 001,

010 or 011, the selected output compare channel is

configured for one of three simple Output Compare

Match modes:

• Compare forces I/O pin low

• Compare forces I/O pin high

• Compare toggles I/O pin

The OCxR register is used in these modes. The OCxR

selected incrementing timer count. When a compare

occurs, one of these Compare Match modes occurs. If

the counter resets to zero before reaching the val ue i n

OCxR, the state of the OCx pin remains unchanged.

13.3 Dual Output Compare Match Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 100

or 101, the selected output compare channel is

configured for one of two Dual Output Compare modes

which are:

• Single Output Pulse mode

• Continuous Output Pulse mode

13.3.1 SINGLE OUTPUT PULSE MODE

For the user to configure the module for the generation

of a single output pulse, the following steps are

required (assuming timer is off):

• Determine instruction cycle time TCY

• Calculate desired pulse width value based on TCY

• Calculate time to start pulse from timer st art value

of 0x0000

• Write pulse width start and stop times into OCxR

and OCxRS Compare registers (x denotes

channel 1, 2, ..., N)

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register

• Set OCM<2:0> = 100

• Enable timer, TON bit (TxCON<15>) = 1

To initiate another single pulse, issue another write to

set OCM<2:0> = 100.

13.3.2 CONTINUOUS OUTPUT PULSE

MODE

For the user to configure the module for the generation

of a continuous stream of ou tput pulses, the following

steps are required:

• Determine instruction cycle time TCY

• Calculate desired pul se value based on TCY

• Calculate timer to start pulse width from timer st art

value of 0x0000

• Write pulse width start and stop times into OCxR

and OCxRS (x denotes channel 1, 2, ..., N)

Compare registers, respectively

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register.

• Set OCM<2: 0> = 101

• Enable timer, TON bit (TxCON<15>) = 1

13.4 Simple PWM Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 110

or 111, the selected output compare channel is config-

ured for the PWM mode of operation. When configured

for the PWM mode of operation, OCxR is the main latch

(read-only) and OCxRS is the secondary latch. This

enables glitchless PWM transitions.

The user must perform the following steps in order to

configure the output compare module for PWM

operation:

1. Set the PWM period by writing to the appropriate

Period register.

2. Set the PWM duty cycle by writing to the OCxRS

3. Configure the output compare module for PWM

operation.

4. Set the TMRx prescale value and enable the

timer, TON bit (TxCON<15>) = 1.

13.4.1 INPUT PIN FAULT PROTECTION

FOR PWM

When control bits, OCM<2:0> (OCxCON<2:0>) = 111,

the selected output compare channel is again config-

ured for the PWM mode of operation with the additional

feature of input Fault protection . While in this mode, if

a logic ‘0’ is detected on the OCFA pin, the respective

PWM output pin is placed in the high -impedance input

state. The OCFLT bit (OCxCON<4>) indicates whether

a Fault condition has occurred. This state will be

maintained until both of the following events have

occurred:

• The external Fault condition has been removed

• The PWM mode has been re-enabled by writing

to the appropriate control bits

dsPIC30F4011/4012

13.4.2 PWM PERIOD

The PWM period is specified by writing to the PRx

Equation 13-1.

EQUATION 13-1: PWM PERIOD

PWM frequency is defined as 1/[PWM period].

When the selected TMRx is equal to its respective

Period register , PRx, the following four events occur on

the next increment cycle:

• TMRx is cleared

• The OCx pin is set

- Exception 1: If PWM duty cycle is 0x0000,

the OCx pin will remain low.

- Exception 2: If duty cycle is greater than PRx,

the pin will remain high.

• The PWM duty cycle is latched from OCxRS into

OCxR

• The corresponding timer interrupt flag is set

See Figure 13-1 for key PWM period comparisons.

Timer3 is referred to in th e fi gu re for cl arity.

FIGURE 13-1: PWM OUTPUT TIMING

PWM period = [(PRx) + 1] • 4 • TOSC •

(TMRX prescal e val ue)

Period

Duty Cycle

TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR)

TMR3 = PR3

T3IF = 1

(Interrupt Flag)

OCxR = OCxRS

TMR3 = PR3

(Interrupt Flag)

OCxR = OCxRS

T3IF = 1

dsPIC30F4011/4012

13.5 Output Compare Operation During

CPU Sleep Mode

When the CPU enters the Sleep mode, all internal

clocks are stopped. Therefore, when the CPU enters

the Sleep state, the output compare channel will drive

the pin to the active state that was observed prior to

entering the CPU Sleep state.

For example, if the pin was high when the CPU

entered the Sleep state, the pin will remain high . Like-

wise, if the pin was low when the CPU entered the

Sleep state, the pin will remain low. In either case, th e

output compare module will resume operation when

the device wakes up.

13.6 Output Compare Operation During

CPU Idle Mode

When the CPU enters the Idle mode, the output

compare module can operate with full functionality.

The output compare channel will operate during the

CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at

logic ‘0’ and the selected time base (T imer2 or Timer3)

is enabled and the TSIDL bit of the selected timer is

set to logic ‘0’.

13.7 Output Compare Interrupts

The output compare channels have the ability to gener-

ate an interrupt on a compare match for whichever

Match mode has been selected.

For all modes except the PWM mode, when a compare

event occurs, the respective interrupt flag (OCxIF) is

asserted and an interrupt will be generated if enab led.

The OCxIF bit is located in the corresponding IFSx reg-

ister, and must be cleared in software. The interrupt is

enabled via the respective Compare Interrupt Enable

(OCxIE) bit, located in the corresponding IECx register .

For the PWM mode, when an event occurs, the respec-

tive T imer Interrupt Flag (T2IF or T3IF) is asserted and

an interrupt will be generated if enabled. The TxIF bit is

located in the IFS0 register and must be cleared in

software. The interrupt is enabled via the respective

Timer Interrupt Enable bit (T2IE or T3IE) located in the

IEC0 register. The output compare interrupt flag is

never set during the PWM mode of operation.

dsPIC30F4011/4012

TABLE 13-1: OUTPUT COMPARE REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000

OC1R 0182 Output Compare 1 Main Regist er 0000 0000 0000 0000

OC1CON 0184 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000

OC2R 0188 Output Compare 2 Main Regist er 0000 0000 0000 0000

OC2CON 018A ——OCSIDL— — — — — — — — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000

OC3RS(2) 018C Output Compare 3 Secondary Register 0000 0000 0000 0000

OC3R(2) 018E Output Compare 3 Main Regist er 0000 0000 0000 0000

OC3CON(2) 0190 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC4RS(2) 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000

OC4R(2) 0194 Output Compare 4 Main Register 0000 0000 0000 0000

OC4CON(2) 0196 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

2: These registers are not availa ble on dsPIC30F4012 devices.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

14.0 QUADRATURE ENCODER

INTERFACE (QEI) MODULE

This section describes the Quadrature Encoder Inter-

face (QEI) module and associated operationa l modes.

The QEI module provides the interface to incremental

encoders for obtaining mechanica l position data.

The operational features of the QEI include:

• Three input channels for two phase signals and

index pulse

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-bit Timer/Counter mode

• Quadrature Encoder Interface interrupts

These operating modes a re determined by setting the

appropriate bits QEIM<2:0> (QEICON<10:8>).

Figure 14-1 depicts the Quadrature Encoder Interface

block diagram.

FIGURE 14-1: QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

16-bit Up/Down Counter

Comparator/

Max Count Register

Quadrature

Programmable

Digital Filter

QEA

Programmable

Digital Filter

INDX

Up/Down

Encoder

Programmable

Digital Filter

QEB

Interface Logic

QEIM<2:0>

Mode Select

(POSCNT)

(MAXCNT)

QEIIF

Event

Flag

Reset

Equal

TCY

TQCS TQCKPS<1:0>

1, 8, 64, 256

Prescaler

TQGATE

QEIM<2:0>

Synchronize

Det

Sleep Input

UPDN_SRC

QEICON<11> Zero Detect

Note: In dsPIC30F4011/4012, the UPDN pin is not available. Up/Down logic bit can still be polled by software.

dsPIC30F4011/4012

14.1 Quadrature Encoder Interface

Logic

A typical, incremental (a.k.a. optical) encoder has three

outputs: Phase A, Phase B and an index pulse. The se

signals are useful and often required in position and

speed control of ACIM and SR motors.

The two channels, Phase A (QEA) and Phase B (QEB),

have a unique relationship. If Phase A leads Phase B,

then the direction (of the motor) is deeme d positive or

forward. If Phase A lags Phase B, then the direction (of

the motor) is deemed negative or reverse.

A third channel, termed index pulse, occurs once per

revolution and is used as a reference to establish an

absolute position. The index pulse coincides with

Phase A and Phase B, both low.

14.2 16-bit Up/Down Position Counter

Mode

The 16-bit Up/Down Counter counts up or down on

every count pulse, which is generated by the difference

of the Phase A and Phase B input signals. The counter

acts as an integrator , whose count value is proportional

to position. The direction of the count is determined by

the UPDN signal which is generated by the Quadrature

Encoder Interface Logic.

14.2.1 POSITION COUNTER ERROR

CHECKING

Position counter error ch ecking in the QEI is provided

for and indica ted by the CNTERR bit (QEICON<15>).

The error checking only applies when the position

counter is configured for Reset on the Index Pulse

modes (QEIM<2:0> = 110 or 100). In these modes, the

contents of the POSCNT register are compared with

the values (0xFFFF or MAXCNT + 1, depending on

direction). If these values are detected, an error condi-

tion is generated by setting the CNTERR bit and a QEI

count error interrupt is generated. Th e QEI cou nt error

interrupt can be disabled by setting the CEID bit

(DFLTCON<8>). The position counter continues to

count encoder edges after an error has been detected.

The POSCNT register continues to count up/down until

a natural rollover/underflow. No interrupt is generated

for the natural rollover/underflow event. The CNTERR

bit is a read/write bit and reset in software by the user.

14.2.2 POSITION COUNTER RESET

The Position Counter Reset Enable bit, POSRES (QEI-

CON<2>) controls whether the position counter is reset

when the index pulse is detected. This bit is only

applicable when QEIM<2:0> = 100 or 110.

If the POSRES bit is set to ‘1’, then the position counter

is reset when the index pulse is detected. If the

POSRES bit is set to ‘0’, then the position counter is not

reset when the index pulse is detected. The position

counter will continue counting up or down and will be

reset on the rollover or underflow condition.

When selecting the INDX signal to reset the position

counter (POSCNT), the user has to specify the states

on the QEA and QEB input pins. These states have to

be matched in order for a Reset to occur. These states

are selected by the IMV<1:0> bits (DFLTCON<10:9>).

The Index Match Value bits (IMV<1:0>) allow the user

to specify the state of the QEA and QEB input pins,

during an index pulse, when the POSCNT register is to

be reset.

In 4x Quadrature Count mode:

IMV1 = Required state of Phase B input signal for

match on index pulse

IMV0 = Required state of Phase A input signal for

match on index pulse

In 2x Quadrature Count mode:

IMV1 = Selects phase input signal for index state

match (0 = Phase A, 1 = Phase B)

IMV0 = Required state of the selected phase input

signal for match on index pulse

The interrupt is still generated on the detection of the

index pulse and not on the position counter overflow/

underflow.

14.2.3 COUNT DIRECT ION STATUS

As mentioned in the previous section, the QEI logic

generates an UPDN signal, based upon the relation-

ship between Pha se A and Pha se B. In ad ditio n to the

output pin, the state of this internal UPDN signal is

supplied to an SFR bit, UPDN (QEICON<11>), as a

read-only bit.

Note: QEI pins are multiplexed with analog

inputs. The user must insure that all QEI

associated pins are set as digital inputs in

the ADPCFG register.

dsPIC30F4011/4012

14.3 Position Measurement Mode

There are two Measurement modes which are sup-

ported and are termed x2 and x4. These modes are

selected by the QEIM<2:0> (QEICON<10:8>) mode

select bits.

When control bits, QEIM<2:0> = 100 or 101, the x2

Measurement mode is selected and th e QEI logic o nly

looks at the Phase A input for the position counter

increment rate. Every rising and falling edge of the

Phase A signal causes the position counter to be incre-

mented or decremented. The Phase B signal is still

utilized for the determination of the counter direction

just as in the x4 mode.

Within the x2 Measurement mode, there are two

variations of how the position counter is reset:

1. Position counter reset by detection of index

pulse, QEIM<2:0> = 100.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 101.

When control bits, QEIM<2:0> = 110 or 111, the x4

Measurement mode is selected and the QEI logic looks

at both edges of the Phase A and Phase B input sig-

nals. Every edge of both signals causes the position

counter to increment or decrement.

Within the x4 Measurement mode, there are two

variations of how the position counter is reset:

1. Position counter reset by detection of index

pulse, QEIM<2:0> = 110.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 111.

The x4 Measurement mode provides for finer resolu-

tion data (more position counts) for determining motor

position.

14.4 Programmable Digital Noise

Filters

The digital noise filter section is responsible for

rejecting noise on the incoming quadrature signals.

Schmitt Trigger inputs and a three-clock cycle delay

filter combine to reject low-level noise an d large, short

duration, noise spikes that typically occur in noise

prone applications, such as a motor system.

The filter ensures that the filtered output signal is not

permitted to change until a stable value has been

registered for three consecutive clock cycles.

For the QEA, QEB and INDX pins, the clock divide

frequency for the digital filter is programmed by bits

QECK<2:0> (DFLTCON<6:4>) and are derived from

the base instruction cycle TCY.

To enable the filte r output for ch annels QEA, QEB an d

INDX, the QEOUT bit must be ‘1’. The filter network for

all channels is disabled on POR and BOR.

14.5 Alternate 16-bit Timer/Counter

When the QEI module is not configured for the QEI

mode, QEIM<2:0> = 001, the module can be config-

ured as a simple 16-bit timer/counter. The setup and

control of the auxiliary timer is accomplished through

the QEICON SFR register. This timer functions identi-

cally to T imer1. The QEA pin is used as the timer clock

input.

When configured as a timer, the POSCNT register

serves as the Timer Count register and the MAXCNT

Period register match occurs, the QEI interrupt flag will

be asserted.

The only exception between the general purpose tim-

ers and this timer is the added feature of external up/

down input select. When the UPDN pin is asserted

high, the timer will increment up. When the UPDN pin

is asserted low, the timer will be decremented.

The UPDN control/status bit (QEICON<11>) can be

used to select the count direction state of the Timer

UPDN = 0, the timer will count down.

In addition, control bit, UPDN_SRC (QEICON<0>),

determines whether the timer count direction state is

based on the logi c state writte n into the UPDN control/

status bit (QEICON<11>) or the QEB pin state. When

UPDN_SRC = 1, the timer count direction is controlled

from the QEB pin. Likewise, when UPDN_SRC = 0, the

timer count direction is controlled by the UPDN bit.

14.6 QEI Module Operation During CPU

Sleep Mode

14.6.1 QEI OPERATION DURING CPU

SLEEP MODE

The QEI module will be halted during the CPU Sleep

mode.

14.6.2 TIMER OPERATION DURING CPU

SLEEP MODE

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

Note: Changing the operational mode (i.e., from

QEI to timer or vice versa) will not affect the

Timer/Position Count re gister contents.

Note: This timer does not support the External

Asynchronous Counter mode of opera tion.

If using an external clock source, the clock

will automatically be synchronized to the

internal instruction cycle.

dsPIC30F4011/4012

14.7 QEI Module Operation During CPU

Idle Mode

Since the QEI module can function as a quadrature

encoder interface, or as a 16-bit timer, the following

section describes operation of the module in both

modes.

14.7.1 QEI OPERATION DURING CPU IDLE

MODE

When the CPU is placed in the Idle mo de, the QEI mod-

ule will operate if the QEISIDL bit (QEICON<13>) = 0.

This bit defaults to a logic ‘0’ upon executing POR and

BOR. For halting the QEI module during the CPU Idle

mode, QEISIDL should be set to ‘1’.

14.7.2 TIMER OPERATION DURING CPU

IDLE MODE

When the CPU is p laced in the Idle mode and the QEI

module is configured in the 16-bit Timer mode, the

16-bit timer will operate if the QEISIDL bit (QEI-

CON<13>) = 0. This bit defaults to a logic ‘0’ upon

executing POR and BOR. For halting the timer module

during the CPU Idle mode, QEISIDL should be set

to ‘1’.

If the QEISIDL bit is cleared, the timer will function

normally as if the CPU Idle mode had not been

entered.

14.8 Quadrature Encoder Interface

Interrupts

The quadrature encoder interface has the ability to

generate an interrupt on occurrence of the following

events:

• Interrupt on 16-bit up/down position counter

rollover/underflow

• Detection of qualified index pulse or if CNT ERR

bit is set

• Timer period match event (overflow/underflow)

• Gate accumu l a ti on eve n t

The QEI Interrupt Flag bit, QEIIF, is asserted upon

occurrence of any of the above events. The QEIIF bit

must be cleared in software. QEIIF is located in the

IFS2 register.

Enabling an interrupt is accomplished via the respec-

tive Enable bit, QEIIE. The QEIIE bit is located in the

IEC2 register.

dsPIC30F4011/4012

TABLE 14-1: QEI REGISTER MAP(1)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

QEICON 0122 CNTERR — QEISIDL INDX UPDN QEIM2 QEIM1 QEIM0 SWPAB — TQGATE TQCKPS1 TQCKPS0 POSRES TQCS UPDN_SRC 0000 0000 0000 0000

DFLTCON 0124 — — — — — IMV1 IMV0 CEID QEOUT QECK2 QECK1 QECK0 — — — — 0000 0000 0000 0000

POSCNT 0126 Position Counter<15:0> 0000 0000 0000 0000

MAXCNT 0128 Maximun Coun t<15:0> 1111 1111 1111 1111

ADPCFG 02A8 — — — — — — — PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

15.0 MOTOR CONTROL PWM

MODULE

This module simplifie s the task of generating multiple,

synchronized Pulse-Width Modulated (PWM) outputs.

In particular, the following power and motion control

applications are supported by the PWM module:

• Three-Phase AC Induction Motor

• Switched Reluctance (SR) Motor

• Brushless DC (BLDC) Motor

• Uninterruptible Power Supply (UPS)

The PWM module has the following features:

• 6 PWM I/O pins with 3 duty cycle generators

• Up to 16-bit resolution

• ‘On-the-Fly’ PWM frequency changes

• Edge and Center-Aligned Output modes

• Single Pulse Generation mode

• Interrupt support for asymmetrical updates in

Center-Aligned mode

• Output override control for Electrically

Commutative Motor (ECM) operation

• ‘Special Event’ comparator for scheduling other

periphera l events

• Fault pins to optionally drive each of the PWM

output pins to a defined state

This module contains 3 duty cycle generators, num-

bered 1 through 3. The module has 6 PWM output pins,

numbered PWM1H/PWM1L through PWM3H/PWM3L.

The six I/O pins are grouped into high/low numbered

pairs, denoted by the suffix H or L, respectively. For

complementary loads, the low PWM pins are always

the complement of the corresponding high I/O pin.

The PWM module allows several modes of operation

which are beneficial for specific power control

applications.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

dsPIC30F4011/4012

FIGURE 15-1: PWM MODULE BLOCK DIAGRAM

PDC3

PDC3 Buffer

PWMCON1

PWMCON2

PTPER

PTMR

Comparator

Channel 3 Dead-Time

Generator and

PTCON

SEVTCMP

Comparator Special Event Trigger

OVDCON

PWM Enable and Mode SFRs

PWM Manual

Control SFR

Channel 2 Dead-Time

Generator and

Channel 1 Dead-Time

Generator and

PWM

Generator 2

PWM

PWM Generator 3

SEVTDIR

PTDIR

DTCON1 Dead-Time Control SFRs

Special Event

Postscaler

PWM1L

PWM1H

PWM2L

PWM2H

Note: Details of PWM Generators 1 and 2 are not shown for clarity.

16-bit Data Bus

PWM3L

PWM3H

FLTACON F ault Pin Control SFRs

PWM Time Base

Output

Driver

Block

FLTA

Override Lo g i c

PTPER Buffer

Generator 1

dsPIC30F4011/4012

15.1 PWM Time Base

The PWM time base is provided by a 15 -bit timer with

a prescaler and postscaler . The time base is accessible

via the PTMR SFR. PTMR<15> is a read-only status

bit, PTDIR, that indicates the present count direction of

the PWM time base. If PTDIR is cleared, PTMR is

counting upwards. If PTDIR is set, PTMR is counting

downwards. The PWM time base is co nfigured via the

PTCON SFR. The time base is enabled/disabled by

setting/clearing the PTEN bit in the PTCON SFR.

PTMR is not cleared when the PTEN bit is cleared in

software.

The PTPER SFR sets the counting period for PTMR.

The user must write a 15-bit value to PTPER<14:0>.

When the value in PTMR<14:0> matches the value in

PTPER<14:0>, the time base will ei ther reset to ‘0’, or

reverse the count direction on the next occurring clock

cycle. The action taken depends on the operating

mode of the time base.

The PWM time base can be configured for four different

modes of operation:

• Free-Running mode

• Single-Shot mode

• Continuous Up/Down Count mode

• Continuous Up /Down Count mode with interrupts

for double updates

These four modes are selected by the PTMOD<1:0>

bits in the PTCON SFR. The Continuous Up/Down

Count modes support center-aligned PWM generation.

The Single-Shot mode allows the PWM module to sup-

port pulse control of certain Electronically Commutative

Motors (ECMs).

The interrupt signals generated by the PWM time base

depend on the mode selection bits (PTMOD<1:0>) and

the postscaler bits (PT OPS<3:0>) in the PTCON SFR.

15.1.1 FREE-RUNNING MODE

In the Free-Running mode, the PWM time base counts

upwards until the value i n the Time Base Period regis-

ter (PTPER) is matched. The PTMR register is reset on

the following input clock edge and the time base will

continue to count upwards as long as the PTEN bit

remains set.

When the PWM time base is in the Free-Running mode

(PTMOD<1:0> = 00), an interrupt event is generated

each time a match with the PTPER register occurs and

the PTMR register is reset to zero. The postscaler

selection bits may be used in this mode of the timer to

reduce the frequency of the interrupt events.

15.1.2 SINGLE-SHOT MODE

In the Single-Shot mode, the PWM time base begins

counting upwards when the PTEN bit is set. When the

value in the PTMR regi ster matches th e PTPER regis-

ter, the PTMR register will be reset on the following

input clock edge and the PTEN bit will be cleared by the

hardware to halt the time base.

When the PWM time base is in the Single-Shot mode

(PTMOD<1:0> = 01), an interrupt event is generated

when a match with the PTPER register occurs, the

PTMR register is reset to zero on the following input

clock edge and the PTEN bit is cleared. The postscaler

selection bits have no effect in this mode of the timer.

15.1.3 CONTINUOUS UP/DOWN COUNT

MODES

In the Continuous Up/Down Count modes, the PWM

time base counts upwards until the value in the PTPER

downwards on the following input clock edge. The

PTDIR bit in the PTMR SFR is read-only and indicates

the counting direction. The PTDIR bit is set when the

timer counts downwards.

In the Continuous Up/Down Count mode

(PTMOD<1:0> = 10), an interrupt event is generated

each time the value of the PTMR register becomes

zero and the PWM time base begins to count upwards.

The postscaler selection bits may be used in this mode

of the timer to reduce the frequency of the interrupt

events.

Note: If the Period register is set to 0x0000, the

timer will stop counting, and the interrupt

and special event trigger will not be gener-

ated even if the special event value is also

0x0000. The module will not update the

Period register if it is already at 0x0000;

therefore, the user must disable the

module in order to update the Period

dsPIC30F4011/4012

15.1.4 DOUBLE UPDATE MODE

In the Double Update mode (PTMOD<1:0> = 11), an

interrupt event is generated each time the PTMR regis-

ter is equal to zero, as well as each time a period match

occurs. The postscaler selection bits have no effect in

this mode of the timer.

The Double Update mode provides two additional func-

tions to the user. First, the control loop bandwidth is

doubled because the PWM duty cycles can be

updated, twice per period. Second, asymmetrical

center-aligned PWM waveforms can be generated

which are useful for minimizing output waveform

distortion in certain motor control applications.

15.1.5 PWM TIME BASE PRESCALER

The input clock to PTMR (FOSC/4) has prescaler

options of 1:1, 1:4, 1:16 or 1:64, selected by control

bits, PTCKPS<1:0>, in the PTCON SFR. The prescaler

counter is cleared when any of the follo wing occurs:

• A write to the PTMR register

• A write to the PTCON register

• Any device Reset

The PTMR register is not cleared when PTCON is

written.

15.1.6 PWM TIME BASE POSTSCALER

The match output of PTMR can optionally be post-

scaled through a 4-bit p ostscaler (which gives a 1:1 to

1:16 scaling).

The postscaler counter is cleared when any of the

following occurs:

• A write to the PTMR register

• A write to the PTCON register

• Any device Reset

The PTMR register is not cleared when the PTCON

15.2 PWM Period

PTPER is a 15-bit register and is used to set the

counting period for the PWM time base. PTPER is a

double-buffered register. The PTPER buffer contents

are loaded into the PTPER register at the following

instants:

• Free-Running and Single-Shot modes: When the

PTMR register is reset to zero after a match with

the PTPER register.

• Continuous Up/Down Count modes: When the

PTMR register is zero.

The value held in the PTPER buffer is automatically

loaded into the PTPER register when the PWM time

base is disabled (PTEN = 0).

The PWM period can be determined using

Equation 15-1:

EQUATION 15-1: PWM PERIOD

If the PWM time base is configured for one of the

Continuous Up/Down Count modes, the PWM period is

provided by Equation 15-2.

EQUATION 15-2: PWM PERIOD

(CENTER-ALIGNED

MODE)

The maximum resolution (in bits) for a given device

oscillator and PWM frequency can be determined using

Equation 15-3:

EQUATION 15-3: PWM RESOLUTION

Note: Programming a value of 0x0001 in the

Period register could generate a

continuous interrupt pulse, and hence,

must be avoided.

TPWM = TCY • (PTPER + 1) • PTMR Prescale Value

TPWM = TCY • 2 • PTPER + 1) • PTMR Pres cale Value

Resolution = log (2 • TPWM/TCY)

log (2)

dsPIC30F4011/4012

15.3 Edge-Aligned PWM

Edge-aligned PWM signals are produced by the module

when the PWM time base is in the Free-Running or

Single-Shot mode. For ed ge -ali gned PWM output s, th e

output has a period specified by the value in PTPER

and a duty cycle specified by the appropriate duty cycle

active at the beginning of the period (PTMR = 0) and is

driven inactive when th e value in the d uty cycle re gister

matches PTMR.

If the value in a particular duty cycle register is zero,

then the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the duty cycle register is greater

than the value held in the PTPER register.

FIGURE 15-2: EDGE-ALIGNED PWM

15.4 Center-Aligned PWM

Center-aligned PWM signals are produced by the

module when the PWM time base is configured in a

Continuous Up/Down Count mode (see Figure 15-3).

The PWM compare output is driven to the active state

when the value of the duty cycle register matches the

value of PTMR and the PWM time base is counting

downwards (PTDIR = 1). The PWM compare output is

driven to the inactive state when the PWM time base is

counting upwards (PTDIR = 0) and the value in the

PTMR register matches the duty cycle value.

If the value in a particular duty cycle register is zero,

then the output on the corresponding PWM pin will be

inactive for the entire PWM period. In addition, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the duty cycle register is equal to

the value held in the PTPER register.

FIGURE 15-3: CENTE R-A LIGNED PW M

Period

Duty Cycle

PTPER

PTMR

Value

New Duty Cycle Latched

PTPER PTMR

Value

Period

Period/2

Duty

Cycle

dsPIC30F4011/4012

15.5 PWM Duty Cycle Comparison

Units

There are three 16-bit Special Function Registers

(PDC1, PDC2 and PDC3) used to specify duty cycle

values for the PWM module.

The value in each duty cycle register determines the

amount of time that the PWM output is in the active

state. The duty cycle registers are 16-bits wide. The

LSb of a duty cycle register determines whether the

PWM edge occurs in the beginning. Thus, the PWM

resolution is effectively doubled.

15.5.1 DUTY CYCLE REGISTER BUFFERS

The three PWM duty cycle registers are double-

buffered to allow glitchless updates of the PWM

outputs. For each duty cycle, there is a duty cycle

duty cycle register that holds the actual compare value

used in the present PWM period.

For edge-aligned PWM outpu t, a new d uty cycl e value

will be updated whenever a match with the PTPER reg-

ister occurs and PTMR is reset. The contents of the

duty cycle buffers are automatically loaded into the

duty cycle registers when the PWM time base is dis-

abled (PTEN = 0) and the UDIS bit is cleared in

PWMCON2.

When the PWM time base is in the Continuous Up/

Down Count mode, new duty cycle values are updated

when the value of the PTMR register is zero and the

PWM time base begins to count upwards. The contents

of the duty cycle buffers are automatically loaded into

the duty cycle registers when the PWM time base is

disabled (PTEN = 0).

When the PWM time base is in the Continuous Up/

Down Count mode with double updates, new duty cycle

values are updated when the value of the PTMR regis-

ter is zero, and when the value of the PTMR register

matches the value in the PTPER register . The contents

of the duty cycle buffers are automatically loaded into

the duty cycle registers when the PWM time base is

disabled (PTEN = 0).

15.6 Complementary PWM Operation

In the Complementary mode of operation, each pair of

PWM outputs is obtained by a complementary PWM

signal. A dead time may be optionally inserted during

device switching when both outputs are inactive for

a short period (refer to Section 15.7 “Dead-Time

Generators”).

In Complementary mode, the duty cycle comparison

units are assigned to the PWM outputs as follows:

• PDC1 register controls PWM1H/PWM1L outputs

• PDC2 register controls PWM2H/PWM2L outputs

• PDC3 register controls PWM3H/PWM3L outputs

The Complementary mode is selected for each PWM

I/O pin pair by clearing the appropriate PTMODx bit in

the PWMCON1 SFR. The PWM I/O pins are set to

Complementary mode by default upon a device Reset.

15.7 Dead-Time Generators

Dead-time generation may be provided when any of

the PWM I/O pin pairs are operating in the

Complementary Output mode. The PWM outputs use

push-pull drive circuits. Due to the inability of the power

output devices to switch instantaneously, some amount

of time must be provided between the turn-off event

of one PWM output in a complementary pair and the

turn-on event of the other transistor.

The PWM module allows two different dead times to be

programmed. These two dead times may be used in

one of two methods described b elow to increase user

flexibility:

• The PWM output signals can be optimized for

different turn-off times in the high side and low

side transistors in a complementary pair of tran-

sistors. The first dead time is inserted between

the turn-off event of the lower transistor of the

complementary pair and the turn-on event of the

upper transistor . The second dead time is inserted

between the turn-off event of the upper transistor

and the turn-on event of the lower transistor.

• The two dead times can be assigned to individual

PWM I/O pin pairs. This operating mode allows

the PWM module to drive different transistor/load

combinations with each complementary PWM I/O

pin pair.

dsPIC30F4011/4012

15.7.1 DEAD-TIME GENERATORS

Each complementary output pair for the PWM module

has a 6-bit down counter that is used to produce the

dead-time insertion. As shown in Figure 15-4, each

dead-time unit has a rising and falling edge detector

connected to the duty cycle comparison output.

15.7.2 DEAD-TIME RANGES

The amount of dead time provided by the dead-time

unit is selected by specifying the input clock prescaler

value and a 6-bit unsigned value.

Four input clock prescaler selections have been

provided to allow a suitable range of dead time based

on the device operating frequency. The dead-time

clock prescaler values are selected using the

DTAPS<1:0> control bits in the DTC ON1 SFR. One of

four clock prescaler options (TCY, 2 TCY, 4 TCY or 8 TCY)

may be selected.

After the prescaler value is selected, the dead time is

adjusted by loading 6-bit unsigned values into the

DTCON1 SFR.

The dead-time unit prescaler is cleared on the following

events:

• On a load of the down timer due to a duty cycle

comparison edge event.

• On a write to the DTCON 1 regi ster.

• On any device Reset.

FIGURE 15-4: DEAD-TIME TIMING DIAGRAM

Note: The user should not modify the DTCON1

operating (PTEN = 1). Unexpected results

may occur.

Duty Cycle Generator

PWMxH

PWMxL

Dead-Time A (Active) Dead-Time A (Inactive)

dsPIC30F4011/4012

15.8 Independent PWM Output

An Independent PWM Output mode is required for

driving certain types of loads. A particular PWM output

pair is in the Independent Output mode when the

corresponding PTMODx bit in the PWMCON1 re gister

is set. No dead-time control is implemented between

adjacent PWM I/O pins when the module is operating

in the Independent Output mo de and both I/O pin s are

allowed to be active simultaneously.

In the Independent Output mode, each duty cycle

generator is connected to both of the PWM I/O pins in

an output pair. By using the associated duty cycle reg-

ister and the appropriate bi ts in the OVDCON reg ister,

the user may select the followin g sig nal output op tio ns

for each PWM I/O pin operating in the Independent

Output mode:

• I/O pin outputs PWM signal

• I/O pin inactive

• I/O pin active

15.9 Single Pulse PWM Operation

The PWM module produces single pulse outputs when

the PTCON control bits, PTMOD<1:0> = 10. Only

edge-aligned outputs may be produced in the Single

Pulse mode. In Single Pulse mode, the PWM I/O pin(s)

are driven to the active state when the PTEN bit is set.

When a match with a duty cycle register occurs, the

PWM I/O pin is driven to the inactive state. When a

match with the PTPER register occurs, the PTMR reg-

ister is cleared, all active PWM I/O pins are driven to

the inactive state, the PTEN bit is cleared and an

interrupt is generated.

15.10 PWM Output Override

The PWM output override bi ts allow the use r to ma nu-

ally drive the PWM I/O pins to specified logic states,

independent of the duty cycle comparison units.

All control bits associated with the PWM output over-

ride function are contained in the OVDCON register.

The upper half of the OVDCON register contains six

bits, POVDxH<3:1> and POVDxL<3:1>, that determine

which PWM I/O pins will be overridden. Th e lower half

of the OVDCON register contains six bits,

POUTxH<3:1> and POUTxL<3:1>, that determine the

state of the PWM I/O pins when a particular output is

overridden via th e POVD bi ts.

15.10.1 COMPLEMENTARY OUTPUT MODE

When a PWMxL pin is driven active via the OVDCON

ment of the corresponding PWMxH pin in the pair.

Dead-time insertion is still performed when PWM

channels are overridden manually.

15.10.2 OVERRIDE SYNCHRONIZATION

If the OSYNC bit in the PWMCON2 register is set, all

output overrides performed via the OVDCON register

are synchronized to the PWM time base. Synchronous

output overrides occur at the following times:

• Edge-Aligned mode when PTMR is zero.

• Center-Aligned modes when PTMR is zero and

when the value of PTMR matches PTPER.

dsPIC30F4011/4012

15.11 PWM Output and Polarity Control

There are three device Configuration bits associated

with the PWM module that provide PWM output pin

control:

• HPOL Configuration bit

• LPOL Configuration bit

• PWMPIN Configuration bit

These three bits in the FBORPOR Configuration regis-

ter (see Section 21.0 “System Integration”) work in

conjunction with the six PWM Enable bits (PENxL and

PENxH). The Configuration b its and PWM Enable bits

ensure that the PWM pins are in the correct states after

a device Reset occurs. The PWMPIN Configuration

fuse allows the PWM module outputs to be optionally

enabled on a device Reset. If PWMPIN = 0, the PWM

outputs will be driven to their inactive states at Reset. If

PWMPIN = 1 (default), the PWM outputs will be tri-

stated. The HPOL bit specifies the polarity for the

PWMxH outputs, whereas the LPOL bit specifies the

polarity for the PWMxL outputs.

15.11.1 OUTPUT PIN CONTROL

The PENxH<3:1> and PENxL<3:1> control bits in the

PWMCON1 SFR enable each high PWM output pin

and each low PWM output pin, respectively. If a

particular PWM output pin is not enabled, it is treated

as a general purpose I/O pin.

15.12 PWM Fault Pin

There is one Fault pin (FL TA) associated with the PWM

module. When asserted, this pin can optionally drive

each of the PWM I/O pins to a defined state.

15.12.1 FAULT PIN ENABLE BITS

The FLTACON SFR has three control bits that deter-

mine whether a particular p air of PWM I/O pins is to be

controlled by the Fault input pin. To enable a

specific PWM I/O pin pair for Fault overrides, the

corresponding bit should be set in the FLTACON

If all enable bits are clea red in the FLTACON reg ister,

then the corresponding Fault input pin has no effect on

the PWM module and the pin may be used as a general

purpose interrupt or I/O pin.

15.12.2 FAULT STATES

The FLTACON Special Function Register has six bits

that determine the state of each PWM I/O pin when it is

overridden by a Fault input. When these bits are

cleared, the PWM I/O pin is driven to the inactive state.

If the bit is set, the PWM I/O pin will be driven to the

active state. The active and inactive states are refer-

enced to the polarity defined for each PWM I/O pin

(HPOL and LPOL polarity control bits).

A special case exists when a PWM mo dule I/O pair is

in the Complementary mode and both pins are

programmed to be active on a Fault condition. The

PWMxH pin always has priority in th e Complementary

mode, so that both I/O pins cannot be driven active

simultaneously.

15.12.3 FAULT INPUT MODES

The Fault input pin has two modes of operation:

•Latched Mode: Whe n the Fault pin is driven low,

the PWM outputs will go to the states defined in

the FLTACON register. The PWM outputs will

remain in this state until the Fault pin is driven

high and the corresponding interrupt flag has

been cleared in software. When both of these

actions have occurred, the PWM outputs will

return to normal operation at the beginning of the

next PWM cycle or half-cycle boundary. If the

interrupt flag is cleared before the Fault condition

ends, the PWM module will wait until the Fault pin

is no longer asserted to restore the outputs.

•Cycle-by-Cycle Mode: When the Fault input pin

is driven low, the PWM outputs remain in the

defined Fault states for as long as the Fault pin is

held low. After the Fault pin is driven high, the

PWM outputs return to normal operation at the

beginning of the following PWM cycle or

half-cycle boundary.

The operating mode for the Fau lt input pin is selected

using the FLTAM control bit in the FLTACON Special

Function Register.

The Fault pin can be controlled manually in software.

Note: The Fault pin logic can operate indepen-

dent of the PWM logic. If all the enable bits

in the FL TACON register are cleared, then

the Fault pin could be used as a general

purpose interrupt pin. The Fault pin has an

interrupt vector, interrupt flag bit and

interrupt priority bits associated with it.

dsPIC30F4011/4012

15.13 PWM Update Lockout

For a complex PWM application, the user may need to

write up to three duty cycle registers and the T ime Base

Period register , PTPER, at a given time. In some appli-

cations, it is important that all buffer registers be written

before the new duty cycle and period values are loaded

for use by the modul e .

The PWM update lockout feature is enabled by setting

the UDIS control bit in the PWMCON2 SFR. The UDIS

bit affects all duty cycle buffer registers and the PWM

Time Base Period buffer, PTPER. No duty cycle

changes or period value changes will have effect while

UDIS = 1.

15.14 PWM Special Event Trigger

The PWM module has a special event trigger that

allows A/D conversions to be synchronized to the PWM

time base. The A/D sampling and conversion time may

be programmed to occur at any point within the PWM

period. The special event trigger allows the user to min-

imize the delay between the time when A/D conversion

results are acquired and the time when the duty cycle

value is updated.

The PWM special event trigger has an SFR named

SEVTCMP and five control bits to control its operation.

The PTMR value for which a special event trigger

should occur is loaded into the SEVTCMP register.

When the PWM time base is in a Continuous Up/Down

Count mode, an additional control bit is required to

specify the counting phase for the special event trigger .

The count phase is selected using the SEVTDIR con-

trol bit in the SEVTCMP SFR. If the SEVTDIR bit is

cleared, the special event trigger will occur on the

upward counting cycle of the PWM time base. If the

SEVTDIR bit is set, the special event trigger will occur

on the downward count cycle of the PWM time base.

The SEVTDIR control bit has no effect unless the PWM

time base is configured for a Continuous Up/Down

Count mode.

15.14.1 SPECIAL EVENT TRIGGER

POSTSCALER

The PWM special event trigger has a postscaler that

allows a 1:1 to 1:16 postscale ratio. The postscaler is

configured by writing the SEVOPS<3:0> control bits in

the PWMCON2 SFR.

The special event output postscaler is cleared on the

following events:

• Any write to the SEVTCMP register

• Any device Reset

15.15 PWM Operation During CPU Sleep

Mode

The Fault A input pin has the ability to wake the CPU

from Sleep mode. The PWM module generates an

interrupt if the Fault pin is dr iven low while in Sleep.

15.16 PWM Operation During CPU Idle

Mode

The PTCON SFR contains a PTSIDL control bit. This

bit determines if the PWM module will continue to

operate or stop when the device enters Idle mode. If

PTSIDL = 0, the module will continue to operate. If

PTSIDL = 1, the module will stop operatio n as long as

the CPU remains in Idle mode.

dsPIC30F4011/4012

TABLE 15-1: 6-OUTPUT PWM REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

PTCON 01C0 PTEN —PTSIDL ————— PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000

PTMR 01C2 PTDIR PWM T i mer Count Value 0000 0000 0000 0000

PTPER 01C4 — PWM Time Base Period Register 0111 1111 1111 1111

SEVTCMP 01C6 SEVTDIR PWM Special Event Compare Register 0000 0000 0000 0000

PWMCON1 01C8 — — — — — PTMOD3 PTMOD2 PTMOD1 — PEN3H PEN2H PEN1H —PEN3LPEN2LPEN1L0000 0000 1111 1111

PWMCON2 01CA — — — — SEVOPS<3:0> — — — — — IUE OSYNC UDIS 0000 0000 0000 0000

DTCON1 01CC ———————— DTAPS<1:0> Dead-Time A Value 0000 0000 0000 0000

FLTACON 01D0 —— FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM ———— FAEN3 FAEN2 FAEN1 0000 0000 0000 0000

OVDCON 01D4 —— POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L —— POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000

PDC1 01D6 PWM Duty Cycle 1 Register 0000 0000 0000 0000

PDC2 01D8 PWM Duty Cycle 2 Register 0000 0000 0000 0000

PDC3 01DA PWM Duty Cycle 3 Register 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

16.0 SPI™ MODULE

The Serial Peripheral Interface (SPI™) module is a

synchronous serial interface. It is useful for communi-

cating with other peripheral devices, such as

EEPROMs, shift registers, display drivers and A/D

converters, or other microcontrollers. It is compatible

with Motorola’s SPI and SIOP interfaces.

16.1 Operating Function Description

The SPI module consists of a 16-bit shift register,

SPI1SR, used for shifting data in and out, and a buffer

configures the module. Additionally, a status register,

SPI1STAT, indicates various status conditions.

The serial interface consists of 4 pins: SDI1 (Serial Dat a

Input), SDO1 (Serial Data Output), SCK1 (Shift Clock

Input or Output), and SS1 (active-low Slave Select).

In Master mode operation, SCK1 is a cl ock output, but

in Slave mode, it is a clock input.

A series of eight (8) or sixteen (16) clock pulses shift

out bits from the SPI1SR to SDO1 pin, and simultane-

ously, shifts in data from SDI1 pin. An interrupt is gen-

erated when the transfer is complete and the

corresponding interrupt flag bit (SPI1IF) is set. This

interrupt can be disabled through an interrupt enable

bit (SPI1IE).

The receive operation is double-buffered. When a

complete byte is received, it is transferred from

SPI1SR to SPI1BUF.

If the receive buffer is full when new data is being

transferred from SPI1SR to SPI1BUF, the module will

set the SPIROV bit, indicating an overflow condition.

The transfer of the data from SPI1SR to SPI1BUF will

not be completed and the new data will be lost. The

module will not respond to SCL transitions while

SPIROV is ‘1’, effectively disabling the module until

SPI1BUF is read by user software.

Transmit writes are also double-buffered. The user

writes to SPI1BUF. When the master or slave transfer

is completed, the contents of the shift register

(SPI1SR) is moved to the receive buffer. If any trans-

mit data has been written to the buffer register, the

contents of the transmit buffer are moved to SPI1SR.

The received data is thus placed in SPI1BUF and the

transmit data in SPI1SR is ready for the next transfer.

In Master mode, the clock is generated by prescaling

the system clock. Data is transmitted as soon as a

value is written to SPI1BUF. The interrupt is generated

at the middle of the transfer of th e last bit.

In Slave mode, data is transmitted and received as

external clock pulses appear on SCK1. Again, the

interrupt is generated when the last bit is latched. If

SS1 control is enabled, then transmission and recep-

tion are enabled only when SS1 = low. The SDO1

output will be disabled in SS1 mode with SS1 high.

The clock provided to the module is (FOSC/4). This

clock is then prescaled by the primary (PPRE<1:0>)

and secondary (SPRE<2:0>) prescale factors. The

CKE bit determines whether transmit occurs on transi-

tion from active clock state to Idle clock state, or vice

versa. The CKP bit selects the Idle state (high or low)

for the clock.

16.1.1 WORD AND BYTE

COMMUNICATION

A control bit, MODE16 (SPI1CON<10>), allows the

module to communicate in either 16-bit or 8-bit mode.

16-bit operation is identical to 8-bit operation, except

that the number of bits transmitted is 16 instead of 8.

The user software must disable the module prior to

changing the MODE16 bit. The SPI module is reset

when the MODE16 bit is changed by the user.

A basic difference between 8-bit and 16-bit operation is

that the data is transmitted out of bit 7 of the SPI1SR

for 8-bit operation, and data is transmitted out of bit 15

of the SPI1SR for 16-bit operation. In both modes, data

is shifted into bit 0 of the SPI1SR.

16.1.2 SDO1 DISABLE

A control bit, DISSDO, is provided to the SPI1CON

will allow the SPI module to be connected in an input

only configuration. SDO1 can also be used for general

purpose I/O.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Both the transmit buffer (SPI1TXB) and

the receive buffer (SPI1RXB) are mapped

to the same register address, SPI1BUF.

dsPIC30F4011/4012

16.2 Framed SPI Support

The module supports a basic framed SPI protocol in

Master or Slave mode. The control bit, FRMEN,

enables framed SPI support and causes the SS1 pin to

perform the frame synchronization pulse (FSYNC)

function. The control bit, SPIF SD, determines wh ether

the SS1 pin is an input or an output (i.e., whether the

module receives or generates the frame synchroniza-

tion pulse). The frame pulse is an active-high pulse for

a single SPI clock cycle. When frame synchronization

is enabled, the data transmission starts only on the

subsequent transmit edge of the SPI clock.

FIGURE 16-1: SPI BLOCK DIAGRAM

FIGURE 16-2: SPI MASTER/SLAVE CONNECTION

Read Write

Internal

Data Bus

SDI1

SDO1

SS1

SCK1

SPI1SR

SPI1BUF

bit 0

Shift

Clock Edge

Select

FCY

Primary

1, 4, 16, 64

Enable Master Clock

Prescaler

Secondary

Prescaler

1, 2, 4, 6, 8

Transmit

SPI1BUF

Receive

SS1 and

Control

Clock

Control

FSYNC

Serial Input Buffer

(SPI1BUF)

Shift Register

(SPI1SR)

MSb LSb

SDO1

SDI1

PROCESSOR 1

SCK1

SPI Master

Serial Input Buffer

(SPI1BUF)

LSb

MSb

SDI1

SDO1

PROCESSOR 2

SCK1

SPI Slave

Serial Clock

Shift Register

(SPI1SR)

dsPIC30F4011/4012

16.3 Slave Select Synchronization

The SS1 pin allows a Synchronous Slave mode. The

SPI must be configured in SPI Slave mode, with SS1

pin control enabled (SSEN = 1). When the SS1 pin is

low, transmission and reception are enabled and the

SDO1 pin is driven. When SS1 pin goes high, the

SDO1 pin is no longer d riven. Also, the SPI module is

resynchronized and all counters/control circuitry are

reset. Therefore, when the SS1 pin is asserted low

again, transmission/reception will begin at the MSb,

even if SS1 had been deasserted in the middle of a

transmit/receive.

16.4 SPI Operation During CPU Sleep

Mode

During Sleep mode, the SPI module is shut down. If

the CPU enters Sleep mode while an SPI transaction

is in progress, then the transmission and reception is

aborted.

The transmitter and receiver will stop in Sleep mode.

However, register contents are not affected by

entering or exiting Sleep mode.

16.5 SPI Operation During CPU Idle

Mode

When the device enters Idle mode, all clock sources

remain functional. The SPISIDL bit (SPI1STAT<13>)

selects if the SPI module will stop or continue on Idle.

If SPISIDL = 0, the module will continue to operate

when the CPU enters Idle mode. If SPISIDL = 1, the

module will stop when the CPU enters Idle mode.

dsPIC30F4011/4012

TABLE 16-1: SPI1 REGISTER MAP(1)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

SPI1STAT 0220 SPIEN — SPISIDL — — — — — — SPIROV — — — —SPITBFSPIRBF0000 0000 0000 0000

SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

17.0 I2C™ MODULE

The Inter-Integrated Circuit (I2C™) module provides

complete hardware support for both Slave and Multi-

Master modes of the I2C serial communication

standard with a 16-bit interface.

This module offers the following key features:

•I

2C Interface supporting both Ma ster and Slave

Operation

•I

2C Slave mode supports 7-bit and 10-bit address-

ing

•I

2C Master mode support s 7-bit and 10 -bit

addressing

•I

2C Port allows Bidirectional Transfers between

Master and Slaves

• Serial Clock Synchronization for I2C Port can be

used as a Handshake Mechanism to Suspend

and Resume Serial Transfer (SCLREL control)

•I

2C supports Multi-Master Operation; detects bus

collision and will arbitrate accordingly

17.1 Operating Function Description

The hardware fully implements all the master and slave

functions of the I2C Standard and Fast mode

specifications, as well as 7 and 10-bit ad dressing.

Thus, the I2C module can operate e ither as a slave or

a master on an I2C bus.

17.1.1 VARIOUS I2C MODES

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit addressing

•I

2C slave operation with 10-bit addressing

•I

2C master operation with 7-bit or 10-bit addressing

See the I2C programmer ’s model in Figure 17-1.

17.1.2 PIN CONFIG URA TI ON IN I2C MODE

I2C has a 2-pin interface. The SCL pin is clock and the

SDA pin is data.

17.1.3 I2C REGISTERS

I2CCON and I2CSTA T are control and status registers,

respectively . The I2CCON register is readable and writ-

able. The lower 6 bits of I2CSTAT are read-only. The

remaining bits of the I2CSTAT are read/write.

I2CRSR is the shift register used for shifting data,

whereas I2CRCV is the buffer register to which data

bytes are written or from which data bytes are read.

I2CRCV is the receive buffer, as shown in Figure 17-1.

I2CTRN is the transmit register to which bytes are

written during a transmit operation, as shown in

Figure 17-2.

The I2CADD register holds the slave address. A status

bit, ADD10, indicates 10-bit Address mode. The

I2CBRG acts as the Baud Rate Generator reload

value.

In receive operations, I2CRSR and I2CRCV together

form a double-buffered receiver. When I2CRSR

receives a complete byte, it is transferred to I2CRCV

and an interrupt pulse is generated. During

transmission, the I2CTRN is not double-buffered.

FIGURE 17-1: PROGRAMMER’S MODEL

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Note: Following a Restart condition in 10-bit

mode, the user only needs to match the

first 7-bit address.

bit 7 bit 0 I2CRCV (8 bits)

bit 7 bit 0 I2CTRN (8 bits)

bit 8 bit 0 I2CBRG (9 bits)

bit 15 bit 0 I2CCON (16-bits)

bit 15 bit 0 I2CSTAT (16-bits)

bit 9 bit 0 I2CADD (10-bits)

dsPIC30F4011/4012

FIGURE 17-2: I2C™ BLOCK DIAGRAM

I2CRSR

I2CRCV

Internal

Data Bus

SCL

SDA

Shift

Match Detect

I2CADD

Start and

Stop bit Detect

Clock

Addr_Match

Clock

Stretching

I2CTRN LSB

Shift

Clock

Write

Read

BRG Down I2CBRG

Reload

Control

FCY

Start, Restart,

Stop bit Generate

Write

Read

Acknowledge

Generation

Collision

Detect

Write

Read

Write

Read

I2CCON

Write

Read

I2CSTAT

Control Logic

Read

LSB

Counter

dsPIC30F4011/4012

17.2 I2C Module Addresses

The I2CADD register contains the Slave mode

addresses. The register is a 10-bit regi ster.

If the A10M bit (I2CCON<10>) is ‘0’, the address is

interpreted by the module as a 7-bit address. When an

address is re ceived, it is c ompa red to t he 7 LS bs of t he

I2CADD register.

If the A10M bit is ‘1’, the address is assumed to be a

10-bit address. When an address is received, it will b e

compared with the binary value, ‘11110 A9 A8’

(where A9 and A8 are two Most Significant bits of

I2CADD). If that value matches, the next address will

be compared with the Least Significant 8 bits of

I2CADD, as specified in the 10-bit addressing protocol.

The 7-bit I2C slave addresses supported by the

dsPIC30F are shown in Table 17-1.

TABLE 17-1: 7-BIT I2C™ SLAVE

ADDRESSES

17.3 I2C 7-bit Slave Mode Operation

Once enabled (I2CEN = 1), the slave module w ill wait

for a Start bit to occur (i.e., the I2C module is ‘Idle’).

Following the detection of a Start bit, 8 bits are shifted

into I2CRSR and the address is compared against

I2CADD. In 7-bit mode (A10M = 0), I2CADD<6:0> bits

are compared against I2CRSR<7:1>, and I2CRSR<0>

is the R_W bit. All incoming bits are sampled on the

rising edge of SCL.

If an address match occurs, an Acknowledgement will

be sent, and the Slave Event Interrupt Flag (SI2CIF) is

set on the falling edge of the ninth (ACK) bit. The

address match does not affect the contents of the

I2CRCV buffer or the RBF bit.

17.3.1 SLAVE TRANSMISSION

If the R_W bit received is a ‘1’, then the serial port wil l

go into Transmit mode. It will send ACK on the ninth bit

and then hold SCL to ‘0’ until the CPU responds by writ-

ing to I2CTRN. SCL is released by setting the SCLREL

bit and 8 bits of data are shifted out. Data bits are

shifted out on the falling edge of SCL, such that SDA is

valid during SCL high (see timing diagram). The inter-

rupt pulse is sent on the falling edg e of the ninth clock

pulse, regardless of the status of the ACK received

from the master.

17.3.2 SLAVE RECEPTION

If the R_W bit received is a ‘0’ during an address

match, then Receive mode is initiated. Incoming bits

are sampled on the rising edge of SCL. After 8 bits are

received, if I2CRCV is not full or I2COV is not set,

I2CRSR is transferre d to I2CRCV. ACK is sent on the

ninth clock.

If the RBF flag is set, indicating that I2CRCV is still

holding data from a previous operation (RBF = 1), then

ACK is not sent; however, the interrupt pulse is gener-

ated. In the case of an overflow, the contents of the

I2CRSR are not loaded into the I2CRCV.

17.4 I2C 10-bit Slave Mode Operation

In 10-bit mode, the basic receive and transmit

operations are the same as in the 7-bit mode. However ,

the criteria for address match is more complex.

The I2C specification dictates that a slave must be

addressed for a write operation, with two address bytes

following a Start bit.

The A10M bit is a control bit that signifies that the

address in I2CADD is a 10-bit address rather than a

7-bit address. The address detection protocol for the

first byte of a message address is identical for 7-bit

and 10-bit messages but the bits being compared are

different.

I2CADD holds the entire 10-bit address. Upon receiv-

ing an address following a Start bit, I2CRSR<7:3> is

compared against a literal ‘11110’ (the default 10-bit

address) and I2CRSR<2:1> are compared against

I2CADD<9:8>. If a match occurs and if R_W = 0, the

interrupt pulse is sent. The ADD10 bit will be cleared to

indicate a partial address match. If a match fails or

R_W = 1, the ADD10 bit is cleared and the module

returns to the Idle state.

The low byte of the address is then received and com-

pared with I2CADD<7:0>. If an a ddress match o ccu rs,

the interrupt pulse is generated and the ADD10 bit is

set, indicating a complete 10-bit address match. If an

address match did not occur, the ADD10 bit is cleared

and the module returns to the Idle state.

Address Description

0x00 General call address or Start byte

0x01-0x03 Reserved

0x04-0x07 HS mode master codes

0x08-0x77 Valid 7-bit addresses

0x78-0x7B Valid 10-bit addresses (lower 7 bits)

0x7C-0x7F Reserved

Note: The I2CRCV will be loaded if the I2COV

bit = 1 and the RBF flag = 0. In this case,

a read of th e I2CRCV was performe d but

the user did not clear the state of the

I2COV bit before the next receive

occurred. The Acknowledgement is not

sent (ACK = 1) and the I2CRCV is

updated.

dsPIC30F4011/4012

17.4.1 10-BIT MODE SLAVE

TRANSMISSION

Once a slave is addressed in this fashion, with the full

10-bit address (we will refer to this state as

“PRIOR_ADDR_MATCH”), the master can begin

sending data bytes for a slave reception operation.

17.4.2 10-BIT MODE SLAVE RECEPTION

Once addressed, the master can generate a Repeated

Start, reset the high byte of the address and set the

R_W bit without generating a Stop bit, thus ini tiating a

slave transmit operation.

17.5 Automatic Clock Stretch

In the Slave modes, the module can synchronize buffer

reads and write to the master device by clock stretching.

17.5.1 TRANSMIT CLOCK STRETCHING

Both 10-bit and 7-bit Transmit modes implement clock

stretching by asserting the SCLREL bit after the falling

edge of the ninth clock if the TBF bit is cleared,

indicating the buffer is empty.

In Slave Transmit modes, clock stretching is always

performed, irrespective of the STREN bit.

Clock synchronization takes place following the ninth

clock of the transmit sequence. If the device samples

an ACK on the falling edge of the ninth clock, and if the

TBF bit is still clear, then the SCLREL bit is automati-

cally cleared. The SCLREL being cleared to ‘0’ will

assert the SCL line low. The user’s ISR must set the

SCLREL bit before transmission is allowed to

continue. By holding the SCL line low, the user has

time to service the ISR and load the contents of the

I2CTRN before the master device can initiate another

transmit sequence.

17.5.2 RECEIVE CLOCK STRETCHING

The STREN bit in the I2 CCON register can be used to

enable clock stretching in Slave Receive mode. When

the STREN bit is set, the SCL pin will be held low at

the end of each data receive sequence.

17.5.3 CLOCK S TRETCHING DURING

7-BIT ADDRESSING (STREN = 1)

When the STREN bit is set in Slave Receive mode,

the SCL line is held low when the buffer register is full.

The method for stretching the SCL output is the same

for both 7-bit and 10-bit Addressing modes.

Clock stretching takes place following the ninth clock of

the receive sequence. On the falling edge of the ninth

clock at the end of the ACK sequence, if the RBF bit is

set, the SCLREL bit is automatically cleared, forcing the

SCL output to be held low. The user ’s ISR must set the

SCLREL bit before reception is allowed to continue. By

holding the SCL line low, the user has time to service

the ISR and read the content s of the I2CRCV be fore the

master device can initiate another receive sequence.

This will prevent buf fer ov erruns from occurri ng.

17.5.4 CLOCK S TRETCHING DURING

10-BIT ADDRESSING (STREN = 1)

Clock stretching takes place automatically during the

addressing sequence. Because this module has a

the protocol to wait for the address to be updated.

After the address phase is complete, clock stretching

will occur on each data receive or transmit sequence

as was described earlier.

17.6 Software Controlled Clock

Stretching (STREN = 1)

When the STREN bit is ‘1’, the SCLREL bit may be

cleared by software to allow software to control the

clock stretching. The logic will synchronize writes to

the SCLREL bit with the SCL clock. Clearing the

SCLREL bit will not assert the SCL output until the

module detects a falling edge on the SCL output and

SCL is sampled low. If the SCLREL bit is cleared by

the user while the SCL line has been sampled low, the

SCL output will be asserted (held low). The SCL out-

put will remain low until the SCLREL bit is set and all

other devices on the I2C bus have deasserted SCL.

This ensures that a write to the SCLREL bit will not

violate the minimum high time requirement for SCL.

If the STREN bit is ‘0’, a software write to the SCLREL

bit will be disregarded and have no effect on the

SCLREL bit.

Note 1: If the user loads the contents of I2CTRN,

setting the TBF bit before the falling edge

of the ninth clock, the SCLREL bit will not

be cleared and clock stretching will not

occur.

2: The SCLREL bit can be set in software

regardless of the state of the TBF bit.

Note 1: If the user reads the contents of the

I2CRCV, clearing the RBF b it before the

falling edge of the ninth clock, the

SCLREL bit will not be cleared and clock

stretching will not occur.

2: The SCLREL bit can be set in software,

regardless of the state of the RBF bit. The

user should be careful to clear the RBF

bit in the ISR before the next receive

sequence in order to prevent an overflow

condition.

dsPIC30F4011/4012

17.7 Interrupts

The I2C module gen erates two interrupt flags, MI2CIF

(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Inter-

rupt Flag). The MI2CIF interrupt flag is activated on

completion of a master message event. The SI2CIF

interrupt flag is activated on detection of a message

directed to the slave.

17.8 Slope Control

The I2C standard requires slope control on the SDA

and SCL signals for Fast mode (400 kHz). The control

bit, DISSLW , enables the user to disable slew rate con-

trol, if desired. It is necessary to disable the slew rate

control for 1 MHz mode.

17.9 IPMI Support

The control bit, IPMIEN, enables the module to support

Intelligent Peripheral Management Interface (IPMI).

When this bit is set, the module accepts and acts upon

all addresses.

17.10 General Call Address Support

The general call address can address all devices.

When this address is used, all devices should, in

theory, respond with an Acknowledgement.

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R_W = 0.

The general call addre ss is recognized w hen the Ge n-

eral Call Enable (GCEN) bit is set (I2CCON<7> = 1).

Following a Start bit detection, 8 bits are shifted into

I2CRSR and the address is compared with I2CADD,

and is also compared with the general call address

which is fixed in hardware.

If a general call address match occurs, the I2CRSR is

transferred to the I2CRCV after the eighth clock, the

RBF flag is set, and on the fallin g edge of the ninth bit

(ACK bit), the Master Event Interrupt Flag (MI2CIF) is

set.

When the interrupt is serviced, the source for the interrupt

can be checked by reading the contents of the I2CRCV

to determine if the address was device-specific or a

general call address.

17.11 I2C Master Support

As a master device, six operations are supported.

• Assert a Start condition on SDA and SCL.

• Assert a Restart condition on SDA and SCL.

• Write to the I2CTRN register initiating

transmission of data/address.

• Generate a Stop condition on SDA and SCL.

• Configure the I2C port to receive data.

• Generate an ACK condition at the end of a

received byte of data.

17.12 I2C Master Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the beginning of the next serial transfer , the I2C bus will

not be released.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the data direction bit. In

this case, the data direction bit (R_W) is logic ‘0’. Serial

data is transmitted 8 bits at a time. After each byte is

transmitted, an ACK bit is received. Start and Stop

conditions are output to indicate the beginning and the

end of a serial transfer.

In Master Receive mode, the first byte transmitted

contains the slave address of the transmitting device

(7 bits) and the data direction bit. In this case, the data

direction bit (R_W) is logic ‘1’. Thus, the first byte

transmitted is a 7-bit slave address, followed by a ‘1’ to

indicate the receive bit. Serial data is received via SDA

while SCL outputs the serial clock. Serial data is

received 8 bits at a time. Af ter each byte is received, an

ACK bit is transmitted. Start and Stop conditions

indicate the beginning and end of transmission.

17.12.1 I2C MASTER TRANSMISSION

Transmission of a data byte, a 7-bit address or the

second half of a 10-bit address, is accomplished by

simply writing a value to the I2CTRN register . The user

should only write to I2CTRN when the module is in a

Wait state. This action will set the buffer full flag (TBF)

and allow the Ba ud Rate Generator to begin counti ng

and start the next transmission. Each bit of address/

data will be shifted out onto the SDA pin after the falling

edge of SCL is asserted. The Transmit Status Flag,

TRSTAT (I2CSTAT<14>), indicates that a master

transmit is in progress.

dsPIC30F4011/4012

17.12.2 I2C MASTER RECEPTION

Master mode reception is enabled by programming the

receive enable (RCEN) bit (I2CCON<3>). The I2C

module must be Idle before the RCEN bit is set, other-

wise the RCEN bit will be disregarded. The Baud Rate

Generator begins counting and on each rollover, the

state of the SCL pin toggles and data is shifted in to the

I2CRSR on the rising edge of each clock.

17.12.3 BAUD RATE GENERATOR (BRG)

In I2C Master mode, the reload value for the BRG is

located in the I2CBRG register. When the BRG is

loaded with this value, the BRG counts down to ‘0’ and

stops until another reload has taken place. If clock

arbitration is taking place, for instance, the BRG is

reloaded when the SCL pin is sampled high.

As per the I2C standard, FSCK may be 100 kHz or

400 kHz. However, the user can specify an y baud rate

up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.

EQUATION 17-1: I2CBRG VALUE

17.12.4 CLOCK ARBITRATION

Clock arbitration occurs when the master deasserts the

SCL pin (SCL allowed to float high) during any receive,

transmit or Restart/S top condition. When the SCL pin is

allowed to float high , the Baud Rate Ge nerator (BRG)

is suspended from counting until the SCL pin is actually

sampled high. When the SCL pin is samp led high, the

Baud Rate Genera tor is reloaded with the conte nts of

I2CBRG and begins counting. This ensures that the

SCL high time will always be at least one BRG rollover

count in the event that the clock is held low by an

external device.

17.12.5 MULTI-MASTER COMMUNICATION,

BUS COLLISION AND BUS

ARBITRATION

Multi-master operation support is achieved by bus

arbitration. When the master outputs address/data bits

onto the SDA pin, arbitration takes place when the

master outputs a ‘1’ on SDA, by letting SDA float high,

while another master asserts a ‘0’. When the SCL pin

floats high, data should be stable. If the expected data

on SDA is a ‘1’ and the data sampled on the SDA

pin = 0, then a bus collision has taken place. The

master will set the MI2 CIF pulse and reset the master

portion of the I2C port to its Idle state.

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the TBF flag is

cleared, the SDA and SCL lines are deasserted and a

value can now be written to I2CTRN. When the user

services the I2C master ev ent Interrupt Service Ro utine

and if the I2C bus is free (i.e., the P bit is set), the user

can resume communication by asserting a Start

condition.

If a Start, Restart, Stop or Acknowled ge condition was

in progress when the bus collision occurred, the condi-

tion is aborted, the SDA and SCL lines are deasserted

and the respective co ntrol bits in the I2CCON register

are cleared to ‘0’. When the user services the bus

collision Interrupt Service Routine, and if the I2C bus is

free, the user can resume communication by asserting

a Start condition.

The Master will continue to monitor the SDA and SCL

pins, and if a Stop condition occurs, the MI2CIF bit will

be set.

A write to the I2CTRN will start the transmission of data

at the first data bit, regardless of where the transmi tter

left off when bus collision occurred.

In a Multi-Master environment, the interrupt generation

on the detection of St art and S top conditions allows the

determination of when the bus is free. Control of the I2C

bus can be taken when the P b it is set i n the I2CSTAT

cleared.

17.13 I2C Module Operation During CPU

Sleep and Idle Modes

17.13.1 I2C OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’. If

Sleep occurs in the middle of a transmission, and the

state machine is partially into a transmission as the

clocks stop, then the transmission is aborted. Similarly,

if Sleep occurs in the middle of a reception, then the

reception is aborted.

17.13.2 I2C OPERATION DURING CPU IDLE

MODE

For the I2C, the I2CSIDL bit selects if the module will

stop on Idle or continue on Idle. If I2CSIDL = 0, the

module will continue operation on assertion of the Idle

mode. If I2CSIDL = 1, the module will stop on Idle.

I2CBRG = FCY FCY

FSCL 1,111,111 – 1

–

()

dsPIC30F4011/4012

TABLE 17-2: I2C™ REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

I2CRCV 0200 — — — — — — — — Receive Register 0000 0000 0000 0000

I2CTRN 0202 — — — — — — — — Transmit Register 0000 0000 1111 1111

I2CBRG 0204 — — — — — — — Baud Rate Generator 0000 0000 0000 0000

I2CCON 0206 I2CEN —I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000

I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000

I2CADD 020A — — — — — — Address Register 0000 0000 0000 0000

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

18.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART) MODULE

This section describes the Universal Asynchronous

Receiver/Transmitter communications module.

18.1 UART Module Overview

The key featur es of the UART module ar e:

• Full-Duplex, 8 or 9-bit Data Communication

• Even, Odd or No Parity Opti ons (for 8-bit data)

• One or Two Stop bits

• Fully Integrated Baud Rate Generator with

16-bit Prescaler

• Baud Rates ranging from 38 bps to 1.875 Mbps at

a 30 MHz Instruction Rate

• 4-Word Deep Transmit Data Buffer

• 4-Word Deep Receive Data Buffer

• Parity, Framing and Buffer Overru n Erro r Detectio n

• Support for Interrupt Only on Address Dete ct

(9th bit = 1)

• Separate Transmit and Receive Interrupts

• Loopback mode for Diagnostic Support

FIGURE 18-1: UART TRANSMITTER BLOCK DIAGRAM

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

Write Write

UTX8 UxTXREG Low Byte

Load TSR

Transmit Control

– Control TSR

– Control Buffer

– Generate Flags

– Generate Interrupt

Control and Status bits

UxTXIF

Data

‘0’ (Start)

‘1’ (Stop)

Parity Parity

Generator

Transmit Shift Register (UxTSR)

16 Divider

Control

Signals

16x Baud Clock

from Baud Rate

Generator

Internal Data Bus

UTXBRK

Note: x = 1 or 2. dsPIC30F4012 only has UART1.

UxTX

dsPIC30F4011/4012

FIGURE 18-2: UART RECE IVER BLOC K DIAGRAM

Read

URX8 UxRXREG Low Byte

Load RSR

UxMODE

Receive Buffer Control

– Generate Flags

– Generate Interrupt

UxRXIF

UxRX

· Start bit Detect

Receive Shift Regi ster Control

Signals

UxSTA

– Shift Data Characters

Read Read

Write Write

to Buffer

8-9

(UxRSR)

PERR

FERR

· Parity Check

· Stop bit Detect

· Shift Clock Generation

· Wake Logic

Internal Data Bus

LPBACK

From UxTX

16x Baud Clock from

Baud Rate Gene r a tor

÷ 16 Divider

dsPIC30F4011/4012

18.2 Enabling and Setting Up UART

18.2.1 ENABLING TH E UART

The UART module is enabled by setting the UARTEN

bit in the UxMODE register (where x = 1 or 2). Once

enabled, the UxTX and UxRX pins are configured as an

output and an input, respectively, overriding the TRIS

and LATCH register bit settings for the corresponding

I/O port pins. The UxTX pin is at logic ‘1’ when no

transmission is taking place.

18.2.2 DISABLING THE UART

The UART module is disabled by clearing the UARTEN

bit in the UxMODE register. This is the default state

after any Reset. If the UART is disabled, all I/O pins

operate as port pins under the con trol of the LATCH and

TRIS bits of th e correspondi ng port pins.

Disabling the UART module resets the buffers to

empty states. Any data characters in the buffers are

lost and the baud rate counter is reset.

All error and status flags associated with the UART

module are reset when the module is disabled. The

URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and

UTXBF bits are cleared, whereas RIDLE and TRMT

are set. Other control bits, including ADDEN,

URXISEL<1:0>, UTXISEL, as well as the UxMODE

and UxBRG registers, are not affected.

Clearing the UARTEN bit while the UART is active will

abort all pending transmissions and receptions and

reset the module as defined above. Re-enabling the

UART will restart the UART in the same configuration.

18.2.3 ALTERNATE I/O

The alternate I/O function is enabled by setting the

ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX

and UxARX pins (alternate transmit and alternate

receive pins, respectively) are used by the UART mod-

ule instead of the UxTX and UxRX pins. If ALTIO = 0,

the UxTX and UxRX pins are used by the UART

module.

18.2.4 SETTING UP DATA, PARITY AND

STOP BIT SELECTIONS

Control bits, PDSEL<1:0> in the UxMODE register , are

used to select the data length and parity used in the

transmission. The data length may either be 8 bits with

even, odd or no parity, or 9-bits with no parity.

The STSEL bit determines whether one or two Stop bits

will be used during data transmission.

The default (power-on) setting of the UART is 8 bits, no

parity and 1 Stop bit (typically represented as 8, N, 1).

18.3 Transmitting Data

18.3.1 TRANSMITTING IN 8-BIT DATA

MODE

The following steps must be performed in order to

transmit 8-bit data:

1. Set up the UART:

First, the data length, parity and number of S top

bits must be selected. Then, the transmit and

receive interrupt enable and priority bits are set

up in the UxMODE and UxSTA registers. Also,

the appropriate baud rate val ue must be written

to the UxBRG register.

2. Enable the UART by setting the UARTEN bit

(UxMODE<15>).

3. Set the UTXEN bit (UxSTA<10>), thereby

enabling a transmission.

4. Write the byte to be transmitted to the lower byte

of UxTXREG. The value will be transferred to the

Transmit Shift register (UxTSR) immediately

and the serial bit stream will start shifting out

during the next rising edge of the baud clock.

Alternatively, the data byte may be written while

UTXEN = 0, following which, the user may set

UTXEN. This will cause the serial bit stream to

begin immediately because the baud clock will

start from a cleared state.

5. A transmit interrupt will be generated depending

on the value of the interrupt control bit UTXISEL

(UxSTA<15>).

18.3.2 TRANSMITTING IN 9-BIT DATA

MODE

The sequence of steps involved in the transmission of

9-bit data is similar to 8-bit transmission, except that a

16-bit data word (of which the up per 7 bits are always

clear) must be written to the UxTXREG register.

18.3.3 TRANSMIT BUFFER (UXTXB)

The transmit buffer is 9 bits wide and 4 characters

deep. Including the Transmit Shift register (UxTSR),

the user effectively has a 5-deep FIFO (First In First

Out) buffer. The UTXBF Status bit (UxSTA<9>)

indicates whether the transmit buffer is full.

If a user attempts to write to a full buffer, the new data

will not be accepted into the FIFO, and no data shift

will occur within the buffer. This enables recovery from

a buffer overrun condition.

The FIFO is reset during any device Reset, but is not

affected when the device enters or wakes up from a

power-saving mode.

dsPIC30F4011/4012

18.3.4 TRANSMIT INTERRUPT

The Transmit Interrupt Flag (U1TXIF or U2TXIF) is

located in the corresponding interrupt flag register .

The transmitter generates an edge to set the UxTXIF

bit. The condition for generati ng the interrupt depen ds

on UTXISEL control bit:

a) If UTXISE L = 0, an interrupt is generated when a

word is transferred from the transmit buffer to the

Transmit Shift register (UxTSR). This implies that

the transmit buffer has at least one empty word.

b) If UTXISEL = 1, an interrupt is generated when

a word is transferred from the transmit bu ffer to

the Transmit Shift register (UxTSR) and the

transmit buffer is empty.

Switching between the two interrupt modes during

operation is possible and sometimes offers more

flexibility.

18.3.5 TRANSMIT BREAK

Setting the UTXBRK bit (UxSTA<11>) will cause the

UxTX line to be driven to logic ‘0’. The UTXBRK bit

overrides all transmission activity. Therefore, the user

should generally wait for the transmitter to be Idle

before setting UTXBRK.

To send a Break character, the UTXBRK bit must be

set by software and must remain set for a minimum of

13 baud clock cycles. The U TXBRK bit is then cleared

by software to generate Stop bits. The user must wait

for a duration of at least o ne or two baud clock cycles

in order to ensure a valid Stop bit(s) before reloading

the UxTXB or starting other transmitter activity.

Transmission of a Break character does not generate

a transmit interrupt.

18.4 Receiving Data

18.4.1 RECEIVING IN 8-BIT OR 9-BIT DATA

MODE

The following steps must be performed while receiving

8-bit or 9-bit data:

1. Set up the UART (see Section 18.3.1

“Transmitting in 8-bit Data Mode”).

2. Enable the UART (see Section 18.3.1

“Tra nsmitting in 8-bit Data Mode”).

3. A receive interrupt will be generated when one

or more data words have been received,

depending on the receive interrupt settings

specified by the URXISEL bits (UxSTA<7:6>).

4. Read the OERR bit to determine if an overrun

error has occurred. The OERR bit must be reset

in software.

5. Read the received data from UxRXREG . The act

of reading UxRXREG will move the next word to

the top of the receive FIFO an d the PERR and

FERR values will be updated.

18.4.2 RECEIVE BUFFER (UXRXB)

The receive buffer is 4 words deep. Including the

Receive Shift register (UxRSR), the user effectively

has a 5-word deep FIFO buffer.

URXDA (UxSTA<0>) = 1 indicates that the receive

buffer has data available. URXDA = 0 implies that the

buffer is empty. If a user attempts to read an empty

buffer, the old values in the buffer will be read and no

data shift will occur within the FIFO.

The FIFO is reset during any device Reset. It is not

affected when the device enters or wakes up from a

power-saving mode.

18.4.3 RECEIVE INTERR UPT

The Receive Interrupt Flag (U1RXIF or U2RXIF) can

be read from the corresponding i nterrupt flag register.

The interrupt flag is set by an edge generated by the

receiver. The condition for setting the receive interrupt

flag depends on the settings specified by the

URXISEL<1:0> (UxSTA<7:6>) control bits.

a) If URXISEL<1:0> = 00 or 01, an interrupt is

generated every time a data word is transferred

from the Receive Shift register (UxRSR) to the

receive buffer. There may be one or more

characters in the receive buffer.

b) If URXISEL<1:0> = 10, an interrupt is generated

when a word is transferred from the Receive

Shift register (UxRSR) to the receive buffer

which, as a result of the transfer, contains

3 characters.

c) If URXISEL<1:0> = 11, an interrupt is set when

a word is transferred from the Receive Shift

a result of the transfer, contains 4 characters

(i.e., becomes full).

Switching between the interrupt modes during

operation is possible, though generally not advisable

during normal operation.

18.5 Reception Error Handling

18.5.1 RECEIVE BUFFER OVERRUN

ERROR (OERR BIT)

The OERR bit (UxSTA<1> ) is set if all of the following

conditions occur:

a) The receive buffer is full.

b) The Receive Shift register is full, but unable to

transfer the character to the receive buffer.

c) The Stop bit of the character in the UxRSR is

detected, indicating that the UxRSR needs to

transfer the character to the buffer.

Once OERR is set, no further data is shifted in UxRSR

(until the OERR bit is cleared in software or a Reset

occurs). The data held in UxRSR and UxRXREG

remains valid.

dsPIC30F4011/4012

18.5.2 FRAMING ERROR (FERR)

The FERR bit (UxSTA<2>) is set if a ‘0’ is detected

instead of a Stop bit. If two Stop bits are selected, both

Stop bits must be ‘1’, otherwise FERR will be set. The

read-only FERR bit i s bu ffered along w ith the receive d

data; it is cleared on any Reset.

18.5.3 PARITY ERROR (PERR)

The PERR bit (UxSTA<3>) is set if the parity of the

received word is incorrect. This error bit is applicable

only if a Parity mode (odd or even) is selected. The

read-only PERR bit is buffered along with the received

data bytes; it is cleared on any Reset.

18.5.4 IDLE STATUS

When the receiver is active (i.e., between the initial

detection of the S t art bit and the completion of the S t op

bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the

completion of the Stop bit and detection of the next

Start bit, the RIDLE bit is ‘1’, indicating that the UART

is Idle.

18.5.5 RECEIVE BREAK

The receiver will count and expect a certain number

of bit times based on the values programmed in

the PDSEL<1:0> (UxMODE<2:1>) and STSEL

(UxMODE<0>) bits.

If the Break is longer than 13 bit times, the reception is

considered complete after the number of bit times

specified by PDSEL and STSEL. The URXDA bit is

set, FERR is set, zeros are loaded into the receive

FIFO, interrupts are generated, if appropriate and the

RIDLE bit is set.

When the module receives a long Break signal and the

receiver has detected the Start bit, the data bits and

the invalid S top bit (which sets the FERR), the receiver

must wait for a valid S top bit before looking for the next

Start bit. It cannot assume that the Break condition on

the line is the next Start bit.

Break is regarded as a character containing all ‘0’s,

with the FERR bit set. The Break character is loaded

into the buffer. No further reception can occur until a

Stop bit is received. Note that RIDLE goes high when

the Stop bit has not been received yet.

18.6 Address Detect Mode

Setting the ADDEN bit (UxSTA<5>) enables this

special mode in which a 9th bit (URX8) value of ‘1’

identifies the received word as an address, rather than

data. This mode is only applicable for 9-bit data

communication. The URXISELx control bit does not

have any impact on interrupt gene ration in this mode,

since an interrupt (if enabled) will be generated every

time the receive d word has the 9th bit set.

18.7 Loopback Mode

Setting the LPBACK bit enables this special mode in

which the UxTX pin is internally connected to the UxRX

pin. When configured for the Loopback mode, the

UxRX pin is disconnected from the internal UART

receive logic. However, the UxTX pin still functions as

in a normal operation.

To select this mode:

a) Configure UART for desired mode of operation.

b) Set LPBACK = 1 to enable Loopback mode.

c) Enable transmission as defined in Section 18.3

“Transmitting Data”.

18.8 Baud Rate Generator

The UART has a 16-bit Baud Rate Generator to allow

maximum flexibility in baud rate generation. The Baud

Rate Generator register (UxBRG) is readable and

writable. The baud rate is computed as follows:

BRG = 16-bit value held in UxBRG register

(0 through 65535)

FCY = Instruction Clock Rate (1/TCY)

The baud rate i s given by Equation 18-1.

EQUATION 18-1: BAUD RATE

Therefore, maximum baud rate possible is:

FCY/16 (if BRG = 0),

and the minimum baud rate possible is:

FCY/(16 * 65536).

With a full, 16-bit Baud Rate Generator, at 30 MIPS

operation, the minimum baud rate achievable is

28.5 bps.

Baud Rate = FCY/(16 * (BRG + 1))

dsPIC30F4011/4012

18.9 Auto-Baud Support

To allow the system to determine baud rates of

received characters, the input can be opti onally linked

to a selected capture input (IC1 for UART1, IC2 for

UART2). To enabl e this mode, the user must program

the input capture module to detect the falling and rising

edges of the Start bit.

18.10 UART Operation During CPU

Sleep and Idle Modes

18.10.1 UART OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, a ll clock sources

to the module are shut down and stay at logic ‘0’. If

entry into Sleep mode occurs while a transmission is

in progress, then the transmission is aborted. The

UxTX pin is driven to logic ‘1’. Similarly, if entry into

Sleep mode occurs while a reception is in progress,

then the reception is aborted. The UxSTA, UxMODE,

UxBRG, transmit and receive registers and buffers, are

not affected by Sleep mode.

If the W AKE bit (UxMODE<7>) is set before the device

enters Sleep mode, then a falling edge on the UxRX

pin will generate a receive interrupt. The Receive

Interrupt Select Mode bit (URXISEL) has no effect for

this function. If the receive interrupt is enabled, then

this will wake-up the device from Slee p. The UARTEN

bit must be set in order to generate a wake-up

interrupt.

18.10.2 UART OPERATION DURING CPU

IDLE MODE

For the UART, the USIDL bit selects if the mo dule will

stop operation when the device enters Idle mode, or

whether the module will continue on Idle. If USIDL = 0,

the module will continu e operation d uring Idle mode. If

USIDL = 1, the module will stop on Idle.

dsPIC30F4011/4012

TABLE 18-1: UART1 REGISTER MAP(1)

TABLE 18-2: UART2 REGISTER MAP (NOT AVAILABLE ON dsPIC30F4012)(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U1MODE 020C UARTEN —USIDL——ALTIO—— WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U1STA 020E UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U1TXREG 0210 — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U1RXREG 0212 — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset St ate

U2MODE 0216 UARTEN —USIDL— — — — — WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U2STA 0218 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U2TXREG 021A — — — — — — — UTX8 T ransmit Register 0000 000u uuuu uuuu

U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U2BRG 021E Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

19.0 CAN MODULE

19.1 Overview

The Controller Area Network (CAN) module is a seria l

interface, useful for communicating with other CAN

modules or digital signal co ntroller devices. This inter-

face/protocol was designed to allow communications

within noisy environments. The dsPIC30F4011/4012

devices have 1 CAN module.

The CAN module is a communication controller imple-

menting the CAN 2.0 A/B protocol, as defined in the

BOSCH specification. The mo dule will support CAN 1.2,

CAN 2.0A, CAN2.0B Passive and CAN 2.0B Active

versions of the protocol. The module implementation is

a full CAN system. The CAN specifica tion is not covered

within this data sheet. The reader may refer to the

BOSCH CAN specification for further det ails.

The modul e fe at ures are as fol low s:

• Implementation of the CAN protocol CAN 1.2,

CAN 2.0A and CAN 2.0B

• Standard and extended data frames

• 0-8 bytes data length

• Programmable bit rate up to 1 Mbit/sec

• Support for remote frames

• Double-buffered receiver with two prioritized

received message storage buffers (each buffer

may contain up to 8 bytes of data)

• 6 full (standard/extended identifier), acceptance

filters, 2 associated with the high priority receive

buffer and 4 associated with the low priority

receive buffer

• 2 full, acceptance filter masks, one each associated

with the high and low priority receive buffers

• Three transmit buffers with application specified

prioritization and abort capability (each buffer may

contain up to 8 bytes of data)

• Programmable wake-up functionality with

integrated low-pass filter

• Programmable Loopback mode supports self-test

operation

• Signaling via interrupt capabilities for all CAN

receiver and transmitter error states

• Programmable clock source

• Programma bl e link to input capt ure module (IC2 ,

for both CAN1 and CAN2) for time-stamping and

network synchronization

• Low-power Sleep and Idle mode

The CAN bus module consists of a protocol engine and

message buffering/control. The CAN protocol engine

handles all functions for receiving and transmitting

messages on the CAN bus. Messa ges a re transmitted

by first loading the appropriate data registers. Status

and errors can be checked by readin g the appropriate

registers. Any message detected on the CAN bus is

checked for errors and then match ed against filters to

see if it should be received and stored in one of the

receive registers.

19.2 Frame Types

The CAN module transmits various types of frames

which include data messages or remote transmission

requests, initiated by the user , as other frames that are

automatically generated for control purposes. The

following frame types are supported:

19.2.1 STANDARD DATA FRAME

A standard data frame is generated by a node when the

node wishes to transmit data. It includes an 11-bit

Standard Identifier (SID) but not an 18-bit Extended

Identifier (EID).

19.2.2 EXTENDED DATA FRAME

An extended data frame is similar to a standard data

frame but includes an extended identifier as well.

19.2.3 REMOTE FRAME

It is possible for a destination node to request the data

from the source. For this purpose, the destination node

sends a remote frame with an identifier that matches

the identifier of the required data frame. The

appropriate data source node will then send a data

frame as a response to this remote request.

19.2.4 ERROR FRAME

An error frame is generated by any node that detects a

bus error. An error frame consists of 2 fields: an error

flag field and an error delimiter field.

19.2.5 OVERLOAD FRAME

An overload frame can be generated by a node as a

result of 2 conditions. First, the node detects a domi-

nant bit during interframe space which is an illegal

condition. Second, due to internal conditions, the node

is not yet able to start reception of the next message. A

node may generate a maximum of 2 sequential

overload frames to delay the start of the next message.

19.2.6 INTERFRAME SPACE

Interframe space separates a proceeding frame (of

whatever type) from a following data or remote frame.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

dsPIC30F4011/4012

FIGURE 19-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM

Acceptance Filter

RXF2(1)

Identifier

Data Field Data Field

Identifier

Acceptance Mask

RXM1(1)

Acceptance Filter

RXF3(1)

Acceptance Filter

RXF4(1)

Acceptance Filter

RXF5(1)

Acceptance Mask

RXM0(1)

Acceptance Filter

RXF0(1)

Acceptance Filter

RXF1(1)

RXB0

(1)

TXREQ

TXB2(1)

TXABT

TXLARB

TXERR

MESSAGE

Message

Queue

Control Transmit Byte Sequencer

TXREQ

TXB1(1)

TXABT

TXLARB

TXERR

MESSAGE

TXREQ

TXB0(1)

TXABT

TXLARB

TXERR

MESSAGE

Receive ShiftTransmit Shift

Receive

Error

Transmit

Error

Protocol

RERRCNT

TERRCNT

ErrPas

BusOff

Finite

State

Machine

Counter

Transmit

Logic

Bit

Timing

Logic

C1TX C1RX

Bit Timing

Generator

PROTOCOL

ENGINE

BUFFERS

CRC Check

CRC Generator

RXB1

(1)

Note 1: These are conceptual groups of registers, not SFR names by themselves.

dsPIC30F4011/4012

19.3 Modes of Operation

The CAN module can operate in one of several

operation modes selected by the user. These modes

include:

• Initialization Mode

• Disable Mode

• Normal Operation Mode

• Listen Only Mode

• Loopback Mode

• Error Recognition Mode

Modes are requested by setting the REQOP<2:0> bits

(C1CTRL<10:8>). Entry into a mode is acknowledged by

monitoring the OPMODE<2:0> bits (C1CTRL<7:5>). The

module will not change the mode and the OPMODE bits

until a change in mode is acceptable, generally during

bus Idle time which is defined as at least 11 consecutive

recessive bits.

19.3.1 INITIALIZATION MODE

In the Initialization mode, the module will not transmit or

receive. The error counters are cleared and the inter-

rupt flags remain unchanged. The programmer will

have access to Configuration registers that are access

restricted in other modes. The module will protect the

user from accidentally violating the CAN protocol

through programming errors. All registers which control

the configuration of the module can not be modified

while the module is online. The CAN module will not be

allowed to enter the Configuration mode while a

transmission is taking place. The Configuration mode

serves as a lock to protect the following registers.

• All Module Control Registers

• Baud Rate and Interrupt Configuration Registers

• Bus Timing Registers

• Identifier Acceptance Filter Registers

• Identifier Acceptance Mask Registers

19.3.2 DISABLE MODE

In Disable mode, the module will not transmit or

receive. The module has the ability to set the W AKIF bit

due to bus activity , however , any pending interrupts will

remain and the error counters will retain their value.

If the REQOP<2:0> bits (C1CTRL<10:8>) = 001, the

module will enter the Disable mode. If the module is

active, the module will wait for 11 recessi ve bits on the

CAN bus, detect that condition as an Idle bus, then

accept the disable command. When the

OPMODE<2:0> bits (C1CTRL<7:5>) = 001, that

indicates whether the module successfully went into

Disable mode. The I/O pins will revert to normal I/O

function when the module is in the Disable mode.

The module can be programmed to apply a low-pass

filter function to the C1RX input line while the module

or the CPU is in Sleep mode. The WAKFIL bit

(C1CFG2<14>) enables or disables the filter.

19.3.3 NORMAL OPERATION MODE

Normal Operation mode is selected when

REQOP<2:0> = 000. In this mode, the module is

activated and the I/O pins will assume the CAN bus

functions. The module will transmit and receive CAN

bus messages via the C1TX and C1RX pins.

19.3.4 LISTEN ONLY MODE

If the Listen Only mode is activated, the module on the

CAN bus is passive. The transmitter buffers revert to

the port I/O function. The receive pins remain inputs.

For the receiver , no error flags or Acknowledge signals

are sent. The error counters are deactivated in this

state. The Listen Only mode can be used for detecting

the baud rate on the CAN bus. To use this, it is

necessary that there are at least two further nodes that

communicate with each other .

19.3.5 ERROR RECOGNITION MODE

The module can be set to ig nore all errors and receive

any message. In this mode, the data which is in the

message assembly buffer until the time an error

occurred, is copied in the receive buffer and can be

read via the CPU interface.

19.3.6 LOOPBACK MODE

If the Loopback mode is activated, the module will

connect the internal transmit signal to the internal

receive signal at the module boundary. The transmit

and receive pins revert to their port I/O function.

Note: Typically, if the CAN module is allowed to

transmit in a particular mode of operation

and a transmission is requested immedi-

ately after the CAN module has been

placed in that mode of operation, the

module waits for 11 consecutive recessive

bits on the bus b efore starting transmission.

If the user switches to Disable mode within

this 11-bit period, then this transmission is

aborted and the corresponding TXABT bit

is set and TXREQ bit is cleared.

dsPIC30F4011/4012

19.4 Message Reception

19.4.1 RECEIVE BUFFERS

The CAN bus module has 3 receive buffers. However,

one of the receive buffers is always committed to mon-

itoring the bus for incoming messages. This buffer is

called the message assembly buffer (MAB). There are

two receive buffers, visibly denoted as RXB0 and

RXB1, that can essentially instantaneously receive a

complete message from the protocol engine.

All messages are assembled by the MAB, and are

transferred to the RXBn buffers only if the accep tance

filter criterion is met. When a message is received, the

RXxIF flag (C1INTF<0> or C1INIF<1>) will be set. This

bit can only be set by the module when a message is

received. The bit is cleared by the CPU when it has

completed processing the message in the buffer. If the

RXxIE bit (C1INTE<0> or C1INTE<1>) is set, an

interrupt will be generated when a message is

received.

RXF0 and RXF1 filters with the RXM0 mask are

associated with RXB0. The filters, RXF2, RXF3, RXF4

and RXF5, and the mask, RXM1, are associated with

RXB1.

19.4.2 MESSAGE ACCEPTANCE FILTERS

The message acceptance filters and masks are used to

determine if a message in the message assembly buf-

fer should be loaded into either of the receive buffers.

Once a valid message has been received into the Mes-

sage Assembly Buffer (MAB), the identifier fields of the

message are compared to the filter values. If there is a

match, that message will be loaded into the appropriate

receive buffer.

The acceptance filter looks at incoming messages for

the RXIDE bit (CiRXnSID<0>) to determine how to

compare the identifiers. If the RXIDE bit is clear, the

message is a standard frame and only filters with the

EXIDE bit (C1RXFxSID<0>) clear are compared. If the

RXIDE bit is set, the message is an extended frame

and only filters with the EXIDE bit set are compared.

19.4.3 MESSAGE ACCEPTANCE FILTER

MASKS

The mask bits essentially determine which bits to apply

the filter to. If any mask bit is set to a zero, then that bit

will automatically be accepted regardless of the filter

bit. There are 2 programmable acceptance filter masks

associated with the receive buffers, one for each buffer .

19.4.4 RECEIVE OVERRUN

An overrun condition occurs when the Message

Assembly Buffer (MAB) has assembled a valid

received message, the message is accepted through

the acceptance filters, and when the receive buffer

associated with the filter has not been designated as

clear of the previous message.

The overrun error flag, RXxOVR (C1INTF<15> or

C1INTF<14>) and the ERRIF bit (C1INTF<5>) will be

set and the message in the MAB will be discarded.

If the DBEN bit is clear, RXB1 and RXB0 operate inde-

pendently. When this is the case, a messag e intended

for RXB0 will not be diverted into RXB1 if RXB0

contains an unread message and the RX0OVR bit will

be set.

If the DBEN bit is set, the overrun for RXB0 is handled

differently. If a valid message is received for RXB0 and

RXFUL = 1, it indicates that RXB0 is full and

RXFUL = 0 indicates that RXB1 is empty , the message

for RXB0 will be loaded into RXB1. An overrun error will

not be generated for RXB0. If a valid message is

received for RXB0 and RXFUL = 1, and RXFUL = 1

indicates that both RXB0 and RXB1 are full, the

message will be lost and an overrun will be indicated

for RXB1.

19.4.5 RECEIVE ERRORS

The CAN module will detect the following receive

errors:

• Cyclic Redundancy Check (CRC) Error

• Bit Stuf fing Error

• Invalid Message Rece ive Error

The receive error counter is incremented by one in

case one of these errors occur. The RXWAR bit

(C1INTF<9>) indicates that the receive error counter

has reached the CPU warning limit of 96 and an

interrupt is generated.

19.4.6 RECEIVE INTERR UPTS

Receive interrupts can be divided into 3 major groups,

each including various conditions that generate

interrupts:

19.4.6.1 Receive Interrupt

A message has been successfully received and loaded

into one of the receive buffers. This interrupt is acti-

vated immediately after receiving the End-of-Frame

(EOF) field. Reading the RXxIF flag will indicate wh ich

receive buffer caused the interrupt.

19.4.6.2 Wake-up Interrupt

The CAN module has woken up from Disable mod e or

the device has woken up from Sleep mode.

dsPIC30F4011/4012

19.4.6.3 Receive Error Interrupts

A receive error interrupt will be indicated by the ERRIF

bit. This bit shows that an error condition occurred. The

source of the error can be determined by checking the

bits in the CAN Interrupt Status register, C1INTF.

• Invalid message received.

• If any type of error occurred during reception of

the last message, an error will be indicated by the

IVRIF bit.

• Receiver overrun.

• The RXxOVR bit indicates that an overrun

condition occurred.

• Receiver warning.

• The RXWAR bit indicates that the Receive Error

Counter (RERRCNT<7:0>) has reached the

warning limit of 96.

• Receiver error passive.

• The RXEP bit indicates that the Receive Error

Counter has exc eed ed th e err or passive limit

of 127 and the module has gone into error passive

state.

19.5 Message Transmission

19.5.1 TRANSMIT BUFFERS

The CAN module has three transmit buffers. Each of

the three buffers occ upies 14 bytes of data. Eight of the

bytes are the maximum 8 bytes of the transmitted mes-

sage. Five bytes hold the standard and extended

identifiers and other message arbitration informatio n.

19.5.2 TRANSMIT MESSAGE PRIORITY

T ransmit priority is a prioritization within each node of the

pending transmittable messages. There are 4 levels of

transmit priority . If TXPRI<1:0> (C1TXxCON<1:0>, where

x = 0, 1 or 2, represents a particular transmit buffer) for a

particular message buffer is set to ‘11’, that buf fer has the

highest priority. If TXPRI<1:0> for a particular message

buffer is set to ‘10’ or ‘01’, that buf fer has an intermediate

priority. If TXPRI<1:0> for a particular message buffer is

‘00’, that buffer has the lowest priority.

19.5.3 TRANSMISSION SEQUENCE

To initiate transmission of the message, the TXREQ bit

(C1TXxCON<3>) must be set. The CAN bus module

resolves any timing conflicts between setting of the

TXREQ bit and the Start-of-Frame (SOF), ensuring

that if the priority was change d, it is resolved correctly

before the SOF occurs. When TXREQ is set, the

TXABT (C1TXxCON<6>), TXLARB (C1TXxCON<5>)

and TXERR (C1TXxCON<4>) flag bits are

automatically cleared.

Setting TXREQ bit simply flags a message buffer as

enqueued for transmission. When the module detects

an available bus, it begins transmitting the message

which has been determined to have the highest priority .

If the transmission completes successfully on the first

attempt, the TXREQ bit is cleared automatically and an

interrupt is generated if TXxIE was set.

If the message transmission fails, one of the error

condition flags will be set and the TXREQ bit will

remain set, indicati ng tha t the me ssa ge i s sti ll pe nding

for transmission. If the message encountered an error

condition during the transmission attempt, the TXERR

bit will be set and the error condition may cause an

interrupt. If the message loses arbitration during the

transmission attempt, the TXLARB bit is set. No

interrupt is generated to signal the loss of arbitratio n.

19.5.4 ABORTING MESSAGE

TRANSMISSION

The system can also abort a message by clearing the

TXREQ bit associated with each message buffer. Se t-

ting the ABAT bit (C1CTRL<12>) will request an abo rt

of all pending messages. If the message has not yet

started transmission, or if the message started but is

interrupted by loss of arbitration or an error, the abort

will be processed. The abort is indicated when the

module sets the TXABT bit, and the TXxIF flag is not

automatically set.

19.5.5 TRANSMISSION ERRORS

The CAN module will detect the following transmission

errors:

• Acknowledge Error

• Form Error

• Bit Error

These transmission errors will not necessarily generate

an interrupt but are indicated by the transmission error

counter. However, each of these errors will cause the

transmission error counter to be incremented by one.

Once the value of the error counter exceeds the value

of 96, the ERRIF (C1INTF<5>) and the TXWAR bit

(C1INTF<10>) are set. Once the value of the error

counter exceeds the value of 96, an interrupt is

generated and the TXWAR bit in the error flag register

is set.

dsPIC30F4011/4012

19.5.6 TRANSMIT INTERRUPTS

T ransmit interrupt s can be divided into 2 major groups,

each including various conditions that generate

interrupts:

• Transmit Interrupt

At least one of the thre e transmit buffers is empty (not

scheduled) and can be load ed to sche dule a messag e

for transmission. Reading the TXxIF flag s will indicate

which transmit buffer is available and caused the

interrupt.

• Transmit Error Interrupts

A transmission error interrupt will be indicated by the

ERRIF flag. This flag shows that an error condition

occurred. The source of the error can be determined by

checking the error flags in the CAN Interrupt Status reg-

ister, C1INTF. The flags in this register are related to

receive and transmit errors.

• Transmitter warning interrupt.

• The TXWAR bit indicates that the Transmit Error

Counter has reached the CPU warning limit of 96.

• Transmitter error passive.

• The TXEP bit (C1INTF<12>) indicates that the

Transmit Error Counter has exceeded the error

passive limit of 127 and the module has gone to

error passive state.

• Bus off.

• The TXBO bit (C1INTF<13>) in dicates that the

Transmit Error Counter (TERRCNT<7:0>) has

exceeded 255 and the module has gone to bus off

state.

19.6 Baud Rate Setting

All nodes on any particular CAN bus must have the

same nominal bit rate. In order to set the baud rate, the

following parameters have to be initialized:

• Synchronization Jump Width

• Baud Rate Prescaler

• Phase Segments

• Length Determination of Phase2 Seg

• Sample Point

• Prop ag a ti o n Se gment Bit s

19.6.1 BIT TIMING

All controllers on the CAN bus must have the same

baud rate an d bit length. However, different controllers

are not required to have the same master oscillator

clock. At different clock frequencies of the individual

controllers, the baud rate has to be adjusted by

adjusting the number of time quanta in each segment.

The nominal bit time can be thought of as being divided

into separate non-overlapping time segments. These

segments are shown in Figure 19-2.

• Synchronization segment (Sync Seg)

• Propagation time segment (Prop Seg)

• Phase segment 1 (Phase1 Seg)

• Phase segment 2 (Phase2 Seg)

The time segments and also the nominal bit time are

made up of integer u nits of time called time qua nta or

TQ. By definition, the n ominal bit time has a mi nimum

of 8 TQ and a maximum of 25 TQ. Also, by definition,

the minimum nominal bit time is 1 μsec, corresponding

to a maximum bit rate of 1 MHz.

FIGURE 19-2: CAN BIT TIMING

Input Signal

Sync Prop

Segment Phase

Segment 1 Phase

Segment 2 Sync

Sample Point

dsPIC30F4011/4012

19.6.2 PRESCALER SETTING

There is a programmable prescaler with integral values

ranging from 1 to 64 in addition to a fixed divide-by-2 for

clock generation. The Time Quantum (TQ) is a fixed

unit of time derived from the oscillator period, shown in

Equation 19-1, where FCAN is FCY (if the CANCKS bit

is set) or 4 FCY (if CANCKS is cleared).

EQUATION 19-1: TIME QUANTUM FOR

CLOCK GENERATION

19.6.3 PROPAGATION SEGMENT

This part of the bit time is used to compensate physical

delay times within the network. These delay times con-

sist of the signal propagation time on the bus li ne and

the internal delay time of the nodes. The propagation

segment can be programmed from 1 TQ to 8 TQ by

setting the PRSEG<2:0> bits (C1CFG2<2:0>).

19.6.4 PHASE SEGMENTS

The phase segments are used to optimally locate the

sampling of the received bit within the transmitted bit

time. The sampl ing point is between Phase1 Seg an d

Phase2 Seg. These segments are lengthened or short-

ened by resynchronization. The end of the Phase1 Seg

determines the sampling po int within a bit period. Th e

segment is programmable from 1 TQ to 8 TQ. Phase2

Seg provides delay to th e next tra nsmitted da ta transi-

tion. The segment is programmable from 1 TQ to 8 TQ,

or it may be defined to be equal to the greater of

Phase1 Seg or the information processing time (2 TQ).

The Phase1 Seg is initialized by setting bits

SEG1PH<2:0> (C1CFG2<5:3>), and Phase2 Seg is

initialized by setting SEG2PH<2:0> (C1CFG2<10:8>).

The following requirement must be fulfilled while setting

the lengths of the pha se segments:

Propagation Segment + Phase1 Seg > = Phase2 Seg

19.6.5 SAMPLE POINT

The sample point is the point of time at which the bus

level is read and interpreted as the value of that respec-

tive bit. The location is at the end of Phase1 Seg. If the bit

timing is slow and contains many TQ, it is possible to

specify multiple sampling of the bus line at the sample

point. The level determined by the CAN bus then cor-

responds to the result from the majority decision of three

values. The majority samples are taken at the sample

point and twice before with a dist ance of TQ/2. The CAN

module allows the user to choose between sampling

three times at the same point, or once at the same point,

by setting or clearing the SAM bit (C1CFG2<6>).

Typically, the sampling of the bit should take place at

about 60-70% through the bit time depending on the

system parameters.

19.6.6 SYNCHRONIZATION

To compensate for phase shifts between the oscillator

frequencies of the different bus stations, each CAN

controller must be able to synchronize to the relevant

signal edge of the incoming signal. When an edge in

the transmitted data is detected , the logic will compare

the location of the edge to the expected time

(synchronous segment). The circuit will then adjust the

values of Phase1 Seg and Phase2 Seg. There are

2 mechanisms used to synchronize.

19.6.6.1 Hard Synchronization

Hard synchronization is only done whenever there is a

‘recessive’ to ‘dominant’ edg e during bu s Idle, indicatin g

the start of a message. After hard synchronization, the

bit time counters are restarted with the synchronous

segment. Hard synchronization forces the edge which

has caused the hard synchronization to lie within the

synchronization segment of the restarted bit time. If a

hard synchronization is done, there will not be a

resynchron iza tion within that bit time.

19.6.6.2 Resynchronization

As a result of resynchronization, Phase1 Seg may be

lengthened or Phase2 Seg may be shortened. The

amount of lengthening o r sho rtening of the phase bu f fer

segment has an upper bound known as the

synchronization jump width, and is specified by the

SJW<1:0> bits (C1CFG1<7:6>). The value of the

synchronization jump width will be add ed to Phase1 Seg

or subtracted from Phase2 Seg. The resynchronization

jump width is programmable betw een 1 TQ and 4 TQ.

The following requirement must be fulfilled while setting

the SJW<1:0> bits:

Phase2 Seg > Syn ch r onization Jump Width

Note: FCAN must not exceed 30 MHz. If

CANCKS = 0, FCY must not exceed 7.5

MHz.

TQ = 2 (BRP<5:0> + 1)/FCAN

dsPIC30F4011/4012

TABLE 19-1: CAN1 REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C1RXF0SID 0300 — — — Receive Acceptance Filte r 0 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF0EIDH 0302 ———— Receive Acceptance Filter 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF1SID 0308 — — — Receive Acceptance Filte r 1 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF1EIDH 030A ———— Receive Acceptance Filter 1 Extend ed Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF2SID 0310 — — — Receive Acceptance Filte r 2 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF2EIDH 0312 ———— Receive Acceptance Filter 2 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF3SID 0318 — — — Receive Acceptance Filte r 3 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF3EIDH 031A ———— Receive Acceptance Filter 3 Extend ed Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF4SID 0320 — — — Receive Acceptance Filte r 4 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF4EIDH 0322 ———— Receive Acceptance Filter 4 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF5SID 0328 — — — Receive Acceptance Filte r 5 Standard Identifier<10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF5EIDH 032A ———— Receive Acceptance Filter 5 Extend ed Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM0SID 0330 — — — Receive Acceptance Mask 0 Standard Identifi er<10:0> —MIDE000u uuuu uuuu uu0u

C1RXM0EIDH 0332 ———— Receive Acceptance Mask 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXM0E IDL 0334 Receive Acceptance Mask 0 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM1SID 0338 — — — Receive Acceptance Mask 1 Standard Identifi er<10:0> —MIDE000u uuuu uuuu uu0u

C1RXM1EIDH 033A ———— Receive Acceptance Mask 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXM1E IDL 033C Receive Accept ance Mask 1 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1TX2SID 0340 Transmit Buffer 2 Standard Identifier<10:6> — — — Transmit Buffer 2 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1 T X 2 EI D 0342 T ra n s m it B u ffer 2 E x t e n de d I de n t i f ie r < 17 : 1 4 > — — — — T ransmit Buffer 2 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX2B1 0346 Transmit Buffer 2 Byte 1 T ransmit Buff er 2 By te 0 uuuu uuuu uuuu uuuu

C1TX2B2 0348 Transmit Buffer 2 Byte 3 T ransmit Buff er 2 By te 2 uuuu uuuu uuuu uuuu

C1TX2B3 034A T ransmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C1TX2CON 034E — — — — — — — — — TXABT TXLARB TXERR TXREQ —TXPRI<1:0>0000 0000 0000 0000

C1TX1SID 0350 Transmit Buffer 1 Standard Identifier<10:6> — — — Transmit Buffer 1 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1 T X 1 EI D 0352 T ra n s m it B u ffer 1 E x t e n de d I de n t i f ie r < 17 : 1 4 > — — — — T ransmit Buffer 1 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX1B1 0356 Transmit Buffer 1 Byte 1 T ransmit Buff er 1 By te 0 uuuu uuuu uuuu uuuu

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

C1TX1B2 0358 Transmit Buffer 1 Byte 3 T ransmit Buff er 1 By te 2 uuuu uuuu uuuu uuuu

C1TX1B3 035A T ransmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1TX1CON 035E — — — — — — — — — TXABT TXLARB TXERR TXREQ —TXPRI<1:0>0000 0000 0000 0000

C1TX0SID 0360 Transmit Buffer 0 Standard Identifier<10:6> — — — Transmit Buffer 0 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1 T X 0 EI D 0362 T ra n s m it B u ffer 0 E x t e n de d I de n t i f ie r < 17 : 1 4 > — — — — T ransmit Buffer 0 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX0B1 0366 Transmit Buffer 0 Byte 1 T ransmit Buff er 0 By te 0 uuuu uuuu uuuu uuuu

C1TX0B2 0368 Transmit Buffer 0 Byte 3 T ransmit Buff er 0 By te 2 uuuu uuuu uuuu uuuu

C1TX0B3 036A T ransmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1TX0CON 036E — — — — — — — — — TXABT TXLARB TXERR TXREQ —TXPRI<1:0>0000 0000 0000 0000

C1RX1SID 0370 — — — Receive Buffer 1 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX1EID 0372 ———— Receive Buf fer 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RX1DLC 0374 Receive Buffer 1 Extended Identifier<5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1RX1B4 037C Receive Buff er 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1RX1CON 037E — — — — — — — —RXFUL— — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000

C1RX0SID 0380 — — — Receive Buffer 0 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX0EID 0382 ———— Receive Buf fer 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RX0DLC 0384 Receive Buffer 0 Extended Identifier<5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1RX0B4 038C Receive Buff er 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1RX0CON 038E — — — — — — — —RXFUL— — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000

C1CTRL 0390 CANCAP — CSIDL ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> —0000 0100 1000 0000

C1CFG1 0392 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C1CFG2 0394 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C1INTE 0398 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1IE RX0IE 0000 0000 0000 0000

C1EC 039A TERRCNT<7:0> RERRCNT<7:0> 0000 0000 0000 0000

TABLE 19-1: CAN1 REGISTER MAP(1) (C ONT IN UED)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

20.0 10-BIT, HIGH-SPEED ANALOG-

TO-DIGITAL CONVERTER

(ADC) MODULE

The 10-bit, high-speed Analog-to-Digital Converter

(ADC) allows conversion of a n analog input signal to a

10-bit digital number. This module is based on a

Successive Approximation Register (SAR) architecture

and provides a maximum sampling rate of 1 Msps. The

ADC module has 16 analog inputs which are multi-

plexed into four sample and hold amplifiers. The output

of the sample and hold is the input into the converter

which generates the result. The analog reference

voltages are software selectable to either the device

supply voltage (AVDD/AVSS) or the voltage level on the

(VREF+/VREF-) pins. The ADC module has a unique

feature of being able to operate while the device is in

Sleep mode.

The ADC module has six 16-bit registers:

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

• A/D Control Register 3 (ADCON3)

• A/D Input Select Register (ADCHS)

• A/D Port Configuration Register (ADPCFG)

• A/D Input Scan Selection Register (ADCSSL)

The ADCON1, ADCON2 and ADCON3 registers

control the operation of the ADC module . The ADCHS

ADPCFG register configures the port pins as analog

inputs or as digital I/O. The ADCSSL register selects

inputs for scanning.

The block diagram of the ADC module is shown in

Figure 20-1.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157). Note: The SSRC<2:0>, ASAM, SIMSAM,

SMPI<3:0>, BUFM and ALTS bits, as well

as the ADCON3 and ADCSSL registers,

must not be written to while ADON = 1.

This would lead to indeterminate results.

dsPIC30F4011/4012

FIGURE 20-1: 10-BIT, HIGH-SPEED ADC FUNCTIONAL BLOCK DIAGRAM

S/H

10-bit Result Conversion Logic

VREF+

AVSS

AVDD

ADC

Data

16-word, 10-bit

Dual Port

Buffer

Bus Interface

AN0

AN5

AN7

AN1

AN2

AN3

AN4

AN6

AN8

AN8(1)

AN4

AN5

AN6(1)

AN7(1)

AN0

AN1

AN2

AN3

CH1

CH2

CH3

CH0

AN5

AN2

AN8

AN4

AN1

AN7

AN3

AN0

AN6

AN1

VREF-

Sample/Sequence

Control

Sample

CH1,CH2,

CH3,CH0

Input MUX

Control

Input

Switches

S/H

Format

Note 1: Not available on dsPIC30F4012 devices.

dsPIC30F4011/4012

20.1 A/D Result Buffer

The module contains a 16-word, dual port, read-only buf-

fer, called ADCBUF0...ADCBUFF, to buffer the A/D

results. The RAM is 10 bits wide, but is read into different

format 16-bit words. The contents of the sixteen A/D

Conversion Result Buffer registers, ADCBUF0 through

ADCBUFF, cannot be written by user software.

20.2 Conversion Operation

After the ADC module has been configured, the sample

acquisition is started by setting the SAMP bit. Various

sources, such as a programmable bit, timer time-outs

and external events, terminate acquisition and start a

conversion. When the A/D co nversion is complete, the

result is loaded into ADCBUF0...ADCBUFF, and the A/D

Interrupt Flag, ADIF, and the DONE bit are set after the

number of samples specified by the SMPI<3:0> bit s.

The following steps should be followed for doing an

A/D conversion:

1. Configure the ADC mo dule:

- Configure analog pins, voltage reference

and digital I/O

- Select A/D input channels

- Select A/D conversion clock

- Select A/D conversion trigger

- Turn on ADC module

2. Configure the A/D in terrupt (if required):

- Clear ADIF bit

- Select A/D interrupt priority

3. Start sampling.

4. Wait the required acquisition time.

5. Trigger acquisition end, start conversion.

6. Wait for A/D conversion to complete by either:

- Waiting for the A/D interrupt

- Waiting for the DONE bit to get set

7. Read A/D result buffer, clear ADIF if required.

20.3 Selecting the Conversion

Sequence

Several groups of control bits select the sequence in

which the A/D connects inputs to the sample/hold

channels, converts channels, writes the buffer memory

and generates interrupts. The sequence is controlled

by the sampling clocks.

The SIMSAM bit controls the acquire/convert

sequence for multiple channels. If the SIMSAM bit is

‘0’, the two or four selected channels are acquired and

converted sequentially with two or four sample clo cks.

If the SIMSAM bit is ‘1’, two or four se lected channels

are acquired simultaneously with one sample clock.

The channels are then converted sequentially.

Obviously, if there is only 1 channel selected, the

SIMSAM bit is not applicable.

The CHPS<1:0> bits select how many channels are

sampled. This selection can vary from 1, 2 or 4 channels.

If the CHPS bits select 1 channel, the CH0 channel is

sampled at the sample clock and converted. The result is

stored in the buffer. If the CHPS bits select 2 channels,

the CH0 and CH1 channels are sampled and converted.

If the CHPS bits select 4 channels, the CH0, CH1, CH2

and CH3 channels are sampled and converted.

The SMPI<3:0> bits select the number of acquisition/

conversion sequences that would be performed before

an interrupt occurs. This can vary from 1 sample per

interrupt to 16 samples per interrupt.

The user cannot program a combi nation of CHPS and

SMPI bits that specifies more than 16 con versions per

interrupt, or 8 conversions per interrupt, depending

on the BUFM bit. The BUFM bit, when set, splits the

16-word results buffer (ADCBUF0 to ADCBUFF) into

two, 8-word groups. Writing to the 8-word buffers is

alternated on each interrupt event. Use of the BUFM bit

depends on how much time is available for moving data

out of the buffers after the interrupt, as determined by

the application.

If the processor can quickly unload a full buffer within

the time it takes to acquire and convert one channel,

the BUFM bit can be ‘0’ and up to 16 conversions

may be done per interrupt. The processor has one

sample-and-conversion time to move the sixteen

conversions.

If the processor cannot unload the buffer within the

acquisition and conversion time, the BUFM bit should be

‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,

then eight conversions are loaded into half of the buffer,

following which an interrupt occurs. The next eight

conversions are loaded into the other half of the buffer.

The processor has the entire time between interrupts to

move the eight conversions.

The ALTS bit can be used to alternate the inputs

selected during the sampling sequence. The input

multiplexer has two sets of sample inputs: MUX A and

MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are

selected for sampling. If the ALTS bit is ‘1’ and

SMPI<3:0> = 0000, on the first sample/convert

sequence, the MUX A inputs are selected, and on the

next acquire/convert sequence , the MUX B inputs are

selected.

The CSCNA bit (ADCON2<10>) allows the CH0

channel inputs to be alternately scanned across a

selected number of analog inputs for the MUX A group.

The inputs are selected by the ADCSSL register. If a

particular bit in the ADCSSL register is ‘1’, the corre-

sponding input is selected. The inputs are always

scanned from lower to higher numbered inputs, starting

after each interrupt. If the number of inputs selected is

greater than the number of samples taken per interrupt,

the higher numbered inputs are unused.

dsPIC30F4011/4012

20.4 Programming the Start of the

Conversion Trigger

The conversion trigger terminates ac qui si tio n and starts

the requested conversions.

The SSRC<2:0> bits select the source of the

conversion trigger.

The SSRC bits provide for up to five alternate sources

of conversion trigger.

When SSRC<2:0> = 000, the conversion trigger is

under software control. Clearing the SAMP bit causes

the conversion trigger.

When SSRC<2:0> = 111 (Auto-Start mode), the con-

version trigger is under A/D clock control. The SAMC

bits select the number of A/D clocks between the start

of ac q u i s i t i on and the start of conversion. This provides

the fastest conversion rates on multiple channels.

SAMC must always be at least one clock cycle.

Other trigger sources can come from timer modules,

motor control PWM module or external interrupts.

20.5 Aborting a Conversion

Clearing the ADON bit during a conversion aborts the

current conversion and stops the sampling sequencing.

The ADCBUFx is not updated with the partially com-

pleted A/D conversion sample. That is, the ADCBUFx

will continue to contain the value of the last complete d

conversion (or the last value written to the ADCBUFx

If the clearing of the ADON bit coincides with an

auto-start, the clearing has a higher priority.

After the A/D conversion is aborted, a 2 TAD wait is

required before the next sampling may be started by

setting the SAMP bit.

If sequential sampling is specified, the A/D continues at

the next sample pulse, which corresponds with the next

channel converted. If simultaneous sampling is speci-

fied, the A/D continues with the next multichannel

group conversion sequence.

20.6 Selecting the A/D Conversion

Clock

The A/D conversion requires 12 TAD. The source of the

A/D conversion clock is software selected using a 6-bit

counter. There are 64 possible options for TAD.

EQUATION 20-1: A/D CONVERSION CLOCK

The internal RC oscillator is selected by setting the

ADRC bit.

For correct A/D conversions, the A/D conversion clock

(TAD) must be selected to ensure a minimum TAD time

of 83.33 nsec (for VDD = 5V). Refer to Section 24.0

“Electrical Characteristics” for minimum TAD under

other operating conditions.

Example 20-1 shows a sample calculation for the

ADCS<5:0> bits, assuming a device operating speed

of 30 MIPS.

EXAMPLE 20-1: A/D CONVERSION CLOCK

CALCULATION

Note: To operate the ADC at the maximum

specified conversion speed, the auto-

convert trigger option should be selected

(SSRC = 111) and the auto-sample

time bits should be set to ‘1’ TAD

(SAMC = 00001). This configuration gives

a total conversion period (sample +

convert) of 13 TAD.

The use of any other conversion trigger

results in additional TAD cycles to

synchronize the external event to the

ADC.

TAD = TCY * (0.5 * (ADCS<5:0> + 1))

ADCS<5:0> = 2 – 1

TAD

TCY

TAD = 154 nsec

ADCS<5:0> = 2 – 1

TAD

TCY

TCY = 33 nsec (30 MIPS)

= 2 • – 1

154 nsec

33 nsec

= 8.33

Therefore,

Set ADCS<5:0> = 9

Actual TAD = (ADCS<5:0> + 1)

TCY

= (9 + 1)

33 nsec

= 165 nsec

dsPIC30F4011/4012

20.7 A/D Conversion Speeds

The dsPIC30F 10-bit ADC specifications permit

a maximum 1 Msps sampling rate. Table 20-1

summarizes the conversion speeds for the dsPIC30F

10-bit ADC and the required operating conditions.

TABLE 20-1: 10-BIT A/D CONVERSION RATE PARAMETERS

dsPIC30F 10-bit A/D Converter Conversion Rates

A/D

Speed TAD

Minimum Sampling

Time Min. RS Max. VDD Temperature A/D Channels Configuration

Up to

1 Msps(1) 83.33 ns 12 TAD 500Ω4.5V

5.5V

-40°C to +85°C

Up to

750

ksps(1)

95.24 ns 2 TAD 500Ω4.5V

5.5V

-40°C to +85°C

Up to

600

ksps(1)

138.89 ns 12 TAD 500Ω3.0V

5.5V

-40°C to +125°C

Up to

500 ksps 153.85 ns 1 TAD 5.0 kΩ4.5V

5.5V

-40°C to +125°C

Up to

300 ksps 256.41 ns 1 TAD 5.0 kΩ3.0V

5.5V

-40°C to +125°C

Note 1: External VREF- and VREF+ pins mu st be used for correct operation. See Figure 20-2 for recommended

circuit.

VREF-VREF+

ADC

ANx S/H

S/H

CH1, 2 or 3

CH0

VREF-VREF+

ADC

ANx S/HCHX

VREF-VREF+

ADC

ANx S/H

S/H

CH1, 2 or 3

CH0

VREF-VREF+

ADC

ANx S/HCHX

ANx or VREF-

AVSS or

AVDD

VREF-VREF+

ADC

ANx S/HCHX

ANx or VREF-

AVSS or

AVDD

dsPIC30F4011/4012

The configuration guidelines give the required setup

values for the conversion speeds above 500 ksps,

since they require external VREF pins usage and there

are some differences in the configuration procedure.

Configuration details that are not critical to the

conversion speed have been omitted.

Figure 20-2 illustrates the recommende d ci rcuit for th e

conversion rates above 500 ksps.

FIGURE 20-2: A/D CONVERTER VOLTAGE REFERENCE SCHEMATIC

20.7.1 1 Msps CONFIGURATION

GUIDELINE

The configuration for 1 Msps operation is dependent on

whether a single input pin is to be sampled or whether

multiple pins are to be sampled.

20.7.1.1 Single Analog Input

For conversions at 1 Msps for a single analog input, at

least two sample and hold channels must be e nabled.

The analog input multiplexer must be configured so

that the same input pin is connected to both sample

and hold channels. The A/D converts the value held on

one S&H channel while the second S&H channel

acquires a new input sample.

20.7.1.2 Multiple Analog Inputs

The ADC can also be used to sample multiple analog

inputs using multiple sample and hold channels. In this

case, the total 1 Msps conversion rate is divided among

the different input signals. For example, four inputs can

be sampled at a rate of 250 ksps for each signal, or two

inputs could be sampled at a rate of 500 ksps for each

signal. Sequential sampling must be used in this

configuration to allow adequate sampling time on each

input.

REF

VDD

VDD VDD

12 44

VDD

VSS

AVDD

AVSS

VDD

VSS VDD

VSS

dsPIC30F4011

0.01 μF

0.1 μF

1 μFC7

0.1 μFC6

0.01 μF

VDD VDD VDD

1 μFC4

0.1 μFC3

0.01 μF

dsPIC30F4011/4012

20.7.1.3 1 Msps Configuration Items

The following configuration items are required to

achieve a 1 Msps conversion rate.

• Comply with conditions provi ded in Table 20-2

• Connect external V REF+ and VREF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCON1 register to

enable the auto-convert option

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable sequential sampling by clearing the

SIMSAM bit in the ADCON1 regi st er

• Enable at least two sample and hold channels by

writing the CHPS<1:0> control bits in the

ADCON2 register

• Write the SMPI<3:0> control bits in the ADCON2

between interrupts. At a minimum, set SMPI<3:0>

= 0001 since at least two sample and hold chan-

nels should be enabled

• Configure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

• Select at least two channels per analog input pin

by writing to the ADCHS register

20.7.2 750 ksps CONFIGURATION

GUIDELINE

The following configuration items are required to

achieve a 750 ksps conversion rate. This configuration

assumes that a single analog input is to be sampled.

• Comply with conditions provi ded in Table 20-2

• Connect external V REF+ and VREF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCON1 register to

enable the auto-convert option

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable one sample and hold channel by setting

CHPS<1:0> = 00 in the ADCO N 2 re gi st er

• Write the SMPI<3:0> control bits in the ADCON2

between interrupts

• Configure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

20.7.3 600 ksps CONFIGURATION

GUIDELINE

The configuration for 600 ksps operation is dependent

on whether a single input pin is to be sampled or

whether multiple pins are to be sampled.

20.7.3.1 Single Analog Input

When performing conversions at 600 ksps for a single

analog input, at least two sample and hold channels

must be enabled. The analog input multiplexer must be

configured so that the same input pin is connected to

both sample and hold channels. The ADC converts the

value held on one S/H channel, while the second S/H

channel acquires a new input sample.

20.7.3.2 Multiple Analog Input

The ADC can al so be used to sample multiple a nalog

inputs using multiple sample and hold channels. In this

case, the total 600 ksps conversion rate is divided

among the different input signals. For example, four

inputs can be sampled at a rate of 150 ksps for each

signal or two inputs can be sampled at a rate of

300 ksps for each signal. Sequential sampling must be

used in this configuration to allow adequate sampling

time on each input.

20.7.3.3 600 ksps Configuration Items

The following configuration items are required to

achieve a 600 ksps conversion rate.

• Comply with co nd i ti o ns provided in Table 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCON1 register to

enable the auto-convert option

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable sequential sampling by clearing the

SIMSAM bit in the ADCON1 register

• Enable at least two sample and hold channel s by

writing the CHPS<1:0> control bits in the

ADCON2 register

• Write the SMPI<3:0> control bits in the ADCON2

between interrupts. At a minimum, set

SMPI<3:0> = 0001 since at leas t two sample and

hold channels should be enable d

• Configure the A/D clock pe riod to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling ti me to be 2 TAD by

writing: SAMC<4:0> = 00010

Select at least two channels per analog input pin by

writing to the ADCHS register.

12 x 1,000,000 = 83.33 ns

(12 + 2) x 750,000 = 95.24 ns

12 x 600,000 = 138.89 ns

dsPIC30F4011/4012

20.8 A/D Acquisition Requirements

The analog input model of t he 10-bit ADC is shown in

Figure 20-3. The total sampling time for the ADC is a

function of the internal amplifier settling time, device

VDD and the holding capacitor charge time.

For the ADC to meet its specified accuracy, the charge

holding capacitor (CHOLD) must be allowed to fully

charge to the voltage level on the analog input pin. The

source impedance (RS), the interconnect impedance

(RIC) and the internal samp ling switch (RSS) impedance

combine to directly af fect the time required to cha rge the

capacitor CHOLD. The combined impedance of the ana-

log sources must therefore be small enough to fully

charge the holding capacitor within the chosen sample

time. To minimize the effects of pin leakage currents on

the accuracy of the ADC, the maximum recommended

source impedance, RS, is 5 kΩ. After the analog input

channel is selected (changed), this sampling function

must be completed prior to starting the conversion. The

internal holding capacitor will be in a discharged state

prior to each sample operation.

The user must allow at least 1 TAD period of sampli ng

time, TSAMP, between conversions to all ow each sam-

ple to be acquired. This sample time may be controlled

manually in software by setting/clearing the SAMP bit,

or it may be automatically controlled by the AD C. In an

automatic configuration, the user must allow enough

time between conversion trig gers so that the mi nimum

sample time can be satisfied. Refer to Section 24.0

“Electrical Characteristics” for TAD a nd sample time

requirements.

FIGURE 20-3: A/D CONVERTER ANALOG INPUT MODEL

CPIN

Rs ANx VT = 0.6V

VT = 0.6V ILEAKAGE

RIC ≤ 250ΩSampling

Switch

RSS

CHOLD

= DAC Capacitance

VSS

VDD

= 4.4 pF

±500 nA

Legend: CPIN

I leakage

RIC

RSS

CHOLD

= Input Capacitance

= Threshold Voltage

= Leakage Current at the pin due to

= Interconnect Resistance

= Sampling Switch Resistance

= Sample/Hold Capacitance (from DAC)

various junctions

Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ.

RSS ≤ 3 kΩ

dsPIC30F4011/4012

20.9 Module Power-Down Modes

The module has 3 internal power modes. When the

ADON bit is ‘1’, the module is in Active mode; it is fully

powered and functional. When ADON is ‘0’, the module

is in Off mode. The digital and analog portions of the

circuit are disabled for maximum current savings. In

order to return to the Active mode from Off mode, the

user must wait for the ADC circuitry to stabilize.

20.10 A/D Operation During CPU Sleep

and Idle Modes

20.10.1 A/D OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’.

If Sleep occurs in the middle of a conversion, the

conversion is aborted. The converter will not continue

with a partially completed conversion on exit from

Sleep mode.

entering or leaving Sleep mode.

The ADC module can operate during Sleep mode if the

A/D clock source is set to RC (ADRC = 1). When the

RC clock source is selected, the ADC module waits

one instruction cycle before starting the conversion.

This allows the SLEEP instruction to be executed,

which eliminates all digital switching noise from the

conversion. When the conversion is complete, the

DONE bit is set and the result is loaded into the

ADCBUFx register.

If the A/D interrupt is enabled, the device wakes up

from Sleep. If the A/D interrupt is not enabled, the ADC

module is then turned off, although the ADON bit

remains set.

20.10.2 A/D OPERATION DURING CPU IDLE

MODE

The ADSIDL bit selects if the module stops on Idle or

continues on Idle. If ADSIDL = 0, the module continues

operation on assertion of Idle mode. If ADSIDL = 1, the

module stops on Idle.

20.11 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the ADC module to be turn ed off, and any

conversion and acquisition sequence is aborted. The

values that are in the ADCBUFx registers are not

modified. The A/D Result register contains unknown

data after a Power-on Reset.

20.12 Output Formats

The A/D result is 10 bits wide. The data buffer RAM is

also 10 bits wide. The 10-bit data can be read in one of

four different formats. The FORM<1:0> bits select the

format. Each of the output formats translates to a 16-bit

result on the data bus.

Write data will always be in right justified (integer)

format.

FIGURE 20-4: A/D OUTPUT DATA FORMATS

RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional (1.15) d09 d08d07d06d05d04d03d02d01d00000000

Fractional (1.15)d09d08d07d06d05d04d03d02d01d00000000

Signed Integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

dsPIC30F4011/4012

20.13 Configuring Analog Port Pins

The use of the ADPCFG and TRIS registers control the

operation of the ADC port pins. The port pins that are

desired as analog inputs must have their correspondi ng

TRIS bit set (input). If the TRIS bit is cleared (output), the

digital output level (VOH or VOL) is con verted.

The A/D operation is independent of the state of the

CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.

When reading the PORT register , all pins configured as

analog input channels are read as clea red.

Pins configured as digital inputs will not convert an ana-

log input. Analog levels on any pin tha t is defined a s a

digital input (including the ANx pins), may cause the

input buffer to consume current that exceeds the

device specifications.

20.14 Connection Considerations

The analog inputs have diodes to VDD and VSS as ESD

protection. This requires that the analog input be

between VDD and VSS. If the input voltage exceeds this

range by greater than 0.3V (either direction), one of the

diodes becomes forward biased and it may damage the

device if the input current spec ification is exceeded.

An external RC filter is sometimes added for anti-

aliasing of the input signal. The R component should be

selected to ensure that the sampling time requirements

are satisfied. Any external components connected (via

high-impedance) to an analog input pin (capacitor,

zener diode, etc.) should have very little leakage

current at the pin.

dsPIC30F4011/4012

TABLE 20-2: ADC REGISTER MAP(1)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

ADCBUF0 0280 — — — — — — ADC Data Buffer 0 0000 00uu uuuu uuuu

ADCBUF1 0282 — — — — — — ADC Data Buffer 1 0000 00uu uuuu uuuu

ADCBUF2 0284 — — — — — — ADC Data Buffer 2 0000 00uu uuuu uuuu

ADCBUF3 0286 — — — — — — ADC Data Buffer 3 0000 00uu uuuu uuuu

ADCBUF4 0288 — — — — — — ADC Data Buffer 4 0000 00uu uuuu uuuu

ADCBUF5 028A — — — — — — ADC Data Buffer 5 0000 00uu uuuu uuuu

ADCBUF6 028C — — — — — — ADC Data Buffer 6 0000 00uu uuuu uuuu

ADCBUF7 028E — — — — — — ADC Data Buffer 7 0000 00uu uuuu uuuu

ADCBUF8 0290 — — — — — — ADC Data Buffer 8 0000 00uu uuuu uuuu

ADCBUF9 0292 — — — — — — ADC Data Buffer 9 0000 00uu uuuu uuuu

ADCBUFA 0294 — — — — — — ADC Data Buffer 10 0000 00uu uuuu uuuu

ADCBUFB 0296 — — — — — — ADC Data Buffer 11 0000 00uu uuuu uuuu

ADCBUFC 0298 — — — — — — ADC Dat a Buffer 12 0000 00uu uuuu uuuu

ADCBUFD 029A — — — — — — ADC Data Buffer 13 0000 00uu uuuu uuuu

ADCBUFE 029C — — — — — — ADC Data Buffer 14 0000 00uu uuuu uuuu

ADCBUFF 029E — — — — — — ADC Data Buffer 15 0000 00uu uuuu uuuu

ADCON1 02A0 ADON —ADSIDL— — — FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000 0000 0000 0000

ADCON2 02A2 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000 0000 0000 0000

ADCON3 02A4 — — — SAMC<4:0> ADRC — ADCS<5:0> 0000 0000 0000 0000

ADCHS 02A6 CH123NB<1:0> CH123SB CH0NB CH0SB<3:0> CH123NA<1:0> CH123SA CH0NA CH0SA<3:0> 0000 0000 0000 0000

ADPCFG 02A8 — — — — — — —PCFG8

(2) PCFG7(2) PCFG6(2) PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

ADCSSL 02AA — — — — — — — CSSL8(2) CSSL7(2) CSSL6(2) CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000

Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

2: These bits are not availa ble on dsPIC30F4012 devices.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

21.0 SYSTEM INTEGRATION

There are several features intended to maximize

system reliability, minimize cost through eliminati on of

external components, provide power-saving operating

modes and offer code protection:

• Oscillator Selection

• Reset

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST )

- Programmable Brown-out Reset (BOR)

• W atchdog Timer (WDT)

• Power-Saving Modes (Sleep and Idle)

• Code Protection

• Unit ID Locations

• In-Circuit Serial Programming (ICSP)

dsPIC30F devices have a Watchdog Timer which is

permanently enabled via the Configuration bits, or can

be software controlled. It runs off its own RC oscillator for

added reliability. There are two timers that offer neces-

sary delays on power-up. One is the Oscillator Start-up

T imer (OST), intended to keep the chip in Re set until the

crystal oscillator is stable. The other is the Power-up

Timer (PWRT), which provides a delay on power-up

only, designed to kee p the part in Reset while the power

supply stabilizes. With these two timers on-chip, most

applications need no external Reset circuitry.

Sleep mode is designed to offer a very low-current

Power-Down mode. The user can wake-up from Sleep

through external Reset, Watchdog Timer wake-up or

through an interrupt. Several oscillator options are also

made available to allow the part to fit a wide variety of

applications. In the Idle mode, the clock sources are

still active, but the CPU is shut off. The RC oscillator

option saves system cost, while the LP crystal option

saves power.

21.1 Oscillator System Overview

The dsPIC30F oscillator system has the following

modules and features:

• Various external and internal oscillator options as

clock sources

• An on-chip PLL to boost internal operating

frequency

• A clock switching mechanism between various

clock sources

• Programmable clock postscaler for system power

savings

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

• Oscillator Control register (OSCCON)

• Configuration bits for main oscillator selection

Table 21-1 provides a summary of the dsPIC30F

oscillator operating modes. A simplified diag ram of the

oscillator system is shown in Figure 21-1.

Configuration bits determine the clock source upon

Power-on Reset (POR) and Brown-out Reset (BOR).

Thereafter, the clock source can be changed between

permissible clock sources. The OSCCON register

controls the clock switching and reflects system clock

related status bits.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

dsPIC30F4011/4012

TABLE 21-1: OSCILLATOR OPERATING MODES

Oscillator Mode Description

XTL 200 kHz-4 MHz crystal on OSC1:OSC2

XT 4 MHz-10 MHz crystal on OSC1:OSC2

XT w/PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled

XT w/PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled

XT w/PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)

LP 32 kHz crystal on SOSCO:SOSCI(2)

HS 10 MHz-25 MHz crystal

EC External clock input (0-40 MHz)

ECIO External clock input (0-40 MHz), OSC2 pin is I/O

EC w/PLL 4x External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1)

EC w/PLL 8x External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1)

EC w/PLL 16x External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1)

ERC External RC oscillator, OSC2 pin is FOSC/4 output(3)

ERCIO External RC oscillator, OSC2 pin is I/O(3)

FRC 8 MHz internal RC oscil lator

FRC w/PLL 4x 7.37 MHz Internal RC oscillator, 4x PLL enabled

FRC w/PLL 8x 7.37 MHz Internal RC oscillator, 8x PLL enabled

FRC w/PLL 16x 7.37 MHz Internal RC oscillator, 16x PLL enabled

LPRC 512 kHz internal RC oscillator

Note 1: The dsPIC30F maximum operating frequency of 120 MHz must be met.

2: LP oscillator can be conveniently shared as a system clock, as well as a Real-Time Clock for Timer1.

3: Requires external R and C. Frequency operation up to 4 MHz.

dsPIC30F4011/4012

FIGURE 21-1: OSCILLATOR SYSTEM BLOCK DIAGRAM

Primary

OSC1

OSC2

SOSCO

SOSCI

Oscillator

32 kHz LP

Clock

and Control

Block

Switching

Oscillator

x4, x8, x16

PLL

Primary

Oscillator

Stability Detector

Stability Dete ctor

Secondary

Oscillator

Programmable

Clock Divider

Oscillator

Start-up

Timer

Fail-Safe Clock

Monitor (FSCM)

Internal Fast RC

Oscillator (FRC)

Internal

Low-Power RC

Oscillator (LPRC)

PWRSAV Instruction

Wake-up Request

Oscillator Configuration bits

System

Clock

Oscillator Trap

to Timer1

LPRC

FRC

Secondary Osc

POR Done

Primary Osc

FPLL

POST<1:0>

FCKSM<1:0> 2

PLL

Lock COSC<1:0>

NOSC<1:0>

OSWEN

dsPIC30F4011/4012

21.2 Oscillator Configurations

21.2.1 INITIAL CLOCK SOURCE

SELECTION

While coming out of Power-on Reset or Brown-out

Reset, the device selects its clock source based on:

a) The FOS<1:0> Configuration bits that select one

of four oscillator groups.

b) The FPR<3:0> Configuration bits that select one

of 13 oscillator choices within the primary group.

The selection is as shown in Table 21-2.

21.2.2 OSCILLATOR START-UP TIMER

(OST)

In order to ensure that a crystal oscillator (or ceramic

resonator) has started and stabilized, an Oscillator

Start-up Timer (OST) is included. It is a simple, 10-bit

counter that counts 1024 TOSC cycles before releasing

the oscillator clock to the rest of the system. The time-

out period is designated as TOST. The TOST time is

involved every time the oscillator has to restart (i.e., on

POR, BOR and wake-up from Sleep). The Oscillator

Start-up Timer is applied to the LP, XT, XTL and HS

modes (upon wake-up from Slee p, POR and BOR) for

the primary oscillator.

TABLE 21-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator Mode Oscillator

Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2

Function

EC Primary 111011 CLKO

ECIO Primary 111100 I/O

EC w/PLL 4x Primary 111101 I/O

EC w/PLL 8x Primary 111110 I/O

EC w/PLL 16x Primary 111111 I/O

ERC Primary 111001 CLKO

ERCIO Primary 111000 I/O

XT Primary 110100 OSC2

XT w/PLL 4x Primary 110101 OSC2

XT w/PLL 8x Primary 110110 OSC2

XT w/PLL 16x Primary 110111 OSC2

XTL Primary 110000 OSC2

HS Primary 110010 OSC2

FRC w/PLL 4x Primary 110001 I/O

FRC w/PLL 8x Primary 111010 I/O

FRC w/PLL 16x Primary 110011 I/O

LP Secondary 0 0 ————(Notes 1, 2)

FRC Internal FRC 0 1 ————(Notes 1, 2)

LPRC Internal LPRC 1 0 ————(No t es 1, 2)

Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>).

2: Note that the OSC1 pin cannot be used as an I/O pin, even if the secondary oscillator or an internal clock

source is selected at all times.

dsPIC30F4011/4012

21.2.3 LP OSCILLATOR CONTROL

Enabling the LP oscillator is controlled with two

elements:

• Current oscillator group bits, COSC<1:0>

• LPOSCEN bit (OSCCON<1>)

The LP oscillator is on (even during Sleep mode) if

LPOSCEN = 1. The LP oscillator is the device clock if:

• COSC<1:0> = 00 (LP selected as main osc.) and

• LPOSCEN = 1

Keeping the LP oscillator on at all times allows for a

fast switch to the 32 kHz system clock for lower power

operation. Returning to the faster main oscillator still

requires a start-up time.

21.2.4 PHASE LOCKED LOOP (PLL)

The PLL multiplies the clock which is generated by the

primary oscillator. The PLL is selectable to have eith er

gains of x4, x8 or x16. Input and output frequency

ranges are summarized in Table 21-3.

TABLE 21-3: PLL FREQUENCY RANGE

The PLL features a lock output which is asserted when

the PLL enters a phase locked state. Should the loop

fall out of lock (e.g., due to noise), the lock signal is

rescinded. The state of this signal is reflected in the

read-only LOCK bit in the OSCCON register.

21.2.5 FAST RC OSCILLATOR (FRC)

The FRC oscillator is a fast (7.37 MHz, ±2% nomi nal),

internal RC oscillator. This oscillator is intended to

provide reasonable device operating speeds without

the use of an external crystal, ceramic resonator or RC

network. Using the x4, x8 and x16 PLL options, high er

operational frequencies can be generated.

The dsPIC30F operates from the FRC oscillator when-

ever the Current Oscillator Selection (COSC<1:0>)

control bits in the OSCCON register

(OSCCON<13:12>) are set to ‘01’.

There are four tuning bits (TUN<3:0>) for the FRC

oscillator in the OSCCON register. These tuning bits

allow the FRC oscillator frequency to be adjusted as

close to 7.37 MHz as possible, depending on the

device operating conditions. The FRC oscillator

frequency has been calibrated during factory testing.

Table 21-4 describes the adjustment range of the

TUN<3:0> bits.

TABLE 21-4: FRC TUNING

21.2.6 LOW-POWER RC OSCILLATOR (LPRC)

The LPRC oscillator is a component of the Watchdog

Timer (WDT) and oscillates at a nominal frequency of

512 kHz. The LPRC oscillator is the clock source for

the Power-up Timer (PWRT) circuit, WDT and clock

monitor circuits. It may also be used to provide a low-

frequency clock source option for applications where

power consumption is critical and timing accuracy is

not required.

The LPRC oscillator is always enabled at a POR

because it is the clock source for the PWRT. After the

PWRT expires, the LPRC oscillator remains on if one

of the following is true:

• The Fail-Safe Clock Monitor is enabled

• The WDT is enabled

• The LPRC oscillator is selected as the system

clock via the COSC<1:0> control bits in the

OSCCON register

If one of the above conditions is not true, the LPRC

shuts off after the PWRT expires.

FIN PLL

Multiplier FOUT

4 MHz-10 MHz x4 16 MHz-40 MHz

4 MHz-10 MHz x8 32 MHz-80 MHz

4 MHz-7.5 MHz x16 64 MHz-120 MHz

Note: OSCTUN functionality has b een provided

to help customers compensate for

temperature effects on the FRC frequency

over a wide range of temperatures. The

tuning step size is an approximation and is

neither characterized nor tested.

TUN<3:0>

Bits FRC Frequency

0111 +10.5%

0110 +9.0%

0101 +7.5%

0100 +6.0%

0011 +4.5%

0010 +3.0%

0001 +1.5%

0000 Center Frequency (oscillator is

running at calibrated frequency)

1111 -1.5%

1110 -3.0%

1101 -4.5%

1100 -6.0%

1011 -7.5%

1010 -9.0%

1001 -10.5%

1000 -12.0%

Note 1: OSC2 pin function is determined by the

Primary Oscillator mode selection

(FPR<3:0>).

2: Note that OSC1 pin cannot be used as an

I/O pin, even if the secondary oscillator or

an internal clock source is selected a t all

times.

dsPIC30F4011/4012

21.2.7 FAIL-SAFE CLOCK MONITOR

The Fail-Safe Clock Monitor (FSCM) allows the device

to continue to operate even in the event of an oscillator

failure. The FSCM function is enabled by appropriately

programming the FCKSM<1:0> Configuration bits

(Clock Switch and Monitor Selection bits) in the FOSC

device Configuration register. If the FSCM function is

enabled, the LPRC internal oscillator runs at all times

(except during Sleep mode) and is not subject to

control by the SWDTEN bit.

In the event of an oscillator failure, the FSCM

generates a clock failure trap event and switches the

system clock over to th e FRC oscill ato r. The user then

has the option to either attempt to restart the oscillator

or execute a controlled shutdown. The user may decide

to treat the trap as a warm Reset by simply loading the

Reset address into the oscillato r fail trap vector. In this

event, the CF (Clock Fail) status bit (OSCCON<3>) is

also set whenever a clock failure is recognized.

In the event of a clock failure, the WDT is unaffected

and continues to run on the LPRC clock.

If the oscillator has a very slow start-up time coming

out of POR, BOR or Sleep, it is possible that the

PWRT timer will expire before the oscillator has

started. In such cases, the FSCM is activated. The

FSCM initiates a clock failure trap, and the

COSC<1:0> bits are loaded with the Fast RC (FRC)

oscillator selection. This effectively shuts off the

original oscillator that was trying to start.

The user may detect this situation and restart the

oscillator in the clock fail trap Interrupt Service Routine

(ISR).

Upon a clock failure detection, the FSCM module

initiates a clock switch to the FRC oscillator as follows:

1. The COSC<1:0> bits (OSCCON<13:12>) are

loaded with the FRC oscillator selection value.

2. CF bit is set (OSCCON<3>).

3. OSWEN control bit (OSCCON<0>) is cleared.

For the purpose of clock switching, the clock sources

are sectioned into four groups:

• Primary

• Secondary

• Internal FRC

• Internal LPRC

The user can switch between these functional groups

but cannot switch between options within a gr oup. If the

primary group is selected, then the choice within the

group is always determined by the FPR<3:0>

Configuration bits.

The OSCCON register holds the control and status bits

related to clock switching.

• COSC<1:0>: Read-only status bits always reflect

the current oscillator group in effect.

• NOSC<1:0>: Control bits which are written to

indicate the new oscillator group of choice.

- On POR and BOR, COSC<1:0> and

NOSC<1:0> are both loaded with the

Configuration bit values, FOS<1:0>.

• LOCK: The LOCK status bit indicates a PLL lock.

• CF: Read-only status bit indicating if a clock fail

detect has occurred.

• OSWEN: Control bit changes from a ‘0’ to a ‘1’

when a clock transition sequence is initiated.

Clearing the OSWEN control bit aborts a clock

transition in progress (used for hang-up

situations).

If Configuration bits, FCKSM<1:0> = 1x, then the clock

switching and Fail-Safe Clock Monitor functions are

disabled. This is the default Configuration b it setting.

If clock switching is disabled, then the FOS<1:0> and

FPR<3:0> bits directly control the oscillator selection,

and the COSC<1:0> bits do not control the clock

selection. However, these bits do reflect the clock

source selection.

21.2.8 PROTECTION AGAINST

ACCIDENTAL WRITES TO OSCCON

A write to the OSCCON register is intentionally made

difficult because it controls clock switching and clock

scaling.

To write to the OSCCON low byte, the following code

sequence must be executed without any other

instructions in between:

Byte Write 0x46 to OSCCON low

Byte Write 0x57 to OSCCON low

Byte Write is allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

To write to the OSCCON high byte, the following

instructions must be executed without any other

instructions in between:

Byte Write 0x78 to OSCCON high

Byte Write 0x9A to OSCCON high

Byte Write is allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

Note: The application should not attempt to

switch to a clock of frequency lower than

100 kHz when the Fail-Safe Clock Monitor

is enabled. If such clock switching is

performed, the device may generate an

oscillator fail trap and switch to the Fast

RC (FRC) oscillator.

dsPIC30F4011/4012

21.3 Reset

The dsPIC30F401 1/4012 devices differentiate between

various kinds of Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during normal

operation)

e) Programmable Brown-out Reset (BOR)

f) RESET Instruction

g) Reset caused by trap lock-up (TRAPR)

h) Reset caused by illegal op code, or by using an

uninitialized W register as an Address Pointer

(IOPUWR)

Different registers are affected in different ways by

various Reset conditions. Most registers are not

affected by a WDT wake-up, since this is viewed as the

resumption of normal operation. Status bits from the

RCON register are set or cleared differently in different

Reset situations, as indicated in Table 21-5. These bits

are used in software to determine the nature of the

Reset.

A block diagram of the on-chip Reset circuit is shown in

Figure 21-2.

A MCLR noise filter is provided in the MCLR Reset

path. The filter detects and ignores small pulses.

Internally generated Resets do not drive MCLR pin low .

21.3.1 POR: POWER-ON RESET

A power-on event generates an internal POR pulse

when a VDD rise is detected. The Reset pulse occurs at

the POR circuit threshold voltage (VPOR) which is nom-

inally 1.85V. The device supply voltage characteri stics

must meet specified starting voltage and rise rate

requirements. The POR pulse resets a POR ti mer a nd

places the device in the Reset state. The POR also

selects the device clock source identified by the

oscillator Configuration fuses.

The POR circuit inserts a small delay, TPOR, which is

nominally 10 μs and ensures that the device bias

circuits are stable. Furthermore, a user-selected

power-up time-out (TPWRT) is applied. The TPWRT

parameter is based on device Configuration bits and

can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total

delay is at device power-up, TPOR + TPWRT. When

these delays have expired, SYSRST will be negated on

the next leading edge of the Q1 clock and the PC jumps

to the Reset vector.

The timing for the SYSRST signal is shown in

Figure 21-3 through Figure 21-5.

FIGURE 21-2: RESET SYSTEM BLOCK DIAGRAM

MCLR

VDD

VDD Rise

Detect POR

SYSRST

Sleep or Idle

Brown-out

Reset BOREN

RESET

Instruction

WDT

Module

Digital

Glitch Filter

BOR

Trap Conflict

Illegal Opcode/

Uninitialized W Register

dsPIC30F4011/4012

FIGURE 21-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

FIGURE 21-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

FIGURE 21-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

TPWRT

OST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

MCLR

TPWRT

TOST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

MCLR

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

OST

dsPIC30F4011/4012

21.3.1.1 POR with Long Crystal Start-up Time

(with FSCM Enabled)

The oscillator start-up circuitry is not linked to the POR

circuitry. Some crystal circuits (especially low-

frequency crystals) have a relatively long start-up time.

Therefore, one or more of the following conditions is

possible after the POR timer and the PWRT have

expired:

• The oscillator circuit has not begun to oscillate.

• The Oscillator Start-up Timer has not expired (if a

crystal oscillator is used).

• The PLL has not achieved a lock (if PLL is used).

If the FSCM is enabled and one of the above conditions

is true, then a clock failure trap occurs. The device

automatically switches to the FRC oscillator and the

user can switch to the desired crystal oscillator in the

trap ISR.

21.3.1.2 Operating without FSCM and PWRT

If the FSCM is disabled and the Power-up Timer

(PWRT) is also disabled, then th e device exits rapidly

from Reset on power-up. If the clock source is FRC,

LPRC, ERC or EC, it will be active immediately.

If the FSCM is disabled and the system clock has not

started, the device will be in a frozen state at the Reset

vector until the system clock starts. From the user’s

perspective, the de vice will appear to be in Reset u ntil

a system clock is available.

21.3.2 BOR: PROGRAMMABLE

BROWN-OUT RESET

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit. The main purpose of

the BOR module is to generate a device Reset when a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (i.e.,

missing portions of the AC cycle waveform due to bad

power transmission lines, or voltage sags due to exces-

sive current draw when a large inductive load is turned

on).

The BOR module allows selection of one of the

following voltage trip points (see Table 24-10):

• 2.6V-2.71V

• 4.1V-4.4V

• 4.58V-4.73V

A BOR generates a Reset pulse, which resets the

device. The BOR selects the clock source, based on

the device Configuration bit values (FOS<1:0> and

FPR<3:0>). Furthermore, if an oscillator mode is

selected, the BOR activates the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, then the clock is held until

the LOCK bit (OSCCON<5>) is ‘1’.

Concurrently, the POR time-out (TPOR) and th e PWRT

time-out (TPWRT) are applied before th e internal Reset

is released. If TPWRT = 0 and a crystal oscillator is

being used, then a nominal delay of TFSCM = 100 μs is

applied. The total delay in this case is (TPOR + TFSCM).

The BOR status bit (RCON<1>) is set to indicate that a

BOR has occurred. The BOR circuit, if enabled, contin-

ues to operate while in Sleep or Idle modes and resets

the device if VDD falls below the BOR threshold voltage.

FIGURE 21-6: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

Note: The BOR voltage trip points indicated here

are nominal values provided for design

guidance only.

Note: Dedicated supervisory devices, such as

the MCP1XX and MCP8XX, may also be

used as an external Power-on Reset

circuit.

Note 1: External Power-on Reset circuit is required

only if the VDD power-up slope is too slow.

The diode D helps discharge the capacitor

quickly when VDD powers down.

2: R should be suitably chosen so as to make

sure that the voltage drop across R does not

violate the device’s electrical specification.

3: R1 should be suitably chosen so as to limit

any current flowing into MCLR from external

capacitor C, in the event of MCLR pin break-

down, due to Electrostatic Discharge (ESD)

or Electrical Overstress (EOS).

VDD

dsPIC30F

MCLR

dsPIC30F4011/4012

Table 21-5 lists the Reset conditions for the RCON

ter are R/W, the information in the table implies that all

the bits are negated prior to the action specified in the

condition column.

TABLE 21-5: INITIALIZATION CONDITION FOR RCON REGISTER, CASE 1

Table 21-6 lists a second example of the bit

conditions for the RCON register. In this case, it is not

assumed that the user has set/cleared specific bits

prior to action specified in the condition column .

TABLE 21-6: INITIALIZATION CONDITION FOR RCON REGISTER, CASE 2

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x00000 0 000000001

MCLR Reset during normal

operation 0x000000 001000000

Software Reset during

normal operation 0x000000 000100000

MCLR Reset during Sleep 0x0 00000 001000100

MCLR Reset during Idle 0x000000 001001000

WDT Time-out Reset 0x00000 0 000010000

WDT Wake-up PC + 2 000010100

Interrupt Wake-up from

Sleep PC + 2(1) 000000100

Clock Failure Trap 0x000004 000000000

Trap Reset 0x000000 100000000

Illegal Operation Trap 0x000000 010000000

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector .

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x000000 uuuuuuu01

MCLR Reset during normal

operation 0x000000 uu10000uu

Software Reset during

normal operation 0x000000 uu01000uu

MCLR Reset during Sleep 0x000000 uu1u001uu

MCLR Reset during Idle 0x0000 00 uu1u010uu

WDT Time-out Reset 0x000000 uu00100uu

WDT Wake-up PC + 2 uuuu1u1uu

Interrupt Wake-up from

Sleep PC + 2(1) uuuuuu1uu

Clock Failure Trap 0x000004 uuuuuuuuu

Trap Reset 0x000000 1uuuuuuuu

Illegal Operation Reset 0x000000 u1uuuuuuu

Legend: u = unchanged

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector .

dsPIC30F4011/4012

21.4 Watchdog Timer (WDT)

21.4.1 WATCHDOG TIMER OPERATION

The primary function of the Watchdog Timer (WDT) is

to reset the processor in the event of a software

malfunction. The WDT is a free-running timer that runs

off an on-chip RC oscillator, requiring no external

component. Therefore, the WDT timer continues to

operate even if the main processor clock (e.g., the

crystal oscillator) fails.

21.4.2 ENABLING AND DISABLING

THE WDT

The Watchdog Timer can be “Enabled” or “Disabled”

only through a Configuration bit (FWDTEN) in the

Configuration register, FWDT.

Setting FWDTEN = 1 enables the Watchdog Timer.

The enabling is done when programming the device.

By default, after chip erase, FWDTEN bit = 1. Any

device programmer capable of programming

dsPIC30F devices allows programming of this and

other Configuration bits.

If enabled, the WDT increments until it overflows or

“times out”. A WDT time-out forces a device Reset

(except during Sleep). To prevent a WDT time-out, the

user must clear the Watchdog Timer using a CLRWDT

instruction.

If a WDT times out during Sleep, the device wakes-up.

The WDTO bit in the RCON register is cleared to

indicate a wake-up resulting from a WDT time-out.

Setting FWDTEN = 0 allows user software to enable/

disable the Watchdog Timer via the SWDTEN

(RCON<5>) control bit.

21.5 Power-Saving Modes

There are two power-saving states that can be entered

through the execution of a special instruction, PWRSAV.

These are: Sleep and Idle.

The format of the PWRSAV instruction is as follows:

PWRSAV <parameter>

where,

‘parameter’ defines Idle or Sleep mode.

21.5.1 SLEEP MODE

In Sleep mode, the clock to the CPU and peripherals is

shut down. If an on-chip oscillator is being used, it is

shut down.

The Fail-Safe Clock Monitor is not functional during

Sleep, since there is no clock to monitor. However, the

LPRC clock remains active if WDT is operational during

Sleep.

The Brown-out Reset protection circuit and the Low-

Voltage Detect (LVD) circuit, if enabled, remain

functional during Sleep.

The processor wakes up from Sleep if at least one of

the followin g co nd i ti o ns ha s occurred:

• Any interrupt that is individually enabled and

meets the re qu i re d pri o ri ty le ve l

• Any Reset (POR, BOR and MCLR)

• WDT time-out

On waking up from Sleep mode, the processor restarts

the same clock that was active prior to entry into Sleep

mode. When clock switching is enabled, bits

COSC<1:0> determine the oscillator source to be

used on wake-up. If clock switch is disabled, then

there is only one system clock.

If the clock source is an oscillator, the clock to the

device is held off until OST times out (indicating a

stable oscillator). If PLL is used, the system clock is

held off until LOCK = 1 (indicating that the PLL is

stable). In either case, TPOR, TLOCK and TPWRT delays

are applied.

If EC, FRC, LPRC or ERC oscilla tors are used, th en a

delay of TPOR (~10 μs) is applied. This is the smallest

delay possible on wake-up from Slee p.

Moreover, if the LP oscillator was active during Sleep,

and LP is the oscillator used on wake-up, then the start-

up delay is equal to TPOR. PWRT and OST delays are

not applied. In order to have the smallest possible start-

up delay when waking up from Sleep, one of these

faster wake-up options should be selected before

entering Sleep.

Note: If a POR or BOR occurred, the selection of

the oscillator is based on the FOS<1:0>

and FPR<3:0> Configuration bits.

dsPIC30F4011/4012

Any interrupt that is individually enabled (using the

corresponding IE bit) and meets the prevailing priority

level can wake-up the processor. The processor

processes the interrupt and branches to the ISR. The

SLEEP status bit in the RCON register is set upon

wake-up.

All Resets wake-up the processor from Sleep mode.

Any Reset, other than POR, sets the SLEEP st atus bit.

In a POR, the SLEEP bit is cleared.

If W atchdog Timer is enabled, the processor wakes-up

from Sleep mode upon WDT time-out. The SLEEP and

WDTO status bits are both set.

21.5.2 IDLE MODE

In Idle mode, the clock to the CPU i s shut down while

peripherals keep running. Unlike Sleep mode, the clock

source remains active.

Several peripherals have a con trol bit in ea ch module,

that allows them to operate during Idle.

LPRC Fail-Safe Clock Monitor remains active if clock

failure detect is enable d.

The processor wakes up from Idle if at least one of the

following conditions is true:

• Any interrupt that is individually enabled (IE bit is

‘1’) and meets the required priority level

• Any Reset (POR, BOR, MCLR)

• WDT time-out

Upon wake-up from Idle mode, the clock is re-applied

to the CPU and instruction execution begins

immediately, starting with the instruction following the

PWRSAV instruction.

Any interrupt that is individually enabled (using IE bit)

and meets the prevailing priority level can wake-up the

processor. The processor processes the interrupt and

branches to the ISR. The IDLE status bit in RCON

Any Reset, other than POR, sets the IDLE status bit.

On a POR, the IDLE bit is cleared.

If Watchdog Timer is enabled, then the processor

wakes-up from Idle mode upon WDT time-out. The

IDLE and WDTO status bits are both set.

Unlike wake-up from Sleep, there are no time delays

involved in wake-up from Idle.

21.6 Device Configuration Registers

The Configuration bits in each device Configuration

programmed by a device programmer, or by using the

In-Circuit Serial Programming™ (ICSP™) feature of the

device. Each device Configuration register is a 24-bit

used to hold configuration data. There are five device

Configuration registers availab le to the user:

1. FOSC (0xF80000): Oscillator Config uration

2. FWDT (0xF80002): Watchdog Timer

Configuration Register

3. FBORPOR (0xF80004): BOR and POR

Configuration Register

4. FGS (0xF8000A): General Code Se gment

Configuration Register

5. FICD (0xF8000C): Debug Confi guration

The placement of the Configuration bits is automatically

handled when you select the device in your device

programmer. The desired state of the Configuration bits

may be specified in the source code (dependent on the

language tool used), or through the programming

interface. After the device has been programmed, the

application software may read the Configuration bit

values through the t able read instructions. For additiona l

information, please refer to the programming

specifications of the device.

Note: In spite of various delays applied (TPOR,

TLOCK and TPWRT), the crystal oscillator

(and PLL) may not be active at the end of

the time-out (e.g., for lo w-frequency crys-

tals). In such cases, if FSCM is enabled,

the device detects this condition as a

clock failure and processes the clock fail-

ure trap. The FRC oscillator is enabled,

and the user must re-enable the crystal

oscillator . If FSCM is not enabled, then the

device simply suspends execution of code

until the clock is stable and remains in

Sleep until the oscillator clock has started.

Note: If the code protection Configuration fuse

bits (FGS<GCP> and FGS<GWRP>)

have been programmed, an erase of the

entire code-protected device is only

possible at voltages VDD ≥ 4.5V.

dsPIC30F4011/4012

21.7 In-Circuit Debugger

When MPLAB® ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This func-

tion allows simple debugging functions when used with

MPLAB IDE. When the device has this feature enabled,

some of the resources are not available for general

use. These resources include the first 80 bytes of data

RAM and two I/O pins.

one of four pairs of debug I/O pins may be selected by

the user using configuration options in MPLAB IDE.

These pin pairs are named EMUD/EMUC, EMUD1/

EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3.

In each case, the selected EMUD pin is the emulation/

debug data line and the EMUC pin is the emulation/

debug clock line. These pins interface to the MPLAB

ICD 2 module available from Microchip. The selected

pair of debug I/O pins is used by MPLAB ICD 2 to send

commands and receive respo nses, as well as to send

and receive data. To use the in-circuit debugger func-

tion of the device, the design must implement ICSP

connections to MCLR, VDD, VSS, PGC, PGD and the

selected EMUDx/EMUCx pin pair.

This gives rise to two possibilities:

1. If EMUD/EMUC is selected as the debug I/O pin

pair , then only a 5-pin interface is required as the

EMUD and EMUC pin functions are multiplexed

with the PGD and PGC pin functions in all

dsPIC30F devices.

2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/

EMUC3 is selected as the debug I/O pin pair,

then a 7-pin interface is required as the EMUDx/

EMUCx pin functions (x = 1, 2 or 3) are not

multiplexed with the PGD and PGC pin

functions.

dsPIC30F4011/4012

TABLE 21-7: SYSTEM INTEGRATION REGISTER MAP(1)

TABLE 21-8: DEVICE CONFIGURATION REGISTER MAP(1)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

RCON 0740 TRAPR IOPUWR BGST —EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Depends on type of Reset.

OSCCON 0742 TUN3 TUN2 COSC<1:0> TUN1 TUN0 NOSC<1:0> POST<1:0> LOCK —CF— LPOSCEN OSWEN Depends on Configuration bits.

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F Family Reference Manual” (DS70 046) for descriptions of register bit fields.

Name Address Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

FOSC F80000 FCKSM<1:0> — — — —FOS<1:0>— — — —FPR<3:0>

FWDT F80002 FWDTEN — — — — — — — — — FWPSA<1:0> FWPSB<3:0>

FBORPOR F80004 MCLREN — — — —

PWMPIN

HPOL LPOL BOREN — BORV<1:0> ——FPWRT<1:0>

FBS F80006 —— Reserved(2) — — —

Reserved

(2)

— — — — Reserved(2)

FSS F80008 —— Reserved(2) —— Reserved(2) — — — — Reserved(2)

FGS F8000A — — — — — — — — — — — — —

Reserved

(2)

GCP GWRP

FICD F8000C BKBUG COE — — — — — — — — — — — —ICS<1:0>

Legend: — = unimplemented bit, read as ‘0’

Note 1: Refer to the “dsPIC30F F a m i l y Re fe r ence Manu a l ” (DS70046) for descriptions of register bit fields.

2: Reserved bits read as ‘1’ and must be programmed as ‘1’.

dsPIC30F4011/4012

22.0 INSTRUCTION SET SUMMARY

The dsPIC30F instruction set adds many

enhancements to the previous PIC® MCU instruction

sets, while maintaining an easy migration from PIC

MCU instruction sets.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single-word instruction is a 24-bit word divided

into an 8-bit opcode, which specifies the instruction

type, and one or more o perands which further specify

the operation of the instruction.

The instruction set is highly ortho gonal an d is gr ouped

into five basic categories:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• DSP operations

• Control operations

Table 22-1 shows the general symbols used in

describing the instructions.

The dsPIC30F instruction set summary in Table 22-2

lists all the instructions along with the status flags

affected by each instruction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand, which is typicall y a

• The second source operand, which is typically a

• The destination of the result, which is typically a

However , word or byte-oriented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could either be the file

‘WREG’

Most bit-oriented instructions (including simple rotate/

shift instructions) have two operands:

• The W register (with or without an address modi-

fier) or file register (specified by the value of ‘Ws’

or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The literal instructions that involve data movement may

use some of the following operands:

• A literal value to be loaded into a W register or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand which is a register ‘Wb’

without any address modifier

• The second source operand which is a literal

value

• The destination of the result (only if not the same

as the first source operand) which is typically a

The MAC class of DSP instructions may use some of the

following operands:

• The accumulator (A or B) to be used (required

operand)

• The W registers to be used as the two operands

• The X and Y address space prefetch operations

• The X and Y address space prefetch destinations

• The accumulator write-back destination

The other DSP instructions do not involve any

multiplication and may include:

• The accumulator to be used (required)

• The source or destination operand (designated as

Wso or Wdo, respectively) with or without an

address modifier

• The amount of shift, specified by a W register ‘Wn’

or a literal value

The control instructions may use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

All instructions are a single word, except for certain

double-word instructions, which were made double-

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8 MSbs are ‘0’s. If this second word is executed as an

instruction (by itself), it will execute as a NOP.

Note: This data sheet summarizes features of

this group of dsPIC30F devices and is not

intended to be a complete reference

source. For more information on the CPU,

peripherals, register descriptions and

general device functionality, refer to the

dsPIC30F Family Reference Manual

(DS70046). For more information on the

device instruction set and programming,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

dsPIC30F4011/4012

Most single-word instru ctions are executed in a single

instruction cycle, unless a conditional test is true or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/computed branch), indirect CALL/GOTO, all table

reads and writes and RETURN/RETFIE instructions,

which are single-word instructions but take two or three

cycles. Certain instructions that involve skipping over

the subsequent instruction , require either two or three

cycles if the skip is performed, depending on whether

the instruction being skipped is a single-word or two-

word instruction. Moreover, double-word moves

require two cycles. The double-word instructions

execute in two instruction cycles.

Note: For more details on the instruction set,

refer to the “16-bit MCU and DSC

Reference Manual” (DS70157).

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Means literal defined by “text“

(text) Means “content of text“

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double-Word mode selection

.S Shadow register select

.w Word mode selection (default)

Acc One of two accumulators {A, B}

AWB Accumulator Write-Back Destination Address register ∈ {W13, [W13]+=2}

bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero

Expr Absolute address, label or expression (resolved by the linker)

fFile register addr ess ∈ {0x0000...0x1FFF}

lit1 1-bit unsigned literal ∈ {0,1}

lit4 4-bit unsigned literal ∈ {0...15}

lit5 5-bit unsigned literal ∈ {0...31}

lit8 8-bit unsigned literal ∈ {0...255}

lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal ∈ {0...16384}

lit16 16-bit unsigned literal ∈ {0...65535}

lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0

None Field does not require an entry, may be blank

OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate

PC Program Counter

Slit10 10-bit signed literal ∈ {-512...511}

Slit16 16-bit signed literal ∈ {-32768...32767}

Slit6 6-bit signed literal ∈ {-16...16}

dsPIC30F4011/4012

Wb Base W register ∈ {W0..W15}

Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (Direct Addressing)

Wm*Wm Multiplicand and Multiplier working regi ster pair for Square instructions ∈

{W4*W4, W5*W5 , W6 * W6 , W7*W7}

Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈

{W4*W5, W4*W6, W4*W7, W5*W6, W5*W7, W6*W7}

Wn One of 16 working registers ∈ {W0..W15}

Wnd One of 16 destination working registers ∈ {W0..W15}

Wns One of 16 source working registers ∈ {W0..W15}

WREG W0 (working register used in file register instruction s)

Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx X Data Space Prefetch Address register for DSP instructions

∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8] -=4, [W 8]-=2,

[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,

[W9+W12],none}

Wxd X Data Space Prefetch Destination register for DSP instructions ∈ {W4..W7}

Wy Y Data Space Prefetch Address register for DSP instructions

∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,

[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,

[W11+W12], none}

Wyd Y Data Space Prefetch Destination register for DSP instructions ∈ {W4..W7}

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

dsPIC30F4011/4012

TABLE 22-2: INSTRUCTION SET OVERVIEW

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

words # of

cycles Status Flags

Affected

1ADD ADD Acc Add Accumulators 1 1 OA, OB, SA, SB

ADD f f = f + WREG 1 1 C, DC, N, OV, Z

ADD f,WREG WREG = f + WREG 1 1 C, DC, N, OV, Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C, DC, N, OV, Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C, DC, N, OV, Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C, DC, N, OV, Z

ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA, OB, SA, SB

2ADDC ADDC f f = f + WREG + (C) 1 1 C, DC, N, OV, Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C, DC, N, OV, Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C, DC, N, OV, Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C, DC, N, OV, Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C, DC, N, OV, Z

3AND AND f f = f .AND. WREG 1 1 N, Z

AND f,WREG WREG = f .AND. WREG 1 1 N, Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N, Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N, Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N, Z

4ASR ASR f f = Arithmetic Right Shift f 1 1 C, N, OV, Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C, N, OV, Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C, N, OV, Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N, Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N, Z

5BCLR BCLR f,#bit4 Bit Clear f 1 1 None

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6BRA BRA C,Expr Branch if Carry 1 1 (2) None

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None

BRA GT,Expr Branch if greater than 1 1 (2) None

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr Branch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NOV,Expr Branch if Not Ov er f lo w 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) None

BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None

BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None

BRA OV,Expr Branch if Overflow 1 1 (2) None

BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None

BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr Branch if Zero 1 1 (2) None

BRA Wn Computed Branch 1 2 None

7BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 None

8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

dsPIC30F4011/4012

9BTG BTG f,#bit4 Bit Toggle f 1 1 No n e

BTG Ws,#bit4 Bit Toggle Ws 1 1 Non e

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3) None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3) None

11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1

(2 or 3) None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3) None

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Se t 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Se t 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA, OB, SA, SB

16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO, Sleep

17 COM COM f f = f 11N, Z

COM f,WREG WREG = f 11N, Z

COM Ws,Wd Wd = Ws 11N, Z

18 CP CP f Compare f with WREG 1 1 C, DC, N, OV, Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C, DC, N, OV, Z

CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C, DC, N, OV, Z

19 CP0 CP0 f Comp are f with 0x0000 1 1 C, DC, N, OV, Z

CP0 Ws Compare Ws with 0x0000 1 1 C, DC, N, OV, Z

20 CPB CPB f Comp are f with WREG, with Borrow 1 1 C, DC, N, OV, Z

CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C, DC, N, OV, Z

CPB Wb,Ws Compare Wb with Ws, with Borrow

(Wb – Ws – C)1 1 C, DC, N, OV, Z

21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3) None

22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1

(2 or 3) None

23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3) None

24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠11

(2 or 3) None

25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

26 DEC DEC f f = f –1 1 1 C, DC, N, OV, Z

DEC f,WREG WREG = f –1 1 1 C, DC, N, OV, Z

DEC Ws,Wd Wd = Ws – 1 1 1 C, DC, N, OV, Z

27 DEC2 DEC2 f f = f – 2 1 1 C, DC, N, OV, Z

DEC2 f,WREG WREG = f – 2 1 1 C, DC, N, OV, Z

DEC2 Ws,Wd Wd = Ws – 2 1 1 C, DC, N, OV, Z

28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N, Z, C, OV

30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N, Z, C, OV

31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 time 2 2 None

DO Wn,Expr Do code to PC + Expr, (Wn) +1 time 2 2 None

32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance ( no accumula te) 1 1 OA, OB, OAB,

SA, SB, SAB

33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA, OB, OAB,

SA, SB, SAB

34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C

36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C

38 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to indirect 1 2 None

39 INC INC f f = f + 1 1 1 C, DC, N, OV, Z

INC f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z

INC Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z

40 INC2 INC2 f f = f + 2 1 1 C, DC, N, OV, Z

INC2 f,WREG WREG = f + 2 1 1 C, DC, N, OV, Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C, DC, N, OV, Z

41 IOR IOR f f = f .IOR. WREG 1 1 N, Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N, Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N, Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N, Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N, Z

42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

43 LNK LNK #lit14 Link Frame Pointer 1 1 None

44 LSR LSR f f = Logical Right Shift f 1 1 C, N, OV, Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C, N, OV, Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C, N, OV, Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N, Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N, Z

45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,

AWB Multiply and Accumulate 1 1 OA, OB, OAB,

SA, SB, SAB

MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA, OB, OAB,

SA, SB, SAB

46 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 None

MOV f,WREG Move f to WREG 1 1 None

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 None

MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None

47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store accumulator 1 1 None

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

48 MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumula tor 1 1 OA, OB, OAB,

SA, SB, SAB

49 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None

50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,

AWB Multiply and Subtract from Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

51 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) *

unsigned(Ws) 1 1 None

MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) *

unsigned(lit5) 1 1 None

MUL f W3:W2 = f * WREG 1 1 None

52 NEG NEG Acc Negate Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

NEG f f = f + 1 1 1 C, DC, N, OV, Z

NEG f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z

NEG Ws,Wd Wd = Ws + 1 1 1 C, DC, N, OV, Z

53 NOP NOP No Operation 1 1 None

NOPR No Operation 1 1 None

54 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None

POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd

+1) 1 2 None

POP.S Pop Shadow Registers 1 1 All

55 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None

PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None

PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None

PUSH.S Push Shadow Registers 1 1 None

56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO, Sleep

57 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 time 1 1 None

REPEAT Wn Repeat Next Instruction (Wn) + 1 time 1 1 None

59 RESET RESET Software device Reset 1 1 None

60 RETFIE RETFIE Return from interrupt 1 3 (2) None

61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

62 RETURN RETURN Return from Subroutine 1 3 (2) None

63 RLC RLC f f = Rotate Left through Carry f 1 1 C, N, Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C, N, Z

RLC Ws,Wd Wd = Rotate Lef t through Carry Ws 1 1 C, N, Z

64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N, Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N, Z

RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N, Z

65 RRC RRC f f = Rot ate Right through Carry f 1 1 C, N, Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C, N, Z

RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C, N, Z

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N, Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N, Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N, Z

67 SAC SAC Acc,#Slit4,Wdo Store Accumulat or 1 1 None

SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None

68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C, N, Z

69 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xFFFF 1 1 None

70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA, OB, OAB,

SA, SB, SAB

SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA, OB, OAB,

SA, SB, SAB

71 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N, Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N, Z

72 SUB SUB Acc Subtract Accumulators 1 1 OA, OB, OAB,

SA, SB, SAB

SUB f f = f – WREG 1 1 C, DC, N, OV, Z

SUB f,WREG WREG = f – WREG 1 1 C, DC, N, OV, Z

SUB #lit10,Wn Wn = Wn – lit10 1 1 C, DC, N, OV, Z

SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C, DC, N, OV, Z

SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C, DC, N, OV, Z

73 SUBB SUBB f f = f – WREG – (C) 1 1 C, DC, N, OV, Z

SUBB f,WREG WREG = f – WREG – (C) 1 1 C, DC, N, OV, Z

SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C, DC, N, OV, Z

SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C, DC, N, OV, Z

SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C, DC, N, OV, Z

74 SUBR SUBR f f = WREG – f 1 1 C, DC, N, OV, Z

SUBR f,WREG WREG = WREG – f 1 1 C, DC, N, OV, Z

SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C, DC, N, OV, Z

SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C, DC, N, OV, Z

75 SUBBR SUBBR f f = WREG – f – (C) 1 1 C, DC, N, OV, Z

SUBBR f,WREG WREG = WREG – f – (C) 1 1 C, DC, N, OV, Z

SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C, DC, N, OV, Z

SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C, DC, N, OV, Z

76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None

79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None

80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None

81 ULNK ULNK Unlink Frame Pointer 1 1 None

82 XOR XOR f f = f .XOR. WREG 1 1 N, Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N, Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N, Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N, Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N, Z

83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C, N, Z

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

23.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers and dsPIC® digital signal

controllers are supported with a full range of software

and hardware development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Compilers/Assemblers/Linkers

- MPLAB C Compiler for Vari ous Device

Families

- HI-TECH C for Various Device Families

- MPASMTM Assembler

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB Assembler/Linker/Librarian for

Various Device Families

• Simulators

- MPLAB SIM Software Simulator

• Emulators

- MPLAB REAL ICE™ In-Circuit Emulator

• In-Circuit Debuggers

- MPLAB ICD 3

- PIC kit™ 3 Debug Express

• Device Programmers

- PICkit™ 2 Programmer

- MPLAB PM3 Device Programmer

• Low-Cost Demonstra tion/Development Boards,

Evaluation Kits, and Starter Kits

23.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16/32-bit

microcontroller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- In-Circuit Emulator (sold separately)

- In-Circuit Debugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Extensive on-line help

• Integration of select third party tools, such as

IAR C Compilers

The MPLAB IDE allows you to:

• Edit your source files (either C or assembly)

• One-touch compile or assemble, and download to

emulator and simulator tools (automatically

updates all project information)

• Debug using:

- Source files (C or assembly)

- Mixed C and assembly

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

dsPIC30F4011/4012

23.2 MPLAB C Compilers for Various

Device Families

The MPLAB C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC18,

PIC24 and PIC32 families of microcontrollers and the

dsPIC30 and dsPIC33 families of digital signal control-

lers. These compilers provide powerful integration

capabilities, superior code optimization and ease of

use.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

23.3 HI-TECH C for Various Device

Families

The HI-TECH C Compiler code development systems

are complete ANSI C compilers for Microchip’s PIC

family of microcontrollers and the dsPIC family of digital

signal controllers. These compilers provide powerful

integration capabilities, omniscient code generation

and ease of us e.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

The compilers include a macro assembler, linker,

preprocessor, and one-step driver, and can run on

multiple platforms.

23.4 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for PIC10/12/16/18 MCUs.

The MPASM Assembler generates relocatable object

files for the MPLINK Object Linker , Intel® standard HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST fi les that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

source files

• Directives that allow complete control over the

assembly process

23.5 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler . It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB Object Librarian manages the creation and

modification of libra ry files of preco mpiled cod e. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features inclu de:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grou ping

related modules together

• Flexible creation of libra ries with easy module

listing, replacement, deletion and extraction

23.6 MPLAB Assembler, Linker and

Librarian for Various Device

Families

MPLAB Assembler produces relocatable machine

code from symbolic assembly language for PIC24,

PIC32 and dsPIC devices. MPLAB C Compiler uses

the assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file . Notable features

of the assembler include:

• Support for the entire device instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro lang uage

• MPLAB IDE compatibility

dsPIC30F4011/4012

23.7 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and d sPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified a nd stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most peripherals and internal registers.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C Compilers,

and the MPASM and MPLAB Assemblers. The

software simulator offers the flexibility to develop and

debug code outside of the hardware laboratory

environment, making it an excellent, economical

software development tool.

23.8 MPLAB REAL ICE In-Circuit

Emulator System

MPLAB REAL ICE In-Circuit Emulator System is

Microchip’s next generation high-speed emulator for

Microchip Flash DSC and MCU devices. It debugs and

programs PIC® Flash MCUs and dsPIC® Flash DSCs

with the easy-to-use, powerful graphical user interface of

the MPLAB Integrated Development Environment (IDE),

included with each kit.

The emulator is connected to the design engineer ’s PC

using a high-speed USB 2.0 interface and is connected

to the target with either a connector compatible with in-

circuit debugger systems (RJ11) or with the new high-

speed, noise tolerant, Low-Voltage Differential Signal

(LVDS) interconnection (CAT5).

The emulator is field upgradable through future firmware

downloads in MPLAB IDE. In upcoming releases of

MPLAB IDE, new devices will be supported, and new

features will be added. MPLAB REAL ICE offers

significant advantages over competitive emulators

including low-cost, full-speed emulation, run-time

variable watches, trace analysis, complex breakpoints, a

ruggedized probe interface and long (up to three meters)

interconnection cables.

23.9 MPLAB ICD 3 In-Circuit Debugger

System

MPLAB ICD 3 In-Circuit Debugger System is Micro-

chip's most cost effective high-speed hardware

debugger/programmer for Microchi p Flash Digital Sig-

nal Controller (DSC) and microcontroller (MCU)

devices. It debugs and programs PIC® Flash microcon-

trollers and dsPIC® DSCs with the powerful, yet easy-

to-use graphical user interface of MPLAB Integrated

Development Environment (IDE).

The MPLAB ICD 3 In-Circuit Debugger probe is con-

nected to the design engineer's PC using a high-speed

USB 2.0 interface and is connected to the target with a

connector compatible with the MPLAB ICD 2 or MPLAB

REAL ICE systems (RJ-11). MPLAB ICD 3 supports all

MPLAB ICD 2 headers.

23.10 PICkit 3 In-Circuit Debugger/

Programmer and

PICkit 3 Debug Express

The MPLAB PICkit 3 allows debugging and

programming of PIC® and dsPIC® Flash

microcontrollers at a most affordable price point using

the powerful graphical user interface of the MPLAB

Integrated Development Environment (IDE). The

MPLAB PICkit 3 is connected to the design engineer's

PC using a full speed USB interface and can be

connected to the target via an Microchip debug (RJ-11)

connector (compatible with MPLAB IC D 3 and MPLAB

REAL ICE). The connector uses two device I/O pins

and the reset line to implement in-circuit debugging and

In-Circuit Serial Programming™.

The PICkit 3 Debug Express include the PICkit 3, demo

board and microcontroller , hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

dsPIC30F4011/4012

23.11 PICkit 2 Development

Programmer/Debugger and

PICkit 2 Debug Express

The PICkit™ 2 Development Programmer/Debugger is

a low-cost development tool with an easy to use inter-

face for programming and debugging Microchip’s Flash

families of microcontrollers. The full featured

Windows® programming interface supports baseline

(PIC10F, PIC12F5xx, PIC16F5xx), midrange

(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,

dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit

microcontrollers, and many Microchip Serial EEPROM

products. With Microchip’s powerful MPLAB Integrated

Development Environment (IDE) the PICkit™ 2

enables in-circuit debugging on most PIC® microcon-

trollers. In-Circuit-Debugging runs, halts and single

steps the program while the PIC microcontroller is

embedded in the ap plication. When halted at a break-

point, the file registers can be examined and modified.

The PICkit 2 Debug Express include the PICkit 2, demo

board and microcontroller, hookup cables and CDROM

with user’s guide, lessons, tutorial, compiler and

MPLAB IDE software.

23.12 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64) for menus and error messages and a modu-

lar, detachable socket assembly to support various

package types. The ICSP™ cable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Device Programmer can read, verify and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 has high-speed communications and

optimized algorithms for quick programming of large

memory devices and incorporates an MMC card for file

storage and data applications.

23.13 Demonstration/Development

Boards, Evaluation Kits, and

Star ter Kits

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards include prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The boards support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displa ys, potentiometers and additiona l

EEPROM memory.

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and d sPICDEM™ demon-

stration/develop ment board series of circuit s, Microchip

has a line o f evaluation kit s and demons tration softwa re

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Also available are starter kits that contain everything

needed to experience the specified device. This usually

includes a single application and debug capability, all

on one board.

Check the Microchip web page (www.microchip.com)

for the complete list of demonstration, development

and evaluation kits.

dsPIC30F4011/4012

24.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future

revisions of this document as it becomes available.

For detailed informatio n about the ds PIC30F archi tecture an d core, refer to the “ dsPIC3 0F Family Reference Manual”

(DS70046).

Absolute maximum ratings for the d sPIC30F famil y are liste d be low. Exposure to these maximum rating condi tions for

extended periods may affect device reliability . Functional operation of the device at these or any other conditions above

the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Vo ltage on any pin with respect to V SS (except VDD and MCLR) (Note 1).....................................-0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Vo ltage on MCLR with respect to VSS .......................................................................................................0V to +13.25V

Maximum current out of VSS pin..................... .............. ......................... ......................... .............. ........................300 mA

Maximum current into VDD pin (Note 2)..................... ... .............. .............. .............. .............. ......................... .......250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)............ ... .............. .............. .............. ......................... ............... .........±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD)........... ... .............. .............. .............. .............. .............. ...............±20 mA

Maximum output current sunk by any I/O pin............................................................................................ ... ...........25 mA

Maximum output current sourced by any I/O pin ......................................................................................... .. .........25 mA

Maximum current sunk by all ports .................... ....................................................................................... ... .........200 mA

Maximum current sourced by all ports (Note 2)...... ... .............. .............. .............. ......................... ............... .........200 mA

Note 1: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.

Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/ pin, rather than

pulling this pin directly to VSS.

2: Maximum allowable current is a function of devi c e maximum power dissipation (see Table 24-2).

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

dsPIC30F4011/4012

24.1 DC Characteristics

TABLE 24-1: OPERATING MIPS VS. VOLTAGE

VDD Range Temp Range Max MIPS

dsPIC30F401X-30I dsPIC30F401X-20E

4.5-5.5V -40°C to +85°C 30 —

4.5-5.5V -40°C to +125°C — 20

3.0-3.6V -40°C to +85°C 20 —

3.0-3.6V -40°C to +125°C — 15

2.5-3.0V -40°C to +85°C 10 —

TABLE 24-2: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

dsPIC30F401X-30I

Operating Junction Temperature Rang e TJ-40 — +125 °C

Operating Ambient Temperature Range TA-40 — +85 °C

dsPIC30F401X-20E

Operating Junction Temperature Range TJ-40 — +150 °C

Operating Ambient Temperature Range TA-40 — +125 °C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD X (IDD – ∑ IOH) PDPINT + PI/OW

I/O Pin power dissipation:

PI/O = ∑ ({VDD – VOH} X IOH) + ∑ (V OL X IOL)

Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W

TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 28-pin SPDIP (SP) θJA 41 — °C/W 1

Package Thermal Resistance, 28-pin SOIC (SO) θJA 45 — °C/W 1

Package Thermal Resistance, 40-pin PDIP (P) θJA 37 — °C/W 1

Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT) θJA 40 — °C/W 1

Package Thermal Resistance, 44-pin QFN (ML) θJA 28 — °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.

dsPIC30F4011/4012

TABLE 24-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage(2)

DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature

DC11 VDD Supply Voltage 3.0 — 5.5 V Extended temperature

DC12 VDR RAM Data Retention

Voltage(3) 1.75 — — V

DC16 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

—VSS —V

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 — — V/ms 0-5V in 0.1 sec,

0-3V in 60 ms

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: This is the limit to which VDD can be lowered without losing RAM data.

dsPIC30F4011/4012

TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC31a 2 4 mA +25°C 3.3V

0.128 MIPS

LPRC (512 kHz)

DC31b 2 4 mA +85°C

DC31c 2 4 mA +125°C

DC31e 3 5 mA +25°C 5VDC31f 3 5 mA +85°C

DC31g 3 5 mA +125°C

DC30a 4 6 mA +25°C 3.3V

(1.8 MIPS)

FRC (7.37 MHz)

DC30b 4 6 mA +85°C

DC30c 4 6 mA +125°C

DC30e 7 10 mA +25°C 5VDC30f 7 10 mA +85°C

DC30g 7 10 mA +125°C

DC23a 12 19 mA +25°C 3.3V

4 MIPS

DC23b 12 19 mA +85°C

DC23c 13 19 mA +125°C

DC23e 19 31 mA +25°C 5VDC23f 20 31 mA +85°C

DC23g 20 31 mA +125°C

DC24a 28 39 mA +25°C 3.3V

10 MIPS

DC24b 28 39 mA +85°C

DC24c 29 39 mA +125°C

DC24e 46 64 mA +25°C 5VDC24f 46 64 mA +85°C

DC24g 47 64 mA +125°C

DC27a 53 72 mA +25°C 3.3V

20 MIPS

DC27b 53 72 mA +85°C

DC27d 87 120 mA +25°C 5VDC27e 87 120 mA +85°C

DC27f 87 120 mA +125°C

DC29a 124 170 mA +25°C 5V 30 MIPS

DC29b 125 170 mA +85°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidan ce only

and are not te ste d.

2: The supply current is mainl y a function of the operating voltage and frequency. Other factors, such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, program memory and data memory

are operational. No peripheral modules are operating.

dsPIC30F4011/4012

TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1,2) Max Units Conditions

Operating Current (IDD)(3)

DC51a 1.3 3 mA +25°C 3.3V

0.128 MIPS

LPRC (512 kHz)

DC51b 1.3 3 mA +85°C

DC51c 1.3 3 mA +125°C

DC51e 2.7 5 mA +25°C 5VDC51f 2.7 5 mA +85°C

DC51g 2.7 5 mA +125°C

DC50a 4 6 mA +25°C 3.3V

(1.8 MIPS)

FRC (7.37 MHz)

DC50b 4 6 mA +85°C

DC50c 4 6 mA +125°C

DC50e 7 11 mA +25°C 5VDC50f 7 11 mA +85°C

DC50g 7 11 mA +125°C

DC43a 7 11 mA +25°C 3.3V

4 MIPS

DC43b 7 11 mA +85°C

DC43c 7 11 mA +125°C

DC43e 12 17 mA +25°C 5VDC43f 12 17 mA +85°C

DC43g 12 17 mA +125°C

DC44a 15 22 mA +25°C 3.3V

10 MIPS

DC44b 15 22 mA +85°C

DC44c 16 22 mA +125°C

DC44e 26 36 mA +25°C 5VDC44f 27 36 mA +85°C

DC44g 27 36 mA +125°C

DC47a 30 40 mA +25°C 3.3V

20 MIPS

DC47b 30 40 mA +85°C

DC47d 50 65 mA +25°C 5VDC47e 50 65 mA +85°C

DC47f 51 65 mA +125°C

DC49a 72 95 mA +25°C 5V 30 MIPS

DC49b 73 95 mA +85°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidan ce only

and are not tested.

2: Base IIDLE current is measured with core off, clock on and all modules turned off.

dsPIC30F4011/4012

TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power-Down Current (IPD)(2)

DC60a 0.3 — μA 25°C 3.3V

Base power-down current(3)

DC60b 1 30 μA 85°C

DC60c 12 60 μA125°C

DC60e 0.5 — μA 25°C 5VDC60f 2 45 μA 85°C

DC60g 17 90 μA125°C

DC61a 5 8 μA 25°C 3.3V

Watchdog Timer current: ΔIWDT(3)

DC61b 5 8 μA 85°C

DC61c 6 9 μA125°C

DC61e 10 15 μA 25°C 5VDC61f 10 15 μA 85°C

DC61g 11 17 μA125°C

DC62a 4 10 μA 25°C 3.3V

Timer1 w/32 kHz crystal: ΔITI32(3)

DC62b 5 10 μA 85°C

DC62c 4 10 μA125°C

DC62e 4 15 μA 25°C 5VDC62f 6 15 μA 85°C

DC62g 5 15 μA125°C

DC63a 32 48 μA 25°C 3.3V

BOR on: ΔIBOR(3)

DC63b 35 53 μA 85°C

DC63c 37 56 μA125°C

DC63e 37 56 μA 25°C 5VDC63f 41 62 μA 85°C

DC63g 57 86 μA125°C

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

TABLE 24-8: DC CHA RACTER ISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

St a ndard Operat ing Cond itions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage(2)

DI10 I/O pins:

with Schmitt Trigger buffer VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 OSC1 (in XT, HS and LP modes) V SS —0.2VDD V

DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V

DI18 SDA, SCL VSS —0.3VDD V SMBus disabled

DI19 SDA, SCL VSS — 0.8 V SMBus enabled

VIH Input High Vo ltage(2)

DI20 I/O pins:

with Schmitt Trigger buffer 0.8 VDD —VDD V

DI25 MCLR 0.8 VDD —VDD V

DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V

DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V

DI28 SDA, SCL 0.7 VDD —VDD V SMBus disabled

DI29 SDA, SCL 2.1 — VDD V SMBus enabled

DI30 ICNPU CNXX Pull-up Current(2) 50 250 400 μAVDD = 5V, VPIN = VSS

IIL Input Leakage Current(2,4,5)

DI50 I/O ports — 0.01 ±1 μAVSS ≤ VPIN ≤ VDD,

Pin at high-impeda nce

DI51 Analog input pins — 0.50 — μAVSS ≤ VPIN ≤ VDD,

Pin at high-impeda nce

DI55 MCLR —0.05±5μAVSS ≤ VPIN ≤ VDD

DI56 OSC1 — 0.05 ±5 μAVSS ≤ VPIN ≤ VDD,

XT, HS and LP Osc mode

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing .

3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that the

dsPIC30F device be driven with an external clock while in RC mode.

4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified lev-

els represent normal operating conditions. Higher leakage current may be measured at different input volt-

ages.

5: Negative current is defined as current sourced by the pin.

dsPIC30F4011/4012

FIGURE 24-1: BROWN-OUT RESET CHARACTERISTICS

TABLE 24-9: DC CHARACTERISTICS: I/O PIN OUTPU T SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VOL Output Low Voltage(2)

DO10 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 5V

— — 0.15 V IOL = 2.0 mA, VDD = 3V

DO16 OSC2/CLKO — — 0.6 V IOL = 1.6 mA, VDD = 5V

(RC or EC Osc mode) — — 0.72 V IOL = 2.0 mA, VDD = 3V

VOH Output High Volt a g e(2)

DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V

VDD – 0.2 — — V IOH = -2.0 mA, VDD = 3V

DO26 OSC2/CLKO VDD – 0.7 — — V I OH = -1.3 mA, VDD = 5V

(RC or EC Osc mode) VDD – 0.1 — — V IOH = -2.0 mA, VDD = 3V

Capacitive Loading Specs

on Output Pins(2)

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XTL, XT, HS and LP modes

when external clock is used to

drive OSC1

DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode

DO58 CBSCL, SDA — — 400 pF In I2C™ mode

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

BO10

Reset (due to BOR)

VDD

(Device in Brown-out Reset)

(Device not in Brown-out Reset)

Power-up Time-out

BO15

dsPIC30F4011/4012

TABLE 24-10: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

BO10 VBOR BOR Voltage on

VDD Transition

High-to-Low(2)

BORV = 11(3) — — — V Not in operating range

BORV = 10 2.6 — 2.71 V

BORV = 01 4.1 — 4.4 V

BORV = 00 4.58 — 4.73 V

BO15 VBHYS —5—mV

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: ‘11’ values not in usable operating range.

TABLE 24-11: DC CHARACTERISTICS: PROGRAM AND EEPROM

DC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Dat a EEPROM Memory(2)

D120 EDByte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write,

VMIN = Minimum operating voltage

D122 TDEW Erase/Write Cycle Time 0.8 2 2.6 ms RTSP

D123 TRETD Characteristic Retenti on 40 100 — Year Provided no other specifications are

violated

D124 IDEW IDD During Programming — 10 30 mA Row Erase

Program Flash Memory(2)

D130 EPCell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C

D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating voltage

D132 VEB VDD for Bulk Erase 4.5 — 5.5 V

D133 VPEW VDD for Erase/Write 3.0 — 5.5 V

D134 TPEW Erase/Write Cycle Time 0.8 2 2.6 ms RTSP

D135 TRETD Characteristic Retenti on 40 100 — Year Provided no other specifications are

violated

D137 IPEW IDD During Programming — 10 30 mA Row Erase

D138 IEB IDD During Programming — 10 30 mA Bulk Erase

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing .

dsPIC30F4011/4012

24.2 AC Characteristics and Timing Parameters

The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 24-12: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 24-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

FIGURE 24-3: EXTERNAL CLOCK TIMING

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherw ise state d)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Operating voltage VDD range as described in Section 24.1 “DC

Characteristics”.

VDD/2

VSS

RL=464Ω

CL= 50 pF for all pins except OSC2

5 pF for OSC2 output

Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2

OSC1

CLKO

Q4 Q1 Q2 Q3 Q4 Q1

OS20 OS30 OS30

OS40 OS41

OS31 OS31

OS25

dsPIC30F4011/4012

TABLE 24-13: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS10 FOSC External CLKI Freq uency

(external clocks allowed only

in EC mode)(2)

—

7.5

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

Oscillator Frequency(2) DC

0.4

—

7.37

512

7.5

—

MHz

kHz

MHz

kHz

XTL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

FRC internal

LPRC internal

OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10

for FOSC value

OS25 TCY Instruction Cycle Time(2,3) 33 — DC ns See Table 24-16

OS30 TosL,

TosH Exte rnal Clock in (OSC1)

High or Low Time(2) .45 x TOSC ——nsEC

OS31 TosR,

TosF Exte rnal Clock in (OSC1)

Rise or Fall Time(2) — — 20 ns EC

OS40 TckR CLKO Rise Time(2,4) — — — ns See parameter DO31

OS41 TckF CLKO Fall Time(2,4) — — — ns See parameter DO32

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified value s

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exc eeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“Max.” cycle time limit is “DC” (no clock) for all devices.

4: Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is

low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

dsPIC30F4011/4012

TABLE 24-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5V)

AC CHARACTERISTICS

Stand a rd Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extende d

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OS50 FPLLI PLL Input Frequency Range(2) 4

—

7.5(3)

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

OS51 FSYS On-Chip PLL Output(2) 16 — 120 MHz EC, XT with PLL

OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 μs

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Limited by device operating frequency range.

TABLE 24-15: PLL JITTER

AC CHARACTERISTICS

Stan da rd Ope r a tin g Conditions: 2.5V to 5. 5 V

(unless otherwise stated )

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ(1) Max Units Conditions

OS61 x4 PLL — 0.251 0.413 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.251 0.413 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.256 0.47 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.256 0.47 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x8 PLL — 0.355 0.584 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.355 0.584 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.362 0.664 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.362 0.664 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x16 PLL — 0.67 0.92 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.632 0.956 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.632 0.956 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

TABLE 24-16: INTERNAL CLOCK TIMING EXAMPLES

Clock

Oscillator

Mode

FOSC

(MHz)(1) TCY (μsec)(2) MIPS

w/o PLL(3) MIPS

w/PLL x4(3) MIPS

w/PLL x8(3) MIPS

w/PLL x16(3)

EC 0.200 20.0 0.05 — — —

4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

25 0.16 6.25 — — —

XT 4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

Note 1: Assumption: Oscillator postscaler is divide by 1.

2: Instruction Execution Cycle Time: TCY = 1/MIPS.

3: Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4, since there are 4 Q clocks per instruction cycle.

dsPIC30F4011/4012

TABLE 24-17: AC CHARACTERISTICS: INTERNAL FRC ACCURACY

AC CHARACTERISTICS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

Internal FRC Accuracy @ FRC Freq . = 7.37 MHz(1)

OS63 FRC — — ±2.00 % -40°C ≤ TA ≤ +85°C VDD = 3.0-5.5V

— — ±5.00 % -40°C ≤ TA ≤ +125°C VDD = 3.0-5.5V

Note 1: Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN<3:0> bits can be used to compensate for

temperature drift.

TABLE 24-18: AC CHARACTERISTICS: INTERNAL LPRC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ Freq. = 512 kHz(1)

OS65A -50 — +50 % VDD = 5.0V, ±10%

OS65B -60 — +60 % VDD = 3.3V, ±10%

OS65C -70 — +70 % VDD = 2.5V

Note 1: Change of LPRC frequency as VDD changes.

dsPIC30F4011/4012

FIGURE 24-4: CLKO AND I/O TIMING CHARACTERISTICS

Note: Refer to the Figure 24-2 for load.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Value New Value

DI40

DO31

DO32

TABLE 24-19: CLKO AND I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard O perating Con ditions: 2.5V t o 5.5V ( unless oth erwis e s tated)

Operating temperature -40°C ≤ TA ≤ + 85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1,2,3) Min Typ(4) Max Units Conditions

DO31 TIOR Port Output Rise Time — 7 20 ns

DO32 TIOF Port Output Fall Time — 7 20 ns

DI35 TINP INTx Pin High or Low Time (output) 20 — — ns

DI40 TRBP CNx High or Low Time (input) 2 TCY ——ns

Note 1: These parameters are asynchronous events not related to any internal clock edges

2: Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.

3: These parameters are characterized but not tested in manufacturing.

4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F4011/4012

FIGURE 24-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

Oscillator

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to the Figure 24-2 for load conditions.

FSCM

Delay

SY35

SY30

SY12

dsPIC30F4011/4012

FIGURE 24-6: BAND GAP START-UP TIME CHARACTERISTICS

TABLE 24-20: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET TIMING REQUIREMENTS

AC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C

SY11 TPWRT Power-up Timer Period 2

ms -40°C to +85°C, VDD = 5V

User programmable

SY12 TPOR Power-on Reset Delay 3 10 30 μs -40°C to +85°C

SY13 TIOZ I/O High-Impedance from MCLR

Low or Watchdog Timer Reset —0.81.0μs

SY20 TWDT1

TWDT2

TWDT3

Watchdog Timer Ti me-out

Period

(No Prescaler)

0.6

0.8

1.0

2.0

3.4

3.2

3.0

VDD = 2.5V

VDD = 3.3V, ±10%

VDD = 5V, ±10%

SY25 TBOR Brown-out Reset Pulse Width(3) 100 — — μsVDD ≤ VBOR (D034)

SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC ——TOSC = OSC1 period

SY35 TFSCM Fail- S af e C lo ck Mo ni to r De l a y — 500 900 μs -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

3: Refer to Figure 24-1 and Table 24-10 for BOR.

VBGAP

Enable

Band Gap

Stable

Note 1: Band gap is enabled when FBORPOR <7> is set.

SY40

Band Gap(1)

TABLE 24-21: BAND GAP START-UP TIME REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V (unless otherwise state d)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY40 TBGAP Band Gap

Start-up Time —4065μs Defined as th e ti me be tw e en t he in stant

that the band gap is enabled and the

moment that the band gap referen ce

voltage is stable (RCON<13> status bit)

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F4011/4012

FIGURE 24-7: TIMERx EXTERNAL CLOCK TIMING CHARACTERISTICS

Note: Refer to Figure 24-2 for load conditions.

Tx11

Tx15

Tx10

Tx20

TMRx OS60

TxCK

TABLE 24-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TA10 TTXH T1CK High

Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA11 TTXL T1CK Low

Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA15 TTXP T1CK Input

Period Synchronous,

no prescaler TCY + 10 — — ns

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

— — — N = prescale value

(1, 8, 64, 256)

Asynchronous 20 — — ns

OS60 Ft1 SOSCO/T1CK Oscillator

Input frequency Range

(oscillator enabled by setting

bit, TCS (T1CON<1>)

DC — 50 kHz

TA20 TCKEXTMRL Delay fro m External T1CK

Clock Edge to Timer

Increment

0.5 TCY —1.5 TCY —

dsPIC30F4011/4012

TABLE 24-23: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TB10 TTXH TxCK High Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB11 TTXL TxCK Low T ime Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB15 TTXP TxCK Input

Period Synchronous,

no prescaler TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TB20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY —1.5 TCY —

TABLE 24-24: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input Period Synchronous,

no prescaler TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TC20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY — 1.5 TCY —

dsPIC30F4011/4012

FIGURE 24-8: QEI MODULE EXTERNAL CLOCK TIMING CHARACTERISTICS

TQ11

TQ15

TQ10

TQ20

QEB

POSCNT

TABLE 24-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5 V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TQ10 TtQH T xCK High Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ11 TtQL TxCK Low Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ15 TtQP TxCK Input Period Synchronous,

with prescaler 2 * TCY + 40 — — ns

TQ20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY — 1.5 TCY ns

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

FIGURE 24-9: INPUT CAPTURE TIMING CHARACTERISTICS

ICX

IC10 IC11

IC15

Note: Refer to Figure 24-2 for load conditions.

TABLE 24-26: INPUT CAPTURE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard O pera ting Cond ition s: 2 .5V to 5.5 V (u nless ot herw ise sta ted )

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Time No prescaler 0.5 TCY + 20 — n s

With prescaler 10 — ns

IC11 TccH ICx Input High Time No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

IC15 TccP ICx Input Period (2 TCY + 40)/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

FIGURE 24-10: OUTPUT COMPARE MODULE TIMING CHARACTERISTICS

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 24-2 for load conditions.

or PWM Mode)

TABLE 24-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC10 TccF OCx Output Fall Time — — — ns See parameter DO32

OC11 TccR OCx Output Rise T ime — — — ns See parameter DO31

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

dsPIC30F4011/4012

FIGURE 24-11: OUTPUT COMPARE/PWM MODULE TIMING CHARACTERISTICS

OCFA

OCx

OC20

OC15

TABLE 24-28: SIMPLE OUTPUT COMPARE/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC15 TFD Fault Input to PWM I/O

Change ——50ns

OC20 TFLT Fault Input Pulse Width 50 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

dsPIC30F4011/4012

FIGURE 24-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS

FIGURE 24-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS

FLTA

PWMx

MP30

MP20

PWMx

MP11 MP10

Note: Refer to Figure 24-2 for load conditions.

TABLE 24-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated )

Operatin g te mperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

MP10 TFPWM PWM Output Fall Time — — — ns See parameter DO32

MP11 TRPWM PWM Output Rise

Time — — — ns See parameter DO31

MP20 TFD Fault Input ↓ to PWM

I/O Change — — 50 ns

MP30 TFH Minimum Pulse Width 50 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

dsPIC30F4011/4012

FIGURE 24-14: QEA/QEB INPUT CHARACTERISTICS

TQ30

TQ35

TQ31

QEA

(input)

TQ35

QEB

(input)

TQ36

QEB

Internal

TQ40TQ41

TQ30

TQ31

TABLE 24-30: QU ADR ATURE DECODER TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Typ(2) Max Units Conditions

TQ30 TQUL Quadrature Input Low Time 6 TCY —ns

TQ31 TQUH Quadrature Input High Time 6 TCY —ns

TQ35 TQUIN Quadrature Input Period 12 TCY —ns

TQ36 TQUP Quadrature Phase Period 3 TCY —ns

TQ40 TQUFL Filter T ime to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128

and 256 (Note 2)

TQ41 TQUFH Filter T ime to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128

and 256 (Note 2)

Note 1: These parameters are characterized but not tested in manufacturing.

2: N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 16. “Quadrature Encoder

Interface (QEI)” in the “dsPIC30F Fa mily Reference Manual” (DS70046).

dsPIC30F4011/4012

FIGURE 24-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS

QEA

(input)

Ungated

Index

QEB

(input)

TQ55

Index Internal

Position Counter

Reset

TQ50

TQ51

TABLE 24-31: QEI INDEX PULSE TIMING REQUIREMENTS

AC CHARACTERISTICS

Stand ard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

TQ50 TqIL Filter Time to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ51 TqiH Filter Time to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ55 Tqidxr Index Pulse Recognized to Position

Counter Reset (ungated index) 3 TCY —ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for

forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but

index pulse reco gn i ti on occurs on falling edge.

dsPIC30F4011/4012

FIGURE 24-16: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI1

SP11 SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

LSb In

Bit 14 - - - -1

SP30

SP31

Note: Refer to Figure 24-2 for load conditions.

MSb In

TABLE 24-32: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCK1 Output Low Time(3) TCY/2 — — ns

SP11 TscH SCK1 Output High Time(3) TCY/2 — — ns

SP20 TscF SCK1 Output Fall Time(4 — — — ns See parameter DO32

SP21 TscR SCK1 Output Rise Time(4) — — — ns See p arameter DO31

SP30 TdoF SDO1 Data Output Fall Time(4) — — — ns See p arameter DO32

SP31 TdoR SDO1 Data Output Rise

Time(4) — — — ns See parameter DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge ——30ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI1

SP36

SP30,SP31

SP35

MSb Bit 14 - - - - - -1

LSb In

Bit 14 - - - -1

LSb

Note: Refer to Figure 24-2 for load conditions.

SP11 SP10

SP21

SP20

SP41

SP20

SP21

MSb In

SP40

TABLE 24-33: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherw ise state d)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCK1 Output Low Time(3) TCY/2 — — ns

SP11 TscH SCK1 Output High Time(3) TCY/2 — — ns

SP20 TscF SCK1 Output Fall Time(4) — — — ns See parameter DO32

SP21 TscR SCK1 Output Rise Time(4) — — — ns See parameter DO31

SP30 TdoF SDO1 Data Output Fall

Time(4) — — — ns See parameter DO32

SP31 TdoR SDO1 Data Output Rise

Time(4) — — — ns See parameter DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge — — 30 ns

SP36 TdoV2sc,

TdoV2scL SDO1 Data Output Setup to

First SCK1 Edge 30 — — ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data

Input to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-18: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

SS1

SCK1

(CKP =

)

SCK1

(CKP =

)

SDO1

SDI

SP50

SP40 SP41

SP30,SP31 SP51

SP35

SDI1

MSb LSb

Bit 14 - - - - - -1

Bit 14 - - - -1 LSb In

SP52

SP73

SP72

SP73

SP71 SP70

Note: Refer to Figure 24-2 for load conditions.

MSb In

dsPIC30F4011/4012

TABLE 24-34: SPI MODULE SLAVE MODE (CKE = 0) T IMING REQUIREMENTS

AC CHARACTERISTICS

Stand ard Operat ing Cond itio ns: 2.5 V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCK1 Input Low Time 30 — — ns

SP71 TscH SCK1 Input High Time 30 — — ns

SP72 TscF SCK1 Input Fall T ime(3) —1025ns

SP73 TscR SCK1 Input Rise Tim e(3) —1025ns

SP30 TdoF SDO1 Data Output Fall Time(3) — — — ns See parameter

DO32

SP31 TdoR SDO1 Data Output Rise Time(3) — — — ns See para meter

DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge — — 30 ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP50 TssL2scH,

TssL2scL SS1↓ to SCK1↑ or SCK1↓ Input 120 — — ns

SP51 TssH2doZ SS1↑ to SDO1 Output

High-Impedance(3) 10 — 50 ns

SP52 TscH2ssH

TscL2ssH SS1 after SCK1 Edge 1.5 TCY + 40 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SS1

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI

SP60

SDI1

SP30,SP31

MSb Bit 14 - - - - - -1 LSb

SP51

Bit 14 - - - -1 LSb In

SP35

SP52

SP73

SP72

SP73

SP71 SP70

SP40

SP41

Note: Refer to Figure 24-2 for load conditions.

SP50

MSb In

dsPIC30F4011/4012

TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCK1 Input Low Time 30 — — ns

SP71 TscH SCK1 Input High Time 30 — — ns

SP72 TscF SCK1 Input Fall Time(3) —1025ns

SP73 TscR SCK1 Input Rise Time(3) —1025ns

SP30 TdoF SDO1 Data Output Fall Time(3) — — — ns See parameter DO32

SP31 TdoR SDO1 Data Output Rise Time(3) — — — ns See parameter DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge ——30ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP50 TssL2scH,

TssL2scL SS1↓ to SCK1↓ or SCK1↑ Input 120 — — ns

SP51 TssH2doZ SS1↑ to SDO1 Output

High-Impedance(4) 10 — 50 ns

SP52 TscH2ssH

TscL2ssH SS1↑ after SCK1 Edge 1.5 TCY + 40 — — ns

SP60 TssL2doV SDO1 Data Output Valid after

SS1 Edge ——50ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-20: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 24-21: I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM34

SCL

SDA

Start

Condition Stop

Condition

IM33

Note: Refer to Figure 24-2 for load cond itions.

IM31

IM30

IM11 IM10 IM33

IM11 IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCL

SDA

Out

Note: Refer to Figure 24-2 for load conditions.

dsPIC30F4011/4012

TABLE 24-36: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated )

Operatin g te mperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min(1) Max Units Conditions

IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM11 THI:SCL Clock High T ime 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 100 ns

IM21 TR:SCL SDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 300 ns

IM25 TSU:DAT Data Inpu t

Setup Time 100 kHz mode 250 — ns

400 kHz mode 100 — ns

1 MHz mode(2) — — ns

IM26 THD:DAT Data Inpu t

Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

1 MHz mode(2) — — ns

IM30 TSU:STA Start Conditio n

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs Only relevant for

Repeated Start

condition

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM31 THD:STA Start Condition

Hold Time 100 kHz mode TCY/2 (BRG + 1) — μs After this period, the

first clock pulse is

generated

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM33 TSU:STO Stop Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) — ns

Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns

1 MHz mode(2) TCY/2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock 100 kHz mode — 3500 ns

400 kHz mode — 1000 ns

1 MHz mode(2) ——ns

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — μs

1 MHz mode(2) ——μs

IM50 CBBus Capacitive Loading — 400 pF

Note 1: BRG is the value of the I2C Baud Rate Generator . Refer to Section 21. “Inter-Integrated Circuit (I2C™)”

in the “dsPIC30F Family Reference Manual” (DS70046).

2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

dsPIC30F4011/4012

FIGURE 24-22: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 24-23: I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

SCL

SDA

Start

Condition Stop

Condition

IS31

IS30

IS34

IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCL

SDA

Out

dsPIC30F4011/4012

TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Stand a rd Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extende d

Param

No. Symbol Characteristic Min Max Units Conditions

IS10 TLO:SCL Clock Low T ime 100 kHz mode 4.7 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — μs Device must operate at a

minimum of 10 MHz.

1 MHz mode(1) 0.5 — μs

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — μs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — μs

IS20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) —100ns

IS21 TR:SCL SDA and SCL

Rise T i me 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) —300ns

IS25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

1 MHz mode(1) 00.3μs

IS30 TSU:STA Start Condition

Setup Time 100 kHz mode 4.7 — μs O nly relevant for Repeated

Start condition

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS31 THD:STA Start Condition

Hold Time 100 kHz mode 4.0 — μs After this period, the first

clock pulse is generated

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS33 TSU:STO Stop Condition

Setup Time 100 kHz mode 4.7 — μs

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.6 — μs

IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns

Hold Time 400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid

From Clock 100 kHz mode 0 3500 ns

400 kHz mode 0 1000 ns

1 MHz mode(1) 0350ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — μs

1 MHz mode(1) 0.5 — μs

IS50 CBBus Capacitive Loading — 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

dsPIC30F4011/4012

FIGURE 24-24: CAN MODULE I/O TIMING CHARACTERISTICS

C1TX Pin

(output)

CA10 CA11

Old Value New Value

CA20

C1RX Pin

(input)

TABLE 24-38: CAN MODULE I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C

≤

+85°C for Industrial

-40

≤

+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CA10 TioF Port Output Fall Time — — — ns See parameter DO32

CA11 TioR Port Output Rise Time — — — ns See parameter DO31

CA20 Tcwf Pulse Width to Trigger

CAN Wake-up Filter 500 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

dsPIC30F4011/4012

TABLE 24-39: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply Greater of

VDD – 0.3

or 2.7

— Lesser of

VDD + 0.3

or 5.5

AD02 AVSS Module VSS Supply VSS – 0.3 — VSS + 0.3 V

Reference Inputs

AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V

AD06 VREFL Reference Voltage Low AVSS —AVDD – 2.7 V

AD07 VREF Absolute Reference V oltage AVSS – 0.3 — AVDD + 0.3 V

AD08 IREF Current Drain — 200

.001 300

3μA

μAA/D operating

A/D off

Analog Input

AD10 VINH-VINL Full - Sca l e In pu t Span VREFL —VREFH V

AD11 VIN Absolute Input Voltage AVSS – 0.3 — AVDD + 0.3 V

AD12 — Leakage Current — ±0.001 ±0.244 μAV

INL = AVSS = VREFL = 0V,

AVDD = V REFH = 5V,

Source Impedance = 5 kΩ

AD13 — Leakage Current — ±0.001 ±0.244 μAV

INL = AVSS = VREFL = 0V,

AVDD = V REFH = 3V,

Source Impedance = 5 kΩ

AD17 RIN Recommended Impedance

of Analog Voltage Source ——5KΩ

DC Accuracy

AD20 Nr Resolution 10 data bits bits

AD21 INL I ntegral Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = V REFH = 5V

AD21A INL Integral No nlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = V REFH = 3V

AD22 DNL Differential Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = V REFH = 5V

AD22A DNL Differential Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = V REFH = 3V

AD23 GERR Gain Error(3) ±1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V,

AVDD = V REFH = 5V

AD23A GERR Gain Error(3) ±1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V,

AVDD = V REFH = 3V

AD24 EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V,

AVDD = V REFH = 5V

AD24A EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V,

AVDD = V REFH = 3V

AD25 — Monotonicity(2) — — — — Guaranteed

Note 1: Because the sample caps will eventual ly lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreases with an incre ase in the input vol t age an d has no missing codes.

3: Measuremen ts ta ke n w ith external VREF+ and VREF- used as the ADC voltage references.

dsPIC30F4011/4012

Dynamic Performance

AD30 THD Total Harmonic Distortion — -64 -67 dB

AD31 SINAD Signal to Noise and

Distortion —5758dB

AD32 SFDR Spurious Free Dynamic

Range —6771dB

AD33 FNYQ Input Signal Bandwidth — — 500 kHz

AD34 ENOB Effective Number of Bits 9.29 9.41 — bits

TABLE 24-39: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Note 1: Because the sample caps will eventual ly lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreases with an in cre ase in the inp ut voltage and has no missing codes.

3: Measuremen ts ta ke n w ith external VREF+ and VREF- used as the ADC voltage references.

dsPIC30F4011/4012

FIGURE 24-25: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

TSAMP

Set SAMP

AD61

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

AD60

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 9 5 6 8

1- Software sets ADCONx. SAMP to start sampling.

2- Sampling starts after discharge period.

3- Software clears ADCONx. SAMP to start conversion.

4- Sampling ends, conversion sequence starts.

5- Convert bit 9.

9- One TAD for end of conversion.

AD50

ch0_samp

ch1_dischrg

eoc

8 9

6- Convert bit 8.

8- Convert bit 0.

Execution

TSAMP is described in Section 17. 10-Bit A/D Converter” in the “dsPIC30F Family Reference Manual” (DS70046).

Clear SAMP

AD55 AD55

dsPIC30F4011/4012

FIGURE 24-26: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)

AD55

TSAMP

Set ADON

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 4 5 6 8

1- Software sets ADCONx. ADON to start AD operation.

2- Sampling starts after discharge period.

3- Convert bit 9.

4- Convert bit 8.

5- Convert bit 0.

AD50

ch0_samp

ch1_dischrg

eoc

7 3

AD55

6- One TAD for end of conversion.

7- Begin conversion of next channel

8- Sample for time specified by SAMC<4:0>.

TSAMP

3 4

Execution

TSAMP is described in Section 17. 10-Bit A/D Converter”

in the “dsPIC30F Family Reference Manual” (DS70046).

TCONV

dsPIC30F4011/4012

TABLE 24-40: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature - 40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD A/D Clock Period — 84 — ns See Table 20-2(1)

AD51 tRC A/D Internal RC Oscillator Period 700 900 1100 ns

Conversion Rate

AD55 tCONV Conversion Time — 12 TAD ——

AD56 FCNV Throughput Rate — 1.0 — Msps See Table 20-2(1)

AD57 TSAMP Samp le Time — 1 TAD — — See Table 20-2(1)

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger — 1.0 TAD ——

AD61 tPSS Sample Start from Setting

Sample (SAMP) Bit 0.5 TAD — 1.5 TAD —

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)— 0.5 TAD ——

AD63 tDPU(2) Time to Stabilize Analog Stage

from A/D Off to A/D On ——20μs

Note 1: Because the sample caps will eventual ly lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: tDPU is the time required for the ADC module to stabilize when it is turned on (ADCON1<ADON> = 1). Dur-

ing this time the ADC result is indeterminate.

dsPIC30F4011/4012

25.0 PACKAGING INFORMATION

25.1 Package Marking Information

28-Lead PDIP (Skinny DIP)

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC30F4012-

0710017

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC30F4012-

0710017

30I/SP

30I/SO

Example

dsPIC30F4011-

0710017

40-Lead PDIP

XXXXXXXXXXXXXXXXXX

YYWWNNN

30I/P

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digi ts of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

dsPIC30F4011/4012

Package Marking Information (Continued)

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

dsPIC30F

0710017

4011-30I/

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

dsPIC30F

Example

0710017

4012-30I/

dsPIC30F4011/4012

25.2 Package Details

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e .100 BSC

Top to Seating Plane A – – .200

Molded Package Thickness A2 .120 .135 .150

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .335

Molded Package Width E1 .240 .285 .295

Overall Length D 1.345 1.365 1.400

Tip to Seating Plane L .110 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .040 .050 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – .430

NOTE 1

Microchip Technology Drawing C04-070B

dsPIC30F4011/4012

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e 1.27 BSC

Overall Height A – – 2.65

Molded Package Thickness A2 2.05 – –

Standoff § A1 0.10 – 0.30

Overall Width E 10.30 BSC

Molded Package Width E1 7.50 BSC

Overall Length D 17.90 BSC

Chamfer (optional) h 0.25 – 0.75

Foot Length L 0.40 – 1.27

Footprint L1 1.40 REF

Foot Angle Top φ0° – 8°

Lead Thickness c 0.18 – 0.33

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

Microchip Technology Drawing C04-052B

dsPIC30F4011/4012

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 40

Pitch e .100 BSC

Top to Seating Plane A – – .250

Molded Package Thickness A2 .125 – .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .590 – .625

Molded Package Width E1 .485 – .580

Overall Length D 1.980 – 2.095

Tip to Seating Plane L .115 – .200

Lead Thickness c .008 – .015

Upper Lead Width b1 .030 – .070

Lower Lead Width b .014 – .023

Overall Row Spacing § eB – – .700

NOTE 1

123

A1 b1

Microchip Technology Drawing C04-016B

dsPIC30F4011/4012

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 44

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 8.00 BSC

Exposed Pad Width E2 6.30 6.45 6.80

Overall Length D 8.00 BSC

Exposed Pad Length D2 6.30 6.45 6.80

Contact Width b 0.25 0.30 0.38

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3 A1

Microchip Technology Drawing C04-103B

dsPIC30F4011/4012

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Chamfers at corners are optional; size may vary.

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Leads N 44

Lead Pitch e 0.80 BSC

Overall Height A – – 1.20

Molded Package Thickness A2 0.95 1.00 1.05

Standoff A1 0.05 – 0.15

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ0° 3.5° 7°

Overall Width E 12.00 BSC

Overall Length D 12.00 BSC

Molded Package Width E1 10.00 BSC

Molded Package Length D1 10.00 BSC

Lead Thickness c 0.09 – 0.20

Lead Width b 0.30 0.37 0.45

Mold Draft Angle Top α11° 12° 13°

Mold Draft Angle Bottom β11° 12° 13°

NOTE 1NOTE 2

123

Microchip Technology Drawing C04-076B

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

APPENDIX A: REVISION HISTORY

Revision D (August 2006)

Previous versions of this data sheet contained

Advance or Preliminary Information. They were

distributed with incomplete characterization data.

This revision reflects these changes:

•Revised I

2C Slave Addresses

(see Table 17-1)

• Updated Section 20.0 “10-bit, High-Speed

Analog-to-Digital Converter (ADC) Module” to

more fully describe configuration guideli nes

• Base Instruction CP1 removed from instruction

set (see Table 22-2)

• Revised Electrical Characteristics:

- Operating Current (IDD) S pecifications

(seeTable 24-5)

- Idle Current (IIDLE) Specifications

(see Table 24-6)

- Power-Down Current (IPD) S pecifications

(see Table 24-7)

- I/O Pin Input Specificat ions

(see Table 24-8)

- BOR Voltage Limits

(see Table 24-11)

- Watchdog Timer Time-out Limits

(see Table 24-21)

Revision E (January 2007)

- This revision includes updates to the

packaging diagrams.

Revision F (March 2008)

This revision reflects these updates:

• Added Note 1 to 32-bit Timer4/5 Block Diagram

(see Figure 11-1) and 16-b it Timer4/5 Block

Diagram (see Figure 11-2)

• Changed the location of the input reference in the

10-bit High-Speed ADC Functional Block Diagram

(see Figure 20-1)

• Added FUSE Configuration Register (FICD)

details (see Section 21.6 “Device Configuration

Registers” and Table 21-8)

• Removed erroneous statement regarding genera-

tion of CAN receive errors (see Section 19.4.5

“Receive Errors”)

• Electrica l Specificat io ns:

- Resolved TBD values for parameters DO10,

DO16, DO20, and DO26 (see Table 24-9)

- 10-bit High-Speed ADC tPDU timing parame-

ter (time to stabilize) has been updated from

20 µs typical to 20 µs maximum (see

Table 24-40)

- Parameter OS65 (Internal RC Accuracy) has

been expanded to reflect multiple Min and

Max values for different temperatures (see

Table 24-18)

- Parameter DC12 (RAM Data Retention Volt-

age) has been updated to include a Min value

(see Table 24-4)

- Parameter D134 (Erase/Write Cycle Time)

has been updated to include Min and Max

values and the Typ value has been removed

(see Table 24-11)

- Removed parameters OS62 (Internal FRC

Jitter) and OS64 (Internal FRC Drift) and

Note 2 from AC Characteristics (see

Table 24-17)

- Parameter OS63 (Internal FRC Accuracy)

has been expanded to reflect multiple Min

and Max values for different temperatures

(see Table 24-17)

- Updated Min and Max values and Conditions

for parameter SY11 and updated Min, Typ,

and Max values and Conditions for parame-

ter SY20 (see Table 24-20)

• Corrected erroneous device number (see

“Product Identification System”)

• Additional minor corrections throughout the

document

dsPIC30F4011/4012

Revision G (December 2010)

This revision includes minor typographical and

formatting changes throughout the data sheet text.

The major chang es are referenced by their respective

section in Table A-1.

TABLE A-1: MAJOR SECTION UPDATES

Section Name Update Description

“High-Performance, 16-Bit

Digital Signal Controllers”Added Note 1 to all QFN pin diagrams (see “Pin Diagrams”).

Section 15.0 “Motor Control

PWM Module” Added the IUE bit (PWMCON2<2>) to the PWM Register Map (see Table 15-1).

Updated the PWM Period equations (see Equation 15-1 and Equation 15-2).

Section 21.0 “System

Integration” Added a shaded note on OSCTUN functionality in Section 21.2.5 “Fast RC

Oscillator (FRC)”.

Section 24.0 “Electrical

Characteristics” Updated the maximum value for parameter DI19 and the minimum value for

parameter DI29 in the I/O Pin Input Specifications (see Table 24-8).

Removed parameter D136 and updated the minimum, typical, maximum, and

conditions for parameters D122 and D134 in the Program and EEPROM

specifications (see Table 24-11).

“Product Identification System”Added the “ML” package definition.

dsPIC30F4011/4012

INDEX

Numerics

10-Bit, High-Speed Analog-to-Digital Converter (ADC) Mod-

ule.............................................................................137

16-bit Up/Down Position Counter Mode..............................90

Count Direction Status................................................90

Counter Reset.............................................................90

Error Checking............................................................90

AC Characteristics ............................................................184

Load Conditions........................................................184

Temperature and Voltage Specifications..................184

ADC1 Msps Configuration Guideline................................142

600 ksps Configuration Guideline.............................143

750 ksps Configuration Guideline.............................143

Aborting a Conversion ..............................................140

Acquisition Requirements.........................................144

ADCHS .....................................................................137

ADCON1...................................................................137

ADCON2...................................................................137

ADCON3...................................................................137

ADCSSL....................................................................137

ADPCFG...................................................................137

Configuring Analog Port Pins....................................146

Connection Considerations.......................................146

Conversion Operation...............................................139

Conversion Rate Parameters....................................141

Conversion Speeds...................................................141

Effects of a Reset......................................................145

Operation During CPU Idle Mode.............................145

Operation During CPU Sleep Mode..........................145

Output Formats.........................................................145

Power-Down Modes....................... ..................... ......145

Programming the Start of Conversion Trigger ..........140

Result Buffer............. ..................... ..................... ......139

Selecting the Conversion Clock................................140

Selecting the Conversion Sequence.........................139

Voltage Reference Schematic ..................................142

Address Generator Units ....................................................37

Alternate 16-bit Timer/Counter............................................91

Alternate Interrupt Vector Table..........................................47

Assembler

MPASM Assembler............................................. ......172

Barrel Shifter.......................................................................24

Bit-Reversed Addressing ....................................................40

Example......................................................................40

Implementation ...........................................................40

Modifier Values (table)................................................41

Sequence Table (16-Entry).........................................41

Block Diagrams

10-Bit, High-Speed ADC...........................................138

16-bit Timer1 Module..................................................66

16-bit Timer4...............................................................76

16-bit Timer5...............................................................76

32-bit Timer4/5............................................................75

ADC Analog Input Model ..........................................144

CAN Buffers and Protocol Engine.............................128

Dedicated Port Structure.............................................59

DSP Engine ................................................................21

dsPIC30F4011............................................................ 10

dsPIC30F4012............................................................ 11

External Power-on Reset Circuit .............................. 157

I2C ............................................................................ 112

Input Capture Mode.................................................... 79

Oscillator System...................................................... 151

Output Compare Mode............................................... 83

PWM Module.............................................................. 96

Quadrature Encoder Interface.................................... 89

Reset System........................................................... 155

Shared Port Structure................................................. 60

SPI............................................................................ 108

SPI Master/Slave Connection................................... 108

UART Receiver......................................................... 120

UART Transmitter..................................................... 119

BOR. See Brown-out Reset.

Brown-out Reset

Characteristics.......................................................... 182

C Compilers

MPLAB C18.............................................................. 172

CAN Module ..................................................................... 127

Baud Rate Setting .................................................... 132

CAN1 Register Map.................................................. 134

Frame Types ............................................................ 127

Message Reception.................................................. 130

Message Transmission............................................. 131

Modes of Operation.................................................. 129

Overview................................................................... 127

Center-Aligned PWM.......................................................... 99

Code Examples

Data EEPROM Block Erase....................................... 56

Data EEPROM Block Write........................................ 58

Data EEPROM Read.................................................. 55

Data EEPROM Word Erase ....................................... 56

Data EEPROM Word Write ........................................ 57

Erasing a Row of Program Memory ........................... 51

Initiating a Programming Sequence ........................... 52

Loading Write Latches................................................ 52

Port Write/Read.......................................................... 60

Code Protection................................................................ 149

Complementary PWM Operation...................................... 100

Configuring Analog Port Pins.............................................. 60

Core Overview.................................................................... 17

Core Register Map.............................................................. 34

Customer Change Notification Service............................. 235

Customer Notification Service .......................................... 235

Customer Support............................................................. 235

Data Access from Program Memory

Using Program Space Visibility .................................. 28

Data Accumulators and Adder/Subtracter.......................... 22

Data Space Write Saturation...................................... 24

Overflow and Saturation............................................. 22

Round Logic ............................................................... 23

Write-Back.................................................................. 23

Data Address Space........................................................... 29

Alignment.................................................................... 32

Alignment (Figure)...................................................... 32

Data Spaces............................................................... 32

Effect of Invalid Memory Accesses............................. 32

MCU and DSP (MAC Class) Instructions Example.... 31

dsPIC30F4011/4012

Memory Map...............................................................30

Near Data Space ........................................................33

Software Stack............................................................33

Width...........................................................................32

Data EEPROM Memory......................................................55

Erasing........................................................................56

Erasing, Block.............................................................56

Erasing, Word .............................................................56

Protection Against Spurious Write ..............................58

Reading.......................................................................55

Write Verify .................................................................58

Writing.........................................................................57

Writing, Block..............................................................58

Writing, Word ..............................................................57

DC Characteristics............................................................176

BOR ..........................................................................183

I/O Pin Input Specifications.......................................181

I/O Pin Output Specifications....................................182

Idle Current (IIDLE) ....................................................179

Operating Current (IDD).............................................178

Power-Down Current (IPD)........................................180

Program and EEPROM.............................................183

DC Temperature and Voltage Specifications....................177

Dead-Time Generators .....................................................100

Ranges......................................................................101

Development Support .......................................................171

Device Configuration

Device Configuration Registers.........................................160

FBORPOR................................................................160

FGS...........................................................................160

FOSC........................................................................160

FWDT........................................................................160

Divide Support.....................................................................20

DSP Engine.........................................................................20

Multiplier......................................................................22

dsPIC30F4011 Port Register Map......................................61

dsPIC30F4012 Port Register Map......................................62

Dual Output Compare Match Mode ....................................84

Continuous Output Pulse Mode..................................84

Single Output Pulse Mode ..........................................84

Edge-Aligned PWM.............................................................99

Electrical Characteristics...................................................175

Equations

A/D Conversion Clock...............................................140

Baud Rate.................................................................123

I2CBRG Value ..........................................................116

PWM Period................................................................98

PWM Period (Center-Aligned Mode) ..........................98

PWM Resolution .........................................................98

Time Quantum for Clock Generation ........................133

Errata ....................................................................................8

External Interrupt Requests ................................................47

Fast Context Saving............................................................47

Flash Program Memory.......................................................49

In-Circuit Serial Programming (ICSP).........................49

Run-Time Self-Programming (RTSP) .........................49

Table Instruction Operation Summary ........................49

I/O Ports

Parallel I/O (PIO) ........................................................ 59

I2C Module

10-bit Slave Mode Operation.................................... 113

Reception ......................................................... 114

Transmission.................................................... 114

7-bit Slave Mode Operation...................................... 113

Reception ......................................................... 113

Transmission.................................................... 113

Addresses................................................................. 113

Automatic Clock Stretch ........................................... 114

During 10-bit Addressing (STREN = 1) ............ 114

During 7-bit Addressing (STREN = 1) .............. 114

Reception ......................................................... 114

Transmission.................................................... 114

General Call Address Support.................................. 115

Interrupts .................................................................. 115

IPMI Support............................................................. 115

Master Operation...................................................... 115

Baud Rate Generator (BRG) ............................ 116

Clock Operation................................................ 116

Multi-Master Communication,

Bus Collision and Arbitration .................... 116

Reception ......................................................... 116

Transmission.................................................... 115

Master Support......................................................... 115

Operating Function Description................................ 111

Operation During CPU Sleep and Idle Modes.......... 116

Pin Configuration...................................................... 111

Programmer’s Model ................................................ 111

Registers .................................................................. 111

Slope Control............................................................ 115

Software Controlled Clock Stretching (STREN = 1) . 114

Various Modes.......................................................... 111

In-Circuit Serial Programming (ICSP)............................... 149

Independent PWM Output................................................ 102

Initialization Condition for RCON Register, Case 1 .......... 158

Initialization Condition for RCON Register, Case 2 .......... 158

Input Capture Module......................................................... 79

In CPU Idle Mode ....................................................... 80

In CPU Sleep Mode.................................................... 80

Interrupts .................................................................... 81

Simple Capture Event Mode....................................... 80

Input Change Notification Module....................................... 63

Input Diagrams

QEA/QEB Input ........................................................ 199

Instruction Addressing Modes ................................... ......... 37

File Register Instructions............................................ 37

Fundamental Modes Supported ................................. 37

MAC Instructions ........................................................ 38

MCU Instructions........................................................ 37

Move and Accumulator Instructions............................ 38

Other Instructions ....................................................... 38

Instruction Set Summary ........................................... ....... 163

Internal Clock Timing Examples....................................... 187

Internet Address ........................................................ ....... 235

Interrupt Controller

Interrupt Priority.................................................................. 44

Interrupt Sequence............................................................. 47

Interrupt Stack Frame................................................. 47

dsPIC30F4011/4012

Microchip Internet Web Site..............................................235

Modulo Addressing .............................................................38

Applicability.................................................................40

Operation Example.....................................................39

Start and End Address................................................39

W Address Register Selection....................................39

Motor Control PWM Module................................................95

MPLAB ASM30 Assembler, Linker, Librarian ...................172

MPLAB Integrated Development Environment Software..171

MPLAB PM3 Device Programmer ....................................174

MPLAB REAL ICE In-Circuit Emulator System.................173

MPLINK Object Linker/MPLIB Object Librarian ................172

Operating MIPS vs. Voltage..............................................176

Oscillator

Configurations...........................................................152

Fail-Safe Clock Monitor ....................................154

Fast RC (FRC)..................................................153

Initial Clock Source Selection ...........................152

Low-Power RC (LPRC).....................................153

LP .....................................................................153

Phase Locked Loop (PLL) .......................... ......153

Start-up Timer (OST)........................................152

Operating Modes (Table)..........................................150

Oscillator Selection ...........................................................149

Output Compare Module.....................................................83

During CPU Idle Mode................................................86

During CPU Sleep Mode.............................................86

Interrupts.....................................................................86

Packaging.........................................................................219

Details.......................................................................221

Marking.....................................................................219

Pinout Descriptions

dsPIC30F4011............................................................12

dsPIC30F4012............................................................14

POR. See Power-on Reset.

Position Measurement Mode ..............................................91

Power-Saving Modes........................................................159

Idle............................................................................160

Sleep.........................................................................159

Power-Saving Modes (Sleep and Idle) .............................149

Program Address Space.....................................................25

Construction................................................................26

Data Access From Program Memory Using Table In-

structions ............................................................27

Data Access From, Address Generation ....................26

Memory Map...............................................................25

Table Instructions

TBLRDH .............................................................27

TBLRDL..............................................................27

TBLWTH.............................................................27

TBLWTL..............................................................27

Program Counter ................................................................18

Program Data Table Access (lsw) ......................................27

Program Data Table Access (MSB)....................................28

Program Space Visibility

Window into Program Space Operatio n......................29

Programmable Digital Noise Filters ....................................91

Programmer’s Model......... ..................................................18

Diagram...................................................................... 19

Programming Operations.................................................... 51

Algorithm for Program Flash....................................... 51

Erasing a Row of Program Memory ........................... 51

Initiating the Programming Sequence ........................ 52

Loading Write Latches................................................ 52

Protection Against Accidental Writes to OSCCON........... 154

PWM Duty Cycle Comparison Units................................. 100

Duty Cycle Register Buffers ..................................... 100

PWM Fault Pin.................................................................. 103

Enable Bits ............................................................... 103

Fault States .............................................................. 103

Input Modes.............................................................. 103

Cycle-by-Cycle ................................................. 103

Latched............................................................. 103

PWM Operation During CPU Idle Mode........................... 104

PWM Operation During CPU Sleep Mode........................ 104

PWM Output and Polarity Control..................................... 103

Output Pin Control.................................................... 103

PWM Output Override ...................................................... 102

Complementary Output Mode .................................. 102

Synchronization........................................................ 102

PWM Period........................................................................ 98

PWM Special Event Trigger.............................................. 104

Postscaler................................................................. 104

PWM Time Base................................................................. 97

Continuous Up/Down Count Modes ........................... 97

Double Update Mode.................................................. 98

Free-Running Mode.................................................... 97

Postscaler................................................................... 98

Prescaler .................................................................... 98

Single-Shot Mode....................................................... 97

PWM Update Lockout....................................................... 104

QEI Module

Operation During CPU Sleep Mode ........................... 91

Timer Operation During CPU Sleep Mode ................. 91

Quadrature Encoder Interface (QEI)................................... 89

Interrupts .................................................................... 92

Logic........................................................................... 90

Operation During CPU Idle Mode............................... 92

Timer Operation During CPU Idle Mode..................... 92

Reader Response............................................................. 236

Reset ........................................................................ 149, 155

BOR, Programmable................................................ 157

Oscillator Start-up Timer (OST)................................ 149

POR.......................................................................... 155

Long Crystal Start-up Time............................... 157

Operating Without FSCM and PWRT............... 157

Power-on Reset (POR)............................................. 149

Power-up Timer (PWRT).......................................... 149

Programmable Brown-out Reset (BOR)................... 149

Reset Sequence................................................................. 45

Reset Sources............................................................ 45

Revision History................................................................ 227

RTSP

Control Registers........................................................ 50

NVMADR............................................................ 50

NVMADRU ......................................................... 50

NVMCON............................................................ 50

NVMKEY ............................................................ 50

Operation.................................................................... 50

dsPIC30F4011/4012

Simple Capture Event Mode

Capture Buffer Operation............................................80

Capture Prescaler.......................................................80

Hall Sensor Mode .......................................................80

Timer2 and Timer3 Selection Mode............................80

Simple Output Compare Match Mode.................................84

Simple PWM Mode .............................................................84

Input Pin Fault Protection............................................84

Period..........................................................................85

Single Pulse PWM Operation............................................102

Software Simulator (MPLAB SIM).....................................173

Software Stack Pointer, Frame Pointer...............................18

CALL Stack Frame......................................................33

SPI Module........................................................................107

Framed SPI Support .................................................108

Operating Function Description ................................107

Operation During CPU Idle Mode .............................109

Operation During CPU Sleep Mode..........................109

SDO1 Disable ...........................................................107

Slave Select Synchronization ...................................109

Word and Byte Communication ............. ...................107

STATUS Register................................................................18

System Integration

Overview...................................................................149

Thermal Operating Conditions.. ..................... ...................176

Thermal Packaging Characteristics ..................................176

Timer1 Module

16-bit Asynchronous Counter Mode ...........................65

16-bit Synchronous Counter Mode .............................65

16-bit Timer Mode.......................................................65

Gate Operation ...........................................................66

Interrupt.......................................................................67

Operation During Sleep Mode ....................................66

Prescaler.....................................................................66

Real-Time Clock .........................................................67

RTC Interrupts ....................................................67

RTC Oscillator Operation....................................67

Timer2 and Timer3 Selection Mode....................................84

Timer2/3 Module

16-bit Timer Mode.......................................................69

32-bit Synchronous Counter Mode .............................69

32-bit Timer Mode.......................................................69

ADC Event Trigger......................................................72

Gate Operation ...........................................................72

Interrupt.......................................................................72

Operation During Sleep Mode ....................................72

Timer Prescaler...........................................................72

Timer4/5 Module.................................................................75

Timing Diagram

A/D Conversion

10-Bit High-Speed (CHPS<1:0> = 01, SIMSAM = 0,

ASAM = 1, SSRC<2:0> = 111,

SAMC<4:0> = 00001)...............................216

I2C Bus Data (Slave Mode).......................................209

Timing Diagrams

A/D Conversion

10-Bit High-Speed (CHPS<1:0> = 01, SIMSAM = 0,

ASAM = 0, SSRC<2:0> = 000).................215

Band Gap Start-up Time........................................... 191

CAN Bit..................................................................... 132

CAN Module I/O........................................................ 211

Center-Aligned PWM.................................................. 99

CLKO and I/O........................................................... 189

Dead-Time Timing.................................................... 101

Edge-Aligned PWM .................................................... 99

External Clock........................................................... 184

I2C Bus Data (Master Mode) .................................... 207

I2C Bus Start/Stop Bits (Master Mode)..................... 207

I2C Bus Start/Stop Bits (Slave Mode)....................... 209

Input Capture............................................................ 195

Motor Control PWM.................................................. 198

Motor Control PWM Module Fault ............................ 198

Output Compare....................................................... 196

Output Compare/PWM ............................................. 197

PWM Output............................................................... 85

QEI Module External Clock....................................... 194

QEI Module Index Pulse........................................... 200

Reset, Watchdog Timer, Oscillator Start-up Timer

and Power-up Timer......................................... 190

SPI Master Mode (CKE = 0)..................................... 201

SPI Master Mode (CKE = 1)..................................... 202

SPI Slave Mode (CKE = 0)....................................... 203

SPI Slave Mode (CKE = 1)....................................... 205

Time-out Sequence on Power-up

(MCLR Not Tied to VDD), Case 1 ..................... 156

Time-out Sequence on Power-up

(MCLR Not Tied to VDD), Case 2 ..................... 156

Time-out Sequence on Power-up

(MCLR Tied to VDD) ......................................... 156

Timerx External Clock............................................... 192

Timing Requirements

A/D Conversion

10-Bit High-Speed............................................ 217

Band Gap Start-up Time........................................... 191

CAN Module I/O........................................................ 211

CLKO and I/O........................................................... 189

External Clock........................................................... 185

I2C Bus Data (Master Mode) .................................... 208

I2C Bus Data (Slave Mode) ...................................... 210

Input Capture............................................................ 195

Motor Control PWM.................................................. 198

Output Compare....................................................... 196

QEI Module External Clock....................................... 194

QEI Module Index Pulse........................................... 200

Quadrature Decoder................................................. 199

Reset, Watchdog Timer, Oscillator Start-up Timer

and Power-up Timer......................................... 191

Simple Output Compare/PWM Mode ....................... 197

SPI Master Mode (CKE = 0)..................................... 201

SPI Master Mode (CKE = 1)..................................... 202

SPI Slave Mode (CKE = 0)....................................... 204

SPI Slave Mode (CKE = 1)....................................... 206

Timer1 External Clock .............................................. 192

Timer2 and Timer4 External Clock........................... 193

Timer3 and Timer5 External Clock........................... 193

Timing Specifications

PLL Clock ................................................................. 186

PLL Jitter ........................................................... ....... 186

Trap Vectors....................................................................... 46

Traps................................................................................... 45

Hard and Soft ............................................................. 46

Trap Sources.............................................................. 45

dsPIC30F4011/4012

UART

Address Detect Mode ...............................................123

Alternate I/O..............................................................121

Auto-Baud Support ...................................................124

Baud Rate Generator................................................123

Disabling...................................................................121

Enabling and Setting Up...........................................121

Loopback Mode ........................................................123

Module Overview......................................................119

Operation During CPU Sleep and Idle Modes ..........124

Receiving Data..........................................................122

In 8-bit or 9-bit Data Mode................................122

Interrupt ............................................................122

Receive Buffer (UxRCB)...................................122

Reception Error Handling..........................................122

Framing Error (FERR) ......................................123

Idle Status.........................................................123

Parity Error (PERR) ..........................................123

Receive Break ..................................................123

Receive Buffer Overrun Error (OERR Bit) ........122

Setting Up Data, Parity and Stop Bit Selections .......121

Transmitting Data......................................................121

Break ................................................................122

In 8-bit Data Mode ............................................121

In 9-bit Data Mode ............................................121

Interrupt ............................................................122

Transmit Buffer (UxTXB) ..................................121

UART1 Register Map................................................125

UART2 Register Map................................................125

Unit ID Locations...............................................................149

Universal Asynchronous Receiver

Transmitter Module (UART)......................................119

Wake-up from Sleep .........................................................149

Wake-up from Sleep and Idle .............................................47

Watchdog Timer (WDT)............................................149, 159

Enabling and Disabling.............................................159

Operation..................................................................159

WWW Address..................................................................235

WWW, On-Line Support .......................................................8

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets a nd errata,

application notes and sample programs, design

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dsPIC30F4011/4012

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DS70135GdsPIC30F4011/4012

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dsPIC30F4011/4012

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dsPIC30F4011AT-30I/PF-000

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dsPIC30F4011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A

Trademark

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08/04/10