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IS7000
ISOCOM
COMPONENTS
DESCRIPTION
The IS7000 is an optically coupled isolator
consisting of an infrared light emitting diode and
a high voltage NPN silicon photo darlington which
has an integral base-emitter resistor to optimise
switching speed and elevated temperature
characteristics in a standard 4 pin dual in line
plastic package.
FEATURES
• AC Isolation Voltage 5000VRMS
• High Current Transfer Ratio 1000% minimum
• Wide Operating Temperature Range
–30°C to +100°C
• Lead Free and RoHS Compliant
• UL File No. E91231 Package Code “SS”
• VDE Approval Certificate No. 40028086
APPLICATIONS
• Modems
• Fax and Copying Machines
• Numerical Control Machines
• Signal Transmission between Systems of
Different Potentials and Impedance
ORDER INFORMATION
• Add X after PN for VDE Approval
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1UD, United Kingdom
Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail: sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office,
Block A, 8/F, Wah Hing Industrial mansion,
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
Tel: +852 2995 9217 Fax : +852 8161 6292
e-mail sales@isocom.com.hk
ABSOLUTE MAXIMUM RATINGS
Input Diode
Forward Current 50mA
Reverse Voltage 6V
Power Dissipation 70mW
Output Transistor
Collector to Emitter Voltage BVCEO 300V
Collector to Emitter Voltage BVECO 0.1V
Collector Current 150mA
Power Dissipation 150mW
Total Package
Operating Temperature -30 to +100 °C
Storage Temperature -55 to +125 °C
Total Power Dissipation 200mW
Lead Soldering Temperature 260°C
(for 10s)
1
3
2
4
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IS7000
ISOCOM
COMPONENTS
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
OUTPUT
COUPLED
Note 1 : Measure with input leads shorted together and output leads shorted together.
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 10mA 1.2 1.4 V
Reverse Leakage Cur-
rent
IR V
R = 4V 10 µA
Terminal Capacitance Ct V = 0V, f = 1KHz 30 250 pF
Parameter Symbol Test Condition Min Max Unit
Collector-Emitter Break-
down Voltage
BVCEO IC = 0.1mA, IF = 0mA 300 V
Emitter-Collector Break-
down Voltage
BVECO I
E = 0.01mA, IF = 0mA 0.1 V
Collector-Emitter Dark
Current
ICEO V
CE = 200V, IF = 0mA 200 nA
Typ.
Parameter Symbol Test Condition Min Typ. Max Unit
Current transfer ratio CTR IF = 1mA, VCE = 2V 1000 4000 %
Collector—Emitter Satu-
ration Voltage (1)
VCE(sat) I
F = 20mA, IC = 100mA
1.2
V
Input to Output Iso-
lation Voltage
VISO See Note 1 5000 VRMS
Input to Output Iso-
lation Resistance
RISO V
IO= 500V
See Note 1
5x1010 Ω
Floating Capacitance Cf V = 0V, f = 1MHz 0.6 1 pF
Output Rise Time tr 100 µs
Output Fall Time tf 20 µs
VCE = 2V, Ic = 20mA, RL = 100Ω
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COMPONENTS
Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA
Fig 3 Forward Current vs Forward Voltage Fig 4 Collector Current vs
Collector-Emitter Voltage
Fig 5 Collector-emitter Saturation Voltage vs
Forward Current Fig 6 Current Transfer R ati o vs
Forward Current
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IS7000
ISOCOM
COMPONENTS
Fig 7 Relative CTR vs TA Fig 8 Collector-Emitter Saturation Voltage vs
TA
Fig 9 Collector Dark Current vs TA
Response Time Test Circuit
Fig 10 Frequency Response
Fig 11 Response Time vs Load Resistance
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IS7000
ISOCOM
COMPONENTS
ORDER INFORMATION
IS7000 (UL Approval)
After PN PN Description Packing quantity
None IS7000 Standard DIP 4 100 pcs per reel
SM IS7000SM Surface Mount 100 pcs per tube
G IS7000G 10mm Lead Spacing 100 pcs per tube
SMT&R IS7000SMT&R Surface Mount Tape & Reel 1000 pcs per reel
IS7000X (UL and VDE Approval)
After PN PN Description Packing quantity
None IS7000X Standard DIP 4 100 pcs per reel
SM IS7000XSM Surface Mount 100 pcs per tube
G IS7000XG 10mm Lead Spacing 100 pcs per tube
SMT&R IS7000XSMT&R Surface Mount Tape & Reel 1000 pcs per reel
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IS7000
ISOCOM
COMPONENTS
PACKAGE DIMENSIONS (mm)
DIP
G Form
SMD
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ISOCOM
COMPONENTS
RECOMMENDED SOLDER PAD LAYOUT FOR SMD (mm)
TAPE AND REEL PACKAGING (mm)
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IS7000
ISOCOM
COMPONENTS
IR REFLOW SOLDERING TEMPERATURE PROFILE
(One Time Reflow Soldering is Recommended)
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
217°C
30s
60s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
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COMPONENTS
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom
reserves the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices,
audio/visual equipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact
our sales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.
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Disclaimer
ISOCOM
COMPONENTS
ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily
injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at the
customer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by ISOCOM Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.
