Description
The MoonstoneTM 1W Power LED Light Source is a high
performance energy e cient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to
the motherboard.
The low pro le package design is suitable for a wide
variety of applications especially where height is a
constraint.
The package is compatible with re ow soldering
process. This will give more freedom and  exibility to
the light source designer.
Applications
Portable ( ash light, bicycle head light)
Reading light
Architectural lighting
Garden lighting
Decorative lighting
ASMT-Mx00
MoonstoneTM 1 W Power LED Light Source
Data Sheet
Features
Available in Red, Amber, Green, and Blue color.
Energy e cient
Exposed pad for excellent heat transfer
Suitable for re ow soldering process
High current operation
Long operation life
Wide viewing angle
Silicone encapsulation
ESD Class HBM Class 3B (threshold > 8 kV)
MSL 2A for InGaN products
MSL 4 for AlInGaP products
Speci cations
 AllnGaP technology for Red and Amber
 2.1V (typ) at 350mA for AllnGaP
 InGaN technology for Green and Blue
 3.2V (typ) at 350mA for InGaN
2
Package Dimensions
Device Selection Guide ( Tj = 25°C)
Part Number Color
Luminous Flux, V
[1,2] (lm) Test Current
(mA)
Dice
TechnologyMin. Typ. Max.
ASMT-MR00-AGH00 Red 25.5 35.0 43.0 350 AlInGaP
ASMT-MR00-AHJ00 33.0 40.0 56.0 350 AlInGaP
ASMT-MA00-AGH00 Amber 25.5 35.0 43.0 350 AlInGaP
ASMT-MG00 Green 43.0 60.0 73.0 350 InGaN
ASMT-MB00 Blue 11.5 15.0 25.5 350 InGaN
Notes
1. V is the total luminous  ux output as measured with an integrating sphere at 25 ms mono pulse condition.
2. Flux tolerance is ± 10%.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise speci ed.
3. Metal slug is connected to anode for electrically non-isolated option.
3
Part Numbering System
Note:
1. Please refer to Page 8 for selection details.
ASMT-M x xx – x x1 x2 x3 x4
Packaging Option
Color
R – Red
A – Amber
G - Green
B - Blue
Color Bin Selection
Maximum Flux Bin Selection
Minimum Flux Bin Selection
Dice Type
N – InGaN
A – AllnGaP
Silicone Type
00 – Non-diused
B1 – Diused
Absolute Maximum Ratings (TA = 25°C)
Parameter ASMT-Mx00/ Units
DC Forward Current [1] 350 mA
Peak Pulsing Current [2] 1000 mA
Power Dissipation for AllnGaP 805 mW
Power Dissipation for InGaN 1225 mW
LED Junction Temperature for AllnGaP 125 °C
LED Junction Temperature for InGaN 110 °C
Operating Ambient Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +120 °C
Reverse Volttage [3] Not recommended
Notes:
1. DC forward current – derate linearly based on Figure 5 for AlInGaP & Figure 11 for InGaN.
2. Pulse condition duty factor = 10%, Frequency = 1kHz.
3. Not recommended for reverse bias operation.
4
Optical Characteristics at 350 mA (TJ = 25°C)
Part Number Color
Peak Wavelength,
λPEAK (nm)
Dominant Wave-
length, λD
[1] (nm)
Viewing Angle,
2θ½ [2] (°)
Luminous E ciency
(lm/W)
Typ Typ Typ Typ
ASMT-MR00-AGH00 Red 635 625 120 48
ASMT-MR00-AHJ00 Red 635 625 120 54
ASMT-MA00-AGH00 Amber 598 590 120 48
ASMT-MG00 Green 519 525 120 54
ASMT-MB00 Blue 454 460 120 13
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice type
Forward Voltage VF (Volts) at IF = 350mA
Thermal Resistance
Rθ j-ms ( °C/W) [1]
Min. Typ. Max. Typ.
AllnGaP 1.7 2.1 2.3 12
InGaN 2.8 3.2 3.5 10
Notes:
1. Rθ j-ms is Thermal Resistance from LED junction to metal slug.
Figure 1. Relative Intensity vs. Wavelength for AlInGaP Figure 2. Forward Current vs Forward Voltage for AlInGaP
Figure 3. Relative Luminous Flux vs. Mono Pulse Current for AlInGaP Figure 4. Radiation Pattern for AlInGaP
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
RED
AMBER
0
50
100
150
200
250
300
350
400
450
500
0 0.5 1 1.5 2 2.5 3
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 50 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (v) - lm
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE(°)
RELATIVE INTENSITY
5
Figure 5. Maximum forward current vs. ambient temperature for AlInGaP
Derated based on TJMAX = 125°C, RθJA = 40°C/W / 50°C/W and 60°C/W
Figure 6. Relative LOP (Normalized at 25°C) vs. junction temperature for
AlInGaP
Figure 7. Relative Intensity vs. Wavelength for InGaN Figure 8. Forward Current vs. Forward Voltage for InGaN
Figure 9. Relative Luminous Flux vs Mono Pulse Current for InGaN Figure 10. Radiation Pattern for InGaN
JUNCTION TEMPERATURE - °C
RELATIVE LOP (Normalized at 25°C)
0
0.5
1
1.5
2
-40 -25 -10 5 20 35 50 65 80 95 110 125
RED
AMBER
0
50
100
150
200
250
300
350
400
0 102030405060708090
TA- AMBIENT TEMPERATURE - °C
IF - MAX FORWARD CURRENT - mA
RJA = 60°C/W
RJA = 40°C/W
= 50°C/WR JA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
GREEN
BLUE
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 5 0 100 150 200 250 300 350 400 450 500
MONO PULSE CURRENT - mA
RELATIVE LUMINOUS FLUX (φV) - lm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -70 -50 -30 -10 10 30 50 70 90
OFF-AXIS ANGLE (°)
RELATIVE INTENSITY
GREEN
BLUE
0
50
100
150
200
250
300
350
400
450
500
0 0.5 1 1.5 2 2.5 3 3.5 4
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
6
Figure 13. Recommended re ow soldering pro le Figure 14. Recommended soldering land pattern
Figure 15. Temperature vs. relative forward voltage shift Figure 16. Relative LOP vs Junction Temperature for InGaN Devices
Note:
For detail information on re ow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 11. Maximum Forward Current vs. Ambient Temperature for InGaN
Derated based on TJMAX = 110°C, RJA = 30°C/W, 40°C/W and 50°C/W
Figure 12. Dominant wavelength vs. forward current – InGaN devices
217 °C
200 °C
150 °C
60 - 120 SEC.
-6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
255 - 260 °C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
17.00 ± 0.20
1.00 ± 0.10
3.1 ± 0.10
8.40 ± 0.10
5.08 ± 0.10
10.70 ± 0.10
-300
-250
-200
-150
-100
-50
0
50
100
150
200
250
300
-40 -15 10 35 60 85
TEMPERATURE - °C
RELATIVE FORWARD VOLTAGE SHIFT (mV)
0
10
20
30
40
50
60
70
80
90
100
25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100105110
JUNCTION TEMPERATURE (°C)
RELATIVE LOP (%)
GREEN
BLUE
DOMINANT WAVELENGTH – nm
100
450
FORWARD CURRENT – mA
400
510
520
200150
540
530
250 300
490
350
480
470
460
500
GREEN
BLUE
IF – MAXIMUM FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
90
300
350
2010 30
400
40 50 60
200
70 80
150
100
50
250
Rθ
JA
= 50 C/W
Rθ
JA
= 40 C/W
Rθ
JA
= 30 C/W
7
Color Bin Selection [x3]
Individual reel will contain parts from one full bin only.
Option Selection Details
ASMT-Mxxx – x x1 x2 x3 x4
x1 – Minimum Flux Bin Selection
x2 – Maximum Flux Bin Selection
x3 – Color Bin Selection
x4 – Packaging Option
Other Colors
0 Full Distribution
Z A and B
Y B and C
W C and D
V D and E
Q A, B and C
P B, C and D
N C, D and E
Flux Bin Limit [x1 x2]
Bin
Luminous Flux (lm) at IF = 350mA
Min. Max.
D 11.5 15.0
E 15.0 19.5
F 19.5 25.5
G 25.5 33.0
H 33.0 43.0
J 43.0 56.0
K 56.0 73.0
Tolerance for each bin limits is ±10%
Color Bin Limits
Color Bin Min. Max.
Red Full Distribution 620.0 635.0
Amber A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
Blue A 455.0 460.0
B 460.0 465.0
C 465.0 470.0
D 470.0 475.0
Green A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ± 1 nm
Packing Tube - Option 0
Tape & Reel - Option 1
Tape Dimension
Dim Value
A0 8.80±0.10
B0 16.45±0.10
K0 3.60±0.10
W 24.0±0.10
P 16.0±0.10
Qty/Reel 250EA
Unit: mm
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
Figure 17. Tube dimensions
Figure 18. Carrier tape dimensions
Example
ASMT-MR00-AHJ00
ASMT-MR00-Axxxx – AllnGaP Red, Non-di used
x1 = H – Minimum Flux Bin H
x2 = J – Maximum Flux Bin J
x3 = 0 – Full Distribution
x4 = 0 – Tube Option
Packaging option [x4]
Selection Option
0 Tube
1 Tape & Reel
Reel Dimensions
R10.00
60.0º
268.00
330.00 ± 1.00
99.50 ± 1.00
2.30 2.30
24.0+1.00
−0.00
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
END
THERE SHALL BE A MINIMUM OF
160 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A MINIMUM OF 390 mm OF EMPTY
COMPONENT POCKETS SEALED WITH COVER TAPE.
START
Tape & Reel - Option 1 (Cont.)
Tape Dimension
Figure 19. Carrier tape leader and trailer dimensions
Figure 20. Reel dimensions
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OP-
ERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RE-
SPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,
EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Handling Precaution
The encapsulation material of the product is made of sili-
cone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage
the product and cause premature failure. During as-
sembly or handling, the unit should be held on the body
only. Please refer to Avago Application Note AN5288 for
detail information.
Moisture Sensitivity
This product is quali ed as Moisture Sensitive Level 2a
for InGaN devices and MSL 4 for AlInGaP devices per
Jedec J-STD-020. Precautions when handling this mois-
ture sensitive product is important to ensure the reliabil-
ity of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
Unopen moisture barrier bag (MBB) can be stored
at <40°C/90%RH for 12 months. If the actual shelf
life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, then it is safe to re ow the LEDs per the
original MSL rating.
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. Obsoletes AV01-0668EN
AV02-0129EN - October 7, 2011
B. Control after opening the MBB
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours for MSL 2a and 72 hours for MSL
4.
C. Control for un nished reel
For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5%RH to ensure no LEDs have
exceeded their  oor life of 672 hours for MSL 2a
and 72 hours for MSL 4.
E. Baking is required if
HIC “10%” indicator is not blue and “5%” indicator
is pink. - The LEDs are exposed to condition of
>30°C/60% RH at any time.
The LEDs  oor life exceeded 672 hours for MSL 2a
and 72 hours for MSL 4.
Recommended baking condition: 60±5ºC for 20hrs.