S3AB thru S3MB Taiwan Semiconductor CREAT BY ART Surface Mount Rectifiers FEATURES - Glass passivated chip junction - Ideal for automated placement - Low forward voltage drop - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: DO-214AA (SMB) DO-214AA (SMB) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.09 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25 unless otherwise noted) PARAMETER SYMBOL S3 S3 S3 S3 S3 S3 S3 AB BB DB GB JB KB MB Unit Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current IF(AV) 3 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 80 A VF 1.15 V Maximum instantaneous forward voltage (Note 1) @3A Maximum reverse current @ rated VR TJ=25 TJ=125 IR 10 A 250 Typical reverse recovery time (Note 2) Trr 1.5 s Typical junction capacitance (Note 3) Cj 40 pF RjL 10 TJ - 55 to +150 O C TSTG - 55 to +150 O C Typical thermal resistance Operating junction temperature range Storage temperature range O C/W Note 1: Pulse test with PW=300s, 1% duty cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Document Number: DS_D1405060 Version: H14 S3AB thru S3MB Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND QUALIFIED PACKAGE PACKING SMB 850 / 7" Plastic reel CODE R5 S3xB (Note 1) Prefix "H" R4 Suffix "G" M4 SMB 3,000 / 13" Paper reel SMB 3,000 / 13" Plastic reel Note 1: "x" defines voltage from 50V (S3AB) to 1000V (S3MB) EXAMPLE AEC-Q101 PREFERRED P/N PART NO. S3MB R5 S3MB R5 S3MB R5G S3MB R5 S3MBHR5 S3MB GREEN COMPOUND PACKING CODE QUALIFIED H DESCRIPTION CODE G Green compound R5 AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25 unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE 3 2.5 2 1.5 RESISTIVE OR INDUCTIVE LOAD 0.5 0 0 20 40 60 80 100 120 140 160 INSTANTANEOUS REVERSE CURRENT (A) AVERAGE FORWARD CURRENT (A) 3.5 1 FIG. 2 TYPICAL REVERSE CHARACTERISTICS 100 10 TJ=125 1 TJ=25 0.1 0 LEAD TEMPERATURE (oC) FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 40 60 80 100 120 140 FIG. 4 TYPICAL FORWARD CHARACTERISTICS 100 100 8.3ms Single Half Sine Wave 10 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE URRENT (A) 20 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 1 Pulse Width=300s 1% Duty Cycle 0.1 1 10 NUMBER OF CYCLES AT 60 Hz Document Number: DS_D1405060 100 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 FORWARD VOLTAGE (V) Version: H14 S3AB thru S3MB Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE CAPACITANCE (pF) 100 10 f=1.0MHz Vsig=50mVp-p 1 1 10 REVERSE VOLTAGE (V) 100 PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max A 1.95 2.10 0.077 0.083 B 4.25 4.75 0.167 0.187 C 3.48 3.73 0.137 0.147 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 2.3 0.091 B 2.5 0.098 C 4.3 0.169 D 1.8 0.071 E 6.8 0.268 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1405060 Version: H14 S3AB thru S3MB Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1405060 Version: H14 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Taiwan Semiconductor: S3AB S3BB S3DB S3GB S3JB S3KB S3MB S3AB R4 S3BB R4 S3DB R4 S3GB R4 S3JB R4 S3KB R4 S3MB R4