D
D
ATA SHEET
Product specification
File under Integrated Circuits, IC01
September 1983
INTEGRATED CIRCUITS
TDA7010T
FM radio circuit
September 1983 2
Philips Semiconductors Product specification
FM radio circuit TDA7010T
GENERAL DESCRIPTION
The TDA7010T is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral
components is important (small dimensions and low costs).
The IC has an FLL (Frequency-Locked-Loop) system with an intermediate frequency of 70 kHz. The i.f. selectivity is
obtained by active RC filters. The only function which needs alignment is the resonant circuit for the oscillator, thus
selecting the reception frequency. Spurious reception is avoided by means of a mute circuit, which also eliminates too
noisy input signals. Special precautions are taken to meet the radiation requirements.
The TDA7010T includes the following functions:
•R.F. input stage
•Mixer
•Local oscillator
•I.F. amplifier/limiter
•Phase demodulator
•Mute detector
•Mute switch
QUICK REFERENCE DATA
PACKAGE OUTLINE
16-lead mini-pack; plastic (SO16; SOT109A); SOT109-1; 1996 July 24.
Supply voltage range (pin 4) VP2,7 to 10 V
Supply current at VP = 4,5 V IPtyp. 8 mA
R.F. input frequency range frf 1,5 to 110 MHz
Sensitivity for −3 dB limiting
(e.m.f. voltage)
(source impedance: 75 Ω; mute disabled) EMF typ. 1,5 µV
Signal handling (e.m.f. voltage)
(source impedance: 75 Ω) EMF typ. 200 mV
A.F. output voltage at RL = 22 kΩVotyp. 75 mV
September 1983 3
Philips Semiconductors Product specification
FM radio circuit TDA7010T
Fig.1 Block diagram.
September 1983 4
Philips Semiconductors Product specification
FM radio circuit TDA7010T
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
D.C. CHARACTERISTICS
VP = 4,5 V; Tamb 25 °C; measured in Fig.4; unless otherwise specified
Supply voltage (pin 4) VPmax. 12 V
Oscillator voltage (pin 5) V6-5 VP−0,5 to VP+ 0,5 V
Total power dissipation see derating curve Fig.2
Storage temperature range Tstg −55 to +150 °C
Operating ambient temperature range Tamb 0 to +60 °C
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 4) VP2,7 4,5 10 V
Supply current
at VP = 4,5 V IP−8−mA
Oscillator current (pin 5) I5−280 −µA
Voltage at pin 12 V12-14 −1,35 −V
Output current at pin 2 I2−60 −µA
Voltage at pin 2; RL = 22 kΩV2-14 −1,3 −V
Fig.2 Power derating curve.
September 1983 5
Philips Semiconductors Product specification
FM radio circuit TDA7010T
A.C. CHARACTERISTICS
Vp = 4,5 V; Tamb = 25 °C; measured in Fig.4 (mute switch open, enabled); frf = 96 MHz (tuned to max. signal at 5 µV
e.m.f.) modulated with ∆f = ±22,5 kHz; fm = 1 kHz; EMF = 0,2 mV (e.m.f. voltage at a source impedance of 75 Ω); r.m.s.
noise voltage measured unweighted (f = 300 Hz to 20 kHz); unless otherwise specified.
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Sensitivity (see Fig.3)
(e.m.f. voltage)
for −3 dB limiting;
muting disabled EMF −1,5 −µV
for −3 dB muting EMF −6−µV
for S/N = 26 dB EMF −5,5 −µV
Signal handling (e.m.f. voltage)
for THD < 10%; ∆f = ± 75 kHz EMF −200 −mV
Signal-to-noise ratio S/N −60 −dB
Total harmonic distortion
at ∆f = ±22,5 kHz THD −0,7 −%
at ∆f = ±75 kHz THD −2,3 −%
AM suppression of output voltage
(ratio of the AM output signal
referred to the FM output signal)
FM signal: fm = 1 kHz; ∆f = ±75 kHz
AM signal: fm = 1 kHz; m = 80% AMS −50 −dB
Ripple rejection (∆VP = 100 mV; f = 1 kHz) RR −10 −dB
Oscillator voltage (r.m.s. value) at pin 5 V5-4(rms) −250 −mV
Variation of oscillator frequency
with supply voltage (∆VP = 1 V) ∆fosc −60 −kHz/V
Selectivity S+300 −43 −dB
S−300 −28 −dB
A.F.C. range ∆frf −± 300 −kHz
Audio bandwidth at ∆Vo = 3 dB
measured with pre-emphasis (t = 50 µs) B −10 −kHz
A.F. output voltage (r.m.s. value)
at RL = 22 kΩVo(rms) −75 −mV
Load resistance
at VP = 4,5 V RL−− 22 kΩ
at VP = 9,0 V RL−− 47 kΩ
September 1983 6
Philips Semiconductors Product specification
FM radio circuit TDA7010T
Note
1. The muting system can be disabled by feeding a current of about 20 µA into pin 1.
Conditions: 0 dB = 75 mV; frf = 96 MHz.
for S + N curve: ∆f = ±22,5 kHz; fm = 1 kHz.
for THD curve: ∆f = ±75 kHz; fm = 1 kHz.
Fig.3 A.F. output voltage (Vo) and total harmonic distortion (THD) as a function of the e.m.f. input voltage (EMF)
with a source impedance (RS) of 75 Ω: (1) muting system enabled; (2) muting system disabled.
September 1983 7
Philips Semiconductors Product specification
FM radio circuit TDA7010T
Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6.
September 1983 8
Philips Semiconductors Product specification
FM radio circuit TDA7010T
Fig.5 Track side of printed-circuit board used for the circuit of Fig.4.
Fig.6 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.
September 1983 9
Philips Semiconductors Product specification
FM radio circuit TDA7010T
PACKAGE OUTLINE
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REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10
1.45
1.25 0.25 0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8 1.27 6.2
5.8
0.7
0.6
0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1 95-01-23
97-05-22
076E07S MS-012AC
0.069 0.010
0.004
0.057
0.049 0.01 0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15 0.050
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
September 1983 10
Philips Semiconductors Product specification
FM radio circuit TDA7010T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
September 1983 11
Philips Semiconductors Product specification
FM radio circuit TDA7010T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
