MINISMDM110/16-2 - TE Connectivity

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 183

PolySwitch Surface-mount

Resettable Devices

More than ten years ago,

Raychem Circuit Protection intro-

duced the SMD product family,

and polymeric PTC devices

quickly became the computer

industry standard for keyboard,

mouse, and disk drive protection.

In 1995, Raychem Circuit

Protection advanced the technol-

ogy, reducing the size and cost of

surface-mount resettable devices

with the introduction of its

miniSMD product series. The

recent additions to the surface-

mount family include the

nanoSMD series, which reduces

the size to a 3216mm (1206mils)

foot print, one-third the size of the

popular miniSMD series.

Benefits:

• Smaller size saves board space

and cost

• Many product choices give

engineers more design flexibility

• Compatible with high-volume

electronics assembly

• Assists in meeting regulatory

requirements

• Higher voltage ratings allow use

in new applications

Features:

• Broadest range of resettable

devices available in the industry

• Current ratings from 0.05 to 3A

• Voltage ratings from 6V comput-

er and electronic applications to

60V (600V Telecom)

• Agency recognition: UL, CSA,

TÜV

• Small footprint

• Fast time-to-trip

• Low resistance

Applications:

• Computer motherboards

• Modems

• USB hub, ports and peripherals

• IEEE1394 ports

• Digital cameras

• Disk drives

• CD-ROMs

• Game machines

• Battery packs

• Phones

• Fax machines

• Analog and digital line cards

• Printers

• PDAs

• Chargers

Product Dimensions, Product Series, Hold Current

Products in this section are grouped by:

Surface-mount

184 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Step 1. Determine the circuit’s operating parameters.

Fill in the following information about the circuit:

Maximum ambient operating temperature

Normal operating current

Maximum operating voltage

(i.e. miniSMDC014 is 60VDC max.)

Maximum interrupt current

Step 2. Select the PolySwitch device that will accommodate the

circuit’s maximum ambient temperature and normal

operating current.

Look across the top of Table S2 to find the temperature that most

closely matches the circuit’s maximum operating temperature. Look

down that column to find the value equal to or greater than the circuit’s

normal operating current. Now look to the far left of that row to find the

part number for the PolySwitch surface mount device that will best

accommodate the circuit. Devices in this section are grouped by

device dimensions, so your operating-current requirement may be

found in more then one grouping.

The thermal derating curves located in Figure S1 are the normalized

representations of the data in Table S2.

Step 3. Compare the selected device’s maximum electrical rat-

ings with the circuit’s maximum operating voltage and

interrupt current.

Look down the first column of Table S3 to find the part number you

selected in Step 2. Look to the right in that row to find the device’s

maximum operating voltage (VMAX) and maximum interrupt current

(IMAX). Ensure that VMAX and IMAX are greater than or equal to the circuit’s

maximum operating voltage and maximum interrupt current.

Selection Guide for Surface-mount Devices

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 185

Step 4. Determine time-to-trip.

Time-to-trip is the amount of time it takes for a device to switch to a

high-resistance state once a fault current has been applied across the

device. Identifying the PolySwitch device’s time-to-trip is important in

order to provide the desired protection capabilities. If the device you

choose trips too fast, undesired or nuisance tripping will occur. If the

device trips too slowly, the components being protected may be

damaged before the device switches to a high-resistance state.

Figures S11-S18 show the typical time-to-trip at 20°C for each of the

PolySwitch devices.

If the PolySwitch device's time-to-trip is too fast or too slow for the

circuit, go back to Step 2 and choose an alternate device.

Step 5. Verify ambient operating conditions.

Ensure that your application’s minimum and maximum ambient

temperatures are within the operating temperature of -40˚C to 85˚C

(-40˚C to 125˚C for SMDH160).

Step 6. Verify the PolySwitch device dimensions.

Using dimensions in Table S4, compare the dimensions of the

PolySwitch device you selected with the application’s space con-

siderations.

Surface-mount

Protection Application Selection Table for Surface-mount Devices

186 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

The table below lists Polyswitch

devices typically used in these

applications.

Specifications for the suggested

device part numbers can be

found in this section.

Once a part has been selected,

the user should evaluate and test

each product for the intended

application.

PolySwitch Resettable Devices—Key Selection Criteria

Overcurrent Fast Time-to-trip

Protection Application Additional Comments Overvoltage Small Size Low Resistance (Temperature Protection)

AC adapter input power use w/ Zener & triac SMD250 SMD250 SMD200

Battery pack protection nanoSMDC150 miniSMDC260 miniSMDE190

Charger protection nanoSMDM050 miniSMDM110/16 nanoSMDM075

CPU/IC protection nanoSMDM100 nanoSMDC150 nanoSMDM075

Data acquisition/sensor microSMD005 — microSMD005

DC input/output power ≤6V nanoSMDM075 nanoSMDC150 nanoSMDM050

≤12V miniSMDC075 miniSMDM110/16 miniSMDC075

DDC nanoSMDM075 nanoSMDM100 nanoSMDM050

Device Bay system DB12, DB20 miniSMDC200 miniSMDC260 miniSMDC200

DB32 miniSMDC260 SMD300 miniSMDM200

Ethernet/Lan nanoSMDM050 miniSMDM110/16 nanoSMDM075

Fan microSMD035 microSMD050 microSMD035

IEEE-1394 power provider SMD100/33 SMD185 SMD100/33

alt. power provider SMD185 SMD185 SMD150/33

self-powered SMD185 SMD185 SMD150/33

LCD inverter nanoSMDM050 miniSMDM110/16 nanoSMDM075

LCD screen power nanoSMDM050 nanoSMDM050 microSMD035

LNB (Low Noise Block) SMD075 SMD075 SMD050

Motor ≤6V nanoSMDM100 nanoSMDC150 microSMDM075

≤13.2V miniSMDC075 miniSMDM110/16 miniSMDC075

PS/2 mouse/keyboard nanoSMDM075 nanoSMDM100 nanoSMDM050

Signal - data communication ≤6V nanoSMDM075 nanoSMDM075 nanoSMDM075

≤13.2V miniSMDC050 miniSMDM075 miniSMDC020

≤30V SMD030-2018 SMD075 SMD050

SCSI nanoSMDM100 nanoSMDC150 nanoSMDM075

Smart card reader microSMD010 microSMD035 microSMD005

Telecom - modem UL1950 OC TS600-170 TS250-130 TS600-170

OV TVB270SA or SC* TVB270SA or SC* TVB270SA or SC*

ITU-T K.21 OC TS250, TSV250 TS250, TSV250-130 TS250-130-RB

OV TVB270SA* TVB270SA* TVB270SA*

Digital line OC miniSMDC014 miniSMDC014 miniSMDC014

OV TVB270SC* TVB270SC* TVB270SC*

Telecom - PBX UL1950 OC TS600-170 TS600-200-RA TS600-170

OV TVB270SA or SC* TVB270SA or SC* TVB270SA or SC*

ITU-T K.21 OC TS250, TSV250 TS250-130 TS250-130-RB

OV TVB270SA* TVB270SA* TVB270SA*

Subscriber OC miniSMDC014 miniSMDC014 miniSMDC014

Telecom - line card Telcordia OC TS600-200-RA-B-0.5 TS600-200-RA-B-0.5 TS600-200-RA-B-0.5

GR-1089 OV TVB270SC* TVB270SC* TVB270SC*

ITU-T K.20 OC TS250, TSV250 TS250-130-RA TS250

OV TVB270SA* TVB270SA* TVB270SA*

Intrabuilding protection Telcordia GR1089 TSL250-080 SMD030-2018 TSL250-080

Temperature sensor CPU nanoSMDM050 nanoSMDM075 nanoSMDM050

USB Individual Port nanoSMDM075 nanoSMDM100 nanoSMDM050

2 port ganged nanoSMDC150 miniSMDC150 miniSMDC125

3 port ganged miniSMDC200 miniSMDM200 miniSMDM200

4 port ganged miniSMDC260 miniSMDM260 miniSMDM260

*Refer to the SiBar thyristor product section for more information.

This list is not exhaustive. Raychem Circuit Protection welcomes our customers’ input for additional application ideas for Polyswitch Resettable devices.

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 187

Table S1. Product Series: Size, Current Rating, Voltage Rating/Typical Resistance for Surface-mount

Devices

TS250

nanoSMDC miniSMDC TSL250

nanoSMDM microSMD miniSMDM midSMD SMD SMD2 miniSMDE TSV250 TS600

Size mm (mils) 3216 (1206) 3225 (1210) 4532 (1812) 5050 (2018) 7555 (2920) 8763 (3425) 11550 (4420) * *

Hold Current (A) ——— —————— —

0.05 — 30VDC/25Ω—————— —

0.08 — — — — — — — 80V/12.5Ω—

0.13 — — — — — — — 60V/6.0-8.0Ω—

0.14 — — 60VDC/4.0Ω—— — — — —

0.17 — — — — — — — — 60V/11.0Ω

0.18 — — — — — — — — —

0.20 — — 30VDC/1.4Ω— — — — — 60V/8.5Ω

0.30 — — — 60VDC/1.4Ω60VDC/3.0Ω—— — —

0.35 — 6VDC/0.81Ω—————— —

0.50 6VDC/0.40Ω13.2VDC/0.55Ω15VDC/0.60Ω— 60VDC/0.87Ω—— — —

0.75 6VDC/0.20Ω6VDC/0.29Ω13.2VDC/0.23Ω— 30VDC/0.67Ω—— — —

24VDC/0.20Ω

1.00 6VDC/0.15Ω— — 15VDC/0.25Ω30VDC/0.30Ω—— — —

33VDC/0.27Ω

1.10 — 6VDC/0.14Ω6VDC/0.12Ω—— — — — —

8VDC/0.14Ω

16VDC/0.12Ω

1.25 — — 6VDC/0.09Ω— 15VDC/0.16Ω—— — —

1.50 6VDC/0.08Ω6VDC/0.07Ω6VDC/0.07Ω15VDC/0.13Ω— 15VDC/0.16Ω—— —

33VDC/0.15Ω

1.60 — — 8VDC/0.066Ω— — 16VDC/0.10Ω—— —

1.85 — — — — — 33VDC/0.12Ω—— —

1.90 — — — — — — 16VDC/0.065Ω——

2.00 — — 6VDC/0.050Ω6VDC/0.07Ω— 15VDC/0.09Ω—— —

8VDC/0.040Ω

2.50 — — — — — 15VDC/0.06Ω—— —

2.60 — — 6VDC/0.035Ω—6V

DC/0.05Ω—— — —

6VDC/0.030Ω

3.00 — — — — 6VDC/0.033Ω—— — —

*Refer to Telecommunications and Networking section for dimensions; voltage for these parts is RMS max.

Surface-mount

188 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Table S2. Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)]

Maximum Ambient Temperature

-40˚C -20˚C 0˚C 20˚C 25˚C 40˚C 50˚C 60˚C 70˚C 80˚C 85˚C 125˚C

Part Number

nanoSMD

Size 3216 mm/1206 mils

nanoSMDM050 0.76 0.68 0.59 0.52 0.50 0.44 0.40 0.35 0.32 0.28 0.26 —

nanoSMDM075 1.11 1.00 0.85 0.78 0.75 0.67 0.61 0.52 0.50 0.44 0.42 —

nanoSMDM100 1.49 1.34 1.15 1.04 1.00 0.89 0.81 0.70 0.66 0.58 0.55 —

nanoSMDC150 2.20 1.99 1.77 1.55 1.50 1.34 1.23 1.10 1.01 0.90 0.84

microSMD

Size 3225 mm/1210 mils

microSMD005 0.08 0.07 0.06 0.05 0.048 0.04 0.04 0.03 0.03 0.02 0.02 —

microSMD035 0.51 0.46 0.40 0.35 0.34 0.30 0.27 0.24 0.22 0.19 0.18 —

microSMD050 0.76 0.66 0.58 0.50 0.475 0.42 0.38 0.35 0.29 0.25 0.23 —

microSMD075 1.10 0.97 0.86 0.75 0.72 0.64 0.58 0.55 0.47 0.42 0.39 —

microSMD110 1.60 1.42 1.26 1.10 1.06 0.94 0.86 0.80 0.70 0.62 0.58 —

microSMD150 2.30 2.02 1.76 1.50 1.43 1.24 1.11 1.00 0.85 0.72 0.65 —

miniSMD

Size 4532 mm/1812 mils

miniSMDC014 0.23 0.20 0.17 0.14 0.13 0.11 0.10 0.09 0.07 0.06 0.05 —

miniSMDC020 0.30 0.27 0.23 0.20 0.19 0.17 0.15 0.13 0.12 0.10 0.09 —

miniSMDC050 0.59 0.57 0.55 0.50 0.48 0.45 0.43 0.35 0.30 0.25 0.23 —

miniSMDC075 1.10 0.99 0.87 0.75 0.72 0.63 0.57 0.49 0.45 0.39 0.35 —

miniSMDM075 1.11 1.00 0.81 0.78 0.75 0.67 0.61 0.49 0.47 0.45 0.42 —

miniSMDM075/24 1.11 1.00 0.85 0.78 0.75 0.67 0.61 0.52 0.50 0.44 0.42 —

miniSMDC110 1.60 1.45 1.28 1.10 1.065 0.92 0.83 0.71 0.66 0.57 0.52 —

miniSMDM110 1.58 1.43 1.20 1.14 1.10 0.98 0.92 0.77 0.73 0.70 0.66 —

miniSMDM110/16 1.61 1.46 1.25 1.14 1.10 0.98 0.90 0.78 0.74 0.66 0.62 —

miniSMDC125 2.00 1.69 1.47 1.25 1.17 1.03 0.92 0.90 0.69 0.58 0.53 —

miniSMDC150 2.30 2.05 1.77 1.50 1.44 1.23 1.09 0.95 0.82 0.68 0.61 —

miniSMDM160 2.32 2.10 1.80 1.66 1.60 1.43 1.32 1.14 1.10 0.99 0.93 —

miniSMDC200 2.60 2.44 2.22 2.00 1.96 1.78 1.67 1.50 1.45 1.34 1.29 —

miniSMDM200 2.88 2.61 2.25 2.07 2.0 1.80 1.66 1.45 1.39 1.26 1.19 —

miniSMDC260 3.40 3.16 2.88 2.60 2.54 2.32 2.18 2.00 1.90 1.76 1.69 —

miniSMDM260 3.70 3.36 2.90 2.68 2.6 2.35 2.18 1.90 1.84 1.67 1.59 —

miniSMDE

Size 11550 mm/4420 mils

miniSMDE190 3.16 2.74 2.20 1.90 1.74 1.48 1.27 1.10 0.80 0.50 0.35 —

Table S2. Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)]

continued

Maximum Ambient Temperature

-40˚C -20˚C 0˚C 20˚C 25˚C 40˚C 50˚C 60˚C 70˚C 80˚C 85˚C 125˚C

Part Number

midSMD

Size 5050 mm/2018 mils

SMD030-2018 0.48 0.42 0.35 0.30 0.28 0.24 0.21 0.17 0.15 0.12 0.10 —

SMD100-2018 1.59 1.43 1.20 1.10 1.03 0.94 0.85 0.72 0.69 0.61 0.57 —

SMD150-2018 2.21 1.97 1.70 1.50 1.42 1.26 1.15 1.00 0.91 0.79 0.73 —

SMD200-2018 2.81 2.54 2.27 2.00 1.93 1.73 1.59 1.46 1.32 1.19 1.12 —

SMD

Size 7555 mm/2920 mils

SMD030 0.44 0.39 0.32 0.30 0.28 0.26 0.23 0.19 0.18 0.17 0.15 —

SMD050 0.73 0.65 0.55 0.50 0.47 0.43 0.39 0.33 0.31 0.28 0.26 —

SMD075 1.11 0.99 0.84 0.75 0.71 0.63 0.57 0.49 0.45 0.39 0.36 —

SMD100 1.59 1.43 1.20 1.10 1.03 0.94 0.85 0.72 0.69 0.61 0.57 —

SMD100/33 1.48 1.35 1.20 1.10 1.06 0.98 0.91 0.83 0.79 0.73 0.69 —

SMD125 1.89 1.68 1.50 1.25 1.21 1.04 0.93 0.85 0.71 0.61 0.55 —

SMD260 and SMD260-RB 3.82 3.41 2.90 2.60 2.45 2.19 1.99 1.70 1.58 1.38 1.28 —

SMD300 4.13 3.75 3.30 3.00 2.87 2.62 2.43 2.25 2.00 1.87 1.78 —

SMD2

Size 8763 mm/3425 mils

SMD150 2.30 2.04 1.80 1.50 1.45 1.23 1.10 0.99 0.83 0.70 0.63 —

SMD150/33 2.30 2.04 1.80 1.50 1.45 1.23 1.10 0.99 0.83 0.70 0.63 —

SMDH160 2.15 1.96 1.78 1.60 1.55 1.42 1.33 1.24 1.15 1.05 1.01 0.64

SMD185 2.54 2.29 2.20 1.80 1.80 1.55 1.43 1.31 1.19 1.06 1.00 —

SMD200 3.01 2.67 2.30 2.00 1.90 1.66 1.50 1.30 1.16 0.99 0.91 —

SMD250 3.72 3.31 2.80 2.50 2.35 2.09 1.89 1.60 1.48 1.28 1.18 —

Telecom Surface-mount

TSL250-080 0.124 0.110 0.095 0.080 0.077 0.066 0.059 0.051 0.044 0.037 0.033 —

TS250-130 0.208 0.182 0.156 0.130 0.124 0.104 0.091 0.078 0.065 0.052 0.045 —

TSV250-130 0.208 0.182 0.156 0.130 0.124 0.104 0.091 0.078 0.065 0.052 0.045 —

TS600-170 0.264 0.230 0.200 0.170 0.163 0.140 0.125 0.109 0.094 0.077 0.070 —

TS600-200-RA 0.310 0.275 0.238 0.200 0.193 0.165 0.147 0.128 0.110 0.091 0.083 —

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 189

Surface-mount

190 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Thermal Derating Curves for Surface-mount Devices*

A = nanoSMD/microSMD/miniSMD & SMD

B = miniSMDE190

C = SMDH160

Ambient Temperature (°C)

Figure S1. Thermal Derating Curve

Percent of rated hold and trip current

–40 –20 0 20 40 60 80 100 120

100

120

140

160

180

200

Figure S1. Thermal Derating Curve

*Refer to Telecom and Networking section for thermal derating of Telecom parts.

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 191

Table S3. Electrical Characteristics for Surface-mount Devices at 20°C

IHITVMAX IMAX PD TYP Max. Time-to-Trip RMIN RTYP R1 MAX Figures for

Part Number (A) (A) (VDC) (A) (W) (A) (s) ΩΩ ΩDimensions

nanoSMD

Size 3216 mm/1206 mils

nanoSMDM050 † 0.50 1.00 6 40 0.4 8.0 0.10 0.15 0.400 0.700 S2

nanoSMDM075 † 0.75 1.50 6 40 0.4 8.0 0.20 0.10 0.200 0.290 S2

nanoSMDM100 † 1.00 1.80 6 40 0.4 8.0 0.30 0.06 0.150 0.210 S2

nanoSMDC150 † 1.50 3.00 6 40 0.6 8.0 1.00 0.04 0.080 0.110 S3

microSMD

Size 3225 mm/1210 mils

microSMD005 0.05 0.15 30 10 0.6 0.25 1.5 3.60 25.00 50.000 S4

microSMD035 0.35 0.75 6 40 0.6 8.0 0.2 0.32 0.81 1.300 S3

microSMD050 0.50 1.00 13.2 40 0.6 5.0 0.1 0.25 0.55 0.900 S3

microSMD075 0.75 1.50 6 40 0.6 8.0 0.1 0.11 0.29 0.400 S3

microSMD110 1.10 2.20 6 40 0.6 5.0 1.0 0.07 0.14 0.210 S3

microSMD150 1.5 3.0 6 40 0.6 5.0 5.0 0.04 0.07 0.110 S3

miniSMD

Size 4532 mm/1812 mils

miniSMDC014 0.14 0.34 60 10 0.6 1.5 0.15 1.500 4.000 6.000 S3

miniSMDC020 0.20 0.40 30 10 0.6 8.0 0.02 0.600 2.900 3.300 S3

miniSMDC050 0.50 1.00 15 40 0.6 8.0 0.15 0.150 0.600 1.000 S3

miniSMDC075 0.75 1.50 13.2 40 0.6 8.0 0.20 0.110 0.260 0.450 S3

miniSMDM075 † 0.75 1.50 13.2 40 0.5 8.0 0.20 0.100 0.230 0.290 S2

miniSMDM075/24 † 0.75 1.50 24 40 0.6 8.0 0.30 0.090 0.200 0.290 S5

miniSMDC110 1.10 2.20 6 40 0.6 8.0 0.30 0.040 0.120 0.210 S3

miniSMDM110 † 1.10 2.00 8 40 0.5 8.0 0.30 0.060 0.140 0.180 S2

miniSMDM110/16 † 1.10 1.95 16 40 0.6 8.0 0.50 0.060 0.120 0.180 S5

miniSMDC125 1.25 2.50 6 40 0.6 8.0 0.40 0.050 0.090 0.140 S3

miniSMDC150 1.50 3.00 6 40 0.6 8.0 0.50 0.040 0.070 0.110 S3

miniSMDM160 † 1.60 2.80 8 40 0.6 8.0 2.00 0.033 0.066 0.099 S5

miniSMDC200 2.00 4.00 6 40 0.6 8.0 5.00 0.020 0.050 0.070 S3

miniSMDM200 † 2.00 3.50 8 40 0.6 8.0 3.00 0.020 0.040 0.060 S5

miniSMDC260 2.60 5.00 6 40 0.6 8.0 15.00 0.015 0.035 0.047 S3

miniSMDM260 † 2.60 4.55 6 40 0.6 8.0 6.00 0.010 0.030 0.043 S5

miniSMDE

Size 11550 mm/4420 mils

miniSMDE190 1.90 3.80 16 100 1.4 10 2.0 0.024 0.065 0.08 S3

New

†Electrical characteristics determined at 25°C.

Surface-mount

192 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Table S3. Electrical Characteristics for Surface-mount Devices continued

IHITVMAX IMAX PD TYP Max. Time-to-Trip RMIN RTYP R1 MAX Figures for

Part Number (A) (A) (VDC) (A) (W) (A) (s) (Ω)(Ω)(Ω) Dimensions

midSMD

Size 5050 mm/2018 mils

SMD030-2018 0.30 0.80 60 20 0.7 1.5 1.5 0.500 1.40 2.300 S6

SMD100-2018 1.10 2.20 15 40 1.2 8.0 0.5 0.100 0.25 0.400 S6

SMD150-2018 1.50 3.00 15 40 1.4 8.0 1.0 0.070 0.13 0.180 S6

SMD200-2018 2.00 4.20 6 40 1.4 8.0 3.0 0.048 0.07 0.100 S6

SMD

Size 7555 mm/2920 mils

SMD030 0.30 0.60 60 10 1.5 1.5 3.0 1.200 3.00 4.800 S7

SMD050 0.50 1.00 60 10 1.5 2.5 4.0 0.350 0.87 1.400 S7

SMD075 0.75 1.50 30 40 1.5 8.0 0.3 0.350 0.67 1.000 S7

SMD100 1.10 2.20 30 40 1.5 8.0 0.5 0.120 0.30 0.480 S7

SMD100/33 1.10 2.20 33 40 1.5 8.0 0.5 0.120 0.27 0.410 S7

SMD125 1.25 2.50 15 40 1.5 8.0 2.0 0.070 0.16 0.250 S7

SMD260 2.60 5.20 6 40 1.5 8.0 20.0 0.025 0.05 0.075 S7

SMD260-RB 2.60 5.00 6 40 1.5 5.0 60.0 0.030 0.055 0.075 S7

SMD300 3.00 6.00 6 40 1.3 8.0 35.0 0.015 0.033 0.048 S7

SMD2

Size 8763 mm/3425 mils

SMD150 1.50 3.00 15 40 1.7 8.0 5.0 0.060 0.16 0.250 S7

SMD150/33 1.50 3.00 33 40 1.7 8.0 5.0 0.080 0.15 0.230 S7

SMDH160 1.60 3.20 16 70 2.1 8.0 15.0 0.050 0.10 0.150 S7

SMD185 1.80 3.60 33 40 1.2 8.0 5.0 0.065 0.12 0.150 S7

SMD200 2.00 4.00 15 40 1.7 8.0 12.0 0.050 0.09 0.125 S7

SMD250 2.50 5.00 15 40 1.7 8.0 25.0 0.035 0.06 0.085 S7

Telecom Surface-mount*

TSL250-080 0.08 0.16 250** 3.0 1.0 1.0 1.8 5.0 11.0 20.0*** S7

TS250-130 0.13 0.26 250** 3.0 3.0 1.0 2.5 6.5 12.0 20.0 S8

650 1.1

TSV250-130 0.13 0.26 250** 3.0 3.0 1.0 3.0 4.0 7.0 12.0*** S10

TS600-170 0.17 0.40 600** 3.0 2.5 1.0 21.0 4.0 9.0 18.0 S9

TS600-200-RA 0.20 0.40 600** 3.0 2.5 1.0 21.0 4.0 7.5 13.5 S9

*These products are intended for telecom applications. Time-to-trip is typical, please see Telecom and Networking section for details.

**RMS max. voltage.

***R1 MAX is measured one hour post-trip or 24 hours post-reflow at 20°C.

IH= Hold current: maximum current device will pass without interruption in 20°C still air.

IT= Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.

VMAX = Maximum voltage device can withstand without damage at rated current.

IMAX = Maximum fault current device can withstand without damage at rated voltage.

PD= Power dissipated from device when in the tripped state in 20°C still air.

R1 MAX is measured one hour post reflow.

RTYP = Typical resistance of device as supplied at 20°C unless otherwise specified.

New

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 193

Figures S2–S10. Physical Description for Dimensions for Surface-mount Devices

DDC

Figures S2

Figures S3

Fi B1

Figure S4

DDC

Figure S5

Figures S7

Figure S8

Figure S9

Figure S10

Surface-mount

Figures S6

194 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Table S4. Dimensions for Surface-mount Devices in Millimeters (Inches)

Dimension

ABCDE FGH

Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min Max. Min. Figures

nanoSMD

nanoSMDM050 3.0 3.4 0.8 1.2 1.4 1.8 0.75 1.05 S2

(0.118) (0.134) (0.032) (0.047) (0.055) (0.071) (0.030) (0.041)

nanoSMDM075 3.0 3.4 0.8 1.2 1.4 1.8 0.75 1.05 S2

(0.118) (0.134) (0.032) (0.047) (0.055) (0.071) (0.030) (0.041)

nanoSMDM100 3.0 3.4 0.8 1.2 1.4 1.8 0.75 1.05 S2

(0.118) (0.134) (0.032) (0.047) (0.055) (0.071) (0.030) (0.041)

nanoSMDC150 3.0 3.4 0.85 1.4 1.37 1.9 0.25 0.127 S3

(0.118) (0.134) (0.033) (0.055) (0.054) (0.075) (0.010) (0.005)

microSMD

microSMD005 3.00 3.43 0.50 0.85 2.35 2.80 0.25 0.20 S4

(0.118) (0.135) (0.019) (0.034) (0.092) (0.110) (0.010) (0.008)

microSMD035 3.00 3.43 0.38 0.62 2.35 2.80 0.30 0.25 S3

(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.012) (0.010)

microSMD050 3.00 3.43 0.38 0.62 2.35 2.80 0.30 0.25 S3

(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.012) (0.010)

microSMD075 3.00 3.43 0.38 0.62 2.35 2.80 0.30 0.25 S3

(0.118) (0.135) (0.015) (0.025) (0.092) (0.110) (0.012) (0.010)

microSMD110 3.00 3.43 0.28 0.48 2.35 2.80 0.30 0.25 S3

(0.118) (0.135) (0.011) (0.019) (0.092) (0.110) (0.012) (0.010)

microSMD150 3.00 3.43 0.51 1.22 2.35 2.80 0.30 0.25 S3

(0.118) (0.135) (0.020) (0.048) (0.092) (0.110) (0.012) (0.010)

miniSMD

miniSMDC014 4.37 4.73 0.635 0.89 3.07 3.41 0.30 0.25 0.50 S3

(0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.012) (0.010) (0.020)

miniSMDC020 4.37 4.73 0.635 0.89 3.07 3.41 0.30 0.25 0.50 S3

(0.172) (0.186) (0.025) (0.035) (0.121) (0.134) (0.012) (0.010) (0.020)

miniSMDC050 4.37 4.73 0.38 0.62 3.07 3.41 0.30 0.25 0.50 S3

(0.172) (0.186) (0.015) (0.025) (0.121) (0.134) (0.012) (0.010) (0.020)

miniSMDC075 4.37 4.73 0.38 0.62 3.07 3.41 0.30 0.25 0.50 S3

(0.172) (0.186) (0.015) (0.025) (0.121) (0.134) (0.012) (0.010) (0.020)

miniSMDM075 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S2

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDM075/24 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S5

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDC110 4.37 4.73 0.38 0.62 3.07 3.41 0.30 0.25 0.50 S3

(0.172) (0.186) (0.015) (0.025) (0.121) (0.134) (0.012) (0.010) (0.020)

miniSMDM110 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S2

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDM110/16 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S5

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDC125 4.37 4.73 0.28 0.48 3.07 3.41 0.25 0.20 0.50 S3

(0.172) (0.186) (0.011) (0.019) (0.121) (0.134) (0.010) (0.008) (0.020)

miniSMDC150 4.37 4.73 0.28 0.48 3.07 3.41 0.25 0.20 0.50 S3

(0.172) (0.186) (0.011) (0.019) (0.121) (0.134) (0.010) (0.008) (0.020)

miniSMDM160 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S5

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDC200 4.37 4.73 0.51 1.22 3.07 3.41 0.30 0.25 S3

(0.172) (0.186) (0.020) (0.048) (0.121) (0.134) (0.012) (0.010)

miniSMDM200 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S5

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

miniSMDC260 4.37 4.73 0.76 1.25 3.07 3.41 0.30 0.25 S3

(0.172) (0.186) (0.030) (0.050) (0.121) (0.134) (0.012) (0.010)

miniSMDM260 4.35 4.75 1.75 2.00 3.05 3.60 1.4 1.7 S5

(0.172) (0.187) (0.069) (0.079) (0.120) (0.142) (0.055) (0.067)

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 195

Surface-mount

Table S4. Dimensions for Surface-mount Devices in Millimeters (Inches)

continued

Dimension

ABCDE FGH

Part Number Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min Max. Min. Figures

miniSMDE

miniSMDE190 11.15 11.51 0.33 0.53 4.83 5.33 0.51 1.02 S3

(0.439) (0.453) (0.013) (0.021) (0.190) (0.210) (0.020) (0.040)

midSMD

SMD030-2018 4.72 5.44 1.78 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 S6

(0.186) (0.214) (0.070) (0.166) (0.194) (0.010) (0.014) (0.010) (0.014) (0.012) (0.018)

SMD100-2018 4.72 5.44 1.52 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 S6

(0.186) (0.214) (0.060) (0.166) (0.194) (0.010) (0.014) (0.010) (0.014) (0.012) (0.018)

SMD150-2018 4.72 5.44 1.52 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 S6

(0.186) (0.214) (0.060) (0.166) (0.194) (0.010) (0.014) (0.010) (0.014) (0.012) (0.018)

SMD200-2018 4.72 5.44 1.52 4.22 4.93 0.25 0.36 0.25 0.36 0.30 0.46 S6

(0.186) (0.214) (0.060) (0.166) (0.194) (0.010) (0.014) (0.010) (0.014) (0.012) (0.018)

SMD

SMD030 6.73 7.98 3.18 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD050 6.73 7.98 3.18 4.8 5.44 0.56 0.71 0.20 0.30 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.125) (0.19) (0.214) (0.022) (0.028) (0.008) (0.012) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD075 6.73 7.98 3.18 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.125) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD100 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD100/33 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD125 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD260 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD260-RB 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD300 6.73 7.98 3.00 4.8 5.44 0.56 0.71 0.56 0.71 2.16 2.41 0.66 1.37 0.43 S7

(0.265) (0.314) (0.118) (0.19) (0.214) (0.022) (0.028) (0.022) (0.028) (0.085) (0.095) (0.026) (0.054) (0.017)

SMD2

SMD150 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

SMD150/33 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

SMDH160 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

SMD185 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

SMD200 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

SMD250 8.00 9.40 3.00 6.0 6.71 0.56 0.71 0.56 0.71 3.68 3.94 0.66 1.37 0.43 S7

(0.315) (0.370) (0.118) (0.24) (0.264) (0.022) (0.028) (0.022) (0.028) (0.145) (0.155) (0.026) (0.054) (0.017)

Telecom Surface-mount

TSL250-080 6.7 7.9 2.7 3.7 4.8 5.3 0.20 0.38 0.20 0.3 2.5 3.1

(0.265) (0.310) (0.11) (0.145) (0.19) (0.21) (0.008) (0.015) (0.008) (0.012) (0.100) (0.120)

TS250-130 8.5 9.4 3.4 7.4 0.3 3.8

(0.335) (0.370) (0.135) (0.290) (0.011) (0.0150)

TSV250-130 6.1 6.9 3.2 0.56 1.9 1.6 2.31

(0.240) (0.270) (0.126) (0.022) (0.075) (0.065) (0.091)

TS600-170 18.2 19.4 11.5 12.3 7.21 8.3 1.61 2.4 9.9 10.4 1.5 2.3

(0.720) (0.765) (0.455) (0.485) (0.325) (0.325) (0.065) (0.095) (0.390) (0.410) (0.060) (0.090)

TS600-170 18.2 19.4 11.5 12.3 7.21 8.3 1.61 2.4 9.9 10.4 1.5 2.3

(0.720) (0.765) (0.455) (0.485) (0.325) (0.325) (0.065) (0.095) (0.390) (0.410) (0.060) (0.090)

Figures S11–S18. Typical Time-to-trip Curves at 20°C for Surface-mount Devices

10010

Fault current (A)

Time-to-trip (s)

10.1

0.001

0.01

0.1

196 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

nanoSMD (data at 25°C)

A = nanoSMDM050

B = nanoSMDM075

C = nanoSMDM100

D = nanoSMDC150

Telecom and Networking Devices

A = TS600-170/TS600-200

B = TS250-130

C = TSV250-130

D = TSL250-080

0.001

0.1 1 10 100

Fault current (A)

BCD

Time-to-trip (s)

0.01

0.1

100

ABCDE

microSMD

A = microSMD005

B = microSMD035

C = microSMD050

D = microSMD075

E = microSMD110

F = microSMD150

Figure S13

Figure S12

0.00 0.50 1.00 1.50 2.00 2.50 3.00

100

0.10

0.01

Time-to-trip (s)

Fault current (A)

Figure S11

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 197

miniSMDM (data at 25°C)

A = miniSMDM075

B = miniSMDM075/24

C = miniSMDM110

D = miniSMDM110/16

E = miniSMDM160

F = miniSMDM200

G = miniSMDM260

Figures S11–S18. Typical Time-to-trip Curves at 20°C for Surface-mount Devices continued

midSMD

A = SMD030-2018

B = SMD100-2018

C = SMD150-2018

D = SMD200-2018

miniSMDC and miniSMDE

A = miniSMDC014

B = miniSMDC020

C = miniSMDC050

D = miniSMDC075

E = miniSMDC110

F = miniSMDC125

G = miniSMDC150

H = miniSMDC200

I = miniSMDE190

J = miniSMDC260

0.001

110

100

Fault current (A)

Time-to-trip (s)

0.01

0.1

100

ABC

Figure S14

0.001

0.1 1 10 100

Fault current (A)

AB C D E FG

Time-to-trip (s)

0.01

0.1

100 HIJ

Figure S15

ABCD

0.001

0.1 1 10 100

Fault current (A)

Time-to-trip (s)

0.01

0.1

100

Figure S16

Surface-mount

198 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

SMD

A = SMD030

B = SMD050

C = SMD075

D = SMD100 and 100/33

E = SMD125

F = SMD260 and SMD260RB

G = SMD300

Figures S11–S18. Typical Time-to-Trip Curves at 20°C for Surface-mount Devices

SMD2

A = SMD150 and 150/33

B = SMDH160

C = SMD185

D = SMD200

E = SMD250

0.001

0.1 1 10 100

Fault current (A)

BC D

Time-to-trip (s)

0.01

0.1

100 AEFG

Figure S17

0.001

0.1 1 10 100

Fault current (A)

Time-to-trip (s)

0.01

0.1

100

ACBDE

Figure S18

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 199

Table S5. Physical Characteristics and Environmental Specifications for Surface-mount Devices

Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH160

Physical Characteristics

Terminal pad material Solder-plated copper for nanoSMDC, microSMD, and miniSMDC series

Gold plating for nanoSMDM, and miniSMDM series

98% tin for SMD series

Soldering characteristics ANSI/J-STD-002 Category 3 for nanoSMDC, nanoSMDM, microSMD, miniSMDC, and miniSMDM series

ANSI/J-STD-002 Category 1 for SMD series

Solder heat withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A

Flammability resistance per IEC 695-2-2 Needle Flame Test for 20 sec.

Recommended storage 40°C max, 70% R.H. max; devices may not meet

conditions specified ratings if storage conditions are exceeded.

Environmental Specifications

Test Test Method Conditions Resistance Change

Passive aging Raychem PS300, Section 5.3.2 60°C, 1000 hours ±3% typical

85°C, 1000 hours ±5% typical

Humidity aging Raychem PS300, Section 5.3.1 85°C, 85% RH, 100 hours ±1.2% typical

Thermal shock MIL-STD-202, Method 107G 85°C, -40°C (20 times) -33% typical

125°C, -55°C (10 times) -33% typical

Vibration MIL-STD-883C per MIL-STD-883C No change

Solvent resistance Raychem PS300, Section 5.2.2 Freon No change

Trichloroethane No change

Hydrocarbons No change

Agency Recognition for Surface-mount Devices*

UL File # E74889 for all surface-mount devices

CSA File # CA78165 for SMD/miniSMDC/miniSMDM/microSMD/nanoSMDC/nanoSMDM series

TÜV Certificate # R9872048 for microSMD/miniSMDC/miniSMDM series

Certificate # R2172061 for nanoSMDM/nanoSMDC series

Certificate # R9872049 for SMD series

*Refer to Telecom and Networking section for agency recognition on Telecom and Networking Surface Mount Devices

Surface-mount

200 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Table S6. Packaging and Marking Information for Surface-mount Devices

Recommended Pad Layout Figures [mm (In.)]

Tape & Reel Standard Part Dimension Dimension Dimension Agency

Part Number Quantity Package Marking A (Nom.) B (Nom.) C (Nom.) Recognition

nanoSMD

nanoSMDM050 3,000 15,000 050 1.80 (0.071) 1.00 (0.039) 1.5 (0.059) UL, CSA, TÜV

nanoSMDM075 3,000 15,000 075 1.80 (0.071) 1.00 (0.039) 1.5 (0.059) UL, CSA, TÜV

nanoSMDM100 3,000 15,000 100 1.80 (0.071) 1.00 (0.039) 1.5 (0.059) UL, CSA, TÜV

nanoSMDC150 3,000 15,000 J1.60 (0.063) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD

microSMD005 4,000 20,000 05 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD035 4,000 20,000 32.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD050 4,000 20,000 50 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD075 4,000 20,000 75 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD110 4,000 20,000 11 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

microSMD150 4,000 20,000 15 2.50 (0.098) 1.00 (0.039) 2.00 (0.079) UL, CSA, TÜV

miniSMD

miniSMDC014 2,000 10,000 14 3.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDC020 2,000 10,000 23.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, TÜV

miniSMDC050 2,000 10,000 53.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDC075 2,000 10,000 73.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDM075 3,000 15,000 075 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDM075/24 3,000 15,000 075G 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDC110 2,000 10,000 13.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDM110 3,000 15,000 110 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDM110/16 3,000 15,000 110G 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDC125 2,000 10,000 12 3.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDC150 2,000 10,000 15 3.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDM160 3,000 15,000 160 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDC200 2,000 10,000 20 3.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDM200 3,000 15,000 200 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

miniSMDC260 1,500 7,500 26 3.15 (0.124) 1.78 (0.070) 3.45 (0.136) UL, CSA, TÜV

miniSMDM260 3,000 15,000 260 3.20 (0.126) 1.50 (0.059) 2.50 (0.098) UL, CSA, TÜV

midSMD

SMD030-2018 4,000 20,000 A03 4.6 (0.18) 1.50 (0.059) 3.4 (0.134) UL

SMD100-2018 4,000 20,000 A10 4.6 (0.18) 1.50 (0.059) 3.4 (0.134) UL, CSA, TÜV

SMD150-2018 4,000 20,000 A15 4.6 (0.18) 1.50 (0.059) 3.4 (0.134) UL, CSA, TÜV

SMD200-2018 4,000 20,000 A20 4.6 (0.18) 1.50 (0.059) 3.4 (0.134) UL, CSA, TÜV

SMD

SMD030 2,000 10,000 030 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD050 2,000 10,000 050 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD075 2,000 10,000 075 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD100 2,000 10,000 100 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD100/33 2,000 10,000 103 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD125 2,000 10,000 125 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD260 2,000 10,000 260 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD260-RB 2,000 10,000 260 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

SMD300 2,000 10,000 300 3.1 (0.12) 2.3 (0.09) 5.1 (0.201) UL, CSA, TÜV

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 201

Table S6. Packaging and Marking Information for Surface-mount Devices continued

Recommended Pad Layout Figures [mm (In.)]

Tape & Reel Standard Part Dimension Dimension Dimension Agency

Part Number Quantity Package Marking A (Nom.) B (Nom.) C (Nom.) Recognition

SMD2

SMD150 1,500 7,500 150 4.6 (0.18) 2.3 (0.09) 6.1 (0.240) UL, CSA, TÜV

SMD150/33 1,500 7,500 153 4.6 (0.18) 2.3 (0.09) 6.1 (0.240) UL, CSA, TÜV

SMDH160 1,500 7,500 160 4.6 (0.18) 2.3 (0.09) 6.1 (0.240)

SMD185 1,500 7,500 185 4.6 (0.18) 2.3 (0.09) 6.1 (0.240) UL, CSA, TÜV

SMD200 1,500 7,500 200 4.6 (0.18) 2.3 (0.09) 6.1 (0.240) UL, CSA, TÜV

SMD250 1,500 7,500 250 4.6 (0.18) 2.3 (0.09) 6.1 (0.240) UL, CSA, TÜV

miniSMDE

miniSMDE190 5,000 20,000 19 4.75 (0.187) 1.45 (0.057) 9.57 (0.377) UL, CSA, TÜV

Telecom Surface-mount

TSL250-080 1,500 7,500 T08 3.6 (0.14) 1.8 (0.07) 5.5 (0.22) UL, CSA, TÜV

TS250-130 1,500 7,500 T13 4.6 (0.18) 1.8 (0.07) 6.1 (0.24) UL, CSA, TÜV

TSV250-130 1,200 6,000 T13V * * * UL, CSA, TÜV

TS600-170 300 900 T20 9.91 (0.390) 3.30 (0.130) 3.35 (0.132) UL, CSA

TS600-200-RA 300 900 T20 9.91 (0.390) 3.30 (0.130) 3.35 (0.132) UL, CSA

*For TSV250-130 pad layout, see Telecom and Networking Section

Figure S19. Recommended Pad Layout

TS250

Product series

-130

Hold current (mA)

-RA

Rx - Resistance range (Optional)

-B-0.5

Bxx = Resistance matched (Optional)

-2

2 = Tape and reel packaging

SMD

Product series

150

Hold current indicator

/33

Alternative voltage rating (If applicable)

-RB

Rx - Resistance range (Limited part number availability)

-2

2 = Tape and reel packaging

Part Numbering System

Surface-mount

202 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

Solder Reflow and Rework Recommendations for Surface-mount Devices

Solder Reflow

•Recommended reflow methods:

IR, Vapor phase, and hot air

oven.

•The following product series are

not designed to be wave soldered

to circuit boards:

nanoSMDM

miniSMDM

midSMD

SMD

SMD2

•The following product series are

designed to be wave soldered

to circuit boards:

nanoSMDC

microSMD

miniSMDC, miniSMDE

•Recommended maximum paste

thickness for the microSMD,

miniSMDC, and miniSMDE

devices is 0.25 mm (10mils).

•Devices can be cleaned using

standard methods and solvents.

Rework

•Use standard industry practices

for the nanoSMDC,

nanoSMDM, microSMD,

miniSMDC, miniSMDM, and

miniSMDE devices.

•For SMD and midSMD series

and all TS devices rework

should be confined to removal

of the installed product and

replacement with a fresh

device.

Caution:

•If reflow temperatures exceed the recommended profile, devices may

not meet the performance specifications.

Preheating

100

150

200

250

300

10 to 20

Temperature (°C)

Soldering Cooling

120

30 to 90

Time(s)

Figure S20

Raychem Circuit Protection Devices PolySwitch Surface-mount Resettable Devices 203

Table S7. Tape and Reel Specifications for Surface-mount Devices (in Millimeters)

nanoSMDC miniSMDC

nanoSMDM microSMD miniSMDM miniSMDE190 midSMD SMD SMD2

EIA 481-1 EIA 481-1 EIA 481-1 EIA 481-2 EIA 481-2 EIA 481-2 EIA 481-2

W 8.0 ± 0.30 8.0 ± 0.30 12.0 ± 0.30 24.0 ± 0.30 16.0 ± 0.30 16.0 ± 0.30 16.0 ± 0.30

Po4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10 4.0 ± 0.10

P14.0 ± 0.10 4.0 ± 0.10 8.0 ± 0.10 8.0 ± 0.10 8.0 ± 0.10 8.0 ± 0.10 12.0 ± 0.10

P22.0 ± 0.05 2.0 ± 0.05 2.0 ± 0.05 2.0 ± 0.10 2.0 ± 0.10 2.0 ± 0.10 2.0 ± 0.10

AoTable S7a 2.95 ± 0.10 Table S7b 5.70 ± 0.10 5.11 ± 0.15 5.6 ± 0.23 6.9 ±0.23

BoTable S7a 3.58 ± 0.10 Table S7b 11.90 ± 0.10 5.6 ± 0.23 8.1 ± 0.15 9.6 ± 0.15

B1max. 4.35 4.35 8.2** 20.1 12.1 12.1 12.1

Do1.5 + 0.10/ -.00 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00

F 3.5 ± 0.05 3.5 ± 0.05 5.5 ± 0.05 11.5 ± 0.10 7.5 ± 0.10 7.5 ± 0.10 7.5 ± 0.10

E11.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10

E2min. 6.25 6.25 10.25 22.25 14.25 14.25 14.25

T max. 0.6 0.6 0.6 0.6 0.6 0.6 0.6

T1max. 0.1 0.1 0.1 0.1 0.1 0.1 0.1

KoTable S7a 0.80 ± 0.10* Table S7b 0.95 ± 0.10 1.8 ± 0.15 3.2 ± 0.15 3.4 ± 0.15

Leader min. 390*** 390 390*** 400 400 400 400

Trailer min. 160*** 160 160*** 160 160 160 160

*1.1±0.05 for microSMD150

**5.9 for miniSMDM

***200 for nanoSMDM, miniSMDM

Table S7c. Reel Dimensions for Surface-mount Devices

nanoSMDC

nanoSMDM microSMD miniSMDC miniSMDM miniSMDE190 midSMD SMD SMD2

A max. 185 185 185 340 609 609 609 609

N min. 50 50 50 50 60 50 50 50

W18.5 + 1.5/-.00 8.4 + 1.5/-.00 12.4 + 2.0/-.00 12.4 + 2.0/-.00 24.4 + 2.0/-.00 16.4 + 2.0/-.00 16.4 + 2.0/-.00 16.4 + 2.0/-.00

W2max. 14.4 14.4 18.4 18.4 30.4 22.4 22.4 22.4

Table S7a

nanoSMDC150 nanoSMDM

Ao2.3 ± 0.10 1.88 ± 0.10

Bo3.5 ± 0.10 3.5 ± 0.10

Ko1.45 ± 0.10 1.4 ± 0.10

Table S7b

miniSMDC miniSMDC260 miniSMDM

Ao3.5 ± 0.23 3.7 ± 0.10 3.5 ± 0.23

Bo5.1 ± 0.15 4.9 ± 0.10 5.1 ± 0.15

Ko0.9 ± 0.15 1.4 ± 0.10 2.3 ± 0.15

Surface-mount

204 PolySwitch Surface-mount Resettable Devices Raychem Circuit Protection Devices

W2 (measured at hub)

W1 (measured at hub)

N (hub dia.)

Cover tape

Embossed cavity

Carrier tape

Figure S22. EIA Reel Dimensions

Latest Information

•Please visit us at www.circuitprotection.com or contact your local representative for the latest information.

•The information in this data package contains some preliminary information. Raychem Circuit Protection, a

division of Tyco Electronics, reserves the right to change any of the specifications without notice. In addition,

Tyco Electronics reserves the right to make changes—without notification to Buyer—to materials or processing

that do not affect compliance with any applicable specification.

Cover tape

Center lines

of cavity

D0P2

Embossment

•Operation beyond the maximum ratings or improper use may result in device damage and possible electrical

arcing and flame.

•The devices are intended for protection against occasional overcurrent or overtemperature fault conditions

and should not be used when repeated fault conditions or prolonged trip events are anticipated.

•Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely

impact the perfomance of the devices.

•Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended

electronic, thermal, and mechanical procedures for electronic components.

•Operation in circuits with a large inductance can generate a circuit voltage (L di/dt) above the rated voltage of

the PolySwitch resettable device.

WARNING:

Figure S21. EIA Taped Component Dimensions