©2008 SCILLC. All rights reserved. Publication Order Number:
June 2008 – Rev. 4 AMIS30624/D
AMIS-30624
I2C Micro-stepping Motor Driver
1.0 General Description
The AMIS-30624 is a single-chip micro-stepping motor driver with a position controller and control/diagnostic interface. It is ready to
build intelligent peripheral systems where up to 32 drivers can be connected to one I2C master. This significantly reduces system
complexity.
The chip receives positioning instructions through the bus and subsequently drives the stator coils so the two-phase stepper motor
moves to the desired position. The on-chip position controller is configurable (OTP or RAM) for different motor types, positioning ranges
and parameters for speed, acceleration and deceleration. Micro-stepping allows silent motor operation and increased positioning
resolution. The advanced motion qualification mode enables verification of the complete mechanical system in function of the selected
motion parameters. The AMIS-30624 can easily be connected to an I2C bus where the I2C master can fetch specific status information
like actual position, error flags, etc. from each individual slave node.
An integrated sensorless stall detection stops the motor when running into stall. This enables silent, yet accurate position calibrations
during a referencing run and allows semi-closed loop operation when approaching the mechanical end-stops.
The chip is implemented in I2T100 technology, enabling both high voltage analog circuitry and digital functionality on the same chip.
The AMIS-30624 is fully compatible with the automotive voltage requirements.
2.0 Product Features
Motor Driver
Micro-stepping technology
Sensorless stall detection
Peak current up to 800mA
Fixed frequency PWM current-control
Selectable PWM frequency
Automatic selection of fast and slow decay mode
No external fly-back diodes required
14V/24V compliant
Motion qualification mode
Controller with RAM and OTP memory
Position controller
Configurable speeds and acceleration
Input to connect optional motion switch
I2C interface
Bi-directional 2-wire bus for Inter IC Control
Field programmable node addresses
Full diagnostics and status information
Protection
Over-current protection
Under-voltage management
Open circuit detection
High-temp warning and management
Low-temp flag
EMI compatibility
High voltage outputs with slope control
HV outputs with slope control
AMIS-30624
3.0 Applications
The AMIS-30624 is ideally suited for small positioning applications. Target markets include: automotive (headlamp alignment, HVAC,
idle control, cruise control), industrial equipment (lighting, fluid control, labeling, process control, XYZ tables, robots) and building
automation (HVAC, surveillance, satellite dish, renewable energy systems). Suitable applications typically have multiple axes or require
mechatronic solutions with the driver chip mounted directly on the motor.
4.0 Ordering Information
Table 1: Ordering Information
Part Number Package Shipping Configuration Temperature Range Peak Current
AMIS30624C6244G SOIC-20 Tube/Tray -40°C…..125°C 800mA
AMIS30624C6244RG SOIC-20 Tape & Reel -40°C…..125°C 800mA
AMIS30624C6245G NQFP-32 (7 x 7 mm) Tube/Tray -40°C…..125°C 800mA
AMIS30624C6245RG NQFP-32 (7 x 7 mm) Tape & Reel -40°C…..125°C 800mA
5.0 Quick Reference Data
Table 2: Absolute Maximum Ratings
Parameter Min. Max. Unit
Vbb Supply voltage -0.3 +40
(1) V
Tamb Ambient temperature under bias (2) -50 +150 °C
Tst Storage temperature -55 +160 °C
Vesd (3) Electrostatic discharge voltage on pins -2 +2 kV
Notes:
(1) For limited time <0.5s
(2) The circuit functionality is not guaranteed.
(3) Human body model (100pF via 1.5 k, according to JEDEC EIA-JESD22-A114-B)
Table 3: Operating Ranges
Parameter Min. Max. Unit
Vbb Supply voltage +8 +29 V
Vbb 18V -40 +125 °C
Top Operating temperature range Vbb 29V -40 +85 °C
Rev. 4 | Page 2 of 56 | www.onsemi.com
AMIS-30624
6.0 Block Diagram
Figure 1: Block Diagram
I2C-bus
Interface
Oscillator
Vref Temp
sense
Voltage
Regulator
TST2
VBB VDD GND
MOTXP
MOTXN
Main Control
Registers
OTP - ROM
4 MHz
Charge Pump
CPN CPP VCP
Stall detection
Position
Controller
Controller
TST1
MOTYP
MOTYN
PWM
regulator
Y
I-sense
PWM
regulator
X
I-sense
Decoder
Sinewave
Table
DAC's
AMIS-30624
HW
SWI
SDA SCK
PC20060925.1
Rev. 4 | Page 3 of 56 | www.onsemi.com
AMIS-30624
7.0 Pin Out
Figure 2: SOIC 20 and NQFP-32 Pi n-out
17
18
19
201
2
3
4
SDA
GND
SWI
GND
SCK
MOTXP
VBB
VDD
16
15
14
13
12
11
AMIS-30624
PC20060925.2
5
6
7
8
9
10
GND GND
MOTXN
MOTYP
MOTYN
TST1
TST2
HW
CPN
CPP
VBB
VCP
1
2
3
5
4
6
7
8
24
23
22
20
21
19
18
17
9 10111213141516
32 31 30 29 28 27 26 25
XP
VBB
SWI
NC
SDA
XP
VBB
VBB
CPN
CPP
VCP
YN
VBB
YN
VBB
VBB
YP
XN
GND
GND
XN
YP
GND
GND
SCK
VDD
GND
TST1
TST2
HW
GND
NC
AMIS-30624
Top view
NQ32 PC20050925.3
Table 4: Pin Description
Pin Name Pin Description SOIC-20 NQFP-32
SDA I2C serial data line 1 8
SCK I2C serial clock line 2 9
VDD Internal supply (needs external decoupling capacitor) 3 10
GND Ground, heat sink 4,7,14,17 11, 14, 25, 26, 31, 32
TST1 Test pin (to be tied to ground in normal operation) 5 12
TST2 Test pin (to be left open in normal operation: internally pulled up) 6 13
HW Hard wired address bit 8 15
CPN Negative connection of pump capacitor (charge pump) 9 17
CPP Positive connection of pump capacitor (charge pump) 10 18
VCP Charge-pump filter-capacitor 11 19
VBB Battery voltage supply 12,19 3, 4, 5, 20, 21, 22
MOTYN Negative end of phase Y coil 13 23, 24
MOTYP Positive end of phase Y coil 15 27, 28
MOTXN Negative end of phase X coil 16 29, 30
MOTXP Positive end of phase X coil 18 1, 2
SWI Switch input 20 6
NC Not connected (to be tied to ground) 7, 16
Rev. 4 | Page 4 of 56 | www.onsemi.com
AMIS-30624
8.0 Package Thermal Resistance
8.1 SOIC-20
To lower the junction-to-ambient thermal resistance, it is recommended to connect the ground leads to a printed circuit board (PCB)
ground plane layout as illustrated in Figure 3. The junction-to-case thermal resistance is dependent on the copper area, copper
thickness, PCB thickness and number of copper layers. Calculating with a total area of 460 mm2, 35µm copper thickness, 1.6mm PCB
thickness and 1 layer, the thermal resistance is 28°C/W; leading to a junction-ambient thermal resistance of 63°C/W.
Figure 3: PCB Ground Plane Layout Condition
8.2 NQFP-32
The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package
partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away
from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 4, the thermal
resistance junction – to – ambient can be brought down to a level of 25°C/W.
Figure 4: PCB Ground Plane Layout Condition
SOIC-20
PC20041128.1
NQFP-32
PC20041128.2
Rev. 4 | Page 5 of 56 | www.onsemi.com
AMIS-30624
9.0 DC Parameters
The DC parameters are given for Vbb and temperature in their operating ranges. Currents flowing in the circuit are defined as positive.
Table 5: DC Parameters
Symbol Pin(s) Parameter Test Conditions Min. Typ. Max. Unit
Motor Driver
IMSmax,Peak Max. current through motor coil
in normal operation 800 mA
IMSmax,RMS Max. RMS current through coil in normal
operation 570 mA
IMSabs Absolute error on coil current -10 10 %
IMSrel Error on current ratio Icoilx / Icoily -7 7 %
Vbb = 12V, Tj = 50 °C 0.50 1 Ω
Vbb = 8V, Tj = 50 °C 0.55 1 Ω
Vbb = 12V, Tj = 150 °C 0.70 1 Ω
RDSon On resistance for each motor pin
(including bond wire) at IMSmax
Vbb = 8V, Tj = 150 °C 0.85 1 Ω
IMSL
MOTXP
MOTXN
MOTYP
MOTYN
Pull down current HiZ mode 2 mA
Thermal Warning & Shutdown
Ttw Thermal warning 138 145 152 °C
Ttsd
(1) (2) Thermal shutdown Ttw + 10 °C
Tlow (2)
Low temperature warning Ttw - 155 °C
Supply and Voltage Regulator
Tamb 125 °C 6.5 18 V
Vbb Nominal operating supply range Tamb 85 °C 6.5 29 V
VbbOTP Supply voltage for OTP zapping (3) 9.0 10.0 V
Ibat Total current consumption Unloaded outputs 3.50 10.0 mA
Ibat_s Sleep mode current consumption 50 100 µA
UV1 Stop voltage high threshold 7.8 8.4 8.9 V
UV2
VBB
Stop voltage low threshold 7.1 7.5 8.0 V
Vdd Internal regulated output (4) 8V < Vbb < 29V 4.75 5 5.50 V
IddStop Digital current consumption Vbb < UV2 2 mA
VddReset Digital supply reset level @ power down
(5) 4.5 V
IddLim
VDD
Current limitation Pin shorted to ground 42 mA
Switch Input and Hardwire Address Input
Rt_OFF Switch OFF resistance (6) 10 kΩ
Rt_ON Switch ON resistance (6) Switch to Gnd or Vbat, 2
kΩ
Vbb_sw Vbb range for guaranteed operation of
SWI and HW 6 29 V
Vmax_sw Maximum voltage T < 1s 40V V
Ilim_sw
SWI
HW
Current limitation Short to Gnd or Vbat 30 mA
I2C Serial Interface
VIL Input level low (7) - 0.5 0.3 * Vdd V
VIH Input level high (8) 0.7 * Vdd Vdd + 0.5 V
VnL Noise margin at the LOW level for each
connected device (including hysteresis) 0.1 * Vdd V
VnH
SDA
SCK
Noise margin at the HIGH level for each
connected device (including hysteresis) 0.2 * Vdd
Rev. 4 | Page 6 of 56 | www.onsemi.com
AMIS-30624
Table 5: DC Parameters (cont.)
Charge Pump
Vbb > 15V Vbb+10 Vbb+12.5 Vbb+15 V
Vcp Output voltage 8V < Vbb < 15V 2 * Vbb – 5 2 * Vbb – 2.5 2 * Vbb V
Cbuffer
VCP
External buffer capacitor 220 470 nF
Cpump CPP CPN External pump capacitor 220 470 nF
Motion Qualification Mode Output
VOUT Output voltage swing TestBemf I2C command 0 - 4,85 V
ROUT Output impedance Service mode I2C command 2 kΩ
Av
SWI
Gain = VSWI / VBEMF Service mode I2C command 0,50
Notes:
(1) No more than 100 cumulated hours in life time above Ttsd.
(2) Thermal shutdown and a low temperature warning are derived from thermal warning.
(3) A 10μF buffer capacitor of between VBB and GND is the minimum needed. Short connections to the power supply are recommended.
(4) Pin VDD must not be used for any external supply
(5) The RAM content will not be altered above this voltage.
(6) External resistance value seen from pin SWI or HW, including 1kΩ series resistor.
(7) If input voltages < - 0.3V, than a resistor between 22Ω to 100Ω needs to be put in series
(8) If the I2C-bus is operated in Fast Mode VIHmin = 0.7 * Vdd
Rev. 4 | Page 7 of 56 | www.onsemi.com
AMIS-30624
10.0 AC Parameters
The AC parameters are given for Vbb and temperature in their operating ranges. All timing values of the I2C transceiver are referred to
VIHman and VILmax levels (see Figure 5).
Table 6: AC Parameters
Symbol Pin(s) Parameter Test Conditions Min. Typ. Max. Unit
Power-up
Tpu Power-up time Guaranteed by design 10 ms
Internal Oscillator
fosc Frequency of internal oscillator 3.6 4.0 4.4 MHz
I2C Transceiver (Generic)
CB Capacitive load of each bus line 400 (1) pF
CI Capacitance of SDA / SCK pin 10 pF
tSP
SDA
SCK Pulse width of spikes which must be
suppressed by the input filter 50 ns
I2C Transceiver (Standard Mode)
fSCL SCL clock frequency 100 kHz
tHD,START
Hold time (repeated) START condition.
After this period the first clock pulse is
generated.
4.0 µs
tLOW LOW period of the SCK clock 4.7 µs
tHIGH HIGH period of the SCK clock 4.0 µs
tSU,START Set-up time for a repeated START
condition 4.7 µs
tHD,DATA Data hold time for I2C bus devices 0 (2) 3.45 (3) µs
tSU,DATA Data set-up time 250 ns
tR Rise time of SDA and SCK signals 1.0 µs
tF Fall time of SDA and SCK signals 0.3 µs
tSU,STOP Set-up time for STOP condition 4.0 µs
tBUF
SDA
SCK
Bus free time between STOP and
START condition 4.7 µs
I2C Transceiver (Fast Mode)
fSCL SCL clock frequency 360 kHz
tHD,START
Hold time (repeated) START condition.
After this period the first clock pulse is
generated.
0.6 µs
tLOW LOW period of the SCK clock 1.3 µs
tHIGH HIGH period of the SCK clock 0.6 µs
tSU,START Set-up time for a repeated START
condition 0.6 µs
tHD,DATA Data hold time for I2C bus devices 0 (2) 0.9 (3) µs
tSU,DATA Data set-up time 100 (4) ns
tR Rise time of SDA and SCK signals 20 + 0.1CB 300 ns
tF Fall time of SDA and SCK signals 20 + 0.1CB 300 ns
tSU,STOP Set-up time for STOP condition 0.6 µs
tBUF
SDA
SCK
Bus free time between STOP and
START condition 1.3 µs
Rev. 4 | Page 8 of 56 | www.onsemi.com
AMIS-30624
Table 6: AC Parameters (cont.)
Switch Input and Hardwire Address Input
Tsw Scan pulse period (5) 1024 µs
Tsw_on SWI HW2 Scan pulse duration 128 µsµs
Motor driver
PWMfreq = 0 (6) 20.6 22.8 25.0 kHz
Fpwm PWM frequency
(5) PWMfreq = 1 (6) 41,2 45,6 50,0 kHz
Fjit_depth PWM jitter modulation depth PWMJen = 1 (6) 10 %
Tbrise Turn-on transient time 170 ns
Tbfall Turn-off transient time Between 10% and 90% 140 ns
Tstab
MOTxx
Run current stabilization time 29 32 35 ms
Charge Pump
fCP CPN CPP Charge pump frequency (5) 250 kHz
Notes:
(1) The maximum number of connected I2C devices is dependent on the number of available addresses and the maximum bus capacitance to still guarantee the rise
and fall times of the bus signals.
(2) An I2C device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the
falling edge of SCL.
(3) The maximum tHD,DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal.
(4) A Fast-mode I2C-bus device can be used in a standard-mode I2C bus system, but the requirement tSU,DATA 250ns must than be met. This will automatically be the
case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data
bit to the SDA line trmax + tSU,DATA = 1000 + 250 = 1250ns (according to the standard-mode I2C-bus specification) before the SCL line is released.
(5) Derived from internal oscillator.
(6) See SetMotorParam and PWM regulator.
Figure 5: I2C Timing Diagrams
SDA
SCK
tF
tHD,START
tLOW
tR
tHD,DATA
tSU,DATA
tHIGH
START REPEATED START
tSU,START tSP tSU,STOP
tBUF
START
STOP
PC20060925.8
VIHmin
VILmax
Rev. 4 | Page 9 of 56 | www.onsemi.com
AMIS-30624
11.0 Typical Application
AMIS-30624
VBAT
2
MOTXP
PC20060925.5
100 nF
MOTXN
MOTYP
MOTYN
11
VDD
VBB
12
VCP
SWI
CPP
CPN
9
8
SDA
SCK
10
HW
18
M
16
15
13
203
VBB
19
1
100 nF
220 nF
220 nF
1 kΩ
Connect
to VBAT
or GND
Connect
to VBAT
or GND
1 kΩ
100 μF
R2
C5C6
C3
C4
C1
C2
1 μF
GND
714 17
TST2
TST1
6
54
R1
I2C
bus
Figure 6: Typical Application Diagram
Notes:
(1) All resistors are ± 5%, ¼ W.
(2) Depending on the application, the ESR value and working voltage of C1 must be carefully chosen.
(3) C2 must be a ceramic capacitor to assure low ESR.
(4) C3 and C4 must be as close as possible to pins CPN, CPP, VCP, and VBB to reduce EMC radiation.
(5) C5 and C6 must be close to pins VBB and GND.
12.0 Positioning Parameters
12.1 Stepping Modes
One of four possible stepping modes can be programmed:
Half stepping
1/4 micro-stepping
1/8 micro-stepping
1/16 micro-stepping
Rev. 4 | Page 10 of 56 | www.onsemi.com
AMIS-30624
12.2 Maximum Velocity
For each stepping mode, the maximum velocity Vmax can be programmed to 16 possible values given in
uring a motion the
pplication must take care that the new Vmax parameter stays within the same group, otherwise steps might be lost.
Tabl Velocity Selection Table
Table 7.
The accuracy of Vmax is derived from the internal oscillator. Under special circumstances it is possible to change the Vmax parameter
while a motion is ongoing. All 16 entries for the Vmax parameter are divided into four groups. When changing Vmax d
a
e 7: Maximum
Vmax Index Stepping Mode
Hex Dec
Vmax
(Full-step/s) Group Half stepping
(Half /s) -step
1/4th
Micro-stepping
(Mic p/s) ro-ste
1/8th
Micro-stepping
(Micr p/s) o-ste
1/16th
Micro-stepping
(Micro-step/s)
0 0 99 A 197 395 790 1579
1 1 136 273 546 1091 2182
2 2 167 334 668 1335 2670
3 3 197 395 790 1579 3159
4 4 213 425 851 1701 3403
5 5 228 456 912 1823 3647
6 6 243
B
486 973 1945 3891
7 7 273 546 1091 2182 4364
8 8 303 607 1213 2426 4852
9 9 334 668 1335 2670 5341
A 10 364 729 1457 2914 5829
B 11 395 790 1579 3159 6317
C 12 456
C
912 1823 3647 7294
D 13 546 1091 2182 4364 8728
E 14 729 1457 2914 5829 11658
F 15 973
D
1945 3891 7782 15564
12.3 Minimum Velocity
y of Vmin is derived from the internal oscillator.
Ta ble Values in Full-step/s for the Minimum Velocity
Once the maximum velocity is chosen, 16 possible values can be programmed for the minimum velocity Vmin.
Table 8 provides the obtainable values in full-step/s. The accurac
ble 8: Obtaina
Vmax (Full-step/s)
Vmin Index A B C D
Hex
Vmax
Fa
Dec ctor 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729 973
0 0 1 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729 973
1 1 1/32 3 4 5 6 6 7 7 8 8 10 10 11 13 15 19 27
2 2 2/32 6 8 10 11 12 13 14 15 17 19 21 23 27 31 42 57
3 3 3/32 9 12 15 18 19 21 22 25 27 31 32 36 42 50 65 88
4 4 4/32 12 16 20 24 26 28 30 32 36 40 44 48 55 65 88 118
5 5 5/32 15 21 26 31 32 35 37 42 46 51 55 61 71 84 111 149
6 6 6/32 18 25 31 36 39 42 45 50 55 61 67 72 84 99 134 179
7 7 7/32 21 30 36 43 46 50 52 59 65 72 78 86 99 118 156 210
8 8 8/32 24 33 41 49 52 56 60 67 74 82 90 97 113 134 179 240
9 9 9/32 28 38 47 55 59 64 68 76 84 93 101 111 128 153 202 271
A 10 10/32 31 42 51 61 66 71 75 84 93 103 113 122 141 168 225 301
B 11 11/32 34 47 57 68 72 78 83 93 103 114 124 135 156 187 248 332
C 12 12/32 37 51 62 73 79 85 91 101 113 124 135 147 170 202 271 362
D 13 13/32 40 55 68 80 86 93 98 111 122 135 147 160 185 221 294 393
E 14 14/32 43 59 72 86 93 99 106 118 132 145 158 172 198 237 317 423
F 15 15/32 46 64 78 93 99 107 113 128 141 156 170 185 214 256 340 454
Notes:
(1) The Vmax factor is an approximation.
(2) In case of motion without acceleration (AccShape = 1) the length of the steps = 1/Vmin. In case of accelerated motion (AccShape = 0) the length of the first step
is shorter than 1/Vmin depending of Vmin, Vmax and Acc.
Rev. 4 | Page 11 of 56 | www.onsemi.com
AMIS-30624
12.4 Acceleration and Deceleration
Sixteen possible values can be programmed for Acc (acceleration and deceleration between Vmin and Vmax). Table 9 provides the
obtainable values in full-step/s². One observes restrictions for some combination of acceleration index and maximum speed (gray cells).
The accuracy of Acc is derived from the internal oscillator.
Table 9: Acceleration and Deceleration Selection Table
Vmax (FS/s) 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729 973
Acc Index
Hex Dec Acceleration (Full-step/s²)
0 0 49 106 473
1 1 218 735
2 2 1004
3 3 3609
4 4 6228
5 5 8848
6 6 11409
7 7 13970
8 8 16531
9 9 19092
A 10 21886
B 11 24447
C 12 27008
D 13 29570
E 14 34925
F 15
14785
29570 40047
The formula to compute the number of equivalent full-step during acceleration phase is:
Acc2
VminVmax
Nstep
22
×
=
12.5 Positioning
The position is programmed in the command SetPosition and is given as a number of (micro)steps. According to the chosen
stepping mode, the position word must be aligned as described in Table 10. When using command GotoSecurePosition, data is
automatically aligned.
Table 10: Position Word Alignment
Stepping Mode Position Word: Pos[15:0] Shift
1/16th S B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB No shift
1/8th S B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB 0 1-bit left ×2
1/4th S B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB 0 0 2-bit left ×4
Half-stepping S B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB 0 0 0 3-bit left ×8
PositionShort S S S B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB 0 0 0 No shift
SecurePosition S B9 B8 B7 B6 B5 B4 B3 B2 B1 LSB 0 0 0 0 0 No shift
Notes:
(1) LSB: Least significant bit
(2) S: Sign bit
Rev. 4 | Page 12 of 56 | www.onsemi.com
AMIS-30624
12.5.1. Position Ranges
A position is coded by using the binary two’s complement format. According to the positioning commands used and to the chosen
stepping mode, the position range will be as shown in Table 11.
Table 11: Position Range
Command Stepping Mode Position Range Full Range Excursion Number of Bits
Half stepping -4096 to +4095 8192 half-steps 13
1/4th micro-stepping -8192 to +8191 16384 micro-steps 14
1/8th micro-stepping -16384 to +16383 32768 micro-steps 15
SetPosition
1/16th micro-stepping -32768 to +32767 65536 micro-steps 16
SetPositionShort Half-stepping -1024 to +1023 2048 half-steps 11
When using the command SetPosition, although coded on 16 bits, the position word will have to be shifted to the left by a certain
number of bits, according to the stepping mode.
12.5.2. Secure Position
A secure position can be programmed. It is coded in 11-bits, thus having a lower resolution than normal positions, as shown in
Table 12. See also the command GotoSecurePosition.
Table 12: Secure Position
Stepping Mode Secure Position Resolution
Half-stepping 4 half-steps
1/4th micro-stepping 8 micro-steps (1/4th)
1/8th micro-stepping 16 micro-steps (1/8th)
1/16th micro-stepping 32 micro-steps (1/16th)
Important Notes:
(1) The secure position is disabled in case the programmed value is the reserved code “10000000000” (0x400 or most negative position).
(2) The resolution of the secure position is limited to 9 bit at start-up. The OTP register is copied in RAM as illustrated below. SecPos1 and SecPos0 = 0.
12.5.3. Shaft
A shaft bit which can be programmed in OTP or with command SetMotorParam, defines whether a positive motion is a clockwise or
counter-clockwise rotation (an outer or an inner motion for linear actuators):
Shaft = 0 MOTXP is used as positive pin of the X coil, while MOTXN is the negative one
Shaft = 1 opposite situation.
SecPos10
SecPos9
SecPos8
SecPos2
SecPos1
SecPos0
SecPos10
SecPos9
SecPos8
SecPos2
RAM
OTP
Rev. 4 | Page 13 of 56 | www.onsemi.com
AMIS-30624
13.0 Structural Description
See the block diagram in Figure 1.
13.1 Stepper Motor Driver
The motor driver receives the control signals from the control logic. The main features are:
Two H-bridges designed to drive a stepper motor with two separated coils. Each coil (X and Y) is driven by one H-bridge and
the driver controls the currents flowing through the coils. The rotational position of the rotor, in unloaded condition, is defined
by the ratio of current flowing in X and Y. The torque of the stepper motor when unloaded is controlled by the magnitude of the
currents in X and Y.
The control block for the H-bridges including the PWM control, the synchronous rectification and the internal current sensing
circuitry
The charge pump to allow driving of the H-bridges’ high side transistors
Two pre-scale 4-bit DACs to set the maximum magnitude of the current through X and Y
Two DACs to set the correct current ratio through X and Y
Battery voltage monitoring is also performed by this block, which provides information to the control logic part. The same applies for the
detection and reporting of an electrical problem that could occur on the coils or the charge pump.
13.2 Control Logic (Position Controller and Main Control)
The control logic block stores the information provided by the I2C interface (in a RAM or an OTP memory) and digitally controls the
positioning of the stepper motor in terms of speed and acceleration, by feeding the right signals to the motor driver state machine.
It will take into account the successive positioning commands to properly initiate or stop the stepper motor in order to reach the set
point in a minimum time.
It also receives feedback from the motor driver part in order to manage possible problems and decide on internal actions and reporting
to the I2C interface.
13.3 Motion Detection
Motion detection is based on the back emf, generated internally in the running motor. When the motor is blocked, for example when it
hits the end-position, the velocity and as a result also the generated back emf, is disturbed. The AMIS-30624 senses the back emf,
calculates a moving average and compares the value with two independent threshold levels. If the back emf disturbance is bigger than
the set threshold, the running motor is stopped.
13.4 Miscellaneous
The AMIS-30624 also contains the following:
An internal oscillator needed for the control logic and the PWM control of the motor driver
An internal trimmed voltage source for precise referencing
A protection block featuring a thermal shutdown and a power-on-reset circuit
A 5V regulator (from the battery supply) to supply the internal logic circuitry
Rev. 4 | Page 14 of 56 | www.onsemi.com
AMIS-30624
14.0 Functional Description
This chapter describes the following functional blocks in more detail:
Position controller
Main control and register, OTP memory + ROM
Motor driver
The motion detection and I2C control are discussed in separate chapters.
14.1 Position Controller
14.1.1. Positioning and Motion C ontrol
A positioning command will produce a motion as illustrated in Figure 7. A motion starts with an acceleration phase from minimum
velocity (Vmin) to maximum velocity (Vmax), and ends with a symmetrical deceleration. This is defined by the control logic according to
the position required by the application and the parameters programmed by the application during configuration phase. The current in
the coils is also programmable.
Figure 7: Positioning and Motion Control
Velocity
Vma
x
Vmin
Acceleration
range
Deceleration
range
Pstart Pstop
P=0
Position
Optional zero
switch
Zero speed
Hold current
Pmin Pmax
Zero speed
Hold current
Table 13: Position Related Parameters
Parameter Reference
Pmax – Pmin See Positioning
Zero speed hold current See Ihold
Maximum current See Irun
Acceleration and deceleration See Acceleration and deceleration
Vmin See Minimum velocity
Vmax See Maximum velocity
Rev. 4 | Page 15 of 56 | www.onsemi.com
AMIS-30624
Different positioning examples are shown in Table 14.
Table 14: Positioning Examples
Positioning Examples
Short motion
Veloci t
y
time
New positioning command in same
direction, shorter or longer, while a motion
is running at maximum velocity.
Veloci t
y
time
New positioning command in same
direction while in deceleration phase
Note: there is no wait time between the
deceleration phase and the new
acceleration phase.
Veloci t
y
time
New positioning command in reverse
direction while motion is running at
maximum velocity.
Velo ci t
y
time
New positioning command in reverse
direction while in deceleration phase.
Velo ci t
y
time
New velocity programming while motion is
running.
Velo ci ty
time
Rev. 4 | Page 16 of 56 | www.onsemi.com
AMIS-30624
14.1.2. Dual Positioning
A SetDualPosition command allows the user to perform positioning using two different velocities. The first motion is done with the
specified Vmin and Vmax velocities in the SetDualPosition command, with the acceleration (deceleration) parameter already in
RAM, to a position Pos1[15:0] also specified in SetDualPosition .
A second relative motion to a position Pos1[15:0] + Pos2[15:0] is done at the specified Vmin velocity in the SetDualPosition
command (no acceleration). Once the second motion is achieved, the ActPos register is reset to zero, whereas TagPos register is not
changed.
Figure 8: Dual Positioning
Velocity
First motion Second motion
PC20070221.1
Vmax
Vmin
27 ms 27 ms
Reset ActPos
t
Pos1[15:0]
Pos1[15:0] +
Pos2[15:0]
Remark: This operation cannot be interrupted or influenced by any further command unless the conditions exist to cause a motor
shutdown or by a HardStop command. Sending a SetDualPosition command while a motion is already ongoing is not
recommended.
Notes:
(0) The priority encoder describes the management of states and commands. All notes below are to be considered illustrative.
(1) The last SetPosition command issued during a DualPosition sequence will be kept in memory and executed afterwards. This also applies to the commands
SetMotorParam and GotoSecurePosition.
(2) Commands such as GetFullStatus1 or GetFullStatus2 will be executed while a Dual Positioning is running.
(3) A DualPosition sequence starts by setting TagPos register to SecPos value, provided secure position is enabled otherwise TagPos is reset to zero.
(4) The acceleration/deceleration value applied during a DualPosition sequence is the one stored in RAM before the SetDualPosition command is sent. The
same applies for Shaft bit, but not for Irun, Ihold and StepMode, which can be changed during the Dual Positioning sequence.
(5) The Pos1, Pos2, Vmax and Vmin values programmed in a SetDualPosition command apply only for this sequence. All further positioning will use the
parameters stored in RAM (programmed for instance by a former SetMotorParam command).
(6) Commands ResetPosition, SetDualPosition, and SoftStop will be ignored while a DualPosition sequence is ongoing, and will not be executed afterwards.
(7) A SetMotorParam command should not be sent during a SetDualPosition sequence.
(8) If for some reason ActPos equals Pos1[15:0] at the moment the SetDualPosition command is issued, the circuit will enter in deadlock state. Therefore, the
application should check the actual position by a GetFullStatus2 command prior to send the SetDualPosition command.
Rev. 4 | Page 17 of 56 | www.onsemi.com
AMIS-30624
14.1.3. Position Periodicity
Depending on the stepping mode the position can range from –4096 to +4095 in half-step to –32768 to +32767 in 1/16th micro-stepping
mode. One can project all these positions lying on a circle. When executing the command SetPosition, the position controller will
set the movement direction in such a way that the traveled distance is at a minimum.
Figure 9 illustrates that the moving direction going from ActPos = +30000 to TagPos = –30000 is clockwise.
If a counter clockwise motion is required in this example, several consecutive SetPosition commands can be used. For larger
movements, one could also use the command RunVelocity.
0
ActPos = +30000
TagPos = -30000
-10000 -20000
+10000 +20000
Motion direction
Figure 9: Motion Direction is Function on Difference Between ActPos and TagPos
14.1.4. Hardwired Address HW
In Figure 10 a simplified schematic diagram is shown of the HW comparator circuit.
The HW pin is sensed via two switches STOP and SBOT. The DriveHS and DriveLS control lines are alternatively closing STOP and SBOT ,
connecting HW pin with a current to resistor converter. Closing STOP (DriveHS = 1) will sense a current to GND. In that case the top IÆ
R converter output is low, via the closed passing switch SPASS_T this signal is fed to the “R” comparator which output HW_Cmp is high.
Closing bottom switch SBOT (DriveLS = 1) will sense a current to VBAT. The corresponding IÆ R converter output is low and via SPASS_B
fed to the comparator. The output HW_Cmp will be high.
Figure 10: Simplified Schematic Diagram of the HW Comparator
PC20060926.1
COMP
IÎ R
IÎ R
Rth
LOGIC Low
DriveHS
DriveLS
HW_Cmp
HW
"R"-Comp
State
STOP
SBOT
SPASS_T
SPASS_B
32 μs
Debouncer
Float
64 ms
Debouncer
High
1 = R2GND 2 = R2VBAT 3 = OPEN
Rev. 4 | Page 18 of 56 | www.onsemi.com
AMIS-30624
Three cases can be distinguished (see also Figure 10):
- HW is connected to ground: R2GND or Drawing 1
- HW is connected to VBAT: R2VBAT or Drawing 2
- HW is floating: OPEN or Drawing 3
Table 15: State Diagram of the HW Comparator
Previous State DriveLS DriveHS HW_Cmp New State Condition Drawing
Float 1 0 0 Float R2GND or OPEN 1 or 3
Float 1 0 1 High R2VBAT 2
Float 0 1 0 Float R2VBAT or OPEN 2 or 3
Float 0 1 1 Low R2GND 1
Low 1 0 0 Low R2GND or OPEN 1 or 3
Low 1 0 1 High R2VBAT 2
Low 0 1 0 Float R2VBAT or OPEN 2 or 3
Low 0 1 1 Low R2GND 1
High 1 0 0 Float R2GND or OPEN 1 or 3
High 1 0 1 High R2VBAT 2
High 0 1 0 High R2VBAT or OPEN 2 or 3
High 0 1 1 Low R2GND 1
The logic is controlling the correct sequence in closing the switches and in interpreting the 32μs de-bounced HW_Cmp output
accordingly. The output of this small state-machine is corresponding to:
- High or address = 1
- Low or address = 0
- Floating
As illustrated in Table 15, the state is depending on the previous state, the condition of the two switch controls (DriveLS and DriveHS)
and the output of HW_Cmp. Figure 11 shows an example of a practical case where a connection to VBAT is interrupted.
Figure 11: Timing Diagram Showing the Change in States for HW Comparator
t
Rth
Tsw = 1024 μs
DriveHS
"R"-Comp
t
t
t
DriveLS
HW_Cmp
State
t
Tsw_on = 128 μs
Condition
R2VBAT OPEN
High
Low
Float
High
High
High
High
R2VBAT R2GND
Float
High
Float
Float
High
High
Low
Low
t
PC20060926.2
Rev. 4 | Page 19 of 56 | www.onsemi.com
AMIS-30624
R2VBAT
A resistor is connected between VBAT and HW. Every 1024μs SBOT is closed for a period of 128μs and a current is sensed. The output
of the I Æ R converter is low and the HW_Cmp output is high. Assuming the previous state was floating, the internal LOGIC will
interpret this as a change of state and the new state will be High (see also Table 15). The next time SBOT is closed the same condition is
observed. The previous state was high, so based on Table 15 the new state remains unchanged. This high state will be interpreted as
HW address = 1.
OPEN
In case the HW connection is lost (broken wire, bad contact in connector) the next time SBOT is closed this will be sensed. There will be
no current, the output of the corresponding I Æ R converter is high and the HW_Cmp will be low. The previous state was High. Based
on Table 15 one can see that the state changes to float. This will trigger a motion to secure position after a debounce time of 64 ms.
This prevents false triggering in case of micro interruptions of the power supply. See also Electrical Transient Conduction Along Supply
Lines.
R2GND
If a resistor is connected between HW and the GND, a current is sensed every 1024μs when STOP is closed. The output of the top I Æ
R converter is low and as a result the HW_Cmp output switches to high. Again based on the stated diagram in Table 15 one can see
that the state will change to low. This low state will be interpreted as HW address = 0.
14.1.5. External Switch SWI
As illustrated in Figure 12, the SWI comparator is almost identical to HW. The major difference is in the limited number of states. Only
open or closed is recognised leading to respectively ESW = 0 and ESW = 1.
Figure 12: Simplified Schematic Diagram of the SWI Comparator
COMP
IÎ R
IÎ R
Rth
LOGIC
Closed
Open
DriveHS
DriveLS
SWI_Cmp
SWI
"R"-Comp
State
STOP
SBOT
SPASS_T
SPASS_B
32 μs
Debouncer
PC20060926.3
1 = R2GND 2 = R2VBAT 3 = OPEN
As illustrated in Figure 14, a change in state is always synchronized with DriveHS or DriveLS. The same synchronization is valid for
updating the internal position register. This means that after every current pulse (or closing of STOP or SBOT) the state of position switch
together with the corresponding position is memorized.
Using the GetActualPos commands reads back the ActPos register and the status of ESW. In this way the master node may get
synchronous information about the state of the switch together with the position of the motor. See Figure 13.
Rev. 4 | Page 20 of 56 | www.onsemi.com
AMIS-30624
GetFullStatus1 Response Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 1
1 Address 1 1 1 OTP3 OTP2 OTP1 OTP0 HW
2 Data 1 Irun[3:0] Ihold[3:0]
3 Data 2 Vmax[3:0] Vmin[3:0]
4 Data 3 AccShape StepMode[1:0] Shaft Acc[3:0]
5 Data 4 VddReset StepLoss ElDef UV2 TSD TW Tinfo[1:0]
6 Data 5 Motion[2:0] ESW OVC1 OVC2 Stall CPFail
7 Data 6 1 1 1 1 1 1 1 1
8 Data 7 AbsThr[3:0] DelThr[3:0]
Figure 13: GetFullStatus1 I2C Commando
Important remark: Every 512μs this information is refreshed.
Figure 14: Timing Diagram Showing the Change in States for SWI Comparator
Rth
Tsw =1024 μs
DriveHS
"R"-Comp
t
t
t
DriveLS
SWI_Cmp
ESW
t
Tsw_on = 128 μst
0111
ActPos
ActPos
ActPos + 1
ActPos + 2
ActPos + 3
t
512 μs
120 μs
PC20060926.4
Rev. 4 | Page 21 of 56 | www.onsemi.com
AMIS-30624
14.2 Main Control and Register, OTP Memory + ROM
14.2.1. Power-up Phase
The power-up phase of the AMIS-30624 will not exceed 10ms. After this phase, the AMIS-30624 is in shutdown mode, ready to receive
I2C messages and execute the associated commands. After power-up, the registers and flags are in the reset state; some of them
being loaded with the OTP memory content (see Table 18).
14.2.2. Reset State
After power-up, or after a reset occurrence (e.g. a micro cut on pin VBB has made Vdd go below VddReset level), the H-bridges will be
in high impedance mode, and the registers and flags will be in a predetermined position. This is documented in Table 18 and Table 19.
14.2.3. Soft Stop
A soft stop is an immediate interruption of a motion, but with a deceleration phase. At the end of this action, the register TagPos is
loaded with the value contained in register ActPos to avoid an attempt of the circuit to achieve the motion (seeTable 18). The circuit is
then ready to execute a new positioning command, provided thermal and electrical conditions allow for it.
14.2.4. Thermal Shutdown Mode
When thermal shutdown occurs, the circuit performs a SoftStop command and goes to motor shutdown mode (see Figure 15).
14.2.5. Temperatur e Management
The AMIS-30624 monitors temperature by means of two thresholds and one shutdown level, as illustrated in the Figure 15. The only
condition necessary to reset flags <TW> and <TSD> (respectively thermal warning and thermal shutdown) is when the temperature is
lower than Ttw causing the occurrence of a GetFullStatus1
I2C frame.
Figure 15: State Diagram Temperature Management
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
Tinfo> = '01'
TW> = '0'
TSD> = '0'
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
THERMAL
SHUTDOWN
POST
THERMAL
WARNING
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
THERMAL
WARNING
POST
THERMAL
SHUTDOWN
1
<Tinfo> = '01'
<TW> = '0'
<TSD> = '0'
NORMAL
TEMP
POST
THERMAL
SHUTDOWN
2
LOW
TEMP
T° < Ttw
& I2C frame
<GetFullStatus1>
T° > Ttw
T° > Ttw
T° < Ttw
T° > Ttsd
T° > Ttsd
T° < Ttsd
T° < Ttw
T° > Ttw
T° < Tlow
T° > Tlow
T° < Ttw
& I2C frame
<GetFullStatus1>
PC20070219.1
Rev. 4 | Page 22 of 56 | www.onsemi.com
AMIS-30624
14.2.6. Battery Under-voltage Management
The AMIS-30624 monitors the battery voltage by means of one threshold and one shutdown level, as illustrated in Figure 16. The only
condition necessary to reset flags <UV2> and <StepLoss> is to recover a battery voltage higher than UV1 and to receive a
GetFullStatus1 command.
Figure 16: State Diagram Battery Voltage Management
PC20060926.5
Vbb < UV2
No Motion
Vbb < UV2
& Motion Ongoing
Vbb > UV1
& I2C frame
<GetFullStatus1>
Vbb > UV1
& I2C frame
<GetFullStatus1>
- <UV2> = '1'
- <Steploss> = '0'
- Motor Shutdown
- <UV2> = '1'
- <Steploss> = '1'
- HardStop
- Motor Shutdown
STOP
MODE
1
STOP
MODE
2
- <UV2> = '0'
- <Steploss> = '0'
NORMAL
VOLTAGE
14.2.7. OTP Register
14.2.7.1 OTP Memory Structure
Table 16 shows where the parameters to be stored in the OTP memory are located.
Table 16: OTP Memory Structure
Address Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00 OSC3 OSC2 OSC1 OSC0 IREF3 IREF2 IREF1 IREF0
0x01 TSD2 TSD1 TSD0 BG3 BG2 BG1 BG0
0x02 AbsThr3 AbsThr2 AbsThr1 AbsThr0 PA3 PA2 PA1 PA0
0x03 Irun3 Irun2 Irun1 Irun0 Ihold3 Ihold2 Ihold1 Ihold0
0x04 Vmax3 Vmax2 Vmax1 Vmax0 Vmin3 Vmin2 Vmin1 Vmin0
0x05 SecPos10 SecPos9 SecPos8 Shaft Acc3 Acc2 Acc1 Acc0
0x06 SecPos7 SecPos6 SecPos5 SecPos4 SecPos3 SecPos2
0x07 DelThr3 DelThr2 DelThr1 DelThr0 StepMode1 StepMode0 LOCKBT LOCKBG
Parameters stored at address 0x00 and 0x01 and bit LOCKBT are already programmed in the OTP memory at circuit delivery. They
correspond to the calibration of the circuit and are just documented here as an indication.
Each OPT bit is at ‘0’ when not zapped. Zapping a bit will set it to ‘1’. Thus only bits having to be at ‘1’ must be zapped. Zapping of a bit
already at ‘1’ is disabled.
Each OTP byte will be programmed separately (see command SetOTPparam).
Once OTP programming is completed, bit LOCKBG can be zapped, to disable future zapping, otherwise any OTP bit at ‘0’ could still be
zapped by using a SetOTPparam command.
Table 17: OTP Overwrite Protection
Lock Bit Protected Bytes
LOCKBT (factory zapped before delivery) 0x00 to 0x01
LOCKBG 0x00 to 0x07
Note:
Zapped bits will really be “active” after a GetOTPparam or a ResetToDefault command or after a power-up.
Rev. 4 | Page 23 of 56 | www.onsemi.com
AMIS-30624
The command used to load the application parameters via the I2C bus in the RAM prior to an OTP memory programming is
SetMotorParam. This allows for a functional verification before using a SetOTPparam command to program and zap separately one
OTP memory byte. A GetOTPparam command issued after each SetOTPparam command allows verification of the correct byte
zapping.
14.2.7.2 Application Parameters Stored in OTP Memory
Except for the physical address PA[3:0], these parameters, although programmed in a non-volatile memory, can still be overridden in
RAM by an I2C writing operation.
PA[3:0] In combination with hired wired (HW) address, it forms the physical address AD[6:0] of the stepper-motor. Up to
32 stepper motors can theoretically be connected to the same I2C bus.
AbsThr[3:0] Absolute threshold used for the motion detection
Index AbsThr AbsThr level (V)
0 0 0 0 0 Disable
1 0 0 0 1 0.5
2 0 0 1 0 1.0
3 0 0 1 1 1.5
4 0 1 0 0 2.0
5 0 1 0 1 2.5
6 0 1 1 0 3.0
7 0 1 1 1 3.5
8 1 0 0 0 4.0
9 1 0 0 1 4.5
A 1 0 1 0 5.0
B 1 0 1 1 5.5
C 1 1 0 0 6.0
D 1 1 0 1 6.5
E 1 1 1 0 7.0
F 1 1 1 1 7.5
DelThr[3:0] Delta threshold used for the motion detection
Index DelThr DelThr level (V)
0 0 0 0 0 Disable
1 0 0 0 1 0.25
2 0 0 1 0 0.50
3 0 0 1 1 0.75
4 0 1 0 0 1.00
5 0 1 0 1 1.25
6 0 1 1 0 1.50
7 0 1 1 1 1.75
8 1 0 0 0 2.00
9 1 0 0 1 2.25
A 1 0 1 0 2.50
B 1 0 1 1 2.75
C 1 1 0 0 3.00
D 1 1 0 1 3.25
E 1 1 1 0 3.50
F 1 1 1 1 3.75
Rev. 4 | Page 24 of 56 | www.onsemi.com
AMIS-30624
Irun[3:0] Current amplitude value to be fed to each coil of the stepper motor. The table below provides the 16 possible values
for IRUN.
Index Irun Run Current (mA)
0 0 0 0 0 59
1 0 0 0 1 71
2 0 0 1 0 84
3 0 0 1 1 100
4 0 1 0 0 119
5 0 1 0 1 141
6 0 1 1 0 168
7 0 1 1 1 200
8 1 0 0 0 238
9 1 0 0 1 283
A 1 0 1 0 336
B 1 0 1 1 400
C 1 1 0 0 476
D 1 1 0 1 566
E 1 1 1 0 673
F 1 1 1 1 800
Ihold[3:0] Hold current for each coil of the stepper motor. The table below provides the 16 possible values for IHOLD.
Index Ihold Hold Current (mA)
0 0 0 0 0 59
1 0 0 0 1 71
2 0 0 1 0 84
3 0 0 1 1 100
4 0 1 0 0 119
5 0 1 0 1 141
6 0 1 1 0 168
7 0 1 1 1 200
8 1 0 0 0 238
9 1 0 0 1 283
A 1 0 1 0 336
B 1 0 1 1 400
C 1 1 0 0 476
D 1 1 0 1 566
E 1 1 1 0 673
F 1 1 1 1 0
StepMode Indicator of stepping mode to be used.
StepMode Step Mode
0 0 1/2 stepping
0 1 1/4 stepping
1 0 1/8 stepping
1 1 1/16 stepping
Shaft Indicator of reference position. If Shaft = ‘0’, the reference position is the maximum inner position, whereas if
Shaft = ‘1’, the reference position is the maximum outer position.
SecPos[10:0] Secure position of the stepper motor. This is the position to which the motor is driven in case HW connection is lost. If
SecPos[10:0] = “100 0000 0000”, this means that secure position is disabled, e.g. the stepper motor will be kept in
the position occupied at the moment these events occur.
The secure position is coded on 11 bits only, providing actually the most significant bits of the position, the
non coded least significant bits being set to ‘0’. See also Table 10.
Rev. 4 | Page 25 of 56 | www.onsemi.com
AMIS-30624
Vmax[3:0] Maximum velocity
Index Vmax Vmax (full step/s) Group
0 0 0 0 0 99 A
1 0 0 0 1 136
2 0 0 1 0 167
3 0 0 1 1 197
4 0 1 0 0 213
5 0 1 0 1 228
6 0 1 1 0 243
B
7 0 1 1 1 273
8 1 0 0 0 303
9 1 0 0 1 334
A 1 0 1 0 364
B 1 0 1 1 395
C 1 1 0 0 456
C
D 1 1 0 1 546
E 1 1 1 0 729
F 1 1 1 1 973
D
Vmin[3:0] Minimum velocity
Index Vmin Vmax factor
0 0 0 0 0 1
1 0 0 0 1 1/32
2 0 0 1 0 2/32
3 0 0 1 1 3/32
4 0 1 0 0 4/32
5 0 1 0 1 5/32
6 0 1 1 0 6/32
7 0 1 1 1 7/32
8 1 0 0 0 8/32
9 1 0 0 1 9/32
A 1 0 1 0 10/32
B 1 0 1 1 11/32
C 1 1 0 0 12/32
D 1 1 0 1 13/32
E 1 1 1 0 14/32
F 1 1 1 1 15/32
Acc[3:0] Acceleration and deceleration between Vmax and Vmin.
Index Acc Acceleration (full step/s²)
0 0 0 0 0 49 (*)
1 0 0 0 1 218 (*)
2 0 0 1 0 1004 .
3 0 0 1 1 3609 .
4 0 1 0 0 6228 .
5 0 1 0 1 8848 .
6 0 1 1 0 11409 .
7 0 1 1 1 13970 .
8 1 0 0 0 16531 .
9 1 0 0 1 19092 (*)
A 1 0 1 0 21886 (*)
B 1 0 1 1 24447 (*)
C 1 1 0 0 27008 (*)
D 1 1 0 1 29570 (*)
E 1 1 1 0 34925 (*)
F 1 1 1 1 40047 (*)
(*) restriction on speed
Rev. 4 | Page 26 of 56 | www.onsemi.com
AMIS-30624
14.2.8. RAM Registers
Table 18: RAM Registers
Register Mnemonic Length
(Bit) Related Commands Comment Reset State
Actual position ActPos 16
GetFullStatus2
GotoSecurePos
ResetPosition
16-bit signed
Last programmed
position
Pos/
TagPos 16
GetFullStatus2
GotoSecurePos
ResetPosition
SetPosition
16-bit signed
(see Positioning)
Note 1
Acceleration shape AccShape 1
GetFullStatus1
ResetToDefault1
SetMotorParam
‘0’ normal acceleration from Vmin to Vmax
‘1’ motion at Vmin without acceleration ‘0’
Coil peak current Irun 4
GetFullStatus1
ResetToDefault1
SetMotorParam
Operating current
See look-up table Irun
Coil hold current Ihold 4
GetFullStatus1
ResetToDefault1
SetMotorParam
Standstill current
See look-up table Ihold
Minimum velocity Vmin 4
GetFullStatus1
ResetToDefault1
SetMotorParam
See Section 13.3 Minimum Velocity
See look-up table Vmin
Maximum velocity Vmax 4
GetFullStatus1
ResetToDefault1
SetMotorParam
See Section 13.2 Maximum Velocity
See look-up table Vmax
Shaft Shaft 1
GetFullStatus1
ResetToDefault1
SetMotorParam
Direction of movement
for positive velocity
Acceleration/
deceleration Acc 4
GetFullStatus1
ResetToDefault1
SetMotorParam
See Section 13.4 Acceleration
See look-up table Acc
Secure position SecPos 11
GetFullStatus2
ResetToDefault1
SetMotorParam
Target position when LIN connection fails; 11
MSBs of 16-bit position (LSBs fixed to ‘0’)
Stepping mode StepMode 2 GetFullStatus1
SetStallParam
See Section 13.1 Stepping Modes
See look-up table StepMode
Stall detection absolute
threshold AbsThr 4 GetFullStatus1
SetStallParam
See Section 15.4 Motion detection
Stall detection delta
threshold DelThr 4 GetFullStatus1
SetStallParam See Section 15.4 Motion detection
From OTP
memory
Stall detection delay FS2StallEn 3 GetFullStatus2
SetStallParam See Section 15.4 Motion detection
‘000’
Stall detection sampling MinSamples 3 GetFullStatus2
SetStallParam See Section 15.4 Motion detection
‘000’
PWM jitter PWMJEn 1 GetFullStatus2
SetStallParam
‘1’ means jitter is added ‘0’
100% duty cycle stall
disable DC100SDis 1 GetFullStatus2
SetStallParam
‘1’ means stall detection is disabled in case
PWM regulator runs at δ = 100% ‘0’
PWM frequency PWMFreq 1 SetMotorParam ‘1’ means 44 kHz is selected ‘0’
Note:
A ResetToDefault command will act as a reset of the RAM content, except for ActPos and TagPos, which are registers that are not modified.
Therefore, the application should not send a ResetToDefault during a motion, to avoid any unwanted change of parameter.
Rev. 4 | Page 27 of 56 | www.onsemi.com
AMIS-30624
14.2.9. Flags Table
Table 19: Flags Table
Flag Mnemonic Length
(Bit) Related Commands Comment Reset State
Charge pump failure CPFail 1 GetFullStatus1
‘0’ = charge pump OK
‘1’ = charge pump failure
reset only after GetFullStatus
‘0’
Electrical defect ElDef 1 GetFullStatus1
<OVC1> or <OVC2> or <open circuit 1> or
<open circuit 2> or <CPFail>
resets only after GetFullStatus1
‘0’
External switch status ESW 1 GetFullStatus1
‘0’ = open
‘1’ = close ‘0’
Motion status Motion 3 GetFullStatus1
“x00” = Stop
“001” = inner motion acceleration
“010” = inner motion deceleration
“011” = inner motion max. speed
“101” = outer motion acceleration
“110” = outer motion deceleration
“111” = outer motion max. speed
“000”
Over current in coil X OVC1 1 GetFullStatus1
‘1’ = over current
reset only after GetFullStatus1 ‘0’
Over current in coil Y OVC2 1 GetFullStatus1
‘1’ = over current
reset only after GetFullStatus1 ‘0’
Secure position enabled SecEn 1 Internal use
‘0’ if SecPos = “100 0000 0000”
‘1’ otherwise NA
Step loss StepLoss 1 GetFullStatus1
‘1’ = step loss due to under voltage, over current
or open circuit ‘1’
Delta high stall DelStallHi 1 GetFullStatus2 ‘1’ = Vbemf > Average + DeltaThr ‘0’
Delta low stall DelStallLo 1 GetFullStatus2 ‘1’ = Vbemf < Average – DeltaThr ‘0’
Absolute stall AbsStall 1 GetFullStatus2 ‘1’ = Vbemf > AbsThr ‘0’
Stall Stall 1 GetFullStatus1 Stall detected ‘0’
Temperature info Tinfo 2 GetFullStatus1
“00” = normal temperature range
“01” = low temperature warning
“10” = high temperature warning
“11” = motor shutdown
“00”
Thermal shutdown TSD 1 GetFullStatus1
‘1’ = shutdown (> 155°C typ.)
reset only after GetFullStatus1 and if
<Tinfo> = “00”
‘0’
Thermal warning TW 1 GetFullStatus1
‘1’ = over temp (> 145°C)
reset only after GetFullStatus1 and if
<Tinfo> = “00”
‘0’
Battery
stop voltage UV2 1 GetFullStatus1
‘0’ = Vbb > UV2
‘1’ = Vbb UV2
reset only after GetFullStatus1
‘0’
Digital supply reset VddReset 1 GetFullStatus1
Set at ‘1’ after power-up of the circuit. If this was
due to a supply micro-cut, it warns that the RAM
contents may
have been lost; can be reset to ‘0’ with a
GetFullStatus1 command.
‘1’
Rev. 4 | Page 28 of 56 | www.onsemi.com
AMIS-30624
14.2.10. Priority Encoder
The table below describes the state management performed by the main control block.
Table 20: Priority Encoder
State Stopped GotoPos DualPosition SoftStop HardStop ShutDown
Command
Motor Stopped,
Ihold in Coils
Motor Motion
Ongoing
No Influence on
RAM and
TagPos
Motor
Decelerating
Motor Forced to
Stop
Motor Stopped,
H-bridges in
Hi-Z
GetOTPparam
OTP refresh;
I2C slave
response
OTP refresh;
I2C slave
response
OTP refresh;
I2C slave
response
OTP refresh;
I2C slave
response
OTP refresh;
I2C slave
response
OTP refresh;
I2C slave
response
GetFullStatus1
[attempt to clear all
flags] (note 1)
I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response;
if (<TSD> or
<ElFlag> = ‘0’
then Stopped
GetFullStatus2 I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response
I2C slave
response
ResetToDefault
[ ActPos and TagPos
are not altered ]
OTP refresh;
OTP to RAM;
AccShape reset
OTP refresh;
OTP to RAM;
AccShape reset
OTP refresh;
OTP to RAM;
AccShape reset
(note 2)
OTP refresh;
OTP to RAM;
AccShape reset
OTP refresh;
OTP to RAM;
AccShape reset
OTP refresh;
OTP to RAM;
AccShape reset
SetMotorParam
[ Master takes care
about proper update ]
RAM update RAM update
(note 5) RAM update RAM update RAM update RAM update
SetStallParam RAM update RAM update RAM update RAM update RAM update RAM update
ResetPosition TagPos and
ActPos reset TagPos and
ActPos reset
SetPosition TagPos updated;
GotoPos TagPos updated TagPos updated
RunVelocity Continuous motion;
GotoPos
GotoSecPosition
If <SecEn> = ‘1’
then TagPos =
SecPos;
GotoPos
If <SecEn> = ‘1’
then TagPos =
SecPos
If <SecEn> = ‘1’
then TagPos =
SecPos
DualPosition DualPosition
HardStop HardStop;
<StepLoss> = ‘1’
HardStop;
<StepLoss> = ‘1’
HardStop;
<StepLoss> = ‘1’
SoftStop SoftStop
HardStop
[ (<CPFail> or
<UV2> or <ElDef>) =
‘1’ <HS> = ‘1’ ]
Shutdown HardStop HardStop HardStop
Thermal shutdown
[ <TSD> = ‘1’ ] Shutdown SoftStop SoftStop
Motion finished NA Stopped Stopped Stopped;
TagPos =ActPos
Stopped;
TagPos =ActPos NA
With the following color code:
Command ignored
Transition to another state
Master is responsible for proper update (see Note 5)
Rev. 4 | Page 29 of 56 | www.onsemi.com
AMIS-30624
Notes:
1) <ElFlag> = <CPFail> or <UV2> or <ElDef> or <VDDreset>
2) After power-on-reset, the Shutdown state is entered. The shutdown state can only be left after GetFullStatus1 command (so that the
master could read the <VddReset> flag).
3) A DualPosition sequence runs with a separate set of RAM registers. The parameters that are not specified in a DualPosition command are
loaded with the values stored in RAM at the moment the DualPosition sequence starts. AccShape is forced to ‘1’ during second motion even if
a ResetToDefault command is issued during a DualPosition sequence, in which case AccShape at ‘0’ will be taken into account after the
DualPosition sequence. A GetFullStatus1 command will return the default parameters for Vmax and Vmin stored in RAM.
4) Shutdown state can be left only when <TSD> and <ElFlag> flags are reset.
5) Flags can be reset only after the master could read them via a GetFullStatus1 command, and provided the physical conditions allow for it
(normal temperature, correct battery voltage and no electrical or charge pump defect).
6) A SetMotorParam command sent while a motion is ongoing (state GotoPos) should not attempt to modify Acc and Vmin values. This can
be done during a DualPosition sequence since this motion uses its own parameters, the new parameters will be taken into account at the next
SetPosition command.
7) <SecEn> = ‘1’ when register SecPos is loaded with a value different from the most negative value
(i.e. different from 0x400 = “100 0000 0000”)
8) <Stop> flag allows user to distinguish whether state stopped was entered after HardStop/SoftStop or not. <Stop> is set to ‘1’ when leaving
state HardStop or SoftStop and is reset during first clock edge occurring in state Stopped.
9) While in state stopped, if ActPos TagPos there is a transition to state GotoPos. This transition has the lowest priority, meaning that <Stop>,
<TSD>, etc. are first evaluated for possible transitions.
10) If <StepLoss> is active, then SetPosition and GotoSecurePosition commands are ignored (they will not modify TagPos register
whatever the state). Other command like DualPosition or ResetPosition will be executed if allowed by current state. <StepLoss> can
only be cleared by a GetFullStatus1 command.
Figure 17: State Diagram
PC20070323.1
GOTOPOS
SOFTSTOP
SHUTDOWN
POWER
ON
DUAL-
POSITION
HARDSTOP
STOPPED
Thermal
shutdown
Thermal Shutdown
SoftStop
Thermal
shutdown
HardStop
HardStop
HardStop
HardStop
Motion
Finished
Motion Finished
Motion
Finished
GetFullStatus1 GotoSecPos
SetPos
Motion
Finished
DualPosition
Priorities
1
2
3
Rev. 4 | Page 30 of 56 | www.onsemi.com
AMIS-30624
14.3 Motor Driver
14.3.1. Current Waveforms in the Coils
Figure 18 illustrates the current fed to the motor coils by the motor driver in half step mode.
t
PC20051205.1
Coil X
Coil Y
Ix
Iy
Figure 18: Current Waveforms in Motorcoils X and Y in Halfstep Mode
Whereas Figure 19 below shows the current fed to one coil in 1/16th micro stepping (one electrical period).
t
PC20051123.4
Coil X
Coil Y
Ix
Iy
Figure 19: Current Waveforms in Motorcoils X and Y in 1/16th Microstep mode
14.3.2. PWM Regulation
In order to force a given current (determined by Irun or Ihold and the current position of the rotor) through the motor coil while ensuring
high energy transfer efficiency, a regulation based on PWM principle is used. The regulation loop performs a comparison of the sensed
output current to an internal reference, and features a digital regulation generating the PWM signal that drives the output switches. The
Rev. 4 | Page 31 of 56 | www.onsemi.com
AMIS-30624
zoom over one micro-step in Figure 19 shows how the PWM circuit performs this regulation. To reduce the current ripple, a higher
PWM frequency should be selectable. The RAM register PWMfreq is used for this (Bit 6 in Data 7 of SetMotorParam).
Table 21: PWM Frequency Selection
PWMfreq Applied PWM Frequency
0 22.8 kHz
1 45.6 kHz
14.3.3. PWM Jitter
To lower the power spectrum for the fundamental and higher harmonics of the PWM frequency, jitter can be added to the PWM clock.
The RAM register PWMJEn is used for this. (Bit 0 in Data 7 of SetMotorParam or SetStallParam).
Readout with GetFullStatus1.
Table 22: PWM Jitter Selection
PWMJEn Status
0 Single PWM frequency
1 Added jitter to PWM frequency
14.3.4. Motor Starting Phase
At motion start, the currents in the coils are directly switched from Ihold to Irun with a new sine/cosine ratio corresponding to the first
half (or micro) step of the motion.
14.3.5. Motor Stopping Phase
At the end of the deceleration phase, the currents are maintained in the coils at their actual DC level (hence keeping the sine/cosine
ratio between coils) during the stabilization time tstab (see Table 6). The currents are then set to the hold values, respectively, Ihold x
sin(TagPos) and Ihold x cos(TagPos) as illustrated below. A new positioning order can then be executed.
Figure 20: Motor Stopping Phase
14.3.6. Charge Pump Monitoring
If the charge pump voltage is not sufficient for driving the high side transistors (due to a failure), an internal HardStop command is
issued. This is acknowledged to the master by raising the flag <CPFail> (available with command GetFullStatus1).
In case this failure occurs while a motion is ongoing, the flag <StepLoss> is also raised.
Rev. 4 | Page 32 of 56 | www.onsemi.com
AMIS-30624
14.3.7. Electrical Defect on Coils, Detection and Confirmation
The principle relies on the detection of a voltage drop on at least one transistor of the H-bridge. Then the decision is taken to open the
transistors of the defective bridge.
This allows the detection of the following short circuits:
External coil short circuit
Short between one terminal of the coil and Vbat or Gnd
Open circuits are detected by a 100 percent PWM duty cycle value during a long time.
Table 23: Electrical Defect Detection
Pins Fault Mode
Yi or Xi Short circuit to GND
Yi or Xi Short circuit to Vbat
Yi or Xi Open
Y1 and Y2 Short circuited
X1 and X2 Short circuited
Xi and Yi Short circuited
Remark: One cannot detect an internal short in the motor.
14.3.8. Motor Shutdown Mode
A motor shutdown occurs when:
The chip temperature rises above the thermal shutdown threshold Ttsd (see Thermal Shutdown Mode)
The battery voltage goes below UV2 (see Battery Voltage Management)
Flag <ElDef> = ‘1’, meaning an electrical problem is detected on one or both coils, e.g. a short circuit
Flag <CPFail> = ‘1’, meaning there is a charge pump failure
A motor shutdown leads to the following:
H-bridges in high impedance mode
The TagPos register is loaded with the ActPos (to avoid any motion after leaving the motor shutdown mode)
The I2C interface remains active, being able to receive orders or send status.
The conditions to get out of a motor shutdown mode are:
Reception of a GetFullStatus1 command AND
The four causes above are no longer detected
This leads to H-bridges in Ihold mode, hence the circuit is ready to execute any positioning command.
This can be illustrated in the following sequence given as an application tip. The master can check whether there is a problem or not
and decide which application strategy to adopt.
Rev. 4 | Page 33 of 56 | www.onsemi.com
AMIS-30624
Tj Tsd or
Vbb UV2 or
<ElDef> = ‘1’ or
<CpFail> = ‘1’
SetPosition
frame
GetFullStatus1
frame
GetFullStatus1
frame
- The application is
aware of a problem
- Possible confirmation
of the problem
- The circuit is driven in
motor shutdown
mode
- The application is not
aware of this
- The position set-point
is updated by the
I2C Master
- Motor shutdown
mode no motion
- The application is still
unaware
- Reset <TW> or <TSD> or <UV2> or <StepLoss>
or <ElDef> or <CPFail> by the application
- Possible new detection of over temperature or
low voltage or electrical problem Circuit
sets <TW> or <TSD> or <UV2> or
<StepLoss> or <ElDef> or <CPFail>
again at ‘1
Figure 21: Example of Possible Sequence Used to Detect and Determine Cause of Motor Shutdown
Important: While in shutdown mode, since there is no hold current in the coils, the mechanical load can cause a step loss, which
cannot be flagged by the AMIS-30624.
Warning: The application should limit the number of consecutive GetFullStatus1 commands to try to get the AMIS-30624 out of
shutdown mode. When this proves to be unsuccessful, for example if there is a permanent defect, the reliability of the circuit could be
altered since GetFullStatus1 attempts to disable the protection of the H-bridges.
14.4 Motion Detection
Motion detection is based on the back emf generated internally in the running motor. When the motor is blocked, for example when it
hits the end-position, the velocity and as a result also the generated back emf, is disturbed. The AMIS-30624 senses the back emf,
calculates a moving average and compares the value with two independent threshold levels: Absolute threshold (AbsThr[3:0] ) and
Delta threshold (DelThr[3:0] ). Instructions for the correct use of these two levels in combination with three additional parameters
(MinSamples, FS2StallEn and DC100SDis) are outside the scope of this datasheet. Detailed information is available in a dedicated
white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”, available on http://www.amis.com/.
If the motor is accelerated by a pulling or propelling force and the resulting back emf increases above the Delta threshold (+ ΔTHR),
then <DelStallHi> is set. When the motor is slowing down and the resulting back emf decreases below the Delta threshold
(- ΔTHR), then <DelStallLo> is set. When the motor is blocked and the velocity is zero after the acceleration phase, the back emf is
low or zero. When this value is below the Absolute threshold, <AbsStall> is set. The <Stall> flag is the OR function of
<DelStallLo> OR <DelStallHi> OR <AbsStall>.
Rev. 4 | Page 34 of 56 | www.onsemi.com
AMIS-30624
AbsStall
t
Velocity
Vmax
Vmin t
Motor speed
Vbemf
VABSTH
t
Back emf
Vbemf
DeltaStallHi
t
Vbemf Vbemf
+ ΔTHR
- ΔTHR
t
DeltaStallLo
t
Figure 22: Triggering of the Stall Flags in Function of Measured Back emf and the Set Threshold Levels
Table 24: Truth Table
Condition <DelStallLo> <DelStallHi> <AbsStall> <Stall>
Vbemf < Average - DelThr 1 0 0 1
Vbemf > Average + DelThr 0 1 0 1
Vbemf < AbsThr 0 0 1 1
The motion will only be detected when the motor is running at the maximum velocity, not during acceleration or deceleration.
If during positioning a mechanical obstacle is detected (stall), an (internal) hardstop is generated. The motor will stop immediately and
as a consequence the <StepLoss> and <Stall> flags are set. The position in the internal counter will be copied to the ActPos register.
All flags can be read out with the GetFullStatus1.
If Stall appears during DualPosition then the first phase is cancelled (via internal Hardstop) and after timeout (26.6ms) the second
phase at Vmin starts.
Important Remark:
Using GetFullStatus1 will read AND clear the following flags: <Steploss>, <Stall>, <AbsStall>, <DelStallLo>, and
<DelStallHi>. New positioning is possible and the ActPos register will be further updated.
Motion detection is disabled when the RAM registers AbsThr[3:0] and DelThr[3:0] are empty or zero. Both levels can be programmed
using the I2C command SetStallParam in the registers AbsThr[3:0] and DelThr[3:0]. Also in the OTP register AbsThr[3:0] and
DelThr[3:0] can be set using the I2C command SetOTPParam. These values are copied in the RAM registers during power on reset.
Rev. 4 | Page 35 of 56 | www.onsemi.com
AMIS-30624
Value Table:
Table 25: Absolute Threshold Settings Table 26: Delta Threshold Settings
AbsThr Index AbsThr Level (V) DelThr
Index DelThr Level (V)
0 Disable 0 Disable
1 0.5 1 0.25
2 1.0 2 0.50
3 1.5 3 0.75
4 2.0 4 1.00
5 2.5 5 1.25
6 3.0 6 1.50
7 3.5 7 1.75
8 4.0 8 2.00
9 4.5 9 2.25
A 5.0 A 2.50
B 5.5 B 2.75
C 6.0 C 3.00
D 6.5 D 3.25
E 7.0 E 3.50
F 7.5 F 3.75
MinSamples
MinSamples[2:0] is a Bemf sampling delay time expressed in number of PWM cycles, for more information please refer to the white
paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”.
Table 27: Back emf Sample Delay Time
tDELAY (μs)
Index MinSamples[2:0] PWMfreq = 0 PWMfreq = 1
0 000 87 43
1 001 130 65
2 010 174 87
3 011 217 109
4 100 261 130
5 101 304 152
6 110 348 174
7 111 391 196
FS2StallEn
If AbsThr or DelThr <>0 (i.e. motion detection is enabled), then stall detection will be activated AFTER the acceleration ramp + an
additional number of full-steps, according to the following table:
Table 28: Activation Delay of Motion Detection
Index FS2StallEn[2:0] Delay (Full Steps)
0 000 0
1 001 1
2 010 2
3 011 3
4 100 4
5 101 5
6 110 6
7 111 7
For more information please refer to the white paper “Robust Motion Control with AMIS-3062x Stepper Motor Drivers”.
DC100StEn
When a motor with large back – e.m.f. is operated at high velocity and low supply voltage, then the PWM duty cycle can be as high as
100 percent. This indicates that the supply is too low to generate the required torque and might also result in erroneously triggering the
stall detection. The bit “DC100StEn” (Bit 1 in Data 7 of SetStallParam) enables the function where stall detection is switched off
when PWM duty cycle equals 100 percent. For more information the white paper “Robust Motion Control with AMIS-3062x Stepper
Motor Drivers”.
Motion Qualification Mode
This mode is useful to debug motion parameters and to verify the stability of stepper motor systems. The motion qualification mode is
entered by means of the I2C command TestBemf. The SWI pin will be converted into an analog output on which the Bemf integrator
output can be measured. Once activated, it can only be stopped after a POR. During the back emf observation, reading of the SWI
state is internally forbidden. More information is available in the white paper “Robust Motion Control with AMIS-3062x Stepper Motor
Drivers”.
Rev. 4 | Page 36 of 56 | www.onsemi.com
AMIS-30624
15.0 I2C Bus Description
15.1 General Description
AMIS-30624 uses a simple bi-directional 2-wire bus for efficient inter-ic control. This bus is called the Inter IC or I2C-bus.
Features include:
Only two bus lines are required; a serial data line (SDA) and a serial clock line (SCK).
Each device connected to the bus is software addressable by a unique address and simple master/slave relationships exists at
all times; master can operate as master-transmitter or as master receiver.
Serial, 8-bit oriented, bi-directional data transfers can be made up to 400 kbit/s.
On-chip filtering rejects spikes on the bus data line to preserve data integrity.
No need to design bus interfaces because I2C-bus interface is already integrated on-chip.
IC’s can be added to or removed from a system without affecting any other circuits on the bus.
15.2 Concept
The I2C-bus consists of two wires, serial data (SDA) and serial clock (SCK), carrying information between the devices connected on the
bus. Each device connected to the bus is recognized by a unique address and operates as either a transmitter or receiver, depending
on the function of the device. AMIS-30624 can both receive and transmit data. In addition to transmitters and receivers, devices can
also be considered as masters or slaves when performing data transfers. AMIS-30624 is a slave device. See Table 30.
Table 29: Definition of I2C –bus Terminology
Term Description
Transmitter The device which sends data on the bus
Receiver The device which receives data from the bus
Master The device which initiates a transfer, generates clock signals and terminates a transfer
Slave The devices addressed by a master
Synchronization Procedure to synchronizer the clock signals of two or more devices
Figure 23: Example of an I2C-bus Configuration Using One Microcontroller and Four Slaves
Micro-
controller
Motordriver_1
AMIS-30624
Motordriver_2
AMIS-30624
Motordriver_3
AMIS-30624
Motordriver_4
AMIS-30624
SDA
SCL
PC20070217.1
Figure 23 highlights the master-slave and receiver-transmitter relationships to be found on the I2C-bus. It should be noted that these
relationships are not permanent but only depend on the direction of data transfer at that time. The transfer of data would proceed as
follows:
1) Suppose the microcontroller wants to send information to motordriver_1:
Microcontroller (master) addresses motordriver_1 (slave)
Microcontroller (master-transmitter) sends data to motordriver_1 (slave-receiver)
Microcontroller terminates the transfer
Rev. 4 | Page 37 of 56 | www.onsemi.com
AMIS-30624
2) If the microcontroller wants to receive information from motordriver_2:
Microcontroller (master) addresses motordriver_2 (slave)
Microcontroller (master-receiver) receives data from motordriver_2 (slave-transmitter)
Microcontroller terminates the transfer
Even in this case the master generates the timing and terminates the transfer.
Generation of the signals on the I2C-bus is always the responsibility of the master device. It generates its own clock signal when
transferring data on the bus. Bus clock signals from a master can only be altered when they are stretched by a slow slave device
holding-down the clock line.
15.3 General Characteristics
Figure 24: Connection of a Device to the I2C-bus
Serial Clock Line
Serial Data Line
PC20060925.7
Rp
+5 V
Clock IN
Clock OUT
Data IN
Data OUT
AMIS-30624
SDASCK SCL SDA
Clock IN
Clock OUT
Data IN
Data OUT
MASTER
Rp
21
Both SDA and SCK are bi-directional lines connected to a positive supply voltage via a pull-up resistor (see Figure 24). When the bus is
free both lines are HIGH. The output stages of the devices connected to the bus must have an open drain to perform the wired-AND
function. Data on the I2C-bus can be transferred up to 400kbits/s in fast mode. The number of interfaces connected to the bus is
dependent on the maximum bus capacitance limit (See CB in Table 6) and the available number of addresses.
15.4 Bit Transfer
The levels for logic ‘0’ (LOW) and ‘1’ (HIGH) are not fixed in the I2C standard but dependent on the used VDD level. Using AMIS-30624,
the levels are specified in Table 5. One clock pulse is generated for each data bit transferred.
Rev. 4 | Page 38 of 56 | www.onsemi.com
AMIS-30624
15.4.1. Data Validity
The data on the SDA line must be stable during the HIGH period of the clock. The HIGH or LOW state of the data line can only change
when the clock signal on the SCL line is LOW (See Figure 25).
Figure 25: Bit Transfer on the I2C-bus
15.4.2. START and STOP Conditions
Within the procedure of the I2C-bus, unique situations arise, which are defined as START (S) and STOP (P) conditions (See Figure 26).
A HIGH to LOW transition on the SDA line while SCK is HIGH is one such unique case. This situation indicates a START condition.
LOW to HIGH transition on the SDA line while SCK is HIGH defines a STOP condition.
START and STOP conditions are always generated by the master. The bus is considered to be busy after the START condition. The
bus is considered to be free again a certain time after the STOP condition. The bus free situation is specified as tBUF in Table 6.
The bus stays busy if a repeated START (Sr) is generated instead of a STOP condition. In this respect, the START (S) and repeated
START (Sr) conditions are functionally identical (See Figure 27). The symbol S will be used to represent START and repeated START,
unless otherwise noted.
Figure 26: START and STOP Conditions
PC20070217.2
SCK
Data line stable
-> Data valid
SDA
Change of
data allowed
START STOP
SCK
START
condition STOP
condition
SDA
PC20070217.3
Rev. 4 | Page 39 of 56 | www.onsemi.com
Rev. 4 | Page 40 of 56 | www.onsemi.com
AMIS-30624
15.5 Transferring Data
15.5.1. Byte Format
Every byte put on the SDA line must be 8-bits long. The number of bytes that can be transmitted per transfer to AMIS-30624 is
restricted to eight. Each byte has to be followed by an acknowledge bit. Data is transferred with the most significant bit (MSB) first (See
Figure 27). If a slave can’t receive or transmit another complete byte of data, it can hold the clock line SCK LOW to force the master
into a wait state. Data transfer then continues when the slave is ready for another byte of data and releases clock line SCK.
SDA
START STOP
Figure 27: Data Transfer on the I2C-bus
SCK
1
PC20070217.4
2789123-8 9
Acknowledgement
signal from slave
Clock line held
low by slave
Aknowledge related
clock puse from master
START
condition
ACK
MSB
STOP
condition
15.5.2. Acknowledge
Data transfer with acknowledge is obligatory. The acknowledge-related clock pulse is generated by the master. The transmitter
releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver must pull down the SDA line during the acknowledge
clock pulse so that it remains stable LOW during the HIGH period of this clock pulse (see Figure 28). Of course, set-up and hold times
must also taken into account (see Table 6). When AMIS-30624 doesn’t acknowledge the slave address, the data line will be left HIGH.
The master can than generate either a STOP condition to abort the transfer, or a repeated START condition to start a new transfer.
If AMIS-30624 as slave-receiver does acknowledge the slave address but later in the transfer cannot receive any more data bytes, this
is indicated by generating a not-acknowledge on the first byte to follow. The master generates than a STOP or a repeated START
condition.
If a master-receiver is involved in the transfer, it must signal the end of data to the slave-transmitter by not generating an acknowledge
on the last byte that was clocked out of the slave. AMIS-30624 as slave-transmitter shall release the data line to allow the master to
generate STOP or repeated START condition.
Figure 28: Acknowledge on the I2C-bus
SDA by master
transmitter
START
SCK from
master
1
PC20070217.5
289
Master releases the Data line
Slave pulls data line
low if Acknowledged
Aknowledge related
clock puse from master
START
condition
Acknowledged
MSB
SDA by slave
receiver
Not acknowledged
AMIS-30624
15.5.3. Clock Generation
The master generates the clock on the SCK line to transfer messages on the I2C-bus. Data is only valid during the HIGH period of the
clock.
15.6 Data Formats with 7-bit Addresses
Data transfers follow the format shown in Figure 29. After the START condition (S), a slave address is sent. This address is 7-bit long
followed by an eighth bit which is a data direction bit (R/W) – a ‘zero’ indicates a transmission (WRITE), a ‘one’ indicates a request for
data (READ). A data transfer is always terminated by a STOP condition (P) generated by the master.
START STOP
Figure 29: A Complete Data Transfer
However, if a master still wishes to communicate on the bus, it can generate a repeated START (Sr) and address another slave without
first generating a STOP condition. Various combinations of read/write formats are then possible within such a transfer.
15.6.1. Data Transfer Formats
15.6.1.1 Writing Data to AMIS-30624
When writing to AMIS-30624, the master-transmitter transmits to slave-receiver and the transfer direction is not changed. A complete
transmission consists of:
Start condition
The slave address (7-bit)
Read/Write bit (‘0’ = write)
Acknowledge bit
Any further data bytes are followed by an acknowledge bit. The acknowledge bit is used to signal a correct reception of the
data to the transmitter. In this case the AMIS-30624 pulls the SDA line to ‘0’. The AMIS-30624 reads the incoming data at SDA
on every rising edge of the SCK signal
Stop condition to finish the transmission
Figure 30: Master Writing Data to AMIS-30624
SCK
PC20070217.6
START
condition STOP
condition
1 - 7 891 - 7 89 1 - 7 89
ACKR/WADDRESS DATA ACK DATA ACK
SDA
N bytes + Acknowledge
PC20070219.3
Master to AMIS-30624
AMIS-30624 to Master
S = Start condition
P = Stop condition
A = Acknowledge (SDA = LOW)
A = No Acknowledge (SDA = HIGH)
SSlave Address R/W AData AData A P
"0" = WRITE
Some commands for the AMIS-30624 are supporting eight bytes of data, other commands are transmitting two bytes of data. See Table
30.
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AMIS-30624
15.6.1.2 Reading Data to AMIS-30624
When reading data from AMIS-30624 two transmissions are needed:
1) The first transmission consists of two bytes of data:
The first byte contains the slave address and the write bit.
The second byte contains the address of an internal register in the AMIS-30624. This internal register address is stored in the
circuit RAM.
Figure 31: Master Reading Data from AMIS- 30624: First Transmission is Addressing
2) The second transmission consists of the slave address and the read bit. Then the master can read the data bits on the SDA line on
every rising edge of signal SCK. After each byte of data the master has to acknowledge correct data reception by pulling SDA LOW.
The last byte is not acknowledged by the master and therefore the slave knows the end of transmission.
Figure 32: Master Reading Data from AMIS- 30624: Second Transmission is R eading Data
Notes:
(1) Each byte is followed by an acknowledgment bit as indicated by the A or Ā in the sequence.
(2) I2C-bus compatible devices must reset their bus logic on receipt of a START condition such that they all anticipate the sending of a slave address, even if these
START conditions are not positioned according to the proper format.
(3) A START condition immediately followed by a STOP condition (void message) is an illegal format.
15.7 7-bit Addressing
The addressing procedure for the I2C-bus is such that the first byte after the START condition usually determines which slave will be
selected by the master. The exception is the general call address which can call all devices. When this address is used all devices
should respond with an acknowledge. The second byte of the general call address then defines the action to be taken.
15.7.1. Definition of Bits in the First Byte
The first seven bits of the first byte make up the slave address. The eighth bit is the least significant bit (LSB). It determines the
direction of the message. If the LSB is a “zero” it means that the master will write information to a selected slave. A “one” in this position
means that the master will read information from the slave. When an address is sent, each device in a system compares the first seven
bits after the START condition with its address. If they match, the device considers itself addressed by the master as a slave-receiver or
slave-transmitter, depending on the R/ W bit.
Figure 33: First Byte after START Procedure
R/W
MSB LSB
SLAVE ADDRESS PC20070219.2
PC20070219.5
SSlave Address R/W AInternal Address
"0" = WRITE
A P
N bytes + Acknowledge
PC20070219.3
Master to AMIS-30624
AMIS-30624 to Master
S = Start condition
P = Stop condition
A = Acknowledge (SDA = LOW)
A = No Acknowledge (SDA = HIGH)
SSlave Address R/W AData AData A P
"0" = WRITE
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AMIS-30624
AMIS-30624 is provided with a physical address in order to discriminate this circuit from other circuits on the I2C bus. This address is
coded on seven bits (two bits being internally hardwired to ‘1’), yielding the theoretical possibility of 32 different circuits on the same
bus. It is a combination of four OTP memory bits (OTP Memory Structure) and of the externally hardwired address bits (pin HW). HW
must either be connected to ground or to Vbat. When HW is not connected and is left floating, correct functionality of the positioner is
not guaranteed. The motor will be driven to the programmed secure position (See Hardwired Address – OPEN).
Figure 34: First Byte after START Procedure
R/W
MSB LSB
OTP memory
PC20070219.3
1 1 PA3 PA2 PA1 PA0 HW
Hardwired Address Bit
15.7.2. General Call Address
The AMIS-30624 supports also a “general call” address “000 0000”, which can address all devices. When this address is used all
devices should respond with an acknowledge. The second byte of the general call address then defines the action to be taken.
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AMIS-30624
16.0 I2C Application Commands
16.1 Introduction
Communications between the AMIS-30624 and a 2-wire serial bus interface master takes place via a large set of commands.
Reading commands are used to:
Get actual status information, e.g. error flags
Get actual position of the stepper motor
Verify the right programming and configuration of the AMIS-30624
Writing commands are used to:
Program the OTP memory
Configure the positioner with motion parameters (max/min speed, acceleration, stepping mode, etc.)
Provide target positions to the Stepper motor
The I2C-bus master will have to use commands to manage the different application tasks the AMIS-30624 can feature. The commands
summary is given in Table 30.
16.2 Commands Table
Table 30: I2C Commands with Corresponding ROM Pointer
Command Byte
Command Mnemonic Function Binary Hexadecimal
GetFullStatus1 Returns complete status of the chip “1000 0001” 0x81
GetFullStatus2 Returns actual, target and secure position “1111 1100” 0xFC
GetOTPParam Returns OTP parameter “1000 0010” 0x82
GotoSecurePosition Drives motor to secure position “1000 0100” 0x84
HardStop Immediate full stop “1000 0101” 0x85
ResetPosition Sets actual position to zero “1000 0110” 0x86
ResetToDefault Overwrites the chip RAM with OTP contents “1000 0111” 0x87
SetDualPosition Drives the motor to two different positions with different speed “1000 1000” 0x88
SetMotorParam Sets motor parameter “1000 1001” 0x89
SetOTP Zaps the OTP memory “1001 0000” 0x90
SetPosition Programs a target and secure position “1000 1011” 0x8B
SetStallParam Sets stall parameters “1001 0110” 0x96
SoftStop Motor stopping with deceleration phase “1000 1111” 0x8F
Runvelocity Drives motor continuously “1001 0111” 0x97
TestBemf Outputs Bemf voltage on pin SWI “1001 1111” 0x9F
These commands are described hereafter, with their corresponding I2C frames. Refer to Data Transfer Formats for more details. A
color coding is used to distinguish between master and slave parts within the frames. An example is shown below.
GetFullStatus1 Response Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Address 1 1 1 OTP3 OTP2 OTP1 OTP0 HW
2 Data 1 Irun[3:0] Ihold[3:0]
Figure 35: Color Code Used in the Definition of I2C Frames
Light Blue : Master data
White: Slave response
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AMIS-30624
16.3 Application Commands
16.3.1. GetFullStatus1
This command is provided to the circuit by the master to get a complete status of the circuit and of the stepper motor. Refer to Table 18
and Table 19 to see the meaning of the parameters sent back to the I2C master.
Note: A GetFullStatus1 command will attempt to reset flags <TW>, <TSD>, <UV2>, <ElDef>, <StepLoss>, <CPFail>, <OVC1>,
<OVC2>, and <VddReset>.
GetFullStatus1 corresponds to the following I2C command frame:
GetFullStatus1 Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 0 0 1
GetFullStatus1 Response Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 1
1 Address 1 1 1 OTP3 OTP2 OTP1 OTP0 HW
2 Data 1 Irun[3:0] Ihold[3:0]
3 Data 2 Vmax[3:0] Vmin[3:0]
4 Data 3 AccShape StepMode[1:0] Shaft Acc[3:0]
5 Data 4 VddReset StepLoss ElDef UV2 TSD TW Tinfo[1:0]
6 Data 5 Motion[2:0] ESW OVC1 OVC2 Stall CPFail
7 Data 6 1 1 1 1 1 1 1 1
8 Data 7 AbsThr[3:0] DelThr[3:0]
Where:
OTP(n) OTP address bits PA[3:0]
HW Hardwired address bit
Irun[3:0] Operating current in the motor coil
Ihold[3:0] Standstill current in the motor coil
Vmax[3:0] Maximum velocity
Vmin[3:0] Minimum velocity
AccShape Enables motion without acceleration
StepMode[1:0] Step mode definition
Shaft Direction of movement
Acc[3:0] Acceleration form minimum to maximum velocity
VddReset Reset of digital supply
StepLoss Step loss occurred
ElDef Electrical defect
UV2 Battery under voltage detected
TSD Thermal shutdown
TW Thermal warning
Tinfo[1:0] Temperature Info
Motion[2:0] Motion status
ESW External switch status
OVC1 Over current in X-coil detected
OVC2 Over current in Y-coil detected
Stall Stall detected
CPFail Charge pump failure
AbsThr[3:0] Stall detection absolute threshold
DelThr[3:0] Stall detection delta threshold
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AMIS-30624
16.3.2. GetFullStatus2
This command is provided to the circuit by the master to get the actual, target and secure position of the stepper motor. Both the actual
and target position are returned in signed two’s complement 16-bit format. Secure position is coded in 10-bit format. According to the
programmed stepping mode the LSBs of ActPos[15:0] and TagPos[15:0] may have no meaning and should be assumed to be ‘0’.
This command also gives additional information concerning stall detection. Refer to Table 18 and Table 19 to see the meaning of the
parameters sent back to the I2C master.
GetFullStatus2 corresponds to the following I2C command frame:
GetFullStatus2 Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 1 1 1 1 1 0 0
GetFullStatus2 Response Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 1
1 Address 1 1 1 OTP3 OTP2 OTP1 OTP0 HW
2 Data 1 ActPos[15:8]
3 Data 2 ActPos[7:0]
4 Data 3 TagPos[15:8]
5 Data 4 TagPos[7:0]
6 Data 5 SecPos[7:0]
7 Data 6 FS2StallEn[2:0] 1 DC100 SecPos[10:8]
8 Data 7 AbsStall DelStallLo DelStallHi MinSamples[2:0] DC100StEn PWMJEn
Where:
OTP(n) OTP address bits PA[3:0]
HW Hardwired address bit
ActPos[15:0] Actual position
TagPos[15:0] Target position
SecPos[10:0] Secure position
FS2StallEn[2:0] Number of full steps after stall detection is enabled
DC100 Flag indicating PWM is at 100 percent duty cycle
AbsStall Stall detected because the absolute threshold is not reached
DelStallLo Stall detected because the delta threshold is under crossed
DelStallHi: Stall detected because the delta threshold is crossed
MinSamples[2:0] Back-emf sampling delay time
DC100StEn Enables the switch off of stall detection when DC100 = 1
PWMJEn PWM jitter enable
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AMIS-30624
16.3.3. GetOTPParam
This command is provided to the circuit by the I2C master to read the content of the OTP memory. More information can be found in
OTP Memory Structure.
GetOTPParam corresponds to the following I2C command frame:
GetOTPParam Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 0 1 0
GetOTPParam Response Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 1
1 OTP byte 0 OTP byte @0x00
2 OTP byte 1 OTP byte @0x01
3 OTP byte 2 OTP byte @0x02
4 OTP byte 3 OTP byte @0x03
5 OTP byte 4 OTP byte @0x04
6 OTP byte 5 OTP byte @0x05
7 OTP byte 6 OTP byte @0x06
8 OTP byte 7 OTP byte @0x07
16.3.4. GotoSecurePosition
This command is provided by the I2C master to one or all the stepper motors to move to the secure position SecPos[10:0]. See the
priority encoder description for more details. The priority encoder table also acknowledges the cases where a GotoSecurePosition
command will be ignored.
GotoSecurePosition corresponds to the following I2C command frame:
GotoSecurePosition Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 1 0 0
16.3.5. HardStop
This command will be internally triggered when an electrical problem is detected in one or both coils, leading to shutdown mode. If this
occurs while the motor is moving, the <StepLoss> flag is raised to allow warning of the I2C master at the next GetStatus1 command
that steps may have been lost. Once the motor is stopped, ActPos register is copied into TagPos register to ensure keeping the stop
position. The I2C master for some safety reasons can also issue a HardStop command.
HardStop corresponds to the following I2C command frame:
HardStop Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 1 0 1
16.3.6. ResetPosition
This command is provided to the circuit by the I2C master to reset ActPos and TagPos registers to zero. This can be helpful to prepare
for instance a relative positioning.
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AMIS-30624
ResetPosition corresponds to the following I2C command frame:
ResetPosition Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 1 1 0
16.3.7. ResetToDefault
This command is provided to the circuit by the I2C master in order to reset the whole slave node into the initial state. ResetToDefault
will, for instance, overwrite the RAM with the reset state of the registers parameters (see Table 18). This is another way for the I2C
master to initialize a slave node in case of emergency, or simply to refresh the RAM content.
Note: ActPos and TagPos are not modified by a ResetToDefault command.
Important: Care should be taken not to send a ResetToDefault command while a motion is ongoing, since this could modify the
motion parameters in a way forbidden by the position controller.
ResetToDefault corresponds to the following I2C command frame:
ResetToDefault Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address
1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 0 1 1 1
16.3.8. RunVelocity
This command is provided to the circuit by the I2C master in order to put the motor in continuous motion state.
RunVelocity corresponds to the following I2C command frame:
RunVelocity Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 1 0 1 1 1
16.3.9. SetDualPosition
This command is provided to the circuit by the I2C master in order to perform a positioning of the motor using two different velocities.
See Section Dual Positioning.
Note1: This sequence cannot be interrupted by another positioning command.
Important: If for some reason ActPos equals Pos1[15:0] at the moment the SetDualPosition command is issued, the circuit will
enter in deadlock state. Therefore, the application should check the actual position by a GetFullStatus2 command prior to starting
a dual positioning. Another solution may consist of programming a value out of the stepper motor range for Pos1[15:0]. For the same
reason Pos2[15:0] should not be equal to Pos1[15:0].
SetDualPosition corresponds to the following I2C command frame:
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AMIS-30624
SetDualPosition Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 1 0 0 0
2 Data 1 1 1 1 1 1 1 1 1
3 Data 2 1 1 1 1 1 1 1 1
4 Data 3 Vmax[3:0] Vmin[3:0]
5 Data 4 Pos1[15:8]
6 Data 5 Pos1[7:0]
7 Data 6 Pos2[15:8]
8 Data 7 Pos2[7:0]
Where:
Vmax[3:0] Max. velocity for first motion
Vmin[3:0] Min. velocity for first motion and velocity for the second motion
Pos1[15:0] First position to be reached during the first motion
Pos2[15:0] Relative position of the second motion
16.3.10. SetStallParam
This command sets the motion detection parameters and the related stepper motor parameters, such as the minimum and maximum
velocity, the run- and hold current, acceleration and step-mode. See Motion Detection for the meaning of these parameters.
SetStallParam corresponds to the following I2C command frame:
SetStallParam Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 1 0 1 1 0
2 Data 1 1 1 1 1 1 1 1 1
3 Data 2 1 1 1 1 1 1 1 1
4 Data 3 Irun[3:0] Ihold[3:0]
5 Data 4 Vmax[3:0] Vmin[3:0]
6 Data 5 MinSamples[2:0] Shaft Acc[3:0]
7 Data 6 AbsThr[3:0] DelThr[3:0]
8 Data 7 FS2StallEn[2:0] AccShape StepMode[1:0] DC100StEn PWMJEn
16.3.11. SetMotorParam
This command is provided to the circuit by the I2C master to set the values for the stepper motor parameters (listed below) in RAM.
Refer to Table 18 to see the meaning of the parameters sent by the I2C master.
Important: If a SetMotorParam occurs while a motion is ongoing, it will modify at once the motion parameters (see Position
Controller). Therefore the application should not change parameters other than Vmax and Vmin while a motion is running, otherwise
correct positioning cannot be guaranteed.
SetMotorParam corresponds to the following I2C command frame:
SetMotorParam Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 1 0 0 1
2 Data 1 1 1 1 1 1 1 1 1
3 Data 2 1 1 1 1 1 1 1 1
4 Data 3 Irun[3:0] Ihold[3:0]
5 Data 4 Vmax[3:0] Vmin[3:0]
6 Data 5 SecPos[10:8] Shaft Acc[3:0]
7 Data 6 SecPos[7:0]
8 Data 7 1 PWMfreq 1 AccShape StepMode[1:0] 1 PWMJEn
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AMIS-30624
16.3.12. SetOTPParam
This command is provided to the circuit by the I2C master to program and zap the OTP data D[7:0] in OTP address OTPA[2:0].
Important: This command must be sent under a specific Vbb voltage value. See parameter VbbOTP in Table 5. This is a mandatory
condition to ensure reliable zapping.
SetOTPParam corresponds to the following I2C command frame:
SetOTPParam Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 1 0 0 0 0
2 Data 1 1 1 1 1 1 1 1 1
3 Data 2 1 1 1 1 1 1 1 1
4 Data 3 1 1 1 1 1 OTPA[2:0]
5 Data 4 D[7:0]
Where:
OTPA[2:0]: OTP address
D[7:0]: Corresponding OTP data
16.3.13. SetPosition
This command is provided to the circuit by the I2C master to drive the motor to a given absolute position. See Positioning for more
details. The priority encoder table (see Priority Encoder) acknowledges the cases where a SetPosition command will be ignored.
SetPosition corresponds to the following I2C command frame:
SetPosition Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 1 0 1 1
2 Data 1 1 1 1 1 1 1 1 1
3 Data 2 1 1 1 1 1 1 1 1
4 Data 3 Pos[15:8]
5 Data 4 Pos[7:0]
Where:
Pos [15:0] Signed 16-bit position set-point for motor.
16.3.14. SoftStop
This command will be internally triggered when the chip temperature rises above the thermal shutdown threshold (see Table 5 and
Section 14.2.5). It provokes an immediate deceleration to Vmin (see Minimum Velocity) followed by a stop, regardless of the position
reached. Once the motor is stopped, TagPos register is overwritten with value in ActPos register to ensure keeping the stop position.
The I2C Master for some safety reasons can also issue a SoftStop command.
SoftStop corresponds to the following I2C command frame:
SoftStop Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Address 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 0 1 1 1 1
16.3.15. TestBemf
This command is provided to the circuit by the I2C master in order to output the Bemf integrator output to the SWI output of the chip.
Once activated, it can be stopped only after POR. During the Bemf observation, reading of the SWI state is internally forbidden.
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AMIS-30624
TestBemf corresponds to the following I2C command frame:
TestBemf Command Frame
Byte Content Structure
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0 Add ss re 1 1 OTP3 OTP2 OTP1 OTP0 HW 0
1 Command 1 0 0 1 1 1 1 1
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AMIS-30624
17.0 Resistance to Electrical and Electromagnetic Disturbances
17.1 Electrostatic Discharges
Table 31: Absolute Maximum Ratings
Parameter Min. Max. Unit
Vesd (1) Electrostatic discharge voltage on all pins -2 +2 kV
Notes:
(1) Human body model (100pF via 1.5 k, according to JEDEC EIA-JESD22-A114-B.)
17.2 Electrical Transient Conduction Along Supply Lines
Test pulses are applied to the power supply wires of the equipment implementing the AMIS-30624 (see application schematic),
according to ISO 7637-1 document. Operating Classes are defined in ISO 7637-2.
Table 32: Test Pulses and Test Levels According to ISO 7637-1
Pulse Amplitude Rise Time Pulse Duration Rs Operating Class
#1 -100V
1µs 2ms 10Ω C
#2a +100V 1µs 50µs 2Ω B
#3a -150V (from +13.5V) 5ns 100ns (burst) 50Ω A
#3b +100V (from +13.5V) 5ns 100ns (burst) 50Ω A
#5b (load dump) +21.5V (from +13.5V) 10ms 400ms 1Ω C
17.3 EMC
Bulk current injection (BCI), according to ISO 11452-4. Operating Classes are defined in ISO 7637-2.
Table 33: Bulk Current Injection Operating Classes
Current Operating Class
60mA envelope A
100mA envelope B
200mA envelope C
17.4 Power Supply Micro-interruptions
According to ISO 16750-2
Table 34: Immunity to Power Supply Micro-interruptions
Test Operating Class
10µs micro-interruptions A
100µs micro-interruptions B
5ms micro-interruptions B
50ms micro-interruptions C
300ms micro-interruptions C
Rev. 4 | Page 52 of 56 | www.onsemi.com
AMIS-30624
18.0 Package Outline
Figure 36: SOIC-20: Plastic Small Outline; 20 leads; Body Width 300mil. AMIS reference: SOIC300 20 300G
Rev. 4 | Page 53 of 56 | www.onsemi.com
AMIS-30624
Dimensions:
Dim Min Nom Max Unit
A 0.8 0.9 mm
A1 0 0.02 0.05 mm
A2 0.576 0.615 0.654 mm
A3 0.203 mm
b 0.25 0.3 0.35 mm
C 0.24 0.42 0.6 mm
D 7 mm
D1 6.75 mm
E 7 mm
E1 6.75 mm
e 0.65 mm
J 5.37 5.47 5.57 mm
K 5.37 5.47 5.57 mm
L 0.35 0.4 0.45 mm
P 45 Degree
R 2.185 2.385 mm
2) Dimensions apply to plated terminal and are measured between
0.2 and 0.25 mm from terminal tip.
3) The pin #1 indication must be placed on the top surface of the
package by using indentation mark or other feature of package body.
4) Exact shape and size of this feature is optional
5) Applied for exposed pad and terminals. Exclude embedding part of
exposed pad from measuring.
6) Applied only to terminals
7) Exact shape of each corner is optional
7x7 NQFP
Figure 37: NQFP-32: No lead Quad F l at Pack; 32 pins; body size 7 x 7 mm. AMIS reference: NQFP-32
Notes
Rev. 4 | Page 54 of 56 | www.onsemi.com
AMIS-30624
19.0 Soldering
19.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the ON
Semiconductor “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering
method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-
circuit boards with high population densities. In these situations re-flow soldering is often used.
19.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by
screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on the heating method. Typical re-
flow peak temperatures range from 215 to 260°C. The top-surface temperature of the packages should preferably be kept below 230°C.
19.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as
solder bridging and non-wetting can present major problems. To overcome these problems, the double-wave soldering method was
specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the
PCB;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint
must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The
footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
19.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 35: Soldering Process
Soldering Method
Package Wave Re-flow(1)
BGA, SQFP Not suitable Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable(2) Suitable
PLCC (3) , SO, SOJ Suitable Suitable
LQFP, QFP, TQFP Not recommended(3)(4) Suitable
SSOP, TSSOP, VSO Not recommended(5) Suitable
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
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Rev. 4 | Page 56 of 56 | www.onsemi.com
AMIS-30624
20.0 Revision History
Revision Date Modifications
1.0 July 16, 2002 First non-preliminary issue
2.1 December 5th , 2005 Complete review
3.0 February 21, 2007 Public release
3.1 March 23, 2007 UpdateI2C commands, adding links
4.0 June 17, 2008 Move content into ON Semiconductor template; update OPN table
21.0 Company or Product Inquiries
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